JP2011021961A - Probe card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe card which is easy to manufacture and has an accurate probe position. <P>SOLUTION: A guide plate 5 is formed by bonding two plate members 51, 51 together. Recesses 52 and protrusions 53 are alternately formed on the bonding surface of the two plate members at regular pitch. These recesses 52 and protrusions 53 face the protrusions 53 and recesses 52 of the other plate member 51. The recess 52 has a square cross section in which the width T1 and the depth D1 are equal to each other. The width T2 of the protrusion 53 is equal to the width and depth of the recess 52. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

The present invention relates to a probe card for measuring electrical characteristics of an IC chip, an LSI chip or the like.

As IC chips and LSI chips, a large number of chips are produced on a single semiconductor wafer, and the chips are used by cutting each chip. Whether each chip is defective or not is checked using a probe card for each chip.

The probe card includes a cantilever type probe card and a vertically actuated type probe card.
As disclosed in Patent Document 1, the cantilever type probe card has a structure in which the probe is connected to the lower cantilever part and the upper cantilever part at the center body part, and the tip of the lower cantilever part is inspected. It is made to contact the electrode pad of the target chip.

As disclosed in Patent Document 2, the vertically actuated probe card has a guide hole formed in two support plates spaced apart vertically, and a probe needle is inserted through the guide hole. A curved portion is provided at a position located between the support plates of the sheet, and a predetermined contact pressure is secured by bending the curved portion when the lower end of the probe needle contacts the electrode pad.

In both the cantilever type and the vertically actuated type probe card, a large number of probe needles (cantilevers) are closely packed, and a guide plate (support plate) made of an insulator is provided to prevent them from contacting and conducting. There are many things.

As the guide plate, a guide hole of the probe needle is formed by drilling a ceramic plate using a fine drill or laser light. However, drilling is extremely troublesome and yield is poor.

As a guide plate that does not require drilling, a proposal disclosed in Patent Document 3 has been made. In Patent Document 3, a long and extremely thin ceramic tube (with an outer diameter of about 30 μm) is densely arranged and bonded so that its axes are parallel and the center is the apex of a square or equilateral triangle. It is disclosed that the ceramic tube assembly is cut into a predetermined dimension in a direction orthogonal to the axis to form a guide plate.

Moreover, although it is a support block for optical fibers, the structure which does not require a drilling operation | work is disclosed by patent document 4. FIG. In this Patent Document 4 (FIG. 4 and the explanation related thereto), a support block for fixing an optical fiber is proposed in which a silicon substrate having a triangular groove formed on one side is overlapped.

JP 2004-117081 A Japanese Patent Laid-Open No. 9-113547 Japanese Patent No. 4260871 Japanese Patent Laid-Open No. 2004-043293

  Recently, with the miniaturization of ICs, the distance between electrode pads has become several tens of μm, and the pitch of guide holes has also decreased. When the interval is reduced, the diameter of the guide hole is inevitably reduced, and the techniques disclosed in Patent Documents 1 and 2 are extremely troublesome and increase the manufacturing cost of the probe card.

  The method of bundling ultrafine ceramic pipes shown in Patent Document 3 and cutting them in the axial direction must be assembled with great care so that the center of the ultrafine ceramic pipe is the apex of a square or equilateral triangle. However, there is a problem in terms of yield.

  The fixed block disclosed in Patent Document 4 is for an optical fiber, and since the distance between the optical fibers is equal to the distance between the centers of the lenses of the microlens array, the distance is very large compared to an integrated circuit. It cannot be used as a guide plate. That is, in the probe card, it is necessary to reduce the interval between the groove portions in the width direction and the thickness direction as much as possible. However, Patent Document 4 does not disclose a solution for this point.

In order to solve the above problems, the probe card according to the first invention comprises a guide plate having a guide hole through which the probe is inserted, and this guide plate is formed by bonding two plate members together. Grooves and projections are alternately formed at equal pitches on the bonding surface of these two plate members, and the center of the groove of one plate member and the center of the projection of the other plate member coincide. It was set as the structure which mutually shifted and bonded.

By making the width of the groove part, the depth of the groove part, and the width of the convex part all equal, all the intervals between the tips of the probe pins can be made equal.

According to a second aspect of the present invention, there is provided a probe card comprising: a guide plate having a guide hole through which the probe is inserted, the guide plate having a spacer member sandwiched between two plate members; Grooves and projections are alternately formed at equal pitches on the opposing surfaces of the two plate members, and the spacer member includes a spacer part that covers the groove part of the plate member.

By making the width of the groove part, the depth of the groove part, the width of the convex part, the width of the spacer part and the thickness of the spacer part all equal, the tip of the probe pin can be positioned at the apex of a square or an equilateral triangle. .

According to the probe card according to the present invention, the pitch of the guide hole formed by the groove portion and the convex portion of the two plate members or the guide hole formed between the plate member and the spacer member can be minimized. It can cope with the miniaturization of IC.

In particular, in the first invention, the width, depth, and the width of the convex portion are all made equal. In the second invention, the width, depth, the width of the convex portion, and the width of the spacer portion. By making all the width and the thickness of the spacer portion equal, it is possible to accurately grasp the address at the tip of the probe pin and to inspect the circuit efficiently and accurately.

Overall plan view of a probe card according to the present invention Perspective view of probe needle tip Top view of guide plate AA arrow view of FIG. The same figure as FIG. 3 which shows another embodiment Figure before assembly of another embodiment with three steps of guide holes Plan view of another embodiment with four stages

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. As shown in FIG. 1, the probe card according to the present invention is provided with a rectangular opening 2 in the center of a printed wiring board 1, and the tip of a cantilever type probe needle 3 faces the opening 2. Through holes 4 corresponding to a large number of probe needles 3 are formed on the rear end side, and the probe needles 3 and wiring patterns corresponding thereto are connected through the through holes 4.

In the illustrated example, a cantilever type is shown as an example of the present invention, but the present invention is not limited to this.

The tip of the probe needle 3 is inserted into a guide hole 6 formed in the guide plate 5, and the adjacent probe needle 3 is shifted in the front-rear direction (left-right direction in FIG. 2), so that the linear density can be reduced within a range where no contact occurs. It is increasing. The interval between the tip portions of adjacent probe needles 3 is the interval between the electrode pads 8 on the surface of the circuit chip 7 to be inspected, as shown in FIG.

Although the guide plate 5 is fixed to the printed wiring board 1, the position thereof is the tip of the probe needle 3 in the illustrated example, but it may be arranged at an intermediate portion as indicated by an imaginary line in FIG.

The guide plate 5 is formed by bonding two insulating plate members 51, 51 such as a ceramic plate and a glass plate, and grooves 52 and convex portions 53 are alternately formed on the bonding surface of these two plate members. The grooves 52 and the protrusions 53 are formed at an equal pitch, and the protrusions 53 and the grooves 52 of the counterpart plate member 51 are opposed to each other. Note that the convex portions 53 facing each other have a slight overlap so that the convex portion 53 does not enter the counterpart groove portion 52 when bonded.

As a method of forming the groove 52, a mask having an opening at the groove portion is attached to the surface of the plate member 51, and in this state, the surface of the plate member 51 is sandblasted or etched, or a dicer is used. Apply the method of mechanical grinding using.

Further, the plate member 51 is obtained by forming a groove portion 52 once in a long plate material as shown by an imaginary line in FIG. 4 and then cutting the plate material along the cutting line. Will improve.

The groove portion 52 has a square cross section in which the width T1 and the depth D1 are equal, and the width T2 of the convex portion 53 is also equal to the width, depth, and dimensions of the groove portion 52. Thus, by making all of the width T1 and depth D1 of the groove 52 equal to the width T2 of the convex portion 53, a large number of guide holes 6 are arranged most precisely under the condition that the adjacent probe needles 3 do not contact each other. can do.

The shape of the groove 52 is not limited to a square cross section, and the bottom surface may be semicircular as shown in FIG. Thus, the probe needle 3 can be positioned accurately by making the bottom surface semicircular in cross section.

Further, as shown in FIG. 6, a three-stage guide plate 5 may be formed by sandwiching a spacer member 54 between two plate members 51, 51. The spacer members 54 may be arranged separately by aligning the individual spacers 55 with the groove portions 52 of the two plate members 51, 51. However, the spacers 54 are fixed by the sheets 56, 56, and the two plates are left as they are. You may arrange | position between the members 51 and 51. FIG.

Also in this case, the width T3 and the thickness D3 of each spacer 55 are equal to the width T1, the depth D1 of the groove 52, and the width T2 of the convex portion 53.

Further, as shown in FIG. 7, a four-stage guide plate 5 may be obtained by sandwiching two spacer members 54 between two plate members 51, 51. Also in this case, the guide holes 6 are arranged in a dense shape as a square.

DESCRIPTION OF SYMBOLS 1 ... Printed circuit board, 2 ... Opening, 3 ... Cantilever type probe needle, 4 ... Through hole, 5 ... Guide plate, 6 ... Guide hole, 7 ... Circuit chip, 8 ... Electrode pad, 51 ... Plate member, 52 ... Groove part, 53 ... convex part, 54 ... spacer member, 55 ... spacer, 56 ... sheet, T1 ... groove part width, D1 ... groove part depth, T2 ... convex part width, T3 ... spacer width, D3 ... spacer thickness.

Claims (4)

A probe card comprising a substrate on which a conductive pattern is formed, a probe having one end connected to the conductive pattern, and a guide plate attached to the substrate and having a guide hole through which the probe is inserted. The guide plate is formed by bonding two plate members, and groove portions and convex portions are alternately formed at equal pitches on the bonding surface of the two plate members. A probe card characterized by being attached to each other so that the center of the groove portion and the center of the convex portion of the other plate member coincide with each other. 2. The probe card according to claim 1, wherein a width of the groove portion, a depth of the groove portion, and a width of the convex portion are all equal. A probe card comprising a substrate on which a conductive pattern is formed, a probe having one end connected to the conductive pattern, and a guide plate attached to the substrate and having a guide hole through which the probe is inserted. The guide plate is configured by sandwiching a spacer member between two plate members, and groove portions and convex portions are alternately formed at equal pitches on the opposing surface of the two plate members, and the spacer member A probe card comprising a spacer portion covering the groove portion of the plate member. 4. The probe card according to claim 3, wherein the width of the groove portion, the depth of the groove portion, the width of the convex portion, the width of the spacer portion, and the thickness of the spacer portion are all equal.

Images