JP2011013795A - Non-contact type data reception/transmission body - Google Patents

Non-contact type data reception/transmission body Download PDF

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JP2011013795A
JP2011013795A JP2009155552A JP2009155552A JP2011013795A JP 2011013795 A JP2011013795 A JP 2011013795A JP 2009155552 A JP2009155552 A JP 2009155552A JP 2009155552 A JP2009155552 A JP 2009155552A JP 2011013795 A JP2011013795 A JP 2011013795A
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conductor
base material
hard base
hole
hard
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JP5291552B2 (en
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Norihiro Oishi
教博 大石
Hiroki Ono
博樹 大野
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Toppan Edge Inc
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Toppan Forms Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a non-contact type data reception/transmission body wherein a hard base material is prevented from breaking along a through-hole even if external force is applied to the hard base material such that the hard base material is bent in a long direction thereof.SOLUTION: The non-contact type data reception/transmission body 10 includes: the hard base material 11; a planar first electric conductor 14 formed on one face 11a thereof; a planar second electric conductor 15 formed on the other face 11b thereof; an antenna 12 penetrating the hard base material 11, and comprising a third electric conductor 16 connecting the first electric conductor 14 and the second electric conductor 15; and an IC chip 13 connected with the antenna 12. The first electric conductor 14 and the second electric conductor 15 are oppositely disposed through the hard base material 11, and are formed with the through-hole 11c penetrating the hard base material 11 in a thickness direction, and extending to between two sides 11e, 11f of the hard base material 11. A part of the through-hole 11c is disposed aslant to the two sides 11e, 11f, and the third electric conductor 16 is formed on the inside of the through-hole 11c.

Description

本発明は、RFID(Radio Frequency IDentification)用途の情報記録メディアのように、電波、主にマイクロ波を媒体として外部から情報を受信し、また、外部に情報を送信できるようにした非接触型データ受送信体に関し、特に、金属製物品に直接貼付しても、非接触状態にて外部から情報を受信し、また、外部に情報を送信できるとともに、外部からの衝撃によりアンテナが断線して、その通信機能が劣化するのを防止した非接触型データ受送信体に関する。   The present invention is a non-contact type data that can receive information from the outside using radio waves, mainly microwaves as a medium, and transmit information to the outside, such as an information recording medium for RFID (Radio Frequency IDentification). Regarding the transmitter / receiver, in particular, even if directly attached to a metal article, information is received from the outside in a non-contact state, and information can be transmitted to the outside, and the antenna is disconnected due to an impact from the outside, The present invention relates to a non-contact type data receiving / transmitting body that prevents the communication function from deteriorating.

非接触型データ受送信体の一例であるICタグは、基材と、その一方の面に設けられ互いに接続されたアンテナおよびICチップとから構成されるインレットを備えており、情報書込/読出装置からの電波または電磁波を受信すると共振作用によりアンテナに起電力が発生し、この起電力によりICタグ内のICチップが起動し、このICチップ内の情報を信号化し、この信号がICタグのアンテナから発信される。
ICタグから発信された信号は、情報書込/読出装置のアンテナで受信され、コントローラーを介してデータ処理装置へ送られ、識別などのデータ処理が行われる。
An IC tag, which is an example of a non-contact type data transmitting / receiving body, includes an inlet composed of a base material, an antenna provided on one surface thereof and connected to each other, and an information writing / reading When a radio wave or electromagnetic wave from the device is received, an electromotive force is generated in the antenna by a resonance action, and the IC chip in the IC tag is activated by this electromotive force, and the information in the IC chip is converted into a signal. Transmitted from the antenna.
A signal transmitted from the IC tag is received by the antenna of the information writing / reading device, sent to the data processing device via the controller, and data processing such as identification is performed.

ICタグが作動するためには、情報書込/読出装置から発信された電波または電磁波がICタグのアンテナに十分取り込まれて、ICチップの作動起電力以上の起電力が誘導されなければならない。ところが、ICタグを金属製物品の表面に貼付した場合、金属製物品の表面では磁束が金属製物品の表面に平行になるため、ICタグのアンテナを横切る磁束が減少して誘導起電力が低下して、ICチップの作動起電力を下回り、ICチップが作動しなくなるという問題があった。   In order for the IC tag to operate, radio waves or electromagnetic waves transmitted from the information writing / reading device must be sufficiently taken into the antenna of the IC tag, and an electromotive force higher than the operating electromotive force of the IC chip must be induced. However, when an IC tag is affixed to the surface of a metal article, the magnetic flux on the surface of the metal article is parallel to the surface of the metal article, so that the magnetic flux across the antenna of the IC tag decreases and the induced electromotive force decreases. As a result, there is a problem that the IC chip does not operate because the operating electromotive force of the IC chip is lower.

そこで、図4に示すように、基材101と、基材101の一方の面101aおよび他方の面101b、並びに、これら一方の面101aおよび他方の面101bに連接する側面101cに沿って設けられた導電体102からなり、基材101の厚み方向の断面形状がコの字型のアンテナ103と、このアンテナ103と電気的に接続されたICチップ104とを備えたICタグ100が提案されている(例えば、特許文献1参照)。
このICタグ100は、金属製物品に貼付しても、ICチップ104の作動起電力以上の起電力が生じるので、ICチップ104が作動し、情報の送受信が可能である。
Therefore, as shown in FIG. 4, the base 101 is provided along the one surface 101a and the other surface 101b of the base 101, and the side surface 101c connected to the one surface 101a and the other surface 101b. Proposed is an IC tag 100 that includes an antenna 103 having a U-shaped cross section in the thickness direction of a base material 101 and an IC chip 104 electrically connected to the antenna 103. (For example, refer to Patent Document 1).
Even if the IC tag 100 is affixed to a metal article, an electromotive force greater than the electromotive force of the IC chip 104 is generated, so that the IC chip 104 operates and information can be transmitted and received.

このICタグ100では、基材101の一方の面101aおよび他方の面101bと側面101cとの境、すなわち、基材101の角にもアンテナ103を形成する導電体102が設けられ、その基材101の角において各面に設けられた導電体102同士の接続部が露出しているため、外力によりその接続部が損傷しやすく、その部分でアンテナ103が断線し、このICタグ100は通信不能になるおそれがあった。   In this IC tag 100, a conductor 102 that forms an antenna 103 is provided at the boundary between one surface 101a of the substrate 101 and the other surface 101b and the side surface 101c, that is, at the corner of the substrate 101. Since the connection portions between the conductors 102 provided on each surface are exposed at the corners of 101, the connection portions are easily damaged by an external force, and the antenna 103 is disconnected at that portion, and the IC tag 100 cannot communicate. There was a risk of becoming.

そこで、本発明者等は、アンテナの断線を防止するために、図5に示すようなICタグ110を考案している。
このICタグ110は、硬質基材111と、硬質基材111の一方の面111aに設けられた面状の第一導電体112、硬質基材111の他方の面111bに設けられた面状の第二導電体113、および、硬質基材111を厚み方向に貫通して第一導電体112と第二導電体113を、これらの導電体の一端にて接続する第三導電体114から構成されるアンテナ115と、アンテナ115と電気的に接続されたICチップ116とから概略構成されている。
Accordingly, the present inventors have devised an IC tag 110 as shown in FIG. 5 in order to prevent disconnection of the antenna.
The IC tag 110 includes a hard base 111, a planar first conductor 112 provided on one surface 111 a of the hard base 111, and a planar shape provided on the other surface 111 b of the hard base 111. The second conductor 113 and the third conductor 114 that penetrates the hard base material 111 in the thickness direction and connects the first conductor 112 and the second conductor 113 at one end of these conductors. Antenna 115 and an IC chip 116 electrically connected to the antenna 115.

第三導電体114は、硬質基材111を厚み方向に貫通するとともに硬質基材111の短辺と平行に延在する貫通孔111c内、すなわち、硬質基材111の一方の面111aから他方の面111bにわたって硬質基材111に対して略垂直に設けられた平面視略矩形状の貫通孔111c内において、この貫通孔111cの内側面に設けられている。   The third conductor 114 penetrates the hard base 111 in the thickness direction and extends in parallel with the short side of the hard base 111, that is, from one surface 111a of the hard base 111 to the other. In a through hole 111c having a substantially rectangular shape in plan view provided substantially perpendicular to the hard base 111 over the surface 111b, the through hole 111c is provided on the inner side surface.

国際公開第2008/071971号パンフレットInternational Publication No. 2008/071971 Pamphlet

硬質基材111の一方の面111aおよび他方の面111bにおいて、アンテナ115(第一導電体112、第二導電体113)の有効面積を大きくするためには、図5に示すように、硬質基材111の一端部において、硬質基材111の短辺と平行に貫通孔111cが設けられる。また、このような形状のICタグ110には、使用時に、硬質基材111の長手方向に外力が加えられることが多い。しかしながら、このように貫通孔111cを配設すると、硬質基材111は、その貫通孔111cの部分において機械的強度が不足するため、ICタグ110に対して、硬質基材111がその長手方向に撓むように外力が加えられた場合、図6および図7に示すように、硬質基材111における貫通孔111cから外側の部分(端部)が、貫通孔111cに沿って破断することがあった。この硬質基材111の破断によって、第三導電体114が露出し、第三導電体114と、第一導電体112または第二導電体113との接続部が損傷しやすくなるだけでなく、この硬質基材111の破断に伴って、貫通孔111cの内側面に設けられた第三導電体114が断線して、ICタグ110が通信不能になるおそれがあった。   In order to increase the effective area of the antenna 115 (first conductor 112, second conductor 113) on one surface 111a and the other surface 111b of the hard base 111, as shown in FIG. A through hole 111 c is provided at one end of the material 111 in parallel with the short side of the hard base 111. Further, an external force is often applied to the IC tag 110 having such a shape in the longitudinal direction of the hard base 111 during use. However, when the through hole 111c is arranged in this way, the hard base 111 has insufficient mechanical strength at the portion of the through hole 111c, so that the hard base 111 is in the longitudinal direction with respect to the IC tag 110. When an external force is applied so as to bend, as shown in FIGS. 6 and 7, a portion (end portion) outside the through hole 111 c in the hard base material 111 may break along the through hole 111 c. The breakage of the hard base material 111 exposes the third conductor 114 and not only easily damages the connection between the third conductor 114 and the first conductor 112 or the second conductor 113, but also As the hard base material 111 is broken, the third conductor 114 provided on the inner surface of the through hole 111c may be disconnected, and the IC tag 110 may be unable to communicate.

本発明は、上記事情に鑑みてなされたものであって、硬質基材に対してその長手方向に撓むように外力が加えられても、硬質基材が貫通孔に沿って破断することを防止した非接触型データ受送信体を提供することを目的とする。   The present invention has been made in view of the above circumstances, and even when an external force is applied to the hard base so as to bend in the longitudinal direction, the hard base is prevented from breaking along the through hole. An object of the present invention is to provide a contactless data receiving / transmitting body.

本発明の非接触型データ受送信体は、硬質基材と、該硬質基材の一方の面に設けられた面状の第一導電体、前記硬質基材の他方の面に設けられた面状の第二導電体、および、前記硬質基材を厚み方向に貫通して前記第一導電体と前記第二導電体を接続する第三導電体から構成されるアンテナと、該アンテナと電気的に接続されたICチップと、を備えた非接触型データ受送信体であって、前記第一導電体と前記第二導電体は、前記硬質基材を介して対向して配置され、前記硬質基材を厚み方向に貫通するとともに、前記硬質基材における向かい合う2つの辺の間に延在する貫通孔が設けられ、該貫通孔の少なくとも一部が前記硬質基材の一辺に対して斜めに配され、前記貫通孔の内に、前記第三導電体が設けられたことを特徴とする。   The non-contact type data transmitting / receiving body of the present invention includes a hard substrate, a planar first conductor provided on one surface of the hard substrate, and a surface provided on the other surface of the hard substrate. A second conductor, and a third conductor that penetrates the hard base material in the thickness direction to connect the first conductor and the second conductor; An IC chip connected to the first and second conductors, the first conductor and the second conductor being opposed to each other with the hard substrate interposed therebetween, A through hole extending through the base material in the thickness direction and extending between two opposing sides of the hard base material is provided, and at least a part of the through hole is inclined with respect to one side of the hard base material And the third conductor is provided in the through hole.

前記硬質基材は、ガラスエポキシ樹脂からなる基材であることが好ましい。   The hard base material is preferably a base material made of glass epoxy resin.

本発明の非接触型データ受送信体によれば、硬質基材と、該硬質基材の一方の面に設けられた面状の第一導電体、前記硬質基材の他方の面に設けられた面状の第二導電体、および、前記硬質基材を厚み方向に貫通して前記第一導電体と前記第二導電体を接続する第三導電体から構成されるアンテナと、該アンテナと電気的に接続されたICチップと、を備えた非接触型データ受送信体であって、前記第一導電体と前記第二導電体は、前記硬質基材を介して対向して配置され、前記硬質基材を厚み方向に貫通するとともに、前記硬質基材における向かい合う2つの辺の間に延在する貫通孔が設けられ、該貫通孔の少なくとも一部が前記硬質基材の一辺に対して斜めに配され、前記貫通孔の内に、前記第三導電体が設けられたので、非接触型データ受送信体に対して、硬質基材がその長手方向に撓むように外力が加えられても、貫通孔の両端に対して集中的に力が加わり難くなるから、硬質基材が貫通孔に沿って破断することを防止できる。したがって、硬質基材の破断によって、第三導電体が露出し、第三導電体と、第一導電体または第二導電体との接続部が損傷するのを防止することができるとともに、この硬質基材の破断に伴って、貫通孔内に設けられた第三導電体が断線して、非接触型データ受送信体が通信不能になることを防止できる。
また、アンテナが面状をなしており、アンテナを構成する第一導電体と第二導電体が、硬質基材における向かい合う2つの辺に対し、一方の辺側の長さと他方の辺側の長さが異なるように設けられるので、広帯域性を保持できる。
According to the non-contact type data transmitting / receiving body of the present invention, the hard base, the planar first conductor provided on one surface of the hard base, and the other surface of the hard base are provided. A planar second conductor, an antenna composed of a third conductor that penetrates the hard base material in the thickness direction and connects the first conductor and the second conductor, and the antenna An electrically connected IC chip, wherein the first conductor and the second conductor are arranged to face each other with the hard substrate interposed therebetween, A through hole extending through the hard base material in the thickness direction and extending between two opposite sides of the hard base material is provided, and at least a part of the through hole is provided on one side of the hard base material. Since the third conductor is disposed obliquely and inside the through hole, the non-contact type data is provided. Even if an external force is applied to the transmitter / receiver so that the hard base material bends in the longitudinal direction, it is difficult to apply force intensively to both ends of the through hole. Breakage can be prevented. Therefore, it is possible to prevent the third conductor from being exposed due to the breakage of the hard base material and damage the connection portion between the third conductor and the first conductor or the second conductor. As the base material breaks, it is possible to prevent the third conductor provided in the through hole from being disconnected and the non-contact type data transmitting / receiving body from becoming incapable of communication.
Further, the antenna has a planar shape, and the first conductor and the second conductor constituting the antenna have a length on one side and a length on the other side with respect to two opposite sides of the hard base material. Therefore, it is possible to maintain a wide bandwidth.

本発明の非接触型データ受送信体の第一の実施形態を示す概略斜視図である。It is a schematic perspective view which shows 1st embodiment of the non-contact-type data transmission / reception body of this invention. 本発明の非接触型データ受送信体の第二の実施形態を示す概略平面図である。It is a schematic plan view which shows 2nd embodiment of the non-contact-type data transmission / reception body of this invention. 本発明の非接触型データ受送信体の第三の実施形態を示す概略平面図である。It is a schematic plan view which shows 3rd embodiment of the non-contact-type data transmission / reception body of this invention. 従来の非接触型データ受送信体の一例を示す概略斜視図である。It is a schematic perspective view which shows an example of the conventional non-contact type data receiving / transmitting body. 従来の非接触型データ受送信体の他の例を示す概略斜視図である。It is a schematic perspective view which shows the other example of the conventional non-contact-type data receiving / transmitting body. 従来の非接触型データ受送信体における課題を説明する概略平面図である。It is a schematic plan view explaining the subject in the conventional non-contact type data receiving / transmitting body. 従来の非接触型データ受送信体における課題を説明する概略平面図である。It is a schematic plan view explaining the subject in the conventional non-contact type data receiving / transmitting body.

本発明の非接触型データ受送信体の実施の形態について説明する。
なお、この形態は、発明の趣旨をより良く理解させるために具体的に説明するものであり、特に指定のない限り、本発明を限定するものではない。
An embodiment of the non-contact type data receiving / transmitting body of the present invention will be described.
This embodiment is specifically described for better understanding of the gist of the invention, and does not limit the present invention unless otherwise specified.

(1)第一の実施形態
図1は、本発明の非接触型データ受送信体の第一の実施形態を示す概略斜視図である。
この実施形態の非接触型データ受送信体10は、平面視長方形状の硬質基材11と、硬質基材11に接するように設けられたアンテナ12と、アンテナ12と電気的に接続されたICチップ13とから概略構成されている。
また、アンテナ12は、硬質基材11の一方の面11aに設けられた面状の第一導電体14と、硬質基材11の他方の面11bに設けられた面状の第二導電体15と、硬質基材11の一端部11A側において、硬質基材11を厚み方向に貫通して第一導電体14と第二導電体15を接続する第三導電体16と、グラウンド17とから構成されている。
さらに、ICチップ13は、硬質基材11の一方の面11aにおいて、接着剤を介して、第一導電体14に設けられた給電点に接続されている。
(1) First Embodiment FIG. 1 is a schematic perspective view showing a first embodiment of a contactless data receiving / transmitting body of the present invention.
The non-contact type data transmitting / receiving body 10 of this embodiment includes a hard base 11 having a rectangular shape in plan view, an antenna 12 provided so as to be in contact with the hard base 11, and an IC electrically connected to the antenna 12. The chip 13 is schematically configured.
The antenna 12 includes a planar first conductor 14 provided on one surface 11 a of the hard base material 11 and a planar second conductor 15 provided on the other surface 11 b of the hard base material 11. And on the one end portion 11 </ b> A side of the hard base material 11, the third base material 16 that penetrates the hard base material 11 in the thickness direction and connects the first conductor 14 and the second conductor 15, and a ground 17. Has been.
Further, the IC chip 13 is connected to a power feeding point provided on the first conductor 14 via an adhesive on one surface 11a of the hard base 11.

第一導電体14は、硬質基材11の一方の面11aにおいて、硬質基材11の長辺方向(長手方向)に延在するように設けられた平面視台形状の導電性の膜から形成されている。同様に、第二導電体15は、硬質基材11の他方の面11bにおいて、硬質基材11の長辺方向(長手方向)に延在するように設けられた平面視台形状の導電性の膜から形成されている。
また、第一導電体14と第二導電体15は、硬質基材11を介して対向して配置されている。そして、第一導電体14と第二導電体15は、平行の関係にある。すなわち、詳細には、第一導電体14と第二導電体15は、硬質基材11を介して面対称に配置されている。
The first conductor 14 is formed from a conductive film having a trapezoidal shape in plan view provided so as to extend in the long side direction (longitudinal direction) of the hard base material 11 on one surface 11 a of the hard base material 11. Has been. Similarly, the second conductor 15 has a trapezoidal conductive shape in plan view provided so as to extend in the long side direction (longitudinal direction) of the hard base material 11 on the other surface 11b of the hard base material 11. It is formed from a film.
Further, the first conductor 14 and the second conductor 15 are arranged to face each other with the hard base material 11 interposed therebetween. The first conductor 14 and the second conductor 15 are in a parallel relationship. That is, in detail, the first conductor 14 and the second conductor 15 are arranged symmetrically with respect to the hard substrate 11.

また、硬質基材11には、硬質基材11を厚み方向に貫通するとともに、硬質基材11における向かい合う2つの長辺11e,11fの間に延在する平面視略矩形状の貫通孔11cが設けられている。さらに、この貫通孔11cは、硬質基材11の長辺11e,11fに対して斜めに配されている。
なお、ここで、「貫通孔11cが硬質基材11における向かい合う2つの長辺11e,11fの間に延在する」とは、貫通孔11cが硬質基材11の長辺11e,11fの間の領域にわたって設けられていることをいう。
The hard base material 11 has a through hole 11c that penetrates the hard base material 11 in the thickness direction and extends between two long sides 11e and 11f facing each other in the hard base material 11 in a plan view. Is provided. Further, the through hole 11c is disposed obliquely with respect to the long sides 11e and 11f of the hard base material 11.
Here, "the through hole 11c extends between the two long sides 11e and 11f facing each other in the hard base material 11" means that the through hole 11c is between the long sides 11e and 11f of the hard base material 11. It is provided over the area.

第三導電体16は、硬質基材11の貫通孔11c内、すなわち、貫通孔11c内における硬質基材11の一方の面11aから他方の面11bにわたって、この貫通孔11cの内側面11d全面に設けられている。そして、第三導電体16が設けられた貫通孔11cには、第三導電体16が充填されているのではなく、硬質基材11の一方の面11aから他方の面11bにわたる空孔が存在している。   The third conductor 16 is formed on the entire inner side surface 11d of the through hole 11c in the through hole 11c of the hard base material 11, that is, from one surface 11a of the hard base material 11 to the other surface 11b in the through hole 11c. Is provided. The through hole 11c provided with the third conductor 16 is not filled with the third conductor 16, but has a hole extending from one surface 11a of the hard base 11 to the other surface 11b. is doing.

さらに、第三導電体16は、貫通孔11cにおける硬質基材11の一方の面11a側の開口部にて第一導電体14と接続され、一方、貫通孔11cにおける硬質基材11の他方の面11b側の開口部にて第二導電体15と接続されている。これにより、第一導電体14と第二導電体15は、第三導電体16を介して電気的に接続され、第一導電体14、第二導電体15および第三導電体16は、硬質基材11の厚み方向の断面形状が略コの字型をなすアンテナ12を形成している。   Furthermore, the third conductor 16 is connected to the first conductor 14 at the opening on the one surface 11a side of the hard base material 11 in the through hole 11c, while the other of the hard base material 11 in the through hole 11c. The second conductor 15 is connected to the opening on the surface 11b side. Thereby, the first conductor 14 and the second conductor 15 are electrically connected via the third conductor 16, and the first conductor 14, the second conductor 15, and the third conductor 16 are hard. An antenna 12 having a substantially U-shaped cross section in the thickness direction of the base material 11 is formed.

アンテナ12の長手方向における長さ、すなわち、第三導電体16を介して、硬質基材11の一方の面11aに設けられた第一導電体14から、硬質基材11の他方の面11bに設けられた第二導電体15にわたる長さは、非接触型データ受送信体10の使用周波数である極超短波帯〈UHF〉やマイクロ波帯の電波帯の周波数(300MHz〜30GHz)の1/2波長に相当する長さとなっている。   The length in the longitudinal direction of the antenna 12, that is, from the first conductor 14 provided on one surface 11 a of the hard base 11 via the third conductor 16 to the other surface 11 b of the hard base 11. The length over the provided second conductor 15 is ½ of the frequency (300 MHz to 30 GHz) of the ultra-high frequency band <UHF>, which is the use frequency of the non-contact type data transmitter / receiver 10, and the microwave band. The length corresponds to the wavelength.

貫通孔11cの硬質基材11の厚み方向と垂直な断面の形状、すなわち、平面視の形状は略矩形状をなしている。なお、貫通孔11cの上記断面の形状は特に限定されず、楕円形状、三角形状、四角形(矩形)状、五角形以上の多角形状をなす小さな貫通孔が複数連接して1つの形状をなしていてもよい。この複数の貫通孔が連接してなる形状は、円形状、半円形状、楕円形状、矩形状、三角形状、四角形(矩形)状、五角形以上の多角形状、蛇行した曲線が連なって1つの形状をなしているものなどであってもよい。   The shape of the cross section perpendicular to the thickness direction of the hard base material 11 of the through hole 11c, that is, the shape in plan view is substantially rectangular. The shape of the cross-section of the through-hole 11c is not particularly limited, and a plurality of small through-holes having an elliptical shape, a triangular shape, a quadrangular (rectangular) shape, or a polygonal shape of a pentagon or more form a single shape. Also good. The shape formed by connecting the plurality of through-holes is a circular shape, a semicircular shape, an elliptical shape, a rectangular shape, a triangular shape, a quadrangular (rectangular) shape, a pentagonal or more polygonal shape, and a meandering curve. It may be what has made.

また、貫通孔11cの大きさ(幅、長さ)は特に限定されず、アンテナ12の共振周波数などに応じて適宜調整される。   Further, the size (width, length) of the through hole 11c is not particularly limited, and is appropriately adjusted according to the resonance frequency of the antenna 12.

硬質基材11としては、ポリエチレンテレフタレート(PET)、ポリブチレンテレフタレート(PBT)などのポリエステル樹脂からなる基材;ポリフッ化ビニル、ポリフッ化ビニリデン、ポリ4フッ化エチレンなどのポリフッ化エチレン系樹脂からなる基材;ナイロン6、ナイロン6,6などのポリアミド樹脂からなる基材;硬質ポリ塩化ビニル(PVC)からなる基材;ポリアセタールからなる基材;ポリカーボネート(PC)からなる基材;ポリアリレートからなる基材;ポリイミドからなる基材;ガラスエポキシ樹脂からなる基材などの繊維強化プラスチックからなる基材;などが用いられる。
これらの基材の中でも、アンテナ12の通信特性を劣化させない点から、ガラスエポキシ樹脂からなる基材が好ましい。
The hard substrate 11 is made of a polyester resin such as polyethylene terephthalate (PET) or polybutylene terephthalate (PBT); made of a polyfluorinated ethylene resin such as polyvinyl fluoride, polyvinylidene fluoride, or polytetrafluoroethylene. Base material: Base material made of polyamide resin such as nylon 6, nylon 6, 6, etc .; Base material made of hard polyvinyl chloride (PVC); Base material made of polyacetal; Base material made of polycarbonate (PC); Made of polyarylate A base material; a base material made of polyimide; a base material made of fiber reinforced plastic such as a base material made of glass epoxy resin;
Among these base materials, a base material made of a glass epoxy resin is preferable because it does not deteriorate the communication characteristics of the antenna 12.

アンテナ12、すなわち、第一導電体14、第二導電体15および第三導電体16は、硬質基材11上に、ポリマー型導電インクを用いて所定のパターンにスクリーン印刷、インクジェット印刷などの印刷法により形成されてなるものか、もしくは、導電性箔をエッチングしてなるもの、金属メッキしてなるものである。   The antenna 12, that is, the first conductor 14, the second conductor 15, and the third conductor 16 are printed on the hard substrate 11 in a predetermined pattern using polymer-type conductive ink, such as screen printing or inkjet printing. It is formed by a method, or is formed by etching a conductive foil, or is formed by metal plating.

ポリマー型導電インクとしては、例えば、銀粉末、金粉末、白金粉末、アルミニウム粉末、パラジウム粉末、ロジウム粉末、カーボン粉末(カーボンブラック、カーボンナノチューブなど)などの導電微粒子が樹脂組成物に配合されたものが挙げられる。   Examples of polymer-type conductive inks are those in which conductive fine particles such as silver powder, gold powder, platinum powder, aluminum powder, palladium powder, rhodium powder, carbon powder (carbon black, carbon nanotube, etc.) are blended in the resin composition Is mentioned.

樹脂組成物として熱硬化型樹脂を用いれば、ポリマー型導電インクは、200℃以下、例えば100〜150℃程度でアンテナ12をなす塗膜を形成することができる熱硬化型となる。アンテナ12をなす塗膜の電気の流れる経路は、塗膜をなす導電微粒子が互いに接触することにより形成され、この塗膜の抵抗値は10-5Ω・cmオーダーである。
また、本発明におけるポリマー型導電インクとしては、熱硬化型の他にも、光硬化型、浸透乾燥型、溶剤揮発型といった公知のものが用いられる。
If a thermosetting resin is used as the resin composition, the polymer conductive ink becomes a thermosetting type capable of forming a coating film forming the antenna 12 at 200 ° C. or less, for example, about 100 to 150 ° C. The electric current path of the coating film forming the antenna 12 is formed when the conductive fine particles forming the coating film contact each other, and the resistance value of this coating film is on the order of 10 −5 Ω · cm.
Further, as the polymer type conductive ink in the present invention, known ones such as a photocuring type, a penetrating drying type, and a solvent volatilization type are used in addition to the thermosetting type.

光硬化型のポリマー型導電インクは、光硬化性樹脂を樹脂組成物に含むものであり、硬化時間が短いので、製造効率を向上させることができる。光硬化型のポリマー型導電インクとしては、例えば、熱可塑性樹脂のみ、あるいは熱可塑性樹脂と架橋性樹脂(特にポリエステルとイソシアネートによる架橋系樹脂など)とのブレンド樹脂組成物に、導電微粒子が60質量%以上配合され、ポリエステル樹脂が10質量%以上配合されたもの、すなわち、溶剤揮発型かあるいは架橋/熱可塑併用型(ただし熱可塑型が50質量%以上である)のものや、熱可塑性樹脂のみ、あるいは熱可塑性樹脂と架橋性樹脂(特にポリエステルとイソシアネートによる架橋系樹脂など)とのブレンド樹脂組成物に、ポリエステル樹脂が10質量%以上配合されたもの、すなわち、架橋型かあるいは架橋/熱可塑併用型のものなどが好適に用いられる。   The photocurable polymer type conductive ink contains a photocurable resin in the resin composition and has a short curing time, so that the production efficiency can be improved. Examples of the photocurable polymer conductive ink include, for example, a thermoplastic resin alone or a blend resin composition of a thermoplastic resin and a crosslinkable resin (especially a crosslinkable resin composed of polyester and isocyanate) and 60 masses of conductive fine particles. % Or more and 10% by mass or more of a polyester resin, that is, a solvent volatile type or a crosslinked / thermoplastic combined type (however, the thermoplastic type is 50% by mass or more), or a thermoplastic resin Or a blend resin composition of a thermoplastic resin and a crosslinkable resin (especially a crosslinkable resin composed of polyester and isocyanate), in which a polyester resin is blended in an amount of 10% by mass or more, ie, a crosslinkable type or a crosslinkable / thermal A plastic combination type is preferably used.

また、アンテナ12をなす導電性箔としては、銅箔、銀箔、金箔、白金箔、アルミニウム箔などが挙げられる。
さらに、アンテナ12をなす金属メッキとしては、銅メッキ、銀メッキ、金メッキ、白金メッキなどが挙げられる。
Examples of the conductive foil forming the antenna 12 include copper foil, silver foil, gold foil, platinum foil, and aluminum foil.
Furthermore, examples of the metal plating that forms the antenna 12 include copper plating, silver plating, gold plating, and platinum plating.

ICチップ13としては、特に限定されず、アンテナ12を介して非接触状態にて情報の書き込みおよび読み出しが可能なものであれば、非接触型ICタグや非接触型ICラベル、あるいは非接触型ICカードなどのRFIDメディアに適用可能なものであればいかなるものでも用いられる。   The IC chip 13 is not particularly limited and may be a non-contact type IC tag, a non-contact type IC label, or a non-contact type as long as information can be written and read out in a non-contact state via the antenna 12. Anything applicable to RFID media such as an IC card can be used.

また、ICチップ13を第一導電体14に接続するために用いられる接着剤としては、一般に配線基板などの接着に用いられる接着剤であれば特に限定されないが、異方性導電接着フィルム(Anisotropic Conductive Film、ACF)、非導電性フィルム(Non−conductive Film、NCF)、異方性導電ペースト(Anisotropic Conductive Paste、ACP)、無導電粒子ペースト(Non Conductive ResinPaste、NCP)などが用いられる。   Further, the adhesive used for connecting the IC chip 13 to the first conductor 14 is not particularly limited as long as it is an adhesive generally used for bonding a wiring board or the like, but an anisotropic conductive adhesive film (Anisotropic). Conductive Film (ACF), non-conductive film (Non-Conductive Film, NCF), anisotropic conductive paste (Anisotropic Conductive Paste, ACP), non-conductive particle paste (Non Conductive Resin Paste, NCP), etc. are used.

次に、非接触型データ受送信体10の製造方法について、その一例を挙げて説明する。
まず、ポリマー型導電インクを用いた印刷法、導電性箔のエッチングまたは金属メッキにより、硬質基材11の一方の面11aに、所定の形状の第一導電体14を形成する。
次いで、ポリマー型導電インクを用いた印刷法、導電性箔のエッチングまたは金属メッキにより、硬質基材11の他方の面11bに、所定の形状の第二導電体15を形成する。
Next, a method for manufacturing the non-contact type data receiving / transmitting body 10 will be described with an example.
First, the first conductor 14 having a predetermined shape is formed on one surface 11a of the hard base 11 by a printing method using a polymer type conductive ink, etching of a conductive foil, or metal plating.
Next, the second conductor 15 having a predetermined shape is formed on the other surface 11b of the hard base 11 by a printing method using a polymer type conductive ink, etching of the conductive foil, or metal plating.

次いで、ドリルや、金型を用いた型抜きにより、硬質基材11の一方の面11aから他方の面11bにわたって、硬質基材11に対して略垂直の貫通孔11cを穿設する。この際、硬質基材11の一方の面11aに設けられた第一導電体14と一緒に、硬質基材11に穿孔するが、第一導電体14に当接したドリルや金型が、硬質基材11に貫通孔11cを穿設すると同時に、第一導電体14の一部を引き延ばしながら、貫通孔11c内にその引き延ばした部分を引きずり込むことによって、貫通孔11cの内側面11d全面に第三導電体16を形成する。その結果、この第三導電体16を介して、第一導電体14と第二導電体15が接続される。   Next, a through hole 11c that is substantially perpendicular to the hard base material 11 is formed from one surface 11a of the hard base material 11 to the other surface 11b by punching or using a die. At this time, the hard base material 11 is perforated together with the first conductor 14 provided on the one surface 11a of the hard base material 11, but the drill or the mold that is in contact with the first conductor 14 is hard. At the same time that the through-hole 11c is drilled in the base material 11, a part of the first conductor 14 is stretched, and the stretched portion is dragged into the through-hole 11c. The conductor 16 is formed. As a result, the first conductor 14 and the second conductor 15 are connected via the third conductor 16.

次いで、硬質基材11の一方の面11aにおいて、第一導電体14とICチップ13を電気的に接続し、非接触型データ受送信体10を得る。   Next, the first conductor 14 and the IC chip 13 are electrically connected on one surface 11a of the hard base material 11 to obtain the non-contact type data transmitting / receiving body 10.

この非接触型データ受送信体10によれば、硬質基材11と、硬質基材11の一方の面11aに設けられた面状の第一導電体14、硬質基材11の他方の面11bに設けられた面状の第二導電体15、および、硬質基材11を厚み方向に貫通して第一導電体14と第二導電体15を接続する第三導電体16から構成されるアンテナ12と、アンテナ12と電気的に接続されたICチップ13と、を備え、第一導電体14と第二導電体15は、硬質基材11を介して対向して配置され、硬質基材11を厚み方向に貫通するとともに、硬質基材11における向かい合う2つの長辺11e,11fの間に延在する貫通孔11cが設けられ、この貫通孔11cは、硬質基材11の長辺11e,11fに対して斜めに配され、この貫通孔11c内に第三導電体16が設けられているので、非接触型データ受送信体10に対して、硬質基材11がその長手方向に撓むように外力が加えられても、貫通孔11cの両端に対して集中的に力が加わり難くなるから、硬質基材11が貫通孔11cに沿って破断することを防止できる。したがって、硬質基材11の破断によって、第三導電体16が露出し、第三導電体16と、第一導電体14または第二導電体15との接続部が損傷するのを防止することができるとともに、この硬質基材11の破断に伴って、貫通孔11cの内側面11dに設けられた第三導電体16が断線して、非接触型データ受送信体10が通信不能になることを防止できる。   According to this non-contact type data transmitting / receiving body 10, the hard base material 11, the planar first conductor 14 provided on one surface 11 a of the hard base material 11, and the other surface 11 b of the hard base material 11. The antenna is composed of a planar second conductor 15 provided on the first conductor 15 and a third conductor 16 that penetrates the hard substrate 11 in the thickness direction and connects the first conductor 14 and the second conductor 15. 12 and an IC chip 13 electrically connected to the antenna 12, and the first conductor 14 and the second conductor 15 are arranged to face each other with the hard base 11 interposed therebetween. Is provided between the two long sides 11e and 11f facing each other in the hard base material 11, and the through holes 11c are provided on the long side 11e and 11f of the hard base material 11. Is arranged obliquely with respect to the third through hole 11c. Since the electric body 16 is provided, even if an external force is applied to the non-contact type data receiving / transmitting body 10 so that the hard base material 11 bends in the longitudinal direction, it is concentrated on both ends of the through hole 11c. Therefore, the hard base material 11 can be prevented from breaking along the through hole 11c. Therefore, it is possible to prevent the third conductor 16 from being exposed due to the breakage of the hard base material 11 and damaging the connection portion between the third conductor 16 and the first conductor 14 or the second conductor 15. As the hard base material 11 is broken, the third conductor 16 provided on the inner surface 11d of the through-hole 11c is disconnected, and the non-contact type data transmitter / receiver 10 becomes unable to communicate. Can be prevented.

また、アンテナ12が面状をなしており、アンテナ12を構成する第一導電体14と第二導電体15が、硬質基材11における向かい合う2つの長辺11e、11fに対し、一方の長辺11e側の長さと他方の長辺11f側の長さが異なるように設けられるので、広帯域性を保持できる。
また、硬質基材11の一方の面11aまたは他方の面11bのいずれか一方が、金属製物品に貼付されていても、金属製物品に貼付されていない面側において、アンテナ12が情報書込/読出装置から発信された電波を十分に取り込み、ICチップ13の作動起電力以上の起電力を誘導することができる。ゆえに、非接触型データ受送信体10は、金属製物品に直接貼付して、非接触状態にて、外部から情報を受信し、また外部に情報を送信できる。
The antenna 12 has a planar shape, and the first conductor 14 and the second conductor 15 constituting the antenna 12 have one long side with respect to the two long sides 11e and 11f facing each other in the hard base material 11. Since the length on the 11e side is different from the length on the other long side 11f side, the broadband property can be maintained.
In addition, even if either one surface 11a or the other surface 11b of the hard base material 11 is affixed to the metal article, the antenna 12 writes information on the surface side not affixed to the metal article. / The radio wave transmitted from the reading device can be sufficiently taken in, and an electromotive force higher than the operating electromotive force of the IC chip 13 can be induced. Therefore, the non-contact type data receiving / transmitting body 10 can be directly attached to a metal article, receive information from the outside in a non-contact state, and transmit information to the outside.

なお、この実施形態では、第一導電体14、第二導電体15および第三導電体16から構成されるアンテナ12が、硬質基材11の厚み方向の断面形状がコの字型をなしている非接触型データ受送信体10を例示したが、本発明の非接触型データ受送信体はこれに限定されない。本発明の非接触型データ受送信体にあっては、アンテナが、硬質基材を介して対向して配設された第一導電体と第二導電体が、基材を厚み方向に貫通して設けられた第三導電体を介して接続されてなるものであれば、アンテナの硬質基材の厚み方向の断面形状がユの字型、エの字型などであってもよい。   In this embodiment, the antenna 12 composed of the first conductor 14, the second conductor 15, and the third conductor 16 has a U-shaped cross section in the thickness direction of the hard base material 11. The contactless data receiving / transmitting body 10 is exemplified, but the contactless data receiving / transmitting body of the present invention is not limited to this. In the non-contact type data transmitting / receiving body of the present invention, the first conductor and the second conductor, in which the antenna is disposed to face each other through the hard base material, penetrate the base material in the thickness direction. The cross-sectional shape in the thickness direction of the hard base material of the antenna may be a U shape, an D shape, or the like.

また、この実施形態では、硬質基材11の長辺11e,11fに対して斜めに配された貫通孔11cを有する非接触型データ受送信体10を例示したが、本発明の非接触型データ受送信体はこれに限定されない。本発明の非接触型データ受送信体にあっては、貫通孔の少なくとも一部が硬質基材の一辺に対して斜めに配されていればよい。   Further, in this embodiment, the non-contact type data receiving / transmitting body 10 having the through holes 11c arranged obliquely with respect to the long sides 11e and 11f of the hard base material 11 is illustrated, but the non-contact type data of the present invention is illustrated. The transmission / reception body is not limited to this. In the non-contact type data transmitting / receiving body of the present invention, it is only necessary that at least a part of the through hole is arranged obliquely with respect to one side of the hard base material.

(2)第二の実施形態
図2は、本発明の非接触型データ受送信体の第二の実施形態を示す概略平面図である。
図2において、図1に示した第一の実施形態の構成要素と同じ構成要素には同一符号を付して、その説明を省略する。
この実施形態の非接触型データ受送信体20が、上述の第一の実施形態の非接触型データ受送信体10と異なる点は、硬質基材11の一端部11A側において、硬質基材11を厚み方向に貫通するとともに、硬質基材11における向かい合う2つの長辺11e,11fの間に延在する平面視略V字状の貫通孔21が設けられている点である。さらに、この貫通孔21は、V字の谷の部分が硬質基材11の一端に対して略垂直となり、V字の線の部分(線状部)21aが硬質基材11の長辺11eに対して斜めになり、V字の線の部分(線状部)21bが硬質基材11の長辺11fに対して斜めになるように配されている点である。
(2) Second Embodiment FIG. 2 is a schematic plan view showing a second embodiment of the contactless data receiving / transmitting body of the present invention.
2, the same components as those of the first embodiment shown in FIG. 1 are denoted by the same reference numerals, and the description thereof is omitted.
The non-contact type data receiving / transmitting body 20 of this embodiment is different from the non-contact type data receiving / transmitting body 10 of the first embodiment described above in that the hard base 11 is on the one end 11A side of the hard base 11. And a through-hole 21 having a substantially V-shape in plan view extending between the two long sides 11e and 11f facing each other in the hard base material 11 is provided. Further, in the through hole 21, the V-shaped valley portion is substantially perpendicular to one end of the hard base material 11, and the V-shaped line portion (linear portion) 21 a is formed on the long side 11 e of the hard base material 11. The V-shaped line portion (linear portion) 21 b is arranged so as to be inclined with respect to the long side 11 f of the hard base material 11.

このように、平面視略V字状の貫通孔21を設ければ、例え、線状部21a、21bのいずれか一方に沿って硬質基材11が破断したとしても、他方が破断しないので、硬質基材11の破断によって、第三導電体16が露出しない部分が残る。したがって、この硬質基材11の破断に伴って、貫通孔21の内側面に設けられた第三導電体16が断線して、非接触型データ受送信体20が通信不能になることを防止できる。   Thus, if the through hole 21 having a substantially V shape in plan view is provided, even if the hard base material 11 breaks along one of the linear portions 21a and 21b, the other does not break. Due to the breakage of the hard base material 11, a portion where the third conductor 16 is not exposed remains. Therefore, it is possible to prevent the non-contact type data receiving / transmitting body 20 from becoming incapable of communication due to the disconnection of the third conductor 16 provided on the inner surface of the through hole 21 with the breakage of the hard base material 11. .

(3)第三の実施形態
図3は、本発明の非接触型データ受送信体の第三の実施形態を示す概略平面図である。
図3において、図1に示した第一の実施形態の構成要素と同じ構成要素には同一符号を付して、その説明を省略する。
この実施形態の非接触型データ受送信体30が、上述の第一の実施形態の非接触型データ受送信体10と異なる点は、硬質基材11の一端部11A側において、硬質基材11を厚み方向に貫通するとともに、硬質基材11における向かい合う2つの長辺11e,11fの間に延在する平面視半円弧状の貫通孔31が設けられている点である。
(3) Third Embodiment FIG. 3 is a schematic plan view showing a third embodiment of the contactless data receiving / transmitting body of the present invention.
3, the same components as those of the first embodiment shown in FIG. 1 are denoted by the same reference numerals, and the description thereof is omitted.
The non-contact type data receiving / transmitting body 30 of this embodiment is different from the non-contact type data receiving / transmitting body 10 of the first embodiment described above in that the hard base 11 is on the one end portion 11A side of the hard base 11. And a through-hole 31 having a semicircular arc shape in plan view extending between the two long sides 11e and 11f facing each other in the hard base material 11 is provided.

このように、平面視半円弧状の貫通孔31を設ければ、非接触型データ受送信体30に対して、硬質基材11がその長手方向に撓むように外力が加えられても、貫通孔31に対して一点に力が集中するのが緩和されるから、硬質基材11が貫通孔31に沿って破断することを防止できる。したがって、硬質基材11の破断によって、第三導電体16が露出し、第三導電体16と、第一導電体14または第二導電体15との接続部が損傷するのを防止することができるとともに、この硬質基材11の破断に伴って、貫通孔11cの内側面11dに設けられた第三導電体16が断線して、非接触型データ受送信体30が通信不能になることを防止できる。   As described above, when the through hole 31 having a semicircular arc shape in plan view is provided, even if an external force is applied to the non-contact type data receiving / transmitting body 30 so that the hard base material 11 is bent in the longitudinal direction, the through hole is provided. Since the concentration of force on one point with respect to 31 is alleviated, the hard base material 11 can be prevented from breaking along the through hole 31. Therefore, it is possible to prevent the third conductor 16 from being exposed due to the breakage of the hard base material 11 and damaging the connection portion between the third conductor 16 and the first conductor 14 or the second conductor 15. As the hard base material 11 breaks, the third conductor 16 provided on the inner surface 11d of the through hole 11c is disconnected, and the non-contact type data transmitter / receiver 30 becomes incapable of communication. Can be prevented.

10,20,30・・・非接触型データ受送信体、11・・・硬質基材、11c,21,31・・・貫通孔、12・・・アンテナ、13・・・ICチップ、14・・・第一導電体、15・・・第二導電体、16・・・第三導電体、17・・・グラウンド。 10, 20, 30 ... non-contact type data transmitting / receiving body, 11 ... hard base material, 11c, 21, 31 ... through hole, 12 ... antenna, 13 ... IC chip, 14. -1st conductor, 15 ... 2nd conductor, 16 ... 3rd conductor, 17 ... Ground.

Claims (2)

硬質基材と、該硬質基材の一方の面に設けられた面状の第一導電体、前記硬質基材の他方の面に設けられた面状の第二導電体、および、前記硬質基材を厚み方向に貫通して前記第一導電体と前記第二導電体を接続する第三導電体から構成されるアンテナと、該アンテナと電気的に接続されたICチップと、を備えた非接触型データ受送信体であって、
前記第一導電体と前記第二導電体は、前記基材を介して対向して配置され、
前記硬質基材を厚み方向に貫通するとともに、前記硬質基材における向かい合う2つの辺の間に延在する貫通孔が設けられ、該貫通孔の少なくとも一部が前記硬質基材の一辺に対して斜めに配され、
前記貫通孔の内に、前記第三導電体が設けられたことを特徴とする非接触型データ受送信体。
Hard substrate, planar first conductor provided on one surface of the hard substrate, planar second conductor provided on the other surface of the hard substrate, and the hard substrate An antenna comprising a third conductor that penetrates the material in the thickness direction and connects the first conductor and the second conductor, and an IC chip electrically connected to the antenna A contact-type data receiver / transmitter,
The first conductor and the second conductor are disposed to face each other with the base material interposed therebetween,
A through hole extending through the hard base material in the thickness direction and extending between two opposite sides of the hard base material is provided, and at least a part of the through hole is provided on one side of the hard base material. Arranged diagonally,
A non-contact type data receiving / transmitting body, wherein the third conductor is provided in the through hole.
前記硬質基材は、ガラスエポキシ樹脂からなる基材であることを特徴とする請求項1に記載の非接触型データ受送信体。
The non-contact type data receiving / transmitting body according to claim 1, wherein the hard base material is a base material made of glass epoxy resin.
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