JP2011003749A5 - - Google Patents
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- Publication number
- JP2011003749A5 JP2011003749A5 JP2009145946A JP2009145946A JP2011003749A5 JP 2011003749 A5 JP2011003749 A5 JP 2011003749A5 JP 2009145946 A JP2009145946 A JP 2009145946A JP 2009145946 A JP2009145946 A JP 2009145946A JP 2011003749 A5 JP2011003749 A5 JP 2011003749A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- bonding material
- electronic device
- electrode
- electrode post
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000463 material Substances 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 14
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims 6
- 238000000034 method Methods 0.000 claims 6
- 238000000465 moulding Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009145946A JP5481701B2 (ja) | 2009-06-19 | 2009-06-19 | 電子装置および電子装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009145946A JP5481701B2 (ja) | 2009-06-19 | 2009-06-19 | 電子装置および電子装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011003749A JP2011003749A (ja) | 2011-01-06 |
| JP2011003749A5 true JP2011003749A5 (https=) | 2012-07-12 |
| JP5481701B2 JP5481701B2 (ja) | 2014-04-23 |
Family
ID=43561465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009145946A Active JP5481701B2 (ja) | 2009-06-19 | 2009-06-19 | 電子装置および電子装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5481701B2 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6036739B2 (ja) * | 2014-04-04 | 2016-11-30 | 株式会社村田製作所 | モジュールおよびその製造方法 |
| US11728307B2 (en) * | 2021-04-21 | 2023-08-15 | Micron Technology, Inc. | Semiconductor interconnect structures with conductive elements, and associated systems and methods |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5120266B6 (ja) * | 2007-01-31 | 2018-06-27 | 富士通セミコンダクター株式会社 | 半導体装置及びその製造方法 |
-
2009
- 2009-06-19 JP JP2009145946A patent/JP5481701B2/ja active Active
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