JP2010537122A - Electrical feedthrough for vacuum pumps - Google Patents

Electrical feedthrough for vacuum pumps Download PDF

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JP2010537122A
JP2010537122A JP2010522377A JP2010522377A JP2010537122A JP 2010537122 A JP2010537122 A JP 2010537122A JP 2010522377 A JP2010522377 A JP 2010522377A JP 2010522377 A JP2010522377 A JP 2010522377A JP 2010537122 A JP2010537122 A JP 2010537122A
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circuit board
vacuum
vacuum pump
housing
pump according
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JP5456674B2 (en
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エングランダー，ハインリッヒ
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オーリコン レイボルド バキューム ゲーエムベーハー
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D17/00—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
    • F04D17/08—Centrifugal pumps
    • F04D17/16—Centrifugal pumps for displacing without appreciable compression
    • F04D17/168—Pumps specially adapted to produce a vacuum
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D19/00—Axial-flow pumps
    • F04D19/02—Multi-stage pumps
    • F04D19/04—Multi-stage pumps specially adapted to the production of a high vacuum, e.g. molecular pumps
    • F04D19/042—Turbomolecular vacuum pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D25/00—Pumping installations or systems
    • F04D25/02—Units comprising pumps and their driving means
    • F04D25/06—Units comprising pumps and their driving means the pump being electrically driven
    • F04D25/0693—Details or arrangements of the wiring
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/08—Sealings
    • F04D29/083—Sealings especially adapted for elastic fluid pumps

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Positive Displacement Air Blowers (AREA)
  • Applications Or Details Of Rotary Compressors (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)

Abstract

【解決手段】真空ポンプは、真空カバー(20)によって閉じられた筐体(10)を備える。筐体(10)の端壁(14)と真空カバー(20)との間に、プリント回路基板(16)が電気的フィードスルーとして配置されている。プリント回路基板(16)は、直径が異なる２つの密閉部(15,21) によって密閉されており、その結果、環状の部分領域(22)が外側で大気圧にさらされ、内側で真空にさらされる。プリント回路基板(16)が筐体(10)の外形を越えて横方向に突出することが回避される。A vacuum pump includes a housing (10) closed by a vacuum cover (20). A printed circuit board (16) is arranged as an electrical feedthrough between the end wall (14) of the housing (10) and the vacuum cover (20). The printed circuit board (16) is sealed by two sealing parts (15, 21) with different diameters, so that the annular partial area (22) is exposed to atmospheric pressure on the outside and exposed to vacuum on the inside. It is. It is avoided that the printed circuit board (16) protrudes laterally beyond the outer shape of the housing (10).

Description

本発明は、モータ及びポンプロータを収容する真空気密な筐体と、回路基板を含む電気的フィードスルーとを備えた真空ポンプに関する。   The present invention relates to a vacuum pump including a vacuum-tight housing that houses a motor and a pump rotor, and an electrical feedthrough including a circuit board.

ターボ分子ポンプタイプの真空ポンプはロータを備えており、ロータは、非常に高い回転数で回転するように構成されており、従って高真空を生成すべく適合されている。このタイプの多くのポンプでは、ロータ及び該ロータを駆動するモータが磁気軸受で支持されている。筐体内は、通常10mbar未満の真空である。モータ及び磁気軸受のための電気的フィードスルーが、筐体に真空気密な状態で配置されている。   A turbomolecular pump type vacuum pump includes a rotor, which is configured to rotate at a very high rotational speed and is therefore adapted to produce a high vacuum. In many pumps of this type, the rotor and the motor that drives the rotor are supported by magnetic bearings. The inside of the housing is usually a vacuum of less than 10 mbar. Electrical feedthroughs for the motor and magnetic bearings are placed in a vacuum-tight manner in the housing.

欧州特許出願公開第１７５７８２５号明細書には、筐体内へ挿入された電気的フィードスルーが回路基板を備えている真空ポンプが記載されている。回路基板の内面が、密閉手段を介して筐体に接して配置されており、回路基板の外面が、別の密閉手段を介して外側の真空カバーに接して配置されており、前記真空カバーは真空気密な状態で筐体を閉じている。回路基板の配線導体が２つの密閉手段間の間隙を通って導かれている。回路基板は、筐体の外部に配置されてコネクタを備えた突出部を含む。別のコネクタが、筐体内に配線導体に接して配置されている。   EP 1 578 825 describes a vacuum pump in which an electrical feedthrough inserted into a housing comprises a circuit board. The inner surface of the circuit board is disposed in contact with the casing through the sealing means, the outer surface of the circuit board is disposed in contact with the outer vacuum cover through another sealing means, and the vacuum cover is The case is closed in a vacuum-tight state. The wiring conductor of the circuit board is guided through the gap between the two sealing means. The circuit board includes a protrusion that is disposed outside the housing and includes a connector. Another connector is disposed in contact with the wiring conductor in the housing.

欧州特許出願公開第１７５７８２５号明細書European Patent Application No. 1757825

本発明は、その一部が筐体を越えて突出する回路基板を電気的フィードスルーが備えていないため、回路基板及び露出したプラグ装置が損傷する危険性の回避を可能にする真空ポンプを提供することを目的とする。   The present invention provides a vacuum pump that allows avoiding the risk of damaging the circuit board and the exposed plug device because the electrical feedthrough does not include a circuit board, part of which protrudes beyond the housing. The purpose is to do.

本発明に係る真空ポンプは、請求項１によって定義される。前記真空ポンプは、第１密閉手段及び第２密閉手段が配置されている回路基板を備えており、回路基板の部分領域が外側で大気圧にさらされ、生成された真空に内側でさらされるように、第１密閉手段及び第２密閉手段は互いに横方向に変位して配置されている。   The vacuum pump according to the invention is defined by claim 1. The vacuum pump includes a circuit board on which a first sealing means and a second sealing means are arranged so that a partial region of the circuit board is exposed to atmospheric pressure on the outside and exposed to the generated vacuum on the inside. In addition, the first sealing means and the second sealing means are disposed laterally displaced from each other.

このような構成の利点は、圧力差にさらされて筐体の壁を越えて横方向に延びていない前記部分領域が、回路基板に導電体を接続するために用いられ得ることにある。第１及び第２密閉手段の横方向への相互の変位により、空間が、壁の外形内に生成され、外側の線の接続のために利用可能となる。このため、回路基板が筐体の外形を越えて延びる必要性が回避される。圧力差を受ける回路基板の壁部分では、回路基板自体がポンプの壁を形成する。回路基板が筐体の壁の前側端部に接して支持されているので、前記部分領域の歪みが防がれる。   An advantage of such an arrangement is that the partial area that is exposed to a pressure differential and does not extend laterally beyond the wall of the housing can be used to connect the conductor to the circuit board. Due to the lateral displacement of the first and second sealing means, a space is created in the outer shape of the wall and is available for connection of the outer lines. This avoids the need for the circuit board to extend beyond the outer shape of the housing. In the wall portion of the circuit board that receives the pressure differential, the circuit board itself forms the wall of the pump. Since the circuit board is supported in contact with the front end portion of the wall of the housing, distortion of the partial region is prevented.

本発明の好ましい実施形態によれば、筐体を真空に閉鎖する真空カバーが、保護カバー内に配置されて、保護カバーに対して移動可能である。保護カバーの面に垂直な移動の可能性により、密閉手段が所定の位置に押圧されることが可能になる。真空カバーは、真空カバーに作用する圧力差によって所定の位置に保持されており、保護カバーによって大まかに位置付けられているだけである。保護カバーは、真空カバー及び回路基板の損傷を回避すべく機能する。保護カバーは、この機能以外に、回路基板に導かれる外側の電気線のプラグ接続のための支持体として機能する。保護カバーは、真空カバーの位置を決めるための位置決め手段を含んでいるが、他方では、真空カバーが既存の圧力差の反作用を受けることを可能にする。代わりに、真空カバーを保護カバーと一体に形成することが可能である。   According to a preferred embodiment of the present invention, a vacuum cover that closes the housing to a vacuum is disposed within the protective cover and is movable relative to the protective cover. The possibility of movement perpendicular to the surface of the protective cover allows the sealing means to be pressed into place. The vacuum cover is held in place by the pressure difference acting on the vacuum cover and is only roughly positioned by the protective cover. The protective cover functions to avoid damaging the vacuum cover and the circuit board. In addition to this function, the protective cover functions as a support for connecting the plug of the outer electric wire led to the circuit board. The protective cover includes positioning means for determining the position of the vacuum cover, but on the other hand allows the vacuum cover to be subjected to the reaction of an existing pressure differential. Alternatively, the vacuum cover can be formed integrally with the protective cover.

電気的フィードスルーの第１実施形態を示す真空ポンプの筐体の部分縦断面図である。It is a partial longitudinal cross-sectional view of the housing | casing of the vacuum pump which shows 1st Embodiment of electrical feedthrough. 回路基板が電気部品を更に備えている電気的フィードスルーの第２実施形態を示す図である。It is a figure which shows 2nd Embodiment of the electrical feedthrough in which the circuit board is further provided with the electrical component.

本発明の実施形態を、添付図面を参照して以下に更に詳細に説明する。   Embodiments of the present invention will be described in more detail below with reference to the accompanying drawings.

図１には、ターボ分子ポンプの筐体10が示されている。筐体10内にモータ及びポンプロータが配置されている。筐体10は、両端部の内の一方にポンプ入口11を備えており、外周部にポンプ出口12を備えている。前記ポンプ入口11で真空が生成される。前記ポンプ出口12は大気又はプレ真空ポンプに通じることが可能である。   FIG. 1 shows a casing 10 of a turbo molecular pump. A motor and a pump rotor are arranged in the housing 10. The casing 10 has a pump inlet 11 at one of both ends, and a pump outlet 12 at the outer periphery. A vacuum is generated at the pump inlet 11. The pump outlet 12 can lead to an atmospheric or pre-vacuum pump.

筐体の環状壁13の後方端部には、平坦な端面14が設けられている。端面14に、Ｏリングとして形成された環状の第１密閉手段15を収容する溝が形成されている。端面14に接して回路基板16が配置されてあり、回路基板16は、両面の一方又は両方に配線導体（図示せず）を備えた絶縁材料からなる本体から構成されている。このような回路基板は「プリント回路」とも呼ばれる。回路基板16は第１密閉手段15に密接して配置されている。端面14に囲まれている回路基板の中央領域には、開口部17が圧力補償のために形成されている。回路基板16は、ポンプの内部チャンバに面する内面18と、内部チャンバから見て外方に面する外面19とを有する。前記内面18は、第１密閉手段15に接して配置されている。   A flat end surface 14 is provided at the rear end of the annular wall 13 of the housing. The end face 14 is formed with a groove for accommodating the first annular sealing means 15 formed as an O-ring. A circuit board 16 is disposed in contact with the end face 14, and the circuit board 16 is composed of a main body made of an insulating material having a wiring conductor (not shown) on one or both sides. Such a circuit board is also called a “printed circuit”. The circuit board 16 is disposed in close contact with the first sealing means 15. An opening 17 is formed in the central region of the circuit board surrounded by the end face 14 for pressure compensation. The circuit board 16 has an inner surface 18 facing the inner chamber of the pump and an outer surface 19 facing outward as viewed from the inner chamber. The inner surface 18 is disposed in contact with the first sealing means 15.

真空カバー20が、回路基板16の外面19に接して配置されている。真空カバー20は、第２密閉手段21が保持されている環状溝を含む。更に、前記第２密閉手段21はＯリング型である環状の密閉手段である。第２密閉手段21は、第１密閉手段15より小さな直径で開口している。このようにして、２つの密閉手段15,21 間に環状の部分領域22が形成され、環状の部分領域22は、外側が大気圧にさらされ、内側が真空にさらされるので既存の圧力差にさらされる。開口部17が設けられているため、第２密閉手段21によって囲まれた領域では、圧力が平衡を保っており、つまり、筐体の内部の真空が真空カバー20のこの領域に作用する。従って、真空カバー20は、大気圧の影響により壁13に向かう方向に押圧される。   A vacuum cover 20 is disposed in contact with the outer surface 19 of the circuit board 16. The vacuum cover 20 includes an annular groove in which the second sealing means 21 is held. Further, the second sealing means 21 is an O-ring type annular sealing means. The second sealing means 21 opens with a smaller diameter than the first sealing means 15. In this way, an annular partial region 22 is formed between the two sealing means 15, 21 and the annular partial region 22 is exposed to atmospheric pressure on the outside and exposed to vacuum on the inside so Exposed. Since the opening 17 is provided, the pressure is balanced in the region surrounded by the second sealing means 21, that is, the vacuum inside the housing acts on this region of the vacuum cover 20. Accordingly, the vacuum cover 20 is pressed in the direction toward the wall 13 due to the influence of atmospheric pressure.

筐体10は、前側の端部で、密閉機能を備えない保護カバー23によって閉じられている。保護カバー23は、真空カバー20を収容するための中空の空間24と、真空カバー20の位置を決めるための階段状の肩部として形成された位置決め手段25とを含んでいる。保護カバー23は、回路基板及び回路基板に接続された要素だけでなく真空カバー20をも保護すべく機能する。   The casing 10 is closed at the front end by a protective cover 23 that does not have a sealing function. The protective cover 23 includes a hollow space 24 for housing the vacuum cover 20 and positioning means 25 formed as a stepped shoulder for determining the position of the vacuum cover 20. The protective cover 23 functions to protect the vacuum cover 20 as well as the circuit board and the elements connected to the circuit board.

回路基板16の内面18から、電気線26が筐体の内部に延びている。これらの電気線26は、電気供給線であってもよく、或いは制御線又は信号線であってもよい。電気線26は、はんだ付け又はプラグの取付けにより回路基板の導体線に接続されている。   An electric wire 26 extends from the inner surface 18 of the circuit board 16 into the housing. These electric lines 26 may be electric supply lines, or may be control lines or signal lines. The electric wire 26 is connected to the conductor wire of the circuit board by soldering or attaching a plug.

外側の導電体27が、回路基板16の外面19にはんだ付けされるか、又はプラグを用いて取り付けられる。前記導電体27は、多重電気プラグとして構成されたプラグ装置28に内部の空間24を通って導かれる。プラグ装置28は外部のケーブルと接続すべく機能する。プラグ装置28は、保護カバー23の側壁に配置されているが、裏面に配置されてもよい。   The outer conductor 27 is soldered to the outer surface 19 of the circuit board 16 or attached using a plug. The conductor 27 is guided through the internal space 24 to a plug device 28 configured as a multiple electrical plug. The plug device 28 functions to connect with an external cable. The plug device 28 is disposed on the side wall of the protective cover 23, but may be disposed on the back surface.

回路基板16は、側壁13を越えて横方向に突出していない。第１及び第２密閉手段15,21 間の部分的領域22が、導電体27のための接続領域として設けられている。   The circuit board 16 does not protrude laterally beyond the side wall 13. A partial region 22 between the first and second sealing means 15, 21 is provided as a connection region for the conductor 27.

図２に示された実施形態は、回路基板16が、例えば抵抗器、コンデンサ、プロセッサ又はメモリ素子のような電気部品30を更に備えているという点のみ図１に示された実施形態とは異なる。電気部品30は、同様に受動素子及び能動素子であってもよい。   The embodiment shown in FIG. 2 differs from the embodiment shown in FIG. 1 only in that the circuit board 16 further comprises electrical components 30 such as resistors, capacitors, processors or memory elements. . The electrical component 30 may be a passive element and an active element as well.

第１実施形態と同様に、真空カバー20は密閉手段21を支持している縁部によって囲まれた凹部31を含む。図２では、前記凹部31は、回路基板の外面19に固定された電気部品30を収容すべく機能する。   Similar to the first embodiment, the vacuum cover 20 includes a recess 31 surrounded by an edge supporting the sealing means 21. In FIG. 2, the recess 31 functions to accommodate the electrical component 30 fixed to the outer surface 19 of the circuit board.

Claims (10)

モータ及びポンプロータを収容し、ポンプ入口(11)及びポンプ出口(12)を含む真空気密な筐体(10)と、回路基板(16)を含む電気的フィードスルーとを備えた真空ポンプであり、前記回路基板の内面(18)が第１密閉手段(15)を介して前記筐体の壁の端面(14)に接して配置されており、前記回路基板の外面(19)が第２密閉手段(21)を介して前記筐体の真空カバー(20)に接して配置されている真空ポンプにおいて、
前記回路基板(16)の部分領域(22)が外側で大気圧にさらされ、生成された真空に内側でさらされるように、前記第１及び第２密閉手段(15,21) は互いに横方向に変位して配置されていることを特徴とする真空ポンプ。 A vacuum pump containing a motor and a pump rotor, and having a vacuum-tight housing (10) including a pump inlet (11) and a pump outlet (12), and an electrical feedthrough including a circuit board (16) The inner surface (18) of the circuit board is disposed in contact with the end surface (14) of the wall of the housing via the first sealing means (15), and the outer surface (19) of the circuit board is second sealed. In the vacuum pump arranged in contact with the vacuum cover (20) of the housing through the means (21),
The first and second sealing means (15, 21) are transverse to each other so that the partial area (22) of the circuit board (16) is exposed to atmospheric pressure on the outside and exposed to the generated vacuum on the inside. A vacuum pump characterized by being displaced in position. 前記部分領域(22)から延びる外側の導電体(27)が、前記回路基板(16)の配線導体に接続されていることを特徴とする請求項１に記載の真空ポンプ。   The vacuum pump according to claim 1, wherein an outer conductor (27) extending from the partial region (22) is connected to a wiring conductor of the circuit board (16). 前記外側の導電体(27)は、前記筐体(10)に固定されたプラグ装置(28)に接続されていることを特徴とする請求項２に記載の真空ポンプ。   The vacuum pump according to claim 2, wherein the outer conductor (27) is connected to a plug device (28) fixed to the casing (10). 前記真空カバー(20)は、保護カバー(23)内に配置されており、前記保護カバーに対して移動可能であることを特徴とする請求項１乃至３のいずれかに記載の真空ポンプ。   The vacuum pump according to any one of claims 1 to 3, wherein the vacuum cover (20) is disposed in the protective cover (23) and is movable with respect to the protective cover. 前記保護カバー(23)は、前記真空カバー(20)の位置を決めるための位置決め手段(25)を備えていることを特徴とする請求項４に記載の真空ポンプ。   The vacuum pump according to claim 4, wherein the protective cover (23) includes positioning means (25) for determining the position of the vacuum cover (20). 前記回路基板(16)に、圧力補償のための開口部(17)が形成されていることを特徴とする請求項１乃至５のいずれかに記載の真空ポンプ。   The vacuum pump according to any one of claims 1 to 5, wherein an opening (17) for pressure compensation is formed in the circuit board (16). 前記回路基板(16)は、内面(18)及び／又は外面(19)に電気部品(30)を支持していることを特徴とする請求項１乃至６のいずれに記載の真空ポンプ。   The vacuum pump according to any one of claims 1 to 6, wherein the circuit board (16) supports an electrical component (30) on an inner surface (18) and / or an outer surface (19). 前記回路基板(16)は、ポンプ検出のための電子部品を備えていることを特徴とする請求項１乃至７のいずれかに記載の真空ポンプ。   The vacuum pump according to any one of claims 1 to 7, wherein the circuit board (16) includes an electronic component for detecting a pump. 前記第１及び第２密閉手段(15,21) は、異なる直径で開口している環状の密閉手段であることを特徴とする請求項１乃至８のいずれかに記載の真空ポンプ。   The vacuum pump according to any one of claims 1 to 8, wherein the first and second sealing means (15, 21) are annular sealing means opened with different diameters. 前記プラグ装置(28)は、前記筐体(10)の保護カバー(23)に取り付けられていることを特徴とする請求項３に記載の真空ポンプ。   The vacuum pump according to claim 3, wherein the plug device (28) is attached to a protective cover (23) of the housing (10).
JP2010522377A 2007-08-30 2008-08-28 Electrical feedthrough for vacuum pumps Expired - Fee Related JP5456674B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE202007012070U DE202007012070U1 (en) 2007-08-30 2007-08-30 Electric feedthrough of a vacuum pump
DE202007012070.2 2007-08-30
PCT/EP2008/061335 WO2009027485A1 (en) 2007-08-30 2008-08-28 Current leadthrough for a vacuum pump

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US8961105B2 (en) 2010-07-07 2015-02-24 Shimadzu Corporation Vacuum pump
JP2018109371A (en) * 2016-12-28 2018-07-12 エドワーズ株式会社 Vacuum pump, connector applied to vacuum pump, and control device
JP2021508363A (en) * 2017-11-03 2021-03-04 グリー グリーン リフリッジレイション テクノロジー センター カンパニー リミテッド オブ チューハイ Connecting wire structures for magnetic bearings, compressors, and air regulators
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JP7214711B2 (en) 2017-11-03 2023-01-30 グリー グリーン リフリッジレイション テクノロジー センター カンパニー リミテッド オブ チューハイ Connecting wire structures for magnetic bearings, compressors, and air regulators

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KR101497901B1 (en) 2015-03-03
KR20100058524A (en) 2010-06-03
JP5456674B2 (en) 2014-04-02
DE202007012070U1 (en) 2009-01-08
US20100303650A1 (en) 2010-12-02
CN101796302A (en) 2010-08-04
WO2009027485A1 (en) 2009-03-05
EP2183486A1 (en) 2010-05-12
RU2010111847A (en) 2011-10-10
TW200909688A (en) 2009-03-01
CA2695506A1 (en) 2009-03-05

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