JP2014011120A - Electrical feedthrough, vacuum pump and printed circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make compact an electrical feedthrough used in a vacuum device while reducing the cost.SOLUTION: An electrical feedthrough 33 transfers an electric signal while vacuum sealing between the vacuum side and the atmosphere side of a vacuum device. The electrical feedthrough 33 includes pads 334e, 334f, a printed circuit board 336 having a through via 330 formed to penetrate the pads 334e, 334f, and a connector 200 having a connection pin 201a, being soldered to the pads 334e, 334f so as to surface mount the connector 200 on the printed circuit board 336. The through via 330 is sealed when the connection pin 201a is soldered thereto. Consequently, a general purpose connector 200 can be used, and since the through via 330 is formed in the pad region, the cost and size can be reduced.

Description

  The present invention relates to an electric feedthrough of a vacuum apparatus, a vacuum pump provided with the electric feedthrough, and a printed circuit board used for the electric feedthrough.

  A turbo molecular pump used for evacuation of a semiconductor manufacturing apparatus or the like includes a pump body and a control unit that controls the pump body. In general, the pump body is fixed to the vacuum chamber of the apparatus, the control unit is installed at a location away from the vacuum chamber, and the pump body and the control unit are connected by a cable and a connector plug mechanism. There is also known an integrated turbomolecular pump in which a pump body and a control unit are directly connected by a connector plug mechanism without using a cable.

  By the way, in the integrated turbo molecular pump, there is a problem that when a conventional connector dedicated to vacuum use is used, it is disadvantageous in volume and cost. Therefore, instead of using a dedicated connector, a configuration in which general-purpose connectors are mounted on both front and back surfaces of a circuit board and the circuit board is fixed to a vacuum pump has been proposed (for example, see Patent Document 1).

Utility Model Registration No. 3172822

  However, in the apparatus described in Patent Document 1, since the printed board needs to function as a member that blocks the vacuum side and the atmosphere side, an insulating layer is formed so as to cover one side of the via, and the insulating layer By forming the wiring pattern in a staircase shape inside, a device is provided so that the vacuum side and the atmosphere side are not directly communicated with each other via. Thus, since the circuit board has a special structure, it is an impediment to cost reduction.

The invention according to claim 1 is an electric feedthrough for transmitting and receiving an electric signal while vacuum-sealing between the vacuum side and the atmosphere side of the vacuum apparatus, and is formed so as to penetrate the pad and the pad. A printed circuit board having through vias, and a board connecting portion, and the board connecting portion soldered to a pad and surface-mounted on the printed board.
According to a second aspect of the present invention, in the electric feedthrough according to the first aspect, the pad is provided with a plurality of through vias.
According to a third aspect of the present invention, in the electrical feedthrough according to the first or second aspect, one mounting surface is soldered with a connector for electrical wiring on the vacuum side as a surface mounting component, and the other mounting surface is mounted on the other mounting surface. Is characterized in that an air-side electrical wiring connector is soldered as a surface-mounted component, and the vacuum-side connector and the air-side connector are electrically connected through a through via.
According to a fourth aspect of the present invention, there is provided a vacuum pump according to the third aspect of the present invention. A power supply unit having a motor drive circuit for driving and controlling the motor, the vacuum side connector mounted on the electric feedthrough is connected to the motor, and the atmospheric side connector is connected to the motor drive circuit, and the vacuum side The atmospheric-side connector is characterized in that at least one of the board connecting portions is soldered to a pad and electrically connected through a through via.
A printed circuit board according to a fifth aspect of the present invention is a printed circuit board used for the electrical feedthrough according to any one of the first to third aspects.

  According to the present invention, it is possible to reduce the size and cost of an electric feedthrough used in a vacuum apparatus.

It is a figure which shows the integrated turbomolecular pump attached to the vacuum apparatus. It is a figure explaining the connection structure of the pump unit 2 and the power supply unit 3. FIG. It is a figure which shows the detail of the printed circuit board 336. FIG. It is a figure which shows the AA cross section of FIG. FIG. 3 is a diagram showing an electrical feedthrough of a vacuum chamber. It is a figure which shows the other example of a connection.

  Embodiments of a turbo molecular pump according to the present invention will be described below with reference to the drawings. FIG. 1 is a view showing an integrated turbomolecular pump attached to a vacuum apparatus. As shown in FIG. 1, the turbo molecular pump 1 of the present embodiment includes a pump unit 2 and a power supply unit 3. The power supply unit 3 is attached to a fixed portion 20 a provided on the side surface of the base portion 20 of the pump unit 2. The turbo molecular pump 1 is attached to the vacuum device 7 by fixing an inlet flange 5 provided in the pump unit 2 to a vacuum chamber of a vacuum device 7 such as a semiconductor manufacturing apparatus. A back pump is connected to the exhaust port 21 of the pump unit 2.

  FIG. 2 is a diagram for explaining a connection structure between the pump unit 2 and the power supply unit 3. In FIG. 2, the power supply unit 3 and the connection portion between the power supply unit 3 and the pump unit 2 are shown in cross section. The power supply unit 3 drives and controls the pump unit 2, and includes a motor control unit that controls a motor that rotates the rotor of the turbo molecular pump, a sensor circuit unit that processes sensor signals necessary for motor control, and the like. . In addition, a magnetic bearing type turbo pump further includes a bearing control unit and a sensor circuit unit of a bearing sensor.

  Reference numeral 30 denotes a casing of the power supply unit 3, which is bolted to the fixing portion 20 a of the base portion 20. A seal member 202 is provided between the casing 30 and the fixed portion 20a. Inside the casing 30, substrates 31a and 31b on which electronic components (not shown) are mounted are provided. Further, a printed circuit board 336 is fixed to the base portion 20 of the pump unit 2 so as to close the opening 203 formed in the fixing portion 20a.

  A seal member 201 is provided between the printed board 336 and the fixed portion 20a. When the inside of the pump is in a vacuum state, the space on the right side of the printed board 336 is in a vacuum state, and the inside of the casing 30 on the left side of the printed board 336 is in an atmospheric pressure state. That is, the electrical feedthrough 33 of the present embodiment is a circuit board such as a connector mounted on a printed board 336, and has a function of performing electrical connection between the vacuum side and the atmosphere side. For the printed board 336, for example, a glass cloth epoxy board is used.

  In the example shown in FIG. 2, the connector 200 is mounted on the vacuum side surface of the printed circuit board 336, and the connectors 34a and 34b are mounted on the air side surface. The connector 34a is connected to the connector 32a by a lead wire, and the connector 34b is connected to the connector 32b by a lead wire. As will be described later, the connector 200 and the connectors 34a and 34b are electrically connected by a wiring member (through via, wiring pattern) on which the printed board 336 is formed.

  FIG. 3 is a diagram illustrating the electric feedthrough 33. FIG. 3A is a view showing the casing 30 side of the electric feedthrough 33, and FIG. 3B is a view showing the base portion 20 side of the electric feedthrough 33. FIG. 4 is a cross-sectional view taken along the line AA in FIG.

  The printed circuit board 336 is a surface-mount type printed circuit board, and a plurality of through vias 330 are formed as shown in FIG. In the example shown in FIG. 3A, six wiring patterns 331a to 331f are formed, and six through vias 330 are formed so as to penetrate each of the wiring patterns 331a to 331f. The connection pins 340 and 341 of the connector 34a are connected to pads (not shown) provided on the corresponding wiring patterns 331c and 331d, respectively. The connection pins 342 and 343 of the connector 34b are connected to the corresponding wiring patterns 331e and 331f, respectively.

  On the other hand, as shown in FIG. 3B, a ring-shaped copper pattern 333 is formed on the surface of the printed board 336 on the vacuum side (base part 20 side). The copper pattern 333 functions as a seal surface with which the seal member 201 shown in FIG. 2 comes into contact. In the inner region surrounded by the copper pattern 333, pads (also called lands) 334a to 334f for mounting circuit components are formed by the copper pattern. A through via 330 penetrating the wiring pattern 331a penetrates the pad 334a. Similarly, the through vias 330 penetrating the wiring patterns 331b to 331f penetrate the corresponding pads 334b to 334f, respectively. The connector 200 is provided with six terminals 201, and connection pins 201a which are board connection portions of the terminals 201 are soldered to corresponding pads 334a to 334f.

  As shown in the AA sectional view of FIG. 4, the connector 200 is a general-purpose product and has a general configuration including a housing 202 and terminals 201 formed of an insulating resin. The through via 330 is formed by forming a through hole of the printed circuit board 336 and copper plating the inner peripheral surface thereof, and connects the copper patterns formed on the front and back surfaces of the printed circuit board 336 to each other. In the present embodiment, as described above, the through via 330 is disposed so as to penetrate the pads 334a to 334f. When the connector 200 is mounted on the printed circuit board 336, it is connected by reflow soldering so that the openings of the through vias 330 of the pads 334a to 334f are closed by the connection pins 201a of the connector 200 as shown in FIG. The As a result, the through via 330 is shielded by the connection pin 201a and the solder 335, and the vacuum side (pump unit side) is kept airtight.

  The electric feedthrough 33 transmits and receives an electrical signal while vacuum-sealing between the vacuum side and the atmosphere side of the vacuum apparatus. The electric feedthrough 33 includes a printed circuit board 336 having a pad and a through via formed so as to penetrate the pad. For example, a connector for a power supply line to the motor of the pump unit is soldered to one mounting surface of the printed circuit board, that is, a pad on the vacuum side, and a motor drive circuit of the power supply unit is mounted on the mounting surface on the atmosphere The connector is soldered.

  In the example shown in FIG. 3, the connection pins 201a of the connector 200 on the vacuum side are soldered to pads 334a to 334f in which the through vias 330 are formed, and the connection pins 340 to 343 of the connectors 34a and 34b on the atmosphere side are through vias. Soldered to a pad formed on the wiring pattern connected to 330. For example, as shown in FIG. 6, pads may be provided on both the vacuum side and the atmosphere side of the through via 330, and the connection pins of the connectors 210 and 211 may be soldered to them.

  In FIG. 3, the 6-pin connector 200 is provided on the vacuum side and the 2-pin connectors 34a and 34b are provided on the atmosphere side. However, a 6-pin connector may be provided on the atmosphere side. With such a configuration, the process of drawing the pattern from the pad can be omitted, and the printed circuit board 336 can be made smaller.

  In the example described above, the number of through vias 330 provided in one pad is six. However, the number is not limited to this, and the number of through vias 330 may be set as appropriate according to the magnitude of current. In the case of a turbo molecular pump, there is a power system that supplies power to a motor or an electromagnet, and a signal system wiring that is used to connect a sensor or the like. Therefore, the number of through vias 330 is increased in the case of a power system and is decreased in the case of a signal system so as to avoid an unnecessarily large substrate area.

  In the above-described embodiment, the electric feedthrough of the turbo molecular pump has been described as an example. However, the electric feedthrough of the present invention is not limited to the turbo molecular pump, and is applied as an electric feedthrough of various vacuum apparatuses such as a mass spectrometer. be able to. FIG. 5 shows an example when used as an electric feedthrough of a vacuum chamber.

  Reference numeral 70 denotes a wall portion of the vacuum chamber, and a printed circuit board 336 provided in the electric feedthrough 33 is attached so as to close the opening 700 of the wall portion 70. A seal member 701 seals between the wall 70 and the printed circuit board 336. The printed circuit board 336 is sandwiched between the fixing flange 73 and the wall portion 70 by fixing the fixing flange 73 to the wall portion 70 with bolts 74. On the printed circuit board 336, a pressure sensor 71 and a connector 72 for drawing out the signal of the pressure sensor 71 out of the vacuum chamber are mounted as circuit components. The pressure sensor 71 is mounted on the surface of the printed circuit board 336 on the vacuum chamber side, and the connector 72 is mounted on the surface of the printed circuit board 336 on the atmosphere side.

  The connection pin 711 of the pressure sensor 71 is soldered to the pad 334 so as to block the through vias 330a and 330b. On the other hand, with respect to the connector 72, one connection pin 721 is soldered so as to close the through via 330a, while the other connection pin 722 is on a pad provided in a wiring pattern connected to the through via 330b. Soldered to

  As described above, the electrical feedthrough 33 according to the present embodiment is an electrical feedthrough for transferring an electrical signal while vacuum-sealing between the vacuum side and the atmosphere side of the vacuum apparatus, and the pad 334a. 334f and a printed circuit board 336 having a through via 330 formed so as to penetrate the pads 334a to 334f, and a connection pin 201a which is a board connection portion. The connection pin 201a is soldered to the pads 334a to 334f. And a connector 200 that is a surface-mounted component that is surface-mounted on the printed circuit board 336.

  Thus, in the present embodiment, the through via 330 is sealed by soldering the connection pin 201a to the pads 334a to 334f. A part of the solder enters the through via 330. Moreover, since the electric feedthrough 33 is configured using the general printed circuit board 336 and a general-purpose connector as described above, the cost can be reduced. Since the through via 330 is formed in the pad, it does not require an arrangement space for the through via and can be miniaturized.

  Note that by forming a plurality of through vias 330 in the pads 334a to 334f, it is possible to cope with connection of a line having a large current value.

  Furthermore, the electric feedthrough 33 of the present embodiment can be applied to a vacuum pump in which a pump unit and a power supply unit are integrated like the above-described turbo molecular pump, and various types such as a mass spectrometer and a vacuum chamber. It can be used as an electric field through of the vacuum device.

  In addition, the above description is an example to the last, and this invention is not limited to the said embodiment at all unless the characteristic of this invention is impaired. For example, in the example shown in FIG. 3, the pads 334a to 334f in which the through vias 330 are formed are provided on the vacuum side, but may be provided on the atmosphere side. In that case, the through via 330 is closed by the board connecting portion of the circuit component mounted on the atmosphere side surface.

  1: turbo molecular pump, 2: pump unit, 3: power supply unit, 33: electric feedthrough, 32a, 32b, 34a, 34b, 72, 200, 210, 211: connector, 70: wall, 71: pressure sensor, 201a, 210a, 211a, 340-343, 711, 721, 722: connection pins, 330, 330a, 330b: through vias, 334, 334a-334f: pads, 335: solder, 336: printed circuit boards

Claims (5)

An electrical feedthrough for transmitting and receiving electrical signals while vacuum-sealing between the vacuum side and the atmosphere side of the vacuum device,
A printed circuit board having a pad and a through via formed to penetrate the pad;
An electric feed-through comprising a board connecting portion, and the board connecting portion soldered to the pad and surface-mounted on the printed board. The electrical feedthrough of claim 1,
An electrical feedthrough, wherein the pad is provided with a plurality of through vias. The electrical feedthrough according to claim 1 or 2,
One mounting surface is soldered with a vacuum-side electrical wiring connector as the surface mounting component, and the other mounting surface is soldered with an air-side electrical wiring connector as the surface mounting component. The electrical feedthrough is characterized in that the vacuum-side connector and the atmospheric-side connector are electrically connected through the through via. An electrical feedthrough according to claim 3;
A pump unit having at least a motor for rotating the rotor and evacuating the vacuum processing chamber;
A power supply unit integrally connected to the pump unit and having a motor drive circuit for driving and controlling the motor;
The vacuum side connector mounted on the electrical feedthrough is connected to the motor, and the atmospheric side connector is connected to the motor drive circuit,
The vacuum pump is characterized in that at least one substrate connecting portion of the vacuum side and atmospheric side connectors is soldered to the pad and electrically connected through the through via.   The printed circuit board used for the electric feedthrough as described in any one of Claims 1 thru | or 3.

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