JP2016079906A - Vacuum pump - Google Patents

Vacuum pump Download PDF

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JP2016079906A
JP2016079906A JP2014212633A JP2014212633A JP2016079906A JP 2016079906 A JP2016079906 A JP 2016079906A JP 2014212633 A JP2014212633 A JP 2014212633A JP 2014212633 A JP2014212633 A JP 2014212633A JP 2016079906 A JP2016079906 A JP 2016079906A
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Prior art keywords
pump
pump body
circuit board
printed circuit
heat
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JP6451201B2 (en
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清水　幸一
Koichi Shimizu
幸一 清水
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Shimadzu Corp
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Shimadzu Corp
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D19/00—Axial-flow pumps
    • F04D19/02—Multi-stage pumps
    • F04D19/04—Multi-stage pumps specially adapted to the production of a high vacuum, e.g. molecular pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D25/00—Pumping installations or systems
    • F04D25/02—Units comprising pumps and their driving means
    • F04D25/06—Units comprising pumps and their driving means the pump being electrically driven
    • F04D25/0693—Details or arrangements of the wiring
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F04D29/582—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps
    • F04D29/5853—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps heat insulation or conduction

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Non-Positive Displacement Air Blowers (AREA)

Abstract

PROBLEM TO BE SOLVED: To effectively release the heat of terminal pins electrically connected to a control device that controls a pump body.SOLUTION: A vacuum pump comprises: a pump body; a control device that controls the pump body; a printed board on which a wiring pattern connected to the control device is formed; and a terminal member including a sealing component that seals an opening part of the pump body, and terminal pins passed through the sealing component and connected to the wiring pattern. The periphery of the opening part of the pump body is connected to a surface in the printed board opposed to the pump body so that heat can be conducted.SELECTED DRAWING: Figure 3

Description

本発明は、真空ポンプに関する。   The present invention relates to a vacuum pump.

半導体製造装置等の外部装置の真空排気に用いられる真空ポンプは、ポンプ本体とそのポンプ本体を制御する制御装置とを備えている。一般的に、ポンプ本体は外部装置の真空チャンバに固定され、制御装置は真空チャンバから離れた場所に設置される（たとえば、特許文献１参照）。制御装置と、ポンプ本体の筐体内に設けられる電動機とは、ポンプ本体の筐体の開口部に設けられた端子部材（ハーメチックシールコネクタ）を介して、電気的に接続されている。端子部材は、ポンプ本体の筐体の開口部を封止する封止部品（ハーメチックシール）と、封止部品を貫通する端子ピンとを有している。   A vacuum pump used for evacuation of an external apparatus such as a semiconductor manufacturing apparatus includes a pump body and a control device that controls the pump body. In general, the pump body is fixed to a vacuum chamber of an external device, and the control device is installed at a location away from the vacuum chamber (see, for example, Patent Document 1). The control device and the electric motor provided in the casing of the pump main body are electrically connected via a terminal member (hermetic seal connector) provided in the opening of the casing of the pump main body. The terminal member has a sealing component (hermetic seal) that seals the opening of the casing of the pump body, and a terminal pin that penetrates the sealing component.

特開２００６−２５００３３号公報JP 2006-250033 A

特許文献１に記載の真空ポンプでは、端子ピンの熱が、封止部品を介してポンプ本体に伝わる構成とされている。しかしながら、封止部品には、通常、金属に比べて熱伝導率の低いガラスが用いられているため、ガラスを貫通する端子ピンの熱が放熱されにくいという問題があった。   The vacuum pump described in Patent Document 1 is configured such that the heat of the terminal pin is transmitted to the pump body via the sealing component. However, since glass having a lower thermal conductivity than that of metal is usually used for the sealing component, there is a problem in that the heat of the terminal pins penetrating the glass is hardly radiated.

本発明の好ましい実施形態による真空ポンプは、ポンプ本体と、ポンプ本体を制御する制御装置と、制御装置に接続される配線パターンが形成されているプリント基板と、ポンプ本体の開口部を封止する封止部品、および封止部品を貫通し、配線パターンに接続される端子ピンを有する端子部材とを備え、ポンプ本体の開口部の周縁と、プリント基板におけるポンプ本体と対向する面とが熱伝導可能に接続されている。
さらに好ましい実施形態では、封止部品は、絶縁性を有する封止部と、封止部を保持する保持部とを有し、端子ピンは、封止部を貫通している。
さらに好ましい実施形態では、ポンプ本体の開口部の周縁と、プリント基板におけるポンプ本体と対向する面との間に熱伝導部材が設けられ、ポンプ本体の開口部の周縁と、プリント基板におけるポンプ本体と対向する面とが熱伝導部材を介して熱伝導可能に接続されている。
さらに好ましい実施形態では、熱伝導部材は、シール部材を介してポンプ本体に着脱自在に取り付けられるアダプタであり、封止部品は、ポンプ本体には固着されずにアダプタに固着され、封止部品、アダプタおよびシール部材により、ポンプ本体の開口部が封止されている。
さらに好ましい実施形態では、ポンプ本体の開口部の周縁と、プリント基板におけるポンプ本体と対向する面とが直接接している。 A vacuum pump according to a preferred embodiment of the present invention seals a pump body, a control device that controls the pump body, a printed circuit board on which a wiring pattern connected to the control device is formed, and an opening of the pump body. A sealing member and a terminal member having a terminal pin that penetrates the sealing component and is connected to the wiring pattern, and heat conduction between the peripheral edge of the opening of the pump body and the surface of the printed circuit board facing the pump body Connected as possible.
In a more preferred embodiment, the sealing component has an insulating sealing portion and a holding portion that holds the sealing portion, and the terminal pin penetrates the sealing portion.
In a further preferred embodiment, a heat conducting member is provided between the periphery of the opening of the pump body and the surface of the printed circuit board facing the pump body, and the periphery of the opening of the pump body, the pump body of the printed circuit board, The opposing surfaces are connected via a heat conducting member so as to be capable of conducting heat.
In a further preferred embodiment, the heat conducting member is an adapter that is detachably attached to the pump main body via a seal member, and the sealing component is fixed to the adapter without being fixed to the pump main body. The opening of the pump body is sealed by the adapter and the seal member.
In a more preferred embodiment, the peripheral edge of the opening of the pump body is in direct contact with the surface of the printed board facing the pump body.

本発明によれば、ポンプ本体を制御する制御装置に接続される端子ピンの熱を効果的に放熱できる。   ADVANTAGE OF THE INVENTION According to this invention, the heat | fever of the terminal pin connected to the control apparatus which controls a pump main body can be thermally radiated effectively.

第１の実施の形態に係るターボ分子ポンプを示す図。The figure which shows the turbo-molecular pump which concerns on 1st Embodiment. 制御装置が取り外された状態のポンプ本体のベース部を示す斜視図。The perspective view which shows the base part of the pump main body of the state from which the control apparatus was removed. ベース部および制御装置の断面模式図。The cross-sectional schematic diagram of a base part and a control apparatus. 端子部材を示す拡大断面模式図。The expanded cross-sectional schematic diagram which shows a terminal member. 第２の実施の形態に係るターボ分子ポンプにおける端子部材を示す拡大断面模式図。The expanded cross-section schematic diagram which shows the terminal member in the turbo-molecular pump which concerns on 2nd Embodiment.

以下、図面を参照して、本発明に係る真空ポンプの一実施の形態について説明する。
−第１の実施の形態−
図１は、本発明による真空ポンプの一例であるターボ分子ポンプ１を示す図である。ターボ分子ポンプ１はポンプ本体２と、ポンプ本体２を駆動制御する制御装置３とを備え、制御装置３はポンプ本体２のベース部４に固定されている。ポンプ本体２に設けられた吸気口フランジ５を半導体製造装置や液晶パネル製造装置、分析装置等の外部装置７の真空チャンバに固定することにより、ターボ分子ポンプ１が外部装置７に取り付けられる。ポンプ本体２の排気ポート６にはバックポンプが接続される。 Hereinafter, an embodiment of a vacuum pump according to the present invention will be described with reference to the drawings.
-First embodiment-
FIG. 1 is a view showing a turbo molecular pump 1 which is an example of a vacuum pump according to the present invention. The turbo molecular pump 1 includes a pump body 2 and a control device 3 that drives and controls the pump body 2, and the control device 3 is fixed to a base portion 4 of the pump body 2. The turbo molecular pump 1 is attached to the external device 7 by fixing the inlet flange 5 provided in the pump body 2 to a vacuum chamber of the external device 7 such as a semiconductor manufacturing apparatus, a liquid crystal panel manufacturing apparatus, or an analysis apparatus. A back pump is connected to the exhaust port 6 of the pump body 2.

図２は制御装置３が取り外された状態のポンプ本体２のベース部４を示す斜視図であり、図３はベース部４および制御装置３の断面模式図である。図２に示すように、ポンプ本体２の下側の筐体を構成するベース部４は略円筒形状であり、外周面より外方に突出する固定部４６が形成されている。固定部４６は、矩形状の平面部４７を有し、平面部４７の外周に沿って溝が設けられ、溝に水密用のシール部材３６が配置されている。   FIG. 2 is a perspective view showing the base portion 4 of the pump body 2 with the control device 3 removed, and FIG. 3 is a schematic sectional view of the base portion 4 and the control device 3. As shown in FIG. 2, the base part 4 which comprises the housing | casing of the lower side of the pump main body 2 is a substantially cylindrical shape, and the fixing | fixed part 46 which protrudes outward from an outer peripheral surface is formed. The fixing portion 46 has a rectangular flat portion 47, a groove is provided along the outer periphery of the flat portion 47, and a watertight seal member 36 is disposed in the groove.

図３に示すように、ケーシング３５は、略矩形箱状であり、矩形開口の周縁にフランジ３８が設けられている。フランジ３８は、ベース部４の平面部４７にボルト３７で固定され、ケーシング３５の内面とベース部４の外面とで略直方体形状の内部空間が画成されている。制御装置３の内部空間には、制御用プリント基板３３および電力供給用プリント基板３４が配設されている。フランジ３８とベース部４の平面部４７との間には、水密用のシール部材３６が配設されているため、外部から制御装置３内に水分が浸入することが防止される。   As shown in FIG. 3, the casing 35 has a substantially rectangular box shape, and a flange 38 is provided on the periphery of the rectangular opening. The flange 38 is fixed to the flat portion 47 of the base portion 4 with bolts 37, and a substantially rectangular parallelepiped internal space is defined by the inner surface of the casing 35 and the outer surface of the base portion 4. A control printed circuit board 33 and a power supply printed circuit board 34 are disposed in the internal space of the control device 3. Since the water-tight seal member 36 is disposed between the flange 38 and the flat portion 47 of the base portion 4, moisture can be prevented from entering the control device 3 from the outside.

図３に示すように、平面部４７の中央には円形開口部４８が設けられている。円形開口部４８は、ベース部４の内部空間と、制御装置３の内部空間とを連通する円形状の貫通孔である。円形開口部４８は、端子部材１０の封止部品（ハーメチックシール）１１０によって封止されている。   As shown in FIG. 3, a circular opening 48 is provided in the center of the flat portion 47. The circular opening 48 is a circular through-hole that communicates the internal space of the base portion 4 and the internal space of the control device 3. The circular opening 48 is sealed by a sealing component (hermetic seal) 110 of the terminal member 10.

図４は、端子部材１０を示す拡大断面模式図であり、図３のＡ部を拡大した図である。図４に示すように、端子部材１０は、封止部品１１０と複数の端子ピン１１１とを有する。封止部品１１０は、ガラス封止部１１４と保持板１１６とを有している。   FIG. 4 is an enlarged schematic cross-sectional view showing the terminal member 10, and is an enlarged view of a portion A in FIG. As shown in FIG. 4, the terminal member 10 includes a sealing component 110 and a plurality of terminal pins 111. The sealing component 110 has a glass sealing portion 114 and a holding plate 116.

保持板１１６は、円板部１１６ａと、円板部１１６ａの外縁から略９０度屈曲し、ベース部４の内部空間に向かって延在する円筒部１１６ｂとを有している。円筒部１１６ｂの外径は、円形開口部４８の内径とほぼ同じ大きさに形成されている。円板部１１６ａには、円形の開口部（以下、円形開口部１１６ｈと記す）が形成され、円形開口部１１６ｈはガラス封止部１１４によって封止されている。複数の端子ピン１１１は、それぞれガラス封止部１１４を貫通するように設けられている。   The holding plate 116 includes a disc portion 116 a and a cylindrical portion 116 b that is bent approximately 90 degrees from the outer edge of the disc portion 116 a and extends toward the internal space of the base portion 4. The outer diameter of the cylindrical portion 116 b is formed to be approximately the same as the inner diameter of the circular opening 48. A circular opening (hereinafter, referred to as a circular opening 116h) is formed in the disk part 116a, and the circular opening 116h is sealed by a glass sealing part 114. Each of the plurality of terminal pins 111 is provided so as to penetrate the glass sealing portion 114.

端子部材１０は、保持板１１６の円形開口部１１６ｈに複数の端子ピン１１１を挿通した状態で、各端子ピン１１１の外周面と円形開口部１１６ｈの内周面との間の空間を、絶縁性を有するガラスで充填することで形成されている。ガラス封止部１１４は保持板１１６によって保持され、ガラス封止部１１４は各端子ピン１１１を保持している。なお、ガラス封止部１１４の熱伝導率は、約１Ｗ／ｍ・Ｋである。   The terminal member 10 insulates the space between the outer peripheral surface of each terminal pin 111 and the inner peripheral surface of the circular opening 116h in a state where the plurality of terminal pins 111 are inserted into the circular opening 116h of the holding plate 116. It is formed by filling with glass having. The glass sealing portion 114 is held by a holding plate 116, and the glass sealing portion 114 holds each terminal pin 111. Note that the thermal conductivity of the glass sealing portion 114 is about 1 W / m · K.

円筒部１１６ｂは、円形開口部４８の内壁に嵌入され、円板部１１６ａの外縁部が全周に亘ってはんだ付けされ、はんだ１３０によって封止部品１１０と円形開口部４８との隙間が封止されている。このように、端子部材１０が、円形開口部４８に嵌入され、はんだ付けにより円形開口部４８の内壁に固着されることで、真空となるベース部４の内部空間の気密性が確保される。   The cylindrical portion 116 b is fitted into the inner wall of the circular opening 48, the outer edge of the disk portion 116 a is soldered over the entire circumference, and the gap between the sealing component 110 and the circular opening 48 is sealed by the solder 130. Has been. As described above, the terminal member 10 is fitted into the circular opening 48 and fixed to the inner wall of the circular opening 48 by soldering, thereby ensuring the airtightness of the internal space of the base portion 4 that is evacuated.

制御装置３からポンプ本体２内の電動機（不図示）への電力の供給や、ポンプ本体２内の各種センサ（不図示）から制御装置３へのセンサ信号の供給は、端子部材１０の複数の端子ピン１１１を介して行われる。端子部材１０の各端子ピン１１１は、配線用プリント基板１１７のスルーホールに挿入され、はんだ付けされている。   Supply of electric power from the control device 3 to an electric motor (not shown) in the pump body 2 and supply of sensor signals from various sensors (not shown) in the pump body 2 to the control device 3 are performed by a plurality of terminal members 10. This is done via the terminal pin 111. Each terminal pin 111 of the terminal member 10 is inserted into a through hole of the printed circuit board 117 for wiring and soldered.

複数の端子ピン１１１のうち、ポンプ本体２内の電動機（不図示）に接続される端子ピン１１１は配線用プリント基板１１７の所定の配線パターン１１７ｃに電気的に接続され、この配線パターン１１７ｃはハーネス３２を介して電力供給用プリント基板３４に電気的に接続されている（図３参照）。複数の端子ピン１１１のうち、ポンプ本体２内の各種センサ（不図示）に接続される端子ピン１１１は配線用プリント基板１１７の所定の配線パターン１１７ｃに電気的に接続され、この配線パターン１１７ｃはハーネス３１を介して制御用プリント基板３３に接続されている。なお、図示しないが、電力供給用プリント基板３４と制御用プリント基板３３とは、電気的に接続されている。   Among the plurality of terminal pins 111, the terminal pin 111 connected to the electric motor (not shown) in the pump body 2 is electrically connected to a predetermined wiring pattern 117c of the printed circuit board 117 for wiring, and this wiring pattern 117c is a harness. It is electrically connected to the printed circuit board 34 for power supply via 32 (see FIG. 3). Among the plurality of terminal pins 111, the terminal pins 111 connected to various sensors (not shown) in the pump body 2 are electrically connected to a predetermined wiring pattern 117c of the printed circuit board 117 for wiring, and the wiring pattern 117c is It is connected to the control printed circuit board 33 via the harness 31. Although not shown, the power supply printed circuit board 34 and the control printed circuit board 33 are electrically connected.

電力供給用プリント基板３４は、コンバータ回路やインバータ／モータドライブ回路等から構成される電力系回路を備えている。制御用プリント基板３３には、各種センサ信号に基づいて電力供給用プリント基板３４の電力系回路の制御を行う。   The power supply printed circuit board 34 includes a power system circuit including a converter circuit, an inverter / motor drive circuit, and the like. The control printed circuit board 33 controls the power system circuit of the power supply printed circuit board 34 based on various sensor signals.

図４に示すように、配線用プリント基板１１７は絶縁性を有する絶縁層１１７ｅ内に配線パターン１１７ｃが形成された構成であり、複数の配線パターン１１７ｃがそれぞれ接続ランド１１７ｄを介して端子ピン１１１やハーネス３１，３２（図３参照）と電気的に接続される。本実施の形態では、熱伝導率が約０．５Ｗ／ｍ・Ｋのエポキシ樹脂により絶縁層１１７ｅが形成され、熱伝導率が約４００Ｗ／ｍ・Ｋの銅により配線パターン１１７ｃが形成されている。   As shown in FIG. 4, the printed circuit board 117 for wiring has a configuration in which a wiring pattern 117c is formed in an insulating layer 117e having an insulating property, and a plurality of wiring patterns 117c are respectively connected to terminal pins 111 and 111 via connection lands 117d. Electrically connected to the harnesses 31 and 32 (see FIG. 3). In this embodiment, the insulating layer 117e is formed of an epoxy resin having a thermal conductivity of about 0.5 W / m · K, and the wiring pattern 117c is formed of copper having a thermal conductivity of about 400 W / m · K. .

略平板状の配線用プリント基板１１７は、平面部４７と平行に配置され、平面部４７に対向する平坦な面（以下、裏面１１７ａと記す）が、円形開口部４８の開口周縁部、すなわち円形開口部４８の開口縁から径方向外方に広がる平面部４７の表面に、熱伝導可能に接続されている。本実施の形態では、配線用プリント基板１１７は、ねじ止めによってベース部４に固着され、配線用プリント基板１１７の裏面１１７ａが円形開口部４８の開口周縁部に直接接している。   The substantially flat printed circuit board 117 for wiring is arranged in parallel with the flat portion 47, and a flat surface (hereinafter referred to as a back surface 117 a) facing the flat portion 47 is an opening peripheral edge of the circular opening 48, that is, a circular shape. It is connected to the surface of the flat portion 47 extending radially outward from the opening edge of the opening portion 48 so as to be capable of conducting heat. In the present embodiment, the printed circuit board 117 for wiring is fixed to the base portion 4 by screwing, and the back surface 117 a of the printed circuit board 117 for wiring is in direct contact with the opening peripheral edge of the circular opening 48.

図４では、端子ピン１１１からの熱の移動を破線の矢印で模式的に表している。本実施の形態では、端子ピン１１１からの熱をポンプ本体２に伝える２種類の熱伝導経路を有している。第１の熱伝導経路は、端子ピン１１１→ガラス封止部１１４→保持板１１６→ポンプ本体２であり、第２の熱伝導経路は、端子ピン１１１→配線用プリント基板１１７→ポンプ本体２である。第２の熱伝導経路では、配線用プリント基板１１７の中でも、特に熱伝導率の高い配線パターン１１７ｃを通って、端子ピン１１１の熱がポンプ本体２へと放熱される。   In FIG. 4, the movement of heat from the terminal pin 111 is schematically represented by a dashed arrow. In the present embodiment, there are two types of heat conduction paths for transferring heat from the terminal pins 111 to the pump body 2. The first heat conduction path is the terminal pin 111 → the glass sealing portion 114 → the holding plate 116 → the pump main body 2, and the second heat conduction path is the terminal pin 111 → the printed circuit board 117 for wiring → the pump main body 2. is there. In the second heat conduction path, the heat of the terminal pin 111 is radiated to the pump body 2 through the wiring pattern 117 c having a particularly high thermal conductivity in the printed circuit board 117 for wiring.

上述した第１の実施の形態によれば、次の作用効果が得られる。
（１）ポンプ本体２の円形開口部４８の開口周縁部と、配線用プリント基板１１７におけるポンプ本体２と対向する面である配線用プリント基板１１７の裏面１１７ａとが熱伝導可能に接続されている。これにより、制御装置３に電気的に接続される端子ピン１１１の熱を、配線用プリント基板１１７を介してポンプ本体２のベース部４に伝達させ、ポンプ本体２から外気に放熱させることができる。 According to the first embodiment described above, the following operational effects are obtained.
(1) The peripheral edge of the circular opening 48 of the pump body 2 and the back surface 117a of the printed circuit board 117 for wiring, which is the surface of the printed circuit board 117 facing the pump body 2, are connected so as to be capable of conducting heat. . Thereby, the heat of the terminal pin 111 electrically connected to the control device 3 can be transmitted to the base portion 4 of the pump body 2 via the printed circuit board 117 for wiring, and can be radiated from the pump body 2 to the outside air. .

このように、本実施の形態では、封止部品１１０を含む第１の熱伝導経路の他に、封止部品１１０を含まずに、配線用プリント基板１１７を含む第２の熱伝導経路を形成した。このため、配線用プリント基板１１７を含む第２の熱伝導経路が形成されない場合に比べて、放熱性を向上させることができる。   Thus, in the present embodiment, in addition to the first heat conduction path including the sealing component 110, the second heat conduction path including the printed circuit board 117 for wiring is formed without including the sealing component 110. did. For this reason, compared with the case where the 2nd heat conduction path containing the printed circuit board 117 for wiring is not formed, heat dissipation can be improved.

ここで、端子ピン１１１の定格電流は、発熱量が大きい電力供給用の端子ピン１１１の温度上昇の特性に基づいて設定される。本実施の形態によれば、端子ピン１１１の熱を効果的に放熱し、端子ピン１１１の温度を効果的に抑制できるので、端子ピン１１１の定格電流を大きく設定することができる。   Here, the rated current of the terminal pin 111 is set based on the temperature rise characteristic of the power supply terminal pin 111 that generates a large amount of heat. According to the present embodiment, since the heat of the terminal pin 111 can be effectively radiated and the temperature of the terminal pin 111 can be effectively suppressed, the rated current of the terminal pin 111 can be set large.

なお、特許文献１の図２に示される構成では、ハーメチックシールコネクタのピンの熱が、インシュレータ部→インシュレータ部を保持するコネクタ部→ポンプ本体のベース部の順で伝達される。つまり、特許文献１に記載の技術（以下、従来技術と記す）では、封止部品を含む熱伝導経路しか存在しないため、ピンの温度上昇を効果的に抑制することが難しい。   In the configuration shown in FIG. 2 of Patent Document 1, the heat of the pins of the hermetic seal connector is transmitted in the order of the insulator part → the connector part holding the insulator part → the base part of the pump body. That is, in the technique described in Patent Document 1 (hereinafter referred to as the conventional technique), there is only a heat conduction path including the sealing component, and thus it is difficult to effectively suppress the temperature rise of the pin.

また、特許文献１の図６に示される構成では、封止部品を含む熱伝導経路とは別に、ハーメチックシールコネクタの端子ピンの熱が、配線用プリント基板→制御装置のケーシング→ボルトおよびカラー→ポンプ本体のベース部の順で伝達される熱伝導経路が開示されている。しかしながら、特許文献１の図６の構成は、外側から配線用プリント基板にアクセスできるようにするための構成であるので、ピンの発熱を効果的に放熱させることが難しい。具体的には、従来技術では、ボルトおよびカラーをハーメチックシールコネクタが装着される開口から離れた位置に配置させているので、端子ピンからポンプ本体のベース部までの熱伝導経路が本実施の形態の第２の熱伝導経路に比べて長い。また、従来技術では、端子ピンからポンプ本体のベース部に至る熱伝導経路を構成する部材の数が、本実施の形態の第２の熱伝導経路を構成する部材の数よりも多く、部材間の界面が多数存在しているので、端子ピンからポンプ本体までの熱抵抗が本実施の形態に比べて大きい。   Further, in the configuration shown in FIG. 6 of Patent Document 1, the heat of the terminal pin of the hermetic seal connector is separated from the printed circuit board for wiring → the casing of the control device → bolt and collar → A heat conduction path that is transmitted in the order of the base portion of the pump body is disclosed. However, since the configuration of FIG. 6 in Patent Document 1 is a configuration for enabling access to the printed circuit board for wiring from the outside, it is difficult to effectively dissipate the heat generated by the pins. Specifically, in the prior art, since the bolt and the collar are arranged at a position away from the opening where the hermetic seal connector is mounted, the heat conduction path from the terminal pin to the base portion of the pump body is the present embodiment. This is longer than the second heat conduction path. In the prior art, the number of members constituting the heat conduction path from the terminal pin to the base portion of the pump body is larger than the number of members constituting the second heat conduction path of the present embodiment, Therefore, the thermal resistance from the terminal pin to the pump body is larger than that of the present embodiment.

これに対して、本実施の形態では、配線用プリント基板１１７とポンプ本体２のベース部４とが、制御装置３のケーシング３５を介さずに、直接接する構成である。すなわち、各端子ピン１１１の熱が、配線用プリント基板１１７→ポンプ本体２のベース部４の順で伝わるように、第２の熱伝導経路が形成されている。第２の熱伝導経路は、その経路の長さが短く、かつ、熱伝導経路を構成する部材の数も少ないので、効果的に端子ピン１１１の熱をポンプ本体２のベース部４に伝えることができる。   On the other hand, in the present embodiment, the printed circuit board 117 for wiring and the base portion 4 of the pump body 2 are in direct contact with each other without the casing 35 of the control device 3 interposed therebetween. That is, the second heat conduction path is formed so that the heat of each terminal pin 111 is transmitted in the order of the printed circuit board 117 for wiring → the base portion 4 of the pump body 2. Since the length of the second heat conduction path is short and the number of members constituting the heat conduction path is small, the heat of the terminal pin 111 is effectively transmitted to the base portion 4 of the pump body 2. Can do.

なお、特許文献１の図６に示される構成では、ハーメチックシールコネクタの端子ピンの熱が配線用プリント基板を介して制御装置のケーシングに伝達され、ケーシングに伝わった熱の一部が外気に放熱される。しかしながら、制御装置のケーシングは、ポンプ本体に比べて、熱容量が小さいという問題がある。   In the configuration shown in FIG. 6 of Patent Document 1, the heat of the terminal pin of the hermetic seal connector is transmitted to the casing of the control device via the printed circuit board for wiring, and a part of the heat transmitted to the casing is dissipated to the outside air. Is done. However, there is a problem that the casing of the control device has a smaller heat capacity than the pump body.

これに対して、本実施の形態では、主に、熱容量が大きいポンプ本体２で端子ピン１１１の熱を放熱する構成である。したがって、本実施の形態によれば、端子ピン１１１の熱を熱容量の大きいポンプ本体２によって効果的に放熱することができる。   On the other hand, in this Embodiment, it is the structure which mainly radiates the heat | fever of the terminal pin 111 with the pump main body 2 with a large heat capacity. Therefore, according to the present embodiment, the heat of the terminal pin 111 can be effectively radiated by the pump body 2 having a large heat capacity.

（２）各端子ピン１１１を、配線用プリント基板１１７を介して、制御用プリント基板３３や電力供給用プリント基板３４に接続するようにした。これにより、各端子ピン１１１をハーネスで制御用プリント基板３３や電力供給用プリント基板３４に接続する場合に比べて、配線の自由度を向上させることができる。 (2) Each terminal pin 111 is connected to the control printed circuit board 33 and the power supply printed circuit board 34 via the wiring printed circuit board 117. Thereby, the freedom degree of wiring can be improved compared with the case where each terminal pin 111 is connected to the printed circuit board 33 for control and the printed circuit board 34 for electric power supply with a harness.

（３）封止部品１１０をはんだ付けにより、直接、ポンプ本体２に取り付ける構成とした。これにより、封止部品１１０をボルトなどでポンプ本体２に取り付けるためのコネクタ機構を設ける場合に比べて、部品点数および部品コストを低減できる。 (3) The sealing component 110 is directly attached to the pump body 2 by soldering. Thereby, compared with the case where the connector mechanism for attaching the sealing component 110 to the pump main body 2 with a volt | bolt etc. is provided, a number of parts and component cost can be reduced.

（４）配線用プリント基板１１７を利用して、第２の熱伝導経路を構成することができるため、配線用プリント基板１１７とは別に、第２の熱伝導経路を構成するための専用の熱伝導部材を新たに設ける必要がない。 (4) Since the second heat conduction path can be configured using the printed circuit board 117 for wiring, a dedicated heat for configuring the second heat conduction path separately from the printed circuit board 117 for wiring. There is no need to newly provide a conductive member.

−第２の実施の形態−
図５を参照して、第２の実施の形態に係る真空ポンプを説明する。なお、図中、第１の実施の形態と同一もしくは相当部分には同一の参照番号を付し、相違点を主に説明する。図５は、図４と同様の図であり、第２の実施の形態に係るターボ分子ポンプにおける端子部材を示す拡大断面模式図である。 -Second Embodiment-
A vacuum pump according to the second embodiment will be described with reference to FIG. In the figure, the same reference numerals are assigned to the same or corresponding parts as those in the first embodiment, and the differences will be mainly described. FIG. 5 is a view similar to FIG. 4 and is an enlarged schematic cross-sectional view showing a terminal member in a turbo molecular pump according to the second embodiment.

第１の実施の形態では、配線用プリント基板１１７の裏面１１７ａと、ポンプ本体２のベース部４の円形開口部２４８の開口周縁部とが直接接触する構成とされていた。これに対して、第２の実施の形態では、ポンプ本体２の円形開口部２４８の開口周縁部と、配線用プリント基板１１７の裏面１１７ａとの間にアダプタ２２０が設けられ、配線用プリント基板１１７とポンプ本体２とがアダプタ２２０を介して熱伝導可能に接続されている。   In the first embodiment, the back surface 117a of the printed circuit board 117 for wiring and the opening peripheral edge of the circular opening 248 of the base portion 4 of the pump body 2 are in direct contact with each other. On the other hand, in the second embodiment, an adapter 220 is provided between the peripheral edge of the circular opening 248 of the pump body 2 and the back surface 117a of the printed circuit board 117 for wiring, and the printed circuit board 117 for wiring. And the pump body 2 are connected to each other through an adapter 220 so as to be able to conduct heat.

第２の実施の形態では、円形開口部２４８の内径が、封止部品１１０の保持板１１６における円筒部１１６ｂの外径よりも大きく形成されている。アダプタ２２０は、熱伝導率が３０〜５０Ｗ／ｍ・Ｋ程度の鉄合金により形成され、平板部２２１と、平板部２２１から円形開口部２４８に向かって突出する円筒部２２２とを有している。   In the second embodiment, the inner diameter of the circular opening 248 is formed larger than the outer diameter of the cylindrical portion 116 b in the holding plate 116 of the sealing component 110. The adapter 220 is formed of an iron alloy having a thermal conductivity of about 30 to 50 W / m · K, and includes a flat plate portion 221 and a cylindrical portion 222 that protrudes from the flat plate portion 221 toward the circular opening 248. .

アダプタ２２０の平板部２２１には、円形開口部２４８の内径よりも小さい内径ｄａ１を有する円形状の貫通孔２２３が設けられている。アダプタ２２０の円筒部２２２は、貫通孔２２３の内径ｄａ１よりも大きい内径ｄａ２を有している。アダプタ２２０の円筒部２２２の内径ｄａ２は、保持板１１６の円筒部１１６ｂの外径とほぼ同じ大きさに形成されている。   The flat plate portion 221 of the adapter 220 is provided with a circular through hole 223 having an inner diameter da1 smaller than the inner diameter of the circular opening 248. The cylindrical portion 222 of the adapter 220 has an inner diameter da2 that is larger than the inner diameter da1 of the through hole 223. The inner diameter da2 of the cylindrical portion 222 of the adapter 220 is formed to be approximately the same size as the outer diameter of the cylindrical portion 116b of the holding plate 116.

保持板１１６の円筒部１１６ｂは、アダプタ２２０の円筒部２２２の内壁に嵌入され、保持板１１６の円板部１１６ａがアダプタ２２０の貫通孔２２３の開口周縁部に当接されている。保持板１１６の円筒部１１６ｂの先端と、アダプタ２２０の円筒部２２２の先端とは、全周に亘ってはんだ付けされ、はんだ２３０によってアダプタ２２０と封止部品１１０との隙間が封止されている。   The cylindrical portion 116 b of the holding plate 116 is fitted into the inner wall of the cylindrical portion 222 of the adapter 220, and the disc portion 116 a of the holding plate 116 is in contact with the opening peripheral edge portion of the through hole 223 of the adapter 220. The tip of the cylindrical portion 116 b of the holding plate 116 and the tip of the cylindrical portion 222 of the adapter 220 are soldered over the entire circumference, and the gap between the adapter 220 and the sealing component 110 is sealed by the solder 230. .

配線用プリント基板１１７の裏面１１７ａは、アダプタ２２０の平板部２２１の表面に接し、接着剤やねじ止めによってアダプタ２２０の平板部２２１に固着されている。   The back surface 117a of the printed circuit board 117 for wiring is in contact with the surface of the flat plate portion 221 of the adapter 220, and is fixed to the flat plate portion 221 of the adapter 220 with an adhesive or a screw.

アダプタ２２０と端子部材１０、ならびに、配線用プリント基板１１７とアダプタ２２０のそれぞれが固着されることで、これらの部材が一体構造体とされている。   The adapter 220 and the terminal member 10, and the printed circuit board 117 for wiring and the adapter 220 are fixed to each other, so that these members are integrated.

アダプタ２２０の円筒部２２２の外径ｄａ３は、円形開口部２４８の内径とほぼ同じ大きさに形成されている。アダプタ２２０の円筒部２２２は、円形開口部２４８の内壁に嵌入され、円筒部２２２の外周面が円形開口部２４８の内壁に接触している。   The outer diameter da3 of the cylindrical portion 222 of the adapter 220 is formed to be approximately the same size as the inner diameter of the circular opening 248. The cylindrical portion 222 of the adapter 220 is fitted into the inner wall of the circular opening 248, and the outer peripheral surface of the cylindrical portion 222 is in contact with the inner wall of the circular opening 248.

アダプタ２２０の平板部２２１は、ベース部４に設けられた固定部４６の平面部２４７と平行に配置されている。アダプタ２２０の平板部２２１は、平面部２４７に対向する平坦な面（以下、裏面２２１ａと記す）が、円形開口部２４８の開口周縁部における、後述のシール部材２３９の外側の領域に当接されている。   The flat plate portion 221 of the adapter 220 is arranged in parallel with the flat surface portion 247 of the fixing portion 46 provided on the base portion 4. The flat surface portion 221 of the adapter 220 has a flat surface (hereinafter referred to as a back surface 221a) facing the flat surface portion 247 abutted with a region outside a seal member 239 described later at the opening peripheral edge of the circular opening portion 248. ing.

アダプタ２２０は、ボルト２５０により、着脱自在にベース部４の平面部２４７に取り付けられている。ベース部４の平面部２４７における円形開口部２４８の開口周縁部には、円形開口部２４８の開口に沿って溝２４７ｂが設けられ、溝２４７ｂに気密用のシール部材２３９が配置されている。アダプタ２２０とベース部４との間に気密用のシール部材２３９が配設されることで、アダプタ２２０とベース部４との隙間が封止され、真空となるベース部４の内部の気密性が確保されている。   The adapter 220 is detachably attached to the flat surface portion 247 of the base portion 4 with bolts 250. A groove 247b is provided along the opening of the circular opening 248 in the opening peripheral portion of the circular opening 248 in the flat surface portion 247 of the base portion 4, and an airtight seal member 239 is disposed in the groove 247b. By providing an airtight seal member 239 between the adapter 220 and the base portion 4, the gap between the adapter 220 and the base portion 4 is sealed, and the airtightness inside the base portion 4 that becomes a vacuum is reduced. It is secured.

図５では、端子ピン１１１からの熱の移動を破線の矢印で模式的に表している。第２の実施の形態では、配線用プリント基板１１７の裏面１１７ａと、円形開口部２４８の開口周縁部とが、アダプタ２２０を介して熱伝導可能に接続され、端子ピン１１１→配線用プリント基板１１７（特に、熱伝導率の高い配線パターン１１７ｃ）→アダプタ２２０→ポンプ本体２の順に熱が伝わる第２の熱伝導経路が形成されている。なお、本実施の形態では、アダプタ２２０の円筒部２２２が円形開口部２４８の内壁と熱伝導可能に接続されているので、アダプタ２２０の円筒部２２２からもポンプ本体２に熱が伝わる。   In FIG. 5, the movement of heat from the terminal pin 111 is schematically represented by a dashed arrow. In the second embodiment, the back surface 117a of the printed circuit board 117 for wiring and the peripheral edge of the opening of the circular opening 248 are connected through the adapter 220 so as to be able to conduct heat, and the terminal pin 111 → the printed circuit board 117 for wiring. (In particular, a wiring pattern 117c having high thermal conductivity) → Adapter 220 → Pump main body 2 In this order, a second thermal conduction path through which heat is transmitted is formed. In the present embodiment, since the cylindrical portion 222 of the adapter 220 is connected to the inner wall of the circular opening 248 so as to be able to conduct heat, heat is also transmitted from the cylindrical portion 222 of the adapter 220 to the pump body 2.

このように、第２の実施の形態では、各端子ピン１１１の熱を、配線用プリント基板１１７からアダプタ２２０に伝達させ、アダプタ２２０からポンプ本体２のベース部４に伝達させ、ポンプ本体２から外気へ放熱させることができる。このような第２の実施の形態によれば、第１の実施の形態で説明した（１）の作用効果と同様、端子ピン１１１の温度を効果的に抑制できるので、従来技術に比べて、端子ピン１１１の定格電流を大きく設定することができる。なお、第１の実施の形態に比べて、第２の熱伝導経路を構成する部材として、アダプタ２２０が増えているが、第２の実施の形態においても、制御装置３のケーシング３５を介さずに、端子ピン１１１の熱をポンプ本体２の円形開口部４８の開口周縁部に伝える第２の熱伝導経路が構成されている。このため、第２の実施の形態によれば、従来技術に比べて、熱伝導経路を構成する部材を減らし、熱伝導経路を短くできるので、従来技術に比べて、効果的に端子ピン１１１の熱を放熱することができる。   As described above, in the second embodiment, the heat of each terminal pin 111 is transmitted from the printed circuit board 117 for wiring to the adapter 220, transmitted from the adapter 220 to the base portion 4 of the pump main body 2, and from the pump main body 2. Heat can be dissipated to the outside air. According to the second embodiment, since the temperature of the terminal pin 111 can be effectively suppressed as in the effect (1) described in the first embodiment, compared to the prior art, The rated current of the terminal pin 111 can be set large. In addition, compared with 1st Embodiment, although the adapter 220 is increasing as a member which comprises a 2nd heat conduction path | route, it does not go through the casing 35 of the control apparatus 3 also in 2nd Embodiment. In addition, a second heat conduction path is configured to transmit the heat of the terminal pin 111 to the opening peripheral edge of the circular opening 48 of the pump body 2. For this reason, according to the second embodiment, the number of members constituting the heat conduction path can be reduced and the heat conduction path can be shortened as compared with the conventional technique. Heat can be dissipated.

第２の実施の形態によれば、第１の実施の形態で説明した（１）および（２）の作用効果に加え、次のような作用効果を奏する。
（５）アダプタ２２０はシール部材２３９を介してポンプ本体２のベース部４に着脱自在に取り付けられ、封止部品１１０はポンプ本体２には固着されずにアダプタ２２０に固着されて一体とされ、封止部品１１０、アダプタ２２０およびシール部材２３９により、ポンプ本体２の円形開口部２４８が封止されている。 According to the second embodiment, in addition to the functions and effects (1) and (2) described in the first embodiment, the following functions and effects are achieved.
(5) The adapter 220 is detachably attached to the base portion 4 of the pump main body 2 through the seal member 239, and the sealing component 110 is fixed to the adapter 220 without being fixed to the pump main body 2, and is integrated. The circular opening 248 of the pump body 2 is sealed by the sealing component 110, the adapter 220, and the seal member 239.

このため、端子部材１０の交換作業を容易に行うことができる。端子部材１０は、各端子ピン１１１とベース部４の内部に配設される電動機（不図示）とを電気的に接続するハーネスを切断し、ボルト２５０を外すことでアダプタ２２０付きの端子部材１０を取り外すことができる。新たにアダプタ２２０付きの端子部材１０を取り付けるときは、ボルト２５０によりアダプタ２２０をベース部４に取り付けた後、各端子ピン１１１とベース部４の内部に配設される電動機（不図示）とをハーネスにより接続する。   For this reason, the exchange operation of the terminal member 10 can be performed easily. The terminal member 10 is a terminal member 10 with an adapter 220 by cutting a harness that electrically connects each terminal pin 111 and an electric motor (not shown) disposed inside the base portion 4 and removing a bolt 250. Can be removed. When the terminal member 10 with the adapter 220 is newly attached, after the adapter 220 is attached to the base portion 4 by the bolt 250, each terminal pin 111 and an electric motor (not shown) disposed inside the base portion 4 are attached. Connect with harness.

第１の実施の形態では、保持板１１６が円形開口部４８にはんだ付けされているため、第２の実施の形態に比べて端子部材１０の取付け／取外し作業に手間がかかる。これに対して、第２の実施の形態では、ボルト２５０を取付け／取り外すことで、アダプタ２２０付きの端子部材１０を取付け／取り外すことができ、端子部材１０の交換作業にかかる工数を短縮できる。   In the first embodiment, since the holding plate 116 is soldered to the circular opening 48, it takes time to attach / remove the terminal member 10 as compared with the second embodiment. On the other hand, in 2nd Embodiment, the terminal member 10 with the adapter 220 can be attached / detached by attaching / detaching the bolt 250, and the man-hour concerning the replacement | exchange operation | work of the terminal member 10 can be shortened.

次のような変形も本発明の範囲内であり、変形例の一つ、もしくは複数を上述の実施形態と組み合わせることも可能である。
（変形例１）
上述した実施の形態では、絶縁性を有する封止部として、ガラスを採用した例（ガラス封止部１１４）について説明したが、本発明はこれに限定されない。封止部は絶縁性を有する部材であればよく、たとえば、絶縁性を有するセラミックスにより封止部を形成してもよい。 The following modifications are also within the scope of the present invention, and one or a plurality of modifications can be combined with the above-described embodiment.
(Modification 1)
In the above-described embodiment, the example (glass sealing portion 114) in which glass is employed as the sealing portion having insulation has been described, but the present invention is not limited to this. The sealing part should just be a member which has insulation, for example, you may form a sealing part with the ceramic which has insulation.

（変形例２）
第１の実施の形態では、配線用プリント基板１１７をねじ止めによってベース部４に固着させ、配線用プリント基板１１７の裏面１１７ａと円形開口部４８の開口周縁部とを、直接接触させる例について説明したが本発明はこれに限定されない。たとえば、配線用プリント基板１１７を接着剤によってベース部４に固着させてもよい。この場合、配線用プリント基板１１７の裏面１１７ａと、円形開口部４８の開口周縁部との間に接着層が介在されることになるので、接着層には熱伝導率の高いものを採用することが好ましい。 (Modification 2)
In the first embodiment, an example in which the printed circuit board 117 for wiring is fixed to the base portion 4 by screwing and the back surface 117a of the printed circuit board 117 for wiring and the opening peripheral edge of the circular opening 48 are brought into direct contact with each other will be described. However, the present invention is not limited to this. For example, the printed circuit board 117 for wiring may be fixed to the base portion 4 with an adhesive. In this case, since an adhesive layer is interposed between the back surface 117a of the printed circuit board 117 for wiring and the opening peripheral edge portion of the circular opening 48, the adhesive layer having a high thermal conductivity should be adopted. Is preferred.

（変形例３）
第１の実施の形態において、配線用プリント基板１１７の裏面１１７ａと円形開口部４８の開口周縁部との間に、柔軟な熱伝導性シートを介在させてもよい。同様に、第２の実施の形態において、配線用プリント基板１１７の裏面１１７ａとアダプタ２２０との間や、アダプタ２２０と円形開口部４８の開口周縁部との間に、柔軟な熱伝導性シートを介在させてもよい。 (Modification 3)
In the first embodiment, a flexible heat conductive sheet may be interposed between the back surface 117 a of the printed circuit board 117 for wiring and the opening peripheral edge of the circular opening 48. Similarly, in the second embodiment, a flexible thermal conductive sheet is provided between the back surface 117a of the printed circuit board 117 for wiring and the adapter 220, or between the adapter 220 and the opening peripheral edge of the circular opening 48. It may be interposed.

（変形例４）
配線用プリント基板１１７やアダプタ２２０、封止部品１１０の材料、形状は、上述したものに限定されない。なお、配線用プリント基板１１７やアダプタ２２０、封止部品１１０の材料は、熱伝導率の高いものほどよい。 (Modification 4)
The materials and shapes of the printed circuit board 117, the adapter 220, and the sealing component 110 are not limited to those described above. In addition, the material of the printed circuit board 117 for wiring, the adapter 220, and the sealing component 110 is better as the material has higher thermal conductivity.

（変形例５）
上述した実施の形態では、ポンプ本体２のベース部４の側方（図１において左方）に制御装置３を配置した構成について説明したが、本発明はこれに限定されない。ポンプ本体２のベース部４の下方（図１において下方）に制御装置３を配置してもよい。すなわち外部装置７、ポンプ本体２および制御装置３を一直線上に配置させてもよい。 (Modification 5)
In the above-described embodiment, the configuration in which the control device 3 is disposed on the side (left side in FIG. 1) of the base portion 4 of the pump body 2 has been described, but the present invention is not limited to this. The control device 3 may be disposed below the base portion 4 of the pump body 2 (downward in FIG. 1). That is, the external device 7, the pump main body 2, and the control device 3 may be arranged on a straight line.

（変形例６）
上述した実施の形態では、真空ポンプとしてターボ分子ポンプを採用した例について説明したが、本発明はこれに限定されず、種々の真空ポンプに本発明を適用することができる。たとえば、本発明は、ジーグバーンポンプやＨｏｌｗｅｃｋポンプなどのドラッグポンプのみを備えた真空ポンプにも適用することができる。 (Modification 6)
In the above-described embodiment, the example in which the turbo molecular pump is employed as the vacuum pump has been described. However, the present invention is not limited to this, and the present invention can be applied to various vacuum pumps. For example, the present invention can also be applied to a vacuum pump having only a drag pump such as a Ziegburn pump or a Holweck pump.

本発明の特徴を損なわない限り、本発明は上記実施の形態に限定されるものではなく、本発明の技術的思想の範囲内で考えられるその他の形態についても、本発明の範囲内に含まれる。   As long as the characteristics of the present invention are not impaired, the present invention is not limited to the above-described embodiments, and other forms conceivable within the scope of the technical idea of the present invention are also included in the scope of the present invention. .

１ ターボ分子ポンプ、２ ポンプ本体、３ 制御装置、４ ベース部、５ 吸気口フランジ、６ 排気ポート、７ 外部装置、１０ 端子部材、３１ ハーネス、３２ ハーネス、３３ 制御用プリント基板、３４ 電力供給用プリント基板、３５ ケーシング、３６ シール部材、３７ ボルト、３８ フランジ、４６ 固定部、４７ 平面部、４８ 円形開口部、１１０ 封止部品、１１１ 端子ピン、１１４ ガラス封止部、１１６ 保持板、１１６ａ 円板部、１１６ｂ 円筒部、１１６ｈ 円形開口部、１１７ 配線用プリント基板、１１７ａ 裏面、２２０ アダプタ、２２１ 平板部、２２１ａ 裏面、２２２ 円筒部、２２３ 貫通孔、２３９ シール部材、２４７ 平面部、２４７ｂ 溝、２４８ 円形開口部、２５０ ボルト DESCRIPTION OF SYMBOLS 1 Turbo molecular pump, 2 Pump main body, 3 Control apparatus, 4 Base part, 5 Inlet port flange, 6 Exhaust port, 7 External device, 10 Terminal member, 31 Harness, 32 Harness, 33 Control printed circuit board, 34 For power supply Printed circuit board, 35 casing, 36 sealing member, 37 bolt, 38 flange, 46 fixing part, 47 flat part, 48 circular opening, 110 sealing part, 111 terminal pin, 114 glass sealing part, 116 holding plate, 116a circle Plate portion, 116b Cylindrical portion, 116h Circular opening, 117 Printed circuit board for wiring, 117a Back surface, 220 Adapter, 221 Flat plate portion, 221a Back surface, 222 Cylindrical portion, 223 Through hole, 239 Seal member, 247 Planar portion, 247b Groove, 248 circular opening, 250 volts

Claims (5)

ポンプ本体と、
前記ポンプ本体を制御する制御装置と、
前記制御装置に接続される配線パターンが形成されているプリント基板と、
前記ポンプ本体の開口部を封止する封止部品、および前記封止部品を貫通し、前記配線パターンに接続される端子ピンを有する端子部材とを備え、
前記ポンプ本体の開口部の周縁と、前記プリント基板における前記ポンプ本体と対向する面とが熱伝導可能に接続されている真空ポンプ。 A pump body;
A control device for controlling the pump body;
A printed circuit board on which a wiring pattern connected to the control device is formed;
A sealing component that seals the opening of the pump body, and a terminal member that has a terminal pin that penetrates the sealing component and is connected to the wiring pattern;
A vacuum pump in which a peripheral edge of the opening of the pump main body and a surface of the printed board facing the pump main body are connected so as to be capable of conducting heat. 請求項１に記載の真空ポンプにおいて、
前記封止部品は、絶縁性を有する封止部と、前記封止部を保持する保持部とを有し、
前記端子ピンは、前記封止部を貫通している真空ポンプ。 The vacuum pump according to claim 1, wherein
The sealing component has an insulating sealing portion and a holding portion for holding the sealing portion,
The terminal pin is a vacuum pump penetrating the sealing portion. 請求項１または２に記載の真空ポンプにおいて、
前記ポンプ本体の開口部の周縁と、前記プリント基板における前記ポンプ本体と対向する面との間に熱伝導部材が設けられ、
前記ポンプ本体の開口部の周縁と、前記プリント基板における前記ポンプ本体と対向する面とが前記熱伝導部材を介して熱伝導可能に接続されている真空ポンプ。 The vacuum pump according to claim 1 or 2,
A heat conduction member is provided between a peripheral edge of the opening of the pump body and a surface of the printed circuit board facing the pump body;
A vacuum pump in which a peripheral edge of the opening of the pump main body and a surface of the printed circuit board facing the pump main body are connected to be able to conduct heat through the heat conducting member. 請求項３に記載の真空ポンプにおいて、
前記熱伝導部材は、シール部材を介して前記ポンプ本体に着脱自在に取り付けられるアダプタであり、
前記封止部品は、前記ポンプ本体には固着されずに前記アダプタに固着され、
前記封止部品、前記アダプタおよび前記シール部材により、前記ポンプ本体の開口部が封止されている真空ポンプ。 The vacuum pump according to claim 3,
The heat conducting member is an adapter that is detachably attached to the pump body via a seal member,
The sealing component is fixed to the adapter without being fixed to the pump body,
A vacuum pump in which an opening of the pump body is sealed by the sealing component, the adapter, and the seal member. 請求項１または２に記載の真空ポンプにおいて、
前記ポンプ本体の開口部の周縁と、前記プリント基板における前記ポンプ本体と対向する面とが直接接している真空ポンプ。 The vacuum pump according to claim 1 or 2,
A vacuum pump in which a peripheral edge of the opening of the pump body is in direct contact with a surface of the printed circuit board facing the pump body.
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