JP2010536034A5 - - Google Patents
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- Publication number
- JP2010536034A5 JP2010536034A5 JP2010519994A JP2010519994A JP2010536034A5 JP 2010536034 A5 JP2010536034 A5 JP 2010536034A5 JP 2010519994 A JP2010519994 A JP 2010519994A JP 2010519994 A JP2010519994 A JP 2010519994A JP 2010536034 A5 JP2010536034 A5 JP 2010536034A5
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- light
- points
- subsystem
- optical element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 claims description 160
- 238000001514 detection method Methods 0.000 claims description 71
- 238000005286 illumination Methods 0.000 claims description 54
- 230000007547 defect Effects 0.000 claims description 49
- 239000013307 optical fiber Substances 0.000 claims description 37
- 230000008859 change Effects 0.000 claims description 19
- 230000004044 response Effects 0.000 claims description 11
- 235000012431 wafers Nutrition 0.000 description 285
- 238000007689 inspection Methods 0.000 description 55
- 238000012545 processing Methods 0.000 description 52
- 238000000034 method Methods 0.000 description 37
- 239000004065 semiconductor Substances 0.000 description 22
- 230000035945 sensitivity Effects 0.000 description 16
- 230000005540 biological transmission Effects 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 230000009467 reduction Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000013459 approach Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000003491 array Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- 108091061129 Spx family Proteins 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/837,220 | 2007-08-10 | ||
| US11/837,220 US7746459B2 (en) | 2007-08-10 | 2007-08-10 | Systems configured to inspect a wafer |
| PCT/US2008/009571 WO2009023154A2 (en) | 2007-08-10 | 2008-08-11 | Systems configured to inspect a wafer |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014222431A Division JP6014102B2 (ja) | 2007-08-10 | 2014-10-31 | ウエハーを検査するように構成される装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010536034A JP2010536034A (ja) | 2010-11-25 |
| JP2010536034A5 true JP2010536034A5 (enExample) | 2014-05-08 |
| JP5701602B2 JP5701602B2 (ja) | 2015-04-15 |
Family
ID=40346192
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010519994A Active JP5701602B2 (ja) | 2007-08-10 | 2008-08-11 | ウエハーを検査するように構成される装置 |
| JP2014222431A Active JP6014102B2 (ja) | 2007-08-10 | 2014-10-31 | ウエハーを検査するように構成される装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014222431A Active JP6014102B2 (ja) | 2007-08-10 | 2014-10-31 | ウエハーを検査するように構成される装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7746459B2 (enExample) |
| JP (2) | JP5701602B2 (enExample) |
| WO (1) | WO2009023154A2 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8441639B2 (en) * | 2009-09-03 | 2013-05-14 | Kla-Tencor Corp. | Metrology systems and methods |
| KR101908749B1 (ko) | 2010-12-16 | 2018-10-16 | 케이엘에이-텐코 코포레이션 | 웨이퍼 검사 |
| US9279774B2 (en) * | 2011-07-12 | 2016-03-08 | Kla-Tencor Corp. | Wafer inspection |
| US9404873B2 (en) * | 2012-03-09 | 2016-08-02 | Kla-Tencor Corp. | Wafer inspection with multi-spot illumination and multiple channels |
| US9945792B2 (en) * | 2012-12-19 | 2018-04-17 | Kla-Tencor Corporation | Generating an array of spots on inclined surfaces |
| US9448343B2 (en) * | 2013-03-15 | 2016-09-20 | Kla-Tencor Corporation | Segmented mirror apparatus for imaging and method of using the same |
| EP3470924A1 (en) * | 2017-10-11 | 2019-04-17 | ASML Netherlands B.V. | Method of optimizing the position and/or size of a measurement illumination spot relative to a target on a substrate, and associated apparatus |
| US11513085B2 (en) * | 2020-02-20 | 2022-11-29 | Kla Corporation | Measurement and control of wafer tilt for x-ray based metrology |
| WO2022009297A1 (ja) * | 2020-07-07 | 2022-01-13 | 株式会社日立ハイテク | 荷電粒子線装置 |
| CN114199884B (zh) * | 2021-12-09 | 2023-06-13 | 合肥御微半导体技术有限公司 | 一种晶圆背检设备及其检测方法 |
Family Cites Families (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0731129B2 (ja) * | 1984-10-29 | 1995-04-10 | 株式会社日立製作所 | 半導体ウエハ異物検出装置 |
| US5274434A (en) * | 1990-04-02 | 1993-12-28 | Hitachi, Ltd. | Method and apparatus for inspecting foreign particles on real time basis in semiconductor mass production line |
| US5537669A (en) * | 1993-09-30 | 1996-07-16 | Kla Instruments Corporation | Inspection method and apparatus for the inspection of either random or repeating patterns |
| US6271916B1 (en) * | 1994-03-24 | 2001-08-07 | Kla-Tencor Corporation | Process and assembly for non-destructive surface inspections |
| US5805278A (en) * | 1995-02-09 | 1998-09-08 | Inspex, Inc. | Particle detection method and apparatus |
| US5798829A (en) * | 1996-03-05 | 1998-08-25 | Kla-Tencor Corporation | Single laser bright field and dark field system for detecting anomalies of a sample |
| JP3287227B2 (ja) * | 1996-08-08 | 2002-06-04 | 三菱電機株式会社 | 微小異物検出方法及びその検出装置 |
| US6956644B2 (en) * | 1997-09-19 | 2005-10-18 | Kla-Tencor Technologies Corporation | Systems and methods for a wafer inspection system using multiple angles and multiple wavelength illumination |
| US20040057045A1 (en) * | 2000-12-21 | 2004-03-25 | Mehdi Vaez-Iravani | Sample inspection system |
| US6201601B1 (en) * | 1997-09-19 | 2001-03-13 | Kla-Tencor Corporation | Sample inspection system |
| US6020957A (en) * | 1998-04-30 | 2000-02-01 | Kla-Tencor Corporation | System and method for inspecting semiconductor wafers |
| US6256093B1 (en) * | 1998-06-25 | 2001-07-03 | Applied Materials, Inc. | On-the-fly automatic defect classification for substrates using signal attributes |
| US6999183B2 (en) * | 1998-11-18 | 2006-02-14 | Kla-Tencor Corporation | Detection system for nanometer scale topographic measurements of reflective surfaces |
| US6774991B1 (en) * | 1999-05-27 | 2004-08-10 | Inspex Incorporated | Method and apparatus for inspecting a patterned semiconductor wafer |
| JP2001083080A (ja) * | 1999-09-13 | 2001-03-30 | Hitachi Ltd | 結晶欠陥計測装置 |
| US6590645B1 (en) * | 2000-05-04 | 2003-07-08 | Kla-Tencor Corporation | System and methods for classifying anomalies of sample surfaces |
| US6879390B1 (en) * | 2000-08-10 | 2005-04-12 | Kla-Tencor Technologies Corporation | Multiple beam inspection apparatus and method |
| US6538730B2 (en) * | 2001-04-06 | 2003-03-25 | Kla-Tencor Technologies Corporation | Defect detection system |
| JP3446754B2 (ja) * | 2001-12-11 | 2003-09-16 | 三菱電機株式会社 | 微小異物検出方法及びその検出装置 |
| US7130039B2 (en) * | 2002-04-18 | 2006-10-31 | Kla-Tencor Technologies Corporation | Simultaneous multi-spot inspection and imaging |
| US7116413B2 (en) * | 2002-09-13 | 2006-10-03 | Kla-Tencor Corporation | Inspection system for integrated applications |
| US7061598B1 (en) * | 2002-09-27 | 2006-06-13 | Kla-Tencor Technologies Corporation | Darkfield inspection system having photodetector array |
| US7106432B1 (en) * | 2002-09-27 | 2006-09-12 | Kla-Tencor Technologies Corporation | Surface inspection system and method for using photo detector array to detect defects in inspection surface |
| EP1639342A4 (en) * | 2003-05-19 | 2010-04-14 | Kla Tencor Tech Corp | DEVICE AND METHOD FOR ENABLING A ROBUST SEPARATION BETWEEN INTERESTING SIGNALS AND NOISE |
| US7068363B2 (en) * | 2003-06-06 | 2006-06-27 | Kla-Tencor Technologies Corp. | Systems for inspection of patterned or unpatterned wafers and other specimen |
| US7271921B2 (en) * | 2003-07-23 | 2007-09-18 | Kla-Tencor Technologies Corporation | Method and apparatus for determining surface layer thickness using continuous multi-wavelength surface scanning |
| US7002677B2 (en) * | 2003-07-23 | 2006-02-21 | Kla-Tencor Technologies Corporation | Darkfield inspection system having a programmable light selection array |
| US7130036B1 (en) * | 2003-09-16 | 2006-10-31 | Kla-Tencor Technologies Corp. | Methods and systems for inspection of an entire wafer surface using multiple detection channels |
| US7304310B1 (en) * | 2003-11-21 | 2007-12-04 | Kla-Tencor Technologies Corp. | Methods and systems for inspecting a specimen using light scattered in different wavelength ranges |
| US7184138B1 (en) * | 2004-03-11 | 2007-02-27 | Kla Tencor Technologies Corporation | Spatial filter for sample inspection system |
| US7206066B2 (en) * | 2004-03-19 | 2007-04-17 | Kla-Tencor Technologies Corporation | Reflectance surface analyzer |
| JP2005283190A (ja) * | 2004-03-29 | 2005-10-13 | Hitachi High-Technologies Corp | 異物検査方法及びその装置 |
| US7471382B2 (en) * | 2004-10-04 | 2008-12-30 | Kla-Tencor Technologies Corporation | Surface inspection system with improved capabilities |
| US7489393B2 (en) * | 2005-03-02 | 2009-02-10 | Kla-Tencor Technologies Corporation | Enhanced simultaneous multi-spot inspection and imaging |
| US7728965B2 (en) * | 2005-06-06 | 2010-06-01 | Kla-Tencor Technologies Corp. | Systems and methods for inspecting an edge of a specimen |
| US7511816B2 (en) * | 2005-06-16 | 2009-03-31 | Kla-Tencor Technologies Corp. | Methods and systems for determining drift in a position of a light beam with respect to a chuck |
| US7518728B2 (en) * | 2005-09-30 | 2009-04-14 | Intel Corporation | Method and instrument for collecting fourier transform (FT) Raman spectra for imaging applications |
| US7554656B2 (en) * | 2005-10-06 | 2009-06-30 | Kla-Tencor Technologies Corp. | Methods and systems for inspection of a wafer |
| US7372559B2 (en) * | 2005-12-14 | 2008-05-13 | Kla-Tencor Technologies Corp. | Systems and methods for inspecting a wafer with increased sensitivity |
| US7436505B2 (en) * | 2006-04-04 | 2008-10-14 | Kla-Tencor Technologies Corp. | Computer-implemented methods and systems for determining a configuration for a light scattering inspection system |
| US7463349B1 (en) * | 2006-06-02 | 2008-12-09 | Kla-Tencor Technologies Corp. | Systems and methods for determining a characteristic of a specimen |
-
2007
- 2007-08-10 US US11/837,220 patent/US7746459B2/en active Active
-
2008
- 2008-08-11 WO PCT/US2008/009571 patent/WO2009023154A2/en not_active Ceased
- 2008-08-11 JP JP2010519994A patent/JP5701602B2/ja active Active
-
2014
- 2014-10-31 JP JP2014222431A patent/JP6014102B2/ja active Active
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