JP2010515057A - 回転コンタクト部品および製造方法 - Google Patents

回転コンタクト部品および製造方法 Download PDF

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Publication number
JP2010515057A
JP2010515057A JP2009544147A JP2009544147A JP2010515057A JP 2010515057 A JP2010515057 A JP 2010515057A JP 2009544147 A JP2009544147 A JP 2009544147A JP 2009544147 A JP2009544147 A JP 2009544147A JP 2010515057 A JP2010515057 A JP 2010515057A
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JP
Japan
Prior art keywords
tip
layer
contact component
assembly
members
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009544147A
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English (en)
Japanese (ja)
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JP2010515057A5 (https=
Inventor
エリック ディー． ホッブス，
Original Assignee
フォームファクター， インコーポレイテッド
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Filing date
Publication date
Application filed by フォームファクター， インコーポレイテッド filed Critical フォームファクター， インコーポレイテッド
Publication of JP2010515057A publication Critical patent/JP2010515057A/ja
Publication of JP2010515057A5 publication Critical patent/JP2010515057A5/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2009544147A 2006-12-28 2007-12-06 回転コンタクト部品および製造方法 Pending JP2010515057A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/617,394 US7851794B2 (en) 2006-12-28 2006-12-28 Rotating contact element and methods of fabrication
PCT/US2007/086667 WO2008082847A2 (en) 2006-12-28 2007-12-06 Rotating contact element and methods of fabrication

Publications (2)

Publication Number Publication Date
JP2010515057A true JP2010515057A (ja) 2010-05-06
JP2010515057A5 JP2010515057A5 (https=) 2011-02-03

Family

ID=39582969

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009544147A Pending JP2010515057A (ja) 2006-12-28 2007-12-06 回転コンタクト部品および製造方法

Country Status (7)

Country Link
US (1) US7851794B2 (https=)
EP (1) EP2097951A2 (https=)
JP (1) JP2010515057A (https=)
KR (1) KR20090108608A (https=)
CN (1) CN101569060A (https=)
TW (1) TW200831910A (https=)
WO (1) WO2008082847A2 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170064058A (ko) * 2015-11-30 2017-06-09 삼성전자주식회사 프로브 카드 및 그를 포함하는 테스트 장치
KR20220142312A (ko) * 2021-04-14 2022-10-21 충화 프레시전 테스트 테크 컴퍼티 리미티드 프로브 카드 장치 및 스프링형 프로브

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9702904B2 (en) 2011-03-21 2017-07-11 Formfactor, Inc. Non-linear vertical leaf spring
US9052342B2 (en) 2011-09-30 2015-06-09 Formfactor, Inc. Probe with cantilevered beam having solid and hollow sections
JP6562896B2 (ja) * 2016-12-22 2019-08-21 三菱電機株式会社 半導体装置の評価装置およびそれを用いた半導体装置の評価方法
US11973301B2 (en) 2018-09-26 2024-04-30 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
US12181493B2 (en) 2018-10-26 2024-12-31 Microfabrica Inc. Compliant probes including dual independently operable probe contact elements including at least one flat extension spring, methods for making, and methods for using
US12078657B2 (en) 2019-12-31 2024-09-03 Microfabrica Inc. Compliant pin probes with extension springs, methods for making, and methods for using
US12000865B2 (en) 2019-02-14 2024-06-04 Microfabrica Inc. Multi-beam vertical probes with independent arms formed of a high conductivity metal for enhancing current carrying capacity and methods for making such probes
US11768227B1 (en) 2019-02-22 2023-09-26 Microfabrica Inc. Multi-layer probes having longitudinal axes and preferential probe bending axes that lie in planes that are nominally parallel to planes of probe layers
US11802891B1 (en) 2019-12-31 2023-10-31 Microfabrica Inc. Compliant pin probes with multiple spring segments and compression spring deflection stabilization structures, methods for making, and methods for using
US12196782B2 (en) 2019-12-31 2025-01-14 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
US11761982B1 (en) 2019-12-31 2023-09-19 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact and methods for making such probes
US12196781B2 (en) 2019-12-31 2025-01-14 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
US11774467B1 (en) 2020-09-01 2023-10-03 Microfabrica Inc. Method of in situ modulation of structural material properties and/or template shape
US12146898B2 (en) 2020-10-02 2024-11-19 Microfabrica Inc. Multi-beam probes with decoupled structural and current carrying beams and methods of making

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6269164U (https=) * 1985-10-18 1987-04-30
JPH08508613A (ja) * 1993-03-29 1996-09-10 ゼネラル・データコム・インコーポレーテッド ばね偏倚式テーパー付き接点要素
JP2006511804A (ja) * 2002-12-23 2006-04-06 フォームファクター，インコーポレイテッド 微小電子接触構造体

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US536380A (en) * 1895-03-26 Brake for railway-cars
US4781640A (en) * 1985-01-24 1988-11-01 Varian Associates, Inc. Basket electrode shaping
US5829128A (en) * 1993-11-16 1998-11-03 Formfactor, Inc. Method of mounting resilient contact structures to semiconductor devices
US4793816A (en) * 1987-07-20 1988-12-27 Industrial Electronic Hardware Terminal protector for circuit board connector
US6624648B2 (en) * 1993-11-16 2003-09-23 Formfactor, Inc. Probe card assembly
US6504223B1 (en) * 1998-11-30 2003-01-07 Advantest Corp. Contact structure and production method thereof and probe contact assembly using same
US6970005B2 (en) * 2000-08-24 2005-11-29 Texas Instruments Incorporated Multiple-chip probe and universal tester contact assemblage
US7385411B2 (en) * 2004-08-31 2008-06-10 Formfactor, Inc. Method of designing a probe card apparatus with desired compliance characteristics

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6269164U (https=) * 1985-10-18 1987-04-30
JPH08508613A (ja) * 1993-03-29 1996-09-10 ゼネラル・データコム・インコーポレーテッド ばね偏倚式テーパー付き接点要素
JP2006511804A (ja) * 2002-12-23 2006-04-06 フォームファクター，インコーポレイテッド 微小電子接触構造体

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170064058A (ko) * 2015-11-30 2017-06-09 삼성전자주식회사 프로브 카드 및 그를 포함하는 테스트 장치
KR102466151B1 (ko) 2015-11-30 2022-11-15 삼성전자주식회사 프로브 카드 및 그를 포함하는 테스트 장치
KR20220142312A (ko) * 2021-04-14 2022-10-21 충화 프레시전 테스트 테크 컴퍼티 리미티드 프로브 카드 장치 및 스프링형 프로브
KR102631577B1 (ko) 2021-04-14 2024-02-01 충화 프레시전 테스트 테크 컴퍼티 리미티드 프로브 카드 장치 및 스프링형 프로브

Also Published As

Publication number Publication date
US7851794B2 (en) 2010-12-14
EP2097951A2 (en) 2009-09-09
TW200831910A (en) 2008-08-01
WO2008082847A3 (en) 2008-12-31
US20080157789A1 (en) 2008-07-03
CN101569060A (zh) 2009-10-28
KR20090108608A (ko) 2009-10-15
WO2008082847A2 (en) 2008-07-10

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