JP2010513097A5 - - Google Patents

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Publication number
JP2010513097A5
JP2010513097A5 JP2009542884A JP2009542884A JP2010513097A5 JP 2010513097 A5 JP2010513097 A5 JP 2010513097A5 JP 2009542884 A JP2009542884 A JP 2009542884A JP 2009542884 A JP2009542884 A JP 2009542884A JP 2010513097 A5 JP2010513097 A5 JP 2010513097A5
Authority
JP
Japan
Prior art keywords
substrate
portion formed
attached
marking device
alignment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009542884A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010513097A (ja
Filing date
Publication date
Priority claimed from US11/614,143 external-priority patent/US8246141B2/en
Application filed filed Critical
Publication of JP2010513097A publication Critical patent/JP2010513097A/ja
Publication of JP2010513097A5 publication Critical patent/JP2010513097A5/ja
Pending legal-status Critical Current

Links

JP2009542884A 2006-12-21 2007-12-18 インサート成型されたプリントヘッド基板 Pending JP2010513097A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/614,143 US8246141B2 (en) 2006-12-21 2006-12-21 Insert molded printhead substrate
PCT/US2007/025879 WO2008079224A1 (en) 2006-12-21 2007-12-18 Insert molded printhead substrate

Publications (2)

Publication Number Publication Date
JP2010513097A JP2010513097A (ja) 2010-04-30
JP2010513097A5 true JP2010513097A5 (enExample) 2012-02-09

Family

ID=39295056

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009542884A Pending JP2010513097A (ja) 2006-12-21 2007-12-18 インサート成型されたプリントヘッド基板

Country Status (5)

Country Link
US (1) US8246141B2 (enExample)
EP (1) EP2091745B1 (enExample)
JP (1) JP2010513097A (enExample)
CN (1) CN101563231B (enExample)
WO (1) WO2008079224A1 (enExample)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7862147B2 (en) 2008-09-30 2011-01-04 Eastman Kodak Company Inclined feature to protect printhead face
US8251497B2 (en) 2008-12-18 2012-08-28 Eastman Kodak Company Injection molded mounting substrate
US8496317B2 (en) * 2009-08-11 2013-07-30 Eastman Kodak Company Metalized printhead substrate overmolded with plastic
US8118406B2 (en) * 2009-10-05 2012-02-21 Eastman Kodak Company Fluid ejection assembly having a mounting substrate
US8430474B2 (en) 2010-06-10 2013-04-30 Eastman Kodak Company Die mounting assembly formed of dissimilar materials
US8438730B2 (en) * 2011-01-26 2013-05-14 Eastman Kodak Company Method of protecting printhead die face
US8485637B2 (en) * 2011-01-27 2013-07-16 Eastman Kodak Company Carriage with capping surface for inkjet printhead
US8517514B2 (en) 2011-02-23 2013-08-27 Eastman Kodak Company Printhead assembly and fluidic connection of die
US20120212544A1 (en) 2011-02-23 2012-08-23 Brian Gray Price Mounting member with dual-fed ink passageways
US20130025125A1 (en) * 2011-07-27 2013-01-31 Petruchik Dwight J Method of fabricating a layered ceramic substrate
WO2013016048A1 (en) 2011-07-27 2013-01-31 Eastman Kodak Company Inkjet printhead with layered ceramic mounting substrate
US8721042B2 (en) 2011-07-27 2014-05-13 Eastman Kodak Company Inkjet printhead with layered ceramic mounting substrate
US8887393B2 (en) * 2012-01-27 2014-11-18 Eastman Kodak Company Fabrication of an inkjet printhead mounting substrate
US8690296B2 (en) 2012-01-27 2014-04-08 Eastman Kodak Company Inkjet printhead with multi-layer mounting substrate
CN102632721A (zh) * 2012-04-18 2012-08-15 珠海天威飞马打印耗材有限公司 打印模板
US8905508B2 (en) * 2012-11-06 2014-12-09 Eastman Kodak Company Ink barrier for optical sensor in inkjet printer
BR112015020862B1 (pt) 2013-02-28 2021-05-25 Hewlett-Packard Development Company, L.P. barra de impressão moldada
US9446587B2 (en) 2013-02-28 2016-09-20 Hewlett-Packard Development Company, L.P. Molded printhead
US10821729B2 (en) 2013-02-28 2020-11-03 Hewlett-Packard Development Company, L.P. Transfer molded fluid flow structure
US10029467B2 (en) * 2013-02-28 2018-07-24 Hewlett-Packard Development Company, L.P. Molded printhead
US9656469B2 (en) 2013-02-28 2017-05-23 Hewlett-Packard Development Company, L.P. Molded fluid flow structure with saw cut channel
US10632752B2 (en) 2013-02-28 2020-04-28 Hewlett-Packard Development Company, L.P. Printed circuit board fluid flow structure and method for making a printed circuit board fluid flow structure
EP2825386B1 (en) 2013-02-28 2018-02-21 Hewlett-Packard Development Company, L.P. Molded fluid flow structure
JP6068684B2 (ja) 2013-02-28 2017-01-25 ヒューレット−パッカード デベロップメント カンパニー エル．ピー．Ｈｅｗｌｅｔｔ‐Ｐａｃｋａｒｄ Ｄｅｖｅｌｏｐｍｅｎｔ Ｃｏｍｐａｎｙ， Ｌ．Ｐ． 流体流れ構造の成形
US9539814B2 (en) 2013-02-28 2017-01-10 Hewlett-Packard Development Company, L.P. Molded printhead
CN105189122B (zh) 2013-03-20 2017-05-10 惠普发展公司，有限责任合伙企业 具有暴露的前表面和后表面的模制芯片条
EP2976221B1 (en) * 2013-03-20 2019-10-09 Hewlett-Packard Development Company, L.P. Molded die slivers with exposed front and back surfaces
US10016983B2 (en) 2014-04-24 2018-07-10 Hewlett-Packard Development Company, L.P. Overmolded ink delivery device
JP6579780B2 (ja) * 2014-05-30 2019-09-25 キヤノン株式会社 液体吐出ヘッドおよび支持部材
KR101492396B1 (ko) 2014-09-11 2015-02-13 주식회사 우심시스템 어레이형 잉크 카트리지
WO2017065744A1 (en) * 2015-10-13 2017-04-20 Hewlett-Packard Development Company, L.P. Printhead with non-epoxy mold compound
CN107433777B (zh) * 2016-05-27 2020-05-12 精工电子打印科技有限公司 液体喷射头以及液体喷射装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4103643A (en) * 1973-03-26 1978-08-01 The Perkin-Elmer Corporation Aerosol-reducing slide holder system
IT1272050B (it) 1993-11-10 1997-06-11 Olivetti Canon Ind Spa Dispositivo stampante parallelo con struttura modulare e relativo procedimento di realizzazione.
JP4497678B2 (ja) * 1999-08-24 2010-07-07 キヤノン株式会社 液体吐出記録ヘッド、および、それを備える記録装置
US6536868B1 (en) 1999-08-24 2003-03-25 Canon Kabushiki Kaisha Liquid ejection type print head, printing apparatus provided with same and a method for producing a liquid ejection type print head
JP2002079674A (ja) * 2000-09-04 2002-03-19 Canon Inc 液体吐出ヘッドユニット、ヘッドカートリッジおよび液体吐出ヘッドユニットの製造方法
US6431683B1 (en) * 2001-03-20 2002-08-13 Hewlett-Packard Company Hybrid carrier for wide-array inkjet printhead assembly
JP2003237083A (ja) 2002-02-15 2003-08-26 Canon Inc 液体噴射記録ヘッド、および、それを備えた液体噴射記録装置
US7188925B2 (en) * 2004-01-30 2007-03-13 Hewlett-Packard Development Company, L.P. Fluid ejection head assembly
US7690774B2 (en) 2006-12-21 2010-04-06 Eastman Kodak Company Printing device fluid reservoir with gripping features

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