JP2010512526A - 半導体部材を製造するための乾燥工程を制御するための装置および方法 - Google Patents
半導体部材を製造するための乾燥工程を制御するための装置および方法 Download PDFInfo
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- JP2010512526A JP2010512526A JP2009540658A JP2009540658A JP2010512526A JP 2010512526 A JP2010512526 A JP 2010512526A JP 2009540658 A JP2009540658 A JP 2009540658A JP 2009540658 A JP2009540658 A JP 2009540658A JP 2010512526 A JP2010512526 A JP 2010512526A
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- gas concentration
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- 238000001035 drying Methods 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 title description 7
- 239000004065 semiconductor Substances 0.000 title description 7
- 239000002904 solvent Substances 0.000 claims abstract description 24
- 238000001745 non-dispersive infrared spectroscopy Methods 0.000 claims abstract description 12
- 150000001298 alcohols Chemical class 0.000 claims abstract description 4
- 239000007789 gas Substances 0.000 claims description 51
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 39
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 claims description 18
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 11
- 239000001294 propane Substances 0.000 claims description 9
- 238000010926 purge Methods 0.000 claims description 6
- 238000003556 assay Methods 0.000 claims description 5
- 238000001514 detection method Methods 0.000 claims description 5
- 238000005259 measurement Methods 0.000 claims description 5
- 238000012544 monitoring process Methods 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 3
- 229910001873 dinitrogen Inorganic materials 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 8
- 238000000691 measurement method Methods 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 230000031700 light absorption Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
- G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
- G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
- G01N21/3504—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing gases, e.g. multi-gas analysis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/14—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects using gases or vapours other than air or steam, e.g. inert gases
- F26B21/145—Condensing the vapour onto the surface of the materials to be dried
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
Abstract
Description
Claims (9)
- 乾燥室(1)中に位置付けられているウェハ(2)の乾燥工程を制御するための装置であって、かつ乾燥器ガスユニット(3)が乾燥室(1)中の実測ガス濃度を測定するための気体濃度測定ユニット(4)に従って気体状の溶剤によって充填される装置において、気体濃度測定ユニット(4)は、ウェハ(2)を乾燥させるためのアルコールの群からの気体状の溶剤の濃度を監視するNDIR測定装置の様式に従って構成されていることを特徴とする、ウェハ(2)の乾燥工程を制御するための装置。
- 気体濃度測定ユニット(4)の検出器内で、イソプロピルアルコールの代わりに代用ガスのプロパンを使用することを特徴とする、請求項1記載の装置。
- 気体濃度測定ユニット(4)の検定のための検定用キュベットが備えられていることを特徴とする、請求項1記載の装置。
- 気体濃度測定ユニット(4)の検定用キュベット中で、イソプロピルアルコールの代わりに代用ガスのプロパンを使用することを特徴とする、請求項1記載の装置。
- 気体濃度測定ユニット(4)が、気体状の溶剤1ppmを下回る検出限界に調整可能であることを特徴とする、請求項1記載の装置。
- 乾燥室(1)中に位置付けられているウェハ(2)の乾燥工程を制御する方法であって、乾燥室が乾燥器ガスユニット(3)を介して乾燥室(1)中の実測ガス濃度を測定するための気体濃度測定ユニット(4)に従って気体状の溶剤によって充填される方法において、乾燥室(1)中の実測気体濃度を、ウェハ(2)を乾燥させるためのアルコールの群からの気体状の溶剤の濃度を監視するNDIR測定によって測定することを特徴とする、ウェハ(2)の乾燥工程を制御する方法。
- 乾燥室(1)をパージするために、その溶剤の残留含有率が同様にNDIR測定法により確認される窒素ガスを導入することを特徴とする、請求項6記載の方法。
- 気体濃度測定ユニット(4)の検定を、検定用キュベットにより実施することを特徴とする、請求項6記載の方法。
- 乾燥室(1)内でのウェハ(2)の乾燥を、典型的に50〜2000hPaの広い圧力範囲で実施することを特徴とする、請求項6記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006059492 | 2006-12-14 | ||
DE102006060302A DE102006060302B3 (de) | 2006-12-14 | 2006-12-20 | Anordnung sowie ein Verfahren zur Steuerung von Trocknungsprozessen für die Herstellung von Halbleiterbauelementen |
PCT/EP2007/010901 WO2008071415A1 (de) | 2006-12-14 | 2007-12-12 | Anordnung sowie ein verfahren zur steuerung von trocknungsprozessen für die herstellung von halbleiterbauelementen |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010512526A true JP2010512526A (ja) | 2010-04-22 |
JP2010512526A5 JP2010512526A5 (ja) | 2012-04-05 |
Family
ID=39271314
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009540658A Pending JP2010512526A (ja) | 2006-12-14 | 2007-12-12 | 半導体部材を製造するための乾燥工程を制御するための装置および方法 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2102574A1 (ja) |
JP (1) | JP2010512526A (ja) |
DE (1) | DE102006060302B3 (ja) |
WO (1) | WO2008071415A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013101610B4 (de) * | 2013-02-19 | 2015-10-01 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung und Verfahren zur Ferndetektion eines nicht infrarotaktiven Zielgases |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57134660U (ja) * | 1981-02-14 | 1982-08-21 | ||
JPS61194334A (ja) * | 1985-02-22 | 1986-08-28 | Shimadzu Corp | 赤外線ガス分析計 |
DE3522949A1 (de) * | 1985-06-27 | 1987-01-08 | Hartmann & Braun Ag | Verfahren zum nachjustieren von infrarot-gasanalysatoren |
US20010029683A1 (en) * | 2000-01-04 | 2001-10-18 | Murphy Neal T. | System and method for controlling a vapor dryer process |
JP2002202260A (ja) * | 2000-12-28 | 2002-07-19 | Horiba Ltd | 赤外線ガス分析計用コンデンサマイクロフォン検出器 |
JP2004085252A (ja) * | 2002-08-23 | 2004-03-18 | Horiba Ltd | ガス分析計 |
JP2005024486A (ja) * | 2003-07-02 | 2005-01-27 | Shimadzu Corp | フローセンサ及びそれを用いた赤外線ガス検出器 |
JP2006024931A (ja) * | 2004-07-07 | 2006-01-26 | Samsung Electronics Co Ltd | 基板乾燥装置 |
JP2006098387A (ja) * | 2004-09-02 | 2006-04-13 | Osaka Gas Co Ltd | シロキサン含有ガス中のシロキサンの分析装置および分析方法 |
JP2006112900A (ja) * | 2004-10-14 | 2006-04-27 | Shimadzu Corp | 赤外線ガス分析方法及び分析装置 |
JP2006275641A (ja) * | 2005-03-28 | 2006-10-12 | Matsushita Electric Works Ltd | 分光式ガスセンサ |
JP2006295194A (ja) * | 2005-04-13 | 2006-10-26 | Samsung Electronics Co Ltd | 半導体基板を洗浄する装置及び半導体基板の洗浄方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR980012044A (ko) * | 1996-03-01 | 1998-04-30 | 히가시 데츠로 | 기판건조장치 및 기판건조방법 |
US6649883B2 (en) * | 2001-04-12 | 2003-11-18 | Memc Electronic Materials, Inc. | Method of calibrating a semiconductor wafer drying apparatus |
DE10256696A1 (de) * | 2002-12-04 | 2004-06-24 | Mattson Wet Products Gmbh | Verfahren zum Trocknen von Substraten |
US6928748B2 (en) * | 2003-10-16 | 2005-08-16 | Taiwan Semiconductor Manufacturing Co., Ltd | Method to improve post wafer etch cleaning process |
DE10353076A1 (de) * | 2003-11-13 | 2005-06-02 | Infineon Technologies Ag | Überwachungseinrichtung für eine Marangoni-Trockneranlage |
-
2006
- 2006-12-20 DE DE102006060302A patent/DE102006060302B3/de active Active
-
2007
- 2007-12-12 WO PCT/EP2007/010901 patent/WO2008071415A1/de active Application Filing
- 2007-12-12 EP EP07856648A patent/EP2102574A1/de not_active Withdrawn
- 2007-12-12 JP JP2009540658A patent/JP2010512526A/ja active Pending
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57134660U (ja) * | 1981-02-14 | 1982-08-21 | ||
JPS61194334A (ja) * | 1985-02-22 | 1986-08-28 | Shimadzu Corp | 赤外線ガス分析計 |
DE3522949A1 (de) * | 1985-06-27 | 1987-01-08 | Hartmann & Braun Ag | Verfahren zum nachjustieren von infrarot-gasanalysatoren |
US20010029683A1 (en) * | 2000-01-04 | 2001-10-18 | Murphy Neal T. | System and method for controlling a vapor dryer process |
JP2002202260A (ja) * | 2000-12-28 | 2002-07-19 | Horiba Ltd | 赤外線ガス分析計用コンデンサマイクロフォン検出器 |
JP2004085252A (ja) * | 2002-08-23 | 2004-03-18 | Horiba Ltd | ガス分析計 |
JP2005024486A (ja) * | 2003-07-02 | 2005-01-27 | Shimadzu Corp | フローセンサ及びそれを用いた赤外線ガス検出器 |
JP2006024931A (ja) * | 2004-07-07 | 2006-01-26 | Samsung Electronics Co Ltd | 基板乾燥装置 |
JP2006098387A (ja) * | 2004-09-02 | 2006-04-13 | Osaka Gas Co Ltd | シロキサン含有ガス中のシロキサンの分析装置および分析方法 |
JP2006112900A (ja) * | 2004-10-14 | 2006-04-27 | Shimadzu Corp | 赤外線ガス分析方法及び分析装置 |
JP2006275641A (ja) * | 2005-03-28 | 2006-10-12 | Matsushita Electric Works Ltd | 分光式ガスセンサ |
JP2006295194A (ja) * | 2005-04-13 | 2006-10-26 | Samsung Electronics Co Ltd | 半導体基板を洗浄する装置及び半導体基板の洗浄方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2008071415A1 (de) | 2008-06-19 |
EP2102574A1 (de) | 2009-09-23 |
DE102006060302B3 (de) | 2008-06-19 |
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