JP2010287693A5

JP2010287693A5 - Overlay apparatus, alignment apparatus, substrate bonding apparatus, and overlay method

Info

Publication number: JP2010287693A5
Application number: JP2009139623A
Authority: JP
Filing date: 2009-06-10
Publication date: 2012-10-04
Anticipated expiration: 2029-06-10

Description

後述するように、位置合わせ装置１６０において基板ホルダ２００に載せられた基板１０２は、静電吸着等により、基板ホルダ２００に保持される。上ステージ１９０および下ステージ１７０に各々搭載されるので、基板１０２を保持した基板ホルダ２００は、少なくとも２つ用意される。 As will be described later, the substrate 102 placed on the substrate holder 200 in the alignment device 160 is held by the substrate holder 200 by electrostatic attraction or the like. Since it is mounted on each of the upper stage 190 and the lower stage 170, at least two substrate holders 200 holding the substrate 102 are prepared.

最初に搬送された基板ホルダ２００は、ローダ１２０により反転されて上ステージ１９０に保持される。また、次に搬送された基板ホルダ２００は、そのままの向きで下ステージ１７０に保持される。これら基板ホルダ２００に保持された基板１０２は、図８に示すように、相互に位置合わせして仮接合される。 The substrate holder 200 transported first is reversed by the loader 120 and held on the upper stage 190. The substrate holder 200 transported next is held on the lower stage 170 in the same direction. As shown in FIG. 8, the substrates 102 held by these substrate holders 200 are temporarily aligned and aligned with each other.

Claims

An overlay device that superimposes a first substrate and a second substrate on each other,
A first stage for holding the first substrate;
A second stage that holds the second substrate and moves relative to the first stage to overlay the second substrate on the first substrate;
A push-up pin that supports the first substrate apart from the second stage with the bonding surface of the first substrate held by the first stage facing the second stage;
With
The push-up pin is a stacking apparatus that moves toward the first stage to hold the first substrate on the first stage in a state of being separated from the second stage.

The overlay apparatus according to claim 1, wherein the push-up pin further supports the second substrate and moves toward the second stage to hold the second substrate on the second stage.

The first substrate includes a first holder for holding the first substrate;
The overlay apparatus according to claim 1, wherein the second substrate includes a second holder that holds a second substrate that is superimposed on the first substrate.

The first stage holds the first holder with the surface opposite to the holding surface holding the first substrate facing the first stage,
The overlay apparatus according to claim 3, wherein the push-up pin is disposed on the second stage.

The overlay apparatus according to claim 4, wherein the push-up pin mounts the second holder on the second stage after the first holder is mounted on the first stage.

The advance / retreat position accuracy of the push-up pin when the first holder is mounted on the first stage is higher than the advance / retreat position accuracy of the push-up pin when the second holder is mounted on the second stage. The superposition apparatus according to claim 4 or 5, wherein the superposition apparatus is high.

The overlay apparatus according to any one of claims 1 to 6, wherein the push-up pin is disposed on the second stage.

The overlay apparatus according to claim 7, wherein the push-up pin mounts the second substrate on the second stage after mounting the first substrate on the first stage.

The push-up pin advance / retreat position accuracy when the first substrate is mounted on the first stage is the push-up pin advance / retreat position accuracy when the second substrate is mounted on the second stage. The superposition apparatus according to claim 7 or 8, which is higher than the superposition apparatus.

The first stage is an upper stage on which the mounting surface on which the first substrate is mounted faces downward, and the second stage is on which the mounting surface on which the second substrate is mounted faces upward. The superposition apparatus according to any one of claims 1 to 9, which is a lower stage.

An alignment apparatus comprising the superimposing apparatus according to any one of claims 1 to 10.

A laminating apparatus comprising the superimposing apparatus according to any one of claims 1 to 10.

A method of superimposing a first substrate and a second substrate on each other,
A step of supporting the first substrate apart from the second stage with a push-up pin, with the bonding surface of the first substrate held by the first stage facing the second stage;
Mounting the supported first substrate on the first stage by moving the push-up pin toward the first stage in a state in which the first substrate is separated from the second stage;
Mounting the second substrate on the second stage;
And a step of superimposing the first substrate and the second substrate on each other by relative movement of the first stage and the second stage.

The step of mounting the second substrate on the second stage includes:
Supporting the second substrate by the push-up pins;
Mounting the second substrate supported on the second stage by moving the push-up pin toward the second stage;
The superposition method according to claim 13.

The first substrate includes a first holder that holds the first substrate, and the second substrate includes a second holder that holds a second substrate superimposed on the first substrate,
The overlaying method according to claim 13 or 14, further comprising a step of supporting the first substrate on the first holder before the step of supporting the first holder.

The first substrate includes a first holder that holds the first substrate, and the second substrate includes a second holder that holds a second substrate superimposed on the first substrate,
After the step of mounting the first holder on the first stage, supporting the first substrate with another push-up pin;
The step of mounting the first substrate on the first holder held on the first stage by moving the other push-up pin toward the first stage. The superposition method according to any one of the above items.

The first substrate includes a first holder that holds the first substrate, and the second substrate includes a second holder that holds a second substrate superimposed on the first substrate,
After the step of mounting the first holder on the first stage, the step of supporting the first substrate by the push-up pins;
Mounting the first substrate on the first holder held by the first stage by moving the push-up pin toward the first stage;
The overlay method according to any one of claims 13 to 15, further comprising: