JP2010287650A - Electronic component mounting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To eliminate the need for a connection of a long air tube to a head. <P>SOLUTION: An electronic component mounting apparatus includes a substrate-holding section for holding a substrate to which an electronic component is mounted; a component-supplying section for supplying the electronic component to be mounted; a head including a liftable suction nozzle 105 for suctioning the electronic component to be mounted to the substrate; and a movement mechanism for moving the head between the substrate holding section and the component-supplying section. An intake and exhaust device having a flexible section, including a film or a thin plate having flexibilities, a piezoelectric element affixed to the flexible section, and a structure for composing an air chamber A, together with the flexible section is mounted to the head to make the intaking and exhausting device a negative-pressure generating section for carrying out suction by the suction nozzle 105. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electronic component mounting apparatus that performs mounting by sucking an electronic component with a nozzle.

  The conventional electronic component mounting apparatus is equipped with a suction nozzle and a head that can move freely in the XY plane. The electronic component is received from the electronic component feeder by suction, and the head moves to the component mounting location on the board. The electronic component is mounted by releasing the electronic component from the suction nozzle. Under the present circumstances, the negative pressure required for adsorption | suction of an electronic component uses a vacuum pump as a generation source (for example, refer patent document 1). An air cylinder, which is an actuator that uses compressed air as a power source, is often used inside the mounter. The compressed air supplied from the compressed air generation source is usually decompressed by, for example, about 0.49 [MPa] by a decompression device and drawn into the mounter. About 0.49 [MPa] air tube is connected to the head, and it is piped vertically and horizontally so as not to hinder the movement of the head.

  Also, when the suction nozzle releases the electronic component, the vacuum pump is stopped and the inside of the suction nozzle is opened to the atmosphere, but at that time, a waiting time occurs until the inside of the suction nozzle becomes an atmospheric pressure state. There is a case in which a positive pressure adjusted to a low pressure is applied to the suction nozzle for a short time (hereinafter referred to as weak blow) in order to increase the air release speed. For the application of such a weak blow, a decompression device and a solenoid valve for further decompressing the compressed air drawn into the previous mounter are used.

JP-A-6-132698

  By the way, the vacuum pump which is the negative pressure generating source described above has a problem that it requires regular maintenance and becomes a noise generating source. Also, since the vacuum pump is large and has a large mass, it must be fixed to the base frame of an electronic component mounting device and supplied with negative pressure to the head with an air tube, but the head can move freely on the XY plane. Therefore, a very long air tube is required so as not to hinder the operation of the head, and a guide mechanism is also required to enable the air tube to follow the operation of the head moving freely in the XY direction. There was a problem of becoming.

  In addition, such air tubes may cause contamination of oil and foreign matter, and when a solenoid valve or the like is interposed in the path including the air tube, performance degradation or response time may be reduced due to oil or foreign matter mixed in the air. In some cases, a problem such as a decrease occurs.

  Further, in order to perform the above-described weak blow, a positive pressure supply air tube is also required, and the air tube has the same problem.

  It is also conceivable to use a vacuum generator or the like that generates a negative pressure state by using a negative pressure due to the flow of compressed air without using a vacuum pump as a negative pressure generation source of the suction nozzle. Although such a vacuum generator is small and can be mounted on the head, it is necessary to supply a positive pressure to the vacuum generator itself, and the problem of the air tube has occurred as well.

  An object of the present invention is to eliminate the need for connection of a long air tube to the head.

  According to the first aspect of the present invention, there is provided a substrate holding unit that holds a substrate on which electronic components are mounted, a component supply unit that supplies electronic components to be mounted, and an elevating mechanism that can adsorb the electronic components mounted on the substrate. In an electronic component mounting apparatus including a head including a suction nozzle and a moving mechanism for moving the head between the substrate holding unit and the component supply unit, a flexible film or thin plate is used. An intake / exhaust device having a portion, a piezoelectric element attached to the flexible portion, and a structure that forms an air chamber together with the flexible portion is mounted on the head, and the intake / exhaust device is mounted on the suction nozzle. It is characterized by being a negative pressure generation source for performing adsorption.

  The invention described in claim 2 has the same configuration as that of the invention described in claim 1, and further includes a negative pressure generating device that obtains a negative pressure from the flow of air by the exhaust of the intake and exhaust device.

  The invention described in claim 3 has the same configuration as that of the invention described in claim 1 or 2, and the intake / exhaust device as a positive pressure generating source for releasing the suction of the suction nozzle is also mounted on the head. It is characterized by that.

  The invention described in claim 4 has the same configuration as that of the invention described in claim 3, and further includes intake / exhaust switching means for switching and connecting the intake port and the exhaust port of the intake / exhaust device to the adsorption nozzle, One suction / exhaust device serves as a negative pressure generation source and a positive pressure generation source of the suction nozzle.

  According to a fifth aspect of the present invention, there is provided a substrate holding unit that holds a substrate on which electronic components are mounted, a component supply unit that supplies electronic components to be mounted, and an elevating / lowering mechanism that sucks the electronic components mounted on the substrate. In an electronic component mounting apparatus including a head including a suction nozzle and a moving mechanism for moving the head between the substrate holding unit and the component supply unit, a flexible film or thin plate is used. An intake / exhaust device having a portion, a piezoelectric element attached to the flexible portion, and a structure that forms an air chamber together with the flexible portion is mounted on the head, and the intake / exhaust device is mounted on the suction nozzle. A positive pressure generating source for releasing the adsorption is used.

  The invention according to claim 6 has the same configuration as that of the invention according to any one of claims 1 to 5, and an exhaust flow path extending from the air chamber to the outside of the structure of the intake / exhaust device. An intake flow path that intersects with the exhaust flow path is provided, and the intake / exhaust device performs intake and exhaust by periodically increasing and decreasing the volume of the air chamber by the piezoelectric element.

  The invention according to claim 7 has the same configuration as that of the invention according to any one of claims 1 to 5, and a plurality of the piezoelectric elements are arranged along the circumference of the flexible portion of the intake / exhaust device. Each of the piezoelectric elements is disposed and provided with an intake port at a position that is the center of the circumference of the flexible part or structure and an exhaust port at a position that is the outer periphery of the circumference of the flexible part or structure. Are driven in order along the circumference to rotate the clearance area between the flexible part and the structure, and the exhaust is exhausted by the centrifugal force generated by the rotational movement of the clearance area. Features.

  The invention described in claim 8 has the same configuration as that of the invention described in any one of claims 1 to 7, and controls the intake pressure or the exhaust pressure by adjusting the drive frequency or applied voltage of the piezoelectric element. It has the control means which performs.

  According to the first aspect of the present invention, an intake / exhaust device that performs intake / exhaust from an air chamber by deforming a flexible portion by a piezoelectric element is used as a negative pressure source of an adsorption nozzle (note that negative pressure is a pressure lower than atmospheric pressure). And positive pressure means a pressure higher than atmospheric pressure, the same applies hereinafter). In general, a piezoelectric element can be easily reduced in thickness, and a flexible portion to which the piezoelectric element is attached is also in the form of a film or a thin plate, so that the entire intake / exhaust device can be reduced in thickness. Therefore, the intake / exhaust device can be easily reduced in weight and size as compared with a configuration including a blower and a motor for rotationally driving the same as a conventional negative pressure source, and can be directly mounted on the head. It becomes possible. As a result, it is possible to eliminate the need for a long air tube that supplies negative pressure to the head that freely moves in the work area, and to eliminate the need for a guide mechanism that can accommodate the movement of the head. Accordingly, the operation of the head can be smoothed, and the production cost can be reduced by simplifying the device configuration.

  Furthermore, since an air tube is not required, the occurrence of mixing of oil and foreign matters can be reduced, and even when an electromagnetic valve or the like is used, it is possible to suppress a decrease in performance and response time.

  In addition, if the pressure is about the pressure required for suction of minute electronic components, it is possible to select a light material in consideration of the strength. From this viewpoint, the intake / exhaust device can be reduced in weight. It becomes possible.

  Further, since the intake / exhaust device performs intake / exhaust by vibrating the flexible portion with the piezoelectric element, for example, by adjusting the vibration frequency, it can be removed from the audible range, and noise can be suppressed.

  Since the invention according to claim 2 includes the negative pressure generating device, it is possible to use the exhaust instead of the intake air of the intake / exhaust device to generate the negative pressure. Therefore, for example, even when the intake port is separated from the suction nozzle due to a layout problem, the exhaust port side can be connected to the suction nozzle. It becomes possible to raise.

  According to the third aspect of the present invention, since the positive pressure generating source for releasing the suction of the suction nozzle is also an intake / exhaust device, a long air tube for supplying positive pressure to the head and its guide mechanism are not required. Is possible. Along with this, even when a solenoid valve or the like is used, it is possible to suppress a decrease in performance and response time due to mixing of oil and foreign matters.

  In addition, if the pressure is about the positive pressure for releasing the negative pressure inside the suction nozzle, it is possible to select a lightweight material even considering its strength, and it is possible to reduce the weight of the intake / exhaust device It becomes.

  In the invention according to claim 4, since the intake port and the exhaust port of the intake / exhaust device are switched and connected to the adsorption nozzle, the intake / exhaust device can be used as both a negative pressure generation source and a positive pressure generation source. In addition, the number of intake / exhaust devices mounted on the head can be reduced, and the weight and size of the head can be reduced.

  According to the fifth aspect of the present invention, the intake / exhaust device, which is easily reduced in size and weight, is used as a positive pressure generation source for releasing the suction of the suction nozzle, so that the negative pressure is supplied to the head by mounting directly on the head. A long air tube is unnecessary, and a guide mechanism corresponding to the movement of the head can also be unnecessary.

  Further, if the pressure is about the positive pressure for releasing the adsorption, a light material can be selected, and the intake / exhaust device can be reduced in weight.

  Furthermore, it is possible to suppress noise by vibrating so as to remove the audible range when applying pressure.

  According to the sixth aspect of the present invention, since the intake / exhaust device has a structure in which the intake passage is joined to the exhaust passage, even when the volume of the air chamber changes from a decrease to an increase due to vibration of the flexible portion, The exhaust gas is discharged to the outside by an inertial force, and intake and exhaust can be performed while suppressing pulsation to a minimum.

  In addition, since the flexible portion may be simply vibrated with a piezoelectric element, the structure of the intake / exhaust device itself can be simplified, the control is simple, and the control circuit is easily manufactured. Is possible.

  According to the seventh aspect of the invention, since the plurality of piezoelectric elements arranged along the circumference rotate and move the gap region and perform suction and exhaust by the centrifugal force, it is possible to perform intake and exhaust without pulsation. It becomes.

  In the eighth aspect of the invention, the pressure of the intake and exhaust is controlled by the driving frequency of the piezoelectric element or the applied voltage, so that the pressure can be easily adjusted at any time. Moreover, an electropneumatic regulator for pressure adjustment can be eliminated, and the production cost of the apparatus can be reduced.

  In particular, when applying positive pressure to release the negative pressure of the suction nozzle, fine pressure adjustment is required, but the adjustment can be easily performed by control, reducing the adjustment work load. It is also possible to plan.

It is a perspective view which shows the whole electronic component mounting apparatus which concerns on this Embodiment. It is a block diagram which shows the control system of an electronic component mounting apparatus. It is a block diagram which shows the intake / exhaust system of an electronic component mounting apparatus. Exploded perspective view of intake and exhaust device, 5A and 5B are cross-sectional views along the center line direction of the intake / exhaust device. FIG. 5A shows a non-operating state and FIG. 5B shows an operating state. It is a top view which shows arrangement | positioning of a piezoelectric element. It is sectional drawing along the centerline direction of the intake / exhaust apparatus provided with a collection pipe. It is a block diagram which shows the intake / exhaust system provided with another intake / exhaust switching electromagnetic valve. FIG. 9A is a block diagram showing an intake / exhaust system of the electronic component mounting apparatus of the second embodiment, and FIG. 9B is a cross-sectional view of the negative pressure generator. It is a block diagram which shows the intake / exhaust system of the electronic component mounting apparatus of 3rd embodiment. It is a perspective view of the intake / exhaust device used in the third embodiment. It is a perspective view which followed the XX line of FIG. 11 of the intake / exhaust apparatus used in 3rd embodiment. It is a perspective view which followed the YY line of FIG. 12 of the intake / exhaust apparatus used in 3rd embodiment. It is sectional drawing along the centerline direction of the intake / exhaust apparatus of FIG. 11 provided with a collecting pipe. It is a block diagram which shows the intake / exhaust system of the electronic component mounting apparatus of 4th embodiment. It is a block diagram which shows the intake / exhaust system of the electronic component mounting apparatus of 5th embodiment. It is a block diagram which shows the intake / exhaust system of the electronic component mounting apparatus of 6th embodiment. It is a block diagram which shows the intake / exhaust system of the electronic component mounting apparatus of 7th Embodiment.

(First embodiment)
A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view of an electronic component mounting apparatus 100 according to the present embodiment. Hereinafter, as shown in the drawing, two directions orthogonal to each other on the horizontal plane are respectively referred to as an X-axis direction and a Y-axis direction, and a vertical direction orthogonal to these directions is referred to as a Z-axis direction.

  The electronic component mounting apparatus 100 mounts various electronic components on a board. As shown in FIG. 1, the electronic component mounting apparatus 100 includes a plurality of electronic component feeders 101 and a plurality of electronic component feeders 101 that supply electronic components to be mounted. Electronic component mounting on a substrate provided in the middle of a substrate transfer path by the substrate transfer means 103, and a substrate transfer means 103 for transferring a substrate in the X-axis direction, and a pair of component supply sections composed of feeder banks 102 held side by side A substrate holding unit 104 for performing work, a head 106 that holds a plurality (three in this example) of suction nozzles 105 so as to be movable up and down, and two sets of component supply units for the head 106 And an XY gantry 107 as a head moving mechanism for driving and transporting to an arbitrary position within a work area including the substrate holding unit 104 and the above-described components. A base frame 114 to lifting, and an operation control unit 10 for controlling the operation of each of the above structures.

The operation control means 10 of the electronic component mounting apparatus 100 has mounting data in which various setting contents relating to the mounting of the electronic component are recorded, and the electronic component to be mounted from the mounting data and the electronic component feeder 101 of the electronic component. The component receiving position based on the installation position and data indicating the mounting position on the board are read out, and the XY gantry 107 is controlled to transfer the head 106 to the electronic component receiving position and mounting position. The suction nozzle 105 is moved up and down and the suction-release operation is controlled, and while moving, the position of the electronic component and the angle around the nozzle during the suction are detected and moved by using a component posture recognition means (not shown). Operation control such as correction and angle adjustment is executed.
(Substrate transport means and substrate holder)
The substrate transport unit 103 includes a transport belt (not shown), and transports the substrate along the X-axis direction by the transport belt.

As described above, the substrate holding unit 104 for fixing and holding the substrate at the work position when the electronic component is mounted on the substrate is provided in the middle of the substrate transfer path by the substrate transfer means 103. The substrate transport unit 103 transports the substrate to the substrate holding unit 104 and stops and holds the substrate by a holding mechanism (not shown). That is, a stable electronic component mounting operation is performed while the substrate is held by the holding mechanism.
(Parts supply section)
Each feeder bank 102 is provided in a state along the X-axis direction at each of both ends of the base frame 114 in the Y-axis direction. Each feeder bank 102 includes a flat portion along the XY plane, and a plurality of electronic component feeders 101 are arranged and mounted on the upper surface of the flat portion along the X-axis direction (in FIG. Only one component feeder 101 is shown, but in reality, several electronic component feeders 101 are mounted side by side).

  Each feeder bank 102 is provided with a latch mechanism (not shown) for holding each electronic component feeder 101, and each electronic component feeder 101 can be mounted or separated as necessary.

  The electronic component feeder 101 described above holds a tape reel wound with a tape in which an infinite number of electronic components are encapsulated at uniform intervals on the rear end side, and in the vicinity of the front end portion, as described above, to the head 106. The electronic component delivery unit 101a is provided. And in the state attached to the feeder bank 102, the delivery part 101a of an electronic component becomes a fixed position about a Y-axis direction and a Z-axis direction. In addition, in the X-axis direction, the position of the electronic component delivery unit 101a is determined depending on which position in the X-axis direction on the feeder bank 102 is attached.

When the mounting operation is performed, the tape is transported to the electronic component delivery unit 101a, and the electronic component is supplied to the head 106 positioned in the delivery unit 101a.
(XY gantry)
The XY gantry 107 includes an X-axis guide rail 107a that guides the movement of the head 106 in the X-axis direction, and two Y-axis guide rails 107b that guide the head 106 in the Y-axis direction together with the X-axis guide rail 107a. , An X-axis motor 109 that is a drive source that moves the head 106 along the X-axis direction, and a Y-axis motor 110 that is a drive source that moves the head 106 in the Y-axis direction via the X-axis guide rail 107a. ing. By driving the motors 109 and 110, the head 106 can be transported to almost the entire region between the two Y-axis guide rails 107b.

  Each of the motors 109 and 110 is positioned so that the suction nozzle 105 is positioned via the head 106 by controlling the rotation amount of each of the motors 109 and 110 to be a desired rotation amount. Is going.

In addition, the two feeder banks 102 and the board holding unit 104 are both disposed within the transportable area of the head 106 by the XY gantry 107 in view of the necessity of mounting electronic components.
(head)
FIG. 2 is a block diagram showing a control system of the electronic component mounting apparatus 100. In FIG. 2, only the control configuration of one suction nozzle 105 is illustrated, but actually, a control configuration is provided for each suction nozzle 105 mounted on the head 106.

  The head 106 has three suction nozzles 105 (see FIG. 1) that hold the electronic component T by air suction at the tip thereof, and three Z-axis motors 111 that raise and lower the suction nozzles 105 along the Z-axis direction, respectively. And three rotary motors 112 for adjusting the angle of the electronic components held by rotating the respective suction nozzles 105 about the Z-axis direction.

  Each of the suction nozzles 105 is supported by the head 106 so as to be able to move up and down and rotate in a state along the Z-axis direction. Yes.

  FIG. 3 is a block diagram showing an intake / exhaust system for adsorbing electronic components provided in the head 106 and related operations. In FIG. 3, only the intake / exhaust system of one suction nozzle 105 is illustrated, but actually, an intake / exhaust system is provided for each of the suction nozzles 105 mounted on the head 106.

  The suction / exhaust system of each suction nozzle 105 includes a suction / exhaust device 20A that is a negative pressure generation source for the suction of electronic components of the suction nozzle 105, a main pipe 61 that connects the suction nozzle 105 to the suction / exhaust device 20A, and a suction An intake / exhaust device 20B that is a source of positive pressure (weak blow) for releasing electronic components of the nozzle 105, a branch pipe 62 that branches from the main pipe 61 and connects the suction nozzle 105 and the intake / exhaust apparatus 20B, and an adsorption An intake / exhaust switching electromagnetic valve 63 is provided as a positive / negative pressure switching means for switching the connection state between the intake / exhaust device 20A and the intake / exhaust device 20B with respect to the nozzle 105.

  The main pipe 61 has one end connected to the suction nozzle 105 and the other end connected to the intake port of the intake / exhaust device 20A.

  The branch pipe 62 has one end connected to the middle of the main pipe 61 and the other end connected to the exhaust port of the intake / exhaust device 20B.

The intake / exhaust switching electromagnetic valve 63 is a normally closed type 2-port 2-position pilot-type electromagnetic valve provided in the middle of the branch pipe 62. The intake / exhaust switching electromagnetic valve 63 has a function of switching between connection / disconnection of the intake / exhaust device 20B and the suction nozzle 105 by an operation control means 10 described later.
(Intake / exhaust device)
FIG. 4 is an exploded perspective view of the intake / exhaust device 20A, FIG. 5 is a cross-sectional view along the center line direction, FIG. 5 (A) shows a non-operating state, and FIG. 5 (B) shows an operating state.

  The intake / exhaust device 20 </ b> A includes a diaphragm 21 as a flexible thin plate-like flexible portion, eight piezoelectric elements 22 pasted on the upper surface of the diaphragm 21 along the circumference, and the diaphragm 21. And a substrate 23 as a structure constituting an air chamber.

  The substrate 23 is circular, and in the vicinity of the outer periphery thereof, four arc-shaped exhaust ports 24 whose circumferences are divided into four are formed so as to penetrate the front and back.

  The diaphragm 21 has a circular shape with the same diameter as the substrate, and is fixed over the entire periphery near the outer periphery of the upper surface of the substrate 23 (outside the exhaust ports 24). That is, the area inside each substrate outlet 23 of the substrate 23 is not bonded to the diaphragm 21, and the gap between the substrate 23 and the diaphragm 21 in the area becomes the air chamber A (gap region). (See FIG. 5B). In addition, an air inlet 25 penetrating the front and back of the diaphragm 21 is formed in the center of the diaphragm 21 so that air is taken into the air chamber A from the air inlet 25 and exhausted from the air outlet 24 of the substrate 23. It has become.

  Each piezoelectric element 22 has an arc shape formed by dividing an annular ring into eight equal parts, and the entire lower surface of each piezoelectric element 22 is attached to the upper surface of the diaphragm 21 so as to form an annular shape. The eight piezoelectric elements 22 are set such that the outer diameter of the ring is smaller than the outer diameter of the diaphragm, the inner diameter of the ring is set larger than the intake port 25 of the diaphragm 21, and is concentric with the diaphragm 21. It is arranged to become.

  The intake / exhaust device 20A includes a drive circuit 26 for individually applying an operating voltage to each piezoelectric element 22. By applying a positive drive voltage by the drive circuit 26, the piezoelectric element 22 has both ends of the circular arc shape downward. The piezoelectric element 22 is bent in a circular arc shape having a convex shape when viewed from the radial direction. Then, the air chamber A is formed between the diaphragm 21 and the substrate 23 by using this bending.

  The drive circuit 26 can individually apply a drive voltage to each piezoelectric element 22, and as shown in FIG. 6, the piezoelectric element 22 </ b> X that applies the drive voltage among the piezoelectric elements 22 is arranged along the circumference. The power is applied so as to shift in a certain direction (either clockwise or counterclockwise). As a result, the air chamber A rotates and moves along the circumference, and accordingly, the air in the air chamber A flows outward in the radial direction by centrifugal force. As a result, the center side of the air chamber A has a low pressure and the outer peripheral side has a high pressure, air flows in from the intake port 25, and air is discharged from each exhaust port 24, and intake and exhaust are performed.

  Note that the drive circuit 26 may apply an alternating voltage whose potential changes according to a sine curve to the piezoelectric elements 24 in a sequence with a phase difference of 1/8 cycle or 1/4 cycle (in this case). Also, a difference between the clockwise direction and the counterclockwise direction may be provided). In the case of a phase difference of 1/8 cycle, intake and exhaust can be performed in substantially the same manner as described above, and in the case of a phase difference of 1/4 cycle, two piezoelectric elements 22 facing each other at the center of the circumference can be used. Two air chambers A can be formed.

  Each piezoelectric element 22 may be a monomorph or a bimorph, but in the case of a bimorph, it is more preferable because the bending can be increased and the volume of the air chamber A can be increased.

  The applied voltage by the drive circuit 26 or its period (the speed at which the piezoelectric element 22X transitions or the AC frequency) can be changed and adjusted by the operation control means 10, and by these changes, the intake / exhaust device 20A can perform the intake and exhaust. The flow rate of the exhaust can be freely adjusted.

  FIG. 7 is a cross-sectional view of the intake / exhaust device 20B. The intake / exhaust device 20B has the same configuration as the intake / exhaust device 20A, and also has a collecting pipe 27 for collecting exhaust from the four exhaust ports 24. About the intake / exhaust device 20B, about the same structure as 20A of intake / exhaust devices, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  The collecting pipe 27 of the intake / exhaust device 20B is open at the top, and the substrate 23 is fitted into the opening without any gap, so that all the exhaust from each exhaust port 24 is discharged into the collecting pipe 27. Yes. An exhaust port 28 penetrating to the outside is provided at the center lower portion of the collecting pipe 27, and all exhaust from each exhaust port 24 is exhausted from one exhaust port 28.

The intake / exhaust device 20A described above is exhausted in order from each exhaust port 24. However, the intake / exhaust device 20B is exhausted from one exhaust port 28, which requires a positive pressure. By connecting the exhaust port 28 to the target object, a positive pressure without pulsation can be supplied.
(Operation control means)
As shown in FIG. 2, the operation control means 10 mainly includes an X-axis motor 109, a Y-axis motor 110 of the XY gantry 107, a Z-axis motor 111 that raises and lowers the suction nozzle 105 in the head 106, and a suction nozzle 105. The CPU 30 that executes various processes and controls according to a predetermined control program and the various processes and controls for the drive motors 26 and 26 of the rotary motor 112, the intake / exhaust apparatus 20A, and the intake / exhaust apparatus 20B. System ROM 12 storing a program for storing, RAM 13 serving as a work area for various processes by storing various data, I / F (interface) 14 for connecting the CPU 30 and various devices, and a substrate Required for mounting operation control, such as the list of electronic components to be mounted on the device, the mounting position of each electronic component and the receiving position of the electronic component A non-volatile storage device 17 for storing mounting data and the like, an operation panel 15 for inputting data required for various settings and operations, and a display monitor 18 for presenting the contents of various settings and necessary information. And have. Each of the motors 109 to 112 described above is a servo motor including an encoder, and is connected to the I / F 14 via a servo driver (not shown).

  The CPU 30 reads mounting data from the storage device 17 at the time of mounting the electronic components, and from the mounting data, lists various electronic components to be mounted on the board, reception positions and mounting positions of the electronic components. Get information.

  The CPU 30 controls the X-axis and Y-axis motors 109 and 110 to move the head 106 to the electronic component receiving position, and controls the Z-axis motor to lower the suction nozzle 105 to suck the electronic components. Then, the suction nozzle 105 is raised and the head 106 is further transferred to the mounting position. Then, during the transfer to the mounting position, the CPU 30 detects the position of the sucked electronic component with respect to the nozzle and the angle around the nozzle using the component posture recognition means, and controls the rotation motor 112 to correct the angle. Execute. Further, when positioning the head 106 at the mounting position, correction is performed in consideration of the position of the electronic component relative to the nozzle.

  Further, the suction nozzle 105 is lowered by the Z-axis motor to complete the mounting of the electronic component.

  The CPU 30 repeatedly executes the above operation for all electronic components mounted on the board.

  Here, the control for the intake / exhaust system of the suction nozzle 105 performed in the mounting operation of the electronic component will be further described.

  At the time of receiving electronic components, the CPU 30 controls the drive circuit 26 of the intake / exhaust device 20A to start driving while maintaining the closed state of the intake / exhaust switching electromagnetic valve 63, and sets the inside of the suction nozzle 105 to a negative pressure state. To do. In this state, the electronic component is received, and the electronic component is sucked to the tip of the suction nozzle 105. The voltage value or frequency of the drive voltage applied to the intake / exhaust device 20A is set in advance so that a pressure suitable for suction of the target electronic component is obtained, and the drive circuit 26 is controlled based on this value. To be done. Such setting values may be prepared in mounting data for each electronic component, for example.

When mounting the electronic component on the board, the CPU 30 considers a predetermined delay before reaching the target height when the head 106 arrives at the mounting position and the lowering of the suction nozzle 105 is started. The drive of the intake / exhaust device 20A is stopped at the timing, the drive of the intake / exhaust device 20B is started, and the intake / exhaust switching electromagnetic valve 63 is switched to the connected state. As a result, the inside of the suction nozzle 105 in a negative pressure state is quickly switched to a positive pressure, and the electronic component is separated from the tip of the suction nozzle 105 and mounted on the substrate side.
(Effect of the first embodiment)
In the electronic component mounting apparatus 10, each of the piezoelectric elements includes an intake / exhaust device 20 </ b> A that is a negative pressure generation source for intake of the suction nozzle 105 and an intake / exhaust device 20 </ b> B that is a positive pressure generation source for weak blow. 22, the flexible portion 21 is deformed to perform intake and exhaust from the air chamber A. Since the piezoelectric element 22 is plate-shaped and can be easily thinned, and the flexible portion 21 to which each piezoelectric element 22 is attached is also a film or a thin-plate shape, the intake / exhaust devices 20A and 20B can be thinned as a whole. Is possible.

  Therefore, the intake / exhaust devices 20A and 20B can be easily reduced in weight and size and can be directly mounted on the head 106 as compared with the configuration including the blower and the motor as in the conventional device. Therefore, a long air tube for supplying negative pressure and positive pressure to the head 106 is not required, and a guide mechanism corresponding to the movement of the head 106 is also unnecessary. As a result, the operation of the head 106 can be facilitated, and the production cost of the electronic component mounting apparatus 10 can be reduced by simplifying the apparatus configuration.

  In addition, since an air tube is not necessary, the occurrence of oil and foreign matters is reduced, and the performance and response time of the intake / exhaust switching electromagnetic valve 63 and the like can be suppressed.

  In addition, if the pressure of the negative pressure required for adsorbing the electronic components and the pressure of the positive pressure required for releasing the electronic components are about the same, a light material is selected for each of the intake / exhaust devices 20A and 20B in consideration of the strength. Therefore, the weight can be reduced, and the weight of the head 106 can be reduced.

  Moreover, about each intake / exhaust apparatus 20A, 20B, it becomes possible to suppress a noise by adjusting the vibration frequency of the piezoelectric element 22 so that it may remove | deviate from an audible range.

  Furthermore, each intake / exhaust device 20A, 20B can control the intake / exhaust amount by the voltage value or voltage frequency applied to each piezoelectric element 22, and accordingly, the negative pressure or positive pressure generated can be controlled. In addition, an electropneumatic regulator for pressure adjustment can be eliminated, and the production cost of the apparatus can be reduced. In particular, when applying a positive pressure for releasing the negative pressure of the suction nozzle, fine pressure adjustment is required, but the adjustment can be easily performed by the operation control means 10, and the adjustment work load It is also possible to reduce this.

  In the intake / exhaust system in the above-described head 106, the intake / exhaust switching electromagnetic valve 63 is provided in the branch pipe 62. Therefore, when applying a positive pressure at the time of weak blow execution, the suction nozzle 105 side through the main pipe 61 is provided. Not only that, air also flows to the intake / exhaust device 20A side. Therefore, when applying positive pressure, it is necessary to set the exhaust amount by the intake / exhaust device 20B in consideration of the outflow toward the intake / exhaust device 20A.

  Therefore, instead of the intake / exhaust switching electromagnetic valve 64, a pilot-type electromagnetic valve 64A having a 4-port 2-position as shown in FIG. 8 may be provided at the coupling position of the main pipe 61 and the branch pipe 62. In FIG. 8, the drive circuit 26 of each intake / exhaust device 20A, 20B is not shown.

  The intake / exhaust switching electromagnetic valve 64A connects the intake / exhaust device 20A to the adsorption nozzle 105 at one position, and connects the intake / exhaust device 20B and the adsorption nozzle 105 at the other position. Further, when in the other position, the intake / exhaust device 20B and the intake / exhaust device 20A are not connected.

  Thus, by using the intake / exhaust switching electromagnetic valve 64A in the arrangement shown in FIG. 8, supply of positive pressure from the intake / exhaust device 20B without causing outflow to the intake / exhaust device 20A side when positive pressure is applied. Thus, the positive pressure can be easily adjusted, and a delay in applying the positive pressure can also be suppressed.

The example of the intake / exhaust switching electromagnetic valve 64A can be applied to second to fifth embodiments described later.
(Second embodiment)
Based on FIG. 9, another example of the intake / exhaust system for the suction nozzle 105 of the head 106 in the electronic component mounting apparatus 10 will be described as a second embodiment. In addition, since it is the same as that of the structure of the electronic component mounting apparatus 10 mentioned above about structures other than this intake / exhaust system | strain, the overlapping description is abbreviate | omitted.

  In this intake / exhaust system, as shown in FIG. 9A, an intake / exhaust device 20B is used instead of the intake / exhaust device 20A as a negative pressure generation source for adsorption by the adsorption nozzle 105, and A negative pressure generator 65 that uses the flow of positive pressure air exhausted from the exhaust port 28 (see FIG. 7) is added as a new configuration. In FIG. 9A, the drive circuit 26 of each intake / exhaust device 20B is not shown.

  As shown in FIG. 9B, the negative pressure generating device 65 includes a straight main pipe 65a and a branch pipe 65b branched perpendicularly to the main pipe 65a, and has one end of the main pipe 65a. The part is connected to the exhaust port 28 of the intake / exhaust device 20B, and the other end is open to the atmosphere. Further, the branch pipe 65 b is connected to the suction nozzle 105 via the main pipe 61. With this structure, when the exhaust of the intake / exhaust device 20B flows in the main pipe 65a, the pressure in the main pipe 65a is reduced according to the flow velocity, and the branch pipe 65b is also lowered in accordance with this. It is possible to supply negative pressure.

  In the second embodiment, when the electronic component is received by the suction nozzle 105, the intake / exhaust device 20B connected to the negative pressure generator 65 is driven, and when the electronic component is mounted (suction release). The intake / exhaust switching electromagnetic valve 54 is switched to drive the intake / exhaust device 20B on the branch pipe 62 side.

  Thereby, the intake / exhaust system shown in the second embodiment can have the same effects as the intake / exhaust system of the first embodiment.

Further, as in the example of this embodiment, by using the negative pressure generating device 65, the intake / exhaust device 20B can be used as a negative pressure generating source. When it is desirable to use the intake / exhaust device 20B rather than the exhaust device 20A, it is possible to meet the demand.
(Third embodiment)
Based on FIGS. 10 to 13, another example of the intake and exhaust system for the suction nozzle 105 of the head 106 in the electronic component mounting apparatus 10 will be described as a third embodiment. In addition, since it is the same as that of the structure of the electronic component mounting apparatus 10 mentioned above about structures other than this intake / exhaust system | strain, the overlapping description is abbreviate | omitted.

  In this intake / exhaust system, as shown in FIG. 10, a new intake / exhaust device 30B is used instead of the intake / exhaust device 20A as a negative pressure generation source for adsorption of the adsorption nozzle 105, and the electronic components are released. An example is shown in which an intake / exhaust device 30A is used instead of the intake / exhaust device 20B as a positive pressure generation source for weak blow.

  11 is a perspective view of the intake / exhaust device 30A, FIG. 12 is a cross-sectional view taken along line XX of FIG. 11, and FIG. 13 is a cross-sectional view taken along line YY of FIG.

  The intake / exhaust device 30 </ b> A includes a diaphragm 31 as a flexible film-like flexible portion, a piezoelectric element 32 attached to the center of the lower surface of the diaphragm 31, and a structure 33 that forms an air chamber together with the diaphragm 31. A fixed plate 34 that fixes the diaphragm 31 to the structure 33, and a drive circuit 38 that controls the piezoelectric element 32 so that the diaphragm 31 periodically vibrates in its thickness direction.

  The structure 33 has a square shape in plan view, and a recess 33a is formed at the center of the bottom surface. The diaphragm 31 having the same shape and the same size as the plan view of the structure 33 is sandwiched and fixed by the structure 33 and the fixing plate 34 so as to close the recess 33a. Thus, the air chamber A is formed by closing the concave portion 33 a of the structure 33 with the diaphragm 31.

  An exhaust passage 35 is formed vertically extending from the center of the upper surface of the structure 33 to the air chamber A. When the volume of the air chamber A is reduced, the exhaust passage 35 passes through the exhaust passage 35 and the intake / exhaust device 30A. Exhaust is performed upward. That is, the upper end portion of the exhaust passage 35 is an exhaust port of the intake / exhaust device 30A.

  In addition, a buffer portion 36 having a large diameter is provided in the middle of the exhaust flow path 35 of the structure 33, and the intake flow path extends in a direction perpendicular to the exhaust flow path 35 from the buffer section 36 in all directions. 37 is formed. In addition, it is good also as a structure where each intake flow path 37 joins directly with respect to the exhaust flow path 35, without providing the buffer part 36. FIG.

  Each intake passage 37 is bent rearward at the four corners of the structure 33 and passes through the diaphragm 31 and the fixed plate 34 and is opened to the atmosphere on the lower surface of the intake / exhaust device 30A. That is, the lower end portion of each intake passage 37 is an intake port.

  The fixing plate 34 is formed with an opening 34 a having a central portion of the same size as the concave portion 33 a of the structure 33 and penetrating vertically. The upper surface of the piezoelectric element 32 is attached to the center of the lower surface of the diaphragm 31 so as to be stored inside the opening 34a.

  The drive circuit 38 applies an AC operating voltage to the piezoelectric element 32, and the application of the positive voltage by the drive circuit 38 causes the piezoelectric element 32 to bend upward so as to protrude upward, and the negative voltage is applied. As a result, the piezoelectric element 32 is bent so as to protrude downward. That is, the air chamber A is compressed with the positive voltage, and the air chamber is expanded with the negative voltage.

  Here, the flow of intake and exhaust during compression and expansion of the air chamber A will be described.

  First, when the air chamber A is compressed by the application of the positive voltage by the drive circuit 38, the air flows upward through the buffer portion 36 in the exhaust passage 35. As a result, a pressure drop occurs in the buffer unit 36, and intake is performed from the outside through each intake passage 37.

  Next, when the air chamber A is expanded by application of a negative voltage by the drive circuit 38, air flows into the air chamber A from each intake flow path 37 and above the buffer portion 36 in the exhaust flow path 35. In the portion, the flow of air from each intake passage 37 to the upper end portion (exhaust port) of the exhaust passage 35 is continuously performed by inertia force. That is, in the intake / exhaust device 30A, even if the piezoelectric elements 32 are alternately bent up and down by the application of an alternating voltage, and the air chamber A expands and contracts, the exhaust is performed from the exhaust port of the exhaust passage 35. Pulsation is suppressed and continuous exhaust is performed.

  The piezoelectric element 32 may be a monomorph or a bimorph, but in the case of a bimorph, it is more preferable because the deflection can be increased and the volume change due to the expansion and contraction of the air chamber A can be increased.

  The applied voltage by the drive circuit 38 and its period (the speed at which the piezoelectric element 22X changes or the alternating current frequency) can be changed and adjusted by the operation control means 10, and by these changes, the intake and exhaust devices 20A can perform the intake and exhaust. The flow rate of the exhaust can be freely adjusted.

  FIG. 14 is a cross-sectional view of the intake / exhaust device 30B. The intake / exhaust device 30B has a collecting pipe 39 for collecting the intake ports of the four intake passages 37 in addition to the same configuration as the intake / exhaust device 30A. About the intake / exhaust device 30B, about the same structure as 30A of intake / exhaust devices, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  The upper portion of the collecting pipe 39 of the intake / exhaust device 30B is open, and the fixing plate 34 is fitted into the opening without any gap. An intake port 40 penetrating vertically is formed in the central portion of the lower surface of the collecting pipe 39, and intake air from the intake port of each intake flow path 37 is supplied from the single intake port 40 to the collecting pipe 39. It is supplied through the inside.

  With this collecting pipe 39, the intake ports 40 can be combined into one, and when the intake / exhaust device 30B is used as a negative pressure supply source, the intake ports 40 may be connected.

  In the intake / exhaust system of the third embodiment, in addition to being able to obtain the same effects as the intake / exhaust system of the first embodiment, the intake / exhaust devices 30A, 30B use one piezoelectric element 32 as a drive source. Since the structure is such that the diaphragm 31 is simply reciprocated in the thickness direction by the piezoelectric element 32, the structure of the intake / exhaust device itself can be simplified and the drive circuit 38 can be simplified. In addition, the control can be simplified.

Further, the control is simple and the control circuit can be easily manufactured.
(Fourth embodiment)
Based on FIG. 15, another example of the intake / exhaust system of the electronic component mounting apparatus 10 will be described as a fourth embodiment. Since the intake / exhaust system of the fourth embodiment is the same as the intake / exhaust system of the second embodiment described above except for the intake / exhaust system used, the redundant description will be omitted. In FIG. 15, the drive circuit 38 of each intake / exhaust device 30A is not shown.

  In this intake / exhaust system, as shown in FIG. 15, an intake / exhaust device 30A is used as a negative pressure generation source for adsorption by the adsorption nozzle 105, and exhaust is performed from an exhaust port 40 (see FIG. 12) of the intake / exhaust device 30A. The negative pressure is generated by the negative pressure generator 65 using the flow of the positive pressure air to be supplied to the suction nozzle 105. The intake / exhaust device 30A is also used as a positive pressure generation source for performing weak blow for releasing the negative pressure.

In the fourth embodiment, it is possible to achieve the same effect as the intake and exhaust system of the second embodiment. Further, since the negative pressure generating source and the positive pressure generating source use the intake / exhaust device 30A having the same structure, it is possible to improve the productivity of the device by sharing the parts.
(Fifth embodiment)
Based on FIG. 16, another example of the intake and exhaust system of the electronic component mounting apparatus 10 will be described as a fifth embodiment. The intake / exhaust system of the fifth embodiment is the same as the intake / exhaust system of the first embodiment described above except for the intake / exhaust system to be used, and therefore redundant description will be omitted. In FIG. 16, the drive circuits 26 and 38 of the intake / exhaust devices 20A and 30A are not shown.

  In this intake / exhaust system, as shown in FIG. 16, the intake / exhaust device 20A is used as a negative pressure generation source for adsorption by the adsorption nozzle 105, and a positive pressure is generated to perform weak blow for releasing the negative pressure. The intake / exhaust device 30A is used as a source.

In the fifth embodiment, it is possible to obtain the same effect as that of the intake and exhaust system of the first embodiment. In addition, since products that do not require the collecting pipes 27 and 39, such as the intake / exhaust device 20A and the intake / exhaust device 30A, are used, the product cost can be reduced.
(Sixth embodiment)
Based on FIG. 17, another example of the intake / exhaust system for the suction nozzle 105 of the head 106 in the electronic component mounting apparatus 10 will be described as a sixth embodiment. Since the sixth embodiment is the same as the first embodiment described above except for the intake and exhaust systems, the redundant description will be omitted. In FIG. 17, the drive circuit 26 of the intake / exhaust device 20B is not shown.

  In this intake / exhaust system, as shown in FIG. 17, the intake / exhaust device 20B is used as a negative pressure generation source for adsorption by the adsorption nozzle 105, and a positive pressure is generated to perform weak blow for releasing the negative pressure. By using the same intake / exhaust device 20 </ b> B as a source, a configuration in which only one intake / exhaust device 20 </ b> B is required for each adsorption nozzle 105 is realized.

  That is, the intake port 25 of the intake / exhaust device 20B is connected to the suction nozzle 105 through the main pipe 61, the exhaust port 28 of the intake / exhaust device 20B is connected to the suction nozzle 105 through the branch pipe 62, and the branch pipe 62 with respect to the main pipe 61 is connected. An intake / exhaust switching electromagnetic valve 63B that selectively connects either the intake port 25 or the exhaust port 28 of the intake / exhaust device 20B to the adsorption nozzle 105 is provided at the joining position.

  The intake / exhaust switching electromagnetic valve 63B is a 4-port 2-position pilot type solenoid valve, and the port connected to the intake port 25 and the port connected to the exhaust port 28 of the intake / exhaust device 20B are respectively connected to the suction nozzle 105. The connection is switched between the connected port and the port open to the atmosphere.

  The operation control means 10 connects the intake port 25 of the intake / exhaust device 20B to the adsorption nozzle 105 and opens the exhaust port 28 of the intake / exhaust device 20B to the atmosphere when the electronic component is adsorbed to the intake / exhaust switching electromagnetic valve 63B. When the electronic component is mounted (released), the exhaust port 28 of the intake / exhaust device 20B is connected to the suction nozzle 105, and the intake port 25 of the intake / exhaust device 20B is connected to the atmosphere release side. Take control.

In the sixth embodiment, both the negative pressure supply and the positive pressure supply are performed with respect to one suction nozzle 105 by one suction / exhaust device 20 </ b> B. Therefore, the manufacturing cost of the apparatus can be reduced by greatly reducing the number of parts.
(Seventh embodiment)
Based on FIG. 18, another example of the intake / exhaust system of the electronic component mounting apparatus 10 will be described as a seventh embodiment. The intake / exhaust system of the seventh embodiment is the same as the intake / exhaust system of the sixth embodiment described above except for the intake / exhaust system used, and therefore redundant description will be omitted. In FIG. 18, the drive circuit 38 of the intake / exhaust device 30B is not shown.

  In this intake / exhaust system, as shown in FIG. 18, an intake / exhaust device 30 </ b> B is used as a source of negative pressure and positive pressure for adsorption by the adsorption nozzle 105.

  That is, the intake port 40 of the intake / exhaust device 30B is connected to the adsorption nozzle 105 through the main pipe 61, and the exhaust nozzle of the exhaust passage 35 of the intake / exhaust device 30B is connected to the adsorption nozzle 105 through the branch pipe 62. Then, by the intake / exhaust switching electromagnetic valve 63B, the port connected to the intake port 40 of the intake / exhaust device 30B and the port connected to the exhaust port of the exhaust passage 35 are respectively connected to the port connected to the adsorption nozzle 105 and the atmosphere. It is designed to switch to a port that is open.

As a result, the seventh embodiment can obtain the same effects as those of the intake and exhaust system of the sixth embodiment.
(Other)
In each of the above-described embodiments, suction elements using the piezoelectric elements 22 and 32 as both the negative pressure generation source (adsorption pressure supply source) and the positive pressure generation source (adsorption release pressure supply source) of the suction nozzle 105 are used. Exhaust devices 20A, 20B, 30A, and 30B are employed, but the intake / exhaust device is used for only one of the negative pressure generation source and the positive pressure generation source, and the other is a suction pump or an external positive source as in the prior art. A pressure source may be used. That is, even if the intake / exhaust device is used for only one of the negative pressure generation source and the positive pressure generation source, the air tube used for one of them can be made unnecessary, However, it is possible to obtain the same technical effect as described above.

10 Operation control means (control means)
20A, 20B, 30A, 30B Intake / exhaust device 21 Diaphragm (flexible part)
22, 32 Piezoelectric element 23 Substrate (structure)
24, 28 Exhaust port 25, 40 Inlet port 26, 38 Drive circuit 31 Diaphragm (flexible part)
33 Structure 35 Exhaust flow path 37 Intake flow path 65 Negative pressure generator 100 Electronic component mounting apparatus 101 Electronic component feeder (component supply unit)
102 Feeder bank (parts supply unit)
104 Substrate holding part 105 Suction nozzle 106 Head 107 XY gantry (movement mechanism)
A air chamber

Claims (8)

A board holding unit for holding a board on which electronic components are mounted;
A component supply unit for supplying electronic components to be mounted;
A head having a suction nozzle capable of moving up and down to suck an electronic component mounted on the substrate;
In an electronic component mounting apparatus comprising a moving mechanism that moves the head between the substrate holding unit and the component supply unit,
An air intake / exhaust device including a flexible portion made of a flexible film or thin plate, a piezoelectric element attached to the flexible portion, and a structure that forms an air chamber together with the flexible portion is used as the head. Equipped with
An electronic component mounting apparatus, wherein the intake / exhaust device is used as a negative pressure generation source for performing suction by the suction nozzle.   2. The electronic component mounting apparatus according to claim 1, further comprising a negative pressure generating device that obtains a negative pressure from a flow of air caused by exhaust of the intake / exhaust device.   3. The electronic component mounting apparatus according to claim 1, wherein the suction / exhaust device as a positive pressure generation source for releasing suction of the suction nozzle is also mounted on the head.   Intake / exhaust switching means for switching and connecting an intake port and an exhaust port of the intake / exhaust device to the suction nozzle, and functions as a negative pressure generation source and a positive pressure generation source of the suction nozzle as one intake / exhaust device The electronic component mounting apparatus according to claim 3, wherein: A board holding unit for holding a board on which electronic components are mounted;
A component supply unit for supplying electronic components to be mounted;
A head having a suction nozzle capable of moving up and down to suck an electronic component mounted on the substrate;
In an electronic component mounting apparatus comprising a moving mechanism that moves the head between the substrate holding unit and the component supply unit,
An air intake / exhaust device including a flexible portion made of a flexible film or thin plate, a piezoelectric element attached to the flexible portion, and a structure that forms an air chamber together with the flexible portion is used as the head. Equipped with
An electronic component mounting apparatus, wherein the intake / exhaust device is used as a positive pressure generation source for releasing the suction of the suction nozzle. In the structure of the intake / exhaust device, an exhaust passage that goes outside from the air chamber and an intake passage that intersects the exhaust passage and merges are provided,
6. The electronic component mounting apparatus according to claim 1, wherein the intake / exhaust device performs intake / exhaust by periodically increasing / decreasing a volume of the air chamber by the piezoelectric element. A plurality of the piezoelectric elements are arranged along the circumference of the flexible part of the intake / exhaust device,
An intake port is provided at a position that is the center of the circumference of the flexible part or structure, and an exhaust port is provided at a position that is the outer periphery of the circumference of the flexible part or structure,
A driving circuit for rotating and moving the gap region between the flexible part and the structure by driving each piezoelectric element in turn along the circumference;
6. The electronic component mounting apparatus according to claim 1, wherein exhaust is performed from an exhaust port by a centrifugal force generated by rotational movement of the gap region.   The electronic component mounting apparatus according to any one of claims 1 to 7, further comprising a control unit that adjusts a driving frequency or an applied voltage of the piezoelectric element to control an intake pressure or an exhaust pressure.

Images