JP2010277447A - Quality analysis system and quality analysis method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide information useful for improvement of products being shipped at present and improvement in design quality of products to be next shipped, on the basis of defects occurring in products shipped to the market. <P>SOLUTION: Second quality information associating defect information showing occurrence positions and occurrence causes of defects occurring in components and information showing parts or positions in design data, with each other is generated on the basis of first quality information including the occurrence positions and occurrence causes, and positions in the components wherein defects due to the same occurrence cause occur more frequently than a set value are detected on the basis of the second quality information, and third quality information associating defect frequent appearance information showing the detected positions and information showing parts or positions in the design data, with each other is generated, and a model based on the design data, information superposed on the model and showing the occurrence positions and occurrence causes of defects on the basis of the second quality information, and information superposed on the model and showing the frequent occurrence of defects on the basis of the third quality information are displayed on a display device. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a quality analysis system and a quality analysis method for analyzing the quality of products shipped to the market.

  Products designed in the development / design department are shipped to the market. After shipping, defects may occur in the parts that make up the product.

  Patent Document 1 automatically assigns an appropriate priority to a plurality of actual products having different priorities of analysis, such as failures or performance degradation, and appropriately selects the actual product to be analyzed according to the priorities. Discloses a system for rapid extraction.

JP-A-2005-149328

  By the way, there is a demand to improve the product based on the defect generated in the product shipped to the market or to use it for the design quality of the next generation product.

  An object of the present invention is to provide a quality that can provide information useful for improving a currently shipped product and improving a design quality of a next shipped product based on a defect that has occurred in a product shipped to the market. To provide an analysis system and a quality analysis method.

A quality analysis system comprising a quality information transmission device and a quality analysis device according to an example of the present invention,
The quality information transmission device includes a transmission unit that transmits first quality information including a generation location and a cause of a failure that has occurred in a component having design data designed by a design support device in a product,
The quality analysis device, based on the occurrence location and the cause of occurrence in the first quality information transmitted by the transmission unit, the defect information indicating the occurrence location and the cause of occurrence, and the information indicating the part or position in the design data And a portion in the component where a defect due to the same occurrence occurs more than a set value based on the defect information in the second quality information Means for generating and generating third quality information in which defect frequency information indicating the detected location is associated with information indicating a part or position in the design data; the design data; the second quality information; Display means for displaying a model of the component on a display device based on three quality information, wherein information indicating a defect occurrence location and a cause of occurrence is superimposed on the model based on the second quality information; Displayed on the serial display device, overlapping the defect frequent information in the model and a display means for displaying on said display device based on the third quality information.

  ADVANTAGE OF THE INVENTION According to this invention, based on the defect which generate | occur | produced in the product shipped to the market, it becomes possible to provide the information useful for the improvement of the product currently shipped, and the design quality improvement of the product shipped next. .

The block diagram which shows the structure of the quality analysis system concerning one Embodiment of this invention. The flowchart which shows the procedure of the quality analysis by the quality analysis system shown in FIG. The figure which shows an example of the market quality information regarding a printed circuit board. A figure showing an example of market quality information about the housing The figure which shows the data flow when a development and design department collects market quality information. The figure which shows the example which accumulated the information based on market quality information on the model. The figure which shows the example which accumulated the information based on market quality information on the model. The figure which shows the state which displayed only the quality information which pays attention from the state shown in FIG. The figure which shows the example which displayed the simulation result by CAE superimposed on the model and market quality information. The figure which shows the data flow when providing market quality information tied data to a subcontractor. The figure which shows the model and market quality information which are displayed when security information is added to market quality information. The figure which shows the flow of data when the examination result from a subcontract design place is provided to a development / design department. The figure which shows the example which displayed the examination result from a subcontractor design on a model and market quality information.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a diagram showing a configuration of a quality analysis system according to an embodiment of the present invention.

  As shown in FIG. 1, in the quality analysis system, a sales base / maintenance department 100 is provided with a first computer terminal 110, a first server 120, a measuring device 130, and the like. The development / design department 200 is provided with a second computer terminal 210 and a second server 220 as quality analysis devices. A third computer terminal 310, a third server 320, and the like are provided in the outsource design site 300.

  The first computer terminal 110 includes an input unit 111, a processing unit 112, a storage unit 113, a display unit 114, a communication unit 115, and the like. The input unit 111 is provided for inputting text and operating a pointer displayed on the display unit 114. The processing unit 112 is provided for performing various processes on the input data. The storage unit 113 is provided for storing the processing result by the processing unit 112 and the like. The communication unit 115 is provided to communicate with the first server 120 and the measuring device 130.

  The first server 120 includes a storage unit 121, a communication unit 122, and the like. Information generated by the first computer terminal 110 is stored in the storage unit 121. The communication unit 122 can transmit the data stored in the storage unit 121 to the second server 220.

  The measuring device 130 inspects the printed circuit board or the case where the defect has occurred, and finds out the cause of the defect. The cause of failure occurrence measured by the measuring device is recorded in the storage unit 131 together with the failure occurrence location (or failure occurrence component). The cause of the failure and the location where the failure is recorded in the storage unit 131 can be transmitted to the first computer terminal 110 by the communication unit 132.

  The second computer terminal 210 includes an input unit 211, a processing unit 212, a storage unit 213, a display unit 214, a communication unit 215, and the like. The input unit 211 is provided for inputting text and operating a pointer displayed on the display unit 214. The processing unit 212 is provided for performing various processes on the input data. The storage unit 213 is provided for storing the processing result by the processing unit 212 and the like. The communication unit 215 is provided for communicating with the second server 220.

  The second server 220 includes a storage unit 221 and a communication unit 222. The storage unit 221 stores data generated by the second computer terminal 210 and data received by the communication unit 222 from the first and third servers 120 and 320. The communication unit 222 can transmit the data stored in the storage unit 221 to the third server 320.

  The third computer terminal 310 includes an input unit 311, a processing unit 312, a storage unit 313, a display unit 314, a communication unit 315, and the like. The input unit 311 is provided for inputting text and operating a pointer displayed on the display unit 314. The processing unit 312 is provided for performing various processes on the input data. The storage unit 313 is provided for storing the processing result by the processing unit 312 and the like. The communication unit 315 is provided for communicating with the server 220.

  The third server 320 includes a storage unit 321, a communication unit 322, and the like. The storage unit 321 stores data generated by the third computer terminal 310 and data received by the communication unit 322 from the second server 220.

Next, a quality analysis procedure by the quality analysis system will be described with reference to the flowchart of FIG.
Data (hereinafter also referred to as market quality information) indicating the occurrence location and cause of a defect that has occurred in a component part of a product measured by the measuring device 130 is input to the first computer terminal 110 by the communication unit 132 of the measuring device 130. (Transmission) is performed (step S11). The processing unit 112 of the first computer terminal 110 stores the received data indicating the occurrence location and the cause of occurrence in the storage unit 113.

The operator of the first computer terminal 110 operates the input unit 111 to determine the first market quality shown in FIG. 3 or FIG. 4 based on the cause of the failure and the location where the failure has occurred (or the defective part) sent from the measuring device. Create information. The created first market quality information is temporarily stored in the storage unit 113 of the first computer terminal 110 and then stored in the storage unit 121 of the first server 120 (step S13).
Here, the first market quality information of FIGS. 3 and 4 will be described. FIG. 3 shows printed circuit board quality information. If a defect has occurred on the substrate side, FIG. 3 is used as the first market quality information. The “component name” in FIG. 3 corresponds to a component reference on the printed circuit board and is unique on the printed circuit board. “Category” in FIG. 3 indicates a classification of the cause of the failure in the first market quality information, and is a classification for confirmation on the development side. “Number” in FIG. 3 indicates the number of defects. “Content” in FIG. 3 indicates the specific content of the defect. The bottom row of the table shown in FIG. 3 indicates the number of defectives whose contents are unknown.

  FIG. 4 shows the first market quality information of the casing. If a defect has occurred on the housing side, the operator of the first computer terminal uses the table shown in FIG. 4 as market quality information. “Coordinate values” in FIG. 4 are the three-dimensional coordinates of the defective portion measured by the measuring device shown in FIG. “Numerical values” in FIG. 4 is the number of defective occurrences with respect to the coordinate values. Further, “content” in FIG. 4 indicates specific contents of the defect. The bottom line of FIG. 4 shows the number of defects that could not be analyzed.

  Next, the first server 120 transmits brother 1 market quality information stored in the storage unit 121 to the second server 220 provided in the development / design department 200 (step S13). As shown in FIG. 5, the first market quality information is transmitted from the domestic / overseas sales base 100A and the maintenance department 100B to the second server 220 of the development / design department 200 via the network.

  The communication unit 222 of the second server 220 receives the first market quality information transmitted from the sales base / maintenance department 100 (step S21), and stores the first market quality information in the storage unit 221 (step S22).

  The storage unit 221 of the second server 220 of the development / design department 200 also stores design data of a printed circuit board and a case that are designed by a CAD (design support apparatus) and are a CAD model.

  Next, the processing unit 212 of the second computer terminal 210 generates second market quality information in which the information in the design data is associated with the first market quality information (step S23). If it is the 1st market quality information of the printed circuit board shown in FIG. 3, the information in the design data used as the reference | standard of a connection is a component reference, the components reference of the 1st market quality information and the printed circuit board data component of design data Second market quality information associated with the reference information is generated. In the case of the market quality information of the case shown in FIG. 4, the information in the CAD model that is a reference for linking is a three-dimensional coordinate value, and the coordinate value of the first market quality information and the case 3D data of the design data The second market quality information linked to the coordinate values is generated.

  Further, the processing unit 212 detects, based on the generated second market quality information, a location in the component where the failure due to the same occurrence occurs more than the set value (hereinafter also referred to as a failure quality location). Then, the third market quality information is generated by associating the detected location with the information in the design data. For example, the processing unit 212 detects a location where five or more solder defects have occurred. The reference to be linked is the same as in the case of generating the second market quality information.

  Next, the display unit 214 displays the CAD model on the display device based on the design data, the second market quality information, and the third market quality information (step S24). Display examples of the CAD model of the printed circuit board shown in FIG. 2 are shown in FIGS. As shown in FIGS. 6 and 7, the information included in the second market quality information and the third market quality information can be displayed on the CAD model. When the market quality information frame in the CAD model of FIG. 6 or 7 is selected, the detailed contents of the market quality information are displayed. By performing the display as shown in FIG. 6 or FIG. 7 on the display device, it is possible to confirm defects occurring in the components in the development design department.

  Further, as shown in FIG. 6, R1 which is a frequently occurring defect location detected by the processing unit 212 is displayed in a different color from other regions, and the frequently occurring defect location is displayed so that it can be easily understood by the operator.

  Further, by analyzing defects, it is possible to improve the CAD model and change the design, and to use this information as know-how for the next model. For example, it is possible to use knowing that a part with many defects is not adopted for the next model.

  The keywords N outside the CAD model shown in the lower left of FIG. 6 and FIG. 7 are classifications for which failure could not be determined, and the numerical value next to N is the number of failures that could not be determined. Since this information cannot be linked to the design data information, only the number is displayed outside the outer frame of the CAD model.

  Further, as shown in FIG. 8, it is possible to display only market quality information to be confirmed for each classification by controlling the check box on the right side of the figure.

  Furthermore, as shown in FIG. 9, in the development / design department 200, contours that are the results of CAE (Computer Aided Engineering) generally used in structural analysis, thermal fluid / heat conduction analysis, and power plane analysis are commonly used. It is also possible to superimpose the figure on the CAD model and further analyze the true cause of the failure from the tendency (step S25). As shown in FIG. 9, by superimposing the market quality information, CAD model, and contour diagram, the parts in the stressed part are defective due to the stress based on the tendency of the stress result of the structural analysis. Can be confirmed. By this method, the development / design department 200 side can use the CAD model and market quality information to not only improve the design quality but also control the quality of the next model.

  Market quality information linking data including design data, first market quality information, second market quality information, third market quality information, and contour diagrams is stored in the storage unit 221 of the second server 220 (step S26). .

  If the development / design department 200 further relates to the subcontract design destination 300, the market quality information link data can be provided to the department of the subcontract design destination 300. FIG. 10 shows a data flow when the market quality information linking data is provided to the outsourced design destination 300. As shown in FIG. 10, the market quality information link data is transmitted from the development / design department 200 to the outsourced design destination 300.

  When the market quality information linking data is sent to the subcontract design destination 300, the subcontract design destination 300 is given permission to view all of the second market quality information and the third market quality information included in the market quality information linking data. Instead, it is limited so that only the part related to the design can be viewed.

  The second server 220 transmits the market quality information linking data to the third server 320 of the subcontract design destination 300 when the defective part or the occurrence part is related to the design of an external department (company) (step S27). ). Here, when transmitting the market quality information linking data, the security added market quality information in which the security information is added to the market quality information linking data is transmitted so that only the portion designed by the subcontractor 300 can be viewed. Is done. Specifically, in order to limit the parts that can be browsed by the subcontract design destination 300, when the market quality information association data is stored in the storage unit 221 in step S26, the second market quality information and the third market quality information Information that protects information related to parts or parts that are not involved in the design by the outsourced design destination 300 is added.

  The third server 320 of the outsourced design destination 300 receives the market quality information association data to which the security information is added (step S31), and stores this market quality information association data in the storage unit 321. FIG. 11 shows a display example of market quality information linking data in which the information that can be browsed by the subcontract design destination 300 is limited. FIG. 11 is a display example of the market quality information linking data when only the quality information of “solder defect” is given the viewing authority. As shown in FIG. 11, only “solder failure” can be confirmed.

  Using the third computer terminal 310 of the outsourced design destination 300, the examination result is linked to the market quality information linked data. The examination result means comment information by the operator as described later. Market quality information linked data to which the examination results are linked is stored in the storage unit 321 and the stored data is transmitted from the third server 320 to the development / design department 200 (step S33). FIG. 12 shows a flow of data in which the examination result is incorporated in the outsourced design destination 300. As shown in FIG. 12, the market quality information link data is transmitted from the outsourced design destination 300 to the development / design department 200.

  The development / design department 200 adds the result of the examination based on the market quality information linking data provided from the subcontract design destination 300 to the market quality information linking data and stores it in the storage unit 221 (step S28). . A display example of the market quality information linking data is shown in FIG. As shown in FIG. 13, the review information “Comment: Due to frequent solder defects, parts are not used from the next model” is added to the display example of FIG. 12.

  Eventually, the development / design department 200 receives the result of the examination of the part designed by the subcontractor 300, can grasp the result, improve the current model, and control the design quality of the next model.

  According to this system, by visualizing the market quality information using CAD data at the design stage, based on the defects that occurred in the products shipped to the market, the improvement of the currently shipped products and the next shipment It is possible to provide information useful for improving the design quality of products. Further, by displaying the CAE contour map in duplicate, it becomes possible to analyze the cause of the market quality information as to why it has been broken.

  In addition, since the process for visualizing the market quality information by the second computer terminal 210 provided in the development / design department 200 of the present embodiment is realized by a computer program, a computer-readable storage medium Thus, the same effect as that of the present embodiment can be easily realized simply by installing it on a normal computer. Further, this computer program can be executed not only on a personal computer but also on an electronic device incorporating a processor.

  Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. Further, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, you may combine suitably the component covering different embodiment.

  DESCRIPTION OF SYMBOLS 100 ... Sales base / maintenance department, 110 ... 1st computer terminal, 120 ... 1st server, 130 ... Measuring equipment, 200 ... Development / design department, 210 ... 2nd computer terminal, 220 ... 2nd server, 300 ... Design outsourcing First, 310 ... third computer terminal, 320 ... third server.

Claims (9)

A quality analysis system comprising a quality information transmission device and a quality analysis device,
The quality information transmission device includes a transmission unit that transmits first quality information including a generation location and a cause of a failure that has occurred in a component having design data designed by a design support device in a product,
The quality analyzer is
Based on the occurrence location and the cause of occurrence in the first quality information transmitted by the transmission unit, the failure information indicating the occurrence location and the cause of occurrence is associated with the information indicating the part or position in the design data. 2 means for generating quality information;
Based on the defect information in the second quality information, a part in the component where a defect due to the same cause has occurred more than a set value is detected, and frequent failure information indicating the detected part and the design data Means for generating third quality information in association with information indicating a part or position in the medium,
Display means for displaying a model of the component part on a display device based on the design data, the second quality information, and the third quality information, and the location and cause of the failure based on the second quality information Display means for displaying on the display device information superimposed on the model, and displaying on the display device the defect occurrence information superimposed on the model based on third quality information. Quality analysis system.   The quality analysis apparatus is configured to display the part of the defect information based on the second quality information and the part of the defect frequent information based on the third quality information in order to disable display of the defect information and the defect frequent information. The quality analysis system according to claim 1, further comprising a protection means for protecting a part of the quality analysis system.   The quality analysis system according to claim 1, wherein the display unit displays a result of a simulation performed on the component part so as to overlap the model. A quality analysis method in a quality analysis system comprising a quality information transmission device and a quality analysis device,
Transmitting the first quality information including the occurrence location and the cause of the failure occurring in the component having the design data designed by the design support device in the product from the quality information transmitting device to the quality analyzing device;
Based on the occurrence location and the cause of occurrence in the first quality information, the second quality information in which the defect information indicating the occurrence location and the cause of occurrence and the information indicating the part or position in the design data are associated with the quality. Generated by the analyzer,
Based on the defect information in the second quality information, a part in the component where a defect due to the same cause has occurred more than a set value is detected, and frequent failure information indicating the detected part and the design data Generating the third quality information in association with the information indicating the part or the position in the quality analyzer,
A model based on the design data, superimposed on the model, information indicating the occurrence location and cause of the defect based on the second quality information, and superimposed on the model, the frequent occurrence of the defect based on the third quality information A quality analysis method characterized in that information is displayed on a display device by the quality analysis device.   The defect information and the defect in order to disable display of a part of information indicating the occurrence location and cause of the defect based on the second quality information and a part of the defect frequent appearance information based on the third quality information. The quality analysis method according to claim 4, wherein a part of the frequent information is protected.   The quality analysis method according to claim 4, wherein a result of a simulation performed on the component is displayed superimposed on the model. A program for causing a computer to execute a process of analyzing quality based on first quality information including the occurrence location and cause of a failure that has occurred in a component having design data designed by a design support device in a product. And
Based on the occurrence location and the cause of occurrence in the first quality information, second quality information is generated by associating the failure information indicating the occurrence location and the cause of occurrence with the information indicating the part or position in the design data. The procedure to execute the process,
Based on the defect information in the second quality information, a part in the component where a defect due to the same cause has occurred more than a set value is detected, and frequent failure information indicating the detected part and the design data A procedure for executing a process of generating third quality information in association with information indicating a part or position in the medium;
A model based on the design data, superimposed on the model, information indicating the occurrence location and cause of the defect based on the second quality information, and superimposed on the model, the frequent occurrence of the defect based on the third quality information A program for causing a computer to execute a procedure for executing a process of displaying information on a display device.   The defect information and the defect in order to disable display of a part of the information indicating the occurrence location and cause of the defect based on the second quality information and a part of the information that frequently appears based on the third quality information. The program according to claim 7, wherein the computer is caused to execute a procedure for executing a process for protecting a part of frequent information.   The program according to claim 7, wherein the computer is caused to execute a procedure for executing a process of displaying a result of a simulation performed on the component part on the model.

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