JP2010258131A - Method and device for trimming solar cell module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide trimming method and device for cutting down all excesses only by a cutting means and having the small exchange frequencies of edges. <P>SOLUTION: In the trimming method for a solar cell module, a holder track is set inside a side detected by a detecting means while the angle of the cutting means is adjusted so that the detected angle coincides with the angle of the abutting surface of the edge. In the trimming method for the solar cell module, the cutting means is moved obliquely towards the inside from the outside of the holder track as the other end side from one end side of the side of a module substrate, and a proceeding process of moving the cutting means up to the other end along the holder track and of cutting off the excesses on at least the other end side is carried out while abutting the abutting surface of the edge against the side of the module substrate when the cutting means reaches the side of the module substrate. In the trimming method for the solar cell module, a return process of moving the cutting means along the holder track from the other end side to one end side and of cutting off the residual excesses is carried out. The trimming device 1 carrying out the trimming method is obtained. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a trimming method and apparatus for removing a surplus portion of a sealing member attached to a module substrate of a solar cell module that protrudes from the periphery of the substrate in the manufacturing process of the solar cell module. The present invention relates to a method and an apparatus for trimming a solar cell module in which fine shavings do not sometimes scatter around and an end of a sealing member does not peel off.

Many solar cell modules 5 have a structure in which a photoelectric conversion element 6c, an electrode 6d, and the like are interposed between a module substrate 6 made of transparent glass and a sealing member 7 as shown in FIG. In a so-called thin film type solar cell module such as an amorphous silicon type, for example, a side opposite to the light incident surface (hereinafter sometimes referred to as the front surface) of the rectangular module substrate as the transparent insulating substrate (hereinafter referred to as the rear surface) A silicon thin film is formed using silane gas to form a photoelectric conversion element 6c, and an electrode 6d for taking out the electric power obtained by the photoelectric conversion element 6c is provided on the back side of the element 6c. It is set as the structure which adhered the sealing member 7 which protects the conversion element 6c and the electrode 6d.
Further, in a crystalline silicon type solar cell module such as a single crystal type or a polycrystalline type, so-called cells are electrically connected by lead wires, the surface is protected by a module substrate, and the back surface is protected by a sealing member. ing.

  As sealing member 7 affixed on the back surface side of said solar cell module, the 1st sealing part 71 which has adhesiveness, for example, and the sheet | seat for the weather resistance improvement adhering to the surface of this sealing part Although a two-layer structure having a second sealing portion 72 is known, the sealing member 7 is cut slightly larger than the module substrate 6 and then laminated on the back side of the module substrate 6. The first sealing portion 71 is melted and laminated in a predetermined shape while being bonded to the opposite surface side by being heated at a predetermined temperature under a predetermined pressure using a laminator, and then protruding from the module substrate 6 The excess part 7a is cut off and trimmed.

  This trimming operation was once performed manually, but in recent years, automation is also being sought. For example, after holding a sealed solar cell module on a trimming table, a module substrate is detected by a substrate detection means. And the outline of the substrate is detected, a cutting expected track that is slightly larger than the contour is set, and then the surplus portion is moved along the cutting planned track while moving the cutting means with respect to the solar cell module. A trimming method and apparatus for removing the remaining surplus portions by removing at least a part of the outline of the module substrate with a rotating polishing body is proposed (Patent Document). 1).

However, if the surplus portion remaining slightly by the above method is left unattended, there is a risk that the appearance deteriorates and the sealing member is peeled off from that portion and the photoelectric conversion element and the electrode are damaged. If the portion is polished, shavings may be scattered, the solar cell module may be soiled, and the work environment may be significantly impaired. Conventionally, the shavings are sucked up by a vacuum dust collector or the like, but at present, the scattering speed of the shavings is much higher than the suction speed by the vacuum dust collector, so it cannot be said to be an effective means.
As a method for solving such a problem, a method of cutting directly with a cutting means along the contour of the module substrate and trimming without using a rotating abrasive body can be considered. However, the dimensional accuracy of the module substrate is usually within 1/500 mm. For example, in the case of a module substrate of 910 × 455 mm, an error of about ± 1.82 mm is generated, so the position of the cutting means is mechanically determined. Is very difficult. If done forcibly, the cutting edge of the cutting means will be spilled when it comes into contact with the module substrate, and there is a high risk that the cutting means will need to be replaced frequently.

JP 2001-320069 A

  Therefore, as a result of continuing intensive research on a trimming method and apparatus that can cut off all excess portions with only the cutting means and that does not cause blade spills, the inventor cuts the cutting means when contacting the cutting means with the module substrate. Use the polishing means if you adjust the angle of the means, bring the flat part of the back surface from the blade edge to the back of the blade board into contact with the side of the module substrate, and press the cutting means against the side. As a result of finding that it is possible to cut off all of the surplus portion and that the blade spills are less likely to occur, and further researched, the present invention was completed.

In order to achieve the above object, claim 1 of the present invention provides a rectangular module substrate, a photoelectric conversion element that is provided on one surface side of the module substrate and performs photoelectric conversion, and the photoelectric device that is provided on the one surface side. An electrode for taking out the electric power obtained by the conversion element; and a sealing member that is attached to the one surface side to protect the photoelectric conversion element and the electrode, and an excess portion of the sealing member remains around the module substrate After the solar cell module is held on the trimming table, the position and angle of each side of the module substrate is detected by the substrate detecting means provided on the trimming table, and the substantially flat blade portion and the blade portion are held. A cutting means comprising a holder portion for moving the solar cell module along the detected side with respect to the solar cell module, so that the surplus portion is cut by the cutting means. In the ring method,
Cutting means is set so that the holder trajectory is set at the position of the side detected by the detection means or inside the side, and the detected angle coincides with the angle of the plane portion including the cutting edge on the inner surface of the blade part. The cutting means is moved from one end side to the other end side of the side of the module substrate and obliquely from the outside to the inside of the holder track, and when the cutting means reaches the side of the module substrate, While abutting the flat portion of the back surface of the blade portion with the side of the module substrate, the cutting means is moved to the other end along the holder track to perform an outward path step of cutting off at least the surplus portion on the other end side. And a trimming method of the solar cell module characterized by performing a return path step of moving the cutting means along the holder track from the other end side to the one end side to cut off the remaining surplus portion. .

  According to a second aspect of the present invention, a single blade is used as the blade portion of the cutting means, and the plane portion including the cutting edge on the inner surface of the blade portion is the entire back surface of the cutting means. The trimming method of the solar cell module described in 1.

  Claim 3 of the present invention is characterized in that different cutting means each having a blade portion composed of a single blade whose front and back are attached in the forward path step and the backward path step are used. The content of the trimming method is a solar cell module.

  According to claim 4 of the present invention, before the cutting edge is worn out and the sharpness is lowered due to wear of the blade edge, before severe cutting occurs and the sharpness is dropped beyond the allowable limit, or a certain number of solar cell modules are trimmed. 4. The method for trimming a solar cell module according to claim 1, wherein the blade portion is moved out upwardly or downwardly to feed out the blade edge.

  According to a fifth aspect of the present invention, the cutting means is tilted at an angle corresponding to the chamfering angle of the side of the module substrate, and the cutting means is mounted on the module substrate while the flat portion of the back surface of the blade portion is brought into contact with the chamfered slope. The method of trimming a solar cell module according to any one of claims 1 to 3, further comprising a chamfering step of cutting the surplus portion of the chamfered slope by moving the chamfered surface.

According to a sixth aspect of the present invention, a rectangular module substrate, a photoelectric conversion element that is provided on one side of the module substrate and performs photoelectric conversion, and an electric power that is provided on the one side and obtained by the photoelectric conversion element are taken out. A module holding means for providing a solar cell module comprising an electrode and a sealing member attached to the one surface side to protect the photoelectric conversion element and the electrode, wherein a surplus portion of the sealing member remains around the module substrate A trimming table that is detachably held, substrate detection means for detecting the position and angle of the module substrate side of the solar cell module held on the trimming table, a holder part and a blade part, In a trimming device for a solar cell module having cutting means that can move relative to the solar cell module, input means, and control means,
The cutting means rotates around an axis perpendicular to the top surface of the trimming table, and the angle of the blade can be adjusted.The input means determines the position of the side of the module board and the distance between the holder track, the cutting point, and the cutting angle. Based on the side angle information obtained by the board detection means and the shape information of the blade part, the control means calculates the angle of the plane part including the blade edge on the inner surface of the blade part as the angle of the side of the module board. On the basis of the position information obtained by the board detection means, the position of the side of the module board inputted from the input means, and the distance information of the holder orbit. A function for setting the holder trajectory inside the side, a function for setting the introduction trajectory based on the set holder trajectory information, the incision point information input from the input means, and the incision angle information, As a path step, the cutting means moves from a cutting point provided near one end of the side of the module substrate until it contacts the side of the module substrate along the introduction track, and from the contacted position onto the holder track And a function of controlling the driving means so that the cutting means moves from the other end side to the one end side as a return path step. The content of the trimming device for the solar cell module is as follows.

  According to a seventh aspect of the present invention, the blade portion of the cutting means is a single blade, and the plane portion including the cutting edge on the inner surface of the blade portion is the entire back surface of the cutting means. The content of the trimming device for the solar cell module is described.

  Claim 8 of the present invention has a cutting means for the forward path process and a cutting means for the backward path process, and each blade part is a single blade whose blade mounting direction is reversed in the front-rear direction. The content of the trimming device is a solar cell module.

  The solar cell module according to any one of claims 6 to 8, wherein a feeding mechanism for feeding the blade edge by moving the blade portion in either the upper or lower direction is provided. The trimming device is the content.

  The solar cell module according to any one of claims 6 to 8, wherein the solar cell module according to claim 10 has a blade portion capable of adjusting a rotation angle about an axis parallel to a traveling direction of the cutting means. The trimming device is the content.

  The trimming method and apparatus for a solar cell module according to the present invention adjusts the angle of the cutting means and includes a flat surface portion (hereinafter sometimes referred to as a contact surface) including the blade edge on the inner surface of the blade portion of the cutting means. Since the surplus part is excised by abutting the side of the module substrate and further pressing the cutting means against the side and then moving the cutting means relative to the solar cell module, the surplus part without using a polishing device or the like. Can be cut off completely, and shavings are not scattered, so that the solar cell module can be prevented from being contaminated and the working environment can be prevented from deteriorating. Further, since the load at the time of cutting is distributed over the entire back surface, the impact on the blade edge is reduced, and the risk of blade spillage is greatly reduced. Furthermore, even if there is an error between the actual position of the side of the module board and the measured value, the error is absorbed as bending of the cutting means, the driving means, etc. Can be excised cleanly.

  If the surplus part is cut diagonally with respect to the side of the module board, even if the path of cut is slightly shifted, there is no danger of collision with the adjacent side perpendicularly and applying a large impact to the blade edge, resulting in blade spillage. Hateful. In addition, since it is not necessary to set the cutting point (the point where the blade part is first inserted into the surplus part) exactly above the side, a general-purpose product that does not have high accuracy is sufficient for the device used as the substrate detection means. Yes, the surplus part can be excised easily and inexpensively. It should be noted that the surplus portion remaining on one end side when cutting from one end side to the other end side (forward path) can be cut off when cutting from the other end side to one end side (return path).

  If a single-edged cutting means is used and the entire back surface is pressed against the side of the module board, the contact area between the cutting means and the side of the module board will be the largest, so the angle of the cutting means will be distorted when cutting forwards. Therefore, the risk of contacting the peripheral surface with the blade edge alone is minimized, and therefore the risk of blade spillage is also reduced. In addition, since the bending margin of the blade portion is the largest, the deflection margin of the entire device is increased accordingly, and an error between the actual position of the module board side and the measured value is also greatly allowed. Since the accuracy of measuring the angle and the calculation accuracy of the holder trajectory based on the measurement result are sufficient, the excess portion can be cut off more easily and inexpensively.

  When cutting off the surplus part by reciprocating the cutting means, if different blade parts are used with the blade mounting direction reversed in the forward and backward paths, the entire back surface is placed on the side of the module board in both the forward and backward paths. Since it becomes possible to press, the surplus part can be excised more easily and inexpensively. .

  Before the blade edge wears out and the sharpness falls below the allowable limit, severe blade sharpening occurs and the sharpness falls beyond the allowable limit, or after trimming a certain number of solar cell modules, the blade part is moved upward or downward If the blade edge is drawn out and moved, the cutting of the surplus portion 7a can be continued using the portion where the sharp edge is not sharpened and the sharpness is not lowered. Therefore, the blade portion 3b can be effectively used by substantially using the entire blade edge 3d. The replacement frequency can be greatly reduced, the operation rate can be kept high, and the cost can be reduced.

  When the cutting means is inclined at an angle corresponding to the chamfering angle of the side of the module substrate, the flat part of the back surface of the cutting means is brought into contact with the chamfered slope, and the excess part is cut off in advance, and the part that is easily peeled off is cut off in advance. Therefore, the risk of the protective member peeling off from the end portion and damaging the photoelectric conversion element and the electrode is reduced.

FIG. 1 is a plan view showing an embodiment of a trimming apparatus of the present invention. FIG. 2 is a plan view of the solar cell module before trimming. FIG. 3 is a plan view in which the solar cell module before trimming is placed on the trimming apparatus of the present invention. FIG. 4 is a schematic explanatory view showing a scene of cutting the surplus part by bringing the side of the module substrate into contact with the contact surface of the blade part, (a) is a view seen from the front side in the traveling direction of the cutting means, (B) is the figure seen from the outer side surface, (c) is the figure seen from the normal direction lower side of the solar cell module. FIG. 5 is an explanatory view showing the adjustment of the angle of the blade centered on the vertical axis, (a) is a view of the blade portion as seen from the face with a beak, and (b) is a view of (a) from below. FIG. FIG. 6 is an explanatory diagram of the path of the cutting means in the forward path process. FIG. 7 is an explanatory diagram of another path of the cutting means in the forward path process. FIG. 8 is an explanatory diagram of the path of the cutting means in the return path process. FIG. 9 is a schematic diagram showing the angle of the blade part when performing the forward path process and the backward path process with a blade part composed of a single blade, (a) is a diagram showing the forward path process with the back surface of the blade part as the contact surface; (b) is a diagram showing a return path process using the same blade part as (a) with the part from the blade edge to the ridge as a contact surface, and (c) is a blade composed of a single blade whose front and back is opposite to that of (a). The figure which shows the return path | route process which used the part and used the back surface of the blade part as the contact surface, (d) is a figure which shows the outward path | route process and the return path | route process using the blade part of the double blade in which the blade was provided in both front and back. FIG. 10 is a schematic diagram showing the angle of the blade portion when the forward path step (a) and the backward path step (b) are performed with a blade portion including both blades provided with blades on both the front and back sides. FIGS. 11A and 11B are schematic diagrams showing the orientation of the blade portion when performing the forward path process and the backward path process by vertically inverting the blade section composed of a single blade. Fig.12 (a) is a figure which shows the commercially available cutter used as a blade part in an Example, FIG.12 (b) is a figure which shows the cutter which consists of a single blade whose attachment direction of a blade is front and back reverse to (a). is there. Fig.13 (a) is a top view which shows the example of the blade part which can be used conveniently by this invention, (b) is AA sectional drawing of (a), (c) is the blade part of (a). It is explanatory drawing which shows the cutting | disconnection means formed by attaching to a holder part. FIG. 14 is a schematic diagram showing the inclination of the cutting means when the forward path step (a) and the backward path step (b) are performed using the blade portion of FIG. 15A and 15B are explanatory views showing the adjustment of the angle of the blade portion around the parallel axis. FIG. 15A is a view of the blade portion as viewed from the surface with the ridges, and FIG. 15B is a view of FIG. It is the figure seen from the front side. FIG. 16 is an explanatory view showing a process of cutting off the surplus portion by bringing the contact surface into contact with the chamfered slope. FIG. 17 is a schematic cross-sectional view showing the solar cell module before trimming.

The trimming method of the solar cell module of the present invention was obtained by using a rectangular module substrate, a photoelectric conversion element that is provided on one surface side of the module substrate to perform photoelectric conversion, and a photoelectric conversion element that is provided on the one surface side. Trimming a solar cell module comprising an electrode for taking out electric power and a sealing member that is attached to the one surface side and protects the photoelectric conversion element and the electrode, and an excess portion of the sealing member remains around the module substrate After being held on the table, the position and angle of each side of the module substrate is detected by the substrate detecting means provided on the trimming table, and the substantially flat blade portion and the holder portion for holding the blade portion are detected. The cutting means is moved along the detected side with respect to the solar cell module, so that the excess portion is cut by the cutting means. In the ring method,
Cutting means is set so that the holder trajectory is set at the position of the side detected by the detection means or inside the side, and the detected angle coincides with the angle of the plane portion including the cutting edge on the inner surface of the blade part. The cutting means is moved from one end side to the other end side of the side of the module substrate and obliquely from the outside to the inside of the holder track, and when the cutting means reaches the side of the module substrate, While abutting the flat portion of the back surface of the blade portion with the side of the module substrate, the cutting means is moved to the other end along the holder track to perform an outward path step of cutting off at least the surplus portion on the other end side. Further, the present invention is characterized in that a return path step is performed in which the cutting means is moved along the holder track from the other end side to the one end side to cut off the remaining surplus portion.

Moreover, as shown in FIG. 1, the trimming device 1 for a solar cell module of the present invention includes a rectangular module substrate 6, a photoelectric conversion element 6 c that is provided on one surface side of the module substrate 6 and performs photoelectric conversion, An electrode 6d that is provided on the one surface side and takes out the electric power obtained by the photoelectric conversion element 6c; and a sealing member 7 that is attached to the one surface side and protects the photoelectric conversion element 6c and the electrode 6d. A trimming table 2 that removably holds the solar cell module 5 in which the surplus portion 7a of the sealing member 7 remains around the substrate 6 by the module holding means 2a, and a solar cell module 5 that is held on the trimming table 2 A solar cell module on the trimming table 2 includes a substrate detection means 2b for detecting the position and angle of the side 6a of the module substrate 6, a holder portion 2a, and a blade portion 2b. The cutting means 3 can be moved relative to Lumpur 5, an input unit, the trimming apparatus 1 of the solar cell module and a control unit 4,
The cutting means 3 rotates about an axis A1 perpendicular to the upper surface of the trimming table 2, and the angle of the blade 3b can be adjusted. The input means is the distance between the position of the side 6a of the module substrate 6 and the holder track Th. The cutting point P and the cutting angle can be input, and the control means 4 includes the cutting edge on the inner surface of the blade portion 3b based on the side angle information and the blade shape information obtained by the substrate detection means 2b. A function of setting the angle of the planar portion 3g to coincide with the angle of the side 6a of the module substrate 6, the position information of the side obtained by the substrate detection means 2b, and the position of the side of the module substrate input from the input means A function of setting the holder trajectory Th directly above or inside the side based on the distance information of the holder trajectory, the set holder trajectory information, and the cutting point information input from the input means, The function of setting the introduction trajectory Ti based on the insertion angle information, and the module substrate along the introduction trajectory Ti from the cutting point P provided near the one end side of the side 6a of the module substrate 6 as a forward path process. A function of controlling the driving means 2d and 2e so as to move from the contacted position to the other end side along the holder trajectory Th, and cutting as a return path process. And a function of controlling the driving means 2d and 2e so that the means 3 moves from the other end side to the one end side.

  As the solar cell module 5 trimmed by the solar cell module trimming method and apparatus 1 of the present invention, for example, as shown in FIG. 17, an amorphous silicon solar cell module or a crystalline silicon type conventionally used as a solar cell is used. Examples of the solar cell module include a module substrate 6 in which a hard transparent member such as glass is used.

  The sealing member 7 used in such a solar cell module 5 is cut larger than the module substrate 6 as shown in, for example, FIG. 2, or the end of the module substrate 6 when pressed for sticking. Since the surplus part 7a discharged like a burr | flash from a part will be formed and it will cause the peeling accident of the sealing member 7, it is necessary to cut off this surplus part 7a in the case of commercialization.

In order to cut off the surplus portion 7a, in the present invention, first, the position and angle of the side 6a of the module substrate 6 are measured, and the holder trajectory Th is set based on the measured value and the length of the separately input pressing margin, The surplus portion 7a is cut off by relatively moving the cutting means 3 along the holder trajectory Th.
In order to measure the position and angle of each side 6a of the module substrate 6, first, the solar cell module 5 is placed on the trimming table 2 as shown in FIG. In order to prevent the module 5 from moving, the module holding means 2a such as a vacuum suction device is used, and in this state, each side 6a of the module substrate 6 is used using the substrate detection means 2b such as a CCD camera and an image analyzer. Detect the position and angle.

  The trimming table 2 in the present invention is a work table for trimming the solar cell module 5, and at least the module holding unit 2 a, the substrate detection unit 2 b, and the cutting unit 3 are installed nearby, and if necessary, module moving unit, Rotating means or the like (not shown) is provided.

Examples of the module holding means 2a that can be used in the present invention are mounted on the trimming table 2, such as a vacuum suction device, a holding mechanism that holds and fixes the opposite sides 6a, and a clip mechanism that holds the front and back of the solar cell module 5. Any means can be used as long as it can hold and fix the solar cell module 5 so as not to move when the surplus portion 7a is cut.
In this embodiment, as the module holding means 2a, 6 × 6 = 36 vacuum suction devices are installed on the trimming table 2, the solar cell module 5 is placed on the vacuum suction device, and The solar cell module 5 is controlled by the control means 4 so as to be vacuum-sucked when it is necessary to hold and fix the solar cell module 5.

  The substrate detection means 2b that can be used in the present invention is not particularly limited as long as the position and angle of the side of the module substrate 6 can be detected, but it is easy to use a CCD camera and its image analysis apparatus. Specifically, the CCD substrate is used to photograph the vicinity of the periphery of the module substrate 6 from the light receiving surface side of the solar cell module 5 (three locations per side in FIG. 1), and the image data is subjected to image analysis to obtain the module substrate 6. And the position of the boundary of the surplus portion 7a that protrudes to the outside. Note that since the module substrate 6 and the surplus portion 7a have different color tones when viewed from the light receiving surface side of the solar cell module 5, when the image photographed by the CCD camera is image-analyzed, the portion where the color tone has changed is compared with the module substrate 6 and the surplus portions. It can be recognized as the boundary of 7a. The obtained position data of several boundaries are connected to obtain one line of data, and the position and angle are estimated to be the position and angle of the side 6a of the module substrate 6.

  In the present invention, the position information of the side 6a of the module substrate 6 obtained as described above, the position of the side of the module substrate input by the separate input means, and the distance between the holder tracks (hereinafter referred to as the pressing margin length). The holder trajectory Th is set based on (Yes). Here, if the holder trajectory Th is to be set just at the position of the side 6a in order to cut out the surplus portion 7a, detailed information on the position and angle of the side 6a is required. As the angle information is desired, the expensive substrate detection means 2b is required, which increases the cost. Therefore, in the present invention, when an error is expected in the information obtained by the substrate detection means 2b to be used, the holder trajectory Th is set on the inner side of the side 6a by the pressing length. In the present invention, “inside” means the center direction of the module substrate 6.

  That is, in the present invention, the surplus portion is not necessarily cut by the holder track Th, and when the holder track Th is set inside the side 6a, the holder track can be bent by bending the cutting means 3 or the drive means. The surplus portion 7a is cut outside Th. Further, the blade 3b of the cutting means 3 is pressed against and closely contacts the side 6a of the module substrate by the elastic restoring force of the cutting means 3 and the driving means 2d, 2e, etc., and the cutting means 3 is in this state. Since all the surplus parts 7a are cut away only by moving, it is not necessary to use polishing means or the like.

The cutting means 3 that can be used in the present invention has at least a blade part 3b for cutting the surplus part 7a and a holder part for holding the blade part and adjusting the angle of the blade part 3b as necessary. In the present invention, as described above, since the measurement error due to the substrate detecting means 2b is absorbed by bending the cutting means 3 and the driving means 2d, 2e, etc., a substantially flat blade that is easily bent is used as the blade portion 3b. It is done.
In other words, in the present invention, the length of the range in which the cutting means 3 and the drive means 2d, 2e, etc. are bent at the maximum can be set as the pressing length, and an error corresponding to the pressing margin is allowed. Therefore, if the holder trajectory Th is set on the inner side as much as the side 6a than the side 6a, the surplus portion 7a can be actually cut at the position of the side 6a.

The specific pressing margin length is not particularly limited, and is appropriately determined according to the bending margin of the cutting means 3 and driving means 2d and 2e to be used, the expected dimensional error of the module substrate 2a, and the dimensional error of the substrate detecting means 2b. Just do it. Further, if a buffer mechanism composed of a leaf spring, a coiled spring, a compressed air cylinder, etc. is provided at an appropriate position such as between the cutting means 3 and the drive means 2d, 2e, the trimming apparatus 1 as a whole is bent by the amount of the deflection or stroke. The deflection margin increases, and the pressing margin can be set large.
However, the larger the pressing margin, the stronger the pressure applied to the cutting means 3 and the driving means 2d and 2e, and the risk of causing spillage of the blade portion 3b and seizure of the drive motor used for the driving means increases. The pressing margin is determined within a range in which the pressing does not exceed the strength of the blade used as the blade portion 3b and the standard of the driving motor used for the driving means.

  As the input means (not shown) for inputting the pressing margin etc., a keyboard, a numeric keypad, a pointing device, etc. that are normally used for inputting numerical values are all suitably used and are not particularly limited. Also, a mechanism that does not require manual input and always automatically inputs a constant value may be used as the input means.

As described above, in the present invention, except when the holder track Th can be set at the position of the side 6a of the module substrate, the blade portion 3b is pressed against the module substrate 6 and the pressing force is applied to the blade portion 3b. In this case, however, the blade edge 3d may be rubbed against the module substrate 6 to cause blade sharpening. In order to reduce the possibility of such blade curling, in the present invention, the angle of the blade portion 3b is adjusted based on the angle information of the side 6a obtained by the substrate detecting means 2b, and as shown in FIG. The angle of the flat surface portion 3g including the cutting edge 3d on the inner side surface of the portion (hereinafter sometimes simply referred to as the contact surface 3g) is made to coincide with the angle of the side 6a, and the contact surface 3g is aligned with the side 6a of the module substrate. Make contact. In this way, the pressure when pressing the blade portion 3b against the module substrate 6 does not concentrate only on the blade edge 3d, but is distributed over the entire abutting surface 3g, so that the risk of blade cutting is reduced.
Further, as described in FIG. 5, the holder portion 3a is pivotable about an axis A1 perpendicular to the upper surface of the trimming table, so that the angle of the contact surface 3g of the blade portion is the angle of the side 6a of the module. The angle of the blade portion 3b can be adjusted by the control means 4 so as to match.
The length of the contact portion between the contact surface 3g and the side 6a of the module substrate is preferably as long as possible. A single-edged blade is used as the blade portion 3b, and the entire back surface 3c (surface without wrinkles) is defined as the contact surface. Although it is most preferable, it is also possible to use the part from the blade edge 3d to the flange 3e as the contact surface 3g regardless of a single blade or both blades.

In the present invention, in a state where the contact surface 3g is in contact with the side 6a of the module substrate, the cutting means 3 is moved with respect to the solar cell module 5 along the holder track Th to cut off the surplus portion 7a. At this time, the solar cell module 5 is usually fixed on the trimming table and cut by moving the cutting means 3, but conversely, the cutting means 3 side is fixed and the solar cell module 5 side is moved. You may let them.
In the embodiment shown in FIG. 1, the solar cell module 5 on the trimming table 2 is fixed by attaching the cutting means 3 to the X-axis slide unit 2d and the Y-axis slide unit 2e installed on the trimming table 2. The cutting means 3 is moved.

  However, when the holder track Th is set on the inner side of the side 6a of the module substrate, the incision point P (refers to the point where the blade 3b of the cutting means 3 is inserted into the surplus portion 7a; the same applies hereinafter) on the holder track Th. Can not be set. When the position of the side 6a is accurately measured and the holder trajectory Th is set at the position of the side 6a of the module substrate, the incision point P can be set on the holder trajectory Th. It is extremely difficult to accurately measure the position of the side 6a. Therefore, as shown in FIG. 6, the incision point P is set to the outside of the side 6a of the module substrate, the introduction trajectory Ti that advances from the incision point P toward the holder trajectory Th is set, and the blade portion 3b is connected to the module substrate. If the side 6a is reached and then cut along the holder trajectory Th, the surplus portion 7a can be easily removed.

On the other hand, as described above, in the present invention, the angle of the abutting surface 3g is made to coincide with the angle of the side 6a of the module substrate 6, and therefore, if the vertical direction is advanced from the incision point toward the holder track Th, the surplus portion 7a Is sandwiched between the abutment surface 3g and the side 6a of the module substrate, so that it is difficult to cut further, or the surplus portion 7a sandwiched between the abutment surface 3g and the module substrate 6 is on the back side of the solar cell module 5 May cause the sealing member 7 to peel off. In order to prevent this, the introduction trajectory Ti is an oblique trajectory from one end side to the other end side of the side of the module substrate and from the outside to the inside of the holder trajectory Th. The angle formed between the introduction track Ti and the holder track Th is preferably as shallow as possible near the point where the blade portion 3b reaches the side 6a of the module substrate 6, but the distance between the contact surface 3g and the side 6a of the module substrate 6 is smaller. When the distance is far, there is no particular problem even if the angle of cutting is deep, so as shown in FIG. 7, the angle may be deepened at the start of cutting, and may be advanced in a curved line that becomes shallower as it approaches the holder trajectory Th.
The introduction trajectory Ti is set by the control means based on the holder trajectory Th and the position information and the cutting angle of the cutting point P input from the input means.
In addition, as described above, the cutting means 3 is cut from one end side to the other end side of the side 6a of the module substrate 6 and obliquely from the outside to the inside of the holder track Th, so that the cutting means 3 is side 6a of the module substrate 6. The process of cutting along the holder trajectory Th when reaching is called the forward path process.

By performing the forward path step, the surplus portion 7a can be completely removed on the other end side (the traveling direction side of the cutting means 3), but the surplus portion 7a remains on the one end side (the opposite side in the traveling direction). In order to cut off the surplus portion 7a remaining on the one end side, as shown in FIG. 8, the cutting means 3 may be moved along the holder track Th from the other end side to the one end side. The process of cutting from the other end side to the one end side is referred to as a return path process.
When the return path process is performed, since the surplus portion 7a on the other end side has already been removed, it is very easy to bring the contact surface 3g into contact with the side 6a of the module substrate. In order to cut off the surplus portion 7a remaining on one end side, the cutting means 3 may be moved linearly with the contact surface 3g being in contact with the side 6a of the module substrate.

As described above, it is preferable to use a single blade as the blade portion 3b of the cutting means 3 and use the entire back surface 3c as the contact surface 3g. However, the moving direction of the cutting means 3 in the forward path process and the return path process is as described above. Therefore, the forward path process and the backward path process cannot be performed by using one kind of blade 3b in the same manner. Therefore, as schematically shown in FIGS. 9, 10, and 11, the blade 3b used in the forward path process (FIG. 9A) is used in the return path process by changing the rotation angle around the vertical axis A1. (FIG. 9 (b)), or different cutting means having a blade portion 3b composed of a single blade whose front and back is reversed (FIG. 9 (c)). A cutting means having a bladed portion 3b of a connected two-edged blade is used (FIG. 9 (d)), or a bladed portion 3b having blades on both the front and back sides is used at different angles in the forward path process and the backward path process. (FIGS. 10A and 10B), or a method of using the blade 3b used in the forward path process by rotating it halfway upside down (FIGS. 11A and 11B). However, in the method of FIG. 9B, the contact surface becomes small in the return path process, the cutting edge is likely to be chipped, and the sharpness of the blade is deteriorated. In the method of FIG. In the case of drowning, it is necessary to replace the other blade even when it is safe. This increases the cost, and the method of FIG. 10 makes the abutment surface small and the cutting edge tends to be chipped. In the method of FIG. Alternatively, since the mechanism for half-rotating the module substrate 6 becomes complicated and costs increase, there is a difference in having a blade portion 3b having a single blade whose front and back are reversed as shown in FIG. 9C. The method of using the cutting means in the return path step is most preferable.
In the embodiment shown in FIG. 1, single blades (see FIG. 12) in which the blade mounting directions are different from each other in the forward path process and the backward path process are used. More specifically, a commercially available special shape blade (manufactured by NT Cutter, product number: BM-1P) is used as the blade portion 3b of the forward path process cutting means 31, and the blade section 3b of the backward path process cutting means 32 is described above. A blade having a shape in which the blade mounting direction is reversed in the front-rear direction is used as the blade portion 3b for the cutting means 31 for the forward process. In the figure, “maru” is a mounting hole.

If the above-mentioned blade part is severely worn or if the cutting edge 3d is greatly worn out and the sharpness is reduced, if the blade part 3b can be moved in either the upper or lower direction, the blade will be worn. Since the excision of the surplus portion 7a can be continued using the portion where the sharpness is not lost, the replacement frequency of the blade portion 3b can be greatly reduced by effectively using substantially the entire blade edge 3d, and the cost can be reduced. This vertical movement of the blade portion 3b is permitted by, for example, providing a holder for adjusting the position of the blade portion 3b on the holder portion 3a, etc., and causing severe blade sharpening before the cutting edge is worn out and the sharpness falls below the allowable limit. The trimming device 1 is stopped and the position of the blade portion 3b is manually adjusted before the sharpness drops beyond the limit, that is, after it is confirmed that the sharpness deterioration is just before the allowable limit. Preferably, the feeding mechanism (not shown) is configured so that the blade edge 3b is moved by moving the blade portion 3b up or down by a constant width by remote control using an input means or the like. Is provided. Alternatively, the feeding mechanism may trim the predetermined number of solar cell modules 5 and then automatically move the blade portion 3b in a vertical direction to feed the blade edge by a certain width.
Here, “above or below the blade portion 3b” refers to one side or the other side in the extending direction of the blade edge 3d, and has nothing to do with the position or angle at which the blade portion 3b is installed.

As described above, when the blade portion 3b can be moved in either the upper or lower direction, the preferable shape of the blade portion 3b is as shown in FIGS. 13 (a) and 13 (b). Examples are long rectangular blades with blades attached to each other, both of which are provided on the same side, and whose both ends in the length direction can be connected to the holder portion 3a.
More specifically, in the present invention, the consumption speed of the blade edge 3d is different between the forward path process and the backward path process, but when the blade portion 3b having the shape as described above is used, the forward path process is n times (for example, twice) the return path process. When the cutting edge 3d is consumed at a speed, when n / n + 1 (2/3 in the above example) of the entire cutting edge 3d is consumed in the forward path process, 1 / n + 1 (1 / n in the above example) of the entire cutting edge 3d in the return path process. 3) is exhausted. That is, the cutting edge 3d on the forward path side remains by 1 / n + 1 (1/3 in the above example) and the cutting edge 3d on the backward path side remains by n / n + 1 (2/3 in the above example). When the blade portion 3b is turned over to replace the blade portion 3b with the holder portion 3a so that the blade tip 3d that has been used in the return path process is used on the forward path process side, all the blade edges 3d can be used effectively. .

  When using the blade part 3b of the two-blade as described above, the cutting means 3 can rotate about the axis A2 perpendicular to the back surface 3c (contact surface 3g) as shown in FIG. Then, as shown in FIG. 14A, it is preferable that the cutting means 3 is inclined as shown in FIG. By doing so, a force is applied to the sealing member 7 in the direction of pressing toward the module substrate 6 at the time of cutting, so there is no risk that the sealing member 7 is peeled off from the module substrate 6 by the pressure at the time of cutting.

In this type of solar cell module 5, the side 6 a of the module substrate 6 is generally chamfered, but in order to prevent the sealing member 7 from being peeled off, the surplus portion 7 a remaining on the chamfered slope 6 b is also removed. Is preferred. For this purpose, the cutting means 3 is inclined at an angle corresponding to the chamfering angle of the side 6a of the module substrate, and the cutting means is connected to the module substrate while the contact surface 3g of the blade portion 3b is brought into contact with the chamfered inclined surface 6b of the module substrate. What is necessary is just to move with respect to the board | substrate 6. FIG. In addition, the process of excising the excess part on a chamfering slope is called a chamfering process.
Further, in order to be able to perform a chamfering step of cutting off the surplus portion 7a of the chamfered slope 6b, as shown in FIG. 15, the rotation angle of the blade portion 3b with the parallel axis A3 as the center can be adjusted. What is necessary is just to comprise.

As shown in FIG. 16, the chamfering process is substantially the same as the above-described method for cutting the surplus portion 7a outside the side 6a of the module substrate, except that the cutting means 3 is inclined according to the chamfering angle. That is, since it is difficult to accurately measure the position and angle of the chamfered slope 6b, the position and angle of the side 6a of the module substrate is measured to determine the chamfer angle (usually around 45 °) and the thickness of the module substrate 6 and the like. The estimated values of the chamfered slope position and angle are obtained by correcting the measured values accordingly, and the holder trajectory Th is within the estimated value and within the bending range of the cutting means 3 and the drive means 2d and 2e. Is set, and the cutting means 3 is tilted to an angle corresponding to the chamfer angle (usually 45 °), and then the cutting means is moved relative to the module substrate. In this way, the error in the estimated value is absorbed as the bending of the cutting means 3, the drive means 2d, 2e, etc., together with the difference in position between the holder trajectory Th and the actual chamfered slope 6b. The part 7a can be excised cleanly.
Further, as in the case of removing the surplus portion 7 a outside the side 6 a of the module substrate 6, the chamfering process may be performed in two ways, the forward path and the return path.

  A suction means 2c for sucking chips cut by the cutting means 3 may be provided behind the cutting means 3 in the traveling direction. Thereby, since it can be suction-cleaned simultaneously with excision of the surplus part 7a, chips are not scattered and it is hygienic. Note that the chips generated in the present invention do not scatter unlike the chips generated from the polishing means, and therefore can be easily sucked by a normal suction device.

  The sheet-like member used as the sealing member 7 of the solar cell module 5 is often provided with a metal layer such as an aluminum layer in order to improve weather resistance, water resistance, moisture resistance, and the like. In such a case, when a normal blade is used as the blade portion 3b, the cutting speed becomes slow, or a strong force is required for cutting, and the blade portion 3b becomes sharp and becomes sharp. In some cases, the sealing member 7 may be peeled off. In order to avoid such inconvenience, an ultrasonic oscillator knife connected to the cutting means 3 and ultrasonically vibrating the blade portion 3b is used, or a heating means such as an electric heater is connected to the blade portion. It is preferable to use a heat knife in which 3b is heated so that it can be cut at a high speed with a light force.

  The above steps may be performed all at once while the solar cell module 5 is fixed on the one trimming table 2 provided with the cutting means 31 for the forward path process and the cutting means 32 for the backward path process. Are divided into a plurality of processes having the same working time, and a separate trimming device 1, 1... Is provided for each of these processes, and each time one process is completed, the solar cell module 5 being processed is processed. May be sent all at once to the trimming apparatus 1 for performing the next step. For example, by using the first trimming apparatus 1 provided with the cutting means 31 for the forward path process and the second trimming apparatus 1 provided with the cutting means 32 for the backward path process, the unprocessed solar cell module 5 is first trimmed. It is possible to fix on the apparatus 1 and perform the forward path process, and then transfer it to the second trimming apparatus 1 to perform the backward path process. Thereby, working efficiency increases and a large amount of solar cell modules 5 can be trimmed.

  As described above, according to the trimming method and apparatus of the solar cell module of the present invention, the holder trajectory is set at the position of the side detected by the detecting means or inside the side, and the detected angle is the blade portion. The angle of the cutting means is adjusted so as to coincide with the angle of the plane portion including the cutting edge on the inner surface of the module, and the cutting means is moved from one end side to the other end side of the side of the module substrate and from the outside to the inside of the holder track. When the cutting means reaches the side of the module substrate, the cutting means is moved to the other end along the holder track while bringing the flat portion of the back surface of the blade portion into contact with the side of the module substrate. A forward path step is performed to remove at least the surplus portion on the other end side, and then the cutting means is moved from the other end side to the one end side along the holder track to remove the remaining surplus portion. By configuring so that the process is performed, the error between the actual position of the side of the module board and the measurement value by the board detecting means is absorbed as the bending of the cutting means, the driving means, etc. Since it can be excised and does not require polishing means or the like and does not disperse polishing debris, it is useful as a trimming method and apparatus for excision of surplus portions as finishing when manufacturing a solar cell module.

DESCRIPTION OF SYMBOLS 1 Trimming device of solar cell module 2 Trimming stand 2a Module holding means 2b Substrate detection means 2c Suction means 2d Driving means (X-axis slide unit)
2e Drive means (Y-axis slide unit)
3 Cutting means 31 Cutting means for forward path process 32 Cutting means for backward path process 3a Holder part 3b Blade part 3c Back surface 3d Blade edge 3e 鎬 3g Plane portion including blade edge on inner surface of blade part (contact surface)
4 control means 5 solar cell module 6 module substrate 6a side 6b chamfered slope 6c photoelectric conversion element 6d electrode 7 sealing member 71 first sealing part 72 second sealing part 7a surplus part 8 protective layer A1 perpendicular to the upper surface of the trimming table Axis (vertical axis)
A2 Axis perpendicular to back surface 3c (contact surface 3g) A3 Axis parallel to traveling direction (parallel axis)
P Incision point Ti Introduction trajectory Th Holder trajectory

Claims (10)

A rectangular module substrate, a photoelectric conversion element that is provided on one side of the module substrate and performs photoelectric conversion, an electrode that is provided on the one side and that takes out the electric power obtained by the photoelectric conversion element, and is covered on the one side. And a sealing member that protects the photoelectric conversion element and the electrode and holds the solar cell module on which the surplus portion of the sealing member remains around the module substrate on the trimming table, and then the trimming table. The position and angle of each side of the module substrate is detected by the provided substrate detection means, and a cutting means comprising a substantially flat blade portion and a holder portion for holding the blade portion is detected along the detected side. In the method for trimming the solar cell module in which the surplus part is removed by the excision means by moving the solar cell module,
Cutting means is set so that the holder trajectory is set at the position of the side detected by the detection means or inside the side, and the detected angle coincides with the angle of the plane portion including the cutting edge on the inner surface of the blade part. Adjust the angle of
When the cutting means is moved obliquely from one end side to the other end side of the side of the module board and from the outside to the inside of the holder track, and the cutting means reaches the side of the module board, the plane of the back surface of the blade portion While the part is in contact with the side of the module substrate, the cutting means is moved to the other end along the holder track, and at least a surplus portion on the other end side is cut off,
Then, the trimming method of the solar cell module characterized by performing the return path | route process which moves a cutting | disconnection means along a holder track | orbit from the other end side to one end side, and cuts off the remaining surplus part.   The trimming of a solar cell module according to claim 1, wherein a single blade is used as a blade portion of the cutting means, and a planar portion including a blade edge on an inner surface of the blade portion is the entire back surface of the cutting means. Method.   3. The method for trimming a solar cell module according to claim 2, wherein different cutting means each having a blade portion composed of a single blade whose front and rear blades are reversely attached are used in the forward path step and the backward path step.   Before the blade edge wears out and the sharpness falls below the allowable limit, severe blade sharpening occurs and the sharpness falls beyond the allowable limit, or after trimming a certain number of solar cell modules, the blade part is moved upward or downward The method for trimming a solar cell module according to any one of claims 1 to 3, wherein the blade edge is drawn out by being moved to the position.   The cutting means is tilted at an angle corresponding to the chamfering angle of the side of the module board, and the cutting means is moved relative to the module board while the flat part of the back surface of the blade part is in contact with the chamfered slope, thereby chamfering. The method for trimming a solar cell module according to any one of claims 1 to 4, further comprising a chamfering step of cutting off an excessive portion of the slope. A rectangular module substrate, a photoelectric conversion element that is provided on one side of the module substrate and performs photoelectric conversion, an electrode that is provided on the one side and that takes out the electric power obtained by the photoelectric conversion element, and is covered on the one side. A trimming base that includes a sealing member that is attached and protects the photoelectric conversion element and the electrode, and that removably holds a solar cell module in which a surplus portion of the sealing member remains around the module substrate by a module holding means; A substrate detection means for detecting the position and angle of the side of the module substrate of the solar cell module held on the trimming table, a holder part and a blade part, and relative to the solar cell module on the trimming table In a solar cell module trimming apparatus having a cutting means, an input means, and a control means movable to
The cutting means rotates around an axis perpendicular to the upper surface of the trimming table, and the angle of the blade can be adjusted.
The input means can input the position of the side of the module board and the distance between the holder track, the cutting point, the cutting angle,
Based on the edge angle information obtained by the substrate detection means and the blade shape information, the control means matches the angle of the plane portion including the blade edge on the inner surface of the blade portion with the angle of the edge of the module substrate. The function to set,
A function for setting the holder trajectory directly above or inside the side based on the position information of the side obtained by the board detecting means and the side position of the module board inputted from the input means and the distance information of the holder orbit. When,
A function to set the introduction trajectory based on the set holder trajectory information and the incision point information and incision angle information input from the input means;
As an outward path process, the cutting means moves from a cutting point provided near one end of the side of the module substrate until it contacts the side of the module substrate along the introduction track, and from the contacted position onto the holder track A function of controlling the driving means to move along the other end side,
As a return path step, the function of controlling the driving means so that the cutting means moves from the other end side to the one end side;
And a trimming device for a solar cell module.   7. The trimming device for a solar cell module according to claim 6, wherein the blade portion of the cutting means is a single blade, and the planar portion including the blade edge on the inner surface of the blade portion is the entire back surface of the cutting means. .   8. The solar cell module trimming device according to claim 7, further comprising a cutting means for a forward path process and a cutting means for a backward path process, wherein each blade portion is a single blade whose blade mounting direction is reverse.   The trimming device for a solar cell module according to any one of claims 6 to 8, further comprising a feed-out mechanism that moves the blade part up or down to feed out the blade tip.   The trimming device for a solar cell module according to any one of claims 6 to 9, further comprising a blade portion capable of adjusting a rotation angle about an axis parallel to a traveling direction of the cutting means.

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