JP2010258096A - 窒化物半導体発光素子 - Google Patents
窒化物半導体発光素子 Download PDFInfo
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- JP2010258096A JP2010258096A JP2009104407A JP2009104407A JP2010258096A JP 2010258096 A JP2010258096 A JP 2010258096A JP 2009104407 A JP2009104407 A JP 2009104407A JP 2009104407 A JP2009104407 A JP 2009104407A JP 2010258096 A JP2010258096 A JP 2010258096A
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- 150000004767 nitrides Chemical class 0.000 title claims abstract description 135
- 239000004065 semiconductor Substances 0.000 title claims abstract description 134
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 45
- 239000001301 oxygen Substances 0.000 claims abstract description 45
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 45
- 230000004888 barrier function Effects 0.000 claims abstract description 41
- 239000012535 impurity Substances 0.000 claims abstract description 29
- 239000000203 mixture Substances 0.000 claims abstract description 29
- 239000013078 crystal Substances 0.000 abstract description 21
- 239000000463 material Substances 0.000 abstract description 13
- 239000010410 layer Substances 0.000 description 317
- 239000002994 raw material Substances 0.000 description 26
- 239000000758 substrate Substances 0.000 description 23
- VCZQFJFZMMALHB-UHFFFAOYSA-N tetraethylsilane Chemical compound CC[Si](CC)(CC)CC VCZQFJFZMMALHB-UHFFFAOYSA-N 0.000 description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 12
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 10
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 10
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 230000007547 defect Effects 0.000 description 6
- 229910052733 gallium Inorganic materials 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 6
- IBEFSUTVZWZJEL-UHFFFAOYSA-N trimethylindium Chemical compound C[In](C)C IBEFSUTVZWZJEL-UHFFFAOYSA-N 0.000 description 6
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 5
- 239000012159 carrier gas Substances 0.000 description 5
- 229910052738 indium Inorganic materials 0.000 description 5
- 229910052594 sapphire Inorganic materials 0.000 description 5
- 239000010980 sapphire Substances 0.000 description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 4
- 239000000470 constituent Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 238000010893 electron trap Methods 0.000 description 2
- 238000000295 emission spectrum Methods 0.000 description 2
- RGGPNXQUMRMPRA-UHFFFAOYSA-N triethylgallium Chemical compound CC[Ga](CC)CC RGGPNXQUMRMPRA-UHFFFAOYSA-N 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- MHYQBXJRURFKIN-UHFFFAOYSA-N C1(C=CC=C1)[Mg] Chemical compound C1(C=CC=C1)[Mg] MHYQBXJRURFKIN-UHFFFAOYSA-N 0.000 description 1
- 229910005540 GaP Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000002109 crystal growth method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002429 hydrazines Chemical class 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Abstract
【解決手段】発光層6における障壁層6bとしての第1の窒化物半導体層が、成長時に第1の不純物であるSiが濃度A(例えば、5×1016cm-3)で意図的に添加されたAlaGabIn(1-a-b)N層(0<a<1、0<b<1、1−a−b>0)からなるとともに、井戸層6aとしての第2の窒化物半導体層が、成長時に第2の不純物であるSiが濃度B(0≦B<A)で意図的に添加され第1の窒化物半導体層よりもAlの組成の小さなAlcGadIn(1-c-d)N層(0<c<1、0<d<1、1−c−d>0)からなり、第1の窒化物半導体層の意図的に添加しない酸素の濃度が第2の窒化物半導体層の意図的に添加しない酸素の濃度よりも低くなっている。
【選択図】図1
Description
2 第1のバッファ層
3 n形窒化物半導体層
4 第2のバッファ層
5 第3のバッファ層
6 発光層
6a 井戸層(第2の窒化物半導体層)
6b 障壁層(第1の窒化物半導体層)
7 p形窒化物半導体層
Claims (5)
- n形窒化物半導体層とp形窒化物半導体層との間に、第1の窒化物半導体層を障壁層とし第2の窒化物半導体層を井戸層とする量子井戸構造の発光層を有する窒化物半導体発光素子であって、第1の窒化物半導体層が、成長時に第1の不純物が濃度Aで意図的に添加されたAlaGabIn(1-a-b)N層(0<a<1、0<b<1、1−a−b>0)からなるとともに、第2の窒化物半導体層が、成長時に第2の不純物が濃度B(0≦B<A)で意図的に添加された第1の窒化物半導体層よりもAlの組成の小さなAlcGadIn(1-c-d)N層(0<c<1、0<d<1、1−c−d>0)からなり、第1の窒化物半導体層の成長時に意図的に添加しない酸素の濃度が第2の窒化物半導体層の成長時に意図的に添加しない酸素の濃度よりも低いことを特徴とする窒化物半導体発光素子。
- 前記各不純物が、Siであることを特徴とする請求項1記載の窒化物半導体発光素子。
- 前記第1の窒化物半導体層の第1の不純物の濃度Aが5×1016cm-3以上であることを特徴とする請求項2記載の窒化物半導体発光素子。
- 前記第1の窒化物半導体層の酸素の濃度が1×1018cm-3以下であることを特徴とする請求項1ないし請求項3のいずれか1項に記載の窒化物半導体発光素子。
- 前記発光層の発光波長が220nm〜360nmの範囲内であることを特徴とする請求項1ないし請求項4のいずれか1項に記載の窒化物半導体発光素子。
Priority Applications (2)
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JP2009104407A JP2010258096A (ja) | 2009-04-22 | 2009-04-22 | 窒化物半導体発光素子 |
US12/621,364 US8120013B2 (en) | 2009-04-22 | 2009-11-18 | Nitride semi-conductor light emitting device and a process of producing a nitride semi-conductor light emitting device |
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JP2009104407A JP2010258096A (ja) | 2009-04-22 | 2009-04-22 | 窒化物半導体発光素子 |
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JP2009104407A Pending JP2010258096A (ja) | 2009-04-22 | 2009-04-22 | 窒化物半導体発光素子 |
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JP (1) | JP2010258096A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2019040962A (ja) * | 2017-08-23 | 2019-03-14 | 豊田合成株式会社 | Iii族窒化物半導体発光素子の製造方法 |
Families Citing this family (13)
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JP5549338B2 (ja) * | 2010-04-09 | 2014-07-16 | ウシオ電機株式会社 | 紫外光放射用窒素化合物半導体ledおよびその製造方法 |
TWI649895B (zh) | 2010-04-30 | 2019-02-01 | 美國波士頓大學信託會 | 具能帶結構位變動之高效率紫外光發光二極體 |
DE102010035489A1 (de) * | 2010-08-26 | 2012-03-01 | Osram Opto Semiconductors Gmbh | Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelement |
US8723189B1 (en) | 2012-01-06 | 2014-05-13 | Trustees Of Boston University | Ultraviolet light emitting diode structures and methods of manufacturing the same |
US9112103B1 (en) | 2013-03-11 | 2015-08-18 | Rayvio Corporation | Backside transparent substrate roughening for UV light emitting diode |
US9219204B1 (en) | 2013-03-11 | 2015-12-22 | Rayvio Corporation | Semiconductor device and a method of making a semiconductor device |
CN103413879B (zh) * | 2013-08-13 | 2015-12-09 | 湘能华磊光电股份有限公司 | Led外延的生长方法以及通过此方法获得的led芯片 |
TW201511327A (zh) | 2013-09-06 | 2015-03-16 | Ind Tech Res Inst | 發光二極體 |
US9048389B2 (en) | 2013-09-23 | 2015-06-02 | Industrial Technology Research Institute | Light emitting diode |
JP2016032038A (ja) * | 2014-07-29 | 2016-03-07 | 住友化学株式会社 | 窒化物半導体ウエハおよびその製造方法 |
US9876143B2 (en) | 2014-10-01 | 2018-01-23 | Rayvio Corporation | Ultraviolet light emitting device doped with boron |
CN104638083B (zh) * | 2015-02-04 | 2018-11-09 | 映瑞光电科技(上海)有限公司 | GaN基LED外延结构及其制作方法 |
CN110993753B (zh) * | 2019-11-22 | 2021-03-02 | 华灿光电(苏州)有限公司 | 发光二极管外延片及其制造方法 |
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US6229150B1 (en) * | 1999-07-30 | 2001-05-08 | Matsushita Electronics Corp. | Semiconductor structures using a group III-nitride quaternary material system with reduced phase separation and method of fabrication |
US6630692B2 (en) * | 2001-05-29 | 2003-10-07 | Lumileds Lighting U.S., Llc | III-Nitride light emitting devices with low driving voltage |
US7138648B2 (en) * | 2003-12-17 | 2006-11-21 | Palo Alto Research Center Incorporated | Ultraviolet group III-nitride-based quantum well laser diodes |
JP4563230B2 (ja) * | 2005-03-28 | 2010-10-13 | 昭和電工株式会社 | AlGaN基板の製造方法 |
JP3858042B2 (ja) | 2005-08-04 | 2006-12-13 | 独立行政法人理化学研究所 | 紫外発光素子およびInAlGaN発光層の製造方法 |
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2009
- 2009-04-22 JP JP2009104407A patent/JP2010258096A/ja active Pending
- 2009-11-18 US US12/621,364 patent/US8120013B2/en active Active
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2019040962A (ja) * | 2017-08-23 | 2019-03-14 | 豊田合成株式会社 | Iii族窒化物半導体発光素子の製造方法 |
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US20100270532A1 (en) | 2010-10-28 |
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