JP2010256114A - Original form for contact pin for test and method for manufacturing the same, and method for manufacturing the contact pin for test - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To inexpensively provide a large number of contact pins for tests by paying attention to a lithography technique used as a method for forming fine patterns of semiconductor devices etc., and using a die having a high resolution, and also to provide an easily manufacturable original form for contact pins for tests, a method for manufacturing the same, and a method for manufacturing the contact pins for tests. <P>SOLUTION: The method for manufacturing the contact pins for tests has the process of: manufacturing a die having recessions in a shape reverse to that of the protrusions of the original form for contact pins for tests, by using the original form having the protrusions composed of a plurality of pattern layers the cross sections of which become smaller as they approach the top layer and which have curved surfaces, on one surface of a substrate; pouring resin into the recessions of the die; hardening the poured resin to form resin moldings; and taking the resin moldings out and providing conductive layers on their surfaces. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to the manufacture of semiconductor devices, optical components such as optical waveguides and diffraction gratings, recording devices such as hard disks and DVDs, biochips such as DNA analysis, and displays such as diffusion plates and light guide plates. The present invention also relates to a method for manufacturing a test contact pin used for making an electrical test by contacting each terminal when manufacturing a liquid crystal display device.

  Conventionally, this type of test contact pin is generally a movable spring pin having a spring mechanism or a tapered cantilever type probe pin. Since it is difficult to make the spring pin small because of its mechanism, application to a product having a relatively large pattern such as a printed circuit board is limited, and a probe pin is exclusively used for testing an IC chip or a liquid crystal display device. This probe pin is generally manufactured for each pin by electrolytic polishing or the like.

  Such conventional test contact pins are put to practical use through the process of mounting the probe pins on the taper in a fan shape and attaching them to the probe card, and by bending the contact part at the tip according to the IC pad arrangement and aligning the height and pitch. To be served. These processes are commonly called needle stands, and craftsmanship is required for the work. Especially for highly integrated ICs, the demand for high pin count and narrow pitch is severe, while the number of highly skilled technicians who can meet these requirements is extremely limited, which tends to reduce product performance and reduce reliability. . In addition, difficult readjustment work is often required during use. For this reason, when conventional test contact pins are used, the productivity and performance of cards, sockets, and the like cannot follow the progress of IC technology.

  In order to solve this problem, a method of making contact pins by an etching method has been proposed. In this etching method, the dry method is too poor in productivity, and in the wet method, there is a defect such that the necessary contact force cannot be ensured due to the poor cross-sectional shape of the pin due to the occurrence of taper etching.

  Moreover, although the cross-sectional shape of a contact pin can be ensured by manufacturing using an anisotropic material, since the material which can be used is limited and electroconductivity cannot be ensured, it cannot be used as a contact pin as it is. In addition, there is a method of giving a pad to the wiring pattern on the resin substrate and pressing it, giving up that the contact portion is a pin. However, since this method cannot secure so-called overdrive, the contact pressure easily varies and the contact resistance is not good. Stable and unreliable.

  In order to solve the above problems, a test contact pin manufacturing method using photochemistry and plating techniques has been proposed (see Patent Document 2). In this method, a base metal layer is formed on a supporting metal plate, a photoresist layer is formed on the base metal layer, a mask having a predetermined pattern is applied to the photoresist layer, and the photoresist layer is exposed. Development is performed to remove the portion to be the test contact pin, and an opening is formed in the remaining photoresist layer. A metal layer to be the test contact pin is formed by plating in the opening, and the test layer is formed on the metal layer. The film is covered with an adhesive that covers the part other than the part used for the contact pins, and then the film is separated from the metal layer and the base metal layer, and the supporting metal plate to support the film. This is a method of manufacturing a test contact pin as a body. According to this method, a test contact pin suitable for testing an IC chip, a liquid crystal display device or the like can be manufactured with high productivity. However, in the above method, it is necessary to repeat the production for every required number of sheets, and there is a limit to reproducibility and mass productivity (see Patent Documents 1 and 3).

Japanese Patent No. 3129641 JP-A-6-313775 Japanese Patent No. 31296655

  The present invention solves the above-described problems, and pays attention to lithography technology used as a method for forming a fine pattern of a semiconductor device or the like, and uses a high-resolution mold to inexpensively and make a large number of test contacts. Provide pins. Further, a test contact pin master plate that can be easily manufactured even when the requirements for the test contact pins are constituted by curved surfaces or curves, a manufacturing method thereof, and a manufacturing method of the test contact pins are provided. It is.

  According to a first aspect of the present invention, there is provided a test contact pin master comprising a plurality of pattern layers having a cross-sectional area that decreases as the upper layer is formed on one surface of a substrate. is there.

  The invention according to claim 2 of the present invention is the test contact pin master according to claim 1, wherein the protrusion has a curved surface.

  The invention according to claim 3 of the present invention is the manufacture of a test contact pin original plate characterized in that a projection is formed by sequentially repeating a pattern layer whose cross-sectional area decreases as it becomes an upper layer on a substrate. Is the method.

  According to a fourth aspect of the present invention, there is provided a process for producing a mold having a concave portion having a shape obtained by inverting the shape of the projection of the original plate, using the original plate according to the first or second aspect; It has a step of pouring resin into a concave portion of a mold, a step of curing the poured resin to form a resin molded body, and a step of taking out the resin molded body and providing a conductive layer on the surface. This is a method of manufacturing a test contact pin.

  According to the first aspect of the present invention, since the portion for forming the protrusion is formed by the plurality of pattern layers, the cross-sectional area can be gradually changed, and a plate for manufacturing a high-definition contact pin is formed. it can.

  Further, according to the invention described in claim 2, since the side surface of the protrusion is an original plate made of a curved surface, by using this original plate, the test contact pin also has a shape having a curved surface on the side surface, The stress can be relieved when used in contact with the object to be inspected.

  Further, according to the invention described in claim 3, since the cross-sectional area is laminated so as to become smaller as the upper layer is formed, there is no warping of the resin or deviation of the shape, and the protruding portion having the shape is formed. Can do.

  In addition, according to the invention described in claim 4, a large amount can be manufactured because a large amount of processing can be performed at once by using the original plate and subjecting the resin molded body and the resin molded body to conductive layer formation processing. It does not require advanced technology and expensive equipment, and the manufacturing cost can be reduced.

  Therefore, by using the test contact pin manufacturing method according to the present invention, it is possible to provide a test contact pin that is inexpensive, mass-produced, and is reproducible. Further, the demand for the test contact pin is a curved surface or a curved line. Even if it is comprised by this, the contact pin for a test can be manufactured easily.

It is explanatory drawing which shows one Example of the manufacturing method of the metal mold original plate of this invention. It is explanatory drawing which shows one Example of the manufacturing method of the metal mold | die of this invention. It is sectional drawing which shows one Embodiment of this invention. It is explanatory drawing which shows one Example of the manufacturing method of the contact pin for a test using the metal mold | die of this invention.

  EMBODIMENT OF THE INVENTION Below, the form for implementing this invention is demonstrated using figures.

  As shown in FIG. 1A, a flat layer (2) is formed on a substrate (1). Next, as shown in FIG.1 (b), a photosensitive resin is apply | coated on a flat layer (2), and the photosensitive resin layer (3) is formed. As the photosensitive resin, a positive photosensitive resin using a novolac resin is suitable, but a negative photosensitive resin may be used depending on the pattern configuration of the mold original plate.

  Next, as shown in FIG.1 (c), it exposes by UV light irradiation (4) using a photomask (5). After exposure, a phenomenon was performed to form a first pattern (6a) of a photosensitive resin as shown in FIG. As the irradiation amount of the UV light, an optimum one is selected depending on the type of the photosensitive resin, the shape of the pattern layer, and the like.

  Next, as shown in FIG. 1E, UV light irradiation (4) was performed on the entire surface including the first pattern (6b) of the photosensitive resin. At this time, it is optimal to irradiate the UV light with a wavelength of 300 nm or less removed, but the optimum UV light is selected depending on the type of the photosensitive resin, the shape of the pattern layer, and the like.

  Here, when a positive photosensitive resin such as a novolac resin is used as the photosensitive resin, when the irradiation amount of UV light irradiation is large, the surface of the photosensitive resin pattern tends to be cured, Although the cross-sectional shape of the surface of the pattern layer formed by heating after this UV light irradiation tends to be impaired, UV light having a wavelength of 300 nm or less is large in curing the pattern surface at the wavelength of the irradiated UV light. By removing the UV light with a wavelength of about 300 nm or less from the UV light to be irradiated, the pattern surface can be prevented from being cured, and the appropriate range of the UV irradiation amount is expanded. It becomes a thing. Further, the cross-sectional shape of the surface of the pattern layer formed by heating can be easily formed with higher accuracy and stability.

  Next, heat treatment using a hot plate is performed to produce a first pattern layer (6a) on the substrate (1) as shown in FIG.

    As shown in FIG. 2, the second pattern is repeatedly formed on the obtained pattern layer (first pattern layer (6a)) by the above-described forming method (FIGS. 1A to 1F). A layer (6b) is formed. At that time, when forming the second pattern layer (6b) on the second stage on the first pattern layer (6a) on the first stage, in order to prevent warping and shape deviation of the photosensitive resin, one side of the first pattern layer (6a) may be removed. It is desirable to form the protrusion (6) so as to be about 0.1 to 5 μm inside from the surface.

  Then, a mold original plate (7) is manufactured by forming a third pattern layer (6c) on the second pattern layer (6b). At this time, as described above, it is desirable to form the third stage on the second stage so that it is about 0.1 to 5 μm inside the single-sided single face from the second stage.

  Next, the metal mold | die (8) used for imprint lithography was produced from this metal mold | die original plate (7) using the fine electroforming method (FIG.2 (b)-(c)). If necessary, a process of thinly applying a release treatment material to the convex surface may be performed. Moreover, when using it for manufacture of a multilayer wiring board, the concave-shaped secondary electroforming mold inverted from the convex-shaped electroforming mold may be formed.

  Note that the pattern layer of the protrusion (6) can be changed to a mirror shape (FIG. 3 (a)) or a mountain shape (FIG. 3 (b)) by changing the mask shape of the photomask or changing the number of laminations. The shape of a wedge shape (FIG. 3C) and a pyramid shape (FIG. 3D) can be set. Further, it is possible to form a pattern having a shape having a plurality of convex portions or a curved structure.

  As shown in FIG. 4, using the obtained mold (8), as shown in FIG. 4 (b), the acrylic photo-curing resin material (9) was poured into the mold and subjected to defoaming treatment. Then, the resin plate (10) as shown in FIG.4 (c) which has the support | pillar body of the contact pin for a test was produced by irradiating UV light and performing resin hardening.

  The acrylic photo-curing resin material used at that time preferably contains a conductive material and is a resin material that undergoes photo-crosslinking in a short time.

  As for the defoaming treatment, there are a vacuum defoaming method in which the acrylic photo-curing resin is poured and then leaving in a vacuum environment, and a micro vibration method for giving microvibration. Therefore, it is desirable to use a vacuum defoaming method that is allowed to stand in a vacuum environment.

  Next, using the resin plate (10), plating is performed to form a film (11) of 2 μm or less on the surface of the resin plate, and the base of the test contact pin as shown in FIG. A body (12) is produced.

  As for the plating treatment used at that time, it is desirable to use a copper (Cu) or gold (Au) material in consideration of conductivity, and avoid a plating treatment that becomes hard to maintain softness. The film is preferably 1 μm or less, and if the film is 2 μm or more, the film becomes hard and the width and height of the test contact pin posts vary. As the shape dimensions of the test contact pins, an upper width of 5 to 10 μm, a lower width of 20 to 40 μm, and a height of 20 μm or more are desirable.

  Further, when the softness cannot be maintained by performing the plating process, it is possible to perform copper (Cu) or gold (Au) deposition on the support pin support body side with a vacuum deposition apparatus.

  Next, as shown in FIG. 4E, the base body (12) subjected to the plating treatment is placed on the urethane foam resin (13) until the bottom portion reaches the resin surface with the protruding portion facing down. Insert and fix.

  The urethane foam resin material used at that time has a hardness that does not cause the test contact pins to bend or break when the protrusion (11) of the base body is inserted, and the base plate does not move easily. Those with a degree of hardness are desirable.

  Next, the bottom portion of the base body (12) is subjected to polishing treatment to the urethane foam resin surface by using a CMP (Chemical Mechanical Polishing) polishing method, and then FIG. As shown in FIG. 3, a test contact pin having a shape as shown in FIGS. 3A to 3D can be produced by performing the re-plating process (14) in the same manner as described above.

  Also, depending on the urethane foam resin material, if re-plating treatment cannot be performed, copper (Cu) or gold (Au) vapor deposition may be performed on the support pin side of the contact pin with a vacuum vapor deposition apparatus as described above. In this case, a test contact pin having a shape as shown in FIGS. 3A to 3D can be produced.

As an example, a silicon wafer was used as the substrate. A positive photosensitive resin using a novolak resin (product number TMR-P3, manufactured by Tokyo Ohka Kogyo Co., Ltd.) was used as the photosensitive resin to be the flat layer and the pattern layer. An ultra-high pressure mercury lamp is used as a light source for UV light irradiation, and the first irradiation amount is 33 to 40 mj / cm ² (at 365 nm) per 1 μm film thickness of the photosensitive resin. The second irradiation amount was about 14 to about 140 mj / cm ² (at 365 nm) per 1 μm film thickness of the photosensitive resin, and a filter for removing UV light having a wavelength of about 300 nm or less was used. The heat treatment by the hot plate was performed at about 150 ° C. to 170 ° C. for about 2 to 5 minutes, and the plating treatment by the fine electroforming method was performed by Ni electroforming. The obtained mold had an accuracy of several μm to 20 μm, the heights of the step portions were evenly aligned, and the curved surface was formed cleanly.

  Next, an ultraviolet curable resin material is poured into the mold formed as described above, left in a vacuum environment for about 1 minute for defoaming treatment, and then irradiated with ultraviolet rays for about 30 to 60 seconds to cure the resin. The formed resin plate is formed by copper plating so as to form a film of 2 μm or less on the surface of the support, the plated base plate is urethane foam resin, and the protruding portion is Insert the bottom part until it reaches the resin surface, and polish the bottom part to the urethane foam resin surface with a CMP polisher and perform copper plating again in the treated state to obtain a test contact pin. I was able to.

DESCRIPTION OF SYMBOLS 1 Substrate 2 Flat layer 3 Photosensitive resin 4 UV light 5 Photomask 6 Projection part 6a First pattern layer 6b Second pattern layer 6c Third pattern layer 7 Mold master 8 Mold 9 Photocurable resin material 10 Resin plate 11 Coating 12 Base body 13 Urethane foam resin 14 Re-plating treatment

Claims (4)

  1. A test contact pin master comprising a plurality of pattern portions each having a plurality of pattern layers whose cross-sectional area becomes smaller as the upper layer is formed on one side of the substrate.   The test contact pin master according to claim 1, wherein the protrusion has a curved side surface.   A method for producing a test contact pin original plate, wherein a pattern layer having a cross-sectional area that decreases as an upper layer is formed on a substrate is sequentially repeated to form protrusions.   Using the original plate according to claim 1 or claim 2, a step of producing a mold having a concave portion having a shape obtained by inverting the shape of the projection of the original plate, a step of pouring resin into the concave portion of the mold, A method for producing a test contact pin, comprising: a step of curing the poured resin to form a resin molded body; and a step of taking out the resin molded body and providing a conductive layer on a surface thereof.

Images