JP2010248604A - Catalyst cvd system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a catalyst CVD system for efficiently dissipating heat in a connecting part of a catalyst body heated by performing electric supply with an electrode member. <P>SOLUTION: A top end of a filament 15 is connected to a bottom end of an electrode 5 via a retaining member 12. The filament 15 is coupled to a slotted part 16 of the electrode 5, a diameter of the slotted part 16 is reduced by thread-engaging a nut member 14 on the electrode 5, the filament 15 is connected with surface contact to the electrode 5, and a contact part is controlled from becoming too high temperature by reducing electric contact resistance. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a catalytic CVD apparatus for forming a film by bringing a source gas into contact with a catalyst body.

  2. Description of the Related Art A CVD apparatus that forms a thin film by a chemical vapor deposition (CVD) method using a chemical reaction of a source material in a process of manufacturing a semiconductor device is known. Examples of the CVD apparatus include a plasma CVD apparatus that uses a plasma space in a reaction system and a thermal CVD apparatus that uses a heating reaction. In addition, there is a catalytic CVD apparatus in which a source gas is brought into contact with a heated heating body (catalyst body) to decompose the source gas into reactive species (see, for example, Patent Document 1).

  In the catalytic CVD apparatus, for example, since the surface of a heated catalyst body such as tungsten is responsible for the progress of the chemical reaction, electrical and thermal damage to the substrate and the thin film can be suppressed. Further, by increasing the number of catalyst bodies, it is possible to widen the film formation region, and it is possible to easily cope with an increase in the area of the substrate.

  In a catalytic CVD apparatus, a filament made of tungsten, which is a catalyst body, is connected to an electrode rod having a power introduction terminal, and the filament is heated to a high temperature by supplying power to the electrode rod. In general, the filament is attached to the electrode rod by holding the filament between the press plate and the electrode rod and fixing the press plate and the like to the electrode rod with screws to hold the filament on the electrode rod.

  Since the filament is rod-shaped, there is a limit to the contact area between the electrode bar (press plate material and the like) and the filament, and the contact area cannot be secured sufficiently. For this reason, electrical contact resistance becomes larger than the electrical resistance of the filament, and even when the filament temperature is heated at a temperature lower than the melting point of the electrode rod (SUS304), the temperature of the contact portion may become high. When the temperature of the contact portion becomes high, the electrode rod at the contact portion melts, and the components (Ni, Cr, Fe) of the electrode rod are diffused and transported to the substrate, which may cause metal contamination.

  In order to suppress the temperature of the contact portion between the electrode rod side (press plate material, etc.) and the filament from becoming too high, it is also considered to cool the power introduction terminal and radiate the electrode rod. In reality, it is difficult to use a cooling medium that has a high cooling efficiency, and air cooling must be relied upon to limit cooling efficiency.

Japanese Patent No. 3780364

  The present invention has been made in view of the above situation, and an object of the present invention is to provide a catalytic CVD apparatus that can efficiently dissipate heat at a connecting portion of a catalyst body that is heated when power is supplied by an electrode member. .

  In order to achieve the above object, the catalytic CVD apparatus of the present invention according to claim 1 is provided with a processing chamber in which a substrate is placed with a predetermined vacuum state and a source gas containing a source material is supplied, It has an introduction terminal for electric power and is connected to the electrode member disposed inside the processing chamber in a state where the introduction terminal is arranged outside the processing chamber, and the electrode member located inside the processing chamber, And a catalyst body that decomposes and activates the source gas into reactive species to form a thin film on the substrate by being heated, and the connection of the catalyst body to the electrode member holds the catalyst body by surface contact The catalyst body is attached to the electrode member via a holding member.

  In the present invention according to claim 1, by attaching the catalyst body to the electrode member via the holding member, the catalyst body is attached to the electrode member by surface contact, and the contact portion is reduced by reducing the electrical contact resistance. It can suppress that the temperature of becomes too high. As a result, it is possible to efficiently dissipate the connecting portion of the catalyst body that is heated when power is supplied by the electrode member, and there is no diffusion transport due to melting of the electrode member, thereby preventing metal contamination in the processing chamber. It becomes possible.

  The catalytic CVD apparatus of the present invention according to claim 2 is the catalytic CVD apparatus according to claim 1, wherein the holding member is formed at the tip of the electrode member and is fitted to the outer periphery of the catalyst body. A holding portion that can be reduced in diameter, and a diameter of the holding portion through a taper surface by screwing to the electrode member to bring the catalyst body into surface contact with the inner surface of the holding portion, It consists of a nut member held by an electrode member.

  In the present invention according to claim 2, by screwing the nut member to the electrode member, the holding portion is reduced in diameter via the tapered surface, the inner surface is in surface contact with the catalyst body, and the contact area of the connecting portion is increased. The electric contact resistance can be further reduced.

  The vacuum processing apparatus according to a third aspect of the present invention is the catalytic CVD apparatus according to the second aspect, wherein the holding portion is divided into a plurality in the circumferential direction.

  In the present invention according to claim 3, the surface contact can be ensured by bringing the slit-shaped holding portion divided in the circumferential direction into contact with the catalyst body.

  In order to achieve the above object, the catalytic CVD apparatus of the present invention according to claim 4 is provided with a processing chamber in which a substrate is placed with a predetermined vacuum state and a source gas containing a source substance is supplied, It has an introduction terminal for electric power and is connected to the electrode member disposed inside the processing chamber in a state where the introduction terminal is arranged outside the processing chamber, and the electrode member located inside the processing chamber, A catalyst body that decomposes and activates the source gas into reactive species by heating to form a thin film on the substrate, and an insulation that holds the electrode member in a state where the introduction terminal is arranged outside the processing chamber And water cooling means for cooling the introduction terminal by supplying cooling water to the insulator.

  In the present invention according to claim 4, since the cooling water as the cooling medium is supplied through the insulator, the introduction terminal is cooled by water cooling without using an insulating fluid, and the cooling efficiency can be improved. As a result, it is possible to efficiently dissipate the connecting portion of the catalyst body that is heated when power is supplied by the electrode member, and there is no diffusion transport due to melting of the electrode member, thereby preventing metal contamination in the processing chamber. It becomes possible.

  The catalytic CVD apparatus of the present invention according to claim 5 is the catalytic CVD apparatus according to claim 4, wherein the water-cooling means has an attachment portion that faces the inside of the processing chamber and fits and holds the insulator. A block provided, a first seal member provided in the attachment portion for preventing cooling water from entering the processing chamber, and the first seal provided in the attachment portion on the processing chamber side of the first seal member. A second seal member that prevents intrusion of the cooling water that has passed through the member into the processing chamber, and is formed at the attachment portion between the first seal member and the second seal member, and passes through the first seal member. And a discharge means for discharging the cooled water.

  In the present invention according to claim 5, when the first seal member and the second seal member prevent the cooling water from entering the processing chamber from the mounting portion, in the unlikely event that the cooling water enters from the first seal member, The cooling water that has entered through the discharge means can be discharged, and the entry of the cooling water into the processing chamber can be reliably prevented.

  In order to achieve the above object, the catalytic CVD apparatus of the present invention according to claim 6 is provided with a processing chamber in which a substrate is placed while the inside is in a predetermined vacuum state and a source gas containing a source material is supplied, It has an introduction terminal for electric power and is connected to the electrode member disposed inside the processing chamber in a state where the introduction terminal is arranged outside the processing chamber, and the electrode member located inside the processing chamber, A catalyst body that decomposes and activates the source gas into reactive species by heating to form a thin film on the substrate, and an insulation that holds the electrode member in a state where the introduction terminal is arranged outside the processing chamber And a water cooling means for supplying cooling water to the insulator to cool the introduction terminal, and the connection of the catalyst body to the electrode member is via a holding member that holds the heating body by surface contact. The catalyst body is attached to the electrode member. Characterized in that attached.

  In the present invention according to claim 6, by attaching the catalyst body to the electrode member via the holding member, the catalyst body is attached to the electrode member by surface contact, and the contact portion is reduced by reducing the electrical contact resistance. Since the cooling water as a cooling medium is supplied through the insulator, the introduction terminal is cooled by water cooling without using an insulating fluid, and the cooling efficiency is improved. be able to. As a result, it is possible to efficiently dissipate heat at the connecting portion of the catalyst body that is heated by supplying power to the electrode member, eliminating diffusion transport due to melting of the electrode member, and ensuring metal contamination in the processing chamber It becomes possible to prevent.

  The catalytic CVD apparatus of the present invention according to claim 7 is the catalytic CVD apparatus according to claim 6, wherein the holding member is formed at the tip of the electrode member and is fitted to the outer periphery of the catalyst body. A holding portion that can be reduced in diameter, and a diameter of the holding portion through a taper surface by screwing to the electrode member to bring the catalyst body into surface contact with the inner surface of the holding portion, It consists of a nut member held by an electrode member.

  In the present invention according to claim 7, by screwing the nut member to the electrode member, the holding portion is reduced in diameter via the tapered surface, the inner surface is in surface contact with the catalyst body, and the contact area of the connecting portion is increased. The electric contact resistance can be further reduced.

  According to an eighth aspect of the present invention, there is provided the catalytic CVD apparatus according to the seventh aspect, wherein the holding section is divided into a plurality in the circumferential direction.

  In the present invention according to claim 8, surface contact can be ensured by bringing the slit-shaped holding portion divided in the circumferential direction into contact with the catalyst body.

  The catalytic CVD apparatus of the present invention according to claim 9 is the catalytic CVD apparatus according to any one of claims 6 to 8, wherein the water cooling means faces the inside of the processing chamber and the insulator. A block provided with a mounting portion that is fitted and held; a first seal member that is provided in the mounting portion and prevents cooling water from entering the processing chamber; and the first sealing member on the processing chamber side. A second seal member provided in the attachment portion for preventing the coolant that has passed through the first seal member from entering the processing chamber, and formed in the attachment portion between the first seal member and the second seal member. And a discharge means for discharging the cooling water that has passed through the first seal member.

  In the present invention according to claim 9, the first seal member and the second seal member prevent entry of the cooling water from the mounting portion into the processing chamber, and in the unlikely event that the cooling water enters from the first seal member, The cooling water that has entered through the discharge means can be discharged, and the entry of the cooling water into the processing chamber can be reliably prevented.

  The catalytic CVD apparatus of the present invention can efficiently dissipate heat at the connection portion between the electrode member and the catalyst body that is heated when power is supplied by the electrode member.

1 is an overall configuration diagram of a catalytic CVD apparatus according to an embodiment of the present invention. It is an external view of the support part of a catalyst body. It is principal part sectional drawing in FIG. It is the IV-IV arrow line view in FIG. FIG. 5 is a detailed view of an arrow V portion in FIG. 4. FIG. 6 is a view taken along line VI-VI in FIG. 5. It is a whole block diagram of the catalytic CVD apparatus which concerns on the other Example of this invention.

  The entire catalytic CVD apparatus will be described with reference to FIGS. FIG. 1 schematically shows the overall configuration of a catalytic CVD apparatus, and FIG. 2 shows the overall configuration of a member on which a filament as a catalyst body is supported.

  As shown in FIG. 1, a box-shaped vacuum chamber 1 (processing chamber) is evacuated to a predetermined vacuum state, and a substrate 2 is arranged in a substantially vertical state inside the vacuum chamber 1. Yes. A raw material gas whose flow rate is controlled is supplied from the gas line 11 into the vacuum chamber 1. Inside the vacuum chamber 1, a tungsten filament 15 as a catalyst body is disposed, and the filament 15 is heated to a high temperature by supplying power to the introduction terminal 6 of the electrode rod 5 (electrode member).

  In the catalytic CVD apparatus described above, a source gas containing a source material is supplied into the vacuum chamber 1 and the filament 15 is heated to a high temperature (for example, about 1000 ° C.). When the filament 15 is heated, a catalytic action is generated by heat generation, so that the source gas is decomposed and activated into reactive species, and a thin film is formed on the surface of the substrate 2.

  As shown in FIGS. 1 and 2, a water cooling block 3 is attached to the upper portion of the vacuum chamber 1, and a plurality of electrode rods 5 (in the illustrated example) are interposed in the water cooling block 3 through insulator rings 4 (insulators). 6) are attached. The water cooling block 3 partitions the vacuum chamber side inside the vacuum chamber 1 from the outside atmosphere side, and the electrode bar 5 is provided with an introduction terminal 6 facing the atmosphere side. In addition, although illustration is abbreviate | omitted, the site | part of the introduction | transduction terminal 6 by the side of the atmosphere is covered with the cover etc.

  Cooling water is supplied to the water cooling block 3 through the cooling water passage 7, the insulator ring 4 is cooled by the cooling water, and the electrode rod 5 is removed from the heat. The insulator ring 4 is made of a ceramic having a high thermal conductivity (for example, aluminum nitride), and the heat removal of the electrode rod 5 is efficiently performed. A wiring 8 is connected to the introduction terminal 6, and power is supplied from the introduction terminal 6 to the electrode bar 5.

  Filaments 15 are respectively held at the lower ends of the electrode rods 5 arranged on the vacuum chamber side via the holding members 12, and the filaments 15 are heated by supplying electric power to the electrode rods 5. Although details will be described later, the holding member 12 holds the rod-like filament 15 in surface contact.

  For this reason, the rod-like filament 15 is attached to the electrode rod 5 by surface contact, and the electrical contact resistance can be reduced to prevent the temperature of the contact portion from becoming too high. Moreover, since cooling water is supplied through the insulator ring 4, the introduction terminal 6 can be cooled by water cooling, and the heat removal efficiency of the electrode rod 5 can be improved. For this reason, it becomes possible to efficiently radiate heat at the connection portion of the filament 15 to be heated with the electrode rod 5, and the melting of the electrode rod 5 can be prevented.

  Based on FIG. 3, FIG. 4, the attachment state of the electrode bar 5 is demonstrated. FIG. 3 shows a cross-sectional state of the water-cooled block 3 at a portion where the insulator ring 4 is fixed, and FIG. 4 shows a cross-sectional state in a direction perpendicular to FIG.

  The atmosphere side and the inside of the vacuum chamber are partitioned by a water cooling block 3, and the water cooling block 3 is provided with a cooling water passage 7 extending in the longitudinal direction (left and right direction in FIG. 3). A plurality of fitting holes (attachment portions) 22 are formed in the water cooling block 3 through the cooling water passage 7, and the fitting holes 22 are formed over the atmosphere side and the inside of the vacuum chamber (processing chamber). The insulator ring 4 is fitted in the fitting hole 22, and the electrode rod 5 is supported on the inner periphery of the insulator ring 4.

  The insulator ring 4 includes a first fitting portion 23 that fits into a fitting hole 22 on the atmosphere side (upper side in the figure) across the cooling water passage 7, and an inner side of the vacuum chamber (in the figure) across the cooling water passage 7. And a second fitting portion 24 that fits into the lower fitting hole 22. And the fin part 25 located in the site | part of the cooling water channel 7 is provided between the 1st fitting part 23 and the 2nd fitting part 24. As shown in FIG.

  The outer periphery of the first fitting portion 23 of the insulator ring 4 is fitted into the fitting hole 22 via the O-ring 26, and the atmosphere side and the cooling water passage 7 are sealed by the O-ring 26. The outer periphery of the second fitting portion 24 of the insulator ring 4 is passed through a first O ring 27 (first seal member) on the cooling water channel 7 side and a second O ring 28 (second seal member) on the inner side of the vacuum chamber. The fitting hole 22 is fitted, and the first O-ring 27 and the second O-ring 28 seal the inner side of the vacuum chamber and the cooling water passage 7.

  A discharge hole 31 (discharge means) is formed in the water cooling block 3 between the first O ring 27 and the second O ring 28, and the discharge hole 31 opens to the atmosphere side by a discharge path 32 (discharge means). When the cooling water passes through the first O-ring 27 and enters between the first O-ring 27 and the second O-ring 28 for some reason, the intruding cooling water is discharged from the discharge hole 31 to the atmosphere side through the discharge path 32. The Thereby, it is possible to reliably prevent the cooling water from entering the vacuum chamber side (processing chamber). At this time, the intrusion of the cooling water can be automatically detected by using a water leakage sensor or the like.

  The electrode rod 5 is disposed through the insulator ring 4, and the upper end portion located on the atmosphere side is an introduction terminal 6. The inner periphery of the first fitting portion 23 and the fin portion 25 of the insulator ring 4 is formed with a female screw portion, and the electrode rod 5 is coupled to the insulator ring 4 by screwing the screw portion of the electrode rod 5 into the female screw portion. Since the insulator ring 4 located in the cooling water channel 7 is the fin portion 25, a large contact area with the cooling water is ensured, and the cross-sectional area of the channel is narrowed to increase the flow velocity. it can.

  For this reason, the contact area between the insulator ring 4 (fin portion 25) and the electrode rod 5 is widened, the surface pressure is secured, and the heat transfer of the fin portion 25 is ensured well. And exhibit high cooling performance.

  The holding state of the filament 15 will be described with reference to FIGS. FIG. 5 shows the details of the connection portion between the filament 15 and the electrode rod 5 (details of the arrow V portion in FIG. 4), and FIG. 6 shows the situation where the holding portion of the filament 15 is viewed from below (VI- in FIG. 5). VI arrow) is shown.

  The upper end of the filament 15 is connected to the lower end of the electrode rod 5 via the holding member 12. That is, a cross-shaped slit is provided at the lower end of the electrode bar 5 so as to be fitted to the outer periphery of the filament 15, and a four-divided slit portion 16 (holding portion) is formed. A shaft hole with a tolerance approximating a fitting with respect to the diameter of the filament 15 is formed on the inner periphery of the slit 16 and the electrode rod 5 above the slit 16 so that a wide contact area can be secured. The filament 15 is fitted into the hole.

  The slit portion 16 is sandwiched from the four circumferential directions by the nut member 14 and is reduced in diameter, and the inner peripheral surface of the slit portion 16 is in surface contact with the outer peripheral surface of the filament 15 so that the filament 15 is connected to the electrode rod 5. .

  The slit portion 16 is not limited to being divided into four parts, and can be divided into multiple parts such as two parts, three parts, and five parts or more as long as the diameter is reduced. It is also possible to use a holding member having a configuration that is reduced in diameter by elastic deformation.

  That is, the electrode rod 5 is formed with a screw portion 13 into which the nut member 14 is screwed, and the nut member 14 moves upward with respect to the electrode rod 5 by screwing the nut member 14 into the screw portion 13. A tapered surface 16 a is formed on the outer periphery of the lower end of the slit portion 16, and a tapered surface 14 a that fits the tapered surface 16 a is formed on the inner periphery of the lower end of the nut member 14. Then, when the upper portion of the nut member 14 is screwed into the screw portion 13, the nut member 14 moves upward, and the slit portion 16 is reduced in diameter through the tapered surface 14a and the tapered surface 16a.

  For this reason, the contact area of the connection part of the filament 15 and the electrode stick | rod 5 (slipping part 16) can be enlarged, and electrical contact resistance can be made small. Since the filament 15 is connected by reducing the diameter of the slit portion 16, surface contact between the inner peripheral surface of the slit portion 16 and the outer peripheral surface of the filament 15 can be ensured.

  In the catalytic CVD apparatus described above, a source gas containing a source material is supplied from the gas line 11 to the inside of the vacuum chamber 1, power is supplied to the introduction terminal 6, and the filament 15 is heated to a high temperature (for example, 1000) via the electrode rod 5. To about 0 ° C.). When the filament 15 is heated, a catalytic action is generated by heat generation, so that the source gas is decomposed and activated into reactive species, and a thin film is formed on the surface of the substrate 2.

  Since the filament 15 is connected to the slit portion 16 of the electrode rod 5 by surface contact, the electrical contact resistance of the connecting portion can be reduced to prevent the contact portion from becoming too hot. The electrode bar 5 is supported by the water cooling block 3 via the insulator ring 4, and the supporting portion is cooled by the cooling water flowing through the cooling water channel 7. Since the introduction terminal 6 is cooled by water cooling and the cooling efficiency can be improved, it is possible to efficiently dissipate heat at the connection portion of the filament 15 that is heated by supplying power to the electrode bar 5.

  The electrical contact resistance of the connecting portion between the filament 15 and the electrode rod 5 is reduced so that the contact portion does not become too hot, and the connecting portion of the filament 15 is efficiently radiated by water cooling, so that the electrode rod 5 is melted. Thus, the components of the electrode rod (for example, Ni, Cr, Fe) are not diffusely transported to the substrate. For this reason, it is possible to reliably prevent metal contamination in the vacuum chamber 1.

  Another embodiment of the catalytic CVD apparatus of the present invention will be described with reference to FIG. FIG. 7 schematically shows the overall configuration of a catalytic CVD apparatus according to another embodiment of the present invention. In addition, the same code | symbol is attached | subjected to the same member as the member shown in FIG. 1, and the overlapping description is abbreviate | omitted.

  As shown in the figure, for example, a cylindrical vacuum chamber 41 is evacuated to a predetermined vacuum state, and a support base 44 is provided in the vacuum chamber 41. The substrate 2 is placed and held on the upper surface of the support table 44. The electrode plate 5 is provided on the ceiling plate 42 of the vacuum chamber 41, and the introduction terminal 6 faces the outside. A portion of the introduction terminal 6 is covered with an air cooling chamber 46, and a cooling fan 45 is provided in the air cooling chamber 46.

  A filament 15 is disposed on the electrode bar 5 in the vacuum chamber 41 via the holding member 12 so as to face the support base 44. A shower plate 43 is provided in the vacuum chamber 41 between the support base 44 and the filament 15, and a raw material gas whose flow rate is controlled is supplied from the gas line 11 into the vacuum chamber 41 on the side where the filament 15 is arranged. Is done.

  In the above-described catalytic CVD apparatus, a source gas containing a source material is supplied into the vacuum chamber 41 above the shower plate 43, and the filament 15 is heated to a high temperature (for example, about 1000 ° C.). When the filament 15 is heated, a catalytic action is generated by heat generation, so that the source gas is decomposed and activated into reactive species, the reactive species are sent from the shower plate 43 to the substrate 2 side, and a thin film is formed on the surface of the substrate 2. It is formed.

  Since the filament 15 of the catalytic CVD apparatus described above is connected to the electrode bar 5 by surface contact as in the embodiment shown in FIG. 1, the electrical contact resistance of the connection portion is reduced and the contact portion becomes hot. It can be suppressed. For this reason, the electrical contact resistance of the connection part of the filament 15 and the electrode rod 5 can be made small, and it can suppress that a contact part becomes high temperature too much. Since the introduction terminal 6 is cooled by the cooling fan 45, the heat radiation of the connecting portion of the filament 15 is performed by air cooling.

  For this reason, the electrode rod 5 does not melt and the electrode rod components (for example, Ni, Cr, Fe) are not diffused and transported to the substrate, and metal contamination in the vacuum chamber 41 is prevented by a simple cooling mechanism It becomes possible to do.

  In the embodiment shown in FIG. 7, the water cooling cooling mechanism shown in FIG. 1 can be applied instead of the cooling fan 45.

  INDUSTRIAL APPLICABILITY The present invention can be used in the industrial field of a catalytic CVD apparatus that performs film formation by bringing a source gas into contact with a catalyst body.

DESCRIPTION OF SYMBOLS 1 Vacuum chamber 2 Board | substrate 3 Water cooling block 4 Insulator ring 5 Electrode rod 6 Introduction terminal 7 Cooling water path 8 Wiring 11 Gas line 12 Holding member 13 Screw part 14 Nut member 15 Filament 16 Slot part 22 Fitting hole 23 First fitting Part 24 second fitting part 25 fin part 26 O-ring 27 first O-ring 28 second O-ring 31 discharge hole 32 discharge path 41 vacuum chamber 42 ceiling plate 43 shower plate 44 support base 45 cooling fan 46 air cooling chamber

Claims (9)

A processing chamber to which a raw material gas containing a raw material is supplied while a substrate is arranged with the inside being in a predetermined vacuum state,
An electrode member disposed inside the processing chamber in a state having an introduction terminal for electric power and the introduction terminal being disposed outside the processing chamber;
A catalyst body connected to the electrode member positioned inside the processing chamber and heated to decompose and activate the source gas into reactive species to form a thin film on the substrate;
The connection of the catalyst body to the electrode member is
The catalytic CVD apparatus, wherein the catalytic body is attached to the electrode member via a holding member that holds the catalytic body by surface contact. The catalytic CVD apparatus according to claim 1,
The holding member is
A holding part that is formed at the tip of the electrode member and can be reduced in diameter so as to be fitted to the outer periphery of the catalyst body;
From the nut member that causes the holding portion to be reduced in diameter via a tapered surface by screwing to the electrode member to bring the inner surface of the holding portion into surface contact with the catalyst body and hold the catalyst body on the electrode member A catalytic CVD apparatus characterized by: The catalytic CVD apparatus according to claim 2,
The said holding | maintenance part is divided | segmented into multiple in the circumferential direction. The catalytic CVD apparatus characterized by the above-mentioned. A processing chamber to which a raw material gas containing a raw material is supplied while a substrate is arranged with the inside being in a predetermined vacuum state,
An electrode member disposed inside the processing chamber in a state having an introduction terminal for electric power and the introduction terminal being disposed outside the processing chamber;
A catalyst body connected to the electrode member located inside the processing chamber and heated to decompose and activate the source gas into reactive species to form a thin film on the substrate;
An insulator for holding the electrode member in a state where the introduction terminal is arranged outside the processing chamber;
A catalytic CVD apparatus, comprising: water cooling means for supplying cooling water to the insulator to cool the introduction terminal. In the catalytic CVD apparatus according to claim 4,
The water cooling means is
A block provided with a mounting portion facing the inside of the processing chamber and fitted and held by the insulator;
A first seal member provided at the attachment portion for preventing cooling water from entering the processing chamber;
A second seal member that is provided at the attachment portion of the first seal member on the processing chamber side and that prevents cooling water that has passed through the first seal member from entering the processing chamber;
A catalytic CVD apparatus comprising: a discharge unit that discharges the cooling water that is formed in the attachment portion between the first seal member and the second seal member and that has passed through the first seal member. A processing chamber to which a raw material gas containing a raw material is supplied while a substrate is arranged with the inside being in a predetermined vacuum state,
An electrode member disposed inside the processing chamber in a state having an introduction terminal for electric power and the introduction terminal being disposed outside the processing chamber;
A catalyst body connected to the electrode member located inside the processing chamber and heated to decompose and activate the source gas into reactive species to form a thin film on the substrate;
An insulator for holding the electrode member in a state where the introduction terminal is arranged outside the processing chamber;
Water cooling means for cooling the introduction terminal by supplying cooling water to the insulator,
The connection of the catalyst body to the electrode member is
The catalytic CVD apparatus, wherein the catalyst body is attached to the electrode member via a holding member that holds the heating body by surface contact. The catalytic CVD apparatus according to claim 6,
The holding member is
A holding part that is formed at the tip of the electrode member and can be reduced in diameter so as to be fitted to the outer periphery of the catalyst body;
From the nut member that causes the holding portion to be reduced in diameter via a tapered surface by screwing to the electrode member to bring the inner surface of the holding portion into surface contact with the catalyst body and hold the catalyst body on the electrode member A catalytic CVD apparatus characterized by: The catalytic CVD apparatus according to claim 7,
The said holding | maintenance part is divided | segmented into multiple in the circumferential direction. The catalytic CVD apparatus characterized by the above-mentioned. In the catalytic CVD apparatus according to any one of claims 6 to 8,
The water cooling means is
A block provided with a mounting portion facing the inside of the processing chamber and fitted and held by the insulator;
A first seal member provided at the attachment portion for preventing cooling water from entering the processing chamber;
A second seal member that is provided at the attachment portion of the first seal member on the processing chamber side and that prevents cooling water that has passed through the first seal member from entering the processing chamber;
A catalytic CVD apparatus comprising: a discharge unit that discharges the cooling water that is formed in the attachment portion between the first seal member and the second seal member and that has passed through the first seal member.

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