JP2010245120A - 配線基板 - Google Patents
配線基板 Download PDFInfo
- Publication number
- JP2010245120A JP2010245120A JP2009089407A JP2009089407A JP2010245120A JP 2010245120 A JP2010245120 A JP 2010245120A JP 2009089407 A JP2009089407 A JP 2009089407A JP 2009089407 A JP2009089407 A JP 2009089407A JP 2010245120 A JP2010245120 A JP 2010245120A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- hole
- wiring board
- finished resin
- semi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
【解決手段】適当な大きさの貫通孔20が穿設された基板2と、前記貫通孔20に挿入された銅製の芯材16と、前記基板2の上面と下面の何れか一方に載置された半製品樹脂21を有し、前記貫通孔20は前記芯材16を挿入するのに充分な孔径を有し、前記貫通孔20と前記芯材16との間には隙間が形成され、前記基板2と前記半製品樹脂21を両面から圧下することで該半製品樹脂21を前記隙間に充填し、前記芯材16を保持する。
【選択図】図9
Description
又、本発明は以下の実施の態様を含む。
2 コア基板
3 電子部品
4 スルーホール
5 放熱板
10 配線基板
16 銅柱
20 貫通孔
21 半製品樹脂
22 銅箔
25 ブラインド穴
26 銅めっき層
28 導体パターン
29 アースパターン
37 半製品樹脂
38 半製品樹脂
44 ブラインド穴
45 銅めっき層
47 導体パターン
48 アースパターン
Claims (1)
- 適当な大きさの貫通孔が穿設された基板と、前記貫通孔に挿入された銅製の芯材と、前記基板の上面と下面の何れか一方に載置された半製品樹脂を有し、前記貫通孔は前記芯材を挿入するのに充分な孔径を有し、前記貫通孔と前記芯材との間には隙間が形成され、前記基板と前記半製品樹脂を両面から圧下することで該半製品樹脂を前記隙間に充填し、前記芯材を保持することを特徴とする配線基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009089407A JP5394111B2 (ja) | 2009-04-01 | 2009-04-01 | 配線基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009089407A JP5394111B2 (ja) | 2009-04-01 | 2009-04-01 | 配線基板 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013099635A Division JP2013175779A (ja) | 2013-05-09 | 2013-05-09 | 配線基板の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010245120A true JP2010245120A (ja) | 2010-10-28 |
JP2010245120A5 JP2010245120A5 (ja) | 2012-05-24 |
JP5394111B2 JP5394111B2 (ja) | 2014-01-22 |
Family
ID=43097855
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009089407A Active JP5394111B2 (ja) | 2009-04-01 | 2009-04-01 | 配線基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5394111B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014099544A (ja) * | 2012-11-15 | 2014-05-29 | Shirai Electronics Industrial Co Ltd | 回路基板 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07326866A (ja) * | 1994-05-31 | 1995-12-12 | Murata Mfg Co Ltd | 誘電体基板モジュール |
JP2006066519A (ja) * | 2004-08-25 | 2006-03-09 | Kyocera Corp | 発光素子用配線基板ならびに発光装置 |
JP2007227738A (ja) * | 2006-02-24 | 2007-09-06 | Kyocera Corp | 発光素子用配線基板ならびに発光装置 |
-
2009
- 2009-04-01 JP JP2009089407A patent/JP5394111B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07326866A (ja) * | 1994-05-31 | 1995-12-12 | Murata Mfg Co Ltd | 誘電体基板モジュール |
JP2006066519A (ja) * | 2004-08-25 | 2006-03-09 | Kyocera Corp | 発光素子用配線基板ならびに発光装置 |
JP2007227738A (ja) * | 2006-02-24 | 2007-09-06 | Kyocera Corp | 発光素子用配線基板ならびに発光装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014099544A (ja) * | 2012-11-15 | 2014-05-29 | Shirai Electronics Industrial Co Ltd | 回路基板 |
Also Published As
Publication number | Publication date |
---|---|
JP5394111B2 (ja) | 2014-01-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10229895B2 (en) | Electronic sub-assembly and method for the production of an electronic sub-assembly | |
KR101181105B1 (ko) | 방열회로기판 및 그 제조 방법 | |
JP5885630B2 (ja) | プリント基板 | |
US10499500B2 (en) | Circuit board with embedded metal pallet and a method of fabricating the circuit board | |
KR20110077042A (ko) | 인쇄회로기판조립체의 제조방법 | |
JP2006210870A (ja) | 部品内蔵モジュール及びその製造方法 | |
US11116083B2 (en) | Electronic component embedded by laminate sheet | |
JP2007019516A (ja) | 電子部品を内蔵した配線基板の製造方法 | |
WO2012093509A1 (ja) | 半導体装置およびその製造方法 | |
JP2010062199A (ja) | 回路基板 | |
JP5394111B2 (ja) | 配線基板 | |
WO2014181509A1 (ja) | 多層基板およびこれを用いた電子装置、電子装置の製造方法 | |
KR100888561B1 (ko) | 능동소자 내장형 인쇄회로기판 제조 방법 | |
TWI785716B (zh) | 電路板及其製造方法 | |
JP2013175779A (ja) | 配線基板の製造方法 | |
KR20140060517A (ko) | 부품 내장 기판의 제조 방법 및 이를 이용한 부품 내장 기판 | |
JP5375537B2 (ja) | プリント配線基板及びその製造方法 | |
JP2007243079A (ja) | 放熱型プリント配線板及びその製造方法 | |
WO2022160459A1 (zh) | 一种电路板及其制造方法、电子装置 | |
JP2014220309A (ja) | 多層基板およびこれを用いた電子装置、電子装置の製造方法 | |
CN215222596U (zh) | 一种电路板及电子装置 | |
JP2005072184A (ja) | メタルコアと多層基板の複合基板 | |
KR20110024686A (ko) | 방열기판 및 그 제조방법 | |
JP5078472B2 (ja) | メタルコア基板およびその製造方法 | |
WO2021084749A1 (ja) | 放熱基板及びその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120326 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20120326 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130312 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130509 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20131001 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20131016 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5394111 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |