JP2010239010A - Method for manufacturing printed wiring board, and printed wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To avoid occurrence of deflection and to improve productivity, in manufacturing a printed wiring board including an odd number of layers such as three layers and five layers by stamping. <P>SOLUTION: A first prepreg 101 is arranged around a support substrate 100. First copper foil layers 210 and 310 are arranged on both surfaces of the support substrate respectively. Second prepregs 220 and 320 are arranged on each first copper foil layer respectively. Second copper foil layers 230 and 330 are arranged on each second prepreg respectively, and a first lamination press is performed thereafter. Then, third prepregs 240 and 340 are further arranged on each second copper foil layer respectively, and third copper foil layers 250 and 350 are respectively arranged on each third prepreg. A second lamination press is performed to obtain a laminate 130. Then it is cut along a contour line C inside the end part of the support substrate 100 to separate a prepreg joint portion on periphery. Thus, printed wiring boards 200 and 300 of three-layer configuration are separated from both surfaces of the support substrate 100. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method of manufacturing an odd-structure thin film printed wiring board represented by three layers and a printed wiring board manufactured by the method, and more specifically, warpage of a substrate, which has been a problem peculiar to the odd-layer configuration. It is related with the technique which prevents this.

  In the field of electronic devices, especially portable electronic devices, the demand for thinning has become stricter in recent years, and accordingly, printed wiring boards mounted on electronic devices are also required to be thinned on the micron order. ing.

  As one of methods for meeting this demand, for example, a four-layer printed wiring board is reduced by one layer to have a three-layer configuration. By reducing one layer, for example, the thickness can be reduced to about 20 μm.

  Patent Document 1 describes an example of a method for manufacturing a printed wiring board having a three-layer structure, which will be described with reference to FIGS.

  First, as shown in FIG. 2A, a double-sided copper-clad laminated substrate having copper foil layers 12 and 13 on both sides of a base material 11 is used as the core substrate 10.

  Next, as shown in FIG. 2B, a photosensitive film (not shown) is pasted on both surfaces of the core substrate 10, and a pattern for forming an inner layer circuit wiring is baked only on one copper foil layer 13 that forms a circuit. Etching is performed to form the inner circuit wiring 13a. The other copper foil layer 12 remains as a solid pattern for forming the outer layer circuit wiring.

  Next, both surfaces are roughened with a predetermined agent to enhance adhesion to other materials, and then an insulating layer is formed on the surface side where the inner layer circuit wiring 13a is formed as shown in FIG. A copper foil layer 15 for forming an outer circuit wiring is laminated and pressed through a prepreg 14 as a wiring board 20 shown in FIG.

  Then, after removing the roughened surface of the copper foil layer 12 by chemical polishing or the like, outer layer circuit wirings 12a and 15a are respectively formed on the copper foil layers 12 and 15 as shown in FIG. Drilling is performed to form a plating layer, a solder resist layer, and the like to obtain an actual substrate of the three-layer printed wiring board 20.

JP 2002-261441 A (see paragraph [0002])

  However, in the above prior art, the copper foil layer 15 for forming the outer layer circuit wiring is pressed through the prepreg 14 on one side (the inner layer circuit wiring forming surface side) of the core substrate 10 made of the double-sided copper-clad laminate. Therefore, the following problems arise.

  That is, the base material 11 and the prepreg 14 used for the core substrate 10 have a difference in the base material shrinkage amount (generated internal stress) during the lamination press. Therefore, as shown in FIG. 3, the printed wiring board 20 may be warped. This warpage also appears when the internal stress is released in a later process.

  This type of board warpage not only causes troubles during transportation and handling in the manufacturing process, but also causes deviations in the parts mounting position, leading to incorrect mounting when mounting parts with automatic machines. It might be.

  As long as the three-layer printed wiring board is manufactured as described above, this warping is caused by laminating and pressing (build-up) a copper foil layer on both surfaces of the three-layer printed wiring board via a prepreg. This also occurs in the odd-numbered printed wiring board.

  Accordingly, the object of the present invention is to prevent the occurrence of warpage due to the difference in internal stress and increase the productivity when manufacturing printed wiring boards having an odd number of layers such as three layers, five layers, ... by pressing. It is in.

  In order to solve the above-described problems, the present invention provides a printed wiring board manufacturing method for manufacturing a printed wiring board having circuit wiring of an odd-numbered layer structure. A first prepreg, a first copper foil layer disposed on both surfaces of the support substrate, and a second prepreg, a second copper foil layer, and a third layer, each of which is sequentially laminated with a larger area than the support substrate. A multilayer laminate including a prepreg and a third copper foil layer, and the first prepreg is disposed around the support substrate, and the first copper foil layer is disposed on both sides of the support substrate. On each first copper foil layer, a predetermined number of layers of the multilayer laminate are laminated and integrated by pressing to obtain a laminated matrix, and then the laminated matrix is placed on the inner side of the end of the support substrate. Cut along the contour line The Rukoto, from both sides of the support substrate, is characterized by separating a printed wiring board having a circuit wiring odd layer configuration.

  When laminating the second prepreg, the second copper foil layer, the third prepreg, and the third copper foil layer of the multilayer laminate, preferably, after the second copper foil layer is laminated and the third copper foil layer Each press is performed after lamination.

  In the present invention, in order to manufacture a printed wiring board having a circuit wiring having a three-layer structure, a first step of arranging a first prepreg around a support substrate having smooth surfaces and a first step on each of both surfaces of the support substrate are provided. A second step of disposing a copper foil layer; a third step of disposing a second prepreg having an area larger than the support substrate on each of the first copper foil layers; and on each of the second prepregs. A fourth step in which a second copper foil layer having an area larger than that of the support substrate is disposed and the first lamination press is performed, and an area larger than that of the support substrate is provided on each of the second copper foil layers. A sixth step of performing a second laminating press by disposing a third copper foil layer having an area larger than that of the support substrate on each of the third prepregs; Process and second product And sequentially performing a seventh step of cutting the laminated body obtained by pressing along a predetermined contour line inside the end portion of the support substrate, from each side of the support substrate, the first copper foil layer, A printed wiring board having a three-layer structure including the second prepreg, the second copper foil layer, the third prepreg, and the third copper foil layer is separated.

  In the present invention, a double-sided copper-clad laminate is preferably used as the support substrate.

  When the support substrate is a double-sided copper-clad laminate, a base material drawn from the double-sided copper-clad laminate can be used as the first prepreg.

  When the first copper foil layer is smaller in area than the support substrate, the cutting in the seventh step is performed along the inner contour line from the end of the first copper foil layer.

  In the present invention, an inner layer circuit wiring is formed in the second copper foil layer between the fourth step and the fifth step, and after the seventh step, the first copper foil layer and the first step are performed. A mode in which outer layer circuit wiring is formed in each of the three copper foil layers is included.

  In addition, a via contact that establishes electrical continuity between the outer layer circuit wiring and the inner layer circuit wiring may be formed in the outer layer circuit wiring.

  In the present invention, in order to manufacture a printed wiring board having a circuit wiring having a five-layer structure, the third copper foil layer is formed on the third copper foil layer between the sixth step and the seventh step. After each of the fourth prepregs having a large area, a fourth copper foil layer having a larger area than the support substrate is further laminated on each of the fourth prepregs, and a third laminating press is performed, After disposing a fifth prepreg having a larger area than the support substrate on each fourth copper foil layer, a fifth copper foil layer having a larger area than the support substrate on each fifth prepreg. The fourth lamination press is performed, and after passing through the cutting step of the seventh step, the first copper foil layer, the second prepreg, the second copper foil layer, respectively, from both sides of the support substrate, The third prepreg, the third Copper foil, separating the fourth prepreg, said fourth foil layer, the printed wiring board of the five-layer structure consisting of the fifth prepreg and the fifth copper foil layer.

  Further, in the present invention, in order to manufacture a printed wiring board having a circuit wiring having a seven-layer structure, the fourth pressing is performed and then larger than the supporting substrate on each fifth copper foil layer. After each of the sixth prepregs having an area is disposed, a sixth copper foil layer having an area larger than that of the support substrate is further laminated on each of the sixth prepregs, and a fifth laminating press is performed. After disposing a seventh prepreg having an area larger than that of the support substrate on the sixth copper foil layer, a seventh copper foil layer having an area larger than that of the support substrate is further formed on each of the seventh prepregs. The sixth lamination press is performed, and after the cutting step of the seventh step, the first copper foil layer, the second prepreg, the second copper foil layer, Third prepreg, above Third copper foil layer, fourth prepreg, fourth copper foil layer, fifth prepreg, fifth copper foil layer, sixth prepreg, sixth copper foil layer, seventh prepreg, and seventh A printed wiring board having a seven-layer structure made of a copper foil layer is separated.

  Instead of the prepreg, an insulating resin for buildup may be used.

  The present invention also includes a printed wiring board having circuit wiring with an odd-numbered layer structure manufactured by the method for manufacturing a printed wiring board.

  According to the present invention, a print having at least three-layer circuit wiring including a first copper foil layer, a second prepreg, a second copper foil layer, a third prepreg, and a third copper foil layer on both surfaces of the support substrate, respectively. Since the wiring board is formed at the same time, the productivity is increased by about twice (the same is true for the printed wiring board having an odd number of layers of five or more layers).

  In addition, each printed wiring board has a first copper foil layer and a third copper foil layer for forming outer layer circuit wiring symmetrically on both sides of the second copper foil layer for forming inner layer circuit wiring through prepregs. Since they are laminated and the layer structure is the same on both sides of the second copper foil layer, it is possible to minimize the warpage of the substrate accompanying the release of internal stress during the lamination press and in the subsequent steps.

The schematic diagram which shows the support substrate used for this invention. The schematic diagram for demonstrating the 1st process-4th process of this invention. The schematic diagram which shows the laminated body obtained by the 1st lamination press of this invention. The schematic diagram which shows the state which formed the inner layer circuit wiring in the said laminated body by this invention. The schematic diagram for demonstrating the 5th process-6th process of this invention. The schematic diagram for demonstrating the 7th process of this invention. The schematic diagram which shows the process of isolate | separating a printed wiring board from a support substrate by this invention. The schematic diagram which shows the two printed wiring boards isolate | separated from the said support substrate. The schematic diagram which shows the state which formed the outer layer circuit wiring in each said printed wiring board. (A)-(e) The schematic diagram which shows the manufacturing process of the conventional 3 layer printed wiring board. The schematic diagram which shows the state which curvature generate | occur | produced in the three-layer printed wiring board produced by the prior art example.

  Next, an embodiment of the present invention will be described with reference to FIGS. 1 a to 1 i, but the present invention is not limited to this.

  In manufacturing a printed wiring board having an odd-numbered circuit wiring, in the present invention, a support substrate having smooth surfaces, a first prepreg disposed around the support substrate, and both surfaces of the support substrate are disposed. A multilayer laminate including a first copper foil layer and a second prepreg, a second copper foil layer, a third prepreg, and a third copper foil layer, each of which is sequentially laminated with a larger area than the support substrate. The first prepreg is disposed around the support substrate, and the first copper foil layer is disposed on both sides of the support substrate, and then the multilayer is formed on the first copper foil layer. After obtaining a laminated matrix in which a predetermined number of layers are laminated and integrated by pressing, the laminated matrix is cut along a predetermined contour line on the inner side from the end of the support substrate, thereby supporting the support. Odd numbers from both sides of the board A printed wiring board having a circuit wiring configuration separated.

  When laminating the second prepreg, the second copper foil layer, the third prepreg, and the third copper foil layer of the multilayer laminate, preferably, after the second copper foil layer is laminated and the third copper foil layer It is good to press each after lamination.

  Next, a description will be given of the case of manufacturing a printed wiring board having a three-layer structure among printed wiring boards having an odd-numbered layer structure. First, as shown in FIG. 1A, a support substrate 100 having smooth surfaces is prepared.

  The support substrate 100 is finally processed as waste material. However, in order to facilitate separation during the waste material processing, a double-sided printed wiring board having the same composition as the laminated substrate, that is, copper on both surfaces of the base material (prepreg) 111 A double-sided copper-clad laminate 110 having foil layers 112 and 113 is preferred.

  As a first step, a first prepreg 101 is arranged around the support substrate 100 as shown in FIG. When the double-sided copper-clad laminated substrate 110 is used as the support substrate 100, the first prepreg 101 may be used as a form in which the base material 111 is drawn from the peripheral surface and the base material part is larger than the copper foil part.

  As a second step, as shown in FIG. 1B, first copper foil layers 210 and 310 are disposed on both sides of the support substrate 100, respectively. The first copper foil layers 210 and 310 are preferably the same in area as the support substrate 100, but may be larger than the support substrate 100 or may be smaller.

  As a third step, as shown in FIG. 1b, a second prepreg 220 having an area larger than that of the support substrate 100 is disposed on one first copper foil layer 210, and similarly, the other first copper foil is disposed. A second prepreg 320 having an area larger than that of the support substrate 100 is also disposed on the layer 310. The second prepreg 220 and the second prepreg 320 are preferably the same material and the same thickness.

  As a fourth step, as shown in FIG. 1b, a second copper foil layer 230 having an area larger than that of the support substrate 100 is disposed on one second prepreg 220, and similarly, the other second prepreg 320 is disposed. A second copper foil layer 330 having an area larger than that of the support substrate 100 is also disposed on the substrate, and then the first laminating press is performed.

  By the first laminating press, the first prepreg 101 and the second prepregs 220 and 320 are tightly coupled to each other at the peripheral portion of the support substrate 100, and as shown in FIG. The laminate 120 in which the first copper foil layers 210 and 310 and the second copper foil layers 230 and 330 are integrated is obtained.

  In the printed wiring board having a three-layer structure, the second copper foil layers 230 and 330 exposed on the outer surface of the laminate 120 are copper foil layers for forming an inner layer circuit wiring. Therefore, as shown in FIG. Inner layer circuit wirings 230a and 330a are formed on the copper foil layers 230 and 330 as necessary. The circuit wiring may be formed by, for example, a subtractive method.

  When the second copper foil layers 230 and 330 are, for example, internal power layers or internal shield layers of a circuit board, the second copper foil layers 230 and 330 can be left as they are as a solid pattern. The circuit patterns of the inner layer circuit wirings 230a and 330a may be designed arbitrarily.

  Next, as a fifth step, preferably, the copper foil of the inner layer circuit wirings 230a and 330a is subjected to a roughening treatment, and then, as shown in FIG. 1e, one inner layer circuit wiring 230a (second copper foil layer 230). A third prepreg 240 having a larger area than the support substrate 100 is disposed on the second inner circuit wiring 330a (second copper foil layer 330), and a third prepreg 240 having a larger area than the support substrate 100 is disposed. Three prepregs 340 are arranged.

  Then, as the sixth step, as shown in FIG. 1e, a third copper foil layer 250 having an area larger than that of the support substrate 100 is disposed on one third prepreg 240, and similarly, the other third prepreg 240 is disposed. After the third copper foil layer 350 having a larger area than the support substrate 100 is disposed on the prepreg 340, the second lamination press is performed.

  By this second laminating press, as shown in FIG. 1 f, a laminated body 130 in which the third copper foil layers 250 and 350 are integrally laminated on both surfaces of the laminated body 120 via the third prepregs 240 and 340. Is obtained.

  The laminate 130 includes a first copper foil layer 210, a second prepreg 220, a second copper foil layer 230, a third prepreg 240, and a third copper foil layer 250 and is formed on one surface side of the support substrate 100. The other surface of the support substrate 100 including the printed wiring board 200 having a three-layer structure, the first copper foil layer 310, the second prepreg 320, the second copper foil layer 330, the third prepreg 340, and the third copper foil layer 350. Two three-layer printed wiring boards of the three-layer printed wiring board 300 formed on the side are included.

  Since the peripheral part of the laminated body 130 is sealed with the resin of each prepreg, an air pocket does not generate | occur | produce inside and a chemical | medical agent etc. do not flow in from the outside in a manufacturing process.

  Next, as a seventh step, the laminated body 130 is cut by a router or the like along a predetermined contour line inside the end portion of the support substrate 100 shown in FIG. 1f, and the prepregs 101, 220, 320 of the laminated body 130 are cut. , 240, and 340, the peripheral parts connected are separated.

  When the first copper foil layers 210 and 310 are smaller than the support substrate 100 in area, the periphery of the laminated body 130 along a predetermined contour line inside the end portions of the first copper foil layers 210 and 310. Separate the parts.

  Since the support substrate 100 and the first copper foil layers 210 and 310 are not bonded, the printed circuit board 200 having a three-layer structure is separated from the support substrate 100 as shown in FIG. 300 can be easily separated. FIG. 1 h shows two printed wiring boards 200 and 300 having a three-layer structure separated from the support substrate 100.

  In the printed wiring boards 200 and 300 having the three-layer structure, the first copper foil layers 210 and 310 and the third copper foil layers 250 and 350 are copper foil layers for forming outer layer circuit wiring, respectively. As shown in FIG. 1i, vias for conductive connection with the inner layer circuit wiring are formed in the first copper foil layers 210 and 310 and the third copper foil layers 250 and 350 by laser drilling, Plating (via-fill plating if necessary) to form outer layer circuit wirings 210a, 310a, 250a, 350a on the first copper foil layers 210, 310 and the third copper foil layers 250, 350, If necessary, a solder resist layer or the like is formed to obtain actual substrates of printed wiring boards 200 and 300 having a three-layer structure.

  The outer layer circuit wirings 210a, 310a, 250a, and 350a may be formed by, for example, a subtractive method as in the case of the inner layer circuit wiring. Further, a build-up insulating resin may be used instead of the prepreg. Further, if necessary, drilling with a drill may be added after laser drilling.

  When the support substrate 100 is thin and the peripheral portions of the support substrate 100 can be joined by the second prepregs 220 and 320, the first prepreg 101 can be omitted.

  In addition, as one example of a method for manufacturing a printed wiring board having a five-layer structure, it is larger than the support substrate 100 on the third copper foil layers 250 and 350 between the sixth step and the seventh step. After each of the fourth prepregs having an area is disposed, a fourth copper foil layer having a larger area than the support substrate 100 is further laminated on each fourth prepreg, and a third laminating press is performed. After disposing a fifth prepreg having an area larger than the support substrate 100 on the copper foil layer, a fifth copper foil layer having an area larger than the support substrate 100 is further laminated on each fifth prepreg. The fourth lamination press may be performed to cut in the seventh step.

  In addition, as another example of a method of manufacturing a printed wiring board having a five-layer structure, each first copper foil layer and each of the printed wiring boards 200 and 300 having a three-layer structure cut and separated in the seventh step are used. After the fourth prepreg having a larger area than the printed wiring boards 200 and 300 is disposed on the three copper foil layers, the fourth prepreg has a larger area than the printed wiring boards 200 and 300. What is necessary is just to laminate | stack a 4th copper foil layer and to perform a lamination press.

  As described above, according to the present invention, the support substrate is arranged at the center, and the layers are sequentially laminated (build-up) evenly on both sides thereof, so that almost no warpage occurs in the laminated state. Further, since the two three-layer substrates are obtained by cutting and removing the joints around the laminated body, the warpage of the three-layer substrate itself can be suppressed to a small level.

  In addition, since the thickness of the multilayer substrate handled in the manufacturing process is relatively large, it is possible to avoid the occurrence of conveyance troubles and remodeling of equipment (including new introduction of dedicated equipment), It can be handled by manufacturing equipment.

DESCRIPTION OF SYMBOLS 100 Support substrate 101 1st prepreg 110 Double-sided copper clad laminated substrate 210,310 1st copper foil layer 220,320 2nd prepreg 230,330 2nd copper foil layer 230a, 330a Inner layer circuit wiring 240,340 3rd prepreg 250,350 Third copper foil layer 250a, 350a Outer layer circuit wiring

Claims (12)

In a printed wiring board manufacturing method for manufacturing a printed wiring board having circuit wiring of an odd number of layers,
A support substrate having smooth surfaces, a first prepreg disposed around the support substrate, and a first copper foil layer disposed on both surfaces of the support substrate, each having a larger area than the support substrate. A multilayer laminate including a second prepreg, a second copper foil layer, a third prepreg and a third copper foil layer, which are sequentially laminated.
The first prepreg is arranged around the support substrate, and the first copper foil layers are arranged on both surfaces of the support substrate, respectively, and then the multilayer laminate is predetermined on each first copper foil layer. After obtaining a laminated matrix that is laminated by the number of layers and integrated by pressing, by cutting the laminated matrix along a predetermined contour line inside the end of the support substrate, from both sides of the support substrate, A method of manufacturing a printed wiring board, comprising separating a printed wiring board having circuit wiring of an odd number of layers.   When laminating the second prepreg, the second copper foil layer, the third prepreg and the third copper foil layer of the multilayer laminate, after laminating the second copper foil layer and after laminating the third copper foil layer, respectively. 2. The printed wiring board manufacturing method according to claim 1, wherein pressing is performed. In a printed wiring board manufacturing method for manufacturing a printed wiring board having circuit wiring of an odd number of layers,
A first step of disposing a first prepreg around a support substrate having smooth sides;
A second step of disposing a first copper foil layer on each side of the support substrate;
A third step of disposing a second prepreg having an area larger than that of the support substrate on each of the first copper foil layers;
A fourth step in which a second copper foil layer having an area larger than that of the support substrate is disposed on each of the second prepregs to perform a first laminating press;
A fifth step of disposing a third prepreg having an area larger than that of the support substrate on each of the second copper foil layers;
A sixth step of placing a third copper foil layer having a larger area than the support substrate on each of the third prepregs and performing a second laminating press;
And sequentially performing a seventh step of cutting the laminated body obtained by the second laminating press along a predetermined contour inside the end portion of the support substrate,
A printed wiring board having a three-layer structure including the first copper foil layer, the second prepreg, the second copper foil layer, the third prepreg, and the third copper foil layer is separated from both surfaces of the support substrate. A printed wiring board manufacturing method characterized by the above.   The printed wiring board manufacturing method according to claim 3, wherein a double-sided copper-clad laminated substrate is used as the support substrate.   The printed wiring board manufacturing method according to claim 4, wherein a base material drawn from the double-sided copper-clad laminate is used as the first prepreg.   When the first copper foil layer is smaller in area than the support substrate, the cutting in the seventh step is performed along the inner contour line from the end of the first copper foil layer. The manufacturing method of the printed wiring board of any one of Claim 3 thru | or 5.   Inner layer circuit wiring is formed in the second copper foil layer between the fourth step and the fifth step, and after performing the seventh step, the first copper foil layer and the third copper foil layer 5. The method of manufacturing a printed wiring board according to claim 1, wherein outer layer circuit wirings are respectively formed on the printed circuit boards.   The method of manufacturing a printed wiring board according to claim 7, wherein a via contact that establishes electrical continuity between the outer layer circuit wiring and the inner layer circuit wiring is formed in the outer layer circuit wiring. Between the sixth step and the seventh step, a fourth prepreg having a larger area than the support substrate is disposed on each third copper foil layer, and then on each fourth prepreg. Further, a fourth copper foil layer having an area larger than that of the support substrate is laminated, and a third lamination press is performed.
After disposing a fifth prepreg having an area larger than that of the support substrate on each of the fourth copper foil layers, a fifth copper foil having an area larger than that of the support substrate on each of the fifth prepregs. Laminate the layers and perform the fourth lamination press,
Through the cutting step of the seventh step, the first copper foil layer, the second prepreg, the second copper foil layer, the third prepreg, the third copper foil layer, and the above from both sides of the support substrate, respectively. 9. The printed wiring board having a five-layer structure comprising a fourth prepreg, the fourth copper foil layer, the fifth prepreg, and the fifth copper foil layer is separated. 9. The manufacturing method of the printed wiring board of description. After performing the fourth press, after disposing a sixth prepreg having an area larger than that of the support substrate on each fifth copper foil layer, the support is further provided on each sixth prepreg. Laminating a sixth copper foil layer having a larger area than the substrate and performing a fifth laminating press,
After disposing a seventh prepreg having an area larger than that of the support substrate on each of the sixth copper foil layers, a seventh copper foil having an area larger than that of the support substrate on each of the seventh prepregs. Laminate the layers and perform the 6th laminating press,
Through the cutting step of the seventh step, the first copper foil layer, the second prepreg, the second copper foil layer, the third prepreg, the third copper foil layer, and the above from both sides of the support substrate, respectively. Seven layers comprising a fourth prepreg, the fourth copper foil layer, the fifth prepreg, the fifth copper foil layer, the sixth prepreg, the sixth copper foil layer, the seventh prepreg and the seventh copper foil layer The method for manufacturing a printed wiring board according to claim 9, wherein the printed wiring board having a configuration is separated.   The method for manufacturing a printed wiring board according to any one of claims 1 to 10, wherein an insulating resin for buildup is used instead of the prepreg.   The printed wiring board which has the circuit wiring of the odd number layer structure manufactured by the manufacturing method of the printed wiring board of any one of Claim 1 thru | or 11.

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