JP2010238818A - Heat transfer apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat transfer apparatus that enables a computer to have high performance and reduction in size simultaneously. <P>SOLUTION: This heat transfer apparatus comprises: a heat absorption section 1 that has a first member 1a made of metal, a second member 1b made of n-type semiconductor connected to the first member 1a, and a third member 1c of p-type semiconductor connected to the first member 1a; a heat irradiation section 2 that has a fourth member 2a made of metal, a fifth member 2b of n-type semiconductor connected to the fourth member 2a, and a sixth member 2c of p-type semiconductor connected to the fourth member 2a; a first connection part 3 on the side of the heat absorption section, a first transmission line 7, and a first connection part 5 on the side of the heat irradiation section, all being made of metal that connect the second member 1b with the fifth member 2b; a second connection part 4 and a second transmission line 8 both made of metal that connect a negative electrode of DC power supply A with the third member 1c; and a second connection part 6 on the side of the heat irradiation section and a third transmission line 9 both made of metal that connect a positive electrode of DC power supply A with the sixth member 2c. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a heat transfer device for transferring heat.

  At present, computers such as PCs are widely used and are used by many people. Many electronic devices such as a CPU are incorporated in a computer, and heat is generated inside the computer. In recent years, in order to improve processing performance, more electronic devices are incorporated in a computer than in the past, and therefore, the amount of heat generated inside the computer is increasing.

  Currently, fans, refrigerant (cold liquid), and heat pipes are used to transfer heat generated inside the computer to the outside of the computer.

JP 2003-110264 A

  However, when a fan, a cooling device using a refrigerant, or a heat pipe is incorporated in a computer, a space for arranging them is required, so that the design of the casing is limited, and the size of the computer increases. Users demand high performance from computers and miniaturization.

  An object of this invention is to provide the heat transfer apparatus which can make high performance and size reduction of a computer compatible.

  In order to solve the above problems and achieve the above object, the heat transfer device of the present invention is formed of a first member made of metal and an n-type semiconductor connected to the first member. A heat absorbing part having a second member and a third member formed of a p-type semiconductor connected to the first member, a fourth member formed of metal, and connected to the fourth member A heat dissipating part having a fifth member formed of an n-type semiconductor and a sixth member formed of a p-type semiconductor connected to the fourth member; and the second member A first conductor formed of metal that connects the fifth member; a second conductor formed of metal that connects a negative electrode of a DC power source and the third member; and the DC power source The positive electrode and the sixth member To continue, and a third conductor which is formed by metal.

  The present invention can provide a heat transfer device that can achieve both high performance and downsizing of a computer.

1 is a configuration diagram of a heat transfer device according to Embodiment 1. FIG. It is a figure which shows the condition which transfers the heat which generate | occur | produces inside a computer to the exterior of a computer with a heat transfer apparatus. It is a figure which shows the condition which transfers the heat which the large-scale computer arrange | positioned in the room emits to the exterior of a room with a heat transfer apparatus. It is a block diagram of the heat transfer apparatus of Embodiment 2. FIG. 6 is a configuration diagram of a heat transfer device according to a third embodiment.

  EMBODIMENT OF THE INVENTION Below, the form for implementing this invention is demonstrated with reference to drawings.

(Embodiment 1)
First, the structure of the heat transfer apparatus of Embodiment 1 is demonstrated using FIG.

  FIG. 1 is a configuration diagram of the heat transfer device according to the first embodiment. The heat transfer device according to the first embodiment is a device that transfers heat, and as shown in FIG. 1, the heat absorption part 1, the heat dissipation part 2, the heat absorption side first connection part 3, and the heat absorption side second part. Connecting portion 4, heat radiation side first connection portion 5, heat radiation side second connection portion 6, first transmission path 7, second transmission path 8, and third transmission path 9. Have. The heat transfer device is connected to a DC power source A.

  The heat absorption part 1 has a function of absorbing heat from the outside of the heat transfer device, and is composed of a first member 1a, a second member 1b, and a third member 1c. The first member 1a is made of copper. The shape is plate-shaped. The second member 1b is a member formed of an n-type semiconductor connected to one end of the first member 1a. The third member 1c is a member formed of a p-type semiconductor connected to the other end of the first member 1a. The second member 1b and the third member 1c are provided on one surface of the plate-like first member 1a.

  The heat radiating unit 2 has a function of releasing the heat transferred from the heat absorbing unit 1 to the outside of the heat transfer device, and includes a fourth member 2a, a fifth member 2b, and a sixth member 2c. . The 4th member 2a is formed with metals, such as copper, and the shape is plate shape. The fifth member 2b is a member formed of an n-type semiconductor connected to one end of the fourth member 2a. The sixth member 2c is a member formed of a p-type semiconductor connected to the other end of the fourth member 2a. The fifth member 2b and the sixth member 2c are provided on one surface of the plate-like fourth member 2a.

  The heat absorption side first connection part 3 is formed of a metal such as copper, and one end of the heat absorption side first connection part 3 is connected to the second member 1b of the heat absorption part 1, and the heat absorption side first The other end of the connection unit 3 is connected to the first transmission path 7.

  The heat absorption side second connection portion 4 is formed of a metal such as copper, and one end of the heat absorption side second connection portion 4 is connected to the third member 1c of the heat absorption portion 1, and the heat absorption side second connection portion 4 is formed. The other end of the connection unit 4 is connected to the second transmission path 8.

  The heat radiation side first connection part 5 is formed of a metal such as copper, and one end of the heat radiation side first connection part 5 is connected to the fifth member 2b of the heat radiation part 2, and the heat radiation side first connection part 5 The other end of the connection unit 5 is connected to the first transmission path 7.

  The heat dissipation side second connection portion 6 is formed of a metal such as copper, and one end of the heat dissipation side second connection portion 6 is connected to the sixth member 2c of the heat dissipation portion 2, The other end of the connection unit 6 is connected to the third transmission path 9.

  The first transmission path 7 is a linear body formed of a metal such as copper, and one end of the first transmission path 7 is connected to the heat absorption side first connection portion 3, and the first transmission path 7 The other end of the path 7 is connected to the heat radiation side first connection portion 5.

  The second transmission path 8 is a linear body formed of a metal such as copper, and one end of the second transmission path 8 is connected to the negative electrode of the DC power source A and the other end of the second transmission path 8. Is connected to the second connection portion 4 on the heat absorption side.

  The third transmission path 9 is a linear body formed of a metal such as copper. One end of the third transmission path 9 is connected to the positive electrode of the DC power source A and the other end of the third transmission path 9 Is connected to the second connection portion 6 on the heat radiation side.

  By the way, according to the Peltier effect, when current flows from the n-type semiconductor to the p-type semiconductor, heat is absorbed at the junction between the n-type semiconductor and the p-type semiconductor. Also, according to the Peltier effect, when current flows from the p-type semiconductor to the n-type semiconductor, heat is radiated at the junction between the p-type semiconductor and the n-type semiconductor. Further, the heat moves in the direction of the electron flow (the direction opposite to the current flow).

  As shown in FIG. 1, the heat transfer device of the first embodiment forms a series circuit, and one end of the second transmission path 8 is connected to the negative electrode of the DC power source A, and the third transmission path 9 Is connected to the positive electrode of the DC power source A, a current flows in the direction of the arrow X. Therefore, the heat absorption part 1 absorbs the heat in the direction of the arrow Y from the outside of the heat transfer device, and the heat passes through the heat absorption side first connection part 3 and the first transmission path 7 to the heat radiation part 2. The heat radiating unit 2 releases the heat absorbed by the heat absorbing unit 1 from the outside of the heat transfer device to the outside of the heat transfer device in the direction of arrow Z.

  As described above, in the heat transfer device of the first embodiment, the heat absorption unit 1 absorbs heat from outside the heat transfer device, and the heat dissipation unit 2 absorbs heat absorbed by the heat absorption unit 1 from outside the heat transfer device. Release to the outside of the device. That is, the heat transfer device of the first embodiment transfers heat by electrical means.

  Since the first transmission path 7, the second transmission path 8, and the third transmission path 9 are linear bodies formed of metal, the degree of freedom of their position and length is large in design. . Therefore, as shown in FIG. 2, the heat absorption part 1 of the heat transfer device is arranged in the vicinity of the heat source Q such as a CPU inside the housing P of the computer, and the heat radiation part 2 of the heat transfer device is arranged outside the case P. be able to. Then, the heat transfer device can transfer the heat generated by the heat source Q inside the housing P to the outside of the housing P. If the cooling device R is arranged in the vicinity of the heat radiating part 2 arranged outside the housing P, the heat radiating part 2 due to the heat transferred to the outside of the housing P and damage due to the heat in the vicinity thereof can be suppressed. .

  Since the endothermic part 1 can be reduced in size (area and volume), if the size of the endothermic part 1 is reduced, the housing P can be reduced. In addition, if the size of the heat absorbing portion 1 is reduced, the degree of freedom of arrangement of electronic devices within the housing P is increased, so that electronic devices such as CPUs that achieve high performance can be freely operated without increasing the size of the housing P. Can be arranged.

  Therefore, the heat transfer apparatus according to the first embodiment can achieve both high performance and downsizing of the computer.

  In addition, the heat transfer apparatus of Embodiment 1 can also be arrange | positioned in the room where many large-scale computers which process a lot of data are arranged. FIG. 3 is a diagram illustrating a state in which heat generated by the large-scale computer C disposed in the room S is transferred to the outside of the room S by the heat transfer device. In FIG. 3, three large-scale computers C are arranged inside the room S, and the heat absorption unit 1 of the heat transfer device is arranged in the vicinity of the heat source of each large-scale computer C. The heat radiating part 2 of the heat transfer device is arranged in the vicinity of the cooling device R outside the room S.

  In such a situation, heat generated by the large-scale computer C can be transferred to the outside of the room S for processing. That is, it is not necessary to install a cooling device for cooling the air inside the room S in the room S where a large number of large-scale computers C are arranged. Therefore, the room S can be used effectively. For example, a large number of large-scale computers C can be arranged in the room S.

  In addition, since the 1st transmission path 7, the 2nd transmission path 8, and the 3rd transmission path 9 are the linear bodies formed with the metal, the heat transfer apparatus of Embodiment 1 is a heat source. The generated heat can be transferred over a relatively long distance (several tens of centimeters to several tens of meters).

  Moreover, the heat absorption side 1st connection part 3, the heat radiation side 1st connection part 5, and the 1st transmission line 7 are examples of the 1st conductor of the heat transfer apparatus of this invention. The heat absorption side second connection portion 4 and the second transmission path 8 are examples of the second conductor of the heat transfer device of the present invention. The heat radiation side second connection portion 6 and the third transmission path 9 are examples of the third conductor of the heat transfer device of the present invention.

(Embodiment 2)
Next, the structure of the heat transfer apparatus of Embodiment 2 is demonstrated using FIG.

  FIG. 4 is a configuration diagram of the heat transfer device according to the second embodiment. As shown in FIG. 4, the heat transfer device according to the second embodiment includes three heat absorbing portions 1 and three heat radiating portions 2, and the three heat absorbing portions 1 are connected in parallel. And the three heat radiating parts 2 are also connected in parallel. That is, the heat absorption side first connection part 3 connected to each heat absorption part 1 is connected to the first transmission path 7, and the heat absorption side second connection part 4 connected to each heat absorption part 1. Are connected to the second transmission line 8. In addition, the heat-dissipation-side first connection part 5 connected to each heat-dissipation part 2 is connected to the first transmission path 7, and the heat-dissipation-side second connection part 6 connected to each heat-dissipation part 2. Are connected to the third transmission line 9.

  As described in the first embodiment, the heat transfer device according to the second embodiment can be obtained by connecting the plurality of heat absorbing units 1 in parallel and connecting the plurality of heat radiating units 2 in parallel. Each of the plurality of heat absorbing portions 1 can absorb heat from the outside, and each of the plurality of heat radiating portions 2 can release the heat absorbed by the plurality of heat absorbing portions 1 to the outside. Therefore, the heat transfer device of the second embodiment is used in the same manner as the heat transfer device of the first embodiment, and exhibits the same effect as the heat transfer device of the first embodiment. That is, the heat transfer device of the second embodiment can achieve both high performance and miniaturization of the computer.

(Embodiment 3)
Next, the structure of the heat transfer apparatus of Embodiment 3 is demonstrated using FIG.

  FIG. 5 is a configuration diagram of the heat transfer device according to the third embodiment. As shown in FIG. 5, the heat transfer device of the third embodiment includes a first heat exchange member 10 and a second heat exchange member 11 in addition to the components included in the heat transfer device of the first embodiment. Have.

  As shown in FIG. 5, the first heat exchange member 10 includes a heat absorbing side first connecting portion 3 and a second member 1 b of the heat absorbing portion 1, a heat absorbing side second connection portion 4 and a third member of the heat absorbing portion 1. It is arrange | positioned between 1c. Further, the second heat exchange member 11 is disposed between the heat radiation side first connection part 5 and the fifth member 2b of the heat radiation part 2 and the heat radiation side second connection part 6 and the sixth member 2c of the heat radiation part 2. Has been placed. The first heat exchange member 10 and the second heat exchange member 11 are members having high heat conductivity and electrically insulating properties, such as a glass plate.

  Due to the Peltier effect, heat is radiated (arrow Y1 in FIG. 5) at the joining portion of the heat absorption side first connection part 3 and the second member 1b of the heat absorption part 1, and the heat absorption side second connection part 4 and the heat absorption part 1 Heat absorption (arrow Z1 in FIG. 5) occurs at the joint portion with the third member 1c. In addition, heat radiation (arrow Y2 in FIG. 5) occurs at the joint portion between the heat radiation side second connection portion 6 and the sixth member 2c of the heat radiation portion 2, and the heat radiation side second connection portion 6 and the sixth heat radiation portion 2 sixth. Heat absorption (arrow Z2 in FIG. 5) occurs at the joint portion with the member 2c.

  By the way, the amount of heat Y1 released at the joint portion between the heat absorption side first connection part 3 and the second member 1b of the heat absorption part 1, and the heat absorption side second connection part 4 and the third member 1c of the heat absorption part 1 are shown. It is considered that the amount of heat Z1 absorbed at the joint portion is substantially equal. Also, the amount of heat Y2 released at the joint portion between the heat radiation side second connection portion 6 and the sixth member 2c of the heat radiation portion 2, and the heat radiation side first connection portion 5 and the fifth member 2b of the heat radiation portion 2 It can be considered that the amount of heat Y2 absorbed at the joint portion is substantially equal.

  Therefore, the heat transfer device of the third embodiment absorbs the heat released at the joint portion between the heat absorption side first connection portion 3 and the second member 1b of the heat absorption portion 1 to absorb the heat absorption side second connection portion 4. And the first heat exchange member 10 that releases the absorbed heat at the joint portion between the heat absorbing portion 1 and the third member 1c. Further, the heat transfer device of the third embodiment absorbs heat released at the joint portion between the heat radiation side second connection portion 6 and the sixth member 2c of the heat radiation portion 2 to absorb the heat radiation side first connection portion 5. And a second heat exchange member 11 that releases the absorbed heat at the joint portion between the heat dissipating part 2 and the fifth member 2b.

  As a result, the heat generated in the circuit constituting the heat transfer device can be absorbed in the circuit, and the heat radiating unit 2 reliably releases the heat absorbed by the heat absorbing unit 1 to the outside of the heat transfer device. be able to.

  DESCRIPTION OF SYMBOLS 1 Heat absorption part, 1a 1st member, 1b 2nd member, 1c 3rd member, 2 Heat radiation part, 2a 4th member, 2b 5th member, 2c 6th member, 3 Heat absorption side 1st connection part, 4 Heat absorption side 2nd connection part, 5 Heat radiation side 1st connection part, 6 Heat radiation side 2nd connection part, 7 1st transmission line, 8 2nd transmission line, 9 3rd transmission line.

Claims (3)

A first member formed of metal, a second member formed of n-type semiconductor connected to the first member, and a p-type semiconductor connected to the first member. An endothermic part having a third member,
A fourth member formed of metal, a fifth member formed of n-type semiconductor connected to the fourth member, and a p-type semiconductor connected to the fourth member. A heat dissipating part having a sixth member,
A first conductor formed of metal that connects the second member and the fifth member;
A second conductor formed of metal that connects the negative electrode of the DC power source and the third member;
A heat transfer device comprising: a third conductor formed of metal that connects the positive electrode of the DC power source and the sixth member. There are a plurality of the heat dissipating part and the heat absorbing part,
A second member of each heat absorbing portion is connected to the first conductor;
A third member of each of the heat absorbing portions is connected to the second conductor;
The fifth member of each of the heat dissipation portions is connected to the first conductor,
The heat transfer device according to claim 1, wherein a sixth member of each of the heat radiating portions is connected to the third conductor. Furthermore, a first heat exchange member and a second heat exchange member are provided,
The first member and the second member are plate-like members,
The second member and the third member are arranged to face one surface side of the first member,
The fifth member and the sixth member are arranged to face one surface side of the fourth member,
The first heat exchange member is disposed between the second member and the third member;
The heat transfer device according to claim 1, wherein the second heat exchange member is disposed between the fifth member and the sixth member.

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