JP2010230076A - Gate valve device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To install a heater on a valve element for opening and closing an opening, and to easily supply electric power to this heater. <P>SOLUTION: A gate valve 10 includes: the valve element 12 for opening and closing the opening 112 provided on a wall that partitions into adjacent two spaces; a valve body moving device 20 moving the valve element 12; the heater 13 for heating the valve element 12; and a connector electrically connected to the heater 13 and electrically and physically connectable to an electric power output part that outputs electric power to be supplied to the heater 13. The valve element 12, the heater 13, and the connector are integrated. The connector is interlocked with the valve element 12 to be electrically and physically connected to the electric power output part with the valve element 12 blocking the opening 112, and electrically and physically separated from the electric power output part with the valve element 12 opening the opening 112. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a gate valve device for opening and closing an opening provided in a wall that partitions two adjacent spaces, such as an opening of a vacuum chamber for processing a substrate under vacuum conditions.

  2. Description of the Related Art A vacuum processing system is used to perform processing such as plasma etching, plasma ashing, and plasma film formation on a substrate such as a glass substrate for FPD (flat panel display) under vacuum conditions. This vacuum processing system includes, for example, a process chamber in which processing is performed on a substrate, a transfer chamber that contains a transfer device that carries a substrate into and out of the process chamber, a process chamber and a transfer chamber A gate valve device or the like provided between the two is provided. Both the process chamber and the transfer chamber are vacuum chambers for processing the substrate under vacuum conditions.

  The process chamber has an opening for allowing the substrate to pass through when the substrate is carried in or out. A gate valve device provided between a process chamber and a transfer chamber has a valve body that opens and closes an opening of the process chamber. The process chamber is hermetically sealed by closing the opening of the process chamber by the valve body.

  Processing performed in the process chamber includes processing that produces by-products that may be deposited during processing, such as oxide film etching. If a by-product adheres to the inner wall of the process chamber during such processing, the by-product is peeled off from the inner wall to generate particles (floating particles), which may cause etching defects. Therefore, when performing such treatment, in order to prevent by-products from adhering to the inner wall of the process chamber, a high-temperature medium is circulated around the process chamber by a chiller (constant temperature device), and the process chamber is circulated. The temperature is raised to about 100 ° C.

  When processing is performed in the process chamber, the opening of the process chamber is closed by the valve body of the gate valve device. In this state, a part of the surface of the valve body is exposed to the space in the process chamber. The valve body cannot be heated directly by the chiller. Further, since the contact area between the valve element and the process chamber is small, even if the process chamber is heated to about 100 ° C. by the chiller as described above, the valve element is not heated in the same manner. Therefore, in a state where the opening of the process chamber is closed by the valve body, a by-product tends to adhere to a portion of the surface of the valve body exposed to the space in the process chamber. If a by-product adheres to this portion, particles may be generated and etching defects may occur as in the case where the by-product adheres to the inner wall of the process chamber.

  Therefore, conventionally, in order to prevent by-products from adhering to the surface of the valve body, for example, as described in Patent Documents 1 to 3, a heater is attached to the valve body, and the valve body is directly heated by the heater. It has been proposed to do.

Japanese Patent Laid-Open No. 2001-4505 Japanese Patent Laid-Open No. 10-132095 JP 11-325313 A

  By the way, in the gate valve device, a driving mechanism for moving the valve body is required to open and close the opening. As the drive mechanism, a mechanism in which the valve body does not rub against other structures is preferable in order to prevent generation of particles due to the valve body rubbing against other structures. As a mechanism in which the valve body does not rub against other structures in this way, for example, when the valve body closes the opening, the direction parallel to the surface of the wall having the opening is provided up to a position facing the opening. Then, the valve body is moved toward the opening in a direction perpendicular to the surface of the wall. When the valve body opens the opening, it is the opposite of closing the opening. A mechanism for performing the operation is conceivable. Such a mechanism can be realized, for example, by connecting a valve body to a base member driven in a direction parallel to the wall surface via a link mechanism.

  Here, consider a case where a heater is attached to a valve body in a gate valve device including a drive mechanism in which the valve body is connected to the base member via a link mechanism. In this case, in order to supply power to the heater, it is conceivable to provide a power supply cable so as to be connected to the heater via the base member and the link mechanism. However, in a gate valve device including a drive mechanism in which a valve body is connected to a base member via a link mechanism, an integrated valve body, a heater, and a base are operated in accordance with an operation of opening and closing the opening by the valve body. Since the relative positional relationship with the member changes, there is a problem that it is difficult to provide a power supply cable so as to be connected to the heater via the base member and the link mechanism.

  The present invention has been made in view of the above problems, and an object of the present invention is to attach a heater to a valve body for opening and closing an opening, and to easily supply power to the heater. To provide an apparatus.

  The gate valve device of the present invention includes a valve body for opening and closing an opening provided in a wall partitioning two adjacent spaces, and a valve body for moving the valve body to open and close the opening by the valve body Electrically and physically connected to a moving means, a heater for heating the valve body, and a power output unit that is electrically connected to the heater and outputs power supplied to the heater With possible connectors. The valve body, the heater and the connector are integrated. The connector is electrically and physically connected to the power output unit when the valve body closes the opening, and is electrically connected to the power output unit when the valve body opens the opening. It interlocks with the valve body so as to be physically and physically deviated.

  In the gate valve device according to the present invention, the power output unit may be fixed to the wall.

  Moreover, the gate valve device of the present invention may further include a housing that accommodates the valve body, the heater, and the connector, and the power output unit may be fixed to the housing. In this case, the housing may include a wall constituent part constituting at least a part of the wall, and the power output unit may be fixed to the wall constituent part.

  Further, the gate valve device of the present invention is further provided between a power source for supplying power to the power output unit and the power output unit, and supplies and shuts off power to the power output unit. A switch to be selected may be provided.

  The gate valve device of the present invention is further integrated with the valve body, the heater, and the connector, and is electrically connected to the heater, and outputs second power supplied to the heater. You may provide the subconnector which can be electrically and physically connected with respect to an output part. The sub-connector is electrically and physically separated from the second power output portion when the valve body closes the opening, and the sub-connector is electrically connected to the second power output portion when the valve body opens the opening. It interlock | cooperates with the said valve body so that it may connect electrically and physically with respect to 2 electric power output parts.

  The gate valve device of the present invention may further include the second power output unit. In this case, the gate valve device may further include a housing that accommodates the valve body, the heater, the connector, and the sub connector, and the second power output unit may be fixed to the housing. The gate valve device is further provided between a power source for supplying power to the second power output unit and the second power output unit, and power to the second power output unit. There may be provided a switch for selecting between supply and shutoff.

  In the gate valve device of the present invention, the valve body moving means connects a base member, a driving means for moving the base member in a direction parallel to the surface of the wall, and the base member and the valve body. When the opening is closed by the valve body, the valve body is moved in a direction parallel to the surface of the wall to a position facing the opening, and then the valve The body is moved toward the opening in a direction perpendicular to the wall surface, and when the valve body opens the opening, the valve body is opposite to when the opening is closed. An operation may be performed.

  In the gate valve device of the present invention, one of the two spaces may be inside a vacuum chamber for processing the substrate under vacuum conditions.

  In the gate valve device of the present invention, in a state where the valve body opens the opening, the connector electrically connected to the heater is electrically and physically separated from the power output unit, but the valve body is open. In a state in which the connector is closed, the connector is electrically and physically connected to the power output unit, and power can be supplied to the heater. Thus, according to the gate valve device of the present invention, it is possible to attach a heater to a valve body and easily supply power to the heater without providing a power supply cable so as to be directly connected to the heater. There is an effect that can be done.

1 is a perspective view schematically showing a vacuum processing system including a gate valve device according to a first embodiment of the present invention. It is a top view which shows roughly the inside of the vacuum processing system shown in FIG. It is sectional drawing which shows the structure of the gate valve apparatus which concerns on the 1st Embodiment of this invention. It is sectional drawing which shows the other state of the gate valve apparatus shown in FIG. It is sectional drawing which shows the further another state of the gate valve apparatus shown in FIG. It is a front view which shows the valve body, heater, and connector part of the gate valve apparatus in the state shown in FIG. It is a front view which shows the terminal part connected to the connector part shown in FIG. It is a circuit diagram which shows the circuit structure of the gate valve apparatus which concerns on the 1st Embodiment of this invention. It is explanatory drawing for demonstrating operation | movement of the gate valve apparatus which concerns on the 1st Embodiment of this invention. It is sectional drawing which shows the structure of the gate valve apparatus which concerns on the 2nd Embodiment of this invention. It is sectional drawing which shows the other state of the gate valve apparatus shown in FIG. It is sectional drawing which shows the further another state of the gate valve apparatus shown in FIG. It is sectional drawing which shows the structure of the gate valve apparatus which concerns on the 3rd Embodiment of this invention. It is sectional drawing which shows the other state of the gate valve apparatus shown in FIG. It is sectional drawing which shows the further another state of the gate valve apparatus shown in FIG. It is a front view which shows the valve body of the gate valve apparatus in the state shown in FIG. 14, a heater, a connector part, a subconnector part, and a subterminal part. It is a circuit diagram which shows the circuit structure of the gate valve apparatus which concerns on the 3rd Embodiment of this invention.

[First Embodiment]
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. First, the configuration of a vacuum processing system 100 as an example of a system including a gate valve device according to a first embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 is a perspective view schematically showing a vacuum processing system 100. FIG. 2 is a plan view schematically showing the inside of the vacuum processing system 100. The vacuum processing system 100 is configured as a processing system for performing plasma processing on a glass substrate (hereinafter simply referred to as “substrate”) S for FPD, for example. Examples of the FPD include a liquid crystal display (LCD), an electro luminescence (EL) display, a plasma display panel (PDP), and the like.

  The vacuum processing system 100 includes five vacuum chambers connected in a cross shape. Specifically, the vacuum processing system 100 includes three process chambers 101a, 101b, and 101c, a transfer chamber 103, and a load lock chamber 105 as five vacuum chambers. In these vacuum chambers, the transfer chamber 103 is disposed in the center. The transfer chamber 103 has four side surfaces. The process chambers 101 a, 101 b, 101 c and the load lock chamber 105 are arranged adjacent to each side surface of the transfer chamber 103.

  Although not shown, the vacuum processing system 100 further includes three chillers attached to the process chambers 101a, 101b, and 101c, respectively. Each of these three chillers can raise the temperature of the process chambers 101a, 101b, and 101c to a predetermined temperature (for example, 120 ° C.).

  The process chambers 101a, 101b, and 101c are configured so that their internal spaces can be maintained in a predetermined reduced pressure atmosphere (vacuum state). In the process chambers 101a, 101b, and 101c, susceptors 102 as placement platforms on which the substrates S are placed are respectively provided.

  In the process chambers 101a, 101b, and 101c, with the substrate S placed on the susceptor 102, the substrate S is subjected to plasma processing such as etching processing, ashing processing, and film forming processing under vacuum conditions. In the process chambers 101a, 101b, and 101c, apparatuses for processing performed therein are accommodated, respectively. In the vacuum processing system 100, the same type of processing may be performed in the three process chambers 101a, 101b, and 101c, or different types of processing may be performed for each process chamber. The number of process chambers is not limited to three and may be four or more.

  The transfer chamber 103 is configured so that it can be maintained in a predetermined reduced-pressure atmosphere in the same manner as the process chambers 101a, 101b, and 101c. The vacuum processing system 100 further includes a transfer device 133 provided in the transfer chamber 103. The transport device 133 has a comb-like fork 135 configured to be advanced, retracted and swiveled to transport the substrate S. By the transfer device 133, the substrate S is transferred between the process chambers 101a, 101b, 101c and the load lock chamber 105.

  The load lock chamber 105 is configured to be able to be maintained in a predetermined reduced pressure atmosphere in the same manner as the process chambers 101 a, 101 b, 101 c and the transfer chamber 103. The load lock chamber 105 is for transferring the substrate S between the transfer chamber 103 in a reduced-pressure atmosphere and the external air atmosphere.

  The load lock chamber 105 is configured to have a small internal volume as much as possible in view of repeating the atmospheric pressure state and the vacuum state. In the load lock chamber 105, a plurality of buffers 138 that support the substrate S are disposed at intervals. The gap between these buffers 138 is a relief groove of a comb-like fork (for example, fork 135).

  The vacuum processing system 100 further includes five gate valve devices 10a, 10b, 10c, 10d, and 10e. The gate valve device 10a is disposed between the transfer chamber 103 and the process chamber 101a. The gate valve device 10b is disposed between the transfer chamber 103 and the process chamber 101b. The gate valve device 10c is disposed between the transfer chamber 103 and the process chamber 101c. The gate valve device 10 d is disposed between the transfer chamber 103 and the load lock chamber 105. The gate valve device 10e is disposed on the opposite side of the load lock chamber 105 from the gate valve device 10d. Each of the gate valve devices 10a to 10e has a function of opening and closing an opening provided in a wall that partitions two adjacent spaces.

  The gate valve devices 10a to 10d hermetically seal each chamber in the closed state, and allow the substrate S to be transferred by communicating between the chambers in the open state. The gate valve device 10e maintains the airtightness of the load lock chamber 105 in the closed state, and enables the transfer of the substrate S between the inside and outside of the load lock chamber 105 in the open state.

  The vacuum processing system 100 further includes a transfer device 125 disposed at a position where the gate valve device 10 e is sandwiched between the vacuum processing system 100 and the load lock chamber 105. The transport device 125 includes a fork 127 as a substrate holder, a support portion 129 that supports the fork 127 so that the fork 127 can be advanced, retracted, and turned, and a drive portion 131 that includes a drive mechanism that drives the support portion 129. ing.

  The vacuum processing system 100 further includes cassette indexers 121a and 121b disposed on both sides of the drive unit 131, and cassettes C1 and C2 mounted on the cassette indexers 121a and 121b, respectively. The cassette indexers 121a and 121b have elevating mechanisms 123a and 123b that elevate and lower the cassettes C1 and C2, respectively. In each cassette C1, C2, the substrates S can be arranged in multiple stages at intervals in the vertical direction. The fork 127 of the transport device 125 is disposed between the cassettes C1 and C2.

  Although not illustrated in FIGS. 1 and 2, the vacuum processing system 100 further includes a control unit that controls components that need to be controlled in the vacuum processing system 100. The control unit includes, for example, a controller including a CPU, a user interface connected to the controller, and a storage unit connected to the controller. The controller controls all components that need to be controlled in the vacuum processing system 100. The user interface includes a keyboard on which a process manager manages command input in order to manage the vacuum processing system 100, a display that visualizes and displays the operating status of the vacuum processing system 100, and the like. The storage unit stores a recipe in which a control program (software) for realizing various processes executed in the vacuum processing system 100 under the control of the controller, processing condition data, and the like are recorded. Then, if necessary, an arbitrary recipe is called from the storage unit by an instruction from the user interface or the like, and is executed by the controller, so that a desired process in the vacuum processing system 100 is performed under the control of the controller.

  Recipes such as the control program and processing condition data can be stored in a computer-readable storage medium such as a CD-ROM, a hard disk, a flexible disk, or a flash memory. Alternatively, it can be transmitted from other devices as needed via, for example, a dedicated line and used online.

  Next, the operation of the vacuum processing system 100 will be described. First, the fork 127 of the transfer device 125 is driven forward and backward to receive the unprocessed substrate S from the cassette C 1, and this is placed on the buffer 138 of the load lock chamber 105. Next, the fork 127 is retracted from the load lock chamber 105.

  Next, the gate valve device 10e on the atmosphere side of the load lock chamber 105 is closed. Next, the inside of the load lock chamber 105 is evacuated, and the inside is depressurized to a predetermined degree of vacuum. Next, the gate valve device 10d between the transfer chamber 103 and the load lock chamber 105 is opened. Next, the substrate S accommodated in the load lock chamber 105 is received by the fork 135 of the transfer device 133.

  Next, the substrate S is carried into one of the process chambers 101 a, 101 b, 101 c by the fork 135 of the transfer device 133 and transferred to the susceptor 102. Next, the gate valve device between the process chamber into which the substrate S is loaded and the transfer chamber 103 is closed.

  Next, a predetermined process such as etching is performed on the substrate S in the process chamber into which the substrate S is carried. Next, when the process is completed, the gate valve device between the process chamber in which the process is performed and the transfer chamber 103 is opened. Next, the processed substrate S is transferred from the susceptor 102 to the fork 135 of the transfer device 133 and is unloaded from the process chamber.

  The substrate S is accommodated in the cassette C2 by the transfer device 125 through the load lock chamber 105 through a path opposite to that at the time of carry-in. Note that the processed substrate S may be returned to the original cassette C1.

  Next, the configuration of the gate valve device according to the present embodiment will be described in detail with reference to FIGS. 3 to 5 are cross-sectional views showing the configuration of the gate valve device according to the present embodiment. 3 shows the open state of the gate valve device, and FIGS. 4 and 5 show the closed state of the gate valve device. FIG. 6 is a front view showing a valve body, a heater, and a connector portion of the gate valve device in the state shown in FIG. FIG. 7 is a front view showing a connector portion connected to the connector portion shown in FIG. FIG. 8 is a circuit diagram showing a circuit configuration of the gate valve device according to the present embodiment.

  The gate valve device 10 according to the present embodiment can be applied to any of the five gate valve devices 10a, 10b, 10c, 10d, and 10e in the vacuum processing system 100 shown in FIGS. In particular, it is suitable for application to the gate valve devices 10a, 10b, and 10c provided between the process chambers 101a, 101b, and 101c and the transfer chamber 103. Therefore, hereinafter, the gate valve device 10 according to the present embodiment will be described by taking as an example the case where it is applied to the gate valve devices 10a, 10b, and 10c. In this example, the gate valve device 10 is disposed between the chamber 101 and the transfer chamber 103. The chamber 101 is one of process chambers 101a, 101b, and 101c. 3 to 5, illustration of the transfer chamber 103 is omitted.

  As shown in FIGS. 3 to 5, the chamber 101 includes a housing 111 that defines a space in the chamber 101. The casing 111 includes a wall 111 </ b> A adjacent to the gate valve device 10. This wall 111A partitions the space in the chamber 101 and the space on the side of the gate valve device 10 adjacent thereto. An opening 112 that enables the transfer of the substrate S between the chamber 101 and the transfer chamber 103 is provided in the wall 111A. The wall 111 </ b> A has a surface 111 </ b> AS facing the gate valve device 10. A terminal portion 40 is embedded and fixed to the wall 111A so as to be exposed at the surface 111AS.

  The gate valve device 10 heats the valve body 12, a valve body 12 for opening and closing the opening 112, a valve body moving device 20 for moving the valve body 12 to open and close the opening 112, and the valve body 12. A heater 13 and a connector part 30 are provided. The valve body 12, the heater 13, and the connector part 30 are integrated. The housing 11 accommodates the integrated valve body 12, the heater 13, the connector portion 30, and a part of the valve body moving device 20. The valve body moving device 20 corresponds to the valve body moving means in the present invention.

  The housing 11 has a rectangular tube shape having an upper part, a bottom part, and two side parts connecting the upper part and the bottom part. An end of the housing 11 on the chamber 101 side (right end in FIG. 3) and an end on the transfer chamber 103 side (left end in FIG. 3) are open.

  The valve body 12 has a substantially rectangular parallelepiped shape. The valve body 12 faces the chamber 101 and has a sealing surface 12A capable of closing the opening 112, a back surface 12B opposite to the sealing surface 12A, a top surface 12C, a bottom surface 12D, and two side surfaces 12E and 12F. have. The sealing surface 12 </ b> A has a size that can close the opening 112. In FIG. 6, the opening 112 is indicated by a two-dot chain line.

  An O-ring 19 is attached around the opening 112 in the surface 111AS of the wall 111A. As shown in FIGS. 4 and 5, in a state where the valve body 12 closes the opening 112, the O-ring 19 is sandwiched between the surface 111 AS and the seal surface 12 A over the entire circumference. Thereby, the chamber 101 is hermetically sealed.

  The heater 13 is attached to the valve body 12 so as to contact the bottom surface 12D. The heater 13 may be attached to the valve body 12 so as to be in contact with a surface other than the bottom surface 12D as long as it is a surface other than the seal surface 12A. As the heater 13, for example, a plate type heater is used. However, the heater 13 is not limited to a plate-type heater, and any heater that generates heat upon receiving power supply may be used.

  As shown in FIG. 8, the gate valve device 10 further includes a temperature sensor 73 for measuring the temperature of the valve body 12. Although the temperature sensor 73 is not illustrated in FIGS. 3 to 6, the temperature sensor 73 is attached to the valve body 12.

  The valve body moving device 20 includes an air cylinder 21, a base member 22, and links 23, 24, 25, and 26. The air cylinder 21 includes a cylinder part 21a and a rod part 21b. The cylinder part 21 a is attached to the bottom part of the housing 11. The rod portion 21 b protrudes from the cylinder portion 21 a toward the inside of the housing 11 through an opening formed at the bottom of the housing 11. A part of the rod part 21b is accommodated in the cylinder part 21a. The rod portion 21b reciprocates in the axial direction (vertical direction in FIG. 3) of the cylinder portion 21a and the rod 21b by air supplied to the cylinder portion 21a. Instead of the air cylinder 21, a hydraulic cylinder or a ball screw mechanism driven by a motor may be used.

  The base member 22 is attached to the distal end portion of the rod portion 21b. The base member 22 has, for example, a substantially rectangular parallelepiped shape, similar to the valve body 12, and has a front surface facing the valve body 12, a back surface on the opposite side, a top surface, a bottom surface, and two side surfaces. Yes. The air cylinder 21 moves the base member 22 in a direction parallel to the surface 111AS of the wall 111A. The air cylinder 21 corresponds to the driving means in the present invention.

  The links 23 to 26 constitute a link mechanism that connects the base member 22 and the valve body 12. As shown in FIGS. 3 to 6, one end portions of the links 23 and 24 are rotatably connected to the side surface 12E of the valve body 12, and the other end portions of the links 23 and 24 correspond to the side surface 12E. The base member 22 is connected to the side surface of the base member 22 so as to be rotatable. Similarly, one end portions of the links 25 and 26 are rotatably connected to the side surface 12F of the valve body 12, and the other end portions of the links 25 and 26 are connected to the side surface of the base member 22 corresponding to the side surface 12F. And are connected so as to be rotatable.

  Although not shown, the base member 22 includes a spring that urges the links 23 to 26 to rotate in the counterclockwise direction in FIG. 3 about a connection portion with respect to the side surface of the base member 22, and a counterclockwise direction. And a stopper for restricting the rotation of the links 23 to 26 in the direction. FIG. 3 shows a state in which the rotation of the links 23 to 26 is restricted by the stopper. In this state, the upper surface 12 </ b> C of the valve body 12 is located above the upper surface of the base member 22.

  Rollers 15 and 16 are rotatably attached to the upper surface 12C of the valve body 12. A part of the rollers 15 and 16 protrudes upward from the upper surface 12C. In addition, as the rollers 15 and 16, those having various shapes such as a columnar shape and a spherical shape can be used.

  The valve body moving device 20 moves the valve body 12 between the standby position shown in FIG. 3 and the closed position shown in FIGS. 4 and 5. The operation of the valve body moving device 20 will be described in detail later.

  Hereinafter, the connector unit 30 and the terminal unit 40 will be described in detail. The connector part 30 has four connectors which will be described later, and the terminal part 40 has four input / output terminals which will be described later. The connector part 30 and the terminal part 40 are arranged at positions where the four connectors of the connector part 30 and the four input / output terminals of the terminal part 40 are connected to each other when the valve body 12 is in the closed position. . In the example shown in FIGS. 3 to 6, the connector portion 30 is attached to the bottom surface of the heater 13. However, the connector part 30 may be provided in other positions, such as bottom face 12D of the valve body 12. FIG.

  As shown in FIG. 6, the connector section 30 includes a main body 30A made of an insulating material, power connectors 31 and 32, and sensor connectors 33 and 34 held by the main body 30A. The main body 30A has a surface 30AS facing the chamber 101 and four recesses that open on the surface 30AS and accommodate the connectors 31, 32, 33, and 34, respectively. The connectors 31 and 32 are electrically connected to the heater 13. The connectors 33 and 34 are electrically connected to the temperature sensor 73. In addition, when it is not necessary to measure the temperature of the valve body 12, the temperature sensor 73 and the connectors 33 and 34 may not be provided.

  Here, an example of the structure of the connectors 31, 32, 33, and 34 will be described with reference to FIGS. In this example, the connectors 31, 32, 33, and 34 have metal plugs 31a, 32a, 33a, and 34a, respectively, accommodated in the corresponding recesses so as to be able to advance and retract. Each of the plugs 31a, 32a, 33a, and 34a has a substantially cylindrical shape having a flange. Each of the connectors 31, 32, 33, and 34 is further accommodated in a corresponding recess, and biases the plugs 31a, 32a, 33a, and 34a in a direction protruding from the corresponding recess (right direction in FIG. 3). It has a spring. FIG. 3 shows only the spring 31 b of the connector 31 among the springs of the connectors 31, 32, 33 and 34. The recesses that accommodate the connectors 31, 32, 33, and 34 hold the plugs 31a, 32a, 33a, and 34a so as not to come out of the recesses. The plugs 31 a and 32 a are electrically connected to the heater 13, and the plugs 33 a and 34 a are electrically connected to the temperature sensor 73.

  As shown in FIGS. 3 and 7, the terminal portion 40 has a main body 40A made of an insulating material, power output terminals 41 and 42 and sensor input terminals 43 and 44 held by the main body 40A. Hereinafter, the power output terminals 41, 42 and the sensor input terminals 43, 44 are also referred to as input / output terminals 41, 42, 43, 44. The main body 40A has a surface 40AS facing the gate valve device 10 and four recesses that open at the surface 40AS and accommodate the input / output terminals 41, 42, 43, and 44, respectively. As shown in FIG. 7, on the surface 40AS, O-rings 45 and 46 are provided around the power output terminals 41 and 42 in order to improve insulation between the power output terminals 41 and 42 and the peripheral portions thereof. It is attached. If it is not necessary to measure the temperature of the valve body 12, the sensor input terminals 43 and 44 need not be provided.

  As shown in FIGS. 4 and 5, when the valve body 12 closes the opening 112, the plugs 31a, 32a, 33a, 34a of the connectors 31, 32, 33, 34 are input / output terminals 41, 42, respectively. , 43, 44. Thereby, the connectors 31, 32, 33, and 34 (plugs 31a, 32a, 33a, and 34a) are electrically and physically connected to the input / output terminals 41, 42, 43, and 44, respectively. In this state, the O-rings 45 and 46 are sandwiched between the surface 30AS and the surface 40AS.

  Conductive wires are connected to the input / output terminals 41, 42, 43, and 44, respectively. The four conductive wires are led out of the casing 111 through, for example, holes formed in the wall 111A.

  As shown in FIG. 8, the vacuum processing system 100 includes a power source 71 that generates power to be supplied to the heater 13, a switch 49, and a control unit 72. The power output terminals 41 and 42 are electrically connected to the power source 71 via the switch 49. The switch 49 selects a conduction state or a cutoff state. FIG. 8 shows an example in which a switch 49 is provided between the power output terminal 41 and the power source 71. However, instead of the switch 49 as described above, a switch for simultaneously connecting or disconnecting between the power output terminal 41 and the power source 71 and between the power output terminal 42 and the power source 71 may be provided. When the connectors 31 and 32 are connected to the power output terminals 41 and 42 and the switch 49 is in a conductive state, power can be supplied from the power source 71 to the heater 13. The power output terminals 41 and 42 correspond to the power output unit in the present invention.

  The sensor input terminals 43 and 44 are connected to the control unit 72. Therefore, when the connectors 33 and 34 are connected to the sensor input terminals 43 and 44, the temperature sensor 73 is connected to the control unit 72. For example, the control unit 72 controls the components that need to be controlled in the vacuum processing system 100. The control unit 72 acquires temperature information of the valve body 12 obtained by the temperature sensor 73 connected via the connectors 33 and 34 and the sensor input terminals 43 and 44 in order to control the operation of the gate valve device 10. The air cylinder 21, the power source 71 and the switch 49 are controlled. Note that the control unit 72 may not control the components that need to be controlled in the vacuum processing system 100, but may control only the gate valve device 10. In this case, the control unit 72 is controlled by, for example, another control unit that performs overall control in the vacuum processing system 100.

  As will be described in detail later, in the present embodiment, the connectors 31 and 32 connected to the heater 13 are connected to the power output terminals 41 and 42 that are power output portions when the valve body 12 closes the opening 112. When the valve body 12 opens the opening 112, the valve body 12 is interlocked with the valve body 12 so as to be electrically and physically separated from the power output terminals 41 and 42.

  In the description so far, the gate valve device 10 does not include the terminal unit 40, the switch 49, and the power source 71 as components. However, the gate valve device 10 may include a terminal unit 40 as a component, may further include a switch 49, and may further include a power source 71.

  Next, with reference to FIGS. 3 to 5 and FIG. 9, the operation of the gate valve device 10 according to the present embodiment will be described in detail by taking as an example the case where a predetermined process is performed on the substrate S in the chamber 101. . FIG. 9 is an explanatory diagram for explaining the operation of the gate valve device 10. FIG. 9 shows the operation contents, the state of the opening 112, and the state of the heater 13 in each of the six steps from loading the substrate S into the chamber 101 to unloading the processed substrate S from the chamber 101. .

  In Step 1 in FIG. 9, the opening 112 is opened, and the substrate S is carried into the chamber 101 from the transfer chamber 103 through the opening 112. In this step 1, the valve body 12 is in the standby position. FIG. 3 shows a state in which the valve body 12 is in the standby position. The standby position of the valve body 12 is the position of the valve body 12 when the distal end portion of the rod portion 21b of the air cylinder 21 is positioned at the lowest end of the movable range. When the valve body 12 is in the standby position, the valve body 12 opens the opening 112. In this state, the substrate S is carried from the transfer chamber 103 into the chamber 101 through the opening 112.

  In Step 1, the heater 13 is in an off state, that is, in a state where no power is supplied. In the state where the opening 112 is opened, including the state where the valve body 12 is in the standby position, the connector portion 30 and the terminal portion 40 are separated from each other. Therefore, the connectors 31 and 32 connected to the heater 13 are electrically and physically separated from the power output terminals 41 and 42 which are power output units. Accordingly, no electric power is supplied to the heater 13 when the opening 112 is open. In addition, when the opening 112 is open, the switch 49 is set to a cutoff state.

  In the next step 2, an operation of closing the opening 112 by the valve body 12 is performed. When the opening 112 is closed by the valve body 12 from the state shown in FIG. 3, the base member 22 is raised by the air cylinder 21 of the valve body moving device 20. As the base member 22 is raised, the valve body 12 is also raised. At this time, the valve body 12 moves in a direction parallel to the surface 111AS of the wall 111A until the rollers 15 and 16 contact the upper portion of the housing 11.

  When the rollers 15 and 16 come into contact with the upper part of the housing 11, the valve body 12 reaches a position facing the opening 112. When the base member 22 is further lifted by the air cylinder 21 from this state, the valve body 12 cannot be lifted, so that the links 23 to 26 are clockwise in FIG. 3 centering on the connection portions with respect to the side surfaces of the base member 22. While rotating, the valve body 12 moves toward the opening 112 in a direction perpendicular to the surface 111AS of the wall 111A. At this time, the valve body 12 moves smoothly without being rubbed against the housing 11 by the action of the rollers 15 and 16. Finally, as shown in FIG. 4, the sealing surface 12A of the valve body 12 is pressed against the surface 111AS of the wall 111A, and the opening 112 is closed by the valve body 12. At this time, the operation of the valve body moving device 20 stops. When the opening 112 is closed by the valve body 12, the connector portion 30 is connected to the terminal portion 40. Specifically, the plugs 31a, 32a, 33a, 34a of the connectors 31, 32, 33, 34 contact the input / output terminals 41, 42, 43, 44, respectively, so that the connectors 31, 32, 33, 34 ( Plugs 31a, 32a, 33a, 34a) are electrically and physically connected to the input / output terminals 41, 42, 43, 44, respectively.

  As shown in FIG. 4, when the valve body 12 closes the opening 112 by the above-described operation, the switch 49 is in a cut-off state. Therefore, at this time, no power is supplied to the heater 13.

  In the next step 3, the heater 13 is turned on, that is, in a state where electric power is supplied. Thus, the heater 13 is turned on after the opening 112 is closed by the valve body 12. In step 3, as shown in FIG. 5, the switch 49 is set to a conductive state. As a result, power is supplied from the power source 71 to the heater 13 via the power output terminals 41 and 42 and the connectors 31 and 32, the heater 13 generates heat, and the valve body 12 is heated. At this time, the temperature sensor 73 is connected to the control unit 72 via the connectors 33 and 34 and the sensor input terminals 43 and 44. The control unit 72 acquires temperature information of the valve body 12 obtained by the temperature sensor 73 and controls the power source 71 based on the temperature information to control the temperature of the valve body 12. Note that the control unit 72 may switch between a conduction state and a cutoff state of the switch 49 in order to control the temperature of the valve body 12.

  In the next step 4, the opening 112 is closed by the valve body 12, electric power is supplied to the heater 13, and the valve body 12 is heated. Processing is performed.

  When the processing in the chamber 101 is completed, in the next step 5, the switch 49 is set to the cut-off state with the opening 112 closed by the valve body 12, and the supply of power to the heater 13 is stopped.

  In the next step 6, the opening 112 is opened, and the processed substrate S is carried out from the chamber 101 to the transfer chamber 103 through the opening 112. In step 6, the valve body moving device 20 causes the valve body 12 to perform the reverse operation of closing the opening 112, thereby opening the opening 112. That is, the base member 22 is lowered by the air cylinder 21 of the valve body moving device 20. At this time, at first, the rollers 15 and 16 remain in contact with the upper portion of the housing 11, and the links 23 to 26 rotate counterclockwise in FIG. 3 centering on the connection portions with respect to the side surfaces of the base member 22. While rotating in the direction, the valve body 12 moves in a direction perpendicular to the surface 111AS of the wall 111A so as to move away from the opening 112. Thereby, the opening 112 is opened. Further, when the valve body 12 opens the opening 112, the connector part 30 is separated from the terminal part 40.

  When the links 23 to 26 are rotated to the positions regulated by the stoppers, the valve body 12 is also lowered as the base member 22 is lowered thereafter. At this time, the valve body 12 moves in a direction parallel to the surface 111AS of the wall 111A. Finally, the valve body 12 reaches the standby position shown in FIG. 3, and the operation of the valve body moving device 20 stops. Thereafter, the processed substrate S is unloaded from the chamber 101 to the transfer chamber 103 through the opening 112.

  Next, the effect of the gate valve device 10 according to the present embodiment will be described. The gate valve device 10 according to the present embodiment includes a heater 13 for heating the valve body 12. Therefore, according to the gate valve device 10, when a process for generating a by-product is performed in the chamber 101, the by-product adheres to the surface of the valve body 12 by heating the valve body 12 by the heater 13. Can be prevented. Thereby, according to this Embodiment, it can prevent that a particle | grain generate | occur | produces and, as a result, generation | occurrence | production of malfunctions, such as an etching defect resulting from a particle, can be prevented.

  Moreover, in this Embodiment, the valve body 12, the heater 13, and the connector part 30 containing the connectors 31 and 32 electrically connected to the heater 13 are integrated. The connectors 31 and 32 are electrically and physically connected to the power output terminals 41 and 42 which are power output portions in a state where the valve body 12 closes the opening portion 112, and the valve body 12 is connected to the opening portion 112. In the open state, the valve body 12 is interlocked so as to be electrically and physically separated from the power output terminals 41 and 42. Therefore, in the present embodiment, the connectors 31 and 32 are electrically and physically connected to the power output terminals 41 and 42 that are the power output units only when the valve body 12 closes the opening 112. It becomes possible to supply power to the heater 13. Thus, according to the present embodiment, the power supply cable is provided in the casing 11 of the gate valve device 10 so as to be directly connected to the heater 13 via the base member 22 and the link mechanism. The electric power can be easily supplied to the heater 13.

  The gate valve device 10 according to the present embodiment does not include a power supply cable that is connected to the heater 13 via the valve body moving device 20. Therefore, according to the present embodiment, the attachment and maintenance of the gate valve device 10 are facilitated.

  Further, in the present embodiment, a switch 49 is provided between the power supply 71 and the power output terminals 41 and 42 to select supply and cut-off of power from the power supply 71 to the power output terminals 41 and 42. And when shifting from the state where the opening 112 is opened to the state where the opening 112 is closed, after the opening 112 is closed and the connectors 31, 32 are connected to the power output terminals 41, 42, The switch 49 is set to a conductive state, and power is supplied to the power output terminals 41 and 42. In addition, when the state in which the opening 112 is closed to the state in which the opening 112 is opened, the switch 49 is set to the cut-off state and the supply of power to the power output terminals 41 and 42 is cut off. The opening 112 is opened and the connectors 31 and 32 are separated from the power output terminals 41 and 42. Therefore, in this embodiment, the power output terminals 41 and 42 are not exposed in a state where they are connected to the power source 71. Therefore, according to this Embodiment, generation | occurrence | production of the arc discharge and electric leakage from the electric power output terminals 41 and 42 can be prevented.

  Moreover, in this Embodiment, in the state in which the connector part 30 was connected to the terminal part 40, in order to improve the insulation between the power output terminals 41 and 42 and its peripheral part, the power output terminals 41 and 42 O-rings 45 and 46 provided around are sandwiched between the surface 30AS of the main body 30A of the connector portion 30 and the surface 40AS of the main body 40A of the terminal portion 40. Thereby, according to this Embodiment, generation | occurrence | production of the arc discharge from the electric power output terminals 41 and 42 and electric leakage can be prevented more effectively.

  In the present embodiment, the heater 13 is attached to the surface of the valve body 12. Therefore, according to this Embodiment, compared with the case where the heater 13 is provided in the inside of the valve body 12, the fall of the rigidity of the valve body 12 can be prevented.

[Second Embodiment]
Next, a gate valve device according to a second embodiment of the present invention will be described with reference to FIGS. 10 to 12 are cross-sectional views showing the configuration of the gate valve device according to the present embodiment. 10 shows the open state of the gate valve device, and FIGS. 11 and 12 show the closed state of the gate valve device.

  Hereinafter, the difference between the gate valve device 80 according to the present embodiment and the gate valve device 10 according to the first embodiment will be described. The gate valve device 80 includes a housing 81 instead of the housing 11 in the gate valve device 10. The casing 81 has a box shape having an upper portion, a bottom portion, and four side portions connecting the upper portion and the bottom portion. One of the four side portions of the casing 81 is in contact with the wall 111 </ b> A of the casing 111 of the chamber 101. This side portion is referred to as a wall constituting portion 81A. The wall constituting portion 81A constitutes at least a part of a wall that partitions the space in the chamber 101 and the space on the gate valve device 10 side adjacent thereto. The wall constituting portion 81A has a surface in contact with the wall 111A and an opposite surface 81AS. Of the four side portions of the housing 81, the side portion 81B opposite to the wall constituting portion 81A is in contact with the transfer chamber 103 (not shown).

  The wall constituting portion 81A and the side portion 81B are provided with openings 82 and 83 that enable the transfer of the substrate S, respectively. The opening 82 is continuous with the opening 112 of the wall 111 </ b> A in the chamber 101. As an example, the shapes and positions of the openings 82 and 83 coincide with the shapes and positions of the openings 112 when viewed from a direction perpendicular to the surface of the wall 111A in contact with the wall constituting portion 81A. In the present embodiment, the valve body 12 opens and closes the opening 82.

  An O-ring 89 is attached around the opening 82 in the surface 81AS of the wall constituting portion 81A. As shown in FIGS. 11 and 12, in a state where the valve body 12 closes the opening 82, the O-ring 89 is sandwiched between the surface 81AS and the seal surface 12A over the entire circumference. Thereby, the chamber 101 is hermetically sealed.

  In the present embodiment, the terminal portion 40 is embedded and fixed in the wall constituting portion 81A so as to be exposed at the surface 81AS. The four conducting wires connected to the input / output terminals 41, 42, 43, and 44 are led out of the housing 81 through, for example, holes formed in the wall constituting portion 81A.

  In the present embodiment, the cylinder portion 21 a of the air cylinder 21 is attached to the bottom portion of the housing 81. The rod portion 21 b of the air cylinder 21 protrudes from the cylinder portion 21 a toward the inside of the housing 81 through an opening formed at the bottom of the housing 81.

  In the present embodiment, the gate valve device 80 includes a terminal unit 40 as a component. The gate valve device 80 may further include a switch 49 as a component, and may further include a power source 71.

  Next, the operation of the gate valve device 80 according to the present embodiment will be described with reference to FIGS. FIG. 10 shows a state where the valve body 12 is in the standby position. In a state where the opening 82 is opened, including a state where the valve body 12 is in the standby position, the connector portion 30 and the terminal portion 40 are separated from each other. Therefore, the connectors 31 and 32 connected to the heater 13 are electrically and physically separated from the power output terminals 41 and 42 which are power output units. Therefore, no electric power is supplied to the heater 13 when the opening 82 is open. Further, in a state where the opening 82 is opened, the switch 49 is set to a cutoff state. In this state, the substrate S is carried into the chamber 101 from the transfer chamber 103 through the openings 83, 82, and 112.

  When the opening 82 is closed by the valve body 12 from the state shown in FIG. 10, the valve body 12 is moved by the valve body moving device 20 as in the first embodiment. As a result, as shown in FIG. 11, the sealing surface 12A of the valve body 12 is pressed against the surface 81AS of the wall 81A, and the opening 82 is closed by the valve body 12. When the valve body 12 closes the opening 82, the switch 49 is in a cut-off state. Therefore, at this time, no power is supplied to the heater 13.

  After the opening 82 is closed by the valve body 12, as shown in FIG. 12, the switch 49 is set to a conductive state. As a result, power is supplied from the power source 71 to the heater 13 via the power output terminals 41 and 42 and the connectors 31 and 32, the heater 13 generates heat, and the valve body 12 is heated.

  Thereafter, a predetermined process such as etching is performed on the substrate S in the chamber 101. When the processing in the chamber 101 is completed, the switch 49 is set to the cut-off state in a state where the opening 82 is closed by the valve body 12, and the supply of power to the heater 13 is stopped. Next, as in the first embodiment, the valve body 12 is moved by the valve body moving device 20 to open the opening 82. Further, when the valve body 12 opens the opening portion 82, the connector portion 30 is separated from the terminal portion 40.

  In the present embodiment, the gate valve device 80 includes a terminal unit 40. Therefore, in the present embodiment, the gate valve device 80 according to the present embodiment can be provided without any modification to the existing chamber 101 that does not include the terminal unit 40.

  Other configurations, operations, and effects in the present embodiment are the same as those in the first embodiment.

[Third Embodiment]
Next, a gate valve device according to a third embodiment of the present invention will be described with reference to FIGS. 13 to 15 are cross-sectional views showing the configuration of the gate valve device according to the present embodiment. 13 shows the open state of the gate valve device, and FIGS. 14 and 15 show the closed state of the gate valve device. FIG. 16 is a front view showing the valve body, the heater, the connector part, the sub connector part, and the sub terminal part of the gate valve device in the state shown in FIG. FIG. 17 is a circuit diagram showing a circuit configuration of the gate valve device according to the present embodiment.

  The gate valve device 90 according to the present embodiment includes a sub connector portion 50 and a sub terminal portion 60 in addition to the components of the gate valve device 10 according to the first embodiment. The sub connector part 50 is integrated with the valve body 12, the heater 13 and the connector part 30. The sub terminal unit 60 is fixed to the bottom of the housing 11. The sub-connector section 50 has four sub-connectors described later, and the sub-terminal section 60 has four sub input / output terminals described later. The sub-connector unit 50 and the sub-terminal unit 60 are configured such that the four sub-connectors of the sub-connector unit 50 and the four sub-input / output terminals of the sub-terminal unit 60 are connected to each other when the valve body 12 is in the standby position. Placed in position. In the example shown in FIGS. 13 to 16, the sub-connector portion 50 is attached to the bottom surface of the heater 13. However, the sub connector portion 50 may be provided at other positions such as the bottom surface 12D of the valve body 12. In the present embodiment, the state in which the valve body 12 is in the standby position corresponds to the “specific state in which the valve body opens the opening” in the present invention.

  The configuration of the sub-connector unit 50 is the same as the configuration of the connector unit 30. That is, the sub-connector portion 50 has a main body 50A made of an insulating material, power sub-connectors 51 and 52 and sensor sub-connectors 53 and 54 held by the main body 50A. The main body 50A has a surface 50AS facing downward, and four recesses that open on the surface 50AS and accommodate the sub-connectors 51, 52, 53, and 54, respectively. The sub connectors 51 and 52 are electrically connected to the heater 13. The sub connectors 53 and 54 are electrically connected to the temperature sensor 73. If there is no need to measure the temperature of the valve body 12, the sub connectors 53 and 54 need not be provided.

  Here, an example of the structure of the sub-connectors 51, 52, 53, and 54 will be described with reference to FIGS. In this example, the sub-connectors 51, 52, 53, and 54 have metal plugs 51a, 52a, 53a, and 54a, respectively, accommodated in the corresponding recesses so as to be able to advance and retract. Each of the plugs 51a, 52a, 53a, 54a has a substantially cylindrical shape having a flange. The sub-connectors 51, 52, 53, and 54 are further accommodated in the corresponding recesses, respectively, and urge the plugs 51a, 52a, 53a, and 54a in the direction protruding from the corresponding recesses (downward direction in FIG. 14). Springs to FIG. 14 shows only the spring 51b of the sub-connector 51 among the springs of the sub-connectors 51, 52, 53, and 54. Note that the recesses that accommodate the sub-connectors 51, 52, 53, and 54 hold plugs 51a, 52a, 53a, and 54a, respectively, so as not to come out of the recesses. The plugs 51 a and 52 a are electrically connected to the heater 13, and the plugs 53 a and 54 a are electrically connected to the temperature sensor 73.

  The configuration of the sub-terminal unit 60 is the same as the configuration of the terminal unit 40. That is, as shown in FIG. 16, the sub-terminal portion 60 has a main body 60A made of an insulating material, sub-power output terminals 61 and 62, and sub-sensor input terminals 63 and 64 held by the main body 60A. Yes. Hereinafter, the sub power output terminals 61 and 62 and the sub sensor input terminals 63 and 44 are also referred to as sub input / output terminals 61, 62, 63, and 64. The main body 60A has an upward surface 60AS and four recesses that open on the surface 60AS and accommodate the sub input / output terminals 61, 62, 63, 64, respectively. On the surface 60AS, O-rings 65 and 66 are attached around the auxiliary power output terminals 61 and 62 in order to improve insulation between the power output terminals 61 and 62 and the peripheral portions thereof. In addition, when it is not necessary to measure the temperature of the valve body 12, the sub sensor input terminals 63 and 64 may not be provided.

  As shown in FIG. 13, when the valve body 12 is in the standby position, the plugs 51a, 52a, 53a, 54a of the sub connectors 51, 52, 53, 54 are respectively connected to the sub input / output terminals 61, 62, 63, 64 is contacted. Thus, the sub connectors 51, 52, 53, 54 (plugs 51a, 52a, 53a, 54a) are electrically and physically connected to the sub input / output terminals 61, 62, 63, 64, respectively. In this state, the O-rings 65 and 66 provided around the auxiliary power output terminals 61 and 62 are sandwiched between the surface 50AS and the surface 60AS.

  Conductive wires are connected to the sub input / output terminals 61, 62, 63, 64, respectively. The four conductive wires are led out of the casing 11 through, for example, holes formed in the casing 11.

  As shown in FIG. 17, the sub power output terminals 61 and 62 are electrically connected to the power source 71 via the switch 69. The switch 69 may be a component of the gate valve device 90. The switch 69 selects a conduction state or a cutoff state. FIG. 17 shows an example in which a switch 69 is provided between the sub power output terminal 61 and the power source 71. However, instead of such a switch 69, a switch that simultaneously conducts or cuts off between the sub power output terminal 61 and the power source 71 and between the sub power output terminal 62 and the power source 71 may be provided. When the sub connectors 51 and 52 are connected to the sub power output terminals 61 and 62 and the switch 69 is in a conductive state, power can be supplied from the power source 71 to the heater 13. The sub power output terminals 61 and 62 correspond to the second power output unit in the present invention.

  The sub sensor input terminals 63 and 64 are connected to the control unit 72. Therefore, when the sub connectors 53 and 54 are connected to the sub sensor input terminals 63 and 64, the temperature sensor 73 is connected to the control unit 72. In FIG. 17, the sub connectors 53 and 54 and the sub sensor input terminals 63 and 64 are not shown. The control unit 72 is connected via the connectors 33 and 34 and the sensor input terminals 43 and 44 or via the sub connectors 53 and 54 and the sub sensor input terminals 63 and 64 in order to control the operation of the gate valve device 10. The temperature information of the valve body 12 obtained by the temperature sensor 73 is acquired, and the air cylinder 21, the power source 71, and the switches 49 and 69 are controlled.

  Next, the operation of the gate valve device 90 according to the present embodiment will be described in detail with reference to FIGS. 13 to 15. FIG. 13 shows a state in which the valve body 12 is in the standby position. In this state, the valve body 12 opens the opening 112. In this state, the substrate S is carried from the transfer chamber 103 into the chamber 101 through the opening 112. In this state, the connector part 30 and the terminal part 40 are separated from each other, and the sub-connector part 50 and the sub-terminal part 60 are connected to each other. Specifically, the plugs 51a, 52a, 53a, 54a of the sub-connectors 51, 52, 53, 54 come into contact with the sub input / output terminals 61, 62, 63, 64, respectively. , 54 (plugs 51a, 52a, 53a, 54a) are electrically and physically connected to the sub input / output terminals 61, 62, 63, 64, respectively.

  As illustrated in FIG. 13, when the switch 69 is turned on in a state where the valve body 12 is in the standby position, the power source 71 supplies the heater 13 via the sub power output terminals 61 and 62 and the sub connectors 51 and 52. Electric power is supplied, the heater 13 generates heat, and the valve body 12 is heated. At this time, the temperature sensor 73 is connected to the control unit 72 via the sub connectors 53 and 54 and the sub sensor input terminals 63 and 64. The control unit 72 acquires temperature information of the valve body 12 obtained by the temperature sensor 73 and controls the power source 71 based on the temperature information to control the temperature of the valve body 12. The control unit 72 may switch between a conductive state and a cut-off state of the switch 69 in order to adjust the temperature of the valve body 12.

  When the opening 112 is closed by the valve body 12 from the state shown in FIG. 13, the base member 22 is lifted by the air cylinder 21 of the valve body moving device 20 after the switch 69 is set to the cutoff state. As the base member 22 is raised, the valve body 12 is also raised. Thereby, the sub connector part 50 is separated from the sub terminal part 60. The operation of the gate valve device 90 when closing the opening 112 with the valve body 12 is the same as that of the first embodiment.

  As shown in FIG. 14, when the valve body 12 closes the opening 112, the switch 49 is in a cut-off state. Therefore, at this time, no power is supplied to the heater 13.

  After the opening 112 is closed by the valve body 12, as shown in FIG. 15, the switch 49 is set to a conductive state. As a result, power is supplied from the power source 71 to the heater 13 via the power output terminals 41 and 42 and the connectors 31 and 32, the heater 13 generates heat, and the valve body 12 is heated.

  Thereafter, a predetermined process such as etching is performed on the substrate S in the chamber 101. When the processing in the chamber 101 is completed, the switch 49 is set to a cut-off state in a state where the opening 112 is closed by the valve body 12, and the supply of power to the heater 13 is stopped. Next, as in the first embodiment, the valve body 12 is moved by the valve body moving device 20 to open the opening 112. Further, when the valve body 12 opens the opening portion 82, the connector portion 30 is separated from the terminal portion 40. When the valve body 12 reaches the standby position shown in FIG. 13, the sub connector portion 50 is connected to the sub terminal portion 60.

  As described above, the gate valve device 90 according to the present embodiment includes the sub-connector 51 electrically connected to the heater 13 in addition to the components of the gate valve device 10 according to the first embodiment. And a sub-terminal portion 60 including sub-power output terminals 61 and 62 which are second power output portions. The sub connectors 51 and 52 are electrically and physically separated from the sub power output terminals 61 and 62 in a state where the valve body 12 closes the opening 112, and a specific state in which the valve body 12 opens the opening 112, that is, In a state where the valve body 12 is in the standby position, the valve body 12 is interlocked with the sub power output terminals 61 and 62 so as to be electrically and physically connected.

  According to the present embodiment, the valve body 12 can be preheated before the opening 112 is closed by the valve body 12. Thereby, according to this Embodiment, the heating time of the valve body 12 after the opening part 112 is obstruct | occluded with the valve body 12 can be shortened. As a result, according to the present embodiment, the waiting time until the processing on the substrate S is started can be shortened, and as a result, the processing time in the entire process can be shortened.

  Further, in the present embodiment, when the valve body 12 is shifted from the standby position to the closed state of the opening 112, the sub-connectors 51 and 52 are set after the switch 69 is set to the cutoff state. It deviates from the sub power output terminals 61 and 62. Further, when the valve body 12 is shifted from the closed state to the standby position, the switch 69 is turned on after the sub connectors 51 and 52 are connected to the sub power output terminals 61 and 62. The state is set and power is supplied to the sub power output terminals 61 and 62. Therefore, in the present embodiment, the sub power output terminals 61 and 62 are not exposed in a state where they are connected to the power source 71. Therefore, according to the present embodiment, it is possible to prevent arc discharge and leakage from the sub power output terminals 61 and 62.

  In the present embodiment, in the state where the sub connector portion 50 is connected to the sub terminal portion 60, the sub power output terminal is used in order to improve the insulation between the sub power output terminals 61 and 62 and the peripheral portion thereof. O-rings 65 and 66 provided around 61 and 62 are sandwiched between the surface 50AS of the sub-connector portion 50 and the surface 60AS of the sub-terminal portion 60. Thereby, according to this Embodiment, generation | occurrence | production of the arc discharge from the sub-power output terminals 61 and 62 and electric leakage can be prevented more effectively.

  Other configurations, operations, and effects in the present embodiment are the same as those in the first embodiment.

  In addition, this invention is not limited to said each embodiment, A various change is possible. For example, in the third embodiment, the gate valve device includes the casing 81 in the second embodiment instead of the casing 11, and the wall constituting portion 81A is exposed so that the terminal portion 40 is exposed on the surface 81AS. It may be embedded and fixed in.

  In the first to third embodiments, the connector portion 30 may be attached to the side surface 12E or 12F of the valve body 12.

  DESCRIPTION OF SYMBOLS 10,80,90 ... Gate valve apparatus 11, 81, 111 ... Housing | casing, 12 ... Valve body, 13 ... Heater, 19, 89 ... O-ring, 20 ... Valve body moving apparatus, 30 ... Connector part, 40 ... Terminal , 49, 69 ... switch, 50 ... sub-connector part, 60 ... sub-terminal part, 71 ... power source, 82, 112 ... opening, 100 ... vacuum processing system, 101 ... chamber, 103 ... transfer chamber, S ... substrate.

Claims (11)

A valve body for opening and closing an opening provided in a wall partitioning two adjacent spaces;
Valve body moving means for moving the valve body to open and close the opening by the valve body;
A heater for heating the valve body;
A gate valve device comprising a connector electrically connected to the heater and electrically and physically connectable to a power output unit that outputs power supplied to the heater,
The valve body, heater and connector are integrated,
The connector is electrically and physically connected to the power output unit when the valve body closes the opening, and is electrically connected to the power output unit when the valve body opens the opening. A gate valve device which is interlocked with the valve body so as to be physically and physically separated.   The gate valve device according to claim 1, wherein the power output unit is fixed to the wall.   The gate valve device according to claim 1, further comprising a housing that accommodates the valve body, a heater, and a connector, wherein the power output unit is fixed to the housing.   4. The gate valve device according to claim 3, wherein the housing includes a wall constituent part constituting at least a part of the wall, and the power output unit is fixed to the wall constituent part. .   The power output unit further includes a switch that is provided between a power source for supplying power to the power output unit and the power output unit, and that selects whether power is supplied to or cut off from the power output unit. The gate valve device according to any one of claims 1 to 4. Furthermore, it is integrated with the valve body, the heater and the connector, is electrically connected to the heater, and is electrically and physically connected to the second power output unit that outputs power supplied to the heater. A sub-connector that can be connected to
The sub-connector is electrically and physically separated from the second power output portion when the valve body closes the opening, and the sub-connector is electrically connected to the second power output portion when the valve body opens the opening. The gate valve device according to claim 1, wherein the gate valve device is interlocked with the valve body so as to be electrically and physically connected to the two power output units.   The gate valve device according to claim 6, further comprising the second power output unit. And a housing for accommodating the valve body, the heater, the connector, and the sub-connector,
The gate valve device according to claim 7, wherein the second power output unit is fixed to the housing.   Further, provided between a power supply for supplying power to the second power output unit and the second power output unit, selection of supply and cut-off of power to the second power output unit is selected. The gate valve device according to claim 7 or 8, further comprising a switch for performing the operation.   The valve body moving means includes a base member, drive means for moving the base member in a direction parallel to the surface of the wall, and a link mechanism that connects the base member and the valve body. When the opening is closed by a body, the valve body is moved in a direction parallel to the surface of the wall to a position facing the opening, and then the valve body is directed toward the opening. When the valve body opens the opening, the valve body is caused to perform an operation opposite to that when the opening is closed. Item 10. The gate valve device according to any one of Items 1 to 9.   11. The gate valve device according to claim 1, wherein one of the two spaces is inside a vacuum chamber for processing a substrate under a vacuum condition.

Images