201104115 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種如同於真空條件下處理例如基板用 之真空處理室的開口部般地將分隔2鄰接空間之壁所設置 的開口部進行開啟/關閉用之閘閥裝置。 【先前技術】 為了針對FPD(Flat Panel Display)用玻璃基板等的基板 於真空條件下進行電漿蝕刻、電漿灰化、電漿成膜等處理， 會使用真空處理系統。該真空處理系統係具備有例如：針 對基板進行處理的製程處理室、收納有用以將基板搬入製 程處理室以及從製程處理室將基板搬出之搬送裝置的搬送 處理室、以及設置於製程處理室與搬送處理室之間的閘閥 裝置等。製程處理室與搬送處理室皆是用來在真空條件下 進行基板處理用的真空處理室。 製程處理室係具有在基板之搬入或搬出時讓基板通過 用的開口部。設置於製程處理室與搬送處理室之間的閘閥 裝置具有能將製程處理室之開口部開啟/關閉的閥體。以該 閥體來封閉製程處理室之開口部，藉以將製程處理室密封 而達到氣密狀態。 凡製程處理室内所進行之處理係包含有如氧化骐蝕刻 ^ ’於處理中會堆積產生副生成物的處理。前述處理中，. 二田彳生成物附著於製程處理室内壁時，該副生成物會從内 壁處剝落而產生微粒(浮游粒子），而該微粒會有造成餘刻不 4 201104115 ίίί程ί是二在進行前述處理時，為了防止副生成物附 理室周圍壁’係藉由冷凝器(恆溫裝置)來使製程處 右。°備％有面溫媒介’以將製程處理室昇溫至·。c左 藉由：a理室内進行處理時’製程處理室之開口部會 :夕一伐、置之閥體而被加以封閉。於此狀態下，闊體表 冷二内的空間。閥體無法藉由 的接觸面積二丄闕體與製程處理室之間 理官。故ρ使如則述般藉由冷凝器來將製程處 幹由門^左右’仍無法同樣地使閥體昇溫。因此， 室之開口部的狀態下，闕體表面 物。^^理，内的空間之部份會容易附著有副生成 制程里〜^附著於前述部份時，則與副生成物附著於 二兄同樣地會產生微粒，而有造成餘刻 不良之虞。 μ 4 如』：二ί ’為了防止副生成物附著於閥體表面’例 專利文獻 專利文獻2 專利文獻3 3所記載般’提出有在閥體安裝有加熱器， 、’#由加”、、#來對間體直接進行加熱的方法。 專利文獻1:日切開麗娜號公報 日本特開平10-132095號公報 ^ . τ曰本特開平11-325313號公報 移動_的驅動^/，開口部，閘閥裝置必須具有用以 ^ . /ib, 霉。因此為了防止閥體與其他鍺構物磨 " 如5亥驅動機構較佳為不會讓閥體與其他結構 201104115 物磨擦的機構。作為前述般不會讓_與其他結構物磨擦 的機構可考慮-種例如’當閥體將開σ部封閉時，使闊體 朝向平行於具有開口部之壁的壁面方向而㈣至面向開口 部的位置處後，再使閥體朝向開口部而朝垂直於壁之壁面 方向移動’而當閥體將開口部開放時，則進行封閉開口部 時之相反動作的機構。前述機構可藉由例如將閥體透過連 結機構來連結於朝平行於狀壁面方向驅動之基底 方式而加以實現。 _ 此處，在包含有驅動機構(係透過連結機構來將閥體連 結於基底組件）的關裝置中，考慮到將加熱器安裝在闕體 之情況。此時’為了將電功率供給至加熱器，可考慮透過 基底組件及連結機構來將電功率供給用電纜連接於加熱器 之方式來設置。但在包含有驅動機構(係透過連結機構‘來: 闊體連結於基底組件）的閘閥裝置中，隨著藉由 /關閉開口部的動作，由於一體成型之闊體、：= 組件之間的相對位置關係會產生變化，故會有難以將電功 率供給用電纜透過基底組件及連結機構而連接至加熱器之 方式來設置的問題。 【發明内容】 本發明有鑑於上述問題點’其目的在於提供—種在用 以開啟/關閉開口部的閥體安裝有加熱器，且能輕易地將電 功率供給至該加熱器的閘閥裝置。 本發明之閘閥裝置具備有：將設置在分隔鄰接之2空 201104115 間的壁處之開口部進行開啟/關閉用之閥體、移動閥體以藉 由該閥體來開啟/關閉該開口部之閥體移動機構、加熱該闊 體用之加熱器、以及電連接於該加熱器並且可電性且物理 性地連接於輸出供給至該加熱器的電功率之電功率輸出部 之連接器。該閥體、加熱器及連接器為一體成型。該連接 器係與該閥體連動，並在該閥體將該開口部封閉之狀態下 電性且物理性地連接於該電功率輸出部，而在該閥體將該 開口部開放之狀態下則從該電功率輸出部處電性且物理性 地分離。 本發明之閘閥裝置中，該電功率輸出部可固定於該壁 處。 又，本發明之閘閥裝置可更具備有收納該閥體、加熱 器及連接器的殼體，該電功率輸出部係固定於該殼體。此 時，該殼體可具有構成該壁的至少一部份之壁構成部份， 且該電功率輸出部可固定於該壁構成部份。 又，本發明之閘閥裝置可更具備有開關，該開關係設 置於針對該電功率輸出部供給電功率用之電源與該電功率 輸出部之間處，並可選擇對該電功率輸出部進行電功率之 供給或截止。 又，本發明之閘閥裝置可更具備有副連接器，該副連 接器係與該閥體、加熱器及連接器為一體成型而電連接於 該加熱器，並且可電性且物理性地連接於輸出供給至該加 熱器的電功率之第2電功率輸出部。該副連接器係與該閥 體連動，並在該闊體將該開口部封閉之狀態下從該第2電 201104115 功率輸出部處電性且物理性地分離’而在該閥體將該開口 部開啟之特定狀態下則電性且物理性地連接於該第2電功 率輸出部。 又，本發明之閘閥裝置可更具備有該第2電功率輸出 部。此時，閘閥裝置可更具備有收納該閥體、加熱器、連 接器以及副連接器的殼體，該第2電功率輸出部係固定於 該殼體。又，閘閥裝置可更具備有開關，該開關係設置於 針對該第2電功率輸出部供給電功率用之電源與該第2電 功率輸出部之間處，並可選擇針對該第2電功率輸出部進 行電功率之供給或截止。 又，本發明之閘閥裝置中，該閥體移動機構可為具有 基底組件、將該基底組件朝平行於該壁之壁面方向移動的 驅動機構、以及將該基底組件與該閥體加以連接的連結機 構，且當藉由該閥體來封閉該開口部時，係使該閥體朝平 行於該壁之壁面方向而移動至面向該開口部的位置為止 後，再將該閥體朝向該開口部而朝垂直於該壁之壁面方向 移動，當該閥體將該開口部開啟時，則使該閥體進行封閉 該開口部時之相反動作者。 又，本發明之閘閥裝置中，該2空間之其中一者可為 在真空條件下對基板進行處理用的真空處理室内部。 本發明之閘閥裝置中，當閥體將開口部開啟之狀態 下，電連接於加熱器之連接器會從電功率輸出部電性且物 理性地分離，但是當閥體將開口部封閉之狀態下，則連接 器會電性且物理性地連接於電功率輸出部，而可將電功率 8 201104115 供給至加熱器。如此一來，依本發明之閘閥裝置，則無須 設置有直接連接至加熱器的電功率供給用電纜，而是將加 熱器安裝在閥體，且能發揮輕易地將電功率供給至加熱器 之效果。 【實施方式】 〔第1實施形態〕 以下，參考圖式詳細說明本發明之實施形態。首先， 參考第1圖及第2圖，說明作為包含本發明第1實施形態 之閘閥裝置的系統一例之真空處理系統100的結構。第1 圖係概略顯示真空處理系統100的立體圖。第2圖係概略 顯示真空處理系統100内部的平面圖。真空處理系統100 係構成為能針對例如FPD用玻璃基板（以下僅稱作「基板」)S 進行電漿處理用的處理系統。另外，作為FPD則例舉出液 晶顯示器（LCD)、電發光(Electroluminescence ; EL)顯示器、 電漿顯示器面板(PDP)等。 真空處理系統100係具備有連結呈十字形的5個真空 處理室。具體來說，真空處理系統100係具有作為5個真 空處理室之3個製程處理室101a、101b、101c、搬送處理 室103與預抽腔室105。該等真空處理室中，搬送處理室 103係設置於中央。搬送處理室103具有4個侧面。製程處 理室101a、101b、101c與預抽腔室105則係以鄰接於搬送 處理室103的各側面之方式所設置。 雖然圖中未顯示，真空處理系統100更具備有安裝在 201104115 各製程處理室101a、101b、101c的3個冷凝器。該3個冷 凝器能分別將製程處理室l〇la、101b、101c昇溫至特定温 度(例如120°C)。 製程處理室101 a、101 b、101 c係以能將其内部空間雉 持在特定的減壓氣氛(真空狀態）之型態所構成。製程處理室 101a、l〇lb、101c内分別配備有作為載置基板S之載置台 的基座102 » 於製程處理室101a、101b、l〇lc中，當將基板s載置 於基座102之狀態下’係針對基板s進行例如真空條件下 的蝕刻處理、灰化處理、成膜處理等之電漿處理。製程處 理室101a、101b、101c内分別收納有於該處進行處理用的 裝置。真空處理糸統100中’可於3個製程處理室i〇ia、 101b、101c進行同種類的處理，抑或於各製程處理室進行 不同種類的處理。另外，製程處理室之個數不限定為3個， 亦可為4個以上。 搬送處理室103係與製程處理室101a、1〇lb、1〇lc同 樣地而以可保持在特定減壓氣氛之型態所構成。真空處理 系統100更具備有設置於搬送處理室103内的搬送裝置 133。搬送裝置133係具有能進出、退避及迴轉之結構以搬 送基板S的樹齒狀晶圓叉135。藉由該搬送裝置133而於製 程處理室101a、101b、101c與預抽腔室1〇5之間進行基板 S之搬送。 預抽腔室1〇5係與製程處理室l〇la、l〇lb、l〇lc及搬 送處理室103同樣地而以可保持在特定減壓氣氛之型態所 201104115 構成。預抽腔室105係可於減壓氣氛之搬送處理室1〇3與 外部之大氣氣氛之間進行基板s之收送者。 由於預抽腔至105必須反覆地形成大氣壓狀態與真空 狀態，故係以盡量縮小其内部容積之方式來構成\預抽腔 室105係間隔般地設置有支樓基板s的複數個緩衝材138。 該等緩衝材138彼此之間的間隙卿成了容納櫛齒狀晶圓 叉(例如晶圓叉135)的溝槽。 真空處理系統1〇〇更具備有5個閘閥裝置1〇&、i〇b、 l〇c、10d、閘閥裝置10a係安裝在搬送處理室1〇3盥 製程處理室HHa之間。開閥裝置1〇b係安裝在搬送處理室 103與製程處理室101b之間。閘閥裝置1〇c係安裝在搬送 處理室103與製程處理室101c之間。閘閥裝置1〇d係安裝 在搬送處理室1〇3與預抽腔室105之間。閘閥裝置i〇e則 女裝在預抽腔室105處之閘閥裝置i〇d的相反側。閘閥裝 置10a〜10e皆具有能將設置於分隔鄰接2空間之壁處的開 口部進行開啟/關閉的功能。 閘閥裝置10a〜10d可在關閉狀態下將各處理室密封呈 氣密’且能在開啟狀態下使各處理室間相連通以進行基板8 之搬移。閘閥裝置10e可在關閉狀態下維持預抽腔室1〇5 之氣密性，且能在開啟狀態下於預抽腔室1〇5内部與外部 之間進行基板S之搬移。 ^ 真空處理线動更具備有搬送裝置125，該搬送襄置 !25係設置於與預抽腔室105之間而包_間mQe之位 置處。搬送裝置125係具有：作為基板保持具的晶圓叉 11 201104115 127 ;可進出、退避及迴轉般地支撐晶圓叉127的支撐部 129;以及具備有驅動該支持部129之驅動機構的驅動部 131。 真空處理系統100更具備有設置於驅動部131兩侧的 晶圓匣盒放置架（indexer)121a與121b、以及載置於各晶圓 匣盒放置架121a與121b上的晶圓匣盒ci與C2。晶圓g 盒放置架121a、121b係具有分別昇降晶圓匡盒ci、C2的 汁降機構部123a、123b。各晶圓匣盒d、内係在上下 方向間隔地且多段式地配置有基板S。搬送裝置125之晶圓 叉127係設置於晶圓匿盒c 1與C2之間。 又’雖然於第1圖及第2圖中未顯示但真空處理系 、= = = :咖部係控制真空處理系統⑽ 控制有― 器的記憶部。控制器係針面:卜以及連接至控制 制的構成要素進行统籌控制::須進行控 者為了管理真空處使用者"面部係由工程管理 鍵盤、以及將真空而進行指令的輸人操作等之 之顯示器等所心S糸纟4 ΐ(κ)之運轉狀況可視化地顯示 控制來實現真空處理記憶部係保存有記錄了利用控制器之 程式(軟體)與處理=igg所實施之各種纽用之控制 而根據來自使用者，等的製程配方。接著，可依需要 的製程配方並由控指示等來從記憶部呼叫出任意 真空處理系統1〇〇 轭，藉以於控制器之控制下利用 果進行所期望之處理。 12 201104115 上述控制程式與處理條件資料等製程配方可使用收納 於電腦可讀取記憶媒體，例如CD-ROM、硬碟、軟碟、快 閃記憶體等狀態下者。抑或，可從其他裝置而經由例如專 用線路來即時傳送並在線利用。 接下來，說明真空處理系統100之動作。首先，進退 般地驅動搬送裝置125之晶圓叉127，並從晶圓匣盒C1接 收未處理基板S後，將其載置於預抽腔室105之緩衝材 138。接下來，將晶圓叉127從預抽腔室105退出。 接下來，將預抽腔室105之大氣側閘閥裝置l〇e關閉。 接下來，將預抽腔室105内部進行排氣來使内部減壓至特 定的真空度。接下來，將搬送處理室103與預抽腔室105 之間的閘閥裝置l〇d開啟。接下來，藉由搬送裝置133之 晶圓叉135來接收收納於預抽腔室1〇5的基板S。 接下來，藉由搬送裝置133之晶圓叉135來將基板S 搬入至製程處理室l〇la、l〇lb、l〇lc中任一者，並移轉給 基座102。接下來，將搬入有基板s之製程處理室與搬送處 理室103之間的閘閥裝置關閉。 接下來’於搬入有基板S之製程處理室内，針對基板s 進行蝕刻等特定處理。接下來，待處理終了，則將進行處 理後的製程處理室與搬送處理室103之間的閘閥裝置開 啟°接下來，將完成處理的基板S從基座1〇2移轉給搬送 裝置133之晶圓叉135，並從製程處理室搬出。 基板S係以搬入時之相反路徑經由預抽腔室1〇5,並藉 由搬送裝置125而被收納至晶圓匣盒C2。另外，亦可將完 13 201104115 成處理後的基板S搬回原本的晶圓匣盒Cl。 接下來，參考第3圖至第8圖來詳細說明本實施形態 之閘閥裝置的結構。第3圖至第5圖係顯示本實施形悲之 閘閥裝置的結構之剖面圖。另外’第3圖係顯示開闕裝置 之開啟狀態，第4圖及第5圖則顯示閘閥裝置之關閉狀態。 第6圖係顯示第4圖所示之狀態下’閘閥裝置之閥體、加 熱器及連接器部的前視圖。第7圖係顯示連接至第6圖所 示之連接器部的端子部之前視圖°第8圖係顯示本貫施形 態之閘閥裝置的電路結構之電路圖。 本實施形態之閘閥裝置10可適用於第1圖及第2圖所 示之真空處理系統的5個閘閥裝置10a、10b、10c、10d、 lOe中的任一者，特別是適用於設置在製程處理室101a、 101b、l〇lc與搬送處理室103之間的閘閥裝置10a、10b、 1〇ce於是，以下，以適用於閘閥裝置l〇a、10b、10c之情 況作為實施例來說明本實施形態之閘閥裝置10。本實施例 中，閘閥裝置1〇係設置於處理室101與搬送處理室103之 間。處理室1〇1可為製程處理室101a、101b、l〇lc中任一 者。另外，第3圖至第5圖申，省略了搬送處理室i〇3之 圖式。 如第3圖至第5圖所示’處理室1〇1係具備有劃定出 處理室101内的空間之殼體111。殼體111包含有鄰接於閘 閥裝置10之壁111A。該壁111A係將處理室1〇1内的空間 與鄰接於其之閘閥裝置10侧的空間隔開。壁111A係設置 有可於處理室與搬送處理室1〇3之間進行基板s的搬 201104115 送之開口部112。壁111A係具有面向閘閥裝置10之壁面 111AS。壁111A係埋設固定有如同露出於該壁面111AS般 之端子部40。 閘閥裝置10係具備有殼體11、用以將開口部112開啟 /關閉的閥體12、移動閥體12以將開口部112開啟/關閉的 閥體移動裝置20、用以加熱閥體12的加熱器13、以及連 接器部30。閥體12、加熱器13及連接器部30為一體成型。 殼體11係收納有該等為一體成型之閥體12與加熱器13與 連接器部30、以及閥體移動裝置20的一部份。閥體移動裝 置20係對應於本發明之閥體移動機構。 殼體11為具有上部、底部、以及連結上部與底部的2 個側部之四角形筒狀。殼體11於處理室101側之端部（第3 圖之右端）與搬送處理室103側之端部（第3圖之左端）處分 別形成有開口。 闊體12呈接近直方體形狀。閥體12具有面向處理室 101而可將開口部112密封的密封面12A、該密封面12A 之相反侧的背面12B、上面12C、底面12D、以及2個側面 12E與12F。密封面12A具有足以封閉開口部112的大小。 另外，第6圖係以兩點之鏈線來顯示開口部112。 壁111A之壁面111AS處，於開口部112周圍安裝有Ο 型環19。如第4圖及第5圖所示，在閥體12將開口部112 封閉之狀態下，0型環19係沿其全周而被夾置於壁面 111AS與密封面12A之間處。藉此，可將處理室101密封 呈氣密。 15 201104115 加熱器13係如同連接至底面丨213船.公壯+ 處。另外，只要是密封面以以外之面叙^裝在閱體η 如同連接至底面12D以外之面般地安穿，’二將加熱益13 器13係使用例如平板型加熱器。但是12處。加熱 令达 加熱器13並去眼 疋為平板型加熱器，只要是會接收電 i禾隈 熱者即可。 供給而進行發 如第8圖所示，閛閥裝置10更|供士、β, θ 度用的溫度感測器73。第3圖至第6圖並未置^體12溫 感测器73 ’但溫度感測器73係安裳在^^顯不出溫度 閥體移動裝置20係具有氣壓缸21、 及連結部23、24、25、26。氣壓虹2】土 &組件22、以 桿部21b。壓筒部21a係安裝在殼 捍部21b係從壓筒部21a通過殼體u a 。壓缸 而朝向和辦 氏4所形成之開口部 壓筒二。壓二之-部份係收納於 而朝向_2二缸二=筒= 方向）進行往復運動。另外，亦可使用、，上下 的導螺桿機構來取代氣壓缸21。吏用，由反缸或以馬達驅動 件22係例如牛與在壓缸桿部21b的前端部。基底組 面向閥體12之前面同樣地呈接近直方體形狀，並具有 2個側面。氣· 21、:1 反側的背面、上面、底面、以及 壁面11US的方向^讓基底組件22朝平行於壁111A之 機構。 ° 氣壓红21係對應於本發明之驅動 201104115 連結部23〜26係構成連結基底組件22與閥體12之連 結機構。如第3圖至第6圖所示，連結部23、24之一端部 係町迴轉地連接於閥體12的侧面12E’而連結部23、24 之另一端部則可迴轉地連接於與側面12E相對應之基底組 件22的側面。同樣地，連結部25、26之一端部係可迴轉 地連接於閥體12的側面12F’而連結部25、26之另一端部 則連接於與側面12F相對應之基底組件22的側面。 雖然圖中未顯示，但基底組件22係包含有使連結部23 〜26相對於該等基底組件22的側面而以連接部為中心來 朝第3圖中之逆時針方向迴轉般地施加彈性力的彈簀，以 及限制連結部23〜26朝逆時針方向迴轉的擔塊。第3圖係 ，不藉由擔塊來限制連結部23〜26之迴轉的狀態。於該狀 ’“、下閥體12之上面12C係位於較基底組件22之上面要 更上方的位置。 ία λ體12之上面12C係設置有可進行迴轉的滾輪15、 輪15、16之一部份係較上面12C更朝向上方突出。 ’滚輪15、16可使用圓柱狀、球狀等各種形狀者。 閥體移動裝置2G係使得關12於帛3圖所示之待機 =、與第4 ®及第5圖所示之封齡置之間騎移動。 關於_動裝置20之動作容後詳細說明。 以下’詳細說明關於連接器部30與端子部4〇。連接器 入具端有4個連接器，端子部4〇具有後述之4個 嫌物置時，=彳=^子部* _在賴體12 連接益30之4個連接器與端子部 17 201104115 40之4個輸出人端子相互連接的位置處。帛3圖 所示之實施例中，連接器部30係安裝在加埶器13广圖 但是’連接器部30亦可設置在閥體12之底面° 位置處。 寻具他 如第6圖所示，連接器部3。係具有由絕緣材 的本體魏、以及藉由該本體胤所料之電功率用連t 器3i ' 32及感測器用連接器33、34。本體3〇八係= 向處理室1G1之壁面3GAS、以及於該壁面3㈣處㈣ 口而可收納各連接器31、32、33、34的4個凹部。連接二 31、32係電連接於加熱器13。連接器33、34則電連接： 溫度感測器73。另外，當無須對閥體12的溫度進行量測 時，亦可不設置溫度感測器73及連接器33、34 ^ “ 此處，參考第3圖及第6圖來說明連接器31、32 33、 34結構的一實施例。本實施例中，連接器31、32、33、34 係分別具有可進入/退出地收納於相對應之凹部内的金屬^ 插頭 31a、32a、33a、34a。插頭 31a、32a、33a、3如為分 別具有凸緣的略圓柱形。連接器31、32、33、34係分別更 具有收納於相對應之凹部内，而能針對插頭Ma、32a、33a、 34&來朝向從相對應之凹部處突出之方向（第3圖的右方）施 加彈力的彈簧。另外，第3圖中，連接器31、32、33、34 之彈簧中，僅顯示出連接器31之彈簧3lbe另外，收納連 接器31、32、33、34的凹部係分別將插頭3U、32a、33&、 34a予以保持以使其無法從凹部處拔出。插頭3ia、32a係 電連接於加熱器13,插頭33a、34a則電連接於溫度感測器 73。 73。201104115 如第3圖及第7圖所示，端子部40係具有由絕緣材料 所組成的本體40A、以及藉由該本體40A所保持之電功率 輸出端子41、42及感測器輸入端子43、44。以下，將電功 率輸出端子41、42以及感測器輸入端子43、44標示為輸 出入端子41、42、43、44。本體40A係具有面向閘閥裝置 10之壁面40AS，以及於該壁面40AS處具有開口以收納各 輸出入端子41、42、43、44的4個凹部。如第7圖所示， 於壁面40AS處’電功率輸出端子41、42的周圍為了提高 電功率輸出端子41、42與其周邊部份之間的絕緣性，而安 裝有〇型環45、46。另外，當無須對閥體12的溫度進行 量測時，亦可不設置感測器輸入端子43、44。 如第4圖及第5圖所示，當閥體12將開.口部i 12封閉 之狀態下，連接器31、32、33、34之插頭31a、32a、33a、 34a係分別連接至輸出入端子41、42、43、44。藉此，則 連接器 31、32、33、34(插頭 31a、32a、33a、34a)會分別 電性且物理性地連接於各輸出入端子4卜42、43、1， 於此狀態下，Ο型環45、46會被夾置於壁面3〇AS盥辟 40AS之間處。 〇 土回 輸出入端子41 ' 42 ' 43、44係分別連接於導線。 根導線係通過例如壁111A内部所形成之孔，而被導 體111外部。 & 如第8圖所示，真空處理系統1〇〇係具備有產生供仏 至加熱器13的電功率之電源7卜開關49、以及控制部^‘°。 19 201104115 電功率輸出端子41、42係透過開關49而電連接於電源71。 開關49可選擇形成導通狀態或截止狀態。苐8圖^顯示於 電功率輸出端子41與電源71之間設置有開關49 ^實施 例。但是’亦可於電功率輸出端子41與電源71之間2， 以及於電功率輪出端子42與電源71之間處設置有時 形成導通或截止的開關來取代前述開關49。連接器31 係連接至電功率輸出端子41、42，且當開關49為導通狀態 時，可從電源71來對加熱器13供給電功率。電功率輸= 端子41、42係對應於本發明之電功率輸出部。 感測器輸入端子43、44係連結至控制部72。因此，$ 連接器33、34被連結至感測器輸入端子43、44時，會: 溫度感測器73連結至控制部72。控制部72係例如針^真 空處理系.統1GG巾需要控㈣構成要素進行麟控制者: 控制部72係為了控制閘閥裝置1G之動作，而取得藉由經 連，33、34及感測器輸入端子43、44來連接心度感 器73所獲知之闊體12的溫度資訊’同時控制氣壓缸21、 =、以及開關49。另外，控制部72亦可僅進 2^0之控制，而非針對真空處理系統⑽中需要控制的 =要$進行統籌控Φ卜此情況下之控制部72係例 -匕之控制部來針對真空處理系統_進行麟控制。 3如後所述，本實施形態中，連結至加熱器13之連接器 係與閥體12連動，而在閥體12將開口部ιΐ2封閉 率^P性且物雜地於料電功钱Λ部之電功 丰輪出端子41、42,而在當閥體12將開口部⑴開啟之= 201104115 態下則從電功率輪出端子4卜42處電性且物理性地分離。 另外，目前為止的說明中，閘閥裝置10係以不包含有 端子部40、開關49及電源71者來作為構成要素。但是， 作為閘閥裝置1〇的構成要素亦可包含有端子部4〇，或更包 含有開關49 ’抑或更包含有電源71。 接下來，參考第3圖至第5圖及第9圖，以在處理室 1 〇 1 ^對基板S實施特定處理之情況為例，來詳細說明本實 施形態之閘閥裝置丨0的動作。第9圖係用以說明閘閥裝置 10之動作的說明圖。第9圖係顯示將基板S搬入至處理室 101到將處理完成之基板S從處理室101搬出為止的6個步 驟中，各別之動作内容、開口部112的狀態及加熱器13的 狀態。 第9圖之步驟i係將開口部112開啟，並通過開口部 112來將基板s從搬送處理室1〇3搬入至處理室1〇1。該步 驟1中，闊體12係位於待機位置。第3圖係顯示當閥體12 位於待機位置的狀態。閥體12之待機位置係當氣壓缸21 之壓缸桿部21b的前端部位於可動範圍之最下端位置時的 閥體12位置。當閥體12位於待機位置之狀態中，閥體12 係將開口部112開啟。該狀態下，可通過開口部112來將 基板S從搬送處理室103搬入至處理室ι〇1。 又’步驟1中’加熱器13為OFF狀態，亦即未供給有 電功率之狀態。包含閥體12位於待機位置之狀態，當開口 部112為開啟之狀態下’連接器部3〇與端子部4〇係呈相 互分離。因此，連接至加熱器13之連接器31、32係從作 21 201104115 =電=率輸出部之電功率輸出端子41、42處電性 此’將開口部112開啟之狀態下，加熱器4 未二有電功率。又’將開口部112開啟之狀態 49係設定為截止狀態。 节關 妾下來的步驟2中，係藉由閥體η來進行將開口部⑴ 動作。從第3圖所示之狀態而藉由關12來將開口 j m封閉時’储由閥體移動裝置2〇之氣壓缸2ι來 土底組件22#起。隨著基底組件22的上昇，閥體亦 會上昇。此時，直到滾輪15、16抵觸至殼體u上部為止， 閥體12會朝向平行於壁111A之壁面niAs的方向移動。 當滾輪15、16抵觸到殼體U上部時，閥體12會到達 面向開π部112之位置。從該狀態更進—步地藉由氣壓把 21來將基底組件22昇㈣，由於閥！| 12無法上昇，故連 結部23〜26會一邊相對於該等基底組件22白勺側面而以連 接部為中心來朝向第3圖之順時針方向迴轉，且閥體12合 一邊面向開口部112而朝向垂直於壁mA之壁面illA"s 的方向移動。此時，藉由滾輪15、16之作用，則閥體12 不會與殼體11磨擦而可滑順地移動。然後，最終如第4圖 所示’使闊體12之密封面12A會押抵至壁illA之壁面 111AS ’並藉由閥體12來將開口部in封閉。於此時點， 閥體移動裝置20之動作便會停止。藉由閥體12來將開口 部112封閉時’連接器部30會連接至端子部4〇。具體來說， 連接器31、32、33、34之插頭31a、32a、33a、34a會分別 接觸至輸出入端子4】、42、43'44,藉以讓連接器31、32、 22 201104115 33、34(插頭31a、32a、33a、34a)分別電性且物理性地連接 於輸出入端子41、42、43、44。 如第4圖所示’藉由前逑動作來使闕體π將開口部112 封閉之時點，開關49為截止狀態。因此，該時點並未對加 熱器13供給有電功率。 接下來的步驟3中，使加熱器13為〇N狀態，叩供給 有電功率之狀態。如前述般，加熱器13為0Ν狀態係在藉 由閥體12來將開口部112封閉之後的時點。步驟3中，如 第5圖所示，將開關49設定為導通狀態。藉此，會從電源 71經由電功率輸出端子41、42及連接器31、32來將電功 率供給至加熱器13,以使得加熱器13發熱而加熱閥體12。 又，此時，溫度感測器73會經由連接器％、34及感測器 輸入端子43、44而連接至控制部72。控制部72會取得料 器73所測得之間體12的溫度資訊，並根“ 制電源71，以控制閥體12之溫度。另外，為 之溫度’控制部72亦可將開關49在導通狀 怨與截止狀態之間進行切換。 心狀 封門接=的步驟4中，係在利用閥體12來將開口部山 封閉，將包功率供給至加熱器 下，於虚且將閥體12加熱之狀態 下=理室101對基板s實施餘刻等特定處理。 係在1G1處之處理終了後’接下來的步驟5中， 二定二I- ' 12來將開口部112封閉之狀態下，將開關49 汉疋^^態，以停止對加熱器13供給電功率。 接下來的步驟6中，係將開口部112開啟，並通過開 23 201104115 闕體u進行將二:2’：藉由，動裝置20，並對 1 σΡ 112封閉時之相反動作，以將開口部 组：22降：藉由間體移動裴置2〇之氣壓缸21來將基底 上部之情況下。，此^時，起初，在滾輪15、16抵接至殼體11 月/ ，連結部23〜26會相對於該等基底组件22 的側面而以連接部為中心來朝第3圖之逆時針方向迴轉， 並使得閥體12如同遠_口部112般地朝垂直於壁111Α 之壁面111 AS的方向移動。藉此，將開口部112開啟。又， 田閥體12將開口部112開啟時，連接器部30會從端子部 40分離。 w田連結部23〜26迴轉至受擋塊限制的位置時，然後， 隨著基底組件22的下降，閥體12亦會降下。此時，閥體 12會朝平行於壁1UA之壁面iuas的方向移動。接著， 閥體12最終會到達第3圖所示之待機位置，*停止闊體移 動裝置20之動作。然後，通過開口部112來將處理完成之 基板S從處理室101搬出至搬送處理室1〇3。 一接下來，說明關於本實施形態之閘閥裝置10的效果。 =只施形態之閘閥裝置10具備有加熱閥體12用的加熱器 s3因此，依該閘閥裝置10，於處理室101内進行會產生 】生成物之處理時，藉由利用加熱器13來加熱閥體12，則 止副生成物附著於閥體12表面。藉此，依本實施形態 可防止微粒之發生’結果便可防止微粒所造成之蝕刻不 良等不良問題的發生。 201104115 又 ，本貫施形態中，閥體12、加埶 電連接於加熱器13之連接器31、32的、、f413、以及包含有 成型。接著，連接Μ ^ 的接器部30為—體 者逑接态31、32係與閥體12途叙 m 將開口部m關之狀態下電性且物赌地連接^體π :力率輸出部之電功率輸出端子41、42,而在閥體12 :二電 _開啟_頂從電功_端子41、:2== 分離。因此’本實施形態中，能僅於當閥體12將 =β 112封閉之狀態下，讓連接器31、32電性且物理性 地連接於作為電功率輸出部之電功率輸出端子4卜42來將 電功率供給至加熱器13。如此，依本實施形態，於間閥裝 置10之殼體11内’便無須以透過基底組件22及連結機構 而直接連接至加熱器13之型癌來設置電功率供給用電纜， 即可容易地將電功率供給至加熱器13。 又，本貫施形態之閘閥裝置1〇不具備有透過閥體移動 駿置20而連接至加熱器13之電功率供給用電鏡。因此， 依本實施形態，閘閥裝置10之安裝與維護便較為容易。 又，本實施形態中，於電源71與電功率輸出端子41、 42之間設置有可選擇自電源71對電功率輸出端子41、42 進行電功率的供給或截止之開關49。接著，從開口部112 為開啟之狀態轉變至開口部112為封閉之狀態時，當開口 邹112呈封閉且連接器31、32被連接至電功率輸出端子 41、42後，將開關49設定為導通狀態以對電功率輸出端子 41、42供給電功率。又’從開口部112為封閉之狀態轉變 至開口部112為開啟之狀態時’將開關49設定為截止狀態 25 201104115 =、止對電功率輸出端子4卜42之電功率供給後，將開口 =112開啟以使得連接器3卜32從電功率輸出端子4卜42 处分離。所以’本實施形態中，電功率輸出端子41、42便 不會在連接於電源71之狀態下露出 因此，依本實施形態， 便能防止從電功率輸出端子4卜42發纽光放電或漏電。 又，本實施形態中，當連接器部30為連接至端子部4〇 之狀恶時，為了提尚電功率輸出端子41、42與其周邊部份 之間的絕緣性’設置於電功率輸出端子41、42周圍的〇型 環45、46係被夾置於連接器部30之本體30A的壁面30AS 與端子部40之本體40A地壁面40AS之間。藉此，依本實 施形態’則能更有效果地防止從電功率輸出端子41、42發 生弧光放電或漏電。 又，本實施形態中，加熱器13係安裝於閥體12表面。 因此，依本實施形態，相較於將加熱器13設置於閥體12 内部之情況，則可防止閥體12的剛性下降。 〔第2實施形態〕 接下來，參考第1〇圖至第12圖，說明關於本發明之 第2實施形態的閘閥裝置。第1〇圖至第12圖係顯示本實 施形態之閘閥裝置的結構之剖面圖。另外’第10圖係顯示 閘閥裝置之開啟狀態’第I1圖及第12圖則顯示閘閥裝置 之關閉狀態。 以下，說明本實施形態之閘閥裝置80與第1實施形態 之閘閥裝置的相異點。閘閥裝置80係取代閘閥裝置10 之殼體11而具備有殼體81。殼體81為具有上部、底部、 26 201104115 以及連接上部與底部 部中的其中者係3 4個側部的箱形。殼體81之4個側 ⑴A。將該侧部稱為壁構 101,之殼體ηι的壁BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to opening an opening provided in a wall of a partition 2 adjacent space like an opening of a vacuum processing chamber for a substrate under vacuum conditions. / Close the gate valve device. [Prior Art] A vacuum processing system is used for plasma etching, plasma ashing, plasma film formation, and the like under vacuum conditions for a substrate such as a glass panel for FPD (Flat Panel Display). The vacuum processing system includes, for example, a processing chamber for processing a substrate, a transfer processing chamber for storing a transfer device for loading the substrate into the processing chamber, and transporting the substrate from the processing chamber, and a processing chamber and the processing chamber. Transfer the gate valve device between the processing chambers, etc. Both the process chamber and the transfer chamber are vacuum processing chambers for substrate processing under vacuum conditions. The process chamber has an opening for allowing the substrate to pass when the substrate is loaded or unloaded. The gate valve device provided between the process chamber and the transfer processing chamber has a valve body capable of opening/closing the opening of the process chamber. The valve body is used to close the opening of the process chamber, thereby sealing the process chamber to an airtight state. The processing carried out in the process chamber includes a treatment such as ruthenium oxide etching to deposit by-products during processing. In the foregoing process, When the product of Ertian 附着 is attached to the inner wall of the process chamber, the by-product will peel off from the inner wall to generate particles (floating particles), and the particles will cause a residual moment. 201104115 ίίί In order to prevent the side wall of the by-product attachment chamber from being closed by the condenser (thermostat device). °%% has a surface temperature medium' to heat the process chamber to . c Left By: a process in the room, the opening of the process chamber will be closed at the same time. In this state, the wide body surface is cold. The valve body cannot be used to control the contact between the contact area and the process chamber. Therefore, as described above, the process of drying the process by the condenser is still impossible to raise the temperature of the valve body. Therefore, the surface of the body is in the state of the opening of the chamber. ^^理, the part of the space inside will be easily attached to the sub-generation process. When attached to the above part, the sub-product will be attached to the second brother, and particles will be generated in the same way. . In the case of the valve body, the heater is attached to the valve body, and the valve is attached to the valve body. (#) A method of directly heating the inter-body. Patent Document 1: Japanese Laid-Open Patent Publication No. 10-132095. 曰 曰 曰 11 11 11 11 11 11 11 11 11 11 11 11 11 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 移动 /ib, mildew. Therefore, in order to prevent the valve body and other structures from grinding, such as the 5H drive mechanism is preferably a mechanism that does not allow the valve body to rub with other structures. As a mechanism for preventing the _ from rubbing against other structures as described above, for example, when the valve body closes the σ portion, the wide body is oriented in a direction parallel to the wall surface of the wall having the opening portion (4) to the opening portion. After the position, the valve body is moved toward the opening portion and moved toward the wall surface direction of the wall. When the valve body opens the opening portion, the mechanism for the opposite operation when closing the opening portion is performed. The above mechanism can be realized by, for example, connecting the valve body through the coupling mechanism to the base that is driven in the direction parallel to the wall surface. _ Here, in the case of a closing device including a driving mechanism that connects the valve body to the base assembly through the coupling mechanism, it is considered that the heater is attached to the body. At this time, in order to supply electric power to the heater, it is conceivable to connect the electric power supply cable to the heater through the base unit and the connection mechanism. However, in the gate valve device including the drive mechanism (through the connection mechanism: the wide body is connected to the base assembly), as the action of opening/closing the opening portion, due to the integrally formed wide body, := between the components Since the relative positional relationship changes, there is a problem in that it is difficult to connect the electric power supply cable to the heater through the base unit and the connection mechanism. SUMMARY OF THE INVENTION The present invention has been made in view of the above problems. It is an object of the invention to provide a gate valve device in which a heater is attached to a valve body for opening/closing an opening, and electric power can be easily supplied to the heater. The gate valve device of the present invention includes a valve body for opening/closing an opening provided at a wall partitioning between two adjacent spaces 201104115, and moving the valve body to open/close the opening portion by the valve body A valve body moving mechanism, a heater for heating the wide body, and a connector electrically connected to the heater and electrically and physically connected to an electric power output portion that outputs electric power supplied to the heater. The valve body, the heater and the connector are integrally formed. The connector is electrically connected to the electric power output unit in a state in which the valve body is interlocked with the valve body, and the valve body opens the opening portion. Electrically and physically separated from the electrical power output. In the gate valve device of the present invention, the electric power output portion can be fixed to the wall. Further, the gate valve device of the present invention may further include a casing for housing the valve body, the heater, and the connector, and the electric power output portion is fixed to the casing. At this time, the housing may have a wall forming portion constituting at least a portion of the wall, and the electric power output portion may be fixed to the wall forming portion. Further, the gate valve device of the present invention may further include a switch provided between the power source for supplying electric power to the electric power output portion and the electric power output portion, and optionally supplying electric power to the electric power output portion or cutoff. Moreover, the gate valve device of the present invention may further comprise a sub-connector integrally formed with the valve body, the heater and the connector, electrically connected to the heater, and electrically and physically connected. The second electric power output unit that supplies electric power to the heater is output. The sub-connector is interlocked with the valve body, and electrically and physically separated from the second electric 201104115 power output unit in a state where the wide body closes the opening portion, and the opening is formed in the valve body In a specific state in which the portion is turned on, the second electric power output unit is electrically and physically connected. Further, the gate valve device of the present invention may further include the second electric power output portion. In this case, the gate valve device may further include a casing for housing the valve body, the heater, the connector, and the sub-connector, and the second electric power output portion is fixed to the casing. Further, the gate valve device may further include a switch provided between the power source for supplying electric power to the second electric power output unit and the second electric power output unit, and optionally providing electric power to the second electric power output unit Supply or cutoff. Further, in the gate valve device of the present invention, the valve body moving mechanism may be a drive mechanism having a base assembly, moving the base assembly in a direction parallel to a wall surface of the wall, and a connection connecting the base assembly and the valve body a mechanism, and when the opening is closed by the valve body, the valve body is moved to a position facing the opening portion in a direction parallel to a wall surface of the wall, and then the valve body faces the opening portion And moving toward the wall surface perpendicular to the wall, when the valve body opens the opening portion, the valve body is caused to reverse the actor when the opening portion is closed. Further, in the gate valve device of the present invention, one of the two spaces may be a vacuum processing chamber for processing the substrate under vacuum conditions. In the gate valve device of the present invention, when the valve body opens the opening portion, the connector electrically connected to the heater is electrically and physically separated from the electric power output portion, but when the valve body closes the opening portion, Then, the connector is electrically and physically connected to the electric power output portion, and the electric power 8 201104115 can be supplied to the heater. As a result, according to the gate valve device of the present invention, it is not necessary to provide an electric power supply cable directly connected to the heater, but the heater is attached to the valve body, and the electric power can be easily supplied to the heater. [Embodiment] [First Embodiment] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. First, a configuration of a vacuum processing system 100 as an example of a system including a gate valve device according to a first embodiment of the present invention will be described with reference to Figs. 1 and 2 . The first drawing schematically shows a perspective view of the vacuum processing system 100. Fig. 2 is a plan view showing the inside of the vacuum processing system 100. The vacuum processing system 100 is configured as a processing system for performing plasma processing on, for example, a glass substrate for FPD (hereinafter simply referred to as "substrate") S. Further, examples of the FPD include a liquid crystal display (LCD), an electroluminescence (EL) display, and a plasma display panel (PDP). The vacuum processing system 100 is provided with five vacuum processing chambers connected in a cross shape. Specifically, the vacuum processing system 100 has three process chambers 101a, 101b, and 101c, a transfer processing chamber 103, and a pre-drain chamber 105 as five vacuum processing chambers. In the vacuum processing chambers, the transfer processing chamber 103 is provided at the center. The transfer processing chamber 103 has four side faces. The process chambers 101a, 101b, and 101c and the pre-drain chamber 105 are provided adjacent to the respective side faces of the transfer processing chamber 103. Although not shown in the drawing, the vacuum processing system 100 further includes three condensers installed in the respective process chambers 101a, 101b, and 101c of 201104115. The three condensers can respectively raise the process chambers 10a, 101b, 101c to a specific temperature (e.g., 120 ° C). The process chambers 101a, 101b, and 101c are configured to be capable of holding the internal space thereof in a specific reduced-pressure atmosphere (vacuum state). Each of the processing chambers 101a, 101b, 101c is provided with a susceptor 102 as a mounting table on which the substrate S is placed, in the process chambers 101a, 101b, 101c, and the substrate s is placed on the susceptor 102. In the state of the substrate s, for example, plasma treatment such as etching treatment under vacuum conditions, ashing treatment, film formation treatment, or the like is performed. In the process chambers 101a, 101b, and 101c, devices for processing are stored therein. In the vacuum processing system 100, the same type of processing can be performed in the three processing chambers i〇ia, 101b, and 101c, or different types of processing can be performed in each processing chamber. Further, the number of the processing chambers is not limited to three, and may be four or more. The transfer processing chamber 103 is configured in the same manner as the process chambers 101a, 1〇1b, and 1〇lc, and can be maintained in a specific decompression atmosphere. The vacuum processing system 100 further includes a conveying device 133 provided in the conveying processing chamber 103. The conveying device 133 is a tree-shaped wafer fork 135 having a structure capable of feeding in, retreating, and rotating to convey the substrate S. The substrate S is transported between the process chambers 101a, 101b, and 101c and the pre-drain chambers 1 to 5 by the transfer device 133. The pre-extraction chamber 1〇5 is configured in the same manner as the processing chambers 103a, l1, l, and the transport processing chamber 103, and can be held in a specific decompression atmosphere, 201104115. The pre-extraction chamber 105 is capable of transporting the substrate s between the transfer processing chamber 1〇3 in a reduced-pressure atmosphere and an external atmosphere. Since the pre-extraction chamber 105 must repeatedly form an atmospheric pressure state and a vacuum state, the buffer chambers 138 are provided with a plurality of cushioning materials 138 spaced apart from each other in such a manner as to minimize the internal volume thereof. . The gap between the cushioning members 138 is a groove for receiving a serrated wafer fork (e.g., wafer fork 135). The vacuum processing system 1 further includes five gate valve devices 1〇 &, i〇b, l〇c, 10d, and the gate valve device 10a is installed between the transfer processing chamber 1〇3盥 process chamber HHa. The valve opening device 1〇b is installed between the transfer processing chamber 103 and the process chamber 101b. The gate valve device 1〇c is installed between the transfer processing chamber 103 and the process chamber 101c. The gate valve device 1〇d is installed between the transfer processing chamber 1〇3 and the pre-drain chamber 105. The gate valve device i〇e is on the opposite side of the gate valve device i〇d at the pre-drain chamber 105. Each of the gate valve devices 10a to 10e has a function of opening/closing the opening portion provided at the wall separating the adjacent spaces. The gate valve devices 10a to 10d can seal the processing chambers in a closed state in an airtight state and can communicate between the processing chambers in an open state to move the substrates 8. The gate valve device 10e can maintain the airtightness of the pre-extraction chamber 1〇5 in the closed state, and can move the substrate S between the inside and the outside of the pre-extraction chamber 1〇5 in the open state. ^ The vacuum processing linear motion further includes a transport device 125 which is disposed between the pre-extraction chamber 105 and the position of the package m_m. The transfer device 125 includes a wafer fork 11 201104115 127 as a substrate holder, a support portion 129 that supports the wafer fork 127 in a movable, retractable, and revolving manner, and a drive portion that includes a drive mechanism that drives the support portion 129. 131. The vacuum processing system 100 further includes wafer cassette holders 121a and 121b disposed on both sides of the driving unit 131, and wafer cassettes ci placed on the wafer cassette placement frames 121a and 121b. C2. The wafer g cassette placement frames 121a and 121b have juice drop mechanism portions 123a and 123b for elevating the wafer cassettes ci and C2, respectively. The substrate S is disposed in a plurality of stages in the wafer cassette d and the inside in the vertical direction. The wafer fork 127 of the transfer device 125 is disposed between the wafer cassettes c 1 and C2. Further, although not shown in Fig. 1 and Fig. 2, the vacuum processing system and = = =: the coffee system control vacuum processing system (10) controls the memory portion of the device. The controller is a needle surface: Bu and the components connected to the control system for overall control:: The controller must manage the user in order to manage the vacuum, the facial management system, the keyboard, and the vacuum operation. The operation status of the display, etc., is displayed in a visual manner. The vacuum processing memory unit stores various programs that are recorded by the controller (software) and processing = igg. The control is based on the recipe from the user, etc. Then, any vacuum processing system 1 yoke can be called from the memory unit according to the required process recipe and controlled by the control, etc., so that the desired processing can be performed under the control of the controller. 12 201104115 Process recipes such as the above control program and processing condition data can be stored in a computer readable memory medium such as CD-ROM, hard disk, floppy disk, flash memory, etc. Alternatively, it can be instantly transmitted and utilized online from other devices via, for example, a dedicated line. Next, the operation of the vacuum processing system 100 will be described. First, the wafer fork 127 of the transfer device 125 is driven forward and backward, and the unprocessed substrate S is received from the wafer cassette C1, and then placed on the buffer material 138 of the pre-drain chamber 105. Next, the wafer fork 127 is withdrawn from the pre-draw chamber 105. Next, the atmospheric side gate valve device 10e of the pre-drain chamber 105 is closed. Next, the inside of the pre-extraction chamber 105 is evacuated to decompress the inside to a specific degree of vacuum. Next, the gate valve device 10d between the transfer processing chamber 103 and the pre-drain chamber 105 is opened. Next, the substrate S accommodated in the pre-draw chamber 1A5 is received by the wafer fork 135 of the transfer device 133. Next, the substrate S is carried into the process chambers 100a, l1b, llc by the wafer fork 135 of the transfer device 133, and transferred to the susceptor 102. Next, the gate valve device between the process chamber into which the substrate s is carried and the transfer processing chamber 103 is closed. Next, a specific process such as etching is performed on the substrate s in the process chamber in which the substrate S is carried. Next, when the processing is completed, the gate valve device between the process chamber and the transfer processing chamber 103 after the processing is turned on. Next, the substrate S that has been processed is transferred from the susceptor 1 〇 2 to the transport device 133. The wafer fork 135 is removed from the process chamber. The substrate S is stored in the wafer cassette C2 by the transfer device 125 via the pre-extraction chamber 1〇5 in the opposite path during the loading. Alternatively, the substrate S processed after the completion of 2011041041 may be returned to the original wafer cassette C1. Next, the structure of the gate valve apparatus of this embodiment will be described in detail with reference to Figs. 3 to 8 . Fig. 3 to Fig. 5 are sectional views showing the structure of the gate valve device of the present embodiment. Further, Fig. 3 shows the open state of the opening device, and Figs. 4 and 5 show the closed state of the gate valve device. Fig. 6 is a front view showing the valve body, the heater, and the connector portion of the gate valve device in the state shown in Fig. 4. Fig. 7 is a front view showing the terminal portion connected to the connector portion shown in Fig. 6. Fig. 8 is a circuit diagram showing the circuit configuration of the gate valve device of the present embodiment. The gate valve device 10 of the present embodiment can be applied to any of the five gate valve devices 10a, 10b, 10c, 10d, and 10e of the vacuum processing system shown in Figs. 1 and 2, and is particularly suitable for use in a process. The gate valve devices 10a, 10b, and 1b between the processing chambers 101a, 101b, and 101b and the transfer processing chamber 103 are hereinafter described as an example, which are applied to the gate valve devices 10a, 10b, and 10c. The gate valve device 10 of the embodiment. In the present embodiment, the gate valve device 1 is disposed between the processing chamber 101 and the transfer processing chamber 103. The processing chamber 101 can be any one of the process chambers 101a, 101b, 101c. In addition, in Figs. 3 to 5, the drawing of the transfer processing chamber i〇3 is omitted. As shown in Figs. 3 to 5, the processing chamber 1〇1 is provided with a casing 111 defining a space in the processing chamber 101. The housing 111 includes a wall 111A adjacent to the gate valve assembly 10. This wall 111A separates the space in the processing chamber 1〇1 from the space adjacent to the gate valve device 10 side thereof. The wall 111A is provided with an opening portion 112 through which the substrate s can be transported between the processing chamber and the transfer processing chamber 1〇3, 201104115. The wall 111A has a wall surface 111AS facing the gate valve device 10. The wall portion 111A is embedded and fixed with a terminal portion 40 as exposed to the wall surface 111AS. The gate valve device 10 includes a casing 11 , a valve body 12 for opening/closing the opening portion 112 , a valve body moving device 20 that moves the valve body 12 to open/close the opening portion 112 , and a valve body moving device 20 for heating the valve body 12 . The heater 13 and the connector portion 30. The valve body 12, the heater 13, and the connector portion 30 are integrally formed. The casing 11 houses a part of the integrally formed valve body 12, the heater 13 and the connector portion 30, and the valve body moving device 20. The valve body moving device 20 corresponds to the valve body moving mechanism of the present invention. The casing 11 has a quadrangular cylindrical shape having an upper portion, a bottom portion, and two side portions connecting the upper portion and the bottom portion. An opening is formed in the end portion (the right end of Fig. 3) of the casing 11 on the processing chamber 101 side and the end portion (the left end in Fig. 3) on the side of the transfer processing chamber 103. The wide body 12 is in the shape of a nearly rectangular parallelepiped. The valve body 12 has a sealing surface 12A that faces the processing chamber 101 to seal the opening 112, a back surface 12B opposite to the sealing surface 12A, an upper surface 12C, a bottom surface 12D, and two side surfaces 12E and 12F. The sealing face 12A has a size sufficient to close the opening portion 112. In addition, in Fig. 6, the opening portion 112 is shown by a chain of two points. At the wall surface 111AS of the wall 111A, a Ο-shaped ring 19 is attached around the opening 112. As shown in Figs. 4 and 5, in a state in which the valve body 12 closes the opening portion 112, the O-ring 19 is interposed between the wall surface 111AS and the sealing surface 12A along the entire circumference thereof. Thereby, the process chamber 101 can be hermetically sealed. 15 201104115 Heater 13 is like a ship connected to the bottom 丨213. Gong Zhuang + office. Further, as long as the sealing surface is mounted on the outer surface of the reading body η as if it were connected to the surface of the bottom surface 12D, the heating device 13 is used, for example, a flat type heater. But 12 places. Heat the heater 13 and remove it into a flat-plate heater, as long as it receives heat. Supply and delivery As shown in Fig. 8, the valve device 10 is further provided with a temperature sensor 73 for the supply of ±, θ, and θ. 3 to 6 are not provided with the body 12 temperature sensor 73', but the temperature sensor 73 is installed in the temperature. The valve body moving device 20 has a pneumatic cylinder 21 and a connecting portion 23 , 24, 25, 26. Pneumatic rainbow 2] soil & component 22, with rod portion 21b. The cylinder portion 21a is attached to the casing portion 21b and passes through the casing ua from the cylinder portion 21a. The cylinder is oriented toward the opening portion formed by the machine 4. The second part of the pressure is stored in the direction of _2 two cylinders two = cylinder = direction) to reciprocate. Alternatively, the upper and lower lead screw mechanisms may be used instead of the pneumatic cylinder 21. For example, the reverse cylinder or the motor drive member 22 is, for example, a cow and a front end portion of the cylinder rod portion 21b. The base group faces the front surface of the valve body 12 in a nearly rectangular parallelepiped shape and has two side faces. Gas 21,: 1 The reverse side of the back, the top, the bottom, and the direction of the wall 11US make the base assembly 22 face the mechanism parallel to the wall 111A. ° Air pressure red 21 corresponds to the drive of the present invention. 201104115 The joint portions 23 to 26 constitute a joint mechanism for connecting the base unit 22 and the valve body 12. As shown in FIGS. 3 to 6 , one end of the connecting portions 23 and 24 is rotatably connected to the side surface 12E′ of the valve body 12 , and the other end portions of the connecting portions 23 and 24 are rotatably connected to the side surface. 12E corresponds to the side of the base member 22. Similarly, one end of the joint portions 25, 26 is rotatably connected to the side surface 12F' of the valve body 12, and the other end portion of the joint portions 25, 26 is connected to the side surface of the base unit 22 corresponding to the side surface 12F. Although not shown in the drawings, the base member 22 includes elastic members for causing the connecting portions 23 to 26 to rotate in the counterclockwise direction in FIG. 3 with respect to the side faces of the base members 22 and centering on the connecting portions. The magazine and the weight that restricts the connecting portions 23 to 26 to rotate counterclockwise. Fig. 3 is a view showing a state in which the rotation of the joint portions 23 to 26 is not restricted by the load block. The upper portion 12C of the lower valve body 12 is located above the base member 22. The upper surface 12C of the ία λ body 12 is provided with one of the rollers 15, the wheels 15, 16 which can be rotated. The part protrudes upward from the upper part 12C. The rollers 15 and 16 can be used in various shapes such as a cylindrical shape and a spherical shape. The valve body moving device 2G makes the standby 12 and the 4th shown in FIG. The ride between the seals and the seals shown in Fig. 5. The operation of the actuators 20 will be described in detail below. The following is a detailed description of the connector portion 30 and the terminal portion 4〇. For the connector, the terminal portion 4〇 has four suspects to be described later, = 彳 = ^ subsection * _ four connectors connected to the benefit 30 in the body 12 and the four output terminals of the terminal portion 17 201104115 40 In the embodiment shown in Fig. 3, the connector portion 30 is mounted on the widening device 13 but the connector portion 30 can also be disposed at the bottom surface of the valve body 12. As shown in Fig. 6, the connector portion 3 has a body made of an insulating material, and by the body The electric power is connected to the connector 3i' 32 and the sensor connectors 33 and 34. The main body 3〇8 is connected to the wall surface 3GAS of the processing chamber 1G1, and at the wall surface 3 (four) (4), the connectors 31 and 32 can be accommodated. 4 recesses of 33, 34. Connections 31, 32 are electrically connected to the heater 13. The connectors 33, 34 are electrically connected: a temperature sensor 73. In addition, when the temperature of the valve body 12 is not required to be measured In this case, the temperature sensor 73 and the connectors 33, 34 may not be provided. " Here, an embodiment of the structure of the connectors 31, 32 33, 34 will be described with reference to FIGS. 3 and 6. In the present embodiment, the connectors 31, 32, 33, and 34 respectively have metal plugs 31a, 32a, 33a, and 34a that are housed in the corresponding recesses. The plugs 31a, 32a, 33a, 3 are, for example, slightly cylindrical with flanges, respectively. The connectors 31, 32, 33, 34 are respectively housed in the corresponding recesses, and can be directed toward the plugs Ma, 32a, 33a, 34 & toward the direction protruding from the corresponding recesses (right of Fig. 3) a spring that applies an elastic force. Further, in Fig. 3, among the springs of the connectors 31, 32, 33, 34, only the spring 31 of the connector 31 is shown, and the recesses of the connectors 31, 32, 33, 34 are respectively the plugs 3U, 32a. , 33 & 34, is held so that it cannot be pulled out from the recess. The plugs 3ia, 32a are electrically connected to the heater 13, and the plugs 33a, 34a are electrically connected to the temperature sensor 73. 73. 201104115 As shown in FIGS. 3 and 7, the terminal portion 40 has a body 40A composed of an insulating material, and electric power output terminals 41, 42 and a sensor input terminal 43 held by the body 40A. 44. Hereinafter, the electric power output terminals 41, 42 and the sensor input terminals 43, 44 are designated as input/output terminals 41, 42, 43, 44. The main body 40A has a wall surface 40AS facing the gate valve device 10, and has openings at the wall surface 40AS for accommodating the four recessed portions of the respective output terminals 41, 42, 43, and 44. As shown in Fig. 7, around the electric power output terminals 41, 42 at the wall surface 40AS, 〇-shaped rings 45, 46 are mounted to improve the insulation between the electric power output terminals 41, 42 and their peripheral portions. Further, when it is not necessary to measure the temperature of the valve body 12, the sensor input terminals 43, 44 may not be provided. As shown in Figures 4 and 5, when the valve body 12 will open. In a state where the mouth portion i 12 is closed, the plugs 31a, 32a, 33a, 34a of the connectors 31, 32, 33, 34 are connected to the input/output terminals 41, 42, 43, 44, respectively. Thereby, the connectors 31, 32, 33, 34 (plugs 31a, 32a, 33a, 34a) are electrically and physically connected to the respective input/output terminals 4, 42, 43, and 1, respectively, in this state, The Ο-shaped rings 45, 46 are sandwiched between the wall faces 3〇AS 40AS. The earth return output terminal 41 ' 42 ' 43 and 44 are respectively connected to the wires. The root wire is external to the conductor 111 through, for example, a hole formed inside the wall 111A. & As shown in Fig. 8, the vacuum processing system 1 is provided with a power source 7 switch 49 for generating electric power for supplying power to the heater 13, and a control unit. 19 201104115 The electric power output terminals 41 and 42 are electrically connected to the power source 71 through the switch 49. Switch 49 can optionally form an on state or an off state. Fig. 8 shows that a switch 49 is provided between the electric power output terminal 41 and the power source 71. However, instead of the aforementioned switch 49, a switch that may be turned on or off may be provided between the electric power output terminal 41 and the power source 71, and between the electric power take-off terminal 42 and the power source 71. The connector 31 is connected to the electric power output terminals 41, 42, and the electric power is supplied from the power source 71 to the heater 13 when the switch 49 is in the on state. Electric power transmission = terminals 41, 42 correspond to the electric power output portion of the present invention. The sensor input terminals 43 and 44 are coupled to the control unit 72. Therefore, when the connectors 33, 34 are coupled to the sensor input terminals 43, 44, the temperature sensor 73 is coupled to the control portion 72. The control unit 72 is, for example, a needle system. The 1GG towel needs to be controlled. (4) The component is controlled by the lining controller. The control unit 72 is connected to the heart sensor by connecting the 33, 34 and the sensor input terminals 43 and 44 in order to control the operation of the gate valve device 1G. 73 The temperature information of the wide body 12 is known to simultaneously control the pneumatic cylinder 21, =, and the switch 49. In addition, the control unit 72 may also only control the control unit 72, instead of the control unit 72 in the vacuum processing system (10), which is required to control the control unit 72. Vacuum treatment system _ for lin control. As will be described later, in the present embodiment, the connector connected to the heater 13 is interlocked with the valve body 12, and the opening of the opening portion ι 2 is fixed in the valve body 12, and the material is electrically mixed. The electric power of the part is rotated out of the terminals 41, 42 and electrically and physically separated from the electric power wheel terminal 4 42 when the valve body 12 opens the opening portion (1) = 201104115. In the above description, the gate valve device 10 is a component that does not include the terminal portion 40, the switch 49, and the power source 71. However, the components of the gate valve device 1A may include the terminal portion 4A, or include the switch 49' or include the power source 71. Next, referring to Figs. 3 to 5 and Fig. 9, the operation of the gate valve device 本0 of the present embodiment will be described in detail by taking a case where the processing unit 1 〇 1 ^ performs specific processing on the substrate S as an example. Fig. 9 is an explanatory view for explaining the operation of the gate valve device 10. Fig. 9 shows the contents of the operation, the state of the opening 112, and the state of the heater 13 in the six steps from the loading of the substrate S to the processing chamber 101 to the removal of the processed substrate S from the processing chamber 101. In the step i of Fig. 9, the opening portion 112 is opened, and the substrate s is carried into the processing chamber 1?1 from the transfer processing chamber 1?3 through the opening portion 112. In this step 1, the wide body 12 is in the standby position. Fig. 3 shows a state in which the valve body 12 is in the standby position. The standby position of the valve body 12 is the position of the valve body 12 when the front end portion of the cylinder rod portion 21b of the pneumatic cylinder 21 is at the lowermost position of the movable range. When the valve body 12 is in the standby position, the valve body 12 opens the opening portion 112. In this state, the substrate S can be carried from the transfer processing chamber 103 to the processing chamber ι1 through the opening 112. Further, in the 'step 1', the heater 13 is in an OFF state, that is, a state in which electric power is not supplied. The state in which the valve body 12 is in the standby position is included, and the connector portion 3A and the terminal portion 4 are separated from each other when the opening portion 112 is opened. Therefore, the connectors 31 and 32 connected to the heater 13 are electrically operated from the electric power output terminals 41, 42 of the electric power=rate output portion, and the heater 4 is in a state where the opening portion 112 is opened. There is electric power. Further, the state 49 in which the opening portion 112 is opened is set to the OFF state. In step 2, the opening (1) is operated by the valve body η. When the opening j m is closed by the closing 12 from the state shown in Fig. 3, it is stored by the pneumatic cylinder 2 of the valve body moving device 2 from the earth bottom assembly 22#. As the base member 22 rises, the valve body also rises. At this time, until the rollers 15, 16 are in contact with the upper portion of the casing u, the valve body 12 is moved in a direction parallel to the wall surface niAs of the wall 111A. When the rollers 15, 16 are in contact with the upper portion of the casing U, the valve body 12 reaches the position facing the opening π portion 112. From this state, the base member 22 is raised (four) by the air pressure lever 21, due to the valve! 12 cannot be raised, so that the connecting portions 23 to 26 are rotated clockwise toward the third figure with respect to the side surface of the base unit 22, and the valve body 12 is aligned with the opening 112 in the clockwise direction. It moves in a direction perpendicular to the wall surface illA"s of the wall mA. At this time, by the action of the rollers 15, 16, the valve body 12 does not rub against the casing 11 and can smoothly move. Then, finally, as shown in Fig. 4, the sealing surface 12A of the wide body 12 is pressed against the wall surface 111AS' of the wall illA and the opening portion in is closed by the valve body 12. At this point, the action of the valve body moving device 20 is stopped. When the opening portion 112 is closed by the valve body 12, the connector portion 30 is connected to the terminal portion 4A. Specifically, the plugs 31a, 32a, 33a, 34a of the connectors 31, 32, 33, 34 are respectively in contact with the input and output terminals 4, 42, 43' 44, whereby the connectors 31, 32, 22 201104115 33, 34 (plugs 31a, 32a, 33a, 34a) are electrically and physically connected to the input/output terminals 41, 42, 43, 44, respectively. As shown in Fig. 4, the switch 49 is turned off by the front side squeezing operation when the body π closes the opening 112. Therefore, electric power is not supplied to the heater 13 at this point in time. In the next step 3, the heater 13 is in the 〇N state, and the 叩 is supplied with the electric power. As described above, the state in which the heater 13 is in the 0 state is the time after the opening 112 is closed by the valve body 12. In step 3, as shown in Fig. 5, the switch 49 is set to the on state. Thereby, electric power is supplied from the power source 71 to the heater 13 via the electric power output terminals 41, 42 and the connectors 31, 32, so that the heater 13 generates heat to heat the valve body 12. Further, at this time, the temperature sensor 73 is connected to the control unit 72 via the connectors %, 34 and the sensor input terminals 43, 44. The control unit 72 obtains the temperature information of the body 12 measured by the hopper 73, and "controls the power source 71 to control the temperature of the valve body 12. In addition, the temperature" control unit 72 can also turn the switch 49 on. In the step 4 of the heart-shaped sealing door connection, the valve body 12 is used to close the opening mountain, the package power is supplied to the heater, and the valve body 12 is heated. In the state of the chamber 101, the substrate s is subjected to a specific process such as a sequel to the substrate s. After the end of the process at 1G1, in the next step 5, the second portion I-'12 is closed, and the opening portion 112 is closed. The switch 49 is turned on to stop the supply of electric power to the heater 13. In the next step 6, the opening portion 112 is opened, and the opening 2: 2' is used by opening 23 201104115 阙 body u: The moving device 20 operates on the opposite side of the closing of the 1 σ Ρ 112 to lower the opening group: 22: the upper portion of the base is moved by the pneumatic cylinder 21 of the intermediate movement. Initially, the rollers 15, 16 abut the housing for November/, and the joints 23-26 will be opposite to the bases. The side surface of the member 22 is pivoted in the counterclockwise direction of Fig. 3 centering on the connecting portion, and the valve body 12 is moved in the direction perpendicular to the wall surface 111 AS of the wall 111A like the far mouth portion 112. When the opening portion 112 is opened, the connector portion 30 is separated from the terminal portion 40. When the w field connecting portions 23 to 26 are rotated to the position restricted by the stopper, then, When the base unit 22 is lowered, the valve body 12 is lowered. At this time, the valve body 12 is moved in a direction parallel to the wall surface iuas of the wall 1UA. Then, the valve body 12 finally reaches the standby position shown in FIG. * The operation of the wide-body moving device 20 is stopped. Then, the processed substrate S is carried out from the processing chamber 101 to the transfer processing chamber 1〇3 through the opening 112. Next, the gate valve device 10 of the present embodiment will be described. The effect of the gate valve device 10 is only the heater s3 for heating the valve body 12. Therefore, when the gate valve device 10 is used to process the product in the processing chamber 101, the heater 13 is used. To heat the valve body 12, the accessory product is attached. The surface of the valve body 12 is formed, whereby the occurrence of fine particles can be prevented according to the present embodiment. As a result, it is possible to prevent the occurrence of defects such as etching defects caused by the fine particles. 201104115 Further, in the present embodiment, the valve body 12 is added.埶 electrically connected to the connectors 31, 32 of the heater 13, f413, and including the molding. Next, the connector portion 30 of the connection Μ ^ is the body 逑 connection state 31, 32 system and the valve body 12 m The electric power output terminals 41, 42 of the force rate output portion are connected to the electric power output terminals 41, 42 in the state where the opening portion m is closed, and the electric power output terminals 41, 42 of the force rate output portion are in the valve body 12: the electric power_open_top electric power_terminal 41 , :2== separation. Therefore, in the present embodiment, the connectors 31 and 32 can be electrically and physically connected to the electric power output terminal 4 as the electric power output unit only when the valve body 12 is closed = β 112. Electric power is supplied to the heater 13. As described above, according to the present embodiment, it is possible to easily install the electric power supply cable in the casing 11 of the inter-valve device 10 without the need to connect the type of cancer directly connected to the heater 13 through the base unit 22 and the connection mechanism. Electric power is supplied to the heater 13. Further, the gate valve device 1 of the present embodiment does not include an electric power supply electron microscope that is connected to the heater 13 through the valve body moving spring 20. Therefore, according to this embodiment, the installation and maintenance of the gate valve device 10 is relatively easy. Further, in the present embodiment, a switch 49 for supplying or turning off electric power to the electric power output terminals 41, 42 from the power source 71 is provided between the power source 71 and the electric power output terminals 41, 42. Next, when the opening portion 112 is in the open state and the opening portion 112 is in the closed state, when the opening 112 is closed and the connectors 31, 32 are connected to the electric power output terminals 41, 42, the switch 49 is set to be turned on. The state supplies electric power to the electric power output terminals 41, 42. Further, when the opening portion 112 is in the closed state and the opening portion 112 is in the open state, the switch 49 is set to the off state 25 201104115. After the electric power supply to the electric power output terminal 4 is turned off, the opening is turned on =12. The connector 3 32 is separated from the electric power output terminal 4 42 . Therefore, in the present embodiment, the electric power output terminals 41, 42 are not exposed in the state of being connected to the power source 71. Therefore, according to the present embodiment, it is possible to prevent the neon discharge or the electric leakage from the electric power output terminals 4 to 42. Further, in the present embodiment, when the connector portion 30 is connected to the terminal portion 4, the electric power output terminal 41 is provided in order to improve the insulation between the electric power output terminals 41 and 42 and the peripheral portion thereof. The 〇-shaped rings 45, 46 around the 42 are sandwiched between the wall surface 30AS of the body 30A of the connector portion 30 and the wall surface 40AS of the body 40A of the terminal portion 40. Thereby, according to the present embodiment, it is possible to more effectively prevent arc discharge or electric leakage from the electric power output terminals 41, 42. Further, in the present embodiment, the heater 13 is attached to the surface of the valve body 12. Therefore, according to the present embodiment, the rigidity of the valve body 12 can be prevented from being lowered as compared with the case where the heater 13 is provided inside the valve body 12. [Second Embodiment] Next, a gate valve device according to a second embodiment of the present invention will be described with reference to Figs. 1 to 12 . Fig. 1 to Fig. 12 are sectional views showing the structure of the gate valve device of the embodiment. Further, Fig. 10 shows the open state of the gate valve device. Figs. 1 and 12 show the closed state of the gate valve device. Hereinafter, differences between the gate valve device 80 of the present embodiment and the gate valve device of the first embodiment will be described. The gate valve device 80 is provided with a casing 81 instead of the casing 11 of the gate valve device 10. The casing 81 has a box shape having an upper portion, a bottom portion, 26 201104115, and 34 side portions connecting the upper portion and the bottom portion. Four sides of the housing 81 (1) A. This side is called the wall 101, and the wall of the casing ηι
係構成了將處理室 。卩伤81A。該壁構成部份S1A 側的空間隔開之壁的至間與鄰接於其之閘閥裝置10 接至該壁lllA之壁5、部份。壁構成部份81A具有連 殼體81之4個伽邱士、以及其相反側之壁面81AS。又， 之壁⑴A的開口部二^物至處理請 部份於壁構成 83之形狀及峨咖，=部82' 二：二:㈣η係可將開口部Μ開啟/關閉。 有Ο型产8Q 〇ϋΑ之壁面81AS處的開口部82周圍安裝 Λ ^ 11圖及第12圖所示’當閥體12將開 =AS =1T，〇型環89係沿著全周而被炎置於 ，面隨與密封面12A之間。藉此，將處理室ι〇ι密封 呈氣密。 本實施形態中’端子部40係如同露出於壁面8ias般 地埋設並固定於壁構成部份81A。連接至輪出入端子41、 42、43、44的4根導線係例如通過壁構成部份·内部所 形成之孔而被導出至殼體81外部。 又’本實施形態中，氣壓缸21之壓筒部仏係安裝於 27 201104115 殼體81底部。氣厭去τ m ^ 通過殼體81底部所形 干部21b係從壓筒部21汪 出。 $成之開σ。卩，而朝殼體81的内部突 本實施形態中，閘閥裝置8〇係 端子部4〇。嶋置8。亦可更包含有作為1 = ;: 49,或再更包含有作為構成要素之電源7卜^之開關 接下來，參考第10圖至第12圖， 態之閘閥裝置8G的動作。第謂於本貫施开/ uL ^勒作第10圖係顯示閥體12位於待機 位置之狀I包含_ 12位於待機位置 82為開啟之狀態下，連接器邻3〇盥_2 1 ^ 逆按盗4 30與端子部4〇係相互分離。 因此，連接至加熱器13的連接器31、32會從作為電功率 輸出部之㈣#輸_子41、42麵性絲雖地分離。 所以，當開口部82為開啟之狀態τ，加熱器13並未供給 有電功率。又’當開口部82為開啟之狀態下，開關49係 設定為截止狀態。該狀態下，可通過開口部83、82、112 來將基板S從搬送處理室1〇3搬入至處理室1〇1。 從第10圖所示之狀態，藉由閥體丨2來將開口部8 2封 閉時，與第1貫鉍形態同樣地，係藉由閥體移動裝置20來 移動閥體12。藉此，如第11圖所示，閥體12之密封面12Α 會押抵至壁81Α之壁面81 AS，而藉由閥體12來將開口部 82封閉。閥體Π將開口部82封閉之時點，開關49為截止 狀態。因此，於此時點，加熱器13並未供心右雷功率。 藉由閥體Π來將開口部82封閉後，第12圖所示， 將開關49設定為導通狀態。藉此’從電源71經由電功率 28 201104115 輸出端子41、42及連接器31、32來將電功率供給加熱器 13，以使加熱器13發熱而加熱閥體12。 然後，於處理室101中針對基板S實施蝕刻等特定處 理。於處理室101完成處理後，在利用閥體12來將開口部 82封閉之狀態下，將開關49設定為截止狀態，並停止對加 熱器13之電功率供給。接下來，與第1實施形態同樣地， 藉由閥體移動裝置20來移動閥體12,以將開口部82開啟。 又，當閥體12將開口部82開啟時，連接器部30便會從端 子部40處分離。 本實施形態中，閘閥裝置80係具備有端子部40。因 此，本實施形態中，無須對未具備有端子部40之既有處理 室101進行任何變更，便可設置本實施形態之閘閥裝置80。 本實施形態之其他結構、作用及效果係與第1實施形 態相同。 〔第3實施形態〕 接下來，參考第13圖至第Π圖，說明關於本發明之 第3實施形態的閘閥裝置。第13圖至第15圖係顯示本實 施形態之閘閥裝置結構的剖面圖。另外，第13圖係顯示閘 閥裝置之開啟狀態，第14圖及第15圖則顯示閘閥裝置之 關閉狀態。第16圖係顯示第14圖所示之狀態下，閘閥裝 置之閥體、加熱器、連接器部、副連接器部及副端子部的 前視圖。第17圖係顯示本實施形態之閘閥裝置的電路結構 之電路圖。 本實施形態之閘閥裝置90除了第1實施形態之閘閥裝 29 201104115 當 1 立 的構成要素之外’更具備有副連接器部50與副端子 6〇。副連接器部50係與閥體12、加熱器13及連接器部 ^體成型。副端子部60係固定於殼體η底部。副連 f器°卩5〇具有後述之4個副連接器，副端子部60則具有 後述之4個副輸出入端子。副連接器部5〇與副端子部6〇 係。又置在虽閥體12位於待機位置時，能讓副連接器部5〇 之4個副連接器與副端子部6〇之4個副輸出入端子相互連 接的位置處。第13圖至第16圖的例示中，副連接器部5〇 係安裴於加熱器13底面。但是，副連接器部5〇亦可安裝 於閥體12的底面12D等之其他位置處。本實施形態中，閥 體12位於待機位置之狀態係對應於本發明中之「當閥體將 開口部開啟之特定狀態」。 剎連接器部50的結構係與連接器部3〇的結構相同。 即’ f連接器部50係具有由絕緣材料所组成的本體5〇A、 以及藉由该本體5〇A所保持之電功率用副連接器51、52與 感測器用副連接器53、54。本體50A具有朝向下方之壁面 5〇)S、以及於該壁面5_處具有開口並分職納有副連 接器51、52、53、54的4個凹部。副連接器51、52係電 連接於加熱$ 13。副連接器53、54則電連接於溫度感測器 73。另外，當無須對閥體12的溫度進行量測時，亦可不設 置副連接器53、54。 此處，參考第14圖及第丨6圖，針對副連接器η、、 =、54之構造的—實關加以制。該實闕巾，副連接 器5 52 53、54 別具有可進退地收納於相對應之凹 201104115 ，内的金屬製插頭5la、52a、53a、％。插頭仏、❿、 3a、54a為分別具有凸緣的略圓柱形。副連接器5i、^、 53 54 #、更具有分別收納於相對應之凹部内，而能針對插 1 51a、52a、53a、54a來朝向從相對應之凹部突出之方向（第 Μ圖之下方)施加彈力的彈簧。另外，於副連接器51、52、 53、54之彈簧中，第14圖僅顯示出副連接器51之彈簧51卜 再者，收納副連接器5卜52、53、54之凹部係分別將插頭 51a、52a、53a、54a予以保持以使其不會從凹部處拔出。 插頭51a、52a係電連接於加熱器13，插頭53a、5如則電 連接於溫度感測器73。 副端子部60的結構係與端子部4〇的結構相同。即， 如第16圖所示，副端子部60係具有由絕緣材料所組成的 本體60A、以及藉由該本體60A所保持之副電功率輸出端 子61、62與副感測器輸入端子63 ' 64。以下，將副^功率 輸出端子61、62及副感測器輸入端子63、44標示為5|】輸 出人端子61、62、63、64。本體60A係具有朝二上; 面60AS、以及於該壁面60AS處形成有開口並分別收納 副輪出入端子61、62、63、64的4個凹部。壁面6qas處， 為了提高電功率輸出端子61、62與其周邊部份之間的絕緣 性而在副電功率輸出端子6卜62的周圍設置有〇型環&、 66。另外，當無須對闊體12的溫度進行量測，則亦^不設 置副感測器輸入端子63、64。 如第13圖所不’當闊體12位於待機位置之狀陣時， 副連接器 51、52、53、54 之插頭 51a、52a、53a、分 31 201104115 別接觸至副輸出入端子61、62、63、64。藉此，副連接哭 51、52、53、54(插頭 51a、52a、53a、54a)便會分別電性且 物理性地連接於副輸出入端子61、62、63、64。v ^ „ 入，5亥狀 態下，設置於副電功率輸出端子61、62周圍的〇型環 66係被爽置於壁面50AS與壁面60AS之間。 副輸出入端子61、62、63、64係分別連接有導線。該 4根導線係例如通過殼體11所形成之孔，而被導出至 11的外部。 如第17圖所示，副電功率輸出端子61、62係透過開 關69而電連接於電源71。該開關69亦可為閘閥製置％ 的構成要素。開關69係可選擇為導通狀態或戴止狀態。第 Π圖係顯示於副電功率輸出端子61與電源71之間設置有 開關69之實施例。但是’亦可設置有能讓副電功率輸出端 子61與電源71之間、以及副電功率輸出端子62與電源71 之間同時形成導通或戴止狀態的開關來取代該開關69。副 連接器51、52係連接至副電功率輸出端子61、62，且當μ 關69為導通狀態時’可從電源71來對加熱器13供給電功 率。副電功率輸出端子61、62係對應於本發明之第2電功 率輸出部。 副感測器輸入端子63、64係連接至控制部72。因此， 當副連接器53、54連接至副感測器輸入端子63、64時， 溫度感測器73會連接至控制部72。另外，第17圖中，,·、 略了副連接器53、54及副感測器輸入端子63、64之圖式1 控制部72係為了控制閘閥裝置10之動作，而經由連^器 32 201104115 33、34及感測器輸入端子43、44或經由副連接器μ、54 及副感測器輸入端子63、64所連接之溫度感測器73來取 得闊體12的溫度資訊，同時控制氣壓缸21、電源71及開 關 49、69。 接下來’參考第13圖至第15圖’詳細說明關於本實 施形態之閘闊裝置9 0的動作。第13圖係顯示閥體丨2位於 待機位置之狀態。於此狀態中，閥體12係將開口部112開 啟。在此狀態下，可經由開口部112來將基板3從搬送處 理室103搬入至處理室。又，於此狀態中，連接器部 30與端子部40為相互分離，而副連接器部5〇與副端:部 60則為相互連接之狀態。具體來說，係藉由使副連接器51、 52 53 54之插頭51a、52a、53a、5如分別接觸至副輸出 入端子61、62、63、64，來使副連接器51、52、53、54(插 二53a、54a)分別電性且物理性地連接於副輸出 入鳊子 61、62、63、64。 如第13圖所示，當闊體12位於 將開關69設定為導摘鮮& 頂位1之狀'悲下 ^ ^ , 導通狀態時，則從電源71會經由副雷功 率輸出端子61、62及副連 曰厶由田j電力 加轨哭13,以你“連接器 2來將電功率供給至 /.、、、器13發熱而加熱闕體12。又，此時， 子㈣而連接至控二 ==及副感測器輸入端 器73來取得_ 12 7 72係藉由溫度感測 制電源，叫制閥“二;並根據該溫度資訊來控 , 體 之，皿度。另外，為了調整閥體 又二丨口P72亦可將開關69在導通狀態與截土狀 33 201104115 態進行切換。 從第13圖所示之狀態，藉由閥體12來將開口部112 封閉時，將開關69設定為截止狀態後，係藉由閥體移動裝 置20之氣壓缸21來讓基底組件22上昇。隨著基底組件22 之上昇，則閥體12亦會上昇。藉此，副連接器部50會從 副端子部60處分離。藉由閥體12來將開口部112封閉時 之閘閥裝置90的動作係與第1實施形態相同。 如第14圖所示，當閥體12將開口部112封閉之時點， 開關49係成為截止狀態。因此，於此時點，加熱器13並 未供給有電功率。 藉由閥體12來將開口部112封閉後，如第15圖所示， 將開關49設定為導通狀態。藉此，從電源71經由電功率 輸出端子41、42及連接器31、32來將電功率供給加熱器 13，以使加熱器13發熱而加熱閥體12。 然後，於處理室101中針對基板S實施蝕刻等特定處 理。處理室101之處理完成後，在利用閥體12來將開口部 112封閉之狀態下，將開關49設定為截止狀態，以停止對 加熱器13供給電功率。接下來，與第1實施形態同樣地， 藉由閥體移動裝置20來移動閥體12，以將開口部112開 啟。又，當閥體12將開口部82開啟時，則連接器部30會 從端子部40分離。當閥體12到達第13圖所示之待機位置 後，副連接器部50便會連接至副端子部60。 如以上所說明般，本實施形態之閘閥裝置90除了第1 實施形態之閘閥裝置10的構成要素之外，更具備有：包含 34 201104115The system constitutes the processing room. Bruise 81A. The wall constituting the space on the side of the portion S1A is spaced from the wall to the wall 5 portion of the wall 111A adjacent to the gate valve device 10 adjacent thereto. The wall forming portion 81A has four gazes connected to the casing 81 and a wall surface 81AS on the opposite side. Further, the opening portion of the wall (1) A is applied to the shape of the wall portion 83 and the portion of the wall portion 83. The portion 82' 2: 2: (4) The η system can open/close the opening portion 。.开口 ^ 11 and 12 are shown around the opening 82 of the wall surface 81AS of the 8Q 〇ϋΑ type. When the valve body 12 is open = AS =1T, the 〇-ring 89 is along the entire circumference. The inflammation is placed between the face and the sealing surface 12A. Thereby, the processing chamber is sealed and airtight. In the present embodiment, the terminal portion 40 is embedded and fixed to the wall forming portion 81A as exposed to the wall surface 8ias. The four wires connected to the wheel entry and exit terminals 41, 42, 43, 44 are led out to the outside of the casing 81, for example, through holes formed in the wall forming portion and the inside. Further, in the present embodiment, the cylinder portion of the pneumatic cylinder 21 is attached to the bottom of the housing 81 at 27 201104115. The gas is disgusted to τ m ^ and the cadre 21b formed at the bottom of the casing 81 is ejected from the cylinder portion 21. $成之开σ. Further, the inner portion of the casing 81 is protruded. In the embodiment, the gate valve device 8 is a terminal portion 4A. Set 8. It is also possible to include a switch as a power source 7 as a constituent element, or a switch of the gate valve device 8G in the state of FIG. 10 to FIG. The first is to open the system / uL ^ for the 10th figure shows that the valve body 12 is in the standby position I contains _ 12 in the standby position 82 is open, the connector is adjacent 3〇盥_2 1 ^ inverse It is separated from the terminal portion 4 by the thief 4 30. Therefore, the connectors 31, 32 connected to the heater 13 are separated from the (4) #41_42 facet wires as the electric power output portion. Therefore, when the opening portion 82 is in the open state τ, the heater 13 is not supplied with electric power. Further, when the opening portion 82 is opened, the switch 49 is set to the OFF state. In this state, the substrate S can be carried into the processing chamber 1〇1 from the transfer processing chamber 1〇3 through the openings 83, 82, and 112. When the opening portion 8 2 is closed by the valve body 2 in the state shown in Fig. 10, the valve body 12 is moved by the valve body moving device 20 in the same manner as the first cross-sectional configuration. Thereby, as shown in Fig. 11, the sealing surface 12 of the valve body 12 is pressed against the wall surface 81 AS of the wall 81, and the opening 82 is closed by the valve body 12. When the valve body 封闭 closes the opening portion 82, the switch 49 is turned off. Therefore, at this point, the heater 13 does not provide power to the right. After the opening 82 is closed by the valve body, the switch 49 is set to the ON state as shown in Fig. 12. Thereby, electric power is supplied from the power source 71 to the heaters 13 via the electric power 28 201104115 output terminals 41, 42 and the connectors 31, 32 to heat the heater 13 to heat the valve body 12. Then, specific processing such as etching is performed on the substrate S in the processing chamber 101. After the processing in the processing chamber 101 is completed, the switch 49 is set to the OFF state in a state where the opening portion 82 is closed by the valve body 12, and the supply of electric power to the heater 13 is stopped. Next, similarly to the first embodiment, the valve body 12 is moved by the valve body moving device 20 to open the opening 82. Further, when the valve body 12 opens the opening portion 82, the connector portion 30 is separated from the terminal portion 40. In the present embodiment, the gate valve device 80 is provided with the terminal portion 40. Therefore, in the present embodiment, the gate valve device 80 of the present embodiment can be provided without any modification to the existing processing chamber 101 in which the terminal portion 40 is not provided. Other configurations, operations, and effects of the present embodiment are the same as those of the first embodiment. [Third Embodiment] Next, a gate valve device according to a third embodiment of the present invention will be described with reference to Figs. 13 to Π. Fig. 13 through Fig. 15 are sectional views showing the structure of the gate valve device of the embodiment. Further, Fig. 13 shows the open state of the gate valve device, and Figs. 14 and 15 show the closed state of the gate valve device. Fig. 16 is a front elevational view showing the valve body, the heater, the connector portion, the sub-connector portion and the sub-terminal portion of the gate valve device in the state shown in Fig. 14. Fig. 17 is a circuit diagram showing the circuit configuration of the gate valve device of the embodiment. The gate valve device 90 of the present embodiment further includes a sub-connector portion 50 and a sub-terminal 6 除了 in addition to the one-piece component of the gate valve assembly 29 201104115 of the first embodiment. The sub-connector portion 50 is formed integrally with the valve body 12, the heater 13, and the connector portion. The sub-terminal portion 60 is fixed to the bottom of the casing n. The sub-connector has four sub-connectors, which will be described later, and the sub-terminal portion 60 has four sub-input and output terminals, which will be described later. The sub-connector portion 5A is coupled to the sub-terminal portion 6. Further, when the valve body 12 is at the standby position, the four sub-connectors of the sub-connector portion 5 and the four sub-input and output terminals of the sub-terminal portion 6A can be connected to each other. In the illustration of Figs. 13 to 16, the sub-connector portion 5 is attached to the bottom surface of the heater 13. However, the sub-connector portion 5A may be attached to other positions of the bottom surface 12D of the valve body 12 or the like. In the present embodiment, the state in which the valve body 12 is at the standby position corresponds to "the specific state in which the valve body opens the opening portion" in the present invention. The structure of the brake connector portion 50 is the same as that of the connector portion 3A. That is, the 'f connector portion 50 has a main body 5A composed of an insulating material, and sub-connectors 51 and 52 for electric power held by the main body 5A, and sub-connectors 53, 54 for the sensor. The main body 50A has a wall surface 5〇S facing downward, and four recesses having openings in the wall surface 5_ and substituting the sub-connectors 51, 52, 53, 54. The secondary connectors 51, 52 are electrically connected to the heating $13. The sub-connectors 53, 54 are electrically connected to the temperature sensor 73. Further, when it is not necessary to measure the temperature of the valve body 12, the sub-connectors 53, 54 may not be provided. Here, with reference to FIGS. 14 and 6 , the construction of the sub-connectors η, , =, 54 is implemented. In the actual wipes, the sub-connectors 5 52 53 and 54 are provided with metal plugs 5la, 52a, 53a, and % which are accommodated in the corresponding recess 201104115. The plugs ❿, ❿, 3a, 54a are slightly cylindrical with flanges, respectively. The sub-connectors 5i, ^, 53 54 # are further housed in the corresponding recesses, and can be oriented toward the corresponding recesses for the plugs 1 51a, 52a, 53a, 54a (below the figure) A spring that applies an elastic force. Further, among the springs of the sub-connectors 51, 52, 53, 54, FIG. 14 shows only the spring 51 of the sub-connector 51, and the recessed portions of the sub-connectors 5, 52, 53, 54 respectively The plugs 51a, 52a, 53a, 54a are held so as not to be pulled out from the recess. The plugs 51a, 52a are electrically connected to the heater 13, and the plugs 53a, 5 are electrically connected to the temperature sensor 73, for example. The structure of the sub-terminal portion 60 is the same as that of the terminal portion 4A. That is, as shown in Fig. 16, the sub-terminal portion 60 has a main body 60A composed of an insulating material, and sub-electric power output terminals 61, 62 and sub-sensing input terminals 63' 64 held by the main body 60A. . Hereinafter, the sub power output terminals 61, 62 and the sub sensor input terminals 63, 44 are denoted as 5|] output terminals 61, 62, 63, 64. The main body 60A has two faces, a face 60AS, and four recesses in which the openings are formed in the wall faces 60AS and accommodate the sub-wheel entry and exit terminals 61, 62, 63, and 64, respectively. At the wall surface 6qas, 〇-rings & 66 are provided around the sub-electric power output terminals 6 to 62 in order to improve the insulation between the electric power output terminals 61 and 62 and the peripheral portion thereof. Further, when it is not necessary to measure the temperature of the wide body 12, the sub-sensor input terminals 63, 64 are not provided. As shown in Fig. 13, when the wide body 12 is in the standby position, the plugs 51a, 52a, 53a, 31 of the sub-connectors 51, 52, 53, 54 are not in contact with the sub-input terminals 61, 62. 63, 64. Thereby, the sub-connections crying 51, 52, 53, 54 (plugs 51a, 52a, 53a, 54a) are electrically and physically connected to the sub-input and output terminals 61, 62, 63, 64, respectively. v ^ „ In, in the 5 Hz state, the 〇-shaped ring 66 provided around the sub electric power output terminals 61 and 62 is cooled between the wall surface 50AS and the wall surface 60AS. The sub-output terminals 61, 62, 63, 64 are attached. Wires are respectively connected, and the four wires are led out to the outside of 11, for example, through holes formed in the casing 11. As shown in Fig. 17, the secondary electric power output terminals 61, 62 are electrically connected to the switch 69. The power supply 71. The switch 69 can also be a component of the gate valve device %. The switch 69 can be selected to be in an on state or a wear state. The second diagram shows that a switch 69 is provided between the auxiliary electric power output terminal 61 and the power source 71. In place of the switch 69, a switch capable of simultaneously forming an on or off state between the sub electric power output terminal 61 and the power source 71 and between the sub electric power output terminal 62 and the power source 71 may be provided. The connectors 51, 52 are connected to the sub electric power output terminals 61, 62, and 'the electric power can be supplied from the power source 71 when the μ off 69 is in the on state. The sub electric power output terminals 61, 62 correspond to the present invention. Second electric power The sub-sensor input terminals 63, 64 are connected to the control portion 72. Therefore, when the sub-connectors 53, 54 are connected to the sub-sensor input terminals 63, 64, the temperature sensor 73 is connected to the control. In Fig. 17, the control unit 72 of the first embodiment in which the sub-connectors 53 and 54 and the sub-sensor input terminals 63 and 64 are omitted is controlled in order to control the operation of the gate valve device 10. The temperature information of the wide body 12 is obtained by the device 32 201104115 33, 34 and the sensor input terminals 43, 44 or the temperature sensor 73 connected via the sub-connectors μ, 54 and the sub-sensor input terminals 63, 64. At the same time, the pneumatic cylinder 21, the power source 71, and the switches 49, 69 are controlled. Next, the operation of the sluice device 90 of the present embodiment will be described in detail with reference to Figs. 13 to 15 . Fig. 13 shows the valve body 丨2 is in a standby position. In this state, the valve body 12 opens the opening 112. In this state, the substrate 3 can be carried from the transfer processing chamber 103 to the processing chamber via the opening 112. In the state, the connector portion 30 and the terminal portion 40 are separated from each other, and the sub-connector portion 5〇 The secondary end: the portion 60 is in a state of being connected to each other. Specifically, the plugs 51a, 52a, 53a, 5 of the sub-connectors 51, 52 53 54 are respectively brought into contact with the sub-input and output terminals 61, 62, 63, respectively. And 64, the sub-connectors 51, 52, 53, 54 (plugs 53a, 54a) are electrically and physically connected to the sub-outputs 61, 62, 63, 64, respectively. When the wide body 12 is located in the state of setting the switch 69 to the lead-out & top position 1, the state of conduction is turned on, then the power source 71 passes through the auxiliary lightning power output terminals 61, 62 and the secondary link. By Tian J Power, I am crying 13 and use the "connector 2" to supply electric power to /., and the device 13 generates heat to heat the body 12. Moreover, at this time, the sub (four) is connected to the control two == and the sub-sensor input end 73 to obtain _ 12 7 72 is the temperature sensing power supply, called the valve "two; and according to the temperature information In addition, in order to adjust the valve body and the second port P72, the switch 69 can also be switched between the on state and the intercepted state 33 201104115. From the state shown in Fig. 13, by the valve body When the opening portion 112 is closed, the switch 69 is set to the OFF state, and the base unit 22 is raised by the pneumatic cylinder 21 of the valve body moving device 20. As the base unit 22 is raised, the valve body 12 is also raised. As a result, the sub-connector portion 50 is separated from the sub-terminal portion 60. The operation of the gate valve device 90 when the opening portion 112 is closed by the valve body 12 is the same as that of the first embodiment. As shown in the figure, when the valve body 12 closes the opening portion 112, the switch 49 is turned off. Therefore, at this point, the heater 13 is not supplied with electric power. After the opening portion 112 is closed by the valve body 12, As shown in Fig. 15, the switch 49 is set to the on state. Electric power is supplied to the heater 13 from the electric power output terminals 41 and 42 and the connectors 31 and 32 to heat the heater 13 to heat the valve body 12. Then, specific processing such as etching is performed on the substrate S in the processing chamber 101. After the processing of the chamber 101 is completed, the switch 49 is set to the OFF state in a state where the opening 112 is closed by the valve body 12, and the supply of electric power to the heater 13 is stopped. Next, similarly to the first embodiment, The valve body 12 is moved by the valve body moving device 20 to open the opening portion 112. Further, when the valve body 12 opens the opening portion 82, the connector portion 30 is separated from the terminal portion 40. When the valve body 12 is reached After the standby position shown in Fig. 13, the sub-connector unit 50 is connected to the sub-terminal portion 60. As described above, the gate valve device 90 of the present embodiment is not limited to the components of the gate valve device 10 of the first embodiment. In addition, there are more: including 34 201104115
St:加熱器13之副連接器51、52的副連接器部50; 二及包4作為第2電功率輸出部之副電功率輸出端子 6」、62的副端子部6G。副連接器51、52係與晴12連動， :閥體12將開口部112封閉之狀態下會從副電功率輪出端 61 62處電性且物理性地分離，而當閥體12將開口部 U2開啟之特定狀態，即當閥體12位於待機位置之狀態下 則會電性且物理性地連接於副電功率輸出端子61、62f 依本實施形態，可在利用閥體12來將開口部112封閉 之前預先加熱閥體12。藉此，依本實施形態，則可縮短利 用閥體12來將開口部112封閉後之閥體12的加熱時間。 其結果，依本實施形態，可縮短到對基板s開始進行處理 為止的等待時間，其結果，便可縮短整體製程的處理時間。 又，本實施形態中，從閥體12位於待機位置之狀態轉 變為開口部112被封閉之狀態時，係將開關69設定為截止 狀態後，再將副連接器51、52從副電功率輸出端子61、62 處分離。又，當從開口部112被封閉之狀態轉變為閥體12 位於待機位置之狀態時，係將副連接器51、52連接至副電 功率輸出端子61、62後，再將開關69設定為導通狀態以 將電功率供給至副電功率輸出端子61、62。因此，於本實 施形態下，副電功率輸出端子61、62便不會在連接於電源 71之狀態下露出。因此，依本實施形態，可防止從副電功 率輸出端子61、62發生弧光放電或漏電。 又，本實施形態中，在副連接器部5〇為連接至副端子 部60之狀悲'下，為了提高副電功率輸出端子61、62與其 35 201104115St: the sub-connector portion 50 of the sub-connectors 51, 52 of the heater 13, and the sub-package 4 as the sub-terminal portion 6G of the sub electric power output terminals 6", 62 of the second electric power output portion. The sub-connectors 51 and 52 are interlocked with the clear 12, and the valve body 12 is electrically and physically separated from the sub-electric power wheel end 61 62 in a state where the opening 112 is closed, and the valve body 12 is opened. The specific state in which U2 is turned on, that is, in the state in which the valve body 12 is in the standby position, is electrically and physically connected to the sub electric power output terminals 61, 62f. According to this embodiment, the opening portion 112 can be used by the valve body 12. The valve body 12 is preheated before closing. As a result, according to the present embodiment, the heating time of the valve body 12 after the opening 112 is closed by the valve body 12 can be shortened. As a result, according to the present embodiment, the waiting time until the start of processing of the substrate s can be shortened, and as a result, the processing time of the entire process can be shortened. Further, in the present embodiment, when the valve body 12 is in the standby position and the opening 112 is closed, the switch 69 is set to the OFF state, and the sub-connectors 51 and 52 are connected from the sub-electric power output terminal. 61, 62 separation. Further, when the state in which the opening portion 112 is closed is changed to the state in which the valve body 12 is in the standby position, the sub-connectors 51 and 52 are connected to the sub-electric power output terminals 61 and 62, and then the switch 69 is set to the on state. The electric power is supplied to the sub electric power output terminals 61, 62. Therefore, in the present embodiment, the sub electric power output terminals 61, 62 are not exposed in a state of being connected to the power source 71. Therefore, according to this embodiment, arc discharge or electric leakage from the sub electric power output terminals 61 and 62 can be prevented. Further, in the present embodiment, in the case where the sub-connector portion 5 is connected to the sub-terminal portion 60, in order to improve the sub-electric power output terminals 61, 62 and its 35 201104115
周邊部份之間的絕緣性，設置於副電功率輪出端子6ι、62 周圍的0型環65、66係被夾置於副連接器部5〇之壁面5〇八8 與副端子部60之壁面60AS之間。藉此，依本實施形態， 則能更有效果地防止從副電功率輸出端子61、62發生狐光 放電或漏電。 X 本實施形癌之其他結構、作用及效果係與第1實施形 態相同。 另外，本發明並不限定於前述各實施形態，亦可進行 各種變更。例如，於第3實施形態中，閘閥裝置可具備= 第2實施形態中的殼體81來取代殼體u，而端子部4〇亦 可如同露出於壁面81AS般地被埋設並固定於壁構成部份 81A。 才 又，於第1至第3實施形態中，亦可將連接器部3〇 裝在閥體12之側面12E或12F處。 【圖式簡單說明】 第1圖係概略地顯示包含有本發明第丨實施形態之閘 閥裝置的真空處理系統之立體圖。 Ψ 第2圖係概略地顯示第丨圖所示之真空處理系統内 的平面圖。 第3圖係顯示本發明第1實施形態之閘閥裝置的結 之剖面圖。 第4圖係顯示第3圖所示之閘閥裝置的其他狀態之 面圖。 36 201104115 第5圖係顯示第3圖所示之閘閥裝置的又一其他狀態 之剖面圖。 〜 第6圖係顯示第4圖所示之狀態下’閘閥裝置之闊體、 加熱器以及連接器部的前視圖。 第7圖係顯示連結至第6圖所示之連接器部的端子部 之前視圖。 第8圖係顯示本發明第1實施形態之閘閥裝置的電路 結構之電路圖。 第9圖係用以說明本發明第i實施形態之間闊裝 動作之說明圖。 態之閘闊裝置的結構 第10圖係顯示本發明第2實施形 之剖面圖。 態之 第11 示第1G圖所示之關裝置的其他狀 剖面圖。 第12圖係顯示第 態之剖面圖。 10圖所示之閘閥裝置的又—其他狀 之閘閥裝置的結構 第13圖係顯示本發明第3實施形態 之剖面圖。 置的其他狀態之 第14圖係顯示第13圖所示之閘閥裝 剖面圖。 弟15圖係顯示第13圖所示之閘 態之剖面圖。 其他狀The insulation between the peripheral portions is such that the 0-rings 65 and 66 provided around the sub-electric power output terminals 6 and 62 are sandwiched between the wall surfaces 5 8 8 of the sub-connector portion 5 and the sub-terminal portion 60. Between the walls 60AS. As a result, according to this embodiment, it is possible to more effectively prevent the occurrence of fox discharge or electric leakage from the sub electric power output terminals 61 and 62. X Other configurations, actions, and effects of the present invention are the same as those of the first embodiment. Further, the present invention is not limited to the above embodiments, and various modifications can be made. For example, in the third embodiment, the gate valve device may include the casing 81 in the second embodiment instead of the casing u, and the terminal portion 4〇 may be embedded and fixed to the wall as exposed to the wall surface 81AS. Part 81A. Further, in the first to third embodiments, the connector portion 3 may be attached to the side surface 12E or 12F of the valve body 12. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view schematically showing a vacuum processing system including a gate valve device according to a third embodiment of the present invention. Ψ Fig. 2 is a plan view schematically showing the vacuum processing system shown in Fig. 。. Fig. 3 is a cross-sectional view showing the junction of the gate valve device according to the first embodiment of the present invention. Fig. 4 is a plan view showing another state of the gate valve device shown in Fig. 3. 36 201104115 Fig. 5 is a cross-sectional view showing still another state of the gate valve device shown in Fig. 3. ~ Fig. 6 is a front view showing the wide body, the heater, and the connector portion of the gate valve device in the state shown in Fig. 4. Fig. 7 is a front view showing the terminal portion connected to the connector portion shown in Fig. 6. Fig. 8 is a circuit diagram showing the circuit configuration of the gate valve device according to the first embodiment of the present invention. Fig. 9 is an explanatory view for explaining the wide-packing operation between the i-th embodiment of the present invention. Structure of the gate device of the present invention Fig. 10 is a cross-sectional view showing the second embodiment of the present invention. Fig. 11 shows another cross-sectional view of the closing device shown in Fig. 1G. Figure 12 is a cross-sectional view showing the first state. Fig. 13 is a cross-sectional view showing a third embodiment of the present invention. Fig. 13 is a cross-sectional view showing a third embodiment of the present invention. Fig. 14 of the other states of the arrangement shows a sectional view of the gate valve shown in Fig. 13. Figure 15 shows a cross-sectional view of the thyroid shown in Figure 13. Other
第1 ό圖係顯示第14圖所干夕业能T 趙、加，_部、:連 37 201104115 圖。 第17圖係顯示本發明第3實施形態之閘閥裝置的電路 結構之電路圖。 【主要元件符號說明】 10、10a、10b、10c、10d、10e 閘閥裝置 11 殼體 12 閥體 12A 密封面 12B 背面 12C 上面 12D 底面 12E、12F 侧面 13 加熱器 15 滾輪 16 滚輪 19 0型環 20 閥體移動裝置 21 氣壓缸 21a ' 壓筒部 21b 壓缸桿部 22 基底組件 23、24、25、26 連結部 30 連接器部 38 201104115 30A 本體 30AS 壁面 31 、 32 、 33 、 34 連接器 31a、32a、33a、34a 插頭 31b 彈簧 40 端子部 40A 本體 40AS 壁面 41 > 42 電功率輸出端子 43、44 感測器輸入端子 45、46 0型環 49 開關 50A 本體 50AS 壁面 5 卜 52、53、54 副連接器 51a、52a、53a、54a 插頭 51b 彈簧 60 副端子部 60A 本體 60AS 壁面 61 ' 62 副電功率輸出端 63、64 副感測輸入端 65、66 0型環 71 電源 39 201104115 72 控制部 73 溫度感測器 80 閘閥裝置 81 殼體 81A 壁構成部份 8 IAS 壁面 81B 侧部 82、83 開口部 89 0型環 90 閘闊裝置 100 真空處理系統 101 處理室 101a、101b、101c 製程處理室 102 基座 103 搬送處理室 105 預抽腔室 111 殼體 111A 壁 111AS 壁面 112 開口部 121a、121b 晶圓匡盒放置架 123a、123b 昇降機構部 125 > 133 搬送裝置 127 、 135 晶圓叉 201104115 129 131 138 Cl ' C2 s 支撐部 驅動部 緩衝材 晶圓匣盒 基板 41The first chart shows the picture of the 14th figure of the dry eve of the industry, Zhao Zhao, Jia, _ Department,: Lian 37 201104115. Figure 17 is a circuit diagram showing the circuit configuration of a gate valve device according to a third embodiment of the present invention. [Main component symbol description] 10, 10a, 10b, 10c, 10d, 10e Gate valve device 11 Housing 12 Valve body 12A Sealing surface 12B Back surface 12C Upper surface 12D Base surface 12E, 12F Side surface 13 Heater 15 Roller 16 Roller 19 0-ring 20 Valve body moving device 21 Air cylinder 21a 'Pressing portion 21b Cylinder rod portion 22 Base unit 23, 24, 25, 26 Connecting portion 30 Connector portion 38 201104115 30A Main body 30AS Wall 31, 32, 33, 34 Connector 31a, 32a, 33a, 34a Plug 31b Spring 40 Terminal section 40A Body 40AS Wall 41 > 42 Electrical power output terminals 43, 44 Sensor input terminals 45, 46 0-ring 49 Switch 50A Body 50AS Wall 5 Bu 52, 53, 54 Connector 51a, 52a, 53a, 54a Plug 51b Spring 60 Sub-terminal portion 60A Main body 60AS Wall 61 ' 62 Sub-electric power output 63, 64 Sub-sensing input 65, 66 0-ring 71 Power supply 39 201104115 72 Control unit 73 Temperature Sensor 80 Gate valve device 81 Housing 81A Wall component 8 IAS Wall 81B Side 82, 83 Opening 89 0 Ring 90 Gate device 100 Vacuum processing system 101 Process chambers 101a, 101b, 101c Process chamber 102 Base 103 Transfer processing chamber 105 Pre-drain chamber 111 Housing 111A Wall 111AS Wall 112 Openings 121a, 121b Wafer cassette placement racks 123a, 123b Lifting mechanism Portion 125 > 133 Transfer device 127, 135 Wafer fork 201104115 129 131 138 Cl ' C2 s Support portion drive portion cushioning material wafer cassette substrate 41