JP2010221088A - Method of recycling waste material having metal plating layer - Google Patents
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- JP2010221088A JP2010221088A JP2009068597A JP2009068597A JP2010221088A JP 2010221088 A JP2010221088 A JP 2010221088A JP 2009068597 A JP2009068597 A JP 2009068597A JP 2009068597 A JP2009068597 A JP 2009068597A JP 2010221088 A JP2010221088 A JP 2010221088A
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 173
- 239000002184 metal Substances 0.000 title claims abstract description 173
- 238000007747 plating Methods 0.000 title claims abstract description 150
- 238000000034 method Methods 0.000 title claims abstract description 60
- 239000002699 waste material Substances 0.000 title claims abstract description 59
- 238000004064 recycling Methods 0.000 title claims abstract description 37
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims abstract description 74
- 229910021578 Iron(III) chloride Inorganic materials 0.000 claims abstract description 59
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 claims abstract description 59
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 150000002736 metal compounds Chemical class 0.000 claims abstract description 14
- 238000005554 pickling Methods 0.000 claims abstract description 8
- 229920003023 plastic Polymers 0.000 claims description 26
- 239000004033 plastic Substances 0.000 claims description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 22
- 239000007788 liquid Substances 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 17
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 14
- -1 polyethylene terephthalate Polymers 0.000 claims description 14
- 239000000919 ceramic Substances 0.000 claims description 12
- 239000000956 alloy Substances 0.000 claims description 10
- 229910045601 alloy Inorganic materials 0.000 claims description 10
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 239000004793 Polystyrene Substances 0.000 claims description 5
- 229920006026 co-polymeric resin Polymers 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 5
- 229920002223 polystyrene Polymers 0.000 claims description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 3
- 239000004677 Nylon Substances 0.000 claims description 3
- 229930182556 Polyacetal Natural products 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 3
- 239000004695 Polyether sulfone Substances 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229920001893 acrylonitrile styrene Polymers 0.000 claims description 3
- 239000011777 magnesium Substances 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 229920001778 nylon Polymers 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920006393 polyether sulfone Polymers 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 229920002959 polymer blend Polymers 0.000 claims description 3
- 229920006324 polyoxymethylene Polymers 0.000 claims description 3
- 229920001955 polyphenylene ether Polymers 0.000 claims description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 3
- 239000004800 polyvinyl chloride Substances 0.000 claims description 3
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- 239000002253 acid Substances 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 60
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 24
- 229910052759 nickel Inorganic materials 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 239000000047 product Substances 0.000 description 11
- 238000005406 washing Methods 0.000 description 11
- 239000002585 base Substances 0.000 description 9
- 238000010276 construction Methods 0.000 description 9
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 8
- 229910052804 chromium Inorganic materials 0.000 description 8
- 239000011651 chromium Substances 0.000 description 8
- 150000002739 metals Chemical class 0.000 description 8
- 238000012545 processing Methods 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 6
- 229920009204 Methacrylate-butadiene-styrene Polymers 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 238000004090 dissolution Methods 0.000 description 4
- 229920006351 engineering plastic Polymers 0.000 description 4
- 150000004679 hydroxides Chemical class 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 3
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 229910052707 ruthenium Inorganic materials 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical group Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 229960002089 ferrous chloride Drugs 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- NMCUIPGRVMDVDB-UHFFFAOYSA-L iron dichloride Chemical compound Cl[Fe]Cl NMCUIPGRVMDVDB-UHFFFAOYSA-L 0.000 description 2
- 239000011133 lead Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 208000005156 Dehydration Diseases 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 235000006040 Prunus persica var persica Nutrition 0.000 description 1
- 240000006413 Prunus persica var. persica Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- LKAVYBZHOYOUSX-UHFFFAOYSA-N buta-1,3-diene;2-methylprop-2-enoic acid;styrene Chemical compound C=CC=C.CC(=C)C(O)=O.C=CC1=CC=CC=C1 LKAVYBZHOYOUSX-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- QSWDMMVNRMROPK-UHFFFAOYSA-K chromium(3+) trichloride Chemical group [Cl-].[Cl-].[Cl-].[Cr+3] QSWDMMVNRMROPK-UHFFFAOYSA-K 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229940126543 compound 14 Drugs 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hcl hcl Chemical compound Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- PSCMQHVBLHHWTO-UHFFFAOYSA-K indium(iii) chloride Chemical group Cl[In](Cl)Cl PSCMQHVBLHHWTO-UHFFFAOYSA-K 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- HWSZZLVAJGOAAY-UHFFFAOYSA-L lead(II) chloride Chemical compound Cl[Pb]Cl HWSZZLVAJGOAAY-UHFFFAOYSA-L 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- YBCAZPLXEGKKFM-UHFFFAOYSA-K ruthenium(iii) chloride Chemical group [Cl-].[Cl-].[Cl-].[Ru+3] YBCAZPLXEGKKFM-UHFFFAOYSA-K 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
Images
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/50—Improvements relating to the production of bulk chemicals
- Y02P20/582—Recycling of unreacted starting or intermediate materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/62—Plastics recycling; Rubber recycling
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- Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
- ing And Chemical Polishing (AREA)
- Processing Of Solid Wastes (AREA)
Abstract
Description
本発明は、金属めっきがなされた廃材から、金属製、プラスチック製、又はセラミックス製の対象素地と、この対象素地の表面に施された金属めっきの金属成分を個別に回収して再利用する金属めっき層が形成された廃材の再資源化方法に関する。 The present invention separately collects and reuses metal, plastic, or ceramic target substrates and the metal components of the metal plating applied to the surfaces of the target substrates from the waste material subjected to metal plating. The present invention relates to a method for recycling a waste material on which a plating layer is formed.
従来、最終製品の形状に成形された金属製、プラスチック製、又はセラミックス製の対象素地の表面に、金属めっきを施した部品や製品(即ち、金属めっき施工物又は金属めっきとの複合材ともいう)が、多く使用されている(例えば、特許文献1〜3参照)。
対象素地が金属製の場合、使用後の部品や製品を溶解処理して再利用し、また、対象素地がプラスチック製やセラミックス製の場合、そのまま焼却処理や埋立て処理して廃棄していた。なお、金属めっき層の表面に、更に塗装が施されている場合には、溶剤を使用して塗装を溶解除去することもあった。
Conventionally, parts or products that have been subjected to metal plating on the surface of a metal, plastic, or ceramic target substrate that has been molded into the shape of the final product (that is, a metal plating work or a composite material with metal plating) ) Is often used (see, for example, Patent Documents 1 to 3).
When the target substrate is made of metal, used parts and products are dissolved and reused, and when the target substrate is made of plastic or ceramics, they are discarded by incineration or landfill. In addition, when the surface of the metal plating layer is further coated, the coating may be dissolved and removed using a solvent.
しかしながら、金属製の対象素地を溶解して再利用するに際しては、金属めっきも対象素地と共に溶解され、対象素地に金属めっきの成分が混入するので不純物成分となり、例えば、高純度の部品や製品の原料に使用できない恐れがあった。なお、純度を高めるため、複数の処理工程で精製処理することもできるが、この場合、処理コストがかかり経済的でなかった。 However, when a metal target substrate is dissolved and reused, the metal plating is also dissolved together with the target substrate, and the components of the metal plating are mixed into the target substrate and become an impurity component. For example, high-purity parts and products There was a fear that it could not be used as a raw material. In addition, in order to improve purity, it can also refine | purify in a some process process, However In this case, processing cost increased and it was not economical.
また、プラスチック製やセラミックス製の対象素地を廃棄する場合には、金属めっきを構成する金属のみならず、資源であるプラスチックやセラミックスも廃棄することになるため、資源の有効利用が図れなかった。
なお、プラスチック製の対象素地については、金属めっきを剥がして再利用することも考えられるが、金属めっきの表面に塗装が施されている場合、これを例えば溶剤で溶解除去しようとすれば、溶剤によりプラスチックが損傷し、品質が低下する恐れがあった。また、溶剤を処理する設備も必要となり、設備コストや処理コストがかかるという問題もあった。
Moreover, when discarding the target substrate made of plastic or ceramics, not only the metal constituting the metal plating but also plastics and ceramics, which are resources, are discarded, so that effective use of resources cannot be achieved.
In addition, about the object base made of plastic, it can be considered that the metal plating is peeled off and reused. However, if the surface of the metal plating is coated, This could damage the plastic and reduce the quality. In addition, equipment for treating the solvent is required, and there is a problem that equipment cost and processing cost are required.
そこで、本出願人は塩化第二鉄液又は塩酸が添加された塩化第二鉄溶液を用いて、プラスチック製やセラミックス製の対象素地のめっき金属を除去する技術を鋭意研究した。ところが、対象物に形成されているめっき層の一部が酸化される等して表面に金属化合物が形成されている場合には、この金属化合物を塩化第二鉄液のみの処理で、溶解することは難しく、塩化第二鉄液がめっき層の最表面層の欠陥部分を通過して金属めっき層に到達してめっき金属と接触し、めっき金属の溶解が進行することが判った。従って、この過程が全体の溶解速度を律速して、十分なめっき金属の溶解速度を得ることができなかった。また、めっき層の表層に未溶解部分が残存し、後続の洗浄工程が多大な量の洗浄液と労力を必要とする課題も残していた。 Therefore, the present applicant has intensively studied a technique for removing the plated metal from the target substrate made of plastic or ceramic using a ferric chloride solution or a ferric chloride solution to which hydrochloric acid is added. However, when a metal compound is formed on the surface due to oxidation of a part of the plating layer formed on the object, the metal compound is dissolved only by treatment with ferric chloride solution. It was found that the ferric chloride solution passed through the defective portion of the outermost surface layer of the plating layer, reached the metal plating layer, contacted the plating metal, and the dissolution of the plating metal proceeded. Therefore, this process determines the overall dissolution rate, and a sufficient dissolution rate of the plated metal cannot be obtained. Moreover, the undissolved part remains in the surface layer of the plating layer, and the subsequent cleaning process still has a problem that requires a large amount of cleaning liquid and labor.
本発明はかかる事情に鑑みてなされたもので、対象素地と、この対象素地の表面に施された金属めっきの金属成分を、仮に表面に金属化合物があったとしてもこれを除去し、処理コストや設備コストを過剰にかけることなく、高能率で個別に回収して再利用でき、資源の有効利用を図ることが可能な金属めっき層が形成された廃材の再資源化方法を提供することを目的とする。 The present invention has been made in view of such circumstances, and removes the target substrate and the metal component of the metal plating applied to the surface of the target substrate, even if there is a metal compound on the surface, processing costs. To provide a method for recycling waste materials with a metal plating layer that can be collected and reused individually with high efficiency and can effectively use resources without excessive costs and equipment costs Objective.
前記目的に沿う第1の発明に係る金属めっき層が形成された廃材の再資源化方法は、金属製、セラミック製、又はプラスチック製の素地の表面に金属めっき層が形成された廃材の再資源化方法であって、
前記廃材を塩酸で処理して、前記金属めっき層の表面の金属化合物(めっき金属の酸化物及び水酸化物を含む)を除去する酸洗工程と、酸洗処理された前記廃材を、塩化第二鉄液(塩化第二鉄溶液)又は塩酸が添加された塩化第二鉄液を用いて前記金属めっき層を溶解させるめっき層除去工程とを有する。
なお、塩酸の代わりに硫酸や硝酸等も適用できるが、塩酸の場合は中和が容易であり、廃液の後処理が極めて簡単であるので、金属化合物を除去する液として使用した。また、塩酸の濃度は10質量%以上(好ましくは、10又は15質量%以上で35質量%以下)を採用するのがよい。
The recycling method of the waste material in which the metal plating layer according to the first invention according to the above object is formed is a recycling method of the waste material in which the metal plating layer is formed on the surface of a metal, ceramic, or plastic substrate. A method of
The waste material is treated with hydrochloric acid to remove a metal compound (including oxides and hydroxides of the plating metal) on the surface of the metal plating layer, and the waste material subjected to the pickling treatment is chlorinated. A plating layer removing step of dissolving the metal plating layer using a ferric chloride solution (ferric chloride solution) or a ferric chloride solution to which hydrochloric acid is added.
In addition, although sulfuric acid, nitric acid, etc. are applicable instead of hydrochloric acid, in the case of hydrochloric acid, since neutralization is easy and the post-treatment of a waste liquid is very easy, it was used as a liquid for removing a metal compound. Moreover, it is good to employ | adopt the density | concentration of
また、第2の発明に係る金属めっき層が形成された廃材の再資源化方法は、第1の発明に係る金属めっき層が形成された廃材の再資源化方法において、前記素地は金属製であって、該金属製の素地は、鉄、鋼、銅、亜鉛、アルミニウム、マグネシウム、及びこれらの合金のいずれか1又は2以上である。 Further, a method for recycling waste material in which a metal plating layer according to the second invention is formed is a method for recycling waste material in which a metal plating layer is formed according to the first invention, wherein the substrate is made of metal. The metal base is one or more of iron, steel, copper, zinc, aluminum, magnesium, and alloys thereof.
第3の発明に係る金属めっき層が形成された廃材の再資源化方法は、第1の発明に係る金属めっき層が形成された廃材の再資源化方法において、前記素地はプラスチック製であって、該プラスチック製の素地は、ナイロン、ポリアセタール、変性ポリフェニレンエーテル、ポリカーボネート、ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリフェニレンサルファイド、ポリアミド、ポリエーテルサルフォン、液晶ポリマー、ポリエチレン、ポリプロピレン、ポリ塩化ビニル、ポリスチレン、ABS樹脂、アクリロニトリルスチレン共重合樹脂、MBS樹脂、及びこれらのポリマーアロイ物又はポリマーブレンド物のいずれか1又は2以上である。 A method for recycling waste material in which a metal plating layer according to a third invention is formed is a method for recycling waste material in which a metal plating layer is formed according to the first invention, wherein the substrate is made of plastic. The plastic substrate is made of nylon, polyacetal, modified polyphenylene ether, polycarbonate, polyethylene terephthalate, polybutylene terephthalate, polyphenylene sulfide, polyamide, polyether sulfone, liquid crystal polymer, polyethylene, polypropylene, polyvinyl chloride, polystyrene, ABS resin , Acrylonitrile styrene copolymer resin, MBS resin, and any one or more of these polymer alloys or polymer blends.
第4の発明に係る金属めっき層が形成された廃材の再資源化方法は、第1〜第3の発明に係る金属めっき層が形成された廃材の再資源化方法において、前記めっき層除去工程で回収した塩化第二鉄液又は塩酸が添加された塩化第二鉄液の廃液からめっき金属を回収する。 The waste material recycling method in which the metal plating layer according to the fourth invention is formed is the waste material recycling method in which the metal plating layer according to the first to third inventions is formed. The plating metal is recovered from the ferric chloride solution recovered in step 1 or the ferric chloride solution to which hydrochloric acid is added.
第5の発明に係る金属めっき層が形成された廃材の再資源化方法は、第4の発明に係る金属めっき層が形成された廃材の再資源化方法において、前記金属めっき層の金属成分が溶解した前記廃液に鉄粉を添加し、該廃液中に溶存する塩化物を置換させて前記金属成分を分離回収する。 A waste material recycling method in which the metal plating layer according to the fifth invention is formed is a waste material recycling method in which the metal plating layer according to the fourth invention is formed, wherein the metal component of the metal plating layer is Iron powder is added to the dissolved waste liquid, the chloride dissolved in the waste liquid is replaced, and the metal component is separated and recovered.
そして、第6の発明に係る金属めっき層が形成された廃材の再資源化方法は、第1〜第5の発明に係る金属めっき層が形成された廃材の再資源化方法において、前記金属めっき層の表面には更に塗装又はフィルムが被覆されており、該塗装又はフィルムを高圧水で除去した後、前記金属めっき層を除去する。前記高圧水の水圧は50MPa以上400MPa以下であることが好ましい。 And the recycling method of the waste material in which the metal plating layer which concerns on 6th invention was formed is the said metal plating in the recycling method of the waste material in which the metal plating layer which concerns on 1st-5th invention was formed. The surface of the layer is further coated with a paint or film, and after removing the paint or film with high-pressure water, the metal plating layer is removed. The water pressure of the high-pressure water is preferably 50 MPa or more and 400 MPa or less.
第1〜第6の発明に係る金属めっき層が形成された廃材の再資源化方法は、廃材を塩酸で処理して金属めっき層の表面の金属化合物(その他の化合物も含む)を除去する酸洗工程と、酸洗処理された廃材を、塩化第二鉄液又は塩酸が添加された塩化第二鉄液を用いて金属めっき層を溶解させるめっき層除去工程とを有し、金属めっき層の表面に形成された金属化合物を塩酸で除去し、金属めっき層を露出させ、その後、塩化第二鉄溶液で金属めっき層を溶解させる。
従って、全体の処理時間が短くて済み、金属めっき層の除去後の洗浄も容易となる。また、金属めっき層の表面の金属化合物も金属イオンとして、塩酸に溶け込み回収も容易となる。
The method for recycling a waste material on which a metal plating layer according to the first to sixth inventions is formed is an acid that treats the waste material with hydrochloric acid to remove metal compounds (including other compounds) on the surface of the metal plating layer. A washing step and a plating layer removing step of dissolving the pickled waste material using a ferric chloride solution or a ferric chloride solution to which hydrochloric acid is added. The metal compound formed on the surface is removed with hydrochloric acid to expose the metal plating layer, and then the metal plating layer is dissolved with a ferric chloride solution.
Accordingly, the entire processing time can be shortened, and cleaning after removal of the metal plating layer is facilitated. In addition, the metal compound on the surface of the metal plating layer also dissolves in hydrochloric acid as metal ions and is easy to recover.
更には、素地(「対象素地」に同じ)の表面から、金属めっき層を除去するので、素地を再利用する際に、金属めっき層の金属成分が混入しない高純度の材料が得られる。このため、例えば、高純度の材料を得るために、材料を複数の処理工程で精製処理する必要がなく、処理コストの低減が図れると共に作業性も良好になる。 Furthermore, since the metal plating layer is removed from the surface of the substrate (same as the “target substrate”), a high-purity material in which the metal component of the metal plating layer is not mixed when the substrate is reused can be obtained. For this reason, for example, in order to obtain a high-purity material, it is not necessary to purify the material in a plurality of processing steps, so that the processing cost can be reduced and the workability can be improved.
特に、第4、第5の発明に係る金属めっき層が形成された廃材の再資源化方法においては、金属めっき層を除去した素地を回収できる他、塩化第二鉄液又は塩酸が添加された塩化第二鉄溶液の廃液からめっき金属も個別に回収して再利用できるので、資源の有効利用が図れる。 In particular, in the method for recycling waste materials in which the metal plating layers according to the fourth and fifth inventions are formed, the base material from which the metal plating layers have been removed can be recovered, and ferric chloride solution or hydrochloric acid is added. Since the plating metal can be individually recovered and reused from the ferric chloride solution waste solution, resources can be effectively used.
そして、第6の発明に係る金属めっき層が形成された廃材の再資源化方法は、金属めっき層の表面に更に塗装又はフィルムが被覆されている場合、金属めっき層を除去する前に、塗装又はフィルムを高圧水で予め除去するので、素地と金属めっき層の金属成分への不純物の混入を防止できる。これにより、高純度の対象素地と金属成分を得ることができ、各材料の後処理が不要となる。特に、プラスチック製の対象素地に塗装が施されている場合でも、塗装を溶解させるための溶剤を使用する必要がないので、対象素地の品質低下を防止して再利用できる。 And the recycling method of the waste material in which the metal plating layer which concerns on 6th invention is formed, before the metal plating layer is removed, when the surface of the metal plating layer is further coated or coated, Alternatively, since the film is previously removed with high-pressure water, it is possible to prevent impurities from being mixed into the base and the metal component of the metal plating layer. As a result, a high-purity target substrate and metal components can be obtained, and post-treatment of each material becomes unnecessary. In particular, even when a plastic target substrate is coated, it is not necessary to use a solvent for dissolving the coating, so that the quality of the target substrate can be prevented from being lowered and reused.
続いて、添付した図面を参照しつつ、本発明を具体化した実施の形態につき説明し、本発明の理解に供する。
図1に示すように、本発明の一実施の形態に係る金属めっき層が形成された廃材の再資源化方法は、金属めっきがなされた廃材を塩酸で処理して金属めっき層の表面の金属化合物を除去する酸洗工程と、酸洗処理された廃材を、塩化第二鉄液又は塩酸が添加された塩化第二鉄液を用いて金属めっき層を溶解させるめっき層除去工程とを有する。以下、これらについて詳しく説明する。
Next, embodiments of the present invention will be described with reference to the accompanying drawings for understanding of the present invention.
As shown in FIG. 1, the method for recycling a waste material on which a metal plating layer is formed according to an embodiment of the present invention treats the waste material on which metal plating has been performed with hydrochloric acid to treat metal on the surface of the metal plating layer The pickling process which removes a compound, and the plating layer removal process which dissolves a metal plating layer using the ferric chloride liquid or the ferric chloride liquid to which hydrochloric acid was added to the pickled waste material. These will be described in detail below.
再利用する廃材である金属めっき施工物(以下、単にめっき施工物ともいう)は、使用済みの部品や製品であるが、例えば、部品や製品の製造過程で発生する不良品(例えば、検査不合格品等)や残材でもよい。金属めっき層を除去した素地(対象素地)は、具体的には、金属、セラミック、プラスチック又はこれらの混合物からなる。 Recycled metal plating work (hereinafter also referred to simply as plating work) is a used part or product. For example, a defective product (for example, a non-inspected product) generated in the manufacturing process of the part or product. Acceptable products) and remaining materials. Specifically, the substrate (target substrate) from which the metal plating layer has been removed is made of metal, ceramic, plastic, or a mixture thereof.
金属製の対象素地は、例えば、鉄、鋼、銅、亜鉛、アルミニウム、マグネシウム、及びこれらの金属の合金(以上に示した金属を主体、即ち80質量%以上、更には90質量%以上含む合金)のいずれか1又は2以上で構成されたものである。
また、セラミックス製の対象素地は、例えば、アルミナ、シリカ、マグネシア、ムライト、及びジルコニアのいずれか1又は2以上で構成されたものである。
そして、プラスチック製の対象素地は、(1)エンジニアリングプラスチック又はスーパーエンジニアリングプラスチック、(2)ポリオレフィン樹脂(類)、(3)これらのプラスチックのポリマーアロイ物又はポリマーブレンド物、等である。なお、これら(1)〜(3)のいずれか1又は2以上で構成されたものでもよい。
Examples of metal target substrates include iron, steel, copper, zinc, aluminum, magnesium, and alloys of these metals (alloys containing the above metals as a main component, that is, 80% by mass or more, and further 90% by mass or more). 1) or two or more.
In addition, the ceramic target substrate is made of any one or more of alumina, silica, magnesia, mullite, and zirconia, for example.
The target base material made of plastic is (1) engineering plastic or super engineering plastic, (2) polyolefin resin (s), (3) polymer alloy or polymer blend of these plastics, and the like. In addition, what was comprised by any 1 or 2 or more of these (1)-(3) may be used.
上記した(1)エンジニアリングプラスチック又はスーパーエンジニアリングプラスチックには、(a)ナイロン、ポリアセタール、変性ポリフェニレンエーテル、ポリカーボネート、(b)ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリフェニレンサルファイド、(c)ポリアミド、ポリエーテルサルフォン、液晶ポリマー、等がある。
また、(2)ポリオレフィン樹脂(類)には、(a)ポリエチレン、ポリプロピレン、ポリ塩化ビニル、ポリスチレン、(b)アクリロニトリルブタジエンスチレン共重合樹脂(ABS樹脂)、(c)アクリロニトリルスチレン共重合樹脂、メチルメタクリレートブタジエンスチレン共重合樹脂(MBS樹脂)、等がある。
The above (1) engineering plastic or super engineering plastic includes (a) nylon, polyacetal, modified polyphenylene ether, polycarbonate, (b) polyethylene terephthalate, polybutylene terephthalate, polyphenylene sulfide, (c) polyamide, polyether sulfone, Liquid crystal polymer, etc.
(2) Polyolefin resin (s) includes (a) polyethylene, polypropylene, polyvinyl chloride, polystyrene, (b) acrylonitrile butadiene styrene copolymer resin (ABS resin), (c) acrylonitrile styrene copolymer resin, methyl And methacrylate butadiene styrene copolymer resin (MBS resin).
上記したプラスチックのうち特に好ましいのは、ゴム含有のスチレン系樹脂、例えば上記したポリスチレンを用いたゴム強化ポリスチレン(HI樹脂)、ABS樹脂、MBS樹脂、等であり、とりわけ、ABS樹脂が有利である。この理由は、金属めっきが容易であり、成形加工性がよく、適度な物性を有した安価な汎用樹脂として多岐にわたって使用(例えば、パチンコやスロットルマシーン等の趣味娯楽関係の製品)され、まとめて収集され易いためである。
なお、プラスチックへの金属めっき処理の目的は、プラスチックが元来有していない金属の硬度、光沢、熱伝導性、高級感等を得ることにあり、自動車への利用では、例えば、ヘッドライトハウジング、ドアハンドル、グリル、ホイルキャップ、エンブレム等がある。
Of the above-mentioned plastics, particularly preferred are rubber-containing styrene resins such as rubber-reinforced polystyrene (HI resin), ABS resin, MBS resin, etc. using the above-mentioned polystyrene, and ABS resin is particularly advantageous. . This is because metal plating is easy, moldability is good, and it is widely used as an inexpensive general-purpose resin with appropriate physical properties (for example, hobby entertainment related products such as pachinko and throttle machines). It is because it is easy to collect.
The purpose of metal plating on plastic is to obtain the hardness, luster, thermal conductivity, high-quality feeling, etc. of the metal that plastic originally does not have. , Door handles, grills, foil caps, emblems, etc.
これら対象素地の表面には、単一金属、二種以上の金属、又は合金の金属成分で構成される金属めっきが施されている。
ここで、単一又は二種以上の金属には、例えば、銅、ニッケル、クロム、錫、鉛、ルテニウム、アルミニウム、又はインジウムがある。なお、二種以上の金属とは、例えば、銅の無電解めっきを行った上に、更にニッケルを電気めっきする場合のように、二種以上の金属を複数層に積層してめっきした場合の金属が含まれる。
また、合金には、例えば、銅、ニッケル、クロム、錫、鉛、又はルテニウムを主体とした(例えば、80質量%以上、更には90質量%以上含む)合金がある。
これら金属めっきは、従来公知の電気めっきと無電解めっきのいずれの方法を用いて形成されたものでもよく、まためっき浴を使用しないCVD(化学蒸着)やPVD(物理蒸着)等を用いて形成されたものでもよい。
The surface of these target substrates is subjected to metal plating composed of a single metal, two or more metals, or a metal component of an alloy.
Here, the single or two or more kinds of metals include, for example, copper, nickel, chromium, tin, lead, ruthenium, aluminum, or indium. The two or more kinds of metals are, for example, the case where two or more kinds of metals are laminated and plated in a plurality of layers as in the case of performing electroless plating of copper and further electroplating nickel. Metal is included.
Examples of the alloy include an alloy mainly composed of copper, nickel, chromium, tin, lead, or ruthenium (for example, 80% by mass or more, and further 90% by mass or more).
These metal platings may be formed using any of the conventionally known electroplating and electroless plating methods, and are formed using CVD (chemical vapor deposition), PVD (physical vapor deposition), or the like that does not use a plating bath. It may be done.
以上に示した対象素地の表面から金属めっき層(即ち、めっき金属)を除去する方法について、図1を参照しながら説明する。
まず、図1に示すように、金属めっきが施された金属めっき施工物(廃材)を、水で洗浄処理して、金属めっき層の表面に付着したごみや汚れを除去する。
なお、金属めっきが施された金属めっき施工物は、そのままの状態で洗浄処理してもよいが、籠の中に入れて行うのがよい。この場合、対象素地がプラスチック製の場合は、例えば、従来公知の破砕機を使用して、例えば、一辺が10cm程度の大きさとなるように、予め破砕処理(粗破砕)しておくのがよい。
A method for removing the metal plating layer (that is, the plating metal) from the surface of the target substrate described above will be described with reference to FIG.
First, as shown in FIG. 1, a metal plating work (waste material) subjected to metal plating is washed with water to remove dust and dirt attached to the surface of the metal plating layer.
In addition, although the metal plating construction object to which metal plating was given may be wash-processed as it is, it is good to put it in a basket. In this case, when the target substrate is made of plastic, for example, using a conventionally known crusher, it is preferable to perform crushing treatment (coarse crushing) in advance so that one side has a size of about 10 cm, for example. .
また、金属めっき層の表面に塗装が施されている(又はフィルムが貼付されている)場合には、この塗装(フィルム)を高圧水で除去した後、洗浄処理する。この高圧水の水圧とは、ポンプ等での昇圧後の圧力を指し、例えば、50MPa以上400MPa以下(好ましくは、下限を100MPa、上限を300MPa、更には220MPa)にするとよい。以下、水圧を100〜180MPaに調整して、塗装の除去試験を行った結果について説明する。 When the surface of the metal plating layer is coated (or a film is affixed), the coating (film) is removed with high-pressure water and then washed. The water pressure of the high-pressure water refers to the pressure after the pressure is increased by a pump or the like, for example, 50 MPa or more and 400 MPa or less (preferably, the lower limit is 100 MPa, the upper limit is 300 MPa, and further 220 MPa). Hereinafter, the result of adjusting the water pressure to 100 to 180 MPa and performing a paint removal test will be described.
塗装が、黒色や白色のように単色の場合は、水圧を100MPaとすることで、塗装を容易に剥離できた。特に、白色の場合は、100MPa以下でも剥離が可能であった。
一方、メタリック(銀、桃、黄土)の場合は、水圧を120MPa以上とすることで、塗装を剥離できた。
なお、高圧水を噴出する洗浄用ノズルの形状は、従来公知の扇形、偏心回転、中心回転、等のいずれでもよい。この各種ノズルを使用し、高圧水の水圧、金属めっき施工物との距離、及び高圧水の吹付け時間を、それぞれ設定することで、金属めっきの表面の塗装を全て剥離できることを確認できた(以上、水洗浄工程、ステップS1)。
When the coating was a single color such as black or white, the coating could be easily peeled off by setting the water pressure to 100 MPa. In particular, in the case of white, peeling was possible even at 100 MPa or less.
On the other hand, in the case of metallic (silver, peach, ocher), the coating could be peeled off by setting the water pressure to 120 MPa or more.
The shape of the cleaning nozzle that ejects high-pressure water may be any of a conventionally known sector shape, eccentric rotation, center rotation, and the like. Using these various nozzles, we were able to confirm that the coating on the surface of the metal plating could all be removed by setting the water pressure of the high pressure water, the distance to the metal plating construction, and the spraying time of the high pressure water, respectively ( Above, water washing process, step S1).
この後、水洗した金属めっき施工物を塩酸液に浸漬する。塩酸液は10〜35質量%(更に好ましくは、15〜35質量%)の塩酸を含む液を使用するのがよいが、更に濃度が高い場合であっても本発明は適用できる。
これによって、金属めっき層の表面に形成される金属化合物を溶かして除去することができる。ここで、塩酸の代わりに硫酸や硝酸を使用することもできるが、塩酸の方が後処理が容易である。この場合の塩酸による酸洗時間は、常温で4〜10分程度が好ましいが、濃度によって異なる(以上、酸洗工程、ステップS2)。
Thereafter, the washed metal plating construction is immersed in a hydrochloric acid solution. As the hydrochloric acid solution, a solution containing 10 to 35% by mass (more preferably 15 to 35% by mass) hydrochloric acid is preferably used, but the present invention can be applied even when the concentration is higher.
Thereby, the metal compound formed on the surface of the metal plating layer can be dissolved and removed. Here, sulfuric acid or nitric acid can be used in place of hydrochloric acid, but hydrochloric acid is easier to post-treat. In this case, the pickling time with hydrochloric acid is preferably about 4 to 10 minutes at room temperature, but varies depending on the concentration (pickling step, step S2).
次に、洗浄(酸洗)処理した金属めっき施工物を、塩化第二鉄液、又は塩酸が添加された塩化第二鉄液に浸漬し、この塩化第二鉄液に金属めっきを溶解させる。なお、金属めっきを塩化第二鉄液に溶解させるに際しては、塩化第二鉄液中に洗浄処理した金属めっき施工物を浸漬(例えば、8〜30分程度)させることが好ましいが、例えば、金属めっき施工物の表面の金属めっき層に、塩化第二鉄液を連続的に噴霧したり、連続的に接触(液を垂らす又は液を流す)させてもよい。 Next, the washing (pickling) -treated metal plating construction object is immersed in a ferric chloride solution or a ferric chloride solution to which hydrochloric acid is added, and the metal plating is dissolved in the ferric chloride solution. In addition, when dissolving metal plating in a ferric chloride solution, it is preferable to immerse (for example, about 8 to 30 minutes) a metal plating construction that has been cleaned in the ferric chloride solution. The metal plating layer on the surface of the plating work may be continuously sprayed with ferric chloride liquid or continuously contacted (dropping or flowing liquid).
ここで、使用する塩化第二鉄液中の塩化第二鉄(FeCl3)の濃度は、概ね10質量%以上(望ましくは30質量%以上)でよいが、経済性を考慮すれば、60質量%以下(好ましくは55質量%以下)である。
また、塩化第二鉄液中に、更に塩酸(HCl)を添加することも可能であるが、この場合、塩酸の濃度を、5質量%以上20質量%以下とするのがよい。なお、塩化第二鉄溶液に塩酸を追加すると、処理液の全体の価格が増し、後処理を行う液の量が増すので、塩化第二鉄溶液のみで容易に除去可能なめっき金属の場合は省略するのが好ましい。
Here, the concentration of ferric chloride (FeCl 3 ) in the ferric chloride solution to be used may be approximately 10% by mass or more (preferably 30% by mass or more), but 60% by mass in consideration of economy. % Or less (preferably 55% by mass or less).
Further, hydrochloric acid (HCl) can be further added to the ferric chloride solution. In this case, the concentration of hydrochloric acid is preferably 5% by mass or more and 20% by mass or less. In addition, adding hydrochloric acid to the ferric chloride solution increases the overall cost of the treatment liquid and increases the amount of the post-treatment liquid. For plating metals that can be easily removed only with a ferric chloride solution, It is preferable to omit it.
上記した塩化第二鉄液と、塩酸が添加された塩化第二鉄液には、新たに製造した新液(再生液を含む)と、新液を使用した後の廃液(例えば、塩化銅や塩化ニッケルが溶存している液、更には塩化第一鉄が存在している液)のいずれも使用できる。
これにより、金属めっき中の各種金属は塩化物を形成し、塩化第二鉄液に溶解する。
The ferric chloride solution and the ferric chloride solution to which hydrochloric acid has been added include a newly produced new solution (including a regenerated solution) and a waste solution after using the new solution (for example, copper chloride or Either a solution in which nickel chloride is dissolved or a solution in which ferrous chloride is present can be used.
As a result, various metals in the metal plating form chlorides and dissolve in the ferric chloride solution.
具体的には、銅は塩化銅(CuCl2)、ニッケルは塩化ニッケル(NiCl2)、クロムは塩化クロム(CrCl3)、錫は塩化錫(SnCl2)、鉛は塩化鉛(PbCl2)、ルテニウムは塩化ルテニウム(RuCl3)、アルミニウムは塩化アルミニウム(AlCl3)、インジウムは塩化インジウム(InCl3)となる。このように、金属めっきを塩化第二鉄液に溶解させることで、金属めっきの付着がない対象素地が得られる(以上、めっき層除去工程、ステップS3)。
金属めっき層が除去された対象素地がプラスチックの場合は、その後、弱酸にて洗浄を行い、かつ水洗も行って付着した塩化第二鉄液を除去する(ステップS4)。そして、必要な場合、対象素地を脱水して(ステップS5)破砕処理を行う。
Specifically, copper is copper chloride (CuCl 2 ), nickel is nickel chloride (NiCl 2 ), chromium is chromium chloride (CrCl 3 ), tin is tin chloride (SnCl 2 ), lead is lead chloride (PbCl 2 ), Ruthenium is ruthenium chloride (RuCl 3 ), aluminum is aluminum chloride (AlCl 3 ), and indium is indium chloride (InCl 3 ). In this way, by dissolving the metal plating in the ferric chloride solution, a target substrate free of metal plating is obtained (the plating layer removing step, step S3).
If the target substrate from which the metal plating layer has been removed is plastic, then it is washed with a weak acid and washed with water to remove the adhering ferric chloride solution (step S4). If necessary, the target substrate is dehydrated (step S5) and the crushing process is performed.
ここで、対象素地が金属製の場合は、例えば、塩化第二鉄液の除去処理をした後、溶解処理し原料として再利用できる(ステップS8)。なお、金属の種類(例えば、鉄系金属)によっては、金属めっきを除去した後、そのまま液切り処理を行った後、溶解処理を行ってもよい。
また、セラミックス製の場合は、水洗処理後の脱水処理の後、例えば、破損部分をセラミックス材料で補修したり、また粉砕処理し他の原料に混ぜて使用したりできる(ステップS9)。
そして、プラスチック製の場合は、例えば、1〜10mmの適当な大きさに粉砕して分別し、そのまま原料として使用したり、またバージン材料(未使用材料)に適量混ぜて使用したり、更に加熱して溶融してペレットとすることができる(ステップS7)。
Here, when the target substrate is made of metal, for example, after removing the ferric chloride solution, it can be dissolved and reused as a raw material (step S8). Depending on the type of metal (for example, iron-based metal), after removing the metal plating, the liquid draining process may be performed as it is, and then the dissolution process may be performed.
In the case of ceramics, after the dehydration treatment after the water washing treatment, for example, the damaged portion can be repaired with a ceramic material, or pulverized and mixed with other raw materials (step S9).
In the case of plastic, for example, it is pulverized to an appropriate size of 1 to 10 mm and separated and used as it is as a raw material, or mixed with an appropriate amount of virgin material (unused material), and further heated. And can be melted into pellets (step S7).
一方、塩化第二鉄液に溶解させた金属めっきの金属成分は、この塩化第二鉄液(廃液)から析出させて回収する。この方法としては、従来公知の方法を使用でき、例えば、金属めっきの金属成分が、銅とニッケルを含んでいる場合には、例えば、特開平6−127946号公報に記載の方法を使用できる。また、錫や銀、インジウム等も、同様の方法を使用できる。なお、クロムとアルミニウムは、水酸化物として回収される。
この具体的な方法は、公報に記載されているため、以下簡単に説明する。
On the other hand, the metal component of the metal plating dissolved in the ferric chloride solution is precipitated and recovered from this ferric chloride solution (waste solution). As this method, a conventionally known method can be used. For example, when the metal component of the metal plating contains copper and nickel, for example, the method described in JP-A-6-127946 can be used. The same method can be used for tin, silver, indium, and the like. Note that chromium and aluminum are recovered as hydroxides.
Since this specific method is described in the publication, it will be briefly described below.
上記した金属成分を含有する塩化第二鉄液中に鉄粉を添加し、塩化第二鉄液中に溶存する塩化銅(塩化物)を置換させ、銅を析出させて分離回収する。なお、塩化第二鉄液中に塩化第二鉄が残存している場合は、鉄粉を添加して先に塩化第一鉄に還元しておく方が、銅の回収効率が向上し、望ましい。
次に、銅が除去された脱銅液中に鉄粉を添加し、かつ鉄イオン濃度を制御してニッケルを析出させ分離回収する。
これにより、塩化第二鉄液中から銅とニッケルを回収できる。
以上の方法により、対象素地と金属めっきの金属成分を回収することで、これらを再利用できるので、資源の有効利用が図れる。
Iron powder is added to the ferric chloride solution containing the above-described metal components to replace copper chloride (chloride) dissolved in the ferric chloride solution, and copper is deposited and separated and recovered. If ferric chloride remains in the ferric chloride solution, it is preferable to add iron powder and reduce it to ferrous chloride first, because the copper recovery efficiency is improved. .
Next, iron powder is added to the copper removal liquid from which copper has been removed, and the iron ion concentration is controlled to precipitate and separate and recover nickel.
Thereby, copper and nickel can be recovered from the ferric chloride solution.
By recovering the target substrate and the metal components of the metal plating by the above method, these can be reused, so that resources can be effectively used.
次に、本発明の作用効果を確認するために行った実施例について説明する。
ここでは、プラスチック製の金属めっき施工物10a(具体的には自動車用フロントグリル、廃材の一例)として、図2に示すように、ABS樹脂製の対象素地10の表面に、銅とニッケルのめっき(又は、銅めっき)11が形成されている。その上にニッケル下地めっき12が、更にその上にクロムめっき13がなされている。なお、銅とニッケルのめっきは、それぞれ無電解めっきと電気めっきにより、対象素地10の表面に形成されている。そして、クロムめっき13の表面には金属化合物14が形成されている。
Next, examples carried out for confirming the effects of the present invention will be described.
Here, as shown in FIG. 2, copper and nickel are plated on the surface of the
以上のようにして金属めっき層が形成された200kgの金属めっき施工物10aを籠に入れて、濃度が10質量%以上(この実施例では30〜35質量%を使用)塩酸に3〜10分程度(この実施例では5分)浸漬した。これによって、クロムめっきの表面に形成されている金属化合物が塩酸に溶けて除去できた。なお、この処理は常温で行ったが加熱してもよい。 200 kg of the metal plating construction object 10a on which the metal plating layer is formed as described above is put in a basket, and the concentration is 10% by mass or more (in this example, 30 to 35% by mass). Soaked to the extent (5 minutes in this example). Thereby, the metal compound formed on the surface of the chromium plating was dissolved in hydrochloric acid and removed. In addition, although this process was performed at normal temperature, you may heat.
次に、酸洗処理された金属めっき施工物10aをそのまま、温度が常温から60℃(この実施例では55℃)の塩化第二鉄液中に浸漬させ、金属めっきを塩化第二鉄液に溶解させた。この試験は合計8回行った。なお、使用した塩化第二鉄液の塩化第二鉄の濃度は40〜50質量%(8回平均では、45質量%)、塩化第二鉄液への浸漬時間は8〜15分(平均10分)とした。 Next, the pickled metal plating work 10a is immersed in a ferric chloride solution having a temperature from room temperature to 60 ° C. (55 ° C. in this embodiment) as it is, and the metal plating is made into a ferric chloride solution. Dissolved. This test was performed a total of 8 times. The ferric chloride concentration of the ferric chloride solution used was 40-50% by mass (average of 8 times is 45% by mass), and the immersion time in the ferric chloride solution was 8-15 minutes (average 10). Minutes).
次に、塩化第二鉄液中から、対象素地を取り出し、水洗い、塩酸洗浄、水洗いの順序で、対象素地の表面に付着した塩化第二鉄液を除去した。なお、塩酸洗浄は、塩酸濃度が10質量%の洗浄液を使用し、1回あたり6分行った。また、水洗いは、対象素地の表面に満遍なく水を流す程度に行った。
これにより、金属めっきの付着がない対象素地が得られた。なお、この対象素地の表面精度と物性(引っ張り強度、引っ張り伸び、アイゾット衝撃強度)は、未使用のABS樹脂と同等であることを確認できた。
Next, the target substrate was taken out of the ferric chloride solution, and the ferric chloride solution adhering to the surface of the target substrate was removed in the order of washing with water, washing with hydrochloric acid, and washing with water. In addition, hydrochloric acid washing | cleaning was performed for 6 minutes per time using the washing | cleaning liquid whose hydrochloric acid concentration is 10 mass%. In addition, washing was performed to such an extent that water was evenly flowed over the surface of the target substrate.
Thereby, the object substrate without metal plating adhesion was obtained. It was confirmed that the surface accuracy and physical properties (tensile strength, tensile elongation, Izod impact strength) of this target substrate were equivalent to those of unused ABS resin.
[比較例]
次に、金属めっき施工物10aを最初に塩酸で洗浄するという工程を省略して、塩化第二鉄液のみで、金属めっき層を除去する実験も行った。
塩化第二鉄の溶液(45質量%)は、実施例と同一のものを使用したが、浸漬時間は10分程度では、金属めっき層の除去が困難であったので、27分とした。これによって、金属めっき層は大凡除去できたが、塩化第二鉄液に多量の未溶解残渣が残った。この未溶融残渣の主体は、金属酸化物と推定される。
[Comparative example]
Next, an experiment of removing the metal plating layer with only ferric chloride solution was performed by omitting the step of first washing the metal plating construction object 10a with hydrochloric acid.
The same ferric chloride solution (45% by mass) as that used in the example was used. However, when the immersion time was about 10 minutes, it was difficult to remove the metal plating layer. As a result, the metal plating layer was largely removed, but a large amount of undissolved residue remained in the ferric chloride solution. The main component of this unmelted residue is presumed to be a metal oxide.
以上のことから、本発明の金属めっき層が形成された廃材の再資源化方法を使用することで、処理コストや設備コストを過剰にかけることなく、金属めっき施工物から対象素地と金属めっきの金属成分を個別に回収して再利用でき、資源の有効利用が図れることを確認できた。即ち、塩酸は酸化物や水酸化物に対して溶解度が高いが、めっき金属については溶解力は小さい。また、塩化第二鉄液は酸化物や水酸化物に対して溶解度が小さい(即ち、浸食しにくい)が、めっき金属については溶解力は大きいことを見い出し、これを金属めっきがなされた廃材に適用し、それぞれの分離を行った。 From the above, by using the recycling method of the waste material in which the metal plating layer of the present invention is formed, the object substrate and the metal plating can be removed from the metal plating construction work without excessive processing costs and equipment costs. It was confirmed that metal components can be collected and reused individually, and resources can be used effectively. That is, hydrochloric acid is highly soluble in oxides and hydroxides, but the plating metal has low solubility. In addition, ferric chloride solution has low solubility in oxides and hydroxides (that is, it is difficult to erode), but it has been found that it has a high dissolving power for plated metal, and this is used as a metal-plated waste material. Apply and separate each.
なお、ここでは、塩化第二鉄液を使用した場合について示したが、塩酸が添加された塩化第二鉄液を使用した場合についても、良好な結果が得られることを確認できた。しかし、塩酸と塩化第二鉄を分離した方が、それぞれの液は独立して繰り返し使用でき、効率的である。
また、対象素地がプラスチックの製品を再生させた場合について説明したが、金属又はセラミックスで構成された製品についても、良好な結果が得られることを確認できた。
In addition, although it showed about the case where a ferric chloride liquid was used here, it has confirmed that a favorable result was obtained also when the ferric chloride liquid to which hydrochloric acid was added was used. However, if hydrochloric acid and ferric chloride are separated, each solution can be used repeatedly independently, which is more efficient.
Moreover, although the case where the object base material recycled the product of plastic was demonstrated, it has confirmed that a favorable result was obtained also about the product comprised from the metal or ceramics.
以上、本発明を、実施の形態を参照して説明してきたが、本発明は何ら上記した実施の形態に記載の構成に限定されるものではなく、特許請求の範囲に記載されている事項の範囲内で考えられるその他の実施の形態や変形例も含むものである。例えば、前記したそれぞれの実施の形態や変形例の一部又は全部を組合せて本発明の金属めっき層が形成された廃材の再資源化方法を構成する場合も本発明の権利範囲に含まれる。 As described above, the present invention has been described with reference to the embodiment. However, the present invention is not limited to the configuration described in the above embodiment, and the matters described in the scope of claims. Other embodiments and modifications conceivable within the scope are also included. For example, the case where the waste material recycling method in which the metal plating layer of the present invention is formed by combining a part or all of the above-described embodiments and modifications is included in the scope of the right of the present invention.
10:対象素地(ABS樹脂)、10a:金属めっき施工物、11:銅とニッケルのめっき、12:ニッケル下地めっき、13:クロムめっき、14:金属化合物 10: object substrate (ABS resin), 10a: metal plating construction, 11: copper and nickel plating, 12: nickel base plating, 13: chromium plating, 14: metal compound
Claims (6)
前記廃材を塩酸で処理して、前記金属めっき層の表面の金属化合物を除去する酸洗工程と、
酸洗処理された前記廃材を、塩化第二鉄液又は塩酸が添加された塩化第二鉄液を用いて前記金属めっき層を溶解させるめっき層除去工程とを有することを特徴とする金属めっき層が形成された廃材の再資源化方法。 A method for recycling waste material in which a metal plating layer is formed on the surface of a metal, ceramic, or plastic substrate,
A pickling process in which the waste material is treated with hydrochloric acid to remove a metal compound on the surface of the metal plating layer;
A metal plating layer characterized by having a plating layer removing step of dissolving the metal plating layer using the ferric chloride solution or the ferric chloride solution to which hydrochloric acid is added to the waste material subjected to the pickling treatment Recycling method for waste materials that have been formed.
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