JP2010219119A - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method capable of efficiently processing a substrate by causing collapsing force of micro-bubbles to sufficiently act to the substrate when the substrate is processed using a liquid containing the micro-bubbles. <P>SOLUTION: The substrate processing apparatus 10 for supplying a liquid to a surface S of a substrate W to process the surface of the substrate includes: a nozzle head device 12 disposed so as to face the surface S of the substrate W; a micro-bubble generating section 20 for supplying a liquid L containing micro-bubbles H to the nozzle head device 12; and an ultrasonic vibrator 30 for collapsing the micro-bubbles H by intermittently emitting an ultrasonic wave, at a timing when the micro-bubbles H can reach the substrate W, to the micro-bubbles H of the liquid L containing the micro-bubbles H and supplied to the surface S of the substrate W from the nozzle head device 12. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus and a substrate processing method, and more particularly, to a substrate processing apparatus and a substrate processing method for processing a substrate using the collapse of microbubbles.

  The substrate processing apparatus performs a cleaning process by supplying a liquid to the substrate in a manufacturing process of a substrate such as a semiconductor wafer or a liquid crystal glass substrate. There is an example in which an ultrasonic nozzle is used when cleaning a conventional substrate. The ultrasonic nozzle includes an ultrasonic vibrator, and the ultrasonic vibrator emits ultrasonic waves to the cleaning liquid discharged from the discharge port to the substrate. As a result, the surface of the substrate is cleaned with the cleaning liquid and cleaned with ultrasonic waves (see Patent Document 1).

JP 2004-79767 A

  However, when the technique described in Patent Document 1 is used to apply ultrasonic waves to the liquid, and microbubbles are mixed in the liquid and the microbubbles are crushed by ultrasonic waves to clean the substrate, Before the microbubbles reached the surface of the substrate, the microbubbles disappeared, and the microbubbles did not reach the surface of the substrate, and a sufficient cleaning effect was not obtained on the surface of the substrate.

  The present invention has been made in view of the above, and an object of the present invention is to allow the crushing force of the microbubbles to sufficiently act on the substrate when processing the substrate using the liquid containing the microbubbles. It is another object of the present invention to provide a substrate processing apparatus and a substrate processing method capable of processing a substrate.

  A substrate processing apparatus of the present invention is a substrate processing apparatus for supplying a liquid to a surface of a substrate to process the surface of the substrate, a nozzle head device disposed facing the surface of the substrate, and a microbubble A microbubble generating unit that generates and supplies a liquid containing the liquid to the nozzle head device, and the microbubbles in the liquid containing the microbubbles supplied from the nozzle head device to the surface of the substrate. On the other hand, an ultrasonic transducer is provided that intermittently irradiates ultrasonic waves at the timing when the microbubbles reach the substrate to crush the microbubbles.

  The substrate processing method of the present invention is a substrate processing method for processing a surface of the substrate by supplying a liquid to the surface of the substrate, wherein a liquid containing microbubbles is generated from a microbubble generating unit, and the substrate A liquid containing the microbubbles is supplied to a nozzle head device disposed so as to face the surface, and the liquid in the liquid containing the microbubbles supplied from the nozzle head device to the surface of the substrate. The ultrasonic transducer is configured to intermittently irradiate ultrasonic waves to the microbubbles at a timing when the microbubbles reach the substrate to crush the microbubbles.

  ADVANTAGE OF THE INVENTION According to this invention, when processing a board | substrate using the liquid containing a microbubble, the crushing force of a microbubble can fully be acted on a board | substrate, and the substrate processing apparatus and substrate processing which can perform a substrate processing effectively A method can be provided.

It is a figure which shows preferable embodiment of the substrate processing apparatus of this invention. The figure which shows the example of washing | cleaning operation | movement of the board | substrate by the substrate processing apparatus shown in FIG. It is a figure which expands and shows the structure of a nozzle head apparatus. It is a figure which shows the example of a relationship between the supply flow rate of the liquid (bubble water) containing a microbubble, and the switch frequency of an ultrasonic transducer | vibrator.

  Embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows a preferred embodiment of the substrate processing apparatus of the present invention.

  The substrate processing apparatus 10 shown in FIG. 1 supplies the liquid L containing the microbubble H with respect to the surface S of the board | substrate (it is also called a workpiece | work) W which is a process target as an example, and cleans the surface S of the board | substrate W. It is applied as a device that performs processing. The substrate W is, for example, a semiconductor wafer, and a device having miniaturized electrical wiring is formed on the surface S of the semiconductor wafer, for example.

  The substrate processing apparatus 10 shown in FIG. 1 is used as a cleaning apparatus that removes particles adhering to the surface S of the substrate W as an example, and the substrate holding unit 11, the nozzle head apparatus 12, and the movement operation of the nozzle head apparatus. A section 13, a fan 14 with a filter for downflow, a cup 15, a processing chamber 16, and a microbubble generator 20.

  The substrate holding unit 11 shown in FIG. 1 includes a base member 17, a rotating shaft 18, and a motor 19, and the substrate W is detachably fixed on the base member 17. In the processing chamber 16, a cup 15, a base member 17, and a rotating shaft 18 of a motor 19 are accommodated. A base member 17 is fixed to the tip of the rotating shaft 18.

  The base member 17 and the substrate W can be continuously rotated in the R direction by the motor 19 operating according to a command from the control unit 100. The fan 14 operates according to a command from the control unit 100. The movement operation unit 13 of the nozzle head device can move the nozzle head device 12 along the X direction (radial direction of the substrate) and the Z direction (vertical direction) according to a command from the control unit 100.

  Next, the microbubble generator 20 shown in FIG. 1 will be described.

A microbubble generator 20 shown in FIG. 1 includes a microbubble generator 21, a liquid supply unit 22, and a gas supply unit 23. The liquid supply unit 22 and the gas supply unit 23 are connected to the microbubble generation unit 21 via valves 22B and 23B, respectively. The liquid supply unit 22 supplies a liquid such as pure water to the microbubble generation unit 21, and the gas supply unit 23 supplies a gas such as an inert gas such as N ₂ gas to the microbubble generation unit 21. . The opening / closing control of the valves 22B and 23B is performed according to a command from the control unit 100.

  Thereby, in the microbubble production | generation part 21, the liquid L containing many microbubbles H is produced | generated from gas and a liquid, and it supplies to the nozzle head apparatus 12 side. The micro bubbles H are, for example, micro nano bubbles or nano bubbles.

  The microbubble generator 21 is connected to the nozzle head device 12 via a pipe 24 and a valve 25. The opening / closing operation of the valve 25 is performed according to a command from the control unit 100.

  For example, the microbubble generating unit 21 may be a pressurizing apparatus that causes gas to pass through the filter to include microbubbles in the liquid by pressurization, or microbubbles in the liquid using a shearing force by rotating the liquid and the gas. A swiveling device that generates can be used.

  The nozzle head device 12 shown in FIG. 1 includes an ultrasonic transducer 30. The ultrasonic transducer 30 is electrically connected to the ultrasonic oscillator 31, and the ultrasonic oscillator 31 is electrically connected to the control unit 100. The ultrasonic oscillator 31 obtains the oscillation frequency information from the control unit 100, sends a drive signal to the ultrasonic transducer 30, vibrates the ultrasonic transducer 30 at the oscillation frequency, and causes the nozzle head device 12 to move. Ultrasonic vibration is applied to the microbubbles H in the liquid L including the microbubbles H that pass therethrough.

  FIG. 2 shows an example of the structure of the nozzle head device 12 shown in FIG. 2A shows an example of a state in which the nozzle head device 12 is raised along the Z1 direction and separated from the surface S of the substrate W, and FIG. 2B shows the nozzle head device 12 lowered along the Z2 direction. The example of the state which brought it close to the surface S of the board | substrate W is shown.

  As shown in FIG. 2, the nozzle head device 12 includes a main body portion 32 and a discharge port portion 33 disposed at a lower portion of the main body portion 32. The main body 32 has liquid passages 34 and 35. The liquid passage 34 is formed in the X direction, the liquid passage 35 is formed in the Z direction, and the liquid passages 34 and 35 form a substantially L-shaped passage.

  The liquid passage 34 is connected to the microbubble generator 21 via the pipe 24 and the valve 25, and the liquid L containing the microbubbles H is supplied to the liquid passage 34 by opening the valve 25. The discharge port portion 33 is fixed to the lower portion of the main body portion 32, and the discharge port portion 33 has a liquid passage 36 having the same inner diameter as the liquid passage 35. In the example of FIG. 2, the inner diameter of the liquid passage 34 is smaller than the inner diameter of the liquid passage 35, but is not particularly limited thereto.

  As shown in FIG. 2, the main body portion 32 of the nozzle head device 12 includes an ultrasonic transducer 30. The ultrasonic transducer 30 is disposed above the liquid passage 35 and applies ultrasonic vibration to the microbubbles H in the liquid L including a large number of microbubbles H passing through the liquid passage 35.

  Here, with reference to FIG. 2, the structural example of the movement operation part 13 of a nozzle head apparatus is demonstrated.

  The movement operation unit 13 of the nozzle head device shown in FIG. 2 can position the nozzle head device 12 by moving it in the X direction and the Z direction.

  The movement operation unit 13 of the nozzle head device includes a column 40, an X direction movement unit 41, and a Z direction movement unit 42. The column 40 is arranged upright in the Z direction, an X direction moving part 41 is arranged at the lower part of the column 40, and a Z direction moving part 42 is arranged at the side of the column 40.

  The X direction moving unit 41 includes a slider 44, a motor 45, a feed screw 46, a guide member 47, and a holding unit 48. The slider 44 is fixed to the lower end portion of the column 40. The guide member 47 is fixed to the base portion 48, and the motor 45 and the holding portion 48 are fixed to the guide member 47. An output shaft of the motor 45 is connected to a feed screw 46, and an end portion of the feed screw 46 is rotatably held by a holding portion 48. The nut of the slider 44 is engaged with the feed screw 46. As a result, the motor 45 is actuated by a command from the controller 100 and the feed screw 46 rotates forward and backward, so that the unit of the slider 44 and the column 40 can be moved and positioned along the X direction by the guide member 47. It is.

  The Z-direction moving unit 42 includes a slider 54, a motor 55, a feed screw 56, a guide member 57, and a holding unit 58. The guide member 57 is fixed to the side surface of the column 40, and the motor 55 and the holding portion 58 are fixed to the guide member 57. The slider 54 fixes the nozzle head device 12, and the nozzle head device 12 faces in the X direction. An output shaft of the motor 55 is connected to a feed screw 56, and an end portion of the feed screw 56 is rotatably held by a holding portion 58. The nut of the slider 54 meshes with the feed screw 56. As a result, the motor 55 is actuated by a command from the control unit 100 and the feed screw 56 rotates forward and backward, whereby the slider 54 and the unit of the nozzle head device 12 are moved along the Z direction by the guide member 57. Positioning is possible.

  As described above, the nozzle head device 12 can be positioned by moving along the X direction and the Z direction.

  Next, a cleaning method for cleaning the surface S of the substrate W, for example, using the substrate processing apparatus 10 described above will be described with reference to FIGS.

Liquid supply unit shown in FIG. 1 22, for example a liquid such as pure water is supplied to the microbubble generator 21, the gas supply unit 23, for example, N ₂ gas microbubbles generation unit, such as an inert gas such as a gas 21. Thereby, in the microbubble production | generation part 21, the produced | generated many microbubbles H are included in the liquid L, the liquid L containing many microbubbles H is produced | generated from gas and a liquid, and a nozzle head apparatus 12 side can be supplied.

  On the other hand, when the motor 45 shown in FIG. 2 operates according to a command from the control unit 100 and the feed screw 46 rotates forward and backward, the unit of the slider 44 and the column 40 moves along the X direction by the guide member 47. When the motor 55 is operated according to a command from the control unit 100 and the feed screw 56 rotates forward and backward, the unit of the slider 54 and the nozzle head device 12 is moved along the Z direction by the guide member 57. Position.

  As a result, the nozzle head device 12 is positioned on the surface S of the substrate W as illustrated in FIG. 2A or 2B. In this case, the distance C (indicated by C1) between the discharge port portion 33 and the surface S of the substrate W in the example of FIG. 2A is equal to the discharge port portion 33 and the substrate in the example shown in FIG. It is larger than the distance C (indicated by C2) between the surface S of W. When the nozzle head device 12 is positioned, the liquid L containing the microbubbles H is continuously supplied from the microbubble generating unit 21 to the nozzle head device 12.

  Next, the reason why ultrasonic waves are intermittently applied to the microbubbles H in the liquid L will be described with reference to FIG.

  In the embodiment of the present invention, the substrate W is processed using the impact force of the collapsed microbubbles by applying ultrasonic vibrations to the microbubbles to be crushed. At this time, ultrasonic waves are intermittently applied to the liquid L containing microbubbles. The range irradiated with the ultrasonic wave is a region from the discharge port portion 33 in FIG. 2 to the surface of the substrate W.

  Assume that the time is stopped and the state is stopped in the state shown in FIG. When the ultrasonic wave is irradiated, the ultrasonic wave is applied to the entire liquid L filled below the ultrasonic transducer 30, and the microbubbles H in the liquid L are in an environment where they are crushed by the ultrasonic wave. It will be exposed to. At this time, a part of the liquid L below the ultrasonic transducer 30 is in contact with the substrate W, but the microbubbles H contained in the liquid L in contact with the substrate W are also crushed, and the substrate W is treated (this In the example, it works effectively on cleaning).

  Next, when the microbubbles H are crushed, most of the microbubbles in the liquid L located below the liquid L in contact with the lower surface of the ultrasonic transducer 30 have already been crushed. The number of bubbles is extremely reduced compared with that before ultrasonic irradiation. When the state is advanced here, since the liquid L just in contact with the lower surface of the ultrasonic transducer 30 reaches the substrate W, the micro bubbles in the liquid L have already been crushed. The crushing action cannot be expected and does not contribute to the treatment of the surface of the substrate W. For this reason, for example, in a time zone in which the liquid L just in contact with the lower surface of the ultrasonic transducer 30 has reached the substrate W, the application of ultrasonic vibration to the liquid L is stopped, so The microbubbles H are supplied to the surface of the substrate W so as not to crush the microbubbles H in the liquid L filled below the sonic transducer 30. And the process of the board | substrate W can be advanced by giving an ultrasonic vibration again and crushing this micro bubble H on the surface of the board | substrate W. FIG.

  Further, the reason why the ultrasonic waves are intermittently applied to the microbubbles H in the liquid L will be described. When the liquid L containing the microbubbles H is irradiated with ultrasonic waves, the microbubbles H existing in the ultrasonic irradiation range are crushed (ruptured). When the microbubbles H reaching the surface of the substrate W are crushed within the ultrasonic irradiation range, the surface of the substrate W can be processed by the crushing force of the microbubbles H. However, other microbubbles H that are not in contact with the substrate W are also crushed and disappear in the same manner within the ultrasonic irradiation range. The liquid L containing the microbubbles H is continuously flowing between the ultrasonic transducer 30 and the substrate W, and the liquid L that has already been crushed by the ultrasonic waves and does not have the microbubbles H is present on the surface of the substrate W. Will be supplied.

  Therefore, even if only the microbubbles H that are in contact with the surface of the substrate W within the ultrasonic irradiation range are crushed, the time that the surface of the substrate W can be processed with the crushing force is very short. The surface is processed only slightly.

  Therefore, once the ultrasonic irradiation is stopped and the liquid L containing the microbubbles H is filled between the surface of the ultrasonic transducer 30 and the substrate W, for example, the ultrasonic irradiation is resumed and the ultrasonic vibration is resumed. The liquid L containing the microbubbles H between the child 30 and the surface of the substrate W is irradiated with ultrasonic waves, and the microbubbles H existing in the ultrasonic irradiation range are crushed to reach the surface of the substrate W. The microbubbles H are crushed and the surface of the substrate W is processed by the crushing force of the microbubbles H.

  In this way, the irradiation operation of irradiating the ultrasonic wave to the liquid L containing microbubbles and the stop operation of stopping the irradiation of the ultrasonic wave are repeated, and the ultrasonic wave is intermittently irradiated, whereby the liquid L The microbubbles H can reach the surface of the substrate W one after another and be crushed. Accordingly, since the microbubbles H reach the surface of the substrate W one after another and are crushed, the surface treatment efficiency of the substrate W can be improved.

  Next, a specific example in which ultrasonic vibration is intermittently applied will be described.

  Here, referring to FIG. 3, FIG. 3 is an enlarged view showing the nozzle head device 12 and the ultrasonic transducer 30.

In the example shown in FIG. 3, the water supply amount of the liquid L (also referred to as bubble water) containing the microbubbles H is indicated by A (mL / sec), the cross-sectional area of the discharge port portion is indicated by B (mm ² ), and the discharge port The distance between the portion 33 and the surface S of the substrate W is indicated by C (mm), and the nozzle internal volume is indicated by D (mL).

The time T required for the liquid L (bubble water) containing the microbubbles H to fill the liquid passages 34 and 35 of the nozzle device 12 and be discharged from the discharge port 33 and reach the surface S of the substrate W is:

T = (BC / 1000 + D) / A

It is.

When the time during which ultrasonic irradiation is performed on the microbubble H is Ton and the time when the ultrasonic irradiation is not performed on the microbubble H is Toff, the ultrasonic transducer 30 is turned on / off intermittently. The frequency F to be turned off is

F = 1 / (Ton + Toff) = 1 / (Ton + (BC / 1000 + D) / A)

It can be expressed.

FIG. 4 shows an example of the relationship between the supply flow rate of a liquid containing microbubbles (bubble water) and the switching frequency (on / off switching frequency) of the ultrasonic vibrator. The ultrasonic vibrator is turned on under the following conditions. The frequency F to be turned off was determined. Here, the water supply amount A of the liquid L containing microbubbles H (also referred to as bubble water) is 10 (mL / sec), 20 (mL / sec), and 30 (mL / sec). The cross-sectional area B of the discharge port is 10 (mm ² ). The distance C between the discharge port portion 33 and the surface S of the substrate W is indicated by 10 (mm), 30 (mm), and 50 (mm), and the time Ton during which ultrasonic irradiation is performed on the microbubbles H is 0.1 seconds.

  In the graph shown in FIG. 4, the vertical axis represents the switch frequency (ON / OFF switching frequency) (Hz) of the ultrasonic transducer, and the horizontal axis represents the water supply amount A of the liquid L containing microbubbles H (also referred to as bubble water). (ML / sec). In FIG. 4, the case where the distance C between the discharge port portion and the surface S of the substrate W is 10 (mm) is indicated by a rhombus, the case of 30 (mm) is indicated by a square, and the case of 50 (mm) is indicated by a triangle. It shows with. As is clear from FIG. 4, as the water supply amount A of the liquid L containing microbubbles H (also referred to as bubble water) increases, the switch frequency of the ultrasonic vibrator is increased (the cycle is shortened). (Bubble) Optimal when supply volume increases. The frequency can be changed depending on the supply amount of the liquid containing microbubbles. The frequency of the ultrasonic wave itself can also be controlled by the supply amount of the liquid containing microbubbles.

  In the example shown in FIG. 2A or the example shown in FIG. 2B, the microbubbles H discharged from the discharge port 33 in a state where the nozzle head device 12 is positioned above the surface S of the substrate W. The control unit 100 sends a drive signal to the ultrasonic transducer 30 at a timing when the microbubbles H in the liquid L containing the liquid L reach the surface S of the substrate W, thereby causing the ultrasonic transducer 30 to move to the oscillation frequency. Then, the ultrasonic vibration HR is applied to the microbubbles H by intermittent vibration. Thereby, in either the example shown in FIG. 2A or the example shown in FIG. 2B, the microbubbles contained in the liquid L that is discharged from the discharge port portion 33 and is in contact with the surface S of the substrate W. Since the collapse K occurs in H, the surface S of the substrate W can be sufficiently cleaned by the collapse K of the microbubbles H.

  In this way, after the microbubbles H in the liquid L containing a large number of microbubbles H have arrived on the surface S of the substrate W, the ultrasonic transducer 30 changes to the microbubbles H in the liquid L containing a large number of microbubbles H. On the other hand, by applying ultrasonic waves intermittently and irradiating the surface S of the substrate W, ultrasonic waves are applied to the microbubbles H, and the ultrasonic waves intermittently irradiate the microbubbles H to generate the microbubbles H. Can be crushed. Therefore, the surface S of the substrate W can be efficiently cleaned by crushing the microbubbles H.

  2B is arranged closer to the surface S of the substrate W than the example shown in FIG. 2A, the microbubbles H are formed on the substrate W. The time required to reach the surface S can be shortened.

  As described above, when the liquid L containing the microbubbles H is supplied to the surface S of the substrate W, the ultrasonic oscillator 31 causes the ultrasonic transducer 30 to vibrate intermittently according to a command from the control unit 100. Ultrasonic waves are applied to the microbubbles H at the timing when the microbubbles H reach the surface S of the substrate W, and the microbubbles H contained in the liquid L ejected from the ejection port portion 33 and in contact with the surface S of the substrate W are provided. Since crushing K occurs, sufficient cleaning ability can be obtained. That is, the microbubbles H in the liquid L can be crushed by resonating with an external stimulus by ultrasonic waves, and the microbubbles H included in the liquid L in contact with the surface S of the substrate W can be crushed. The surface of the substrate can be cleaned.

  The microbubbles H are crushed by the application of ultrasonic waves, and the radicals are promoted to be supplied to the particles in the electric wiring portion that is miniaturized on the substrate W. For this reason, particles in the miniaturized electrical wiring portion adhering to the surface S of the substrate W can be removed from the electrical wiring by the force generated by the collapse of the microbubbles H.

  When the microbubbles H in the liquid L containing the microbubbles H are crushed at a high pressure by ultrasonic waves that are external stimuli, an impact force is generated by releasing energy from the inside of the microbubbles H. The cleaning effect of particles adhering to the miniaturized electrical wiring portion of the surface S can be enhanced.

  A substrate processing apparatus of the present invention is a substrate processing apparatus for processing a surface of a substrate by supplying a liquid to the surface of the substrate, the nozzle head device disposed facing the surface of the substrate, and a liquid containing microbubbles And a microbubble generating unit that supplies the nozzle head device to the nozzle head device and a microbubble in the liquid including the microbubbles supplied from the nozzle head device to the surface of the substrate. And an ultrasonic transducer that intermittently irradiates ultrasonic waves at the arrival timing to crush the microbubbles.

  As a result, when the substrate is processed using the liquid containing the microbubbles, the crushing force of the microbubbles can sufficiently act on the substrate, and the substrate processing can be performed effectively.

  In the substrate processing apparatus of the present invention, the nozzle head device has a liquid passage through which liquid containing microbubbles passes, and the ultrasonic transducer is disposed in the vicinity of the liquid passage of the nozzle head device. Thereby, the ultrasonic transducer can crush the microbubbles by applying ultrasonic vibration to the microbubbles in the liquid discharged from the liquid passage of the nozzle head device.

  The substrate processing apparatus of the present invention includes a moving operation unit that moves the nozzle head device to change the distance between the discharge port of the nozzle head device and the surface of the substrate. As a result, the distance between the nozzle head device and the surface of the substrate can be set as appropriate. By reducing this distance, the time until the microbubbles reach the surface of the substrate can be shortened.

  In the substrate processing apparatus of the present invention, a liquid supply unit that supplies liquid and a gas supply unit that supplies gas are connected to the microbubble generation unit. Thereby, the liquid containing a microbubble can be supplied to a nozzle head apparatus only by supplying a liquid and gas.

  The substrate processing method of the present invention is a substrate processing method for supplying a liquid to the surface of the substrate to process the surface of the substrate, and generates microbubbles with respect to the nozzle head device disposed facing the surface of the substrate. The ultrasonic vibrator reaches the substrate with respect to the microbubbles in the liquid containing the microbubbles supplied from the nozzle head device to the surface of the substrate from the nozzle head device. It is characterized by crushing microbubbles by intermittently irradiating ultrasonic waves at timing. Thereby, when processing a board | substrate using the liquid containing a microbubble, the pressure of a microbubble can be made to fully act on a board | substrate, and a board | substrate process is possible effectively. For example, the surface of the substrate can be cleaned by an impact force when it is crushed.

  Here, the microbubbles are microbubbles including concepts such as microbubbles (MB), micronanobubbles (MNB), and nanobubbles (NB). For example, microbubbles are bubbles having a diameter of 10 μm to several tens of μm, micronano bubbles are bubbles having a diameter of several hundred nm to 10 μm, and nanobubbles are bubbles having a diameter of several hundred nm or less.

  As gas, ozone gas or air can be used instead of nitrogen gas. As the liquid, in addition to pure water, an acidic liquid or an alkaline liquid can be used.

  Furthermore, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the embodiments of the present invention. For example, you may delete some components from all the components shown by embodiment of this invention. Furthermore, you may combine the component covering different embodiment suitably.

  The present invention is not limited to the above-described embodiment, and may be, for example, a transport processing method that performs processing while transporting the substrate as well as processing while rotating the substrate. The microbubble generator may be a filter pressurization type or a swivel type device.

  Further, in the above-described embodiment, the cleaning of the substrate is exemplified as an example of the substrate processing. However, the substrate processing is not limited thereto, and for example, a resist stripping process may be used. This resist stripping process is a process of stripping and removing the resist film from the surface of the metal thin film covering the substrate, and stripping the resist film using the crushing force of microbubbles.

DESCRIPTION OF SYMBOLS 10 Substrate processing apparatus 12 Nozzle head apparatus 13 Nozzle head apparatus movement operation part 20 Micro bubble generation apparatus 21 Micro bubble generation part 22 Liquid supply part 23 Gas supply part 30 Ultrasonic vibrator 33 Discharge port part 34, 35 Liquid passage 41 X Direction moving part 42 Z direction moving part
W Substrate S Surface of substrate H Microbubbles L Liquid containing microbubbles

Claims (5)

A substrate processing apparatus for processing the surface of the substrate by supplying liquid to the surface of the substrate,
A nozzle head device disposed facing the surface of the substrate;
A microbubble generator for generating a liquid containing microbubbles and supplying the liquid to the nozzle head device;
Ultrasonic waves are intermittently applied to the microbubbles in the liquid containing the microbubbles supplied from the nozzle head device to the surface of the substrate at a timing when the microbubbles reach the substrate. An ultrasonic transducer for crushing the microbubbles,
A substrate processing apparatus comprising:   The nozzle head device has a liquid passage through which the liquid containing the microbubbles passes, and the ultrasonic transducer is disposed in the vicinity of the liquid passage of the nozzle head device. 2. The substrate processing apparatus according to 1.   The movement operation part which moves the said nozzle head apparatus and changes the distance between the discharge outlet part of the said nozzle head apparatus and the said surface of the said board | substrate is provided, The movement operation part is provided. Substrate processing equipment.   The substrate processing apparatus according to claim 3, wherein a liquid supply unit that supplies a liquid and a gas supply unit that supplies a gas are connected to the microbubble generation unit. A substrate processing method for processing a surface of the substrate by supplying a liquid to the surface of the substrate,
A liquid containing microbubbles is generated from the microbubble generating unit, and the liquid containing the microbubbles is supplied to the nozzle head device disposed facing the surface of the substrate.
With respect to the microbubbles in the liquid containing the microbubbles supplied from the nozzle head device to the surface of the substrate, an ultrasonic transducer generates ultrasonic waves at a timing when the microbubbles reach the substrate. Substrate processing method, wherein the microbubbles are crushed by intermittent irradiation.

Images