JP2010219072A - Connection terminal for circuit board - Google Patents

Connection terminal for circuit board Download PDF

Info

Publication number
JP2010219072A
JP2010219072A JP2010155846A JP2010155846A JP2010219072A JP 2010219072 A JP2010219072 A JP 2010219072A JP 2010155846 A JP2010155846 A JP 2010155846A JP 2010155846 A JP2010155846 A JP 2010155846A JP 2010219072 A JP2010219072 A JP 2010219072A
Authority
JP
Japan
Prior art keywords
circuit board
terminal
circuit
pin
foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010155846A
Other languages
Japanese (ja)
Other versions
JP4939634B2 (en
Inventor
Tsugio Anpo
次雄 安保
Yoshikatsu Hasegawa
佳克 長谷川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Cable Industries Ltd
Original Assignee
Mitsubishi Cable Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Cable Industries Ltd filed Critical Mitsubishi Cable Industries Ltd
Priority to JP2010155846A priority Critical patent/JP4939634B2/en
Publication of JP2010219072A publication Critical patent/JP2010219072A/en
Application granted granted Critical
Publication of JP4939634B2 publication Critical patent/JP4939634B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connection terminal for a circuit board which is compact, light, and economical, and capable of making connection with an insertion terminal easy and guaranteeing reliable fixing as well. <P>SOLUTION: A receiving terminal 22 is formed by a forming press, a flange part 22b is formed on an upper part of a cylindrical connection part 22a formed in a short cylindrical shape, and a tab 22c is provided on a part of the flange part 22b. The cylindrical connection part 22a is inserted and fixed into a terminal insertion hole 20e arranged on a resin plate 20 with the flange part 22b exposed on a surface, and the tab 22c is superimposed, welded and fixed on a foil circuit 21 on the resin plate 20. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、各種電気回路において使用される受型の回路基板用接続端子に関するものである。   The present invention relates to a receiving terminal for a circuit board used in various electric circuits.

例えば、特許文献1にはプリント基板の接続構造が開示されている。   For example, Patent Document 1 discloses a printed circuit board connection structure.

特開平8−222825号公報JP-A-8-222825

しかし、特許文献1の接続構造は部品点数が多いという問題がある。   However, the connection structure of Patent Document 1 has a problem that the number of parts is large.

本発明の目的は、ピン状端子の挿入端との接続を容易にすると共に確実な固定を保証し、小型軽量で安価な回路基板用接続端子を提供することにある。   An object of the present invention is to provide a circuit board connection terminal that facilitates connection with an insertion end of a pin-shaped terminal and ensures secure fixation, and is small, light, and inexpensive.

上記目的を達成するための本発明に係る回路基板用接続端子は、箔回路のピン孔に樹脂プレートのアンカピンを挿通することにより前記箔回路を前記樹脂プレートの表面に位置決め固定して成る回路基板に設けた端子挿入孔に挿入して使用し、ピン状端子の挿入端を受け入れる受型の接続端子であって、上部周囲にフランジ部を設け該フランジ部により前記端子挿入孔に対し下方向に固定し、下端を前記端子挿入孔内に配置し、前記ピン状端子の挿入端を受け入れる短円筒状の筒状接続部と、前記フランジ部の一部から側方に延出し前記箔回路の一部に重ね、表側に接触した電極と前記回路基板の裏側に設けた溶着用孔部から挿入して前記箔回路に接触した電極とを用いて前記箔回路に溶着した導体接続部とを備えたことを特徴とする。   In order to achieve the above object, a circuit board connection terminal according to the present invention comprises a circuit board formed by positioning and fixing the foil circuit on the surface of the resin plate by inserting an anchor pin of the resin plate into a pin hole of the foil circuit. It is a receiving type connection terminal that is used by inserting into the terminal insertion hole provided in the terminal, and accepts the insertion end of the pin-shaped terminal. A short cylindrical connection part that receives the insertion end of the pin-like terminal, extends from a part of the flange part to the side, and is one side of the foil circuit. And a conductor connecting portion welded to the foil circuit using an electrode in contact with the front side and an electrode in contact with the foil circuit inserted from a welding hole provided on the back side of the circuit board. It is characterized by that.

本発明に係る回路基板用接続端子によれば、ピン状端子の挿入端を受け入れて信頼性のある接続を可能とする。   According to the circuit board connection terminal of the present invention, the insertion end of the pin-shaped terminal is received to enable reliable connection.

ジョイントコネクタを構成する上ケース、回路ユニット、下ケースの分解斜視図である。It is a disassembled perspective view of the upper case, circuit unit, and lower case which comprise a joint connector. 回路基板の平面図である。It is a top view of a circuit board. 回路基板の底面図である。It is a bottom view of a circuit board. 回路基板の一部断面図である。It is a partial cross section figure of a circuit board. 金属箔を2枚重ねた箔回路における回路基板の一部断面図である。It is a partial cross section figure of the circuit board in the foil circuit which piled up two metal foils. 受端子の斜視図である。It is a perspective view of a receiving terminal. 受端子を固定した回路基板を積層した要部断面図である。It is principal part sectional drawing which laminated | stacked the circuit board which fixed the receiving terminal. 挿入端子の斜視図である。It is a perspective view of an insertion terminal. 挿入端の断面図である。It is sectional drawing of an insertion end. 挿入端の製造工程の説明図である。It is explanatory drawing of the manufacturing process of an insertion end. 回路基板、ブロック体の断面図である。It is sectional drawing of a circuit board and a block body. 回路基板の製造工程の説明図である。It is explanatory drawing of the manufacturing process of a circuit board. 受端子をロボットハンドにより保持する工程の説明図である。It is explanatory drawing of the process of hold | maintaining a receiving terminal with a robot hand. 受端子を回路基板に固定する工程の説明図である。It is explanatory drawing of the process of fixing a receiving terminal to a circuit board. 受端子を箔回路に溶着する工程の説明図である。It is explanatory drawing of the process of welding a receiving terminal to a foil circuit.

本発明を図示の実施例に基づいて詳細に説明する。
図1は本発明に係る回路基板用接続端子である受端子を使用するジョイントボックスの分解斜視図であり、上ケース11、回路ユニット12、下ケース13を相互に組み付けることにより、ボックス形状のジョイントボックスが得られる。つまり、上ケース11、下ケース13間に回路ユニット12が収納され、ケース11、13同士が接合されると、回路ユニット12を収容した状態で上ケース11、下ケース13に設けられたロック部14a、14bによりロックされる。
The present invention will be described in detail based on the embodiments shown in the drawings.
FIG. 1 is an exploded perspective view of a joint box using a receiving terminal which is a circuit board connection terminal according to the present invention. By assembling an upper case 11, a circuit unit 12 and a lower case 13 to each other, a box-shaped joint is obtained. A box is obtained. That is, when the circuit unit 12 is accommodated between the upper case 11 and the lower case 13 and the cases 11 and 13 are joined to each other, the lock portions provided in the upper case 11 and the lower case 13 with the circuit unit 12 accommodated. Locked by 14a and 14b.

回路ユニット12の上面には、図示を省略した回路パターンが形成されていると共に、複数個の挿入端子15を取り付けた合成樹脂製のブロック体16が配置されている。ブロック体16は上ケース11に区画された枠部17に嵌合され、ブロック体16上に突出した挿入端子15の平刃端15a、受端15b、ピン端15cなどの接続部が上ケース11の枠部17内に位置し、これらの接続部にヒューズ素子、スイッチ素子或いは他の接続端子を収容したコネクタが装着可能とされている。   A circuit pattern (not shown) is formed on the upper surface of the circuit unit 12, and a synthetic resin block body 16 to which a plurality of insertion terminals 15 are attached is disposed. The block body 16 is fitted to a frame portion 17 partitioned by the upper case 11, and connecting portions such as a flat blade end 15 a, a receiving end 15 b, and a pin end 15 c of the insertion terminal 15 protruding on the block body 16 are formed in the upper case 11. A connector that accommodates a fuse element, a switch element, or other connection terminals can be attached to these connection parts.

また、下ケース13においても枠部18が形成され、図示は省略しているが、回路ユニット12の下面に取り付けられたブロック体16から挿入端子15の接続端が下向きに突出され、下ケース13の下面に同様の素子、コネクタなどが装着可能とされている。   The lower case 13 is also formed with a frame portion 18, which is not shown, but the connecting end of the insertion terminal 15 protrudes downward from the block body 16 attached to the lower surface of the circuit unit 12. Similar elements, connectors, and the like can be mounted on the lower surface of the.

回路ユニット12は例えば5枚の回路基板19が積層され、図2、図3に示すように、各回路基板19は例えば射出成型により成型された合成樹脂製の最大厚み1.5mm程度の樹脂プレート20上に、例えば厚さ120μmの銅箔から成り、積層された回路基板19ごとに異なるように区画されたパターンの箔回路21が載置されている。   For example, five circuit boards 19 are laminated in the circuit unit 12, and as shown in FIGS. 2 and 3, each circuit board 19 is a resin plate made of synthetic resin and having a maximum thickness of about 1.5 mm, for example, formed by injection molding. A foil circuit 21 having a pattern made of, for example, a copper foil having a thickness of 120 μm and partitioned differently for each laminated circuit board 19 is placed on 20.

樹脂プレート20には、図4に示すように複数のアンカピン20aが上方に向けて突出され、箔回路21に設けられたピン孔21aに挿通され、アンカピン20aの上部を熱により押し潰すことにより、箔回路21は樹脂プレート20に位置決め固定されている。   As shown in FIG. 4, a plurality of anchor pins 20 a protrude upward in the resin plate 20, are inserted into pin holes 21 a provided in the foil circuit 21, and the upper portions of the anchor pins 20 a are crushed by heat, The foil circuit 21 is positioned and fixed to the resin plate 20.

なお、電流容量によっては一部の箔回路21は、図5に示すように金属箔を2層又はそれ以上の複数層とされ、高さの高いアンカピン20a’により固定され、樹脂プレート20に穿孔された溶着用孔部20bから溶着電極を挿し込んで、金属箔同士は溶着されている。   Depending on the current capacity, a part of the foil circuit 21 may be formed of two or more layers of metal foil as shown in FIG. 5, fixed by a high anchor pin 20 a ′, and perforated in the resin plate 20. The metal foil is welded by inserting a welding electrode from the welded hole 20b.

樹脂プレート20の複数個所には、図2、図3に示すように積層した樹脂プレート20に共通の円形の端子挿通孔20cが形成され、所定の層の回路基板19の端子挿通孔20cには受端子22が取り付けられている。なお、受端子22は必要な電流容量によって数種類の大きさがあり、それに伴って端子挿通孔20cの径も数種類設けられている。   As shown in FIGS. 2 and 3, circular terminal insertion holes 20c common to the laminated resin plates 20 are formed at a plurality of locations on the resin plate 20. The terminal insertion holes 20c of the circuit board 19 of a predetermined layer are formed in the terminal insertion holes 20c. A receiving terminal 22 is attached. The receiving terminal 22 has several sizes depending on the required current capacity, and several types of diameters of the terminal insertion holes 20c are provided accordingly.

受端子22は例えば肉厚0.2mmの黄銅板から成り、フォーミングプレスにより形成され、図6に示すように短円筒状に形成した筒状接続部22aの上部にフランジ部22bが形成され、更にフランジ部22bの一部にタブ22cが付設されている。なお、筒状接続部22aとフランジ部22bとの境界部は、後述する挿入端子を受け入れるためのテーパ状の案内部22dとされている。   The receiving terminal 22 is made of, for example, a brass plate having a thickness of 0.2 mm, and is formed by a forming press. As shown in FIG. 6, a flange portion 22b is formed on the upper portion of the cylindrical connecting portion 22a formed in a short cylindrical shape. A tab 22c is attached to a part of the flange portion 22b. In addition, the boundary part of the cylindrical connection part 22a and the flange part 22b is made into the taper-shaped guide part 22d for receiving the insertion terminal mentioned later.

図7は5枚の回路基板19を積層し、受端子22を固定した状態の回路ユニット12の要部断面図であり、回路基板19の端子挿通孔20cの中間部の径を受端子22の筒状接続部22aの外径とほぼ同じとし、端子挿通孔20cの上部の周囲は上方に持ち上げられた円環部20dとされ、この円環部20d内に受端子22のフランジ部22bを載置する段部20eが形成され、端子挿通孔20cの下部は筒状接続部22aの下端を拡開するために内径が大きくされている。   FIG. 7 is a cross-sectional view of the main part of the circuit unit 12 in a state where five circuit boards 19 are stacked and the receiving terminals 22 are fixed. The diameter of the intermediate portion of the terminal insertion hole 20c of the circuit board 19 It is assumed that the outer diameter of the cylindrical connection portion 22a is substantially the same, and the periphery of the upper portion of the terminal insertion hole 20c is an annular portion 20d lifted upward, and the flange portion 22b of the receiving terminal 22 is mounted in the annular portion 20d. A stepped portion 20e is formed, and an inner diameter of the lower portion of the terminal insertion hole 20c is increased in order to expand the lower end of the cylindrical connecting portion 22a.

受端子22の筒状接続部22aは端子挿通孔20c内に配置され、筒状接続部22aの下端は端子挿通孔20cの下部にテーパ状にかしめ止めされている。この筒状接続部22aの下端の拡開は、受端子22の回路基板19への固定を主目的としているが、下面方向から挿入端子15を挿し込む場合におけるテーパ状の案内部22eともなっている。また、タブ22cは回路基板19の箔回路21上に溶着により接続されており、この溶着のためにタブ22cの下方の樹脂プレート20には、電極挿通のための溶着用孔部20fが形成されている。   The cylindrical connection portion 22a of the receiving terminal 22 is disposed in the terminal insertion hole 20c, and the lower end of the cylindrical connection portion 22a is caulked and fixed to the lower portion of the terminal insertion hole 20c. The expansion of the lower end of the cylindrical connection portion 22a is mainly intended to fix the receiving terminal 22 to the circuit board 19, but also serves as a tapered guide portion 22e when the insertion terminal 15 is inserted from the lower surface direction. . The tab 22c is connected to the foil circuit 21 of the circuit board 19 by welding, and for this welding, a welding hole 20f for electrode insertion is formed in the resin plate 20 below the tab 22c. ing.

回路基板19の受端子22を取り付けない端子挿通孔20cにおいては、その上部周囲に円環部20gが形成され、端子挿通孔20cに挿入される挿入端子15が箔回路21と接触しないようにされている。なお、回路ユニット12の最上位の回路基板19に設けた円環部20gは、ブロック体16を安定して載置するために、受端子22を取り付ける孔部20cに設けた円環部20dと同じ高さとされている。   In the terminal insertion hole 20c to which the receiving terminal 22 of the circuit board 19 is not attached, an annular portion 20g is formed around the upper portion thereof so that the insertion terminal 15 inserted into the terminal insertion hole 20c does not come into contact with the foil circuit 21. ing. The annular portion 20g provided on the uppermost circuit board 19 of the circuit unit 12 includes an annular portion 20d provided in the hole portion 20c to which the receiving terminal 22 is attached in order to stably place the block body 16. It is the same height.

また図2、図3に示すように、樹脂プレート20の下面側には必要に応じて電線用溝部20hが形成され、この電線用溝部20h内に絶縁塗料が塗布された例えば角型電線23が装着され、角型電線23の両端部は電線用溝部20hの両端に設けられた電線用孔部20iを介して立ち上げられて箔回路21の下面と溶着し、回路設計上樹脂プレート20の表面においては、短絡できない箔回路21のパターン同士をジャンパ線として短絡するようにされている。なお、この角型電線23は電流容量に応じて各種断面積のものが使用されている。   As shown in FIGS. 2 and 3, a wire groove 20h is formed on the lower surface side of the resin plate 20 as necessary, and for example, a rectangular electric wire 23 in which an insulating paint is applied in the wire groove 20h is provided. The both ends of the rectangular electric wire 23 are raised through the wire holes 20i provided at both ends of the wire groove 20h and welded to the lower surface of the foil circuit 21, and the surface of the resin plate 20 is designed for circuit design. In FIG. 2, the patterns of the foil circuits 21 that cannot be short-circuited are short-circuited as jumper wires. In addition, this square-shaped electric wire 23 is used in various cross-sectional areas depending on the current capacity.

上述の回路基板19のアンカピン20aの熱溶融した上端部、円環部20d、受端子22は、上層の樹脂プレート20の下面に形成した凹部に嵌まり込み、積層した回路基板19同士が密着すると共に、水平方向にずれないようにされている。例えば、図3に示す凹部20jは、下層の回路基板19に取り付けた受端子22が嵌まり込む部分である。また、回路基板19の四隅に設けた透孔24は回路基板19を積層する場合の位置合わせ孔である。   The heat-melted upper end portion, the annular portion 20d, and the receiving terminal 22 of the anchor pin 20a of the circuit board 19 are fitted into a recess formed in the lower surface of the upper resin plate 20, and the stacked circuit boards 19 are in close contact with each other. At the same time, it is prevented from shifting in the horizontal direction. For example, the recess 20j shown in FIG. 3 is a portion into which the receiving terminal 22 attached to the lower circuit board 19 is fitted. The through holes 24 provided at the four corners of the circuit board 19 are alignment holes when the circuit boards 19 are stacked.

また、回路基板19に設けられた図2、図3に示す角孔25は、挿入端子15、受端子22では電流容量が足りない場合に、図1に示す大電流用の接続端子26を取り付けるためのものであり、回路ユニット12の最上位の回路基板19のみに設けられている。   2 and 3 provided in the circuit board 19 is attached with the connection terminal 26 for large current shown in FIG. 1 when the insertion terminal 15 and the receiving terminal 22 have insufficient current capacity. This is provided only on the uppermost circuit board 19 of the circuit unit 12.

回路基板19は全ての箔回路21を上に向けて積層するとは限らず、図7においては上層の3層の回路基板19は箔回路21を上に向けて積層し、下層の2層の回路基板19は箔回路21を下に向けて積層されている。この場合においても、3層目と4層目の下面同士を重ねた回路基板19では、図示を省略しているが、ずれないように部分的に嵌合し得るようにされている。   The circuit board 19 is not necessarily laminated with all the foil circuits 21 facing up. In FIG. 7, the upper three-layer circuit board 19 is laminated with the foil circuits 21 facing up, and the lower two-layer circuit. The substrate 19 is laminated with the foil circuit 21 facing downward. Also in this case, the circuit board 19 in which the lower surfaces of the third layer and the fourth layer are overlapped is not shown, but can be partially fitted so as not to be displaced.

図8は受端子22に挿入するための挿入端子15の斜視図を示し、挿入端子15の下部は受端子22の筒状接続部22aに挿入するための図9に示すような断面略四角形のピン状挿入端15dとされ、中間部15eを介して上部は上ケース11上に突出して他の接続端子と接続するための平刃端15aとされている。なお、この平刃端15aは、図1に示す受端15b或いはピン端15cとすることもできる。   FIG. 8 is a perspective view of the insertion terminal 15 for insertion into the receiving terminal 22, and the lower portion of the insertion terminal 15 has a substantially square cross section as shown in FIG. 9 for insertion into the cylindrical connection portion 22 a of the receiving terminal 22. A pin-like insertion end 15d is formed, and an upper portion projects from the upper case 11 through an intermediate portion 15e to form a flat blade end 15a for connection to another connection terminal. The flat blade end 15a may be the receiving end 15b or the pin end 15c shown in FIG.

この挿入端子15は例えば厚み0.3mmの黄銅から成る金属板31を断裁、成形して製造され、挿入端15dは図10の工程に示すように、金属板31を積層しながら鍛造することにより強度を持たせている。つまり、金属板31を(a)に示すように金属板31の長手方向に沿った両側部32、33のように基部34に対して上方に立ち上げると共に、(b)に示すように両側部32、33を内側に曲げ、更に(c)に示すように基部34上に折り畳む。   The insertion terminal 15 is manufactured by cutting and molding a metal plate 31 made of brass having a thickness of 0.3 mm, for example, and the insertion end 15d is formed by forging while laminating the metal plates 31 as shown in the process of FIG. Has strength. That is, the metal plate 31 is raised upward with respect to the base 34 like both side portions 32 and 33 along the longitudinal direction of the metal plate 31 as shown in (a), and both side portions as shown in (b). 32 and 33 are bent inward, and further folded on the base 34 as shown in FIG.

続いて、(d)に示すように折り畳んだ両側部32、33を基部34と共に立ち上げて、両側部32、33同士を密着させ、四方から機械的に圧縮して図9に示すような断面形状とする。なお図10(d)に示すように、基部34を下方に稍々膨らんだ形状のままとしてもよい。   Subsequently, as shown in FIG. 9 (d), the folded side portions 32 and 33 are raised together with the base portion 34, the both side portions 32 and 33 are brought into close contact with each other, and mechanically compressed from four sides, as shown in FIG. Shape. In addition, as shown in FIG.10 (d), it is good also as the shape where the base part 34 swelled below frequently.

この挿入端15dによれば、板厚の薄い金属板31を折り曲げ、空洞部がなく上下方向に幅のある断面略四角形の棒状に形成しているので、金属板31の板厚が薄い場合でも、金属板31の厚みと比較して一辺の厚みが十分に大きい挿入端15dを得ることができ、挿入端15dが弯曲したり或いは折損することが少ない。また、上部の平刃端15aも金属板31を二重に折り畳んで厚みを持たせている。   According to the insertion end 15d, the thin metal plate 31 is bent and formed into a bar shape having a substantially rectangular cross section having no cavity and having a width in the vertical direction. Therefore, even when the metal plate 31 is thin. The insertion end 15d having a sufficiently large thickness on one side compared to the thickness of the metal plate 31 can be obtained, and the insertion end 15d is less likely to be bent or broken. The upper flat blade end 15a is also thickened by folding the metal plate 31 twice.

更に、受端子22への挿入時にクリック感を得るためと、接続を良好とするために、挿入端15dに複数の段部を形成してもよい。また、これらの挿入端15dは受端子22の大きさに合わせて数種類用意されている。   Further, a plurality of step portions may be formed on the insertion end 15d in order to obtain a click feeling when inserted into the receiving terminal 22 and to improve the connection. Also, several types of these insertion ends 15d are prepared according to the size of the receiving terminal 22.

合成樹脂材によるブロック体16に設けられた挿通孔には、幾つかの挿入端子15の中間部15eが挿し込まれて固定され、図1に示すように、挿入端15dはまとめて回路基板19に挿入されている。なお、挿入端子15の中間部15eには、挿通孔に固定するための図示しない爪部が設けられている。   Intermediate portions 15e of several insertion terminals 15 are inserted and fixed in insertion holes provided in the block body 16 made of a synthetic resin material, and the insertion ends 15d are collectively connected to the circuit board 19 as shown in FIG. Has been inserted. The intermediate portion 15e of the insertion terminal 15 is provided with a claw portion (not shown) for fixing to the insertion hole.

図11に示すように、ブロック体16の底部には単数又は複数の下方を向くアンカピン16aが一体に形成されており、箔回路21に設けられたピン孔21b、各樹脂プレート20に共通に設けられたピン孔20kに挿通され、最下層の回路基板19から下方に突出したアンカピン16aの下端を溶融して押し潰すことにより、ブロック体16を回路ユニット12に固定すると共に、回路基板19の積層体同士を分離不能に固定している。   As shown in FIG. 11, one or a plurality of downwardly facing anchor pins 16 a are integrally formed at the bottom of the block body 16, and are provided in common to the pin holes 21 b provided in the foil circuit 21 and the resin plates 20. The block body 16 is fixed to the circuit unit 12 by melting and crushing the lower end of the anchor pin 16a that is inserted into the pin hole 20k and protrudes downward from the lowermost circuit board 19, and the circuit board 19 is laminated. The body is fixed inseparably.

図12は回路基板19の製造工程の説明図である。箔回路21の母材である銅箔41はローラ42にコイル状に巻回されており、予め銅箔41に形成されたパイロット孔を基に、送りローラ43により間欠的に繰り出される。銅箔41は孔あけプレス工程に搬送され、孔あけプレス44により複数の所定位置にピン孔21a、21bが穿孔され、樹脂プレート20との積層工程に移送される。なお、銅箔41に設けるピン孔21aは箔回路21を樹脂プレート20に固定するものであるので、樹脂プレート20上に残り、箔回路21となるべき部分に設けられる。   FIG. 12 is an explanatory diagram of the manufacturing process of the circuit board 19. A copper foil 41 as a base material of the foil circuit 21 is wound around a roller 42 in a coil shape, and is intermittently fed out by a feed roller 43 based on pilot holes previously formed in the copper foil 41. The copper foil 41 is conveyed to a punching press process, and pin holes 21 a and 21 b are drilled at a plurality of predetermined positions by the punching press 44 and transferred to the stacking process with the resin plate 20. The pin hole 21 a provided in the copper foil 41 is for fixing the foil circuit 21 to the resin plate 20, so that it remains on the resin plate 20 and is provided in a portion to be the foil circuit 21.

一方、樹脂プレート20はストッカ45に積層されており、銅箔41の搬送に同期して1枚ずつ取り出される。樹脂プレート20は合成樹脂膜を射出成形或いは合成樹脂基材をホットプレスすることにより製造され、アンカピン20a、孔部20b、20f、端子挿通孔20c、ピン孔20k、円環部20d、20g、電線用溝部20h、透孔24等が既に形成されている。   On the other hand, the resin plates 20 are stacked on the stocker 45 and are taken out one by one in synchronization with the transport of the copper foil 41. The resin plate 20 is manufactured by injection molding of a synthetic resin film or hot pressing a synthetic resin base material, and includes an anchor pin 20a, holes 20b and 20f, a terminal insertion hole 20c, a pin hole 20k, an annular portion 20d and 20g, and an electric wire. The groove portion 20h, the through hole 24, etc. are already formed.

1枚の樹脂プレート20が積層台46上に載置されると、積層台46は上昇して銅箔41に向けて押し上げられる。樹脂プレート20のアンカピン20aが銅箔41に穿孔されたピン孔21aに入り込むように、撮像カメラ47による画像処理によって積層台46は三次元的に位置制御される。   When one resin plate 20 is placed on the stacking table 46, the stacking table 46 rises and is pushed up toward the copper foil 41. The position of the stacking table 46 is three-dimensionally controlled by image processing by the imaging camera 47 so that the anchor pin 20a of the resin plate 20 enters the pin hole 21a drilled in the copper foil 41.

なお、特に電流容量を要する箔回路21には、前述したように銅箔41を二重に重ねて電気抵抗を少なくするので、上述の工程を2回繰り返し、図示しない工程により、重ねられた銅箔41同士を図5に示したように樹脂プレート20に設けた溶着用孔部20bを用いて溶着する。   In particular, in the foil circuit 21 that requires a current capacity, the copper foil 41 is doubled as described above to reduce the electrical resistance. Therefore, the above process is repeated twice, and the stacked copper is repeated by a process (not shown). The foils 41 are welded together using the welding hole 20b provided in the resin plate 20 as shown in FIG.

アンカピン20aをピン孔21aに挿入して銅箔41を樹脂プレート20上に重ねた後に、積層台46の上方に位置する熱プレス48を降下し、アンカピン20aの頂部を熱により押し潰し、銅箔41が樹脂プレート20から剥離しないようにする。なお、位置合わせに伴って、ブロック体16のアンカピン16aを挿通する銅箔41のピン孔21bは、樹脂プレート20のピン孔20kと一致している。   After the anchor pin 20a is inserted into the pin hole 21a and the copper foil 41 is stacked on the resin plate 20, the hot press 48 positioned above the stacking base 46 is lowered, and the top of the anchor pin 20a is crushed by heat, and the copper foil 41 is prevented from peeling from the resin plate 20. In addition, the pin hole 21b of the copper foil 41 which penetrates the anchor pin 16a of the block body 16 corresponds with the pin hole 20k of the resin plate 20 with alignment.

続いて、樹脂プレート20と一体となった銅箔41を打ち抜きプレス49に搬送し、画像処理を行いながら銅箔41から箔回路21を打ち抜く。上側の打ち抜きプレス49はビク刃49aを有し、樹脂プレート20を傷付けることなく銅箔41から箔回路21を打ち抜くものであり、ビク刃49aによって箔回路21の回路パターンが打ち抜かれることになる。   Subsequently, the copper foil 41 integrated with the resin plate 20 is conveyed to a punching press 49, and the foil circuit 21 is punched from the copper foil 41 while performing image processing. The upper punching press 49 has a big blade 49a and punches the foil circuit 21 from the copper foil 41 without damaging the resin plate 20. The circuit pattern of the foil circuit 21 is punched by the big blade 49a.

更に、樹脂プレート20と共に銅箔41を搬送し、箔回路21で使用されない残材の銅箔41は、樹脂プレート20から剥離された後に残材処理刃50により細断され、残材ボックス51内に投棄される。一方、箔回路21を表面に一体に固定した樹脂プレート20は、回路基板19として所定方向に搬出され、ストッカ52内に積層される。   Further, the copper foil 41 is transported together with the resin plate 20, and the remaining copper foil 41 that is not used in the foil circuit 21 is peeled off from the resin plate 20 and then chopped by the remaining material processing blade 50, and is left in the remaining material box 51. Dumped. On the other hand, the resin plate 20 on which the foil circuit 21 is integrally fixed to the surface is carried out in a predetermined direction as the circuit board 19 and stacked in the stocker 52.

図13〜図15は回路基板19に受端子22を固定する工程の説明図であり、パーツフィーダにより整列して供給される受端子22を図13に示すように、ロボットハンド61により撮像カメラ62により画像処理を行いながら保持して、回路基板19の必要個所に運搬する。ロボットハンド61には筒部63に対して吊り上げピン64が上下動自在に設けられており、この吊り上げピン64を受端子22の筒状接続部22aに挿入し、摩擦抵抗により受端子22を持ち上げ、受端子22のタブ22cが箔回路21上に載置されるように、画像処理により位置調整しながら受端子22を樹脂プレート20の端子挿通孔20cに挿入する。   FIG. 13 to FIG. 15 are explanatory views of a process of fixing the receiving terminal 22 to the circuit board 19. The receiving terminal 22 arranged and supplied by the parts feeder is picked up by an imaging camera 62 by a robot hand 61 as shown in FIG. Is held while performing image processing, and is transported to a necessary portion of the circuit board 19. The robot hand 61 is provided with a lifting pin 64 that can move up and down with respect to the cylindrical portion 63. The lifting pin 64 is inserted into the cylindrical connecting portion 22a of the receiving terminal 22, and the receiving terminal 22 is lifted by frictional resistance. The receiving terminal 22 is inserted into the terminal insertion hole 20 c of the resin plate 20 while adjusting the position by image processing so that the tab 22 c of the receiving terminal 22 is placed on the foil circuit 21.

筒部63により受端子22を樹脂プレート20の段部20e上に押し付けたまま、吊り上げピン64を図14に示すように上方に持ち上げ、続いて下方から先端を円錐状としたプレスピン65を持ち上げて、筒状接続部22aの下部を押し拡げ、受端子22を端子挿通孔20cの下部にかしめ止めする。   While the receiving terminal 22 is pressed onto the step portion 20e of the resin plate 20 by the cylindrical portion 63, the lifting pin 64 is lifted upward as shown in FIG. 14, and then the press pin 65 having a conical tip is lifted from below. Then, the lower part of the cylindrical connection part 22a is pushed and expanded, and the receiving terminal 22 is caulked to the lower part of the terminal insertion hole 20c.

その後に、図15に示すようにタブ22cを箔回路21に電極66、67を用いて溶着する。電極66、67の先端はそれぞれ直径1mm前後の細径丸型とされ、上方の電極66はタブ22cに接触し、下方の電極67は箔回路21の下面に溶着用孔部20fを介して接触する。なお、この溶着はロボットハンドにより順次に行うこともできるが、多数本の電極を用いて一括して溶着することもできる。   Thereafter, as shown in FIG. 15, the tab 22 c is welded to the foil circuit 21 using the electrodes 66 and 67. The tips of the electrodes 66 and 67 each have a small round shape with a diameter of about 1 mm, the upper electrode 66 contacts the tab 22c, and the lower electrode 67 contacts the lower surface of the foil circuit 21 via the welding hole 20f. To do. This welding can be performed sequentially by a robot hand, but can also be performed at once using a large number of electrodes.

このようにして製作され、それぞれ回路パターンが異なる複数枚の回路基板19を積層し、図11に示すようにブロック体16を回路基板19の積層体上に載置し、ブロック体16に固定された挿入端子15の挿入端15dを、回路基板19の端子挿通孔20cに挿入すると、挿入端15dは少なくとも何れかの回路基板19に取り付けられた受端子22の筒状接続部22aに挿入される。   A plurality of circuit boards 19 each having a different circuit pattern are laminated, and the block body 16 is placed on the laminated body of the circuit boards 19 and fixed to the block body 16 as shown in FIG. When the insertion end 15 d of the inserted terminal 15 is inserted into the terminal insertion hole 20 c of the circuit board 19, the insertion end 15 d is inserted into the cylindrical connection portion 22 a of the receiving terminal 22 attached to at least one of the circuit boards 19. .

このとき、挿入端15dは断面略四角状とされているので、受端子22の筒状接続部22aに挿入された場合に角部が良好に接触し、挿入端子15は何れかの回路基板19の箔回路21と良好な電気的な接続がなされることになる。また必要に応じて、回路ユニット12の下面側からもブロック体16を装着する。   At this time, since the insertion end 15d has a substantially square cross section, when the insertion end 15d is inserted into the cylindrical connection portion 22a of the receiving terminal 22, the corner is in good contact, and the insertion terminal 15 is connected to any of the circuit boards 19. A good electrical connection with the foil circuit 21 is made. If necessary, the block body 16 is also mounted from the lower surface side of the circuit unit 12.

挿入端15dの挿入と同時に、ブロック体16から突出されたアンカピン16aは回路基板19の積層体のピン孔20kを貫通するので、ピン孔20kから突出した先端を溶融すると回路ユニット12が完成する。   Simultaneously with the insertion of the insertion end 15d, the anchor pin 16a protruding from the block body 16 penetrates the pin hole 20k of the laminated body of the circuit board 19, so that the circuit unit 12 is completed when the tip protruding from the pin hole 20k is melted.

この回路ユニット12を上ケース11、下ケース13により挟み込み、ロック部14a、14bによりケース11、13同士をロックする。上ケース11、下ケース13の表面から突出する挿入端子15の平刃端15a、受端15b、ピン端15cに、上述したように各種素子、コネクタを取り付けることによりジョイントボックスとして機能する。   The circuit unit 12 is sandwiched between the upper case 11 and the lower case 13, and the cases 11 and 13 are locked to each other by the lock portions 14a and 14b. By attaching various elements and connectors to the flat blade end 15a, the receiving end 15b, and the pin end 15c of the insertion terminal 15 protruding from the surfaces of the upper case 11 and the lower case 13, as described above, it functions as a joint box.

11 上ケース
12 回路ユニット
13 下ケース
15 挿入端子
15d 挿入端
16 ブロック体
19 回路基板
20 樹脂プレート
20c 端子挿通孔
21 箔回路
22 受端子
11 upper case 12 circuit unit 13 lower case 15 insertion terminal 15d insertion end 16 block body 19 circuit board 20 resin plate 20c terminal insertion hole 21 foil circuit 22 receiving terminal

Claims (4)

箔回路のピン孔に樹脂プレートのアンカピンを挿通することにより前記箔回路を前記樹脂プレートの表面に位置決め固定して成る回路基板に設けた端子挿入孔に挿入して使用し、ピン状端子の挿入端を受け入れる受型の接続端子であって、上部周囲にフランジ部を設け該フランジ部により前記端子挿入孔に対し下方向に固定し、下端を前記端子挿入孔内に配置し、前記ピン状端子の挿入端を受け入れる短円筒状の筒状接続部と、前記フランジ部の一部から側方に延出し前記箔回路の一部に重ね、表側に接触した電極と前記回路基板の裏側に設けた溶着用孔部から挿入して前記箔回路に接触した電極とを用いて前記箔回路に溶着した導体接続部とを備えたことを特徴とする回路基板用接続端子。   Insert the pin pin into the terminal insertion hole provided on the circuit board that is positioned and fixed on the surface of the resin plate by inserting the anchor pin of the resin plate into the pin hole of the foil circuit. A receiving-type connection terminal for receiving an end, wherein a flange portion is provided around an upper portion and fixed downward with respect to the terminal insertion hole by the flange portion, and a lower end is disposed in the terminal insertion hole, and the pin-shaped terminal A cylindrical connecting portion having a short cylindrical shape for receiving the insertion end of the first and second electrodes, extending from a portion of the flange portion to the side, overlapping with a portion of the foil circuit, and provided on the back side of the circuit board and an electrode in contact with the front side A circuit board connection terminal comprising: a conductor connection portion welded to the foil circuit using an electrode inserted from the welding hole portion and brought into contact with the foil circuit. 前記筒状接続部と前記フランジ部との境界部はテーパ状とし、前記ピン状端子の挿入端の案内部としたことを特徴とする請求項1に記載の回路基板用接続端子。   2. The circuit board connection terminal according to claim 1, wherein a boundary portion between the cylindrical connection portion and the flange portion is tapered to serve as a guide portion of an insertion end of the pin-shaped terminal. 前記導体接続部はタブとし、該タブを前記箔回路に溶着したことを特徴とする請求項1又は2に記載の回路基板用接続端子。   The circuit board connection terminal according to claim 1, wherein the conductor connection portion is a tab, and the tab is welded to the foil circuit. 前記筒状接続部の下端を拡開して前記回路基板にかしめ止めしたことを特徴とする請求項1〜3の何れか1項に記載の回路基板用接続端子。   The circuit board connection terminal according to any one of claims 1 to 3, wherein a lower end of the cylindrical connection portion is expanded and caulked to the circuit board.
JP2010155846A 2010-07-08 2010-07-08 Circuit board connection terminals Expired - Fee Related JP4939634B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010155846A JP4939634B2 (en) 2010-07-08 2010-07-08 Circuit board connection terminals

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010155846A JP4939634B2 (en) 2010-07-08 2010-07-08 Circuit board connection terminals

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2004105998A Division JP4578843B2 (en) 2004-03-31 2004-03-31 Circuit board connection terminals

Publications (2)

Publication Number Publication Date
JP2010219072A true JP2010219072A (en) 2010-09-30
JP4939634B2 JP4939634B2 (en) 2012-05-30

Family

ID=42977635

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010155846A Expired - Fee Related JP4939634B2 (en) 2010-07-08 2010-07-08 Circuit board connection terminals

Country Status (1)

Country Link
JP (1) JP4939634B2 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56117472A (en) * 1980-02-20 1981-09-14 Ricoh Co Ltd Facsimile device
JPH0496392A (en) * 1990-08-14 1992-03-27 Nec Corp Mounting method for electric component and eyeletused therefor
JPH05110246A (en) * 1991-10-15 1993-04-30 Sumitomo Wiring Syst Ltd Connecting method of flat type conductor wiring board and mounting method of electrode terminal
JPH08222825A (en) * 1995-02-13 1996-08-30 Nec Corp Connecting structure of printed board
JPH0917527A (en) * 1995-06-30 1997-01-17 Nippon Seiki Co Ltd Electrical connection device
JP2005293975A (en) * 2004-03-31 2005-10-20 Ryosei Electro-Circuit Systems Ltd Connection terminal

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56117472A (en) * 1980-02-20 1981-09-14 Ricoh Co Ltd Facsimile device
JPH0496392A (en) * 1990-08-14 1992-03-27 Nec Corp Mounting method for electric component and eyeletused therefor
JPH05110246A (en) * 1991-10-15 1993-04-30 Sumitomo Wiring Syst Ltd Connecting method of flat type conductor wiring board and mounting method of electrode terminal
JPH08222825A (en) * 1995-02-13 1996-08-30 Nec Corp Connecting structure of printed board
JPH0917527A (en) * 1995-06-30 1997-01-17 Nippon Seiki Co Ltd Electrical connection device
JP2005293975A (en) * 2004-03-31 2005-10-20 Ryosei Electro-Circuit Systems Ltd Connection terminal

Also Published As

Publication number Publication date
JP4939634B2 (en) 2012-05-30

Similar Documents

Publication Publication Date Title
JP4719759B2 (en) Circuit board manufacturing method
JP6966046B2 (en) FPCB assembly for battery module, its manufacturing method and battery module including it
US9961780B2 (en) Method for manufacturing resin multilayer board
JP2009076610A (en) Magnetic component
US20190348214A1 (en) Multilayer coil component
WO2013005576A1 (en) Wiring board
JP4939634B2 (en) Circuit board connection terminals
JP4578843B2 (en) Circuit board connection terminals
US20110266043A1 (en) Substrate
JP2012230954A (en) Printed wiring board and printed wiring board manufacturing method
TW200948239A (en) A printed circuit board having an embedded component and a method thereof
JP3303801B2 (en) Circuit board, electrical junction box provided with the circuit board, and method of manufacturing circuit board
JP5601828B2 (en) Printed wiring board laminate and manufacturing method thereof
JP2011034876A (en) Connection structure between flat board and connection terminal and its connection method
JP4097187B2 (en) Connector and its mounting structure
JP2009231649A (en) Wiring substrate and production method
JP2015104280A (en) Joint box
KR20110033932A (en) Circuit structure, joint box, and method for manufacturing circuit structure
JP2007166743A (en) Electric connection box
JP2019003775A (en) Flexible flat cable and manufacturing method therefor
JP2006134920A (en) Lamination components and packaging structure thereof
JP2001044592A (en) Resin-molded board
JP2004159432A (en) Electrical junction box with built-in electronic part
JPH11214220A (en) Inductor array

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100714

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20111212

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120104

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120130

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120214

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120224

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150302

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4939634

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150302

Year of fee payment: 3

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150302

Year of fee payment: 3

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees