JP2006134920A - Lamination components and packaging structure thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide lamination components which can reduce the packaging height from the lower surface of a printed circuit board to the height of the lamination components and the packaging structure of the lamination components, even when insulation is required on the lower surface of the printed circuit substrate. <P>SOLUTION: The project 1a of the center part of the lamination 1 of the lamination component 10 is dropped into the hole 5 of the printed circuit board 4, the electrode 2 formed in both the ends of the lamination 1 and on its front surface is laid in the printed circuit board 4, and the electrode 2 and the printed circuit board 4 are connected electrically and mechanically by a solder 6. Since the project 1a of the lamination 1 is dropped into the hole 5 of the printed circuit board 4, the packaging height from the lower surfaced 4 of the printed circuit board becomes 1 mm in thickness of the lamination components 10 (lamination 1), and the flat structure can be achieved. Since the electrode is not exposed from the lower surface of the printed circuit board 4, the insulation of the lower surface of the printed circuit board 4 can be assured. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a laminated part having a laminated body in which a plurality of magnetic bodies or dielectric sheets having wiring patterns formed thereon, and electrodes that are formed at both ends of the laminated body and are electrically connected to a printed board, and The present invention relates to a mounting structure for mounting a laminated component on a printed circuit board.

  There is known a multilayer component that achieves an inductor function or a capacitor function by a multilayer body in which a plurality of magnetic bodies or dielectric sheets in which a wiring pattern is formed is laminated so as to reduce the size of the inductor or the capacitor (for example, Patent Documents) 1). FIG. 9 is a perspective view showing a configuration of a conventional laminated component. A conventional laminated component 20 includes a laminated body 21 formed by laminating a plurality of magnetic bodies or dielectric sheets having a wiring pattern, and electrodes 22 formed on the surfaces of both end portions in the longitudinal direction of the laminated body 21. Have.

Such a laminated component 20 is mounted on a printed circuit board by a method similar to the method for mounting surface-mounted components (chip components) disclosed in Patent Document 2, for example. FIG. 10 is a cross-sectional view showing a conventional structure for mounting the laminated component 20 on the printed circuit board 24. The multilayer component 20 is placed on the upper surface of the printed circuit board 24, and the electrodes 22 at both ends of the multilayer component 20 are electrically connected to the electrodes of the printed circuit board 24 through the solder 26. Is implemented.
JP 2002-75780 A JP-A-8-148798

  In the mounting structure as shown in FIG. 10, since the laminated component 20 is mounted on the printed circuit board 24 and mounted, the mounting height from the lower surface of the printed circuit board 24 is increased, and particularly when the thickness is required to be reduced. There is a problem that it is not suitable. For example, when the thickness of the laminated component 20 is 1 mm and the thickness of the printed circuit board 24 is 0.5 mm, the mounting height is 1.5 mm. If the thickness of the multilayer component 20 is reduced, the mounting height is reduced. However, if the thickness is reduced, the inductor function or the capacitor function cannot be sufficiently performed, and the function deterioration becomes a problem.

  Therefore, a mounting structure as shown in FIG. 11 is conceivable. In the conventional example shown in FIG. 11, a hole 25 is formed in the printed circuit board 24, the laminated component 20 is dropped into the hole 25, and the electrodes 22 at both ends thereof are electrically connected to the electrodes of the printed circuit board 24 with a conductive adhesive. As a result, the laminated component 20 is mounted on the printed circuit board 24. In this example, the mounting height from the lower surface of the printed circuit board 24 is the same (1 mm) as the thickness (1 mm) of the laminated component 20, and a reduction in height is realized compared to the example shown in FIG.

  However, since the electrode 22 of the laminated component 20 is exposed from the lower surface of the printed circuit board 24, there is a problem that it cannot be applied when insulation on the lower surface of the printed circuit board 24 is required. In addition, since the electrode 22 and the printed circuit board 24 are separated from each other, there is a problem that easy mounting using solder cannot be performed.

  The present invention has been made in view of such circumstances, and the mounting height from the bottom surface of the printed circuit board can be reduced to the height of the laminated component even when insulation is required on the bottom surface of the printed circuit board. An object of the present invention is to provide a laminated part and a mounting structure of the laminated part.

  Another object of the present invention is to provide a multilayer component and a multilayer component mounting structure that can be easily mounted by a solder reflow process.

  A first laminated component according to the present invention is a laminated component having a laminated body in which a plurality of magnetic bodies or dielectric sheets having a wiring pattern are laminated, and electrodes formed at both ends of the laminated body. The electrode and the stacked body of the electrode forming portion are partially missing in the stacking direction.

  A second laminated component according to the present invention is a laminated component comprising a laminated body in which a plurality of magnetic bodies or dielectric sheets having a wiring pattern are laminated, and electrodes formed at both ends of the laminated body. The electrode is partially missing in the stacking direction.

  The mounting structure of the first multilayer component according to the present invention using the first multilayer component is a mounting structure in which the first multilayer component is mounted on a printed circuit board. In the hole formed in the printed circuit board, The convex part of the said laminated body formed by the defect | deletion part of the said laminated body is put, and the said electrode located on the said printed circuit board is electrically connected with the said printed circuit board.

  The mounting structure of the second multilayer component according to the present invention using the first multilayer component is a mounting structure in which the first multilayer component is mounted on a printed board, and the hole is formed in the hole formed in the printed board. A laminated part is inserted, and the electrode is electrically connected to the printed board.

  A mounting structure of a third laminated component according to the present invention using the second laminated component is a mounting structure in which the second laminated component is mounted on a printed board, and the hole is formed in the hole formed in the printed board. A laminated part is inserted, and the electrode is electrically connected to the printed board.

  In the mounting structure of the first laminated component, the convex part of the laminated body of the laminated component is dropped into the hole formed in the printed board, the electrode is placed on the printed board, and the laminated component is mounted on the printed board. Since the convex part of the laminated body is dropped into the hole of the printed board, the mounting height from the lower surface of the printed board becomes the thickness of the laminated part (laminated body), and the height can be reduced. In addition, the electrodes of the laminated component are not exposed from the lower surface of the printed circuit board, and insulation of the lower surface of the printed circuit board is ensured. In addition, since the electrodes are placed on the printed board, easy mounting by a solder reflow process can be performed.

  In the mounting structure of the second laminated component, the laminated component is dropped into the hole formed in the printed board in a state where the laminated body / electrode missing portion is positioned downward, and the laminated component is mounted on the printed board. Since the multilayer component is dropped into the hole of the printed circuit board, the mounting height from the lower surface of the printed circuit board becomes the thickness of the multilayer component, and the height can be reduced. In addition, since no electrode is formed on the lower side of the laminated component, the electrode is not exposed from the lower surface of the printed circuit board, and insulation of the lower surface of the printed circuit board is ensured.

  In the third laminated component mounting structure, with the electrodes at both ends facing upward, the laminated component is dropped into a hole formed in the printed board, and the laminated component is mounted on the printed board. Since the multilayer component is dropped into the hole of the printed circuit board, the mounting height from the lower surface of the printed circuit board becomes the thickness of the multilayer component, and the height can be reduced. In addition, since no electrode is formed on the lower side of the laminated component, the electrode is not exposed from the lower surface of the printed circuit board, and insulation of the lower surface of the printed circuit board is ensured.

  In the present invention, the mounting height from the lower surface of the printed circuit board can be reduced to the thickness of the laminated component, and since the electrodes are not exposed from the lower surface of the printed circuit board, even when insulation is required on the lower surface of the printed circuit board. Thus, such a low profile can be realized. Further, in the example in which the electrode is placed on the printed board, easy mounting can be performed by a normal solder reflow process.

Hereinafter, the present invention will be described in detail with reference to the drawings showing embodiments thereof.
(First embodiment)
FIG. 1 is a perspective view showing a configuration of an example of a laminated component 10 according to the present invention, FIG. 1 (a) is a perspective view seen from above, and FIG. 1 (b) is a perspective view seen from below. .

  The laminated component 10 includes a laminated body 1 formed by laminating a plurality of magnetic bodies or dielectric sheets having a wiring pattern, and electrodes 2 formed on the surfaces of both end portions in the longitudinal direction of the laminated body 1. ing. This laminated body 1 functions as an inductor or a capacitor. At both ends of the laminate 1, the lower side in the thickness direction is missing, and the electrode 2 is formed on the surface of the remaining upper end, and the lower half in the thickness direction is the laminate / electrode missing part 3. It has become. The thickness of the laminated body 1 (laminated part 10) is 1 mm, the height of the laminated body / electrode defect part 3 is 0.5 mm, and the convex part having a thickness of 0.5 mm remaining in the central part of the laminated body 1 1a is formed. The thickness of the convex portion 1a (the height of the laminate / electrode defect portion 3) is equal to the thickness of the printed circuit board 4 to be mounted.

  FIG. 2 is a cross-sectional view showing an example of a structure for mounting the laminated component 10 on the printed circuit board 4 according to the present invention. A hole 5 that is slightly larger than the size of the convex portion 1a of the multilayer body 1 of the multilayer component 10 to be mounted is formed in the printed board 4 having a thickness of 0.5 mm. The convex portion 1a at the center of the laminated body 1 of the laminated component 10 is dropped into the hole 5, the both ends of the laminated body 1 and the electrode 2 are placed on the printed board 4, and the electrode 2 and the printed board 4 are soldered. 6 is electrically and mechanically connected. Since the thickness of the printed circuit board 4 is equal to the thickness of the convex portion 1a (the height of the stacked body / electrode defect portion 3), the both ends of the stacked body 1 and the electrode 2 are stacked on the printed circuit board 4. The lower surface of the component 10 (laminated body 1) and the lower surface of the printed circuit board 4 are flush with each other.

  In the mounting structure shown in FIG. 2, since the convex part 1a of the laminated body 1 is dropped into the hole 5 of the printed circuit board 4, the mounting height from the lower surface 4 of the printed circuit board is that of the laminated component 10 (laminated body 1). The thickness is 1 mm, which is reduced compared to the mounting structure (mounting height: 1.5 mm) shown in FIG. As a result, it is possible to reduce the height of the mounting structure. Further, unlike the conventional example of FIG. 11, since the electrode 2 is not exposed from the lower surface of the printed circuit board 4, the insulation of the lower surface of the printed circuit board 4 can be ensured. In addition, since the electrode 2 is mounted on the printed circuit board 4, the mounting can be performed by an easy process using the solder 6.

(Second Embodiment)
3 is a perspective view showing the configuration of another example of the laminated component 10 according to the present invention, FIG. 3 (a) is a perspective view seen from the upper side, and FIG. 3 (b) is a perspective view seen from the lower side. It is. The laminated component 10 shown in FIG. 3 has the same configuration as the laminated component 10 shown in FIG. 1, and the same parts are denoted by the same reference numerals and description thereof is omitted. 1 differs from FIG. 1 in that the height of the laminated body / electrode defect portion 3, in other words, the thickness of the convex portion 1a at the central portion of the laminated body 1 is set to 0.3 mm.

  FIG. 4 is a cross-sectional view showing another example of the structure for mounting the laminated component 10 on the printed circuit board 4 according to the present invention. A hole 5 slightly larger than the size of the laminated component 10 to be mounted is formed in the printed board 4 having a thickness of 0.5 mm. The laminated component 10 is dropped into the hole 5 so that the lower surface of the laminated component 10 (laminate 1) and the lower surface of the printed circuit board 4 are flush with each other, and the electrode 2 and the printed circuit board 4 are electrically bonded. The material 7 is electrically and mechanically connected.

  In the mounting structure shown in FIG. 4, since the laminated component 10 is dropped into the hole 5 of the printed circuit board 4, the mounting height from the lower surface of the printed circuit board 4 is 1 mm of the thickness of the laminated component 10 (laminated body 1). Thus, it is reduced as compared with the mounting structure (mounting height: 1.5 mm) shown in FIG. As a result, it is possible to reduce the height of the mounting structure. Further, since the lower surface of the electrode 2 and the lower surface of the printed circuit board 4 are separated by 0.3 mm and the electrode 2 is not exposed from the lower surface of the printed circuit board 4 unlike the conventional example of FIG. Insulating properties can be ensured. In the first embodiment, there is a restriction that the drop thickness of the laminated component 10 into the hole 5 is matched with the thickness of the printed circuit board 4, but in the second embodiment, there is no such restriction. This can correspond to the printed circuit board 4.

  FIG. 5 is a cross-sectional view showing still another example of the mounting structure of the multilayer component 10 according to the present invention on the printed circuit board 4. FIG. 5 shows a modification of FIG. In the example shown in FIG. 5, the laminate / electrode defect portion 3 is filled with an insulator 8 such as a resin. Therefore, the reliability of insulation can be further increased.

(Third embodiment)
FIG. 6 is a perspective view showing the configuration of still another example of the laminated component 10 according to the present invention. The laminated component 10 includes a laminated body 1 having a thickness of 1 mm formed by laminating a plurality of magnetic bodies or dielectric sheets having a wiring pattern, and electrodes 2 formed on the surfaces of both end portions in the longitudinal direction of the laminated body 1. And have. This laminated body 1 functions as an inductor or a capacitor. The electrode 2 is not formed in the entire thickness direction of the multilayer component 10 but is formed only on the surface of the end of the multilayer body 1 in the upper 0.7 mm range in the thickness direction. The electrode 2 is not formed on the surface of the end of the laminated body 1 in the range of the lower part 0.3 mm in the thickness direction of the laminated component 10, and is a defect region of the electrode 2.

  FIG. 7 is a cross-sectional view showing still another example of the structure for mounting the laminated component 10 on the printed circuit board 4 according to the present invention. A hole 5 slightly larger than the size of the laminated component 10 to be mounted is formed in the printed board 4 having a thickness of 0.5 mm. The laminated component 10 is dropped into the hole 5 so that the lower surface of the laminated component 10 (laminate 1) and the lower surface of the printed circuit board 4 are flush with each other, and the electrode 2 and the printed circuit board 4 are electrically bonded. The material 7 is electrically and mechanically connected.

  In the mounting structure shown in FIG. 7, since the laminated component 10 is dropped into the hole 5 of the printed circuit board 4, the mounting height from the lower surface of the printed circuit board 4 is 1 mm of the thickness of the laminated component 10 (laminated body 1). Thus, it is reduced as compared with the mounting structure (mounting height: 1.5 mm) shown in FIG. As a result, it is possible to reduce the height of the mounting structure. In addition, unlike the conventional example of FIG. 11, the electrode 2 is not provided on the lower surface of the multilayer component 10, so that the electrode 2 is not exposed from the lower surface of the printed circuit board 4, thereby ensuring insulation of the lower surface of the printed circuit board 4. it can. Moreover, it can respond to the printed circuit board 4 of arbitrary thickness similarly to 2nd Embodiment. Furthermore, it is not necessary to provide a missing portion of the laminate 1 as in the first and second embodiments.

  Next, the manufacturing method of the laminated component of this invention is demonstrated. FIG. 8 is a schematic diagram showing the steps of the method for manufacturing the laminated component 10 shown in FIG. First, a slurry of ferrite material (oxide of Fe, Ni, Zn, Cu) is performed (FIG. 8A). After this ferrite material is molded into a sheet shape, it is cut into a size of, for example, 150 mm × 150 mm (FIGS. 8B and 8C). The obtained dielectric sheet 11 is NC punched to form alignment through holes 12, through holes 13, and cut marks (FIG. 8D). Next, a desired wiring pattern 14 made of, for example, silver paste is formed on the dielectric sheet 11 by screen printing (FIG. 8E).

  A plurality of dielectric sheets 11 on which the wiring pattern 14 is formed are sequentially laminated and pressed to obtain a laminated body 15 (thickness: 1 mm) (FIG. 8 (f)). Then, a slit 16 (depth: 0.5 mm) is formed along a unidirectional element separation line using a wide peripheral blade cutter (FIG. 8G). This slit 16 becomes the laminated body / electrode defect portion 3 of the laminated component 10, and the defect portion of the laminated body 1 can be easily formed without adding a complicated process.

  After the laminated body 15 is divided for each element, it is sintered at a temperature of 900 to 960 ° C. (FIG. 8H). Thereafter, both end portions of the multilayer body 1 of each element that are not the slits 16 (deleted portions of the multilayer body 1) are immersed in an Ag paste solution to form an Ag film 17 on the portions (FIG. 8 (i)). This Ag film 17 becomes the electrode 2 of the multilayer component 10. If necessary, the Ag film 17 may be plated with Ni or the like.

  When the laminated component 10 shown in FIG. 3 is manufactured, the depth of the slit 16 may be 0.3 mm in FIG. 8G, and the other steps are the steps of the laminated component 10 shown in FIG. It is the same. When the laminated component 10 shown in FIG. 6 is manufactured, it is not necessary to form the slit 16 in FIG. 8G, and the elements are simply separated, and each element is tilted in FIG. What is necessary is just to immerse and the other process is the same as the process of the laminated component 10 shown in FIG. 1 mentioned above.

It is a perspective view which shows the structure of an example of the laminated component which concerns on this invention. It is sectional drawing which shows an example of the mounting structure to the printed circuit board of the multilayer component which concerns on this invention. It is a perspective view which shows the structure of the other example of the laminated component which concerns on this invention. It is sectional drawing which shows the other example of the mounting structure to the printed circuit board of the multilayer component which concerns on this invention. It is sectional drawing which shows the further another example of the mounting structure to the printed circuit board of the multilayer component which concerns on this invention. It is a perspective view which shows the structure of the further another example of the laminated component which concerns on this invention. It is sectional drawing which shows the further another example of the mounting structure to the printed circuit board of the multilayer component which concerns on this invention. It is a schematic diagram which shows the process of the manufacturing method of the laminated component which concerns on this invention. It is a perspective view which shows the structure of the conventional laminated component. It is sectional drawing which shows the mounting structure of the multilayer component on the conventional printed circuit board. It is sectional drawing which shows the mounting structure of the multilayer component on the conventional printed circuit board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Laminated body 1a Convex part 2 Electrode 3 Laminated body / electrode defect | deletion part 4 Printed circuit board 5 Hole 6 Solder 7 Conductive adhesive 8 Insulator 10 Laminated part 11 Dielectric sheet 14 Wiring pattern

Claims (5)

  In a laminated part having a laminate in which a plurality of magnetic bodies or dielectric sheets having a wiring pattern are laminated, and electrodes formed at both ends of the laminate, the electrode and the laminate in the electrode forming section Is partly missing in the stacking direction.   In a laminated part having a laminate in which a plurality of magnetic bodies or dielectric sheets having a wiring pattern are laminated and electrodes formed at both ends of the laminate, the electrodes are partially missing in the lamination direction. Laminated parts characterized by that.   A mounting structure in which the multilayer component according to claim 1 is mounted on a printed circuit board, and a hole formed in the printed circuit board includes a convex portion of the multilayer body formed by a defective portion of the multilayer body, A laminated component mounting structure, wherein the electrode located on the printed board is electrically connected to the printed board.   2. A mounting structure in which the multilayer component according to claim 1 is mounted on a printed circuit board, wherein the multilayer component is placed in a hole formed in the printed circuit board, and the electrode is electrically connected to the printed circuit board. Mounting structure of laminated parts characterized by the above.   A mounting structure in which the multilayer component according to claim 2 is mounted on a printed circuit board, wherein the multilayer component is placed in a hole formed in the printed circuit board, and the electrode is electrically connected to the printed circuit board. Mounting structure of laminated parts characterized by the above.

Images