JP2010212584A5 - - Google Patents
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- Publication number
- JP2010212584A5 JP2010212584A5 JP2009059327A JP2009059327A JP2010212584A5 JP 2010212584 A5 JP2010212584 A5 JP 2010212584A5 JP 2009059327 A JP2009059327 A JP 2009059327A JP 2009059327 A JP2009059327 A JP 2009059327A JP 2010212584 A5 JP2010212584 A5 JP 2010212584A5
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- circuit boards
- adhesive layer
- foil tape
- boards according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims description 31
- 229910052751 metal Inorganic materials 0.000 claims description 29
- 239000002184 metal Substances 0.000 claims description 29
- 239000012790 adhesive layer Substances 0.000 claims description 10
- 239000003522 acrylic cement Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims description 2
- 229920000058 polyacrylate Polymers 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009059327A JP2010212584A (ja) | 2009-03-12 | 2009-03-12 | 回路基板用金属箔テープ |
| TW099103974A TW201044925A (en) | 2009-03-12 | 2010-02-09 | Metal foil tape for circuit substrate |
| KR1020100021256A KR20100103389A (ko) | 2009-03-12 | 2010-03-10 | 회로 기판용 금속박 테이프 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009059327A JP2010212584A (ja) | 2009-03-12 | 2009-03-12 | 回路基板用金属箔テープ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010212584A JP2010212584A (ja) | 2010-09-24 |
| JP2010212584A5 true JP2010212584A5 (cg-RX-API-DMAC7.html) | 2012-01-12 |
Family
ID=42972436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009059327A Pending JP2010212584A (ja) | 2009-03-12 | 2009-03-12 | 回路基板用金属箔テープ |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2010212584A (cg-RX-API-DMAC7.html) |
| KR (1) | KR20100103389A (cg-RX-API-DMAC7.html) |
| TW (1) | TW201044925A (cg-RX-API-DMAC7.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012119563A (ja) * | 2010-12-02 | 2012-06-21 | Mitsui Mining & Smelting Co Ltd | 半導体装置用フレキシブル基板および半導体装置 |
| JP2013038360A (ja) * | 2011-08-11 | 2013-02-21 | Toray Ind Inc | 金属支持フレキシブル基板ならびにそれを用いたテープオートメーテッドボンディング用金属支持キャリアテープ、ｌｅｄ実装用金属支持フレキシブル回路基板および回路形成用銅箔積層済み金属支持フレキシブル回路基板 |
-
2009
- 2009-03-12 JP JP2009059327A patent/JP2010212584A/ja active Pending
-
2010
- 2010-02-09 TW TW099103974A patent/TW201044925A/zh unknown
- 2010-03-10 KR KR1020100021256A patent/KR20100103389A/ko not_active Ceased