JP2010212544A - Method of manufacturing electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method which can manufacture an electronic component efficiently and which can avoid mechanical damage to a component. <P>SOLUTION: The method of manufacturing an electronic component 14 includes a step of forming an electronic component of forming a resin body 12 and an internal electrode 13 on a board 11, a lifting step of lifting the resin body 12 from the board 11 and obtaining an aggregate 15 of the electronic component 14, and a dicing step of dicing the electronic component 14 from the aggregate 15 of the electronic component 14. Adjacent electronic components 14 are arranged in a comma shape different in direction by 90°. The shape of a dummy 18 surrounded by the electric components 14 is an octagon. Thereby, the electric component can be efficiently produced and mechanical damage to the component can be reduced. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing electronic components such as inductor elements and capacitor elements used in various electronic devices.

  As shown in FIG. 3, a conventional method for manufacturing an electronic component is to produce an assembly (not shown) in which a coil portion 2 is laminated in an element body 1 and then to separate pieces by a method such as dicing or barrel. It was converted.

For example, Patent Document 1 is known as prior art document information related to the invention of this application.
JP 2008-147538 A

  However, when dividing into individual pieces by dicing as in the prior art, it is difficult to cut the electrode terminals 3, and in order to avoid this, it is necessary to provide a cutting region in the peripheral portion and to remove the remaining portion of the cutting region after cutting There is. In addition, when dividing into individual pieces by a barrel or a roller, there is a problem that division remaining and burrs are likely to remain, and in order to remove the division remaining and burrs, if barrel polishing is performed for a long time after dividing into pieces, There is a problem that the body is also shaved.

  The present invention solves these problems, and provides a manufacturing method that can be efficiently manufactured with little loss and that can avoid mechanical damage to parts.

  In order to achieve the above object, according to the present invention, the end face of the external electrode portion of the first electronic component is brought into contact with the side surface of the resin body portion of the adjacent second electronic component, and the external electrode portion of the first electronic component The side surfaces of the first and second electronic components, the third electronic component, and the fourth electronic component are respectively in contact with the dummy portion. The first electronic component, the second electronic component, the third electronic component, and the fourth electronic component are continuously connected in a bowl shape, connected to the resin body portion side of the boundary with the end side surface of the external electrode portion. The dummy part has an octagonal shape.

  According to the present invention, there is little loss, it can manufacture efficiently, and mechanical damage to parts can also be avoided.

(Embodiment 1)
A method for manufacturing an electronic component according to the present invention will be described below with reference to the drawings, using Embodiment 1 of the present invention.

  FIG. 1 is a diagram for explaining an electronic component manufacturing process according to Embodiment 1 of the present invention, and FIG. 2 is a pattern layout diagram of the electronic component.

  First, as shown in FIG. 1A, a layer of a photosensitive resin body portion 12 is formed on a silicon substrate 11 whose surface is oxidized. After this is patterned by exposure, copper is sputtered, a copper plating layer is formed thereon, and the surface is ground or polished to be flattened. By repeating this operation, a silicon substrate is obtained as shown in FIG. An assembly 15 of electronic components 14 having a resin body portion 12 and internal electrodes 13 is formed on 11.

  Here, each electronic component 14 has a substantially rectangular shape having a longitudinal direction of about 1 mm and a central portion having a width of about 0.6 mm, and both end portions in the longitudinal direction are external electrode portions 20. The width is about 0.5 mm, which is slightly narrower than the central portion. As shown in FIG. 2, each electronic component 14 has an end face of the external electrode portion 20 of the first electronic component 14a in contact with the side surface of the resin body portion 12 of the adjacent second electronic component 14b. The end portion side surface of the external electrode portion 14a is in contact with the dummy portion 18, and the dummy portion 18 includes the first electronic component 14a, the second electronic component 14b, the third electronic component 14c, and the fourth electronic component 14d. Are connected to the resin body 12 side of the boundary between the side surface of the resin body 12 and the end surface of the external electrode 20, and the first electronic component 14 a, the second electronic component 14 b, and the second The third electronic component 14c and the fourth electronic component 14d are continuously arranged in a bowl shape. That is, each electronic component 14 has a bowl-like arrangement that is 90 ° different from the adjacent electronic component 14, and the portion surrounded by each electronic component 14 is a dummy portion 18, which is more than the central portion. By reducing the width of the external electrode part 20, the shape of the dummy part 18 is an octagon.

  Next, by immersing them in hydrofluoric acid, the oxide film on the surface of the silicon substrate is dissolved, and the assembly 15 of the electronic components 14 is peeled from the silicon substrate 11 as shown in FIG.

  Next, as shown in FIG. 1 (d), the assembly 15 of the electronic components 14 is placed on a support base 16 made of silicone, and a protective sheet 17 made of PET (polyethylene terephthalate) having a thickness of about 0.1 mm is formed thereon. The electronic component 14 is separated into pieces by covering and applying pressure from above the protective sheet 17 with a roller 21 or the like.

  Here, by applying pressure in this way, it can be separated into pieces because the bond between the copper constituting the external electrode portion 20 and the resin body portion 12 is not so strong, and when the impact is applied from the outside, its interface This is because of separation. Therefore, the periphery of the electronic component 14 to be separated needs to be made of different materials (copper and resin body 12). In order to satisfy this relationship, it is desirable that the configuration of the dummy portion 18 has a bowl-shaped dummy electrode 19 as shown in FIG. By doing so, the electronic component 14 and the dummy portion 18 can be easily separated. However, the copper and the resin body portion 12 in one electronic component 14 are configured not to be separated by, for example, being configured to bite into the other side.

  When pressure is applied to the assembly 15 of the electronic components 14 by the roller 21, the interface between the copper and the resin body 12 is separated from the portion where the pressure is applied. The direction of separation is 90 °. If it changes, separation at that corner will not be complete and this will be a burr. In the present invention, since the dummy portion 18 is an octagon in which four corners of a square are cut at an angle of 45 °, the separation direction only changes by 45 °, and burrs are hardly generated during separation.

  Further, since the area can be increased as compared with the case where the dummy portion 18 is square, the electronic component 14 and the dummy portion 18 can be easily separated.

  As described above, the interface between the copper and the resin body portion 12 is easily separated. For example, when separation is performed using the roller 21, the pressure and the number of times can be reduced. 14 can be reduced, and the reliability of the electronic component 14 can be improved.

  In the present invention, the outer shape of the electronic component 14 is a shape in which the width of the external electrode portion 20 at the end is narrower than that of the central portion. When the electronic component 14 is mounted on a printed circuit board (not shown) and soldered, the solder also flows toward the side surface, so it is necessary to secure a distance from the adjacent component. However, in the present invention, since the width of the external electrode portion 20 to be soldered is narrowed, another component can be brought close to the full width of the central portion, and the mounting density can be increased.

  In the present embodiment, the electronic component 14 is separated using the roller 21, but the present invention is not limited to this method, and the same effect can be obtained by using a method such as barrel or blasting.

  According to the electronic component manufacturing method of the present invention, there is little loss at the time of manufacturing, it can be efficiently manufactured, mechanical damage to the component can be avoided, and the manufacturing method of various electronic components such as coil components and capacitor components can be avoided. Applicable.

The figure explaining the manufacturing process of the electronic component in Embodiment 1 of this invention Pattern arrangement diagram of electronic component in Embodiment 1 of the present invention Perspective view of conventional electronic components

DESCRIPTION OF SYMBOLS 11 Board | substrate 12 Resin body part 13 Internal electrode 14 Electronic component 14a 1st electronic component 14b 2nd electronic component 14c 3rd electronic component 14d 4th electronic component 15 Assembly of electronic components 16 Support stand 17 Protection sheet 18 Dummy part 19 Dummy electrode 20 External electrode part 21 Roller

Claims (2)

A method of manufacturing an electronic component having a resin body portion and an internal electrode, the electronic component forming step of forming the resin body portion and the internal electrode on a substrate, and peeling the resin body portion from the substrate. A separation step of obtaining an assembly of electronic components and an individualization step of separating the electronic components from the assembly of electronic components, and in the electronic component formation step, external electrode portions of the first electronic component The end surface of the first electronic component is in contact with the side surface of the resin body portion of the adjacent second electronic component, the end surface of the external electrode portion of the first electronic component is in contact with the dummy portion, and the dummy portion is The resin at the boundary between the side surface of the resin body portion and the side surface of the end portion of the external electrode portion in each of the first electronic component, the second electronic component, the third electronic component, and the fourth electronic component The first electronic component and the second electronic part are connected to the element body side. The third is of the electronic component and the fourth electronic component obtained by forming successively arranged in Tomoe shape, the manufacturing method of the electronic component dummy portion which has a octagonal shape and. The method of manufacturing an electronic component according to claim 1, wherein the dummy portion is provided with a bowl-shaped electrode.

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