JP2010212509A5 - - Google Patents
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- JP2010212509A5 JP2010212509A5 JP2009058409A JP2009058409A JP2010212509A5 JP 2010212509 A5 JP2010212509 A5 JP 2010212509A5 JP 2009058409 A JP2009058409 A JP 2009058409A JP 2009058409 A JP2009058409 A JP 2009058409A JP 2010212509 A5 JP2010212509 A5 JP 2010212509A5
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- semiconductor chip
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- picking
- adhesive sheet
- upward direction
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この発明は、粘着シートの上面に貼着された矩形状の半導体チップをピックアップする半導体チップのピックアップ装置であって、
上面が上記粘着シートの下面を吸着保持する吸着面に形成されたバックアップ体と、
このバックアップ体内に上下方向に駆動可能に設けられ上記半導体チップを上記粘着テープを介して上昇方向に駆動して上記半導体チップを上記バックアップ体の上面から押し上げる押し上げ手段と、
この押し上げ手段によって押し上げられた半導体チップを上記粘着シートからピックアップするピックアップ手段を具備し、
上記押し上げ手段は、
上端面が上記半導体チップの４つの側辺部のうちの１つの側辺部を除く３つの側辺部に対応するコ字状であって、このコ字状の閉塞端側から開放端側に向かって低く傾斜した傾斜面に形成された第１の押し上げ体と、
上端面が平面であって上記半導体チップの上記３つの側辺部以外の部分に対応する形状に形成された筒状の第２の押し上げ体と、
上端面が平面であって上記第２の押し上げ体の内部に挿通された第３の押し上げ体と、
上記第１の押し上げ体を上昇方向に駆動してその傾斜面で上記半導体チップを傾斜させて押し上げてから、上記第２、第３の押し上げ体を上昇方向に駆動して上記半導体チップを上記傾斜面から離れて水平になるまで上昇させた後、上記第３の押し上げ体を上昇方向に駆動して上記半導体チップを上記第２の押し上げ体の上面から離れる高さまで上昇させる上下駆動手段と
によって構成されていることを特徴とする半導体チップのピックアップ装置にある。
This invention is a semiconductor chip pickup device for picking up a rectangular semiconductor chip attached to the upper surface of an adhesive sheet,
A back-up body formed on the suction surface whose upper surface sucks and holds the lower surface of the adhesive sheet;
Push-up means provided in the backup body so as to be driven in the vertical direction, and driving the semiconductor chip in the upward direction via the adhesive tape to push up the semiconductor chip from the upper surface of the backup body;
A pickup means for picking up the semiconductor chip pushed up by the pushing-up means from the adhesive sheet;
The push-up means is
The upper end surface has a U-shape corresponding to three side portions excluding one side portion of the four side portions of the semiconductor chip, from the closed end side to the open end side of the U-shape. A first push-up body formed on an inclined surface which is inclined toward the lower side,
A cylindrical second push-up body formed in a shape corresponding to a portion other than the three side portions of the semiconductor chip, the upper end surface being a plane;
A third push-up body whose upper end surface is flat and inserted into the second push-up body;
The first push-up body is driven in the upward direction and the semiconductor chip is tilted and pushed up by the inclined surface, and then the second and third push-up bodies are driven in the upward direction to tilt the semiconductor chip. And a vertical driving means for raising the semiconductor chip to a height away from the upper surface of the second push-up body by driving the third push-up body in the ascending direction after being lifted up to become horizontal away from the surface. The semiconductor chip pick-up device is characterized by the above.
この発明は、粘着シートの上面に貼着された矩形状の半導体チップを下方から押し上げてピックアップする半導体チップのピックアップ方法であって、
水平に保持された上記半導体チップを幅方向一端から他端に向かって低くなるよう傾斜させて押し上げて上記粘着テープを引き伸ばす工程と、
傾斜させられた上記半導体チップを水平となるよう上昇させて上記粘着テープの上記半導体チップの幅方向他端に位置する部分を引き伸ばす工程と、
上記半導体チップをさらに水平に上昇させて上記半導体チップの周辺部から上記粘着テープを剥離する工程と、
周辺部から粘着テープが剥離された上記半導体チップをピックアップする工程と
を具備したことを特徴とする半導体チップのピックアップ方法にある。
This invention is a semiconductor chip pick-up method for picking up a rectangular semiconductor chip attached to the upper surface of an adhesive sheet by pushing up from below,
Stretching the pressure-sensitive adhesive tape by tilting the semiconductor chip held horizontally and pushing it up so as to become lower from one end to the other in the width direction ;
Extending the inclined semiconductor chip so as to be horizontal and extending a portion of the adhesive tape located at the other end in the width direction of the semiconductor chip; and
A step of further horizontally raising the semiconductor chip and peeling the adhesive tape from the periphery of the semiconductor chip;
And a step of picking up the semiconductor chip from which the adhesive tape has been peeled off from the peripheral portion.
Claims (3)
上面が上記粘着シートの下面を吸着保持する吸着面に形成されたバックアップ体と、
このバックアップ体内に上下方向に駆動可能に設けられ上記半導体チップを上記粘着テープを介して上昇方向に駆動して上記半導体チップを上記バックアップ体の上面から押し上げる押し上げ手段と、
この押し上げ手段によって押し上げられた半導体チップを上記粘着シートからピックアップするピックアップ手段を具備し、
上記押し上げ手段は、
上端面が上記半導体チップの４つの側辺部のうちの１つの側辺部を除く３つの側辺部に対応するコ字状であって、このコ字状の閉塞端側から開放端側に向かって低く傾斜した傾斜面に形成された第１の押し上げ体と、
上端面が平面であって上記半導体チップの上記３つの側辺部以外の部分に対応する形状に形成された筒状の第２の押し上げ体と、
上端面が平面であって上記第２の押し上げ体の内部に挿通された第３の押し上げ体と、
上記第１の押し上げ体を上昇方向に駆動してその傾斜面で上記半導体チップを傾斜させて押し上げてから、上記第２、第３の押し上げ体を上昇方向に駆動して上記半導体チップを上記傾斜面から離れて水平になるまで上昇させた後、上記第３の押し上げ体を上昇方向に駆動して上記半導体チップを上記第２の押し上げ体の上面から離れる高さまで上昇させる上下駆動手段と
によって構成されていることを特徴とする半導体チップのピックアップ装置。 A semiconductor chip pickup device for picking up a rectangular semiconductor chip attached to the upper surface of an adhesive sheet,
A back-up body formed on the suction surface whose upper surface sucks and holds the lower surface of the adhesive sheet;
Push-up means provided in the backup body so as to be driven in the vertical direction, and driving the semiconductor chip in the upward direction via the adhesive tape to push up the semiconductor chip from the upper surface of the backup body;
A pickup means for picking up the semiconductor chip pushed up by the pushing-up means from the adhesive sheet;
The push-up means is
The upper end surface has a U-shape corresponding to three side portions excluding one side portion of the four side portions of the semiconductor chip, from the closed end side to the open end side of the U-shape. A first push-up body formed on an inclined surface which is inclined toward the lower side,
A cylindrical second push-up body formed in a shape corresponding to a portion other than the three side portions of the semiconductor chip, the upper end surface being a plane;
A third push-up body whose upper end surface is flat and inserted into the second push-up body;
The first push-up body is driven in the upward direction and the semiconductor chip is tilted and pushed up by the inclined surface, and then the second and third push-up bodies are driven in the upward direction to tilt the semiconductor chip. And a vertical driving means for raising the semiconductor chip to a height away from the upper surface of the second push-up body by driving the third push-up body in the ascending direction after being lifted up to become horizontal away from the surface. A pick-up device for a semiconductor chip, characterized in that:
上面が上記粘着シートの下面を吸着保持する吸着面に形成されたバックアップ体と、 A back-up body formed on the suction surface whose upper surface sucks and holds the lower surface of the pressure-sensitive adhesive sheet;
このバックアップ体内に上下方向に駆動可能に設けられ上記半導体チップを上記粘着テープを介して上昇方向に駆動して上記半導体チップを上記バックアップ体の上面から押し上げる押し上げ手段と、 Push-up means provided in the backup body so as to be driven in the vertical direction, and driving the semiconductor chip in the upward direction via the adhesive tape to push up the semiconductor chip from the upper surface of the backup body;
この押し上げ手段によって押し上げられた半導体チップを上記粘着シートからピックアップするピックアップ手段を具備し、 A pickup means for picking up the semiconductor chip pushed up by the pushing-up means from the adhesive sheet;
上記押し上げ手段は、 The push-up means is
上端面が上記半導体チップの４つの側辺部のうちの１つの側辺部を除く３つの側辺部に対応するコ字状であって、このコ字状の閉塞端側から開放端側に向かって低く傾斜した傾斜面に形成された第１の押し上げ体と、 The upper end surface has a U-shape corresponding to three side portions excluding one side portion of the four side portions of the semiconductor chip, from the closed end side to the open end side of the U-shape. A first push-up body formed on an inclined surface which is inclined toward the lower side,
上端面が上記半導体チップの上記３つの側辺部以外の部分に対応する形状であって、上記コ字状の第１の押し上げ体の傾斜面と逆向きに傾斜した傾斜面に形成された筒状の第２の押し上げ体と、 A cylinder formed on an inclined surface having an upper end surface corresponding to a portion other than the three side portions of the semiconductor chip and inclined in the direction opposite to the inclined surface of the U-shaped first push-up body A second push-up body having a shape;
上端面が平面であって上記第２の押し上げ体の内部に挿通された第３の押し上げ体と、 A third push-up body whose upper end surface is flat and inserted into the second push-up body;
上記第１の押し上げ体を上昇方向に駆動してその傾斜面で上記半導体チップを傾斜させて押し上げてから、上記第２の押し上げ体を上昇方向に駆動して上記半導体チップを水平になるまで上昇させた後、上記第３の押し上げ体を上昇方向に駆動して上記半導体チップを上記第２の押し上げ体の上面から離れる高さまで上昇させる上下駆動手段と The first push-up body is driven in the upward direction and the semiconductor chip is tilted and pushed up by the inclined surface, and then the second push-up body is driven in the upward direction and the semiconductor chip is raised until it becomes horizontal. And a vertical driving means for driving the third push-up body in the upward direction to raise the semiconductor chip to a height away from the upper surface of the second push-up body.
によって構成されていることを特徴とする半導体チップのピックアップ装置。 A pickup device for a semiconductor chip, comprising:
水平に保持された上記半導体チップを幅方向一端から他端に向かって低くなるよう傾斜させて押し上げて上記粘着テープを引き伸ばす工程と、
傾斜させられた上記半導体チップを水平となるよう上昇させて上記粘着テープの上記半導体チップの幅方向他端に位置する部分を引き伸ばす工程と、
上記半導体チップをさらに水平に上昇させて上記半導体チップの周辺部から上記粘着テープを剥離する工程と、
周辺部から粘着テープが剥離された上記半導体チップをピックアップする工程と
を具備したことを特徴とする半導体チップのピックアップ方法。 A semiconductor chip pick-up method for picking up a rectangular semiconductor chip attached to the upper surface of an adhesive sheet by pushing up from below,
Stretching the pressure-sensitive adhesive tape by tilting the semiconductor chip held horizontally and pushing it up so as to become lower from one end to the other in the width direction ;
Extending the inclined semiconductor chip so as to be horizontal and extending a portion of the adhesive tape located at the other end in the width direction of the semiconductor chip; and
A step of further horizontally raising the semiconductor chip and peeling the adhesive tape from the periphery of the semiconductor chip;
Picking up the semiconductor chip from which the adhesive tape has been peeled off from the peripheral portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009058409A JP5284144B2 (en) | 2009-03-11 | 2009-03-11 | Semiconductor chip pickup device and pickup method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009058409A JP5284144B2 (en) | 2009-03-11 | 2009-03-11 | Semiconductor chip pickup device and pickup method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010212509A JP2010212509A (en) | 2010-09-24 |
| JP2010212509A5 true JP2010212509A5 (en) | 2013-04-18 |
| JP5284144B2 JP5284144B2 (en) | 2013-09-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009058409A Active JP5284144B2 (en) | 2009-03-11 | 2009-03-11 | Semiconductor chip pickup device and pickup method |
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| Country | Link |
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| JP (1) | JP5284144B2 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101186799B1 (en) | 2012-01-26 | 2012-09-28 | 한국기계연구원 | Pick-up apparatus of semiconductor chip |
| KR101397750B1 (en) * | 2012-07-25 | 2014-05-21 | 삼성전기주식회사 | Chip ejector and chip removal method using the same |
| JP6366223B2 (en) * | 2013-02-25 | 2018-08-01 | 東レエンジニアリング株式会社 | Semiconductor chip pickup device |
| JP6200735B2 (en) * | 2013-09-09 | 2017-09-20 | ファスフォードテクノロジ株式会社 | Die bonder and bonding method |
| KR101585316B1 (en) * | 2014-01-29 | 2016-01-13 | 세메스 주식회사 | Apparatus for ejecting a die |
| JP6368407B2 (en) * | 2016-08-04 | 2018-08-01 | 日本ファインテック株式会社 | Chip peeling apparatus and chip peeling method |
| JP7217605B2 (en) * | 2018-09-21 | 2023-02-03 | ファスフォードテクノロジ株式会社 | Semiconductor manufacturing equipment, push-up jig, and semiconductor device manufacturing method |
| WO2020178889A1 (en) * | 2019-03-01 | 2020-09-10 | 株式会社Ｆｕｊｉ | Electronic component detaching apparatus and electronic component detaching method |
| JP7377654B2 (en) * | 2019-09-17 | 2023-11-10 | ファスフォードテクノロジ株式会社 | Die bonding equipment, peeling unit, collet and semiconductor device manufacturing method |
| KR102617784B1 (en) * | 2020-07-09 | 2023-12-26 | 세메스 주식회사 | Die ejector and die bonding apparatus including the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000353710A (en) * | 1999-06-14 | 2000-12-19 | Toshiba Corp | Manufacture of pellet pickup device and semiconductor device |
| JP4574251B2 (en) * | 2003-09-17 | 2010-11-04 | ルネサスエレクトロニクス株式会社 | Manufacturing method of semiconductor device |
| JP2005322815A (en) * | 2004-05-11 | 2005-11-17 | Matsushita Electric Ind Co Ltd | Manufacturing apparatus and manufacturing method of semiconductor apparatus |
| JP4616748B2 (en) * | 2005-10-11 | 2011-01-19 | 株式会社新川 | Die pickup device |
| JP2008141068A (en) * | 2006-12-04 | 2008-06-19 | Shibaura Mechatronics Corp | Apparatus and method of picking up semiconductor chip |
| JP4752790B2 (en) * | 2007-02-26 | 2011-08-17 | パナソニック株式会社 | Electronic component pickup method and pickup device used therefor |
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