JP2010206039A - Light emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that a water content or corrosive gas enters through the interface between resin moldings to cause a failure such as peeling, in a light emitting device of a package formed of two kinds of resin moldings. <P>SOLUTION: The light emitting device includes a package having an opening at its upper surface, a first resin molding constituting at least a part of the upper surface of the package, a second resin molding which has light reflectivity higher than that of the first resin molding to constitute at least the inner surface of the opening of the package, and a light emitting element placed in the opening. The device includes a covering member which is provided to be exposed on the package upper surface or in the opening to cover the interface between the first resin molding and the second resin molding. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a light emitting device using LEDs, and more particularly to a light emitting device used for a display device such as an outdoor display.

  In recent years, display devices using light emitting diodes (hereinafter also referred to as LEDs) of three primary colors of red (R), green (G), and blue (B) have been put into practical use. These display devices, for example, are arranged in a matrix of light emitting devices in which LEDs that emit light of the three primary colors are accommodated in the openings in the opening of the package, and by combining the emission colors of the respective LEDs, A full color display is performed.

  Some light-emitting devices for use in such display devices have a black paint applied to the upper surface of the package for the purpose of improving the contrast ratio between when the LEDs are lit and when not lit. In such a light emitting device, there are problems such that the paint is peeled off, the pigment of the paint is faded, and the contrast is lowered.

  In order to solve this problem, there is one using a black molding resin having a high light absorption rate on the outer surface of these packages and a white molding resin having a high reflectance in the opening (Patent Document 1).

JP 2006-130714 A

  However, in the light emitting device as in Patent Document 1, moisture, corrosive gas, or the like enters from the interface between the two types of molding resins, which may cause problems such as separation of the molding resins.

  In order to solve the above problems, a light-emitting device of the present invention includes a package having an opening on the upper surface, a first molding resin constituting at least a part of the upper surface of the package, and at least an opening in the package. A second molding resin having a light reflectance higher than that of the first molding resin constituting the wall surface, a light emitting element placed in the opening, the first molding resin on the upper surface of the package or the inner wall surface, and the second molding resin. And a covering member that covers the interface of the molding resin.

  The covering member is preferably provided so as to extend from the interface between the first molding resin and the second molding resin into the opening.

  Moreover, it is preferable that the sealing member is provided on the side closer to the light emitting element than the covering member in the opening.

  The interface between the first molding resin and the second molding resin is exposed on the upper surface of the package. The first molding resin includes a groove surrounding the opening, and the covering member extends from the opening to the inside of the groove. It is preferable that it is provided in the range.

  Moreover, it is preferable that the part provided in the upper surface of the package of the coating | coated member is thinner than the part provided in the opening part.

  As described above, by protecting the interface between different molding resins with the covering member, peeling between the molding resins can be prevented, and a highly reliable light-emitting device can be obtained.

  In addition, since the covering member is provided to extend from the interface into the opening, the covering member can be easily formed and the light emitting element can be protected at the same time.

  In addition, since the sealing member is provided closer to the light emitting element than the covering member in the opening, the light emitting element can be protected with a more appropriate material while improving the waterproofness of the light emitting device.

  Further, by providing the groove, the covering member can be easily disposed at a predetermined position, and the surface of the first molding resin is not unnecessarily covered, so that the light emitting device with high contrast and high reliability can be obtained. .

  Further, since the covering member that covers the upper surface of the package is thinner than the inside of the opening, it is possible to reduce the light emitted from the light emitting element from being propagated through the covering member and absorbed by the first molding resin. Can be suppressed.

It is a perspective view which shows the light-emitting device of one Example of this invention. It is a top view which shows the light-emitting device of one Example of this invention. It is sectional drawing which shows the light-emitting device of one Example of this invention. It is a partially expanded sectional view which shows the light-emitting device of one Example of this invention. It is sectional drawing which shows an example of the light-emitting device of this invention. It is a partially expanded sectional view which shows an example of the light-emitting device of this invention. It is a partially expanded sectional view which shows an example of the light-emitting device of this invention. It is a partially expanded sectional view which shows an example of the light-emitting device of this invention. It is a partially expanded sectional view which shows an example of the light-emitting device of this invention. It is a partially expanded sectional view which shows an example of the light-emitting device of this invention. It is a partially expanded sectional view which shows an example of the light-emitting device of this invention. It is a partially expanded sectional view which shows an example of the light-emitting device of this invention. It is a partially expanded sectional view which shows an example of the light-emitting device of this invention. It is a partially expanded sectional view which shows an example of the light-emitting device of this invention. It is a figure which shows the package of the conventional light-emitting device.

  A mode for carrying out the present invention will be described below with reference to the drawings.

  The light emitting device of the present invention has an opening 102 at the center of the upper surface, for example, like the light emitting device 130 shown in FIGS. 1A, 1B, 1C, and 1D. A package 101 in which the inside of the opening 102 and the periphery of the opening 102 are formed of the second molding resin 104 with the molding resin 103; and a conductor wiring 109 embedded in the package so that a part thereof is exposed in the opening 102 A light emitting element 105 placed on the conductor wiring 109, a groove 108 surrounding the opening 102 in the first molding resin 103, and the first molding resin 103 and the second molding on the upper surface of the package 101. A covering member 106 provided from the opening 102 to the inside of the groove 108 so as to cover the interface of the resin 104, and a sealing member 107 provided on the side closer to the light emitting element 105 than the covering member 106 are provided. There.

  Below, each component is explained in full detail.

  The package 101 has an opening 102 at least on the upper surface, at least part of the upper surface is made of the first molding resin 103, and part of the inner surface of the opening 102 is made of the second molding resin 104. ing.

  The shape of the package is not particularly limited. For example, a planar shape (hereinafter simply referred to as “planar shape”) viewed from the upper surface that is a light emission observation surface is a circle, an ellipse, a square, a rectangle, a polygon, and the like. Deformation (for example, a shape with rounded corners or notches) is included. Further, at least one surface may have a taper for improving releasability from a mold used for manufacturing a package. Further, the upper surface of the package may have fine irregularities or the like in order to scatter external light from the light emitting device and improve contrast.

  In the package, a conductor wiring described later is arranged to electrically connect the light emitting element and the outside.

  The package of the present invention can be manufactured by a known method including the injection molding method described in Patent Document 1.

  The opening 102 is provided on the upper surface of the package 101. The opening 102 mainly includes a bottom surface and an inner wall surface continuous from the bottom surface to the top surface of the package. The light emitting element 105 is placed on the bottom surface, and a part of the conductor wiring 109 connected to the electrode of the light emitting element 105 is exposed. Has been.

  The shape of the opening can be variously changed in consideration of the convenience of arrangement of the light emitting element and required optical characteristics. For example, the planar shape is a circle, an ellipse, a square, a rectangle, a polygon, and the like (for example, a deformation thereof) , Rounded corners or notched shapes). The inclination of the inner wall surface may be perpendicular to the bottom surface, but may be a tapered shape that widens from the bottom surface toward the light emission observation surface side in order to adjust the mold releasability, light distribution, and the like.

  At least a part of the inner wall surface of the opening is constituted by the second molding resin 104.

  In order to increase the luminance of the light emitting device, the first molding resin is not provided in the opening so that the light emission is not absorbed in the opening, and the second molding resin is continuous from the inner wall surface to the upper surface of the package. It is also preferable that a portion surrounding the opening on the upper surface of the package is provided. Further, a part of the opening may be formed of the first molding resin. For example, the contrast of the light emitting device can be increased by providing the first molding resin on a portion of the inner wall surface close to the top surface of the package or a part of the bottom surface.

  On the inner wall surface or the bottom surface of the opening, a step, fine unevenness, or the like may be provided for the purpose of preventing separation from the sealing member.

  The package 101 of the light emitting device of the present invention includes a first molding resin 103 and a second molding resin 104 as shown in FIGS. 1A to 1D. Examples of the material of the molding resin include various resins such as phenol resin, glass epoxy resin, BT resin, PPA resin (polyphthalamide), and ceramics.

  The first molding resin 103 is provided on at least a part of the upper surface of the package 101 in order to improve the contrast of the light emitting device. Therefore, it is preferable that the light reflectance is low with respect to outside light (in many cases, sunlight) of the light-emitting device, and it is usually preferable that the color be black or a color similar thereto. For example, PPA resin mixed with carbon black can be used.

Since the second molding resin 104 is provided on the inner wall surface of the opening 102, the second molding resin 104 is preferably formed of a material having a high reflectance with respect to light emitted from the light emitting element 105. For example, a PPA resin mixed with a substantially white inorganic powder such as TiO ₂ or ZnO can be used.

  If necessary, three or more kinds of molding resins may be used. For example, a third molding resin having high adhesiveness to each molding resin can be provided between the first molding resin and the second molding resin, and peeling between the molding resins can be prevented.

  The light-emitting element 105 of the present invention is usually a semiconductor light-emitting element, and in particular, a light-emitting diode that emits visible light is used. For example, a p-type semiconductor layer, an active layer, and an n-type semiconductor are formed on a substrate by various semiconductors such as nitride semiconductors such as InGaN, AlGaN, and InGaAlN, III-V compound semiconductors, and II-VI compound semiconductors. A layered structure including a layer is formed. One or more light-emitting elements are used in the light-emitting device, but a plurality of light-emitting elements that emit different colors may be used in one light-emitting device. In particular, the light-emitting device used in a full-color display device has a blue color. Light emitting elements that emit system light, green light, and red light are used. The light emitting element is provided with positive and negative electrodes for electrical connection with the outside.

  The light emitting element is usually formed on a positive or negative conductor wiring, a submount, or an element mounting area provided separately, by an appropriate adhesive member, for example, an epoxy resin, a resin such as silicone, an Au-Sn eutectic, or the like. The solder is bonded to a predetermined region in the opening using a solder, a brazing material such as a low melting point metal, a conductive paste such as silver, gold, or palladium.

  The light emitting element may be flip-chip bonded with the positive and negative electrodes provided on one surface thereof facing the conductor wiring. In the case of flip-chip bonding, the light emitting element is bonded to a conductor wiring, a submount, or the like using, for example, Au bumps or Au—Sn eutectic.

  The covering member 106 is a member that protects the interface of the first molding resin 103 and the second molding resin 104 exposed on the upper surface or the opening of the package, and prevents the molding resins from being separated from each other and moisture entering. The material is not particularly limited, but a material having high mechanical strength, waterproofness, and high adhesion to the molding resin is preferable. For example, various members such as various resins and sheets are used, but the first molding resin is used. It is preferable that it is a member with high translucency which permeate | transmits the color. It should be noted that a light-emitting device with high contrast can be obtained by making the covering member a color similar to the first molding resin.

  The covering member can be formed by a known method such as potting, compression molding, printing, or sticking depending on the material.

  The shape of the covering member is not particularly limited as long as the waterproofing effect is sufficient, but the covering member is preferably provided so as to extend from the upper surface of the package into the opening. Accordingly, the covering member can be easily formed, and the members in the opening such as the light emitting element can be simultaneously protected. In this case, it is preferable that the material of the covering member has high translucency in order to extract light emitted from the light emitting element. For example, an epoxy resin or a modified silicone resin can be used.

  Further, when the covering member extends from the inside of the opening into a groove to be described later, it is preferable that at least a portion located on the upper surface of the package is thinner than the thickness of the covering member in the opening. The preferable thickness varies depending on the refractive index of the covering member, the inclination angle of the inner wall surface of the opening, and other conditions, but is preferably 5 μm to 100 μm, and more preferably about 10 μm. Thereby, it can suppress that the light emission from a light emitting element propagates to the direction of 1st molding resin from a coating | coated member, can reduce the quantity of the light absorbed by 1st molding resin, and can output the light output of a light-emitting device. Can be increased.

  Further, since the covering member is formed thin, the color of the first molding resin is not obscured, so that the light emitting device with high contrast can be obtained when viewed from the light emission observation surface side. When a thermosetting resin is used, it can be easily formed thin by potting the coating member at a position where it is desired to be formed and then curing and shrinking with heat.

  In addition, by making the covering member a convex lens shape, the directivity angle can be controlled and the light output in the front direction can be improved.

  The sealing member 107 is preferably provided below the covering member 106 in the opening 102 for the purpose of protecting the light emitting element 105 and the wire 110, improving the mechanical strength of the light emitting device, and improving the light extraction efficiency. Thereby, the member in opening parts, such as a light emitting element, can be protected, improving the waterproofness of a light-emitting device. At this time, since the covering member extends on the first molding resin, the second molding resin, and the sealing member, not only the interface between the molding resins but also the interface between the package and the sealing member. Can be protected, and a highly reliable light-emitting device can be obtained.

  Since the sealing member is closer to the light emitting element than the covering member and is not exposed to the outside of the light emitting device, the material can be selected relatively freely. It is not particularly limited as long as it has translucency, in consideration of stress relaxation to the wire, light resistance of the material, refractive index of light, etc., for example, polyolefin resin, polycarbonate resin, polystyrene resin, Epoxy resin, acrylic resin, acrylate resin, methacrylic resin (PMMA, etc.), urethane resin, polyimide resin, polynorbornene resin, fluororesin, silicone resin, modified silicone resin, modified epoxy resin, glass epoxy resin, etc. It can be selected from materials usually used in the art, such as the above resins, liquid crystal polymers, and glass.

  The shape of the outermost surface of the covering member or the sealing member is preferably a concave shape in the vicinity of the central portion of the opening 102. Thereby, it can be set as the light-emitting device with few adhesion of the dust etc. to those members. Further, by making the concave shape, it is possible to disperse the external light incident on the light emitting element, and the effect of improving the contrast can be expected. Further, by forming the outermost surface of the sealing member into a concave shape, the covering member on the upper surface of the package is easily formed in a film shape when the covering member from the opening to the groove is potted and then formed by thermosetting. be able to. In other words, the covering member provided in the opening by potting is thicker than the covering member on the upper surface of the package because the sealing member below it is concave, and the amount of shrinkage during curing is large. As the covering member contracts, a part of the covering member on the upper surface of the package flows out toward the opening, so that the covering member on the upper surface of the package can be formed thin.

  In addition, you may use 2 or more types of sealing members as needed.

  If necessary, a phosphor, a colorant, a light diffusing material, and the like may be added to the covering member and the sealing member of the light emitting device. The phosphor converts the wavelength of light from the light emitting element. For example, by arranging the light emitting element so as to be surrounded by the layered phosphor, the blue light emitting element and the blue light are converted into green light. An RGB full-color light emitting device can be realized by using a phosphor to be converted and a phosphor to convert blue light into red light.

When providing a light diffusing material such as phosphor or particles such as SiO ₂ , it is preferably added to the sealing member below the covering member. The cover member does not contain a light diffusing material, which is usually white or a color similar to it, and is made transparent so that the color of the first molding resin in the portion covered by the cover member is not hidden, so that the diffusion A light-emitting device having high contrast can be obtained while achieving various purposes by adding materials.

  Further, the contrast can be further improved by providing a colorant such as carbon black in the upper surface of the package or a covering member in a groove to be described later.

  The light emitting device of the present invention is preferably provided with a holding part for holding the covering member on the upper surface of the package. Thereby, a coating | coated member can be arrange | positioned appropriately.

  In particular, when the surface of the first molding resin is provided with fine unevenness that scatters external light incident on the light emitting device and enhances the contrast of the light emitting device, if the unevenness is covered with the covering member, the effect of scattering is exerted. Therefore, a light-emitting device with high contrast can be obtained by disposing the holding member so as to limit the position of the covering member.

  The covering member 106 is preferably provided so as to extend in a range from the opening 102 to the holding portion 108. Thereby, when forming the covering member 106, particularly when forming by potting, it is possible to easily position or form the covering member 106, so that the portion where the covering member 106 covers the first molding resin 103 is controlled. can do. As a result, the portion where the first molding resin 103 on the upper surface of the package 101 is exposed and the light reflectance is low can be appropriately exposed on the upper surface of the light emitting device 130, and a light emitting device with high contrast can be obtained.

  The holding part may be anything as long as it can hold the covering member. For example, various processes that change grooves, protrusions, steps, wettability, and the like can be used. Moreover, a coating | coated member can be arrange | positioned more easily by providing these in combination or providing two or more.

  When the covering member is formed by potting into the opening and thermosetting, it is preferable that the distance between the opening and the side of the holding part closer to the opening is equal.

  Moreover, the holding part may be provided only on one side (for example, the end part side of the package), or may be provided on both sides of the interface so as to sandwich the interface between the molding resins.

  As shown in FIGS. 7 and 8, by providing the holding portions in both the first molding resin and the second molding resin so as to sandwich the interface, it becomes easy to arrange the covering member only on the interface. The peeling between the covering member and the package can be effectively prevented. At this time, the contrast of the light emitting device can be increased by providing the aforementioned colorant in the covering member.

  The shape of the holding portion is not particularly limited as long as it can hold the covering member. However, depending on the purpose, such as a shape that surrounds the opening when viewed from the top surface of the package, a planar shape similar to the opening on the top surface of the package, and the like It can be set as various preferable forms.

  The position where the holding portion is provided is not particularly limited, but when the holding portion is provided closer to the package end than the interface between the molding resins on the upper surface of the package, it is preferable to be near the center from the interface to the end of the package. In order to increase the contrast, it is preferable to provide a position near the interface, for example, a position closer to the interface than half of the distance from the interface to the edge of the package, so that a large amount of the first molding resin is exposed. In order to enhance the effect, the distance between the interface and the end of the covering member is increased so that the distance from the interface, for example, a position farther from the interface than half of the distance from the interface to the end of the package. It is preferable to provide it.

  In order to hold the covering member, the planar shape of the holding part preferably surrounds the interface between the molding resins on the upper surface of the package or the periphery of the opening without any break, but is partially broken, broken line, dotted line But you can. When the covering member is also provided in the opening, it is preferable that the holding part is similar to the opening and the distance from the opening to the holding part is uniform. Thereby, it can suppress that the thickness of a coating | coated member varies with places.

  A structure in which the holding portion does not protrude toward the upper surface of the package (for example, a groove) is preferable because the light-emitting device is easier to handle than a structure (for example, a protrusion) that protrudes from the upper surface of the package. Further, the structure in which the holding portion protrudes from the upper surface of the package can hold the covering member more easily than the structure in which the holding portion does not protrude. Furthermore, when the holding portion is a step, it is easier to handle the light emitting device and the covering member can be easily held as compared with the case where the holding portion is a protrusion or a groove.

  1A to 1D, the first molding resin 103 on the upper surface of the package is provided with a groove 108 surrounding the opening 102, and the covering member extends from the interface of the molding resin into the groove. Is provided. Thereby, since the distance between the end portion of the covering member and the interface of the molding resin can be increased by the depth and width of the groove, the waterproof effect can be enhanced.

  When the covering member in the groove is formed by potting into the opening and thermosetting, the distance between the opening and the side closer to the opening of the groove is equal regardless of the width of the groove. preferable.

  The width of the groove is not particularly limited, but is preferably about 100 to 300 μm in the case of a package having an upper surface of about 5 mm × 5 mm. When it is desired to increase the contrast ratio of the light emitting device, it is preferable that the groove is not formed or narrowly formed so that the color of the first molding resin in the groove portion is not easily seen by the covering member provided in the groove, When priority is given to the waterproof performance, it is preferable to form a wide area in order to lengthen the moisture intrusion route. When the width is narrow, the covering member is less likely to enter the groove, and can be appropriately changed in consideration of manufacturing convenience.

  When the covering member in the groove is formed by potting into the opening and thermosetting, it is preferable that the distance between the opening and the side closer to the opening of the groove is equal regardless of the width of the groove. .

  Moreover, when the planar shape of the opening is a square shape, the stress of the sealing member in the groove can be relieved by making the groove part circular.

  The groove may be provided across the interface between the first molding resin 503 and the second molding resin 504, for example, as shown in FIG. By providing the covering member 506 only in the groove 508, a highly reliable light-emitting device can be easily obtained. In such a light emitting device, since the covering member is not provided on the opening or the upper surface of the package, there is no possibility that light emitted from the light emitting element propagates through the covering member and reaches the first molding resin. The amount of light absorbed by the resin can be reduced, and the light output of the light emitting device can be increased.

  For example, as shown in FIG. 7, a plurality of two grooves 708 sandwiching the interface between the first molding resin 703 and the second molding resin 704 are provided, and a covering member 706 extending between the grooves is provided. You can also By providing both ends of the covering member in the groove, the covering member can be more firmly fixed and a light-emitting device with high waterproofness can be obtained.

  The groove depth H2 shown in FIG. 1D is preferably about 75 to 300 μm, for example, when the height of the light emitting device is about 5% or when the groove width is 200 μm. When it is desired to increase the contrast ratio of the light emitting device, it is preferable that the light emitting device is formed shallow so that the color of the first molding resin in the groove portion is not easily seen by the covering member provided in the groove. If you want to prioritize waterproof performance, it is preferable to form deeply in order to lengthen the moisture intrusion route, but if it is formed too deeply, the strength of the first molding resin will decrease, causing problems such as package damage. Therefore, it is preferable to adjust appropriately. When the groove is formed deeply, a light emitting device with high contrast can be obtained by providing a colorant on the covering member in the groove.

  When the covering member is provided so as to extend from the groove to another part (for example, an opening) of the light emitting device, the angle formed between the side surface in the groove near the part where the covering member is provided and the upper surface of the package is The covering member is preferably rounded so as to be easily provided in the groove. The radius of roundness can be adjusted as appropriate depending on the depth and length of the groove. Furthermore, in order to improve the adhesion and waterproofness of the covering member, the bottom surface side of the groove is preferably wider than the top surface side of the package. In order to improve the adhesion between the groove and the covering member, the groove may have irregularities.

  In addition, the holding portion may be protrusions 408 and 808 as shown in FIGS. 4 and 8, for example.

  In that case, the height of the protrusion is preferably about 100 to 200 μm, for example. When it is desired to increase the contrast ratio of the light emitting device, it is preferable to form the first molding resin so that the color of the first molding resin is not easily seen by the covering member held by the protrusions. In order to lengthen the intrusion route, it is preferable to form it high. In order to stably hold the covering member, a uniform height is preferable.

  The shape of the protrusion is not particularly limited as long as it can hold the covering members 406 and 806, but the angle (α in FIG. 4) formed by the upper surface of the package and the side surface of the protrusion close to the interface between the molding resins is In order to prevent peeling of the member, an acute angle is preferable. At this time, the material can be easily formed by selecting a material (for example, thermosetting resin) formed by curing the liquid material as the material of the covering member. Moreover, in order to form a coating | coated member easily, it is preferable that it is an obtuse angle which spreads upwards of a light-emitting device.

For example, as shown in FIG. 8, a plurality of protrusions 808 sandwiching the interface between the first molding resin 803 and the second molding resin 804 can be provided, and a covering member 806 can be provided between the protrusions.
Further, the holding portions may be steps 608 and 1008 as shown in FIGS. 6 and 10, for example.

  In that case, the height of the step is preferably about 100 to 200 μm, for example. When it is desired to increase the contrast ratio of the light emitting device, it is preferable to form the first molding resin on the surface with the lower step so that the color of the first molding resin is not covered with the covering member, and the waterproof performance should be given priority. In this case, it is preferable to form a high height in order to lengthen the moisture intrusion route.

  The shape of the step is not particularly limited as long as it can hold the covering member, but the angle (β in FIG. 6) formed by the upper surface of the package and the side surface close to the interface between the molding resins of the step is peeled off of the covering member. In order to prevent this, an acute angle is preferable. At this time, the material can be easily formed by selecting a material (for example, thermosetting resin) formed by curing the liquid material as the material of the covering member. Moreover, in order to form a coating | coated member easily, it is preferable that it is an obtuse angle which spreads upwards of a light-emitting device.

  In addition to these, the light-emitting device of the present invention can include the following members.

  The conductor wiring 109 in FIGS. 1A to 1C is for electrically connecting the light emitting element 105 and an electrode outside the light emitting device.

  Two or more conductor wirings are provided in one light emitting device. As the conductor wiring, for example, a lead frame obtained by plating a copper or iron plate with silver or gold, a metal film formed by a plating method, or the like can be used.

  The conductor wiring is normally exposed in the opening of the package and partly embedded in the second molding resin or / and the first molding resin to become external terminals protruding outside from the bottom surface or side surface of the package. . This external terminal portion is electrically connected to the outside of the light emitting device such as a printed board using solder or the like.

  In the present invention, when the conductor wiring is a plate-shaped lead frame, the conductor wiring is preferably bent at a portion embedded in the package as shown in FIG. 1C. As a result, the adhesion between the package and the lead frame is increased, so that the peeling of both members and the intrusion of moisture and the like associated therewith can be effectively prevented, and the depth of the opening can be reduced, so that the light extraction efficiency is high. It can be a light emitting device.

  In the case where a plurality of light emitting elements having different emission colors are used in one light emitting device, it is preferable that a plurality of positive or / and negative lead frames are provided according to the number of the respective light emitting elements. Thereby, the light emission of a light emitting element can be adjusted separately, and a desired color can be displayed.

  The wire 110 in FIGS. 1A and 1B is a thin metal wire that electrically connects the electrode of the light emitting element 105 and the conductor wiring 109.

  As a material, various metals having excellent conductivity, for example, Au, Al, Cu and the like are used.

  The light emitting device of the present invention may be provided with other members, for example, an electrostatic protection element such as a Zener diode in order to protect the light emitting element from static electricity and overvoltage.

  Embodiments of the present invention will be described below with reference to the drawings.

  A light emitting device 130 of this example is shown in FIG. The light emitting device 130 is obtained as follows.

  First, a lead frame 109 as a conductor wiring plated with silver and carbon black as a first molding resin 103 are applied to a 0.25 mm thick iron-containing copper plate subjected to punching and bending. Using the included PPA resin and the white PPA resin as the second molding resin 104, first, the second molding resin is molded by the method of Patent Document 1, and the first molding resin is molded. In this way, the package 101 is obtained.

  The package 101 of the present embodiment has a substantially rectangular parallelepiped shape with a top surface of 5.5 mm in length and a width of 5.5 mm, and a height from the bottom surface to the top surface at the package end is 3.55 mm.

  The opening 102 is provided at the approximate center of the upper surface of the package. The opening 102 is 3.5 mm long and 3.5 mm wide and has a square shape with rounded corners with a radius of 0.8 mm. The depth from the upper surface of the package 101 is as follows. 1.0 mm. The inner wall surface of the opening 102 is inclined so as to spread at an angle of 60 degrees from the bottom surface to the upper surface side. The second molding resin 104 is exposed with a width (W1) of 0.2 mm so as to surround the opening 102 on the upper surface of the package 101, and the first molding resin 103 is provided so as to surround it. Yes.

  The groove 108 has a width of 0.2 mm and a depth (H2) of 0.15 mm, and is provided at a position 0.5 mm away from the opening 102 on the upper surface of the package so as to have a shape substantially similar to the planar shape of the opening 102 on the upper surface of the package. ing. That is, the distance W2 from the end of the groove 108 from the outside of the package to the interface between the first molding resin 103 and the second molding resin 104 is set to be 0.3 mm. The width W3 from the end of the top surface of the package to the end of the groove is about 0.46 mm. The angle formed between the side surface near the opening of the groove 108 and the upper surface of the package 101 is approximately 90 degrees.

  Next, a light emitting diode, which is a rectangular light emitting element 105 that emits light having wavelengths of 460 nm, 550 nm, and 630 nm, is formed on the bottom surface of the opening 102 of the package 101 by using an epoxy resin or silver paste (not shown). Each frame is bonded to the frame and electrically connected to the positive and negative lead frames 109 by Au wires 110 having a diameter of 25 μm.

  Then, 6.6 mg of a silicone resin as the sealing member 107 is potted in the opening 102 and cured by heating at 100 ° C. for about 3 hours and at 150 ° C. for 4 hours.

  Next, 3.5 mg of epoxy resin as the covering member 106 is potted on the opening 102. At this time, potting is performed so that the liquid epoxy resin covers the interface of the overflow molding resin from the opening 102 and enters the inside of the groove 108 and further rises from the upper surface of the package 101. Since the surface tension of the liquid epoxy resin works at the corner of the groove 108, it can be easily formed in the shape as described above. Thereafter, the epoxy resin is cured by heating at 100 ° C. for 3 hours and at 150 ° C. for 4 hours. Since epoxy resin shrinks due to heat curing, it can be formed into a film after curing by potting so as to rise first.

  The thickness of the covering member 106 formed in this way is 0.2 mm near the center of the opening 102, approaching the inner wall of the opening 102 while gradually becoming thinner, and is in contact with the opening 102 without passing through the sealing member 107. The thickness was 0.1 mm, the upper surface (H1) of the package 101 was 0.01 mm or less, the thickest portion in the groove 108 was 0.15 mm, and the thinnest portion was 0.1 mm.

  Finally, the external terminals of the lead frame 109 are bent along the package 101.

  In this way, the light emitting device 130 of this example is obtained.

  As shown in FIG. 2, the light emitting device 230 according to the second embodiment is flat except that the lead frame 209 inside the package 201 is not bent and flat, the package upper surface is flat, and the covering member 206 is formed by printing. Is produced in the same manner as in Example 1. Even if it does in this way, the effect of the present invention can be acquired.

  As shown in FIG. 3, the light emitting device of Example 3 is the same as Example 1 except that a covering member 306 of a translucent resin sheet is formed so as to cover the interface of the molding resin on the upper surface of the package. When manufactured, a light emitting device as shown in FIG. 3 can be obtained. In the light emitting device of this embodiment, a member having translucency can be provided in the opening to protect the light emitting element, the wire, and the like. Even if it does in this way, the effect of the present invention can be acquired.

  As shown in FIG. 4, the light emitting device of Example 4 is the same as Example 1 except that the projection 408 is formed on the first molding resin and the covering member 406 is formed over the range from the opening to the projection 408. Produced in the same manner. Even if it does in this way, the effect of the present invention can be acquired.

  As shown in FIG. 5, the light emitting device 330 of Example 5 is provided with a groove 508 on the interface between the first molding resin and the second molding resin, and the covering member 306 is formed in the groove 508. Even if it does in this way, the effect of the present invention can be acquired.

  In the light emitting device of Example 6, as shown in FIG. 6, a step 608 is provided in the first molding resin, and a covering member 606 is formed from the step to the opening. Even if it does in this way, the effect of the present invention can be acquired.

  In the light emitting device of Example 7, as shown in FIG. 7, a groove 708 is provided in each of the first molding resin and the second molding resin, and a covering member 706 is formed so as to extend into two grooves. Yes. Even if it does in this way, the effect of the present invention can be acquired.

  As shown in FIG. 8, in the light emitting device of Example 8, two protrusions 808 are provided on the package end side and the opening side of the interface so as to sandwich the interface between the molding resins, and a covering member 806 is provided between the protrusions. Forming. Even if it does in this way, the effect of the present invention can be acquired.

  In the light emitting device of Example 9, as shown in FIG. 9, the interface between the molding resins is exposed in the opening, and the covering member 906 covering the opening and the sealing member 907 under the covering member 906 are opened. It is formed in the part. Even if it does in this way, the effect of the present invention can be acquired.

  In the light emitting device of Example 10, as shown in FIG. 10, the first molding resin is provided with a step, and the second molding resin is provided with a protrusion 1008 lower than the height of the step, and the covering member 1006 is opened. It is provided over the level difference from the part. Even if it does in this way, the effect of the present invention can be acquired. By the protrusions formed of the second molding resin, it is possible to reduce the light emitted from the light emitting element from being absorbed by the first molding resin of the step portion, and to increase the output of the light emitting device. In addition, the members including the covering member do not protrude from the upper surface of the package and are easy to handle, which is preferable.

  As shown in FIG. 11, the light emitting device of Example 11 is provided with a groove 1108 having one side surface made of the second molding resin, and a bottom surface and one side surface made of the second molding resin. A member 1106 is provided from the opening to the groove. Even if it does in this way, the effect of the present invention can be acquired.

101, 201 Package 102, 202, 302 Openings 103, 203, 303, 403, 503, 603, 703, 803, 903, 1003, 1103, 34 First molding resin (black part)
104, 204, 304, 404, 504, 604, 704, 804, 904, 1004, 1104, 33 Second molding resin (white part)
105, 205 Light emitting element 106, 206, 306, 406, 506, 606, 706, 806, 906, 1006, 1106 Cover member 107, 207, 307, 407, 607, 907 Sealing member 108, 308, 408, 508, 608, 708, 808, 908, 1008, 1108 Holding part (groove, protrusion, step)
109, 209 Conductor wiring (lead frame)
110, 210 Wire 130, 230 Light emitting device

Claims (7)

A package having an opening on the top surface;
A first molding resin constituting at least a part of the upper surface of the package;
A second molding resin having a light reflectance higher than that of the first molding resin, which constitutes at least the inner wall surface of the opening of the package;
A light emitting element placed in the opening;
A covering member provided to cover the interface between the first molding resin and the second molding resin on the upper surface or inner wall surface of the package;
A light emitting device comprising: The light emitting device according to claim 1, wherein the covering member is provided so as to extend from the interface into the opening. The light emitting device according to claim 2, wherein a sealing member is provided on a side closer to the light emitting element than the covering member in the opening. The interface is exposed on the upper surface of the package;
The first molding resin includes a holding portion on an upper surface of the package,
The light-emitting device according to claim 1, wherein the covering member extends from the interface to the holding portion. The light-emitting device according to claim 4, wherein the holding portion is a groove. The light-emitting device according to claim 4, wherein the covering member is provided in a range from the opening to the holding portion. The light emitting device according to claim 2, wherein the portion of the covering member provided on the upper surface of the package is thinner than the portion provided in the opening.

Images