JP2006130714A - Injection molding machine, led device and led device manufactured using injection molding machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED device of which the inside surface has high reflectivity and the other part has high light absorptivity and characterized in that these characteristics are hard to change secularly, and an injection molding machine suitable for manufacturing the LED device. <P>SOLUTION: This injection molding machine is constituted so that the resin flowing channel of a nozzle and a resin flowing channel of a sprue are connected when the contact part of the leading end of the nozzle is in contact with the central contact part of the sprue of a mold to inject a heated molten resin in the mold under pressure and has a plurality of nozzles and a plurality of the sprues corresponding to the respective nozzles and is equipped with a horizontal in-plane moving device for relatively moving the nozzles and the sprues within a horizontal plane. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an injection molding machine, an LED device, and an LED device manufactured by using an injection molding machine.

  The conventional injection molding machine is a single head type, and has one nozzle and one mold spool and injection port. Moreover, although the conventional metal mold opens and closes, it does not rotate or move linearly.

  In the LED device, a lead frame is inserted and molded to form a resin body portion 5 as shown in FIG. The resin body portion 5 is integral, and the outer shape is a rectangular parallelepiped, a rectangular parallelepiped, or a cylinder. A conical space 52 is formed from the upper surface 51 to the middle, and the lead frame 4 is exposed in the small circle portion 53. The LED chip 7 is affixed to the small circle portion 53 (bonding), and the electrode of the LED chip 7 and the lead frame 4 are connected by an Au wire (not shown) (wiring). Thereafter, the LED chip is encapsulated with a transparent resin (not shown) and the lens 8 is formed. The inner side surface 54 of the conical space 52 reflects the light emitted from the LED chip, passes through the lens 8 and sends it out.

  The resin body portion 5 of the conventional LED device is integrally formed of, for example, a white resin, and increases the reflectance of light on the inner side surface 54. In addition, since it is preferable that the outer surface 55 of the resin body part 5 suppresses reflection of light, conventionally, black magic ink or the like has been manually applied to the outer surface 55.

  However, manual application of black ink or paint to the outer surface 55 of the conventional LED device is a difficult operation, is expensive and problematic, and the ink or paint is peeled off over time. The white color is visible in some places, the light absorption is poor and the aesthetics are inferior.

  On the other hand, although it is conceivable to improve the light absorption by making the entire resin body portion 5 black, the inner side surface 54 is also black and hardly reflects the light from the LED, which causes a problem that the brightness of the LED device is slightly low and dark. .

  Accordingly, an object of the present invention is to provide an LED device in which the inner surface has a high light reflectivity, the other portions have a high light absorptance, and these characteristics hardly change over time. It is also an object of the present invention to provide an injection molding machine suitable for manufacturing such an LED device according to the present invention.

  The above object is achieved by the LED device of the first invention according to claim 4, that is, the LED device having a resin body part formed by sequentially injection-molding two kinds of resins.

  In a preferred embodiment of the first invention, as described in claim 5, the two types of resins are a black resin and a white resin, and the melting temperature of the black resin is higher than the melting temperature of the white resin, The black part of the resin body part is manufactured, and after the black part is solidified, the white resin is injection-molded to manufacture the white part of the resin body part.

  According to the injection molding machine according to the present invention, since the metal lead frame can be injection-molded a plurality of times while being conveyed by a transfer press or the like, two or more kinds of resins can be combined efficiently and at a relatively low price. The resin molded body can be formed at a predetermined position of the lead frame.

  According to the LED device of the present invention, since the resin body portion can be formed by dividing it into a black portion and a white portion, there is almost no secular change, and each desired portion is reflected by a desired light reflection. Can keep rate.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

First Embodiment FIG. 1 is a schematic view of a first embodiment of an injection molding machine according to the present invention, (a) is a front sectional view of a nozzle, and (b) is a plan view of a mold.

  In each of the nozzles 1a and 1b, the nozzle tips 11a and 11b face downward in the vertical direction, pressurizing the molten resin and injecting it downward in the vertical direction. The horizontal interval between the nozzles 1a and 1b is more than a predetermined distance for maintenance and temperature management. The nozzles 1a and 1b can be moved up and down by a driving device (not shown). On the upper surface of the mold 2, two spools 21a and 21b are arranged at a predetermined interval. Circular resin inlets 22a and 22b are provided at the centers of the spools 21a and 21b. The resin injection ports 22a and 22b are each connected to a resin flow path in the mold. And the metal mold | die 2 can be linearly moved within a horizontal surface with a drive device not shown.

  First, the mold 2 is set to the left position indicated by a solid line, the nozzle 1a is lowered, and the contact portion of the nozzle tip 11a and the contact portion of the spool 21a of the mold 2 are simultaneously brought into contact with the nozzle 1a. The stored hot melt resin is pressurized, and the hot melt resin flows into the resin flow path A in the mold 2 and is cooled to form, for example, a black portion of the resin body portion.

  Next, the mold 2 is moved to the right position indicated by the dotted line, the nozzle 1b is lowered, and the contact portion of the nozzle tip 11b and the contact portion of the spool 21b of the mold 2 are simultaneously contacted. The heated molten resin stored therein is pressurized, and the heated molten resin flows into the resin flow path B in the mold 2 and is cooled to form, for example, a white portion of the resin body portion.

Second Embodiment FIG. 2 is a schematic view of a second embodiment of an injection molding machine according to the present invention, (a) is a front sectional view of a nozzle, and (b) is a plan view of a mold.

  In each of the nozzles 1a and 1b, the nozzle tips 11a and 11b face downward in the vertical direction, pressurizing the molten resin and injecting it downward in the vertical direction. The horizontal interval between the nozzles 1a and 1b is more than a predetermined distance for maintenance and temperature management. The nozzles 1a and 1b can be moved up and down by a driving device (not shown). On the upper surface of the mold 2, two spools 21a and 21b are arranged at a predetermined interval. Circular resin inlets 22a and 22b are provided at the centers of the spools 21a and 21b. The resin injection ports 22a and 22b are each connected to a resin flow path in the mold. The mold 2 can be rotated 180 degrees around the rotating shaft 23 in the forward and reverse directions by a driving device (not shown).

  First, the mold 2 is set to a 0 ° position indicated by a solid line, the nozzle 1a is lowered, and the contact portion of the nozzle tip 11a and the contact portion of the spool 21a of the mold 2 are simultaneously contacted. The heated molten resin stored in is pressurized and flows into the resin flow path A in the mold 2 and cooled to form, for example, a black portion of the resin body portion.

  Next, the mold 2 is moved to the 180 ° position indicated by the dotted line, the nozzle 1b is lowered, and the contact portion of the nozzle tip 11b and the contact portion of the spool 21b of the mold 2 are simultaneously contacted with the nozzle 1b. The heated molten resin stored in the container is pressurized, and the heated molten resin flows into the resin flow path B in the mold 2 and cooled to form, for example, a white portion of the resin body portion.

Third Embodiment FIGS. 3A and 3B are cross-sectional views of a resin body portion showing a manufacturing process of an LED device according to the present invention, wherein FIG. 3A shows primary molding and FIG. 3B shows secondary molding.

  The metal lead frame 4 is introduced into the mold of the injection molding machine while being sequentially fed by a transfer press. A black molten resin is pressurized and injected through the resin flow path A and then cooled to form a black portion 31 (see FIG. 3A).

  Next, the lead frame 4 is fed and the mold is moved, then white molten resin is pressurized and injected through the resin flow path B, and then cooled to form the white portion 32 in close contact with the black portion 31 ( (Refer FIG.3 (b)).

  The resin body portion is formed as described above, and an LED chip (not shown) is attached to the exposed portion 41 of the lead frame 4 to manufacture an LED device. When the LED is caused to emit light, the light generated from the LED is reflected by the inner side surface 54 and sent out to the outside, but the inner side surface 54 is white and has a high reflectance and the reflection efficiency is increased. On the other hand, the outer side surface 55 of the resin body portion 5 is black and suppresses unnecessary reflection.

4th Embodiment FIG. 4 is a cross-sectional view of a resin body portion showing a manufacturing process of an LED device according to the present invention, wherein (a) shows primary molding and (b) shows secondary molding.

  In the third embodiment, the black portion is formed first and then the white portion is formed. However, in the fourth embodiment, on the contrary, after the white portion 33 is formed, the black portion 34 is formed. Different.

  In any embodiment, the melting temperature of the part to be formed first must be sufficiently higher than the melting temperature of the part to be formed later. Otherwise, if the molten resin to be formed later is touched, the contact portion of the portion formed and solidified first will be melted and partially mixed.

  Although the embodiments using two resins having different colors have been described, it is possible to combine two or more resins having different environmental impacts such as properties such as strength, conductivity, and coefficient of thermal expansion, and economics and harmfulness such as price. It is also possible to change and implement.

It is the schematic of 1st Embodiment of the injection molding machine which concerns on this invention, (a) is front sectional drawing of a nozzle, (b) is a top view of a metal mold | die. It is the schematic of 2nd Embodiment of the injection molding machine which concerns on this invention, (a) is front sectional drawing of a nozzle, (b) is a top view of a metal mold | die. It is sectional drawing of the resin body part which shows the manufacturing process of the LED device which concerns on this invention, (a) shows primary shaping | molding, (b) shows secondary shaping | molding. It is sectional drawing of the resin body part which shows the manufacturing process of the LED device which concerns on this invention, (a) shows primary shaping | molding, (b) shows secondary shaping | molding. It is the schematic of the conventional LED device.

Explanation of symbols

1a Nozzle 1b Nozzle 11a Nozzle tip 11b Nozzle tip 2 Mold 21a Spool 21b Spool 22a Resin inlet 22b Resin inlet 23 Rotating shaft 31 Black portion 32 White portion 33 White portion 34 Black portion 4 Lead frame 41 Exposed portion 5 Resin body portion 51 Upper surface 52 Space 53 Small circle portion 54 Inner side surface 55 Outer side surface 7 LED chip 8 Lens A Resin flow path B Resin flow path

Claims (7)

When the abutting part of the nozzle tip and the abutting part at the center of the spool of the mold are in contact, the resin flow path of the nozzle and the resin flow path of the spool are connected, and the heated molten resin is injected into the mold under pressure. An injection molding machine,
An injection molding machine comprising a plurality of nozzles, a plurality of spools corresponding to each of the nozzles, and a horizontal plane moving device that relatively moves the nozzles and spools in a horizontal plane. 2. The injection molding machine according to claim 1, wherein the horizontal plane moving device has a rotating shaft that faces in a vertical direction, and rotates the mold around the rotating shaft. 3. 2. The injection molding machine according to claim 1, wherein the horizontal plane moving device moves the mold linearly within the horizontal plane. An LED device having a resin body formed by sequentially injection-molding two types of resins. The two types of resins are black resin and white resin, and the melting temperature of the black resin is higher than the melting temperature of the white resin. First, the black portion of the resin body is manufactured by injection molding of the black resin. 5. The LED device according to claim 4, wherein a white portion of a resin body portion is manufactured by injection molding of a white resin after solidifying. It manufactured using the injection molding machine characterized by having the resin body part formed by sequentially injection-molding two types of resin using the injection molding machine according to any one of claims 1 to 3. LED device. The two types of resins are black resin and white resin, and the melting temperature of the black resin is higher than the melting temperature of the white resin. First, the black portion of the resin body is manufactured by injection molding of the black resin. The LED device manufactured by using the injection molding machine according to claim 6, wherein the white portion of the resin body portion is manufactured by injection molding of a white resin after the solidification of the resin.

Images