JP2012161921A - Method for manufacturing airtight electronic component, and airtight electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing an airtight electronic component through a simple process while maintaining airtightness of the electronic component by maintaining compressive strain applied to a member for sealing an airtight part on an electronic substrate, and to provide the airtight electronic component manufactured by the method.SOLUTION: The electronic substrate with a first molded product arranged thereon is placed on an injection molding die after arranging the first molded product near an airtight region on the electronic substrate, and compressive strain is applied to the first molded product by mold clamping force. A second molded product for holding the compressive strain of the first molded product is then formed by injection molding. The airtight part for covering the airtight region on the electronic substrate is thereby formed to manufacture the airtight electronic component.

Description

  The present invention relates to a method for manufacturing an airtight electronic component in which an airtight portion is formed on an electronic substrate, and the airtight electronic component.

  Conventionally, an airtight electronic component in which an airtight portion is formed on an electronic substrate has been widely used. In these airtight electronic components, an airtight portion is formed and a metal terminal is provided for taking out an electric signal, and the airtightness of the takeout portion of the metal terminal is often a problem.

  For example, in an electronic component used outdoors, when exposed to moisture, if the airtightness is insufficient, an internal electronic element may malfunction. For this reason, a case covering the electronic substrate is formed, or the entire electronic substrate is sealed with resin.

  As a method of manufacturing an airtight electronic component in which an airtight part is provided on such an electronic component, for example, an adhesion member such as an O-ring surrounding the periphery of an image sensor disposed on the electronic substrate is disposed on the electronic substrate, and imaging is performed. A cylindrical pressing member that surrounds the outer periphery of the element is disposed on the contact member, and after the translucent member is disposed on the opening portion of the contact member so as to close the opening, force is applied to the pressing member and the contact member. Is applied to form an airtight part by sealing an image pickup device on an electronic substrate (Patent Document 1).

JP 2009-201079 A

  However, in the method described in Patent Document 1, the O-ring is easy to move on the substrate, and it is difficult to arrange each member for forming the airtight portion at a predetermined position, and it is difficult to assemble the airtight electronic component. . Further, in order to maintain the compressive strain generated in the O-ring and maintain the airtightness, the pressing member and the substrate are fixed by a method such as adhesion or the position of the pressing member is fixed by a member fixed on the substrate. From these points, it is not easy to assemble the airtight electronic component.

  The present invention has been made to solve the above-described problems, and its object is to maintain the airtightness of electronic components by maintaining the compressive strain applied to the members that hermetically seal the airtight portions on the electronic substrate. An object of the present invention is to provide a method for manufacturing an airtight electronic component that can be manufactured and that has a simple process, and an airtight electronic component manufactured by the method.

  The inventors have placed the first molded product in the vicinity of the hermetic zone on the electronic substrate, and then placed the electronic substrate on which the first molded product has been placed on a mold for injection molding. Forming an airtight part covering the airtight area on the electronic substrate by applying compression strain to the first molded product and then forming a second molded product that retains the compression strain of the first molded product by injection molding. The airtightness of the airtight part is maintained by the repulsive force between the electronic substrate and the first molded product caused by the compressive strain applied to the first molded product, and an airtight electronic component having excellent airtightness can be obtained by a simple process. The inventors have found that it can be manufactured, and have completed the present invention.

(1) 1) A step of arranging a first molded product in the vicinity of an airtight region on an electronic substrate,
2) placing the electronic substrate on which the first molded product is disposed on a mold for injection molding, and applying compressive strain to the first molded product by a clamping force; and
3) forming a second molded product that retains the compression strain of the first molded product by injection molding;
Including the steps of
At least a part of an airtight part that is formed on the electronic substrate and covers the airtight region and is airtight is a composite made of the first molded product and the second molded product,
Manufacturing method for airtight electronic components.

  (2) The airtight electronic component according to (1), wherein the material of the first molded article is a thermoplastic resin containing a filler, and the compressive strain is 0.5% or more and 2.0% or less. Production method.

  (3) The method for manufacturing an airtight electronic component according to (1) or (2), wherein the first molded product is injection-molded on the electronic substrate.

  (4) The method for manufacturing an airtight electronic component according to any one of (1) and (3), wherein the material of the first molded article is a polybutylene terephthalate resin.

  (5) An airtight electronic component manufactured by the method according to any one of (1) to (4).

  According to the present invention, a method for manufacturing an airtight electronic component that can maintain the airtightness of the electronic component by maintaining the compressive strain applied to the member that hermetically seals the airtight portion on the electronic substrate, and the process is simple, and The airtight electronic component manufactured by the method can be provided.

It is a schematic diagram which shows the cross section of the 1st molded product and the 2nd molded product in this invention. It is a schematic diagram of the cross section of the airtight part formed by the method of this invention. It is a schematic diagram of the cross section of the airtight part formed by the method of this invention. It is a schematic diagram of the cross section of the airtight part formed by the method of this invention. It is the schematic diagram which looked at the electronic substrate with a terminal from the upper surface. It is the schematic diagram which looked at the electric substrate with a terminal in which the 1st molded article was formed in the surface from the upper surface. It is a schematic diagram of the cross section before the mold clamping of the electronic substrate with a terminal in which the 1st molded product was formed in the surface mounted in the metal mold | die. It is a schematic diagram of the cross section of the state clamped of the electronic substrate with a terminal in which the 1st molded article was formed in the surface mounted in the metal mold | die. It is a schematic diagram of the cross section of the airtight electronic component of the state with which the material of the 2nd molded product was filled in the metal mold | die. It is a perspective view of the airtight electronic component sealed with the 1st molded product and the 2nd molded product.

  Hereinafter, embodiments of the present invention will be described. In addition, embodiment of this invention is not limited to the following embodiment at all, and the technical scope of this invention is not limited to this.

  In the detailed description of the invention of the present application and in the claims, the “airtight region” on the electronic substrate is a region where an airtight state on the electronic substrate is required. Specific examples of the hermetic zone include a region where a circuit is formed in an electronic substrate constituting an electronic component used in a corrosive gas atmosphere such as an automotive part, and an airtight state between an IC chip and a signal terminal. A region where the required element is arranged can be mentioned.

  Further, in the detailed description of the invention of the present application and in the claims, the “airtight portion” formed on the electronic substrate is formed on the electronic substrate and covers the airtight region in a non-contact state or a contact state. Thus, it is a member that brings the airtight region into an airtight state. At least a part of the hermetic portion is composed of a composite made up of a first molded product and a second molded product described later.

  The manufacturing method of an airtight electronic component of the present invention includes the following steps 1) to 3), and covers an airtight region including at least a part of a composite formed of a first molded product and a second molded product. This is a method of forming an airtight part that is airtight on an electronic substrate. Hereinafter, the steps 1) to 3) and the method for forming the hermetic portion will be described in order.

1) a step of arranging a first molded product in the vicinity of an airtight region on an electronic substrate;
2) placing the electronic substrate on which the first molded product is placed on a mold for injection molding, and applying compressive strain to the first molded product by a clamping force; and
3) forming a second molded product that retains the compression strain of the first molded product by injection molding;

[Process 1)]
Step 1) is a step of placing the first molded product in the vicinity of the hermetic zone on the electronic substrate.

  In the present invention, the electronic substrate used for manufacturing the airtight electronic component is not particularly limited as long as it is an electronic substrate conventionally used for manufacturing electrical / electronic components, and even a single layer substrate or a multilayer substrate may be used. Also good. The material of the electronic substrate is not particularly limited as long as the object of the present invention is not impaired, and can be appropriately selected from organic materials, inorganic materials, or composite materials thereof that have been conventionally used as materials for electronic substrates.

  Specific examples of suitable materials for the electronic substrate include epoxy resin, bismaleimide triazine resin, cyanate resin, polyparaphenylene benzbisoxazole resin, polyamide resin, polyimide resin, liquid crystalline polymer, polyether ether ketone resin, polyether ketone. Examples thereof include resins such as resins and combinations thereof. When the material of the electronic substrate is a resin, these resins preferably include fibers such as glass fibers, high-elasticity resin fibers, carbon fibers, or metal fibers. In such a case, the fiber material is preferably in the form of a woven or non-woven fabric.

  The shape of the electronic substrate is not particularly limited as long as the hermetic portion can be formed, and may be a planar shape, a curved surface shape, or a combination of these shapes. Among these shapes, a planar shape is preferable because the first molded product is easily fixed at a predetermined position.

  The method for arranging the first molded product in the vicinity of the hermetic zone on the electronic substrate is not particularly limited. As a specific method of placing the first molded product at a predetermined location in the vicinity of the hermetic zone on the electronic substrate, a method of placing the pre-formed first molded product at a predetermined position on the electronic substrate, There is a method of forming a first molded product at a predetermined position on an electronic substrate by insert injection molding. When forming a 1st molded product by insert injection molding, it is preferable to provide a recessed part previously in the location which forms the 1st molded product of an electronic substrate. In this case, the first molded product is more firmly fixed to the substrate. When the first molded product is placed at a predetermined position on the electronic substrate, the first molded product may or may not be fixed on the electronic substrate by means such as adhesion.

  As a method of arranging the first molded product at a predetermined position in the vicinity of the hermetic zone on the electronic substrate, the first molded product can be easily manufactured and positioned on the electronic substrate. Since the product is difficult to move, a method of forming the first molded product at a predetermined position on the electronic substrate by insert injection molding is more preferable.

  The method for producing the first molded product in the case of using the first molded product molded in advance is not particularly limited. Examples of the method for producing the first molded product in such a case include injection molding using a thermoplastic resin, melt processing methods such as extrusion molding, cutting processing methods, and press processing methods.

  The material of the first molded product is not particularly limited as long as a desired compressive strain can be imparted by the clamping force in the step 2) described below, and the curability of a thermoplastic resin, a thermosetting resin, a photocurable resin, or the like. Resin, rubber and the like can be mentioned. As described above, since insert injection molding is more preferable as a method of disposing the first molded product on the electronic substrate, a thermoplastic resin is more preferable as the material of the first molded product.

  When the material is a thermoplastic resin, it is not particularly limited as long as it can be injection-molded, and either a crystalline resin or an amorphous resin can be used. Specific examples of suitable thermoplastic resins include polyolefin (polyethylene (PE), polypropylene (PP), poly-4-methyl-pentene-1, polycyclic olefin, etc.), polystyrene (PS), AS resin, ABS resin, poly General-purpose thermoplastic resins such as vinyl chloride (PVC), polyacrylonitrile (PAN), (meth) acrylic resin, cellulosic resin, elastomer; aliphatic polyamide (nylon 6, nylon 6,6, nylon 12, nylon 6,12, etc. ), Aromatic polyamide (MXD nylon, etc.), aromatic polyester resin (polyethylene terephthalate resin (PET), polybutylene terephthalate resin (PBT), polyethylene naphthalate resin (PEN), etc.), polycarbonate (PC), polyacetal (POM) , Polyphenylene Ether resin (PPE), polyarylene sulfide (PAS) (polyphenylene sulfide resin (PPS), etc.), polysulfone (PSu), polyimide (PI), liquid crystalline polymer (LCP) (liquid crystalline polyester, liquid crystalline polyester amide, liquid crystalline polyamide, etc. Engineering plastics; aliphatic dicarboxylic acids, aliphatic diols, and aliphatic polyesters obtained by polycondensation of monomers selected from the group consisting of aliphatic carboxylic acids or cyclic compounds thereof, diisocyanates, etc. Examples thereof include biodegradable resins such as molecular weight aliphatic polyesters. These thermoplastic resins can be used in combination of two or more.

  Among these thermoplastic resins, polybutylene terephthalate resin is particularly preferable because of its excellent balance of electrical properties, heat resistance, and durability. In addition, when applying a clamping force to the first molded product and applying compressive strain, the material of the first molded product is excellent in adhesion with the electronic substrate and easily forms an airtight part with good airtightness. A thermoplastic elastomer is also preferable.

  In the present invention, when a thermoplastic resin is used as the molding material of the first molded product, the thermoplastic resin can be blended with a filler for the purpose of improving the mechanical properties of the molded product. The type of filler to be blended with the thermoplastic resin is not particularly limited as long as the object of the present invention is not impaired, and various fillers conventionally used as fillers for polymer materials can be used. Either inorganic fillers or organic fillers can be used. Further, the shape of the filler is not limited as long as the object of the present invention is not impaired, and any of a fibrous filler, a granular filler, and a plate-like filler can be suitably used.

  Suitable fibrous fillers include, for example, glass fibers, asbestos fibers, silica fibers, silica-alumina fibers, alumina fibers, zirconia fibers, boron nitride fibers, silicon nitride fibers, boron fibers, potassium titanate fibers, stainless steel, aluminum Inorganic fibrous materials such as metallic fibrous materials such as titanium, copper, and brass.

  Suitable powdery fillers include, for example, carbon black, graphite, silica, quartz powder, glass beads, milled glass fiber, glass balloon, glass powder, calcium silicate, aluminum silicate, kaolin, talc, clay, diatomaceous earth, wollast. Silicate such as knight, iron oxide, titanium oxide, zinc oxide, antimony trioxide, metal oxide such as alumina, metal carbonate such as calcium carbonate and magnesium carbonate, metal sulfate such as calcium sulfate and barium sulfate Other examples include ferrite, silicon carbide, silicon nitride, boron nitride, and various metal powders. Suitable plate-like fillers include mica, glass flakes, various metal foils and the like.

  Among these fillers, it is particularly preferable to use glass fibers because of excellent balance between cost and physical properties of the obtained first molded product.

  As the glass fiber, any known glass fiber is preferably used, and the glass fiber diameter, the cross-sectional shape such as a cylinder, a bowl-shaped cross section, an oval cross section, or the length or glass used for manufacturing chopped strands, rovings, etc. It does not depend on the cutting method. In the present invention, the type of glass used as a raw material for the glass fiber is not particularly limited, but E glass or corrosion resistant glass containing a zirconium element in the composition is preferably used in terms of quality.

  Further, for the purpose of improving the interface characteristics between the matrix of the thermoplastic resin and the filler, a filler whose surface is treated with an organic treating agent such as a silane compound or an epoxy compound is preferably used. As the silane compound and epoxy compound used for such a filler, any known one can be preferably used, and does not depend on the type of silane compound or epoxy compound used for the surface treatment of the filler in the present invention.

  The amount of the filler used is not limited as long as the object of the present invention is not impaired, but typically, 5 parts by mass or more and 120 parts by mass or less are preferable with respect to 100 parts by mass of the thermoplastic resin, and 10 parts by mass or more. 100 mass parts or less are more preferable, and 15 mass parts or more and 80 mass parts or less are especially preferable.

  In addition, when using a thermoplastic resin as the material of the first molded product, an antioxidant, a heat stabilizer, an ultraviolet absorber, an antistatic agent, a dye, a pigment, a lubricant, a release agent, crystallization as necessary. Accelerators, crystal nucleating agents and the like can be further added and used.

  As the first molded product, while maintaining airtightness on the contact surface with the electronic substrate, processing such as applying an adhesive is performed by selecting a material that has excellent bonding properties with the material of the second molded product. Airtight electronic components can be obtained without any problems. In addition, when using a material having a low surface hardness such as an elastomer as the material of the first molded product, when applying a clamping force to the first molded product and applying compressive strain, the electronic substrate and the first molded product Therefore, it is easy to form an airtight part with good airtightness.

  The shape of the first molded product is not particularly limited as long as it allows compression strain to be imparted by the clamping force in step 2) to be described later and the compression strain can be retained by the second molded product. FIG. 1 shows a specific example of the cross-sectional shape of the first molded product. Hereinafter, a suitable cross-sectional shape of the first molded product will be described with reference to FIGS. 1 (a) to 1 (h).

  A suitable cross-sectional shape of the first molded article 12 is a direction perpendicular to the surface direction of the electronic substrate 11, and is the first in step 2) by the force acting in the direction from the second molded article 13 to the electronic substrate 11. This is a shape in which the compressive strain applied to one molded article 12 is maintained. Suitable examples of the cross-sectional shape of the first molded article 12 include a quadrilateral (FIGS. 1A, 1B, and 1C), a triangle (FIG. 4D), a semicircular shape (FIG. 2E), and A shape having protrusions such as FIG. When the cross-sectional shape of the first molded product 12 is a shape having such a protrusion, the protrusion of the first molded product 12 is directed in the direction of the electronic substrate 11 due to the adhesion force generated between the second molded product 13 and the electronic substrate 11. The compression strain of the first molded product 12 is maintained by being pressed.

  When the material of the first molded product 12 and the material of the second molded product 13 are a combination having excellent adhesion, the first molding is performed by the adhesive force generated at the interface between the first molded product 12 and the second molded product 13. The compression strain of the product can also be maintained. In such a case, the cross-sectional shape of the first molded product 12 may be a rectangle as shown in FIG. 1G or a trapezoid as shown in FIG.

  Among these cross-sectional shapes of the first molded product, a repulsive force between the first molded product 12 and the electronic substrate 11 caused by compressive strain can be applied over a wide range, and an airtight electronic component having excellent airtightness is manufactured. Since it is easy to do, the L-shaped cross-sectional shape shown by Fig.1 (a) is more preferable.

[Step 2)]
Step 2) is a step of placing the electronic substrate on which the first molded product is disposed on a mold for injection molding, and applying compressive strain to the first molded product in the previous period by a clamping force.

  The mold used in step 2) can mold the second molded product in step 3) to be described later on the electronic substrate on which the first molded product is arranged at a predetermined position. There is no particular limitation as long as a desired compression strain can be imparted to one molded article. Further, the shape of the cavity of the mold used in step 2) is such that a predetermined compressive strain can be applied to the first molded product and the compressive strain applied to the first molded product can be retained by the clamping force. It will not specifically limit if a 2nd molded article can be formed, According to the shape of the airtight electronic component finally manufactured, various shapes can be selected. It should be noted that the shape of the portion of the cavity surface of the mold that comes into contact with the first molded product is designed so that a desired compressive strain is applied to the first molded product after clamping.

  In step 2), the clamping force applied to the first molded product is not particularly limited as long as the object of the present invention is not impaired, and is appropriately selected in consideration of the type and shape of the material of the first molded product. . As the material of the first molded product, a thermoplastic resin containing a filler is preferable because the obtained airtight electronic component is generally excellent in mechanical properties, electrical properties, durability, workability, and airtightness. In such a case, however, the compressive strain applied to the first molded product in step 2) is preferably 0.5% or more and 2.0% or less. When the compressive strain is too small or too large, it may be difficult to obtain an airtight electronic component having desired airtightness.

[Step 3)]
Step 3) is a step of forming a second molded product that retains the compression strain of the first molded product added in step 2) by injection molding.

  In step 3), as described for step 1), a second molded product having a shape capable of holding the compression strain added to the first molded product in step 2) is formed by injection molding. The material used for injection molding is a thermoplastic resin, and both a crystalline resin and an amorphous resin can be used. Specific examples of suitable thermoplastic resins include polyolefin (polyethylene (PE), polypropylene (PP), poly-4-methyl-pentene-1, polycyclic olefin, etc.), polystyrene (PS), AS resin, ABS resin, poly General-purpose thermoplastic resins such as vinyl chloride (PVC), polyacrylonitrile (PAN), (meth) acrylic resin, cellulosic resin, elastomer; aliphatic polyamide (nylon 6, nylon 6,6, nylon 12, nylon 6,12, etc. ), Aromatic polyamide (MXD nylon, etc.), aromatic polyester resin (polyethylene terephthalate resin (PET), polybutylene terephthalate resin (PBT), polyethylene naphthalate resin (PEN), etc.), polycarbonate (PC), polyacetal (POM) , Polyphenylene Ether resin (PPE), polyarylene sulfide (PAS) (polyphenylene sulfide resin (PPS), etc.), polysulfone (PSu), polyimide (PI), liquid crystalline polymer (LCP) (liquid crystalline polyester, liquid crystalline polyester amide, liquid crystalline polyamide, etc. Engineering plastics; aliphatic dicarboxylic acids, aliphatic diols, and aliphatic polyesters obtained by polycondensation of monomers selected from the group consisting of aliphatic carboxylic acids or cyclic compounds thereof, diisocyanates, etc. Examples thereof include biodegradable resins such as molecular weight aliphatic polyesters. These thermoplastic resins can be used in combination of two or more.

  The combination of the material of the first molded product and the material of the second molded product is not particularly limited as long as the object of the present invention is not hindered, but the material of the second molded product is in consideration of the adhesion with the material of the first molded product. Are preferably selected. As a combination of materials of the first molded product and the second molded product, both are preferably aromatic polyesters, and more preferably both are polybutylene terephthalate resins. When the material of the first molded product and the second molded product is polybutylene terephthalate, the polybutylene terephthalate has a good balance of electrical properties, heat resistance, and durability. It is easy to obtain airtight electronic components that excel in

  The thermoplastic resin that is the material of the second molded product, as in the case of using the thermoplastic resin as the material of the first molded product, is optionally filled with a filler, an antioxidant, a heat stabilizer, an ultraviolet absorber, Antistatic agents, dyes, pigments, lubricants, mold release agents, crystallization accelerators, crystal nucleating agents and the like can be further added and used.

[Method of forming hermetic portion]
In the present invention, the hermetic portion that covers the hermetic zone and is in an airtight state includes at least a part of the composite formed of the first molded product and the second molded product formed by the above-described steps 1) to 3). . Hereinafter, a specific example of the method for forming an airtight portion in the present invention will be described with reference to FIGS. 2 to 4 which are schematic views of a cross section in a direction perpendicular to the electronic substrate of the airtight portion. In addition, as a specific example of the method for forming the hermetic portion, a method for forming a hermetic electronic component in which terminals are partially exposed will be described with reference to FIGS.

  As a specific example of the method of forming the hermetic portion 1, as shown in FIG. 2, the first molded product 12 is enclosed so as to surround the airtight member 14 such as various electronic elements arranged on the electronic substrate 11. And the second molded product 13 is formed, and the upper opening is closed by the lid member 15 by, for example, a method such as adhesion or welding to form the airtight portion 1. Such a method is suitable when the airtight member 14 is an element used in a gas such as a surface acoustic wave element.

  As another specific example of the method of forming the hermetic portion 1, as shown in FIG. 3, a cylindrical shape is formed so as to surround the airtight member 14 such as various electronic elements arranged on the electronic substrate 11. After forming the first molded product 12, the second molded product 13 is formed inside the cylindrical first molded product 12 so as to be in contact with and covered with the airtight member 14. There is a method in which a composite formed of the second molded product 13 is formed and the composite is used as the airtight portion 1. Such an embodiment is preferable because the airtight electronic component can be manufactured by a simple process when the airtight member 14 does not need to be used in a gas.

  Further, when there is a sufficient space around the airtight member 14, as shown in FIG. 4, after forming the first molded product 12 at a location adjacent to the airtight member 14 formed on the electronic substrate 11. Then, the second molded product 13 having a spread in the surface direction of the electronic substrate 11 is formed so as to contact and cover the hermetic member 14 and sufficiently prevent the gas from entering the hermetic member 14. A method of forming a composite body including the first molded product 12 and the second molded product 13 and using the composite pair as the airtight portion 1 is also suitable.

  Next, as a specific example of the method for forming the hermetic portion, a method for manufacturing a hermetic electronic component with a terminal exposed in part, which is one of suitable electronic components, will be described with reference to FIGS. When manufacturing the airtight electronic component 2 in which the terminals are partially exposed, the electronic substrate with terminals 21 having a plurality of terminals 22 formed on the surface shown in FIG. 5 is used.

  Step 1) will be described with reference to FIG. 6 and FIG. FIG. 6 is a view of the electronic substrate with terminal 21 on which the first molded product 23 is formed as viewed from above, and FIG. 7 is placed in a mold composed of an upper mold 24 and a lower mold 25. It is sectional drawing in the AA 'cross section shown by FIG. 5 of the electronic substrate 21 with a terminal in which the 1st molded article 23 was formed.

  In step 1), as shown in FIGS. 6 and 7, the cross section in the direction perpendicular to the surface direction of the electronic substrate 21 with terminals is L-shaped so as to surround the terminals 22 exposed to the outside in the airtight molded product. The first molded product 23 in the shape of a mold is formed on the front surface and the rear surface of the terminal-equipped electronic substrate 21. As the material of the first molded product 23, the above-described various materials can be used, but mechanical properties, electrical properties, durability, workability, and airtightness of the obtained airtight electronic component 2 are comprehensively excellent. Therefore, polybutylene terephthalate resin filled with glass fibers is more preferable.

  Step 2) will be described with reference to FIGS. FIG. 8 is a cross-sectional view of the terminal-attached electronic board 21 taken along the line A-A ′ shown in FIG. 5 in a state where compressive strain is applied to the first molded product 23 by the clamping force.

  In step 2), the terminal-attached electronic substrate 21 having the first molded product 23 formed on the front surface and the rear surface is placed in a mold composed of an upper mold 24 and a lower mold 25, and then FIG. And as FIG. 8 shows, a predetermined | prescribed compressive strain is provided to the 1st molded article 23 by match | combining the upper mold | type 24 and the lower mold | type 25, and clamping. The clamping force at the time of clamping is appropriately set according to the amount of compressive strain and the mechanical properties of the material 23 of the first molded product. When a polybutylene terephthalate resin filled with glass fibers is used as the material of the first molded product 23, the amount of compressive strain applied to the first molded product 23 is preferably 0.5% or more and 2.0% or less.

  Step 3) will be described with reference to FIG. 8, FIG. 9, and FIG. FIG. 9 is a cross-sectional view taken along the line A-A ′ shown in FIG. 5, in which a molten molding material for forming the second molded product 27 is injected into the cavity 26 in the mold. FIG. 10 is a cross-sectional view of the airtight electronic component 2 sealed by the first molded product 23 and the second molded product 27 in the A-A ′ cross section shown in FIG. 5.

  As shown in FIG. 9, in step 3), the molten second molded product 27 is transferred from the gate (not shown) provided in the mold to the cavity 26 in the mold by a molding machine such as an injection molding machine. The molding material is injected, and the second molded product 27 is formed so as to cover the front surface, the rear surface, and the side surface of the terminal-equipped electronic substrate 21. Since the cross-sectional shape of the first molded product 23 is L-shaped, the second molded product 27 formed on the surface of the terminal-equipped electronic substrate 21 is arranged in a direction perpendicular to the surface direction of the terminal-equipped electronic substrate 21. The one molded product 23 is pressed down, the compressive strain applied to the first molded product 23 is maintained, and the airtightness of the hermetic portion can be realized.

  As described above, the airtight electronic parts sealed by the first molded product 23 and the second molded product 27 manufactured by the steps 1) to 3) described above have good airtight portions covered by the second parts. Since it is airtight, good performance can be maintained over a long period of time. Further, since the airtight electronic component 2 encapsulating the terminal-equipped electronic substrate 21 described above is partially exposed, the exposed terminal is connected to another electronic component and is preferably used.

  After the airtight part is formed on the electronic substrate by the method described above, the airtight electronic part is manufactured by combining the case and other electronic parts with the airtight part or the airtight member in the airtight part as desired.

  According to the method for manufacturing a hermetic electronic component of the present invention, since it can be easily manufactured by injection molding, a hermetic electronic component having sufficient hermeticity can be manufactured at low cost. Specific examples of the airtight electronic component manufactured by the method of the present invention include an in-vehicle IC chip module.

  EXAMPLES Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited thereto.

The following materials 1) and 2) were used as the material of the first molded product.
1) DURANEX 303RA (polybutylene terephthalate resin composition, 15% by mass of glass fiber, manufactured by Wintech Polymer Co., Ltd.)
2) Hytrel 5557 (polyester elastomer, manufactured by Toray DuPont Co., Ltd.)

  Further, Duranex 305RA (polybutylene terephthalate resin composition, blended with 15% by mass of glass fiber, manufactured by Wintech Polymer Co., Ltd.) was used as the material of the second molded product.

  A glass epoxy substrate having a thickness of 1.6 mm and a length and width of 45 mm was used as the electronic substrate.

[Reference example]
(Creation of the first molded product)
The height of the compressed first molded article in the airtight electronic component (the distance from the surface of the electronic board to the surface of the first molded article in the direction perpendicular to the surface direction of the electronic board) A 3.0% higher shaped uncompressed first molded product (used in Example 3) was produced by injection molding using Duranex 303RA. The cross-sectional shape of the first molded product was an L-shape shown in FIG.

  The uncompressed first molded product having a height 3.0% higher than the height of the compressed first molded product in the hermetic electronic component is cut, and the compressed first molded product in the hermetic electronic component is cut. A first molded product whose height is 0.5% higher than that of the molded product (used in Example 1), a first molded product whose height is 2.0% higher (used in Example 2), and A first molded product (used in Comparative Example 1) having the same height was prepared.

  A first molded product (used in Example 4) having the same shape as that used in Example 3 was prepared except that the material was changed to Hytrel 5557.

Examples 1 to 3
The first molded product whose shape was adjusted so that a predetermined compressive strain of 0.5 to 3.0% was generated at the time of mold clamping was disposed so as to be symmetrical on the front surface and the rear surface of the electronic substrate. Next, the electronic substrate on which the first molded product was placed was placed on a mold and clamped to give a predetermined compressive strain to the first molded product. Thereafter, a second molded product was formed by using Duranex 305RA so as to cover the front surface, the rear surface, and the side surface of the electronic substrate by injection molding to obtain an airtight electronic component. In the airtight electronic component, the height of the second molded product (distance from the surface of the electronic substrate to the surface of the first molded product in the direction perpendicular to the surface direction of the electronic substrate) is the same as that of the first molded product. It is height. About the obtained airtight electronic component, the ink penetration test was performed according to the following method using 5 airtight electronic components, and the airtightness of the airtight part coat | covered with the 2nd molded article was confirmed. Regarding the airtight electronic components obtained in Examples 1 to 3, Table 1 shows the number of airtight electronic components with insufficient airtightness in 5 airtight electronic components.

<Ink penetration test>
The obtained encapsulated electronic component is immersed in red ink and left at 23 ° C. for 1 hour, and then the ink adhering to the surface of the encapsulated electronic component is wiped off, and the first molded product and the second molded product are used as a tool. Is peeled off from the electronic substrate, and the presence or absence of ink intrusion into the airtight portion is visually confirmed.

Example 4
An airtight electronic component was obtained in the same manner as in Example 1 except that the first molded product having a shape that produced 3.0% compressive strain at the time of clamping was produced by using Hytrel 5557. Table 1 shows the result of the ink penetration test of the airtight electronic component obtained in Example 4.

[Comparative Example 1]
An airtight molded product was obtained in the same manner as in Example 1 except that the first molded product that did not cause compressive strain during mold clamping was used. Table 1 shows the results of the ink penetration test of the airtight electronic component obtained in Comparative Example 1.

  From Table 1, by comparing Examples 1 to 4 and Comparative Example 1, after applying compressive strain to the first molded product by the clamping force, forming a second molded product to manufacture an airtight electronic component It can be seen that the occurrence of airtight defects in the airtight electronic component can be suppressed. In addition, when Examples 1 and 2 and Example 3 are compared, when the material of the first molded product is a thermoplastic resin (polybutylene terephthalate resin) containing a filler, the amount of compressive strain is set to 0.00. It turns out that generation | occurrence | production of an airtight defect is suppressed effectively by setting it as 5% or more and 2.0% or less. On the other hand, according to Example 4, when the material of the first molded article is a thermoplastic elastomer, even if the amount of compressive strain exceeds 2.0%, an extremely excellent effect of suppressing the occurrence of airtight defects can be obtained. I understand that.

  As a result of conducting an ink penetration test on the airtight molded product obtained in Comparative Example 1, intrusion of ink into the second molded product portion was confirmed in all of the 5 airtight electronic components tested. That is, when compressive strain is not applied to the first molded product, a minute gap is generated between the first molded product and the electronic substrate, and thus it is understood that the airtightness of the hermetic electronic component is insufficient.

DESCRIPTION OF SYMBOLS 1 Airtight part 11 Electronic substrate 12 1st molded product 13 2nd molded product 14 Airtight member 15 Lid material 21 Electronic substrate with a terminal 22 Terminal 23 1st molded product 24 Upper mold | type 25 Lower mold | type 26 Cavity 27 2nd molded product

Claims (5)

1) a step of arranging a first molded product in the vicinity of an airtight region on an electronic substrate;
2) placing the electronic substrate on which the first molded product is disposed on a mold for injection molding, and applying compressive strain to the first molded product by a clamping force; and
3) forming a second molded product that retains the compression strain of the first molded product by injection molding;
Including the steps of
At least a part of an airtight part that is formed on the electronic substrate and covers the airtight region and is airtight is a composite made of the first molded product and the second molded product,
Manufacturing method for airtight electronic components.   The method for manufacturing an airtight electronic component according to claim 1, wherein the material of the first molded article is a thermoplastic resin containing a filler, and the compression strain is 0.5% or more and 2.0% or less.   The manufacturing method of the airtight electronic component of Claim 1 or 2 which injection-molds said 1st molded article on the said electronic substrate.   The manufacturing method of the airtight electronic component in any one of Claim 1 to 3 whose material of said 1st molded article is polybutylene terephthalate resin.   An airtight electronic component manufactured by the method according to claim 1.

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