JP2010192727A - Electronic component packaging body and method of coating resin - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component packaging body and a method of coating resin capable of securing packaging reliability, by appropriately forming a resin reinforced section for reinforcing the retention force of a solder joint. <P>SOLUTION: In the electronic component packaging body 8, including an electronic component 6 having a rectangular, a planar shape and a chip-type compact component 60 packaged close to a corner section 6c of the electronic component 6; a discontinuous section for preventing a reinforcement resin 7 from being applied onto the compact component 60, at a position where the compact component 60 exists is provided in a first resin line 7a, and a second resin line 7b for composing a corner reinforcement section 70 provided at the corner section 6c, thus appropriately forming the corner reinforcement section 70, without affecting other compact components 60 packaged closely with nonconformities, and securing packaging reliability. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic component mounting body formed by mounting an electronic component on a substrate, and a resin coating method for applying a reinforcing resin for reinforcing the electronic component to an outer edge portion of the electronic component.

  As a method of mounting an electronic component on a substrate, a method using solder bonding is widely used, and the electronic component is electrically connected to the substrate by soldering the connection electrode provided on the electronic component to the electrode of the substrate. At the same time, the electronic component after mounting is held on the substrate by the solder joint. When an external force is applied to an electronic component such as thermal stress due to heat cycle in the usage state after mounting, the strength is insufficient at the solder joint alone, so the electronic component is bonded to the board with a reinforcing resin together with the solder joint. Thus, the holding force by the solder joint is reinforced (see Patent Document 1).

In the prior art shown in this patent document example, an electronic component having a bump group on the lower surface is solder-bonded to the substrate via the bump, and then located at the outermost peripheral portion of the electronic component in the gap between the electronic component and the substrate. The underfill resin is injected and cured only in the gap to be formed over the entire circumference of the electronic component.
JP 2002-16192 A

  However, as shown in the above-described patent document example, the following problem occurs in the method of forming the resin reinforcing portion by injecting and curing the underfill resin over the entire circumference of the electronic component. That is, in this resin reinforcement method, when another electronic component is mounted in the vicinity of the electronic component to be reinforced, the underfill resin contacts the periphery of the other electronic component depending on the clearance between the electronic components. Or may be applied over the top surface. When such a contact between the reinforcing resin and the electronic component occurs, cracks may occur in the solder joints of the electronic component due to residual stress generated when the reinforcing resin is cooled after being heated or thermal stress during the heat cycle. There is a risk of causing a problem of reducing the mounting reliability, for example. Further, in order to avoid such a problem, it is necessary to increase the space between adjacent electronic components, which is one factor that hinders downsizing and increasing the density of the substrate. As described above, the conventional electronic component mounting body has a problem in that the mounting reliability is reduced due to the method of forming the resin reinforcing portion for reinforcing the holding force of the solder joint portion.

  Therefore, an object of the present invention is to provide an electronic component mounting body and a resin coating method capable of appropriately forming a resin reinforcing portion for reinforcing the holding force of a solder joint portion and ensuring mounting reliability. .

The electronic component mounting body of the present invention is an electronic component mounting body formed by mounting a plurality of electronic components on a substrate by solder bonding, and has a rectangular planar shape among the plurality of electronic components mounted on the substrate. One electronic component, another electronic component mounted close to the corner of the one electronic component, and a reinforcing resin in a linear form along the outer edge of the one electronic component on the upper surface of the substrate Forming a corner reinforcing portion that reinforces a holding force that is formed for each of the four corner portions in the rectangle by applying, and that adheres the one electronic component to the substrate and holds the electronic component on the substrate; Each of the corner reinforcing portions includes a first portion formed in a length less than ½ side length of the one side including the corner portion in parallel with one side of the four sides constituting the rectangle.
And the second resin wire formed to include the corner portion in parallel with the other side orthogonal to the one side, and the first resin wire and / or the second resin wire. Is provided with a discontinuous portion on the electronic component where the reinforcing resin is not applied at the position where the other electronic component is present.

  The resin coating method according to the present invention includes a plurality of electronic components mounted on a substrate by solder bonding, one electronic component having a rectangular planar shape among the plurality of electronic components mounted on the substrate, and the one Formed on each of the four corners of the one electronic component on the upper surface of the substrate, and the one electronic component is bonded to the substrate. In an electronic component mounting body including a corner reinforcing portion that reinforces a holding force for holding the electronic component on the substrate, a reinforcing resin is linearly applied along an outer edge portion of the electronic component on the upper surface of the substrate. A resin coating method for forming the corner reinforcing portion by moving the discharge nozzle while discharging the reinforcing resin from the coating nozzle in order to form each of the corner reinforcing portions. In the drawing application step, the first resin line having a length shorter than ½ side length of the one side including the corner portion is provided in parallel with one side of the four sides constituting the rectangle. A first application step of forming, and a second application step of forming a second resin wire including the corner portion in parallel with the other side orthogonal to the one side, and further including the first application In the step and / or the second application step, the discharge is interrupted in order not to apply the reinforcing resin on the electronic component at a position where the other electronic component is present.

  According to the present invention, in an electronic component mounting body including one electronic component having a rectangular planar shape mounted on a substrate, and another electronic component mounted close to the corner portion of the one electronic component Each of the four corner reinforcing portions provided for each of the four corner portions of one electronic component includes the corner portion of one of the four sides constituting the rectangle and includes one of the one side. The first resin wire formed with a length less than / 2 side length and the second resin wire formed including the corner portion on the other side orthogonal to one side, Reinforcing strength of the solder joint by providing a discontinuous portion on the resin wire and / or the second resin wire so that the reinforcing resin is not applied on the electronic component at a position where another electronic component is present. Others that are mounted in close proximity to the resin reinforcement part And properly formed without exerting a problem with the electronic components, it is possible to secure the mounting reliability.

  Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a resin coating apparatus according to an embodiment of the present invention, FIG. 2 is a configuration explanatory diagram of an electronic component mounting body to be coated by the resin coating apparatus according to an embodiment of the present invention, and FIG. FIG. 4, FIG. 5, FIG. 6, and FIG. 7 show corner reinforcement in an electronic component mounting body according to an embodiment of the present invention. FIG. 8 is a block diagram showing the configuration of the control system of the resin coating apparatus according to one embodiment of the present invention, and FIG. 9 is a corner reinforcing part in the resin coating method according to one embodiment of the present invention. FIG. 10 is a flow diagram for explaining a corner reinforcement resin application work process according to an embodiment of the present invention, and FIG. 11 is a corner reinforcement image according to an embodiment of the present invention. Flow chart, figure of locus confirmation processing in resin application work processing 2, FIG. 13 is a process diagram illustrating a method of coating the corner reinforcement tree resins of an embodiment of the present invention.

  First, the structure of the resin coating device 1 will be described with reference to FIG. The resin coating apparatus 1 has a function of applying a reinforcing resin in a linear form along an outer edge portion of an electronic component in an electronic component mounting body in which an electronic component having a rectangular planar shape and having a connection bump on the lower surface is mounted. It is what has. The resin coating apparatus 1 includes a transport unit 2 that transports an electronic component mounting body to be coated and a resin coating unit 3 that is disposed on the side of the transport unit 2 and that discharges resin.

  In FIG. 1, the transport unit 2 is composed of a pair of transport rails 4 each having a conveyor 4 a, and an electronic component mounting in which a bumped electronic component 6 is pre-mounted on a substrate 5 in the upstream process (arrow a). The body 8 is transported in the substrate flow direction (X direction). In the transported electronic component mounting body 8, the four corner portions (see the corner portion 6 c shown in FIG. 3) of each electronic component 6 are reinforced to reinforce the holding force for holding the electronic component 6 on the substrate 5. Resin 7 is applied. A camera 9 is disposed above the transport unit 2 with the imaging surface facing downward, and the position and shape of the electronic component 6 on the substrate 5 are recognized by imaging the electronic component mounting body 8 by the camera 9. It is possible to do.

  The structure of the resin application part 3 is demonstrated. A coupling bracket 11 is provided on the lower surface of the Y-axis table 10 so as to be movable in the Y direction, and an X-axis table 12 is coupled to the coupling bracket 11. A resin tank 13 is mounted on a holding base 11 a provided so as to extend from the lower part of the coupling bracket 11 to above the conveying unit 2. The resin tank 13 has a function of storing the reinforcing resin 7 to be applied and feeding it to the dispenser 14 described below by a specified amount. A dispenser 14 provided with a coating nozzle 14a protruding downward at the lower end is mounted on a moving table 12a provided on the side surface of the X-axis table 12 on the side of the transport unit 2.

  The dispenser 14 is connected to the resin tank 13 via the resin supply tube 15, and the reinforcing resin 7 supplied from the resin tank 13 is supplied to the dispenser 14 via the resin supply tube 15 and has a predetermined timing. , A prescribed amount is discharged from the coating nozzle 14a. By driving the Y-axis table 10 and the X-axis table 12, the dispenser 14 moves in the X direction and the Y direction above the transport unit 2. The resin tank 13 and the dispenser 14 serve as resin discharge means for discharging the reinforcing resin 7 from the discharge port of the application nozzle 14a.

  The dispenser 14 has a built-in nozzle lifting / lowering mechanism 14b (see FIG. 8) that lifts and lowers the coating nozzle 14a. When the reinforcing resin 7 is applied to the electronic component mounting body 8, the discharge port of the coating nozzle 14a is set to a predetermined position. The dispenser 14 is moved according to a prescribed application trajectory by the Y-axis table 10 and the X-axis table 12 while being positioned at the application height. Thereby, the corner reinforcement part 70 (refer FIG. 3) which formed the resin wire of the reinforcement resin 7 along the outer edge part 6e of the electronic component 6 in the corner part 6c of the electronic component 6 in the electronic component mounting body 8 is formed. . The nozzle lifting mechanism built in the Y-axis table 10, the X-axis table 12, and the dispenser 14 constitutes a moving unit that moves the application nozzle 14 a relative to the electronic component mounting body 8.

  Next, the electronic component mounting body 8 will be described with reference to FIG. The electronic component mounting body 8 is formed by mounting a plurality of electronic components on a substrate by solder bonding. Here, the electronic component has a rectangular planar shape and is provided with two bumps 6a as connection electrodes. 6 shows an example in which an electronic component mounting structure in which 6 is mounted on a substrate 5 by solder bonding via bumps 6a is applied. That is, a plurality of electrodes 5b are formed on the upper surface 5a of the substrate 5 in correspondence with the arrangement of the bumps 6a in the electronic component 6 to be mounted. The electronic component 6 is mounted on the substrate 5 in the previous process, and the bump 6a is soldered to the electrode 5b. A portion where the electronic component 6 is melted and solder-bonded to the electrode 5 b is a solder joint portion for soldering a connection electrode of the electronic component 6 to the electrode 5 b provided on the substrate 5.

In this electronic component mounting body 8, the holding force by solder bonding between the bump 6 a and the electrode 5 b does not have a sufficient holding force against a load caused by a thermal stress or a physical external force during use of the product. Resin reinforcement is performed to reinforce this holding force with a thermosetting resin or the like. There are various forms of this resin reinforcement. Conventionally, resin reinforcement using an underfill resin in which a liquid thermosetting resin is filled in a gap between the electronic component after mounting the electronic component and the substrate has been employed.

  However, as the gap between the electronic component and the substrate becomes narrower due to the miniaturization of the electronic component, it is difficult to fill the underfill resin. Therefore, in the present embodiment, a reinforcing resin is applied in the vicinity of the corner portion 6c for the purpose of intensively reinforcing the outer edge portion 6e of the electronic component 6, and particularly the corner portion 6c where the stress level is most critical. Thus, the corner reinforcing portion 70 (FIG. 4) is formed.

  In the present embodiment, three patterns as shown in FIG. 3 are set in advance as the basic pattern of the corner reinforcing portion 70, and according to the reinforcing characteristics required for the target electronic component mounting body 8. , I try to use these properly. In the patterns A, B, and C shown in FIG. 3, the corner reinforcing portions 70 having the same shape are respectively formed on the four corner portions 6c in the rectangular electronic component 6 having two side lengths a and b that are orthogonal to each other. The example which formed is shown. First, in the pattern A shown in FIG. 3A, for the corner portion 6c in which the first side 61 having the side length a is orthogonal to the second side 62 having the side length b, the first side 61 and the second side 62, the first resin wire 7a and the second resin wire 7b having the lengths m and n, respectively, constituting the corner reinforcing portion 70 are formed.

  The pattern B shown in FIG. 3B is a predetermined length from the first resin wire 7a and the second resin wire 7b in the pattern A shown in FIG. The first resin extending portion 7c and the second resin extending portion 7d that are extended by the length are used. In the pattern A and the pattern B, the first resin line 7a and the second resin line 7b are both formed with a length less than ½ side length of each side. As a result, the resin reinforcing portion is not formed at the center of the first side 61 and the second side 62, and the gap between the upper surface 5a of the substrate 5 and the electronic component 6 communicates with the outside. ing. Further, the pattern C shown in FIG. 3C is obtained by continuously applying the reinforcing resin 7 on the second side 62 in the pattern A shown in FIG. The second resin line 7b is continuously formed with respect to the second side 62.

  As described above, the resin reinforcing portion is formed in such a manner that the gap between the substrate 5 and the electronic component 6 communicates with the outside, thereby generating the resin reinforcing portion over the entire circumference of the electronic component. Such a malfunction can be prevented. That is, when the gap between the lower surface of the electronic component and the substrate is a completely closed space, organic substances and moisture remaining inside the gap are removed by heating when the mounted substrate is reheated. As a result, the pressure in the gap rises, and a crack is generated by the internal pressure in the already heat-cured resin reinforced portion, which may cause a problem of reducing mounting reliability. On the other hand, by using the reinforcing method as shown in the present embodiment, the gas is not confined in the gap between the lower surface of the electronic component and the substrate, and such a problem can be effectively prevented. .

  As shown in FIG. 4A, the corner reinforcing portions 70 shown in the patterns A, B, and C shown in FIG. 3 are all reinforcing resin along the outer edge portion 6e of the electronic component 6 on the upper surface 5a of the substrate 5. 7 is applied to each of the four corner portions 6c in the rectangular shape of the electronic component 6 by applying them in a linear form by the application nozzle 14a. These corner reinforcing portions 70 have a function of reinforcing the holding force for adhering the electronic component 6 to the substrate 5 and holding the electronic component 6 on the substrate 5. That is, the corner reinforcing portion 70 is applied to the rectangular shape of the electronic component 6 by applying the reinforcing resin 7 linearly along the outer edge portion 6 e of the rectangular electronic component 6 (one electronic component) on the upper surface 5 a of the substrate 5. Are formed for each of the four corner portions 6c, and the electronic component 6 is bonded to the substrate 5 to reinforce the holding force for holding the electronic component 6 on the substrate 5.

  Each of the corner reinforcing portions 70 is parallel to the first side 61 (one side) of the four sides (first side 61 and second side 62) constituting the rectangle of the electronic component 6. Including the portion 6c, the first resin wire 7a formed with a length less than ½ side length of the first side 61, and the second side 62 orthogonal to the first side 61 (others The second resin wire 7b formed to include the corner portion 6c in parallel with the side). In the patterns A and B, the second resin line 7b is also formed with a length less than ½ side length of the second side 62, but the pattern C is about the first side 61. Only the first resin wire 7a formed with a length of less than ½ side length is provided.

  In forming such a corner reinforcing portion 70, as shown in FIG. 4A, drawing coating is performed in which the reinforcing nozzle 7 is discharged while the coating nozzle 14a is moved in accordance with a preset coating locus. Is used. As shown in the sectional view of FIG. 4B, the reinforcing resin 7 discharged from the coating nozzle 14 a partially enters the gap between the substrate 5 and the electronic component 6, and the side surface of the electronic component 6. The corner reinforcing portion 70 is formed by thermosetting in a state where a part of the reinforcing resin 7 is in contact with the 6b and the lower surface 6d. A resin having a high viscosity and a high thixo ratio (for example, a viscosity of 30 Pa · S or more and a viscosity ratio of 3 or more) is used as the reinforcing resin 7 mainly used for forming such a corner reinforcing portion 70. By using the resin having such characteristics as the reinforcing resin, the reinforcing resin 7 after being discharged from the coating nozzle 14a keeps almost the same shape as it is discharged without almost flowing. Accordingly, the reinforcing resin 7 can form a resin reinforcing portion having a desired shape without flowing along the upper surface 5a.

  In this drawing application, as shown in FIG. 4B, the application nozzle 14a is moved from the side surface 6b to the side with a predetermined clearance d so as not to cause interference due to contact with the side surface 6b. . Furthermore, the height position from the upper surface 5a of the discharge port of the application nozzle 14a is set to a height Z1 indicating the height position of the lower surface 6d of the electronic component 6 and a height Z2 corresponding to ½ of the thickness of the electronic component 6. It is desirable to set between. By setting the height position of the discharge port of the application nozzle 14 a in this way, the discharged reinforcing resin 7 can be reliably brought into contact with the side surface 6 b and the lower surface 6 d of the electronic component 6. It becomes possible to ensure reinforcement hardening.

  In the example shown in FIG. 1, the reinforcing resin 7 is applied to the electronic component mounting body 8 in which the electronic component 6 is already mounted on the substrate 5 before being carried into the resin coating apparatus 1. The object of application work by the resin application device 1 is not limited to such an electronic component mounting body 8, and the reinforcing resin 7 is applied in advance to the substrate 5 before the electronic component 6 is mounted. It can also be used for so-called “priming” applications.

  That is, as shown in FIG. 5A, in the step before the electronic component 6 is mounted, the first resin wire 7a and the second resin wire 7a are formed by performing drawing application on the upper surface 5a of the substrate 5 by the application nozzle 14a. A corner reinforcing portion 70 made of the resin wire 7b is formed in advance. Thereafter, as shown in FIG. 5B, the electronic component 6 is mounted on the substrate 5 on which the corner reinforcing portion 70 is formed. As a result, as shown in FIG. 5C, a corner reinforcing portion 70 made of the first resin wire 7a and the second resin wire 7b having a cross-sectional shape similar to that in FIG. 4B is formed. By adopting such “front coating”, it is not necessary to apply the coating nozzle 14a with the coating nozzle 14a being offset outward as in the example shown in FIG. There is an advantage that 6d can be sufficiently contacted.

FIG. 6 shows the shape of the corner reinforcement 70 in the pattern B shown in FIG. In this case, the corner reinforcing portion 70 has a shape having a larger extent than the pattern A in the vicinity of the corner portion 6c. That is, as shown in FIG. 6B, from the corner portion 6c, in addition to the first resin wire 7a and the second resin wire 7b, the first resin extending portion 7c and the second resin wire 7b are provided.
Since the resin extending portion 7d further extends, it is possible to widen the fixing margin E in which the corner reinforcing portion 70 constituted by these contacts and fixes to the upper surface 5a of the substrate 5, and the corner portion 6c. As compared with the example shown in the pattern A, the reinforcing effect of the reinforcing resin 7 is significantly improved.

In the example shown in FIG. 7, in addition to an electronic component with bumps such as an electronic component 6 (one electronic component) on the substrate 5, a chip-type small component 60 (another electronic component) such as an RC component is provided. The example of application of this invention in the example mounted is shown. The circuit board component layout is first BGA (Ball
A relatively large functional component such as a grid array) is arranged, and a small component 60 or the like is arranged in the remaining space. At this time, the position of the small component 60 is desirably arranged as close to the electronic component 6 as possible. However, when the electronic component 6 to be used is a component of a type that requires the corner reinforcement portion 70 as shown in FIG. 3, conventionally, the first resin wire 7a or the second resin is used. About the reinforcement range required in order to form the line 7b, it was forced to exclude from the object area which arrange | positions the small components 60 from the beginning.

  That is, in the case where the corner reinforcing portion 70 is provided in each basic pattern shown in FIG. 3, the reinforcing resin 7 is applied from above the small component 60 mounted in the vicinity of the electronic component 6 to partially dispose the small component 60. When covered with the reinforcing resin 7, an external force acts on the small component 60 due to thermal expansion and contraction of the reinforcing resin 7 during the heat cycle, and there is a possibility that the joint portion that joins the electronic component 6 to the substrate 5 may be broken. For this reason, in the present embodiment, when a component such as the electronic component 6 to be formed with the corner reinforcing portion 70 is mounted close together with a component such as the small small component 60, FIG. As shown, the first resin wire 7a and the second resin wire 7b formed for each of the four corner portions 6c by linearly applying the reinforcing resin 7 along the outer edge portion 6e of the electronic component 6 are shown. For either or both, a specific range (indicated by arrow F) is designated as the mounting position of the small component 60. The specified range is excluded from the application target of the reinforcing resin 7 in advance when the application data is created, and a discontinuous portion is provided in the resin wire. That is, in the electronic component mounting body 8 shown in FIG. 7, the first resin wire 7 a and / or the second resin wire 7 b formed for the rectangular electronic component 6 are arranged at positions where other electronic components 60 are present. A discontinuous portion for not applying the reinforcing resin 7 on the electronic component 60 is provided.

  Next, the configuration of the control system of the resin coating apparatus 1 will be described with reference to FIG. The coating operation control unit 30 controls the operation and processing of each unit constituting the resin coating apparatus 1 to control the coating operation for the electronic component 6 before the electronic component mounting body 8 and the substrate 5 are mounted. The storage unit 31 stores various programs and data necessary for the coating operation control unit 30 to execute the above-described coating operation, and includes a basic pattern storage unit 31a, a position information storage unit 31b, a component information storage unit 31c, and a coating. It is comprised from the locus | trajectory memory | storage part 31d.

  The basic pattern storage unit 31a stores a plurality of basic patterns of application shapes for forming the four corner reinforcing portions 70 provided for each of the four corner portions 6c in the rectangle of the electronic component 6 as a target. In the present embodiment, patterns A, B, and C shown in FIG. 3 are included. The position information storage unit 31 b stores component position information indicating the position of the electronic component 6 in the electronic component mounting body 8. The component information storage unit 31 c stores component information including the side size (side length a, b) of the electronic component 6. The application trajectory storage unit 31d stores application trajectory data calculated by a trajectory calculation unit 32 described below. Control of the resin application unit 3 by the application operation control unit 30 is performed based on the application trajectory data stored in the application trajectory storage unit 31d.

The recognition processing unit 33 performs recognition processing on the imaging data acquired by the camera 9. In the present embodiment, the application trajectory data of the application trajectory data is displayed by superimposing the application trajectory calculated by the trajectory calculation unit 32 on the screen imaged by the camera 9 of the electronic component mounting body 8 carried into the transport unit 2. Appropriateness is judged. The mechanism drive unit 34 is controlled by the application operation control unit 30 to drive the dispenser 14 as the resin discharge means, the X-axis table 12 as the moving means, the Y-axis table 10, and the nozzle lifting mechanism 14 b built in the dispenser 14. To do.

  The input unit 35 is an input unit such as a keyboard or a touch panel, and is used for operation commands for executing the operation of the resin coating apparatus 1 and for application trajectory data calculated by the trajectory calculation unit 32 to form the corner reinforcement unit 70. It is used to input the specific dimensions in the basic pattern necessary for creation, that is, the detailed dimensions of each part that differ depending on the type of the electronic component 6 to be processed. The display unit 36 is a display device such as a liquid crystal panel, and displays a guidance screen at the time of an input operation by the input unit 35 and an image for the operator to visually determine whether or not the trajectory is appropriate in a trajectory confirmation process described later.

  Here, with reference to FIG. 9, the detail of the specific dimension input is demonstrated. FIG. 9A shows specific dimensions that need to be input when the electronic component mounting body 8 in which the electronic component 6 has already been mounted in the previous process is targeted. Note that the side lengths a and b (see FIG. 3) indicating the size of the electronic component 6 are stored in advance in the component information storage unit 31c and need not be input here. First, the lengths m and n of the first resin wire 7a and the second resin wire 7b are input as basic specific dimensions that define the shape of the corner reinforcing portion 70. At this time, the diameter D of the application nozzle 14a to be used together and an appropriate clearance dimension d (see FIG. 3B) between the application nozzle 14a and the side surface 6b of the electronic component 6 are input. Accordingly, the offset dimension B (= d + D / 2) from the first side 61 and the second side 62 to the first coating line L1 and the second coating line L2 when the coating nozzle 14a moves in the drawing coating. Is uniquely calculated. That is, in this case, the first coating line L1 and the second coating line L2 correspond to the offset dimension B from the first side 61 (one side) and the second side 62 (other side), respectively. The predetermined width is set apart in the outward direction.

  Thereby, application trajectory data by drawing application for forming the first resin wire 7a and the second resin wire 7b is obtained for one corner portion 6c of one electronic component 6. That is, the application trajectory by drawing from the start point P1 of the first application line L1 to the intersection P2 with the second application line L2 and further to the end point P3 of the second application line L2 is defined. Of course, the application locus may be opposite to the application direction, with P3 as the start point and P1 as the end point. Then, by applying this application trajectory data to each corner portion 6c, application trajectory data for one electronic component 6 is created. That is, the coordinate values of P1, P2, and P3 in the coordinate system with the center point of the electronic component 6 as the origin are uniquely calculated. By combining the position information stored in the position information storage unit 31b, that is, the mounting position information indicating the position coordinates of the center point of the electronic component 6 on the substrate 5, and the application trajectory data for the electronic component 6, one electronic Application trajectory data of the entire component mounting body 8 is created.

  When the pattern B shown in FIG. 3B is targeted, the first resin extending portion 7c and the second resin extending portion 7d from the first resin wire 7a and the second resin wire 7b are used. Are extended from the corner portion 6c in the outward direction, and dimensions obtained by adding m1 and n1 to the outside are input to m and n, respectively. FIG. 9B shows an input example when applying the “priming” basic pattern shown in FIG. 5. In this case, it is only necessary to input the same m and n as in the case of the pattern A, and in this case, the offset dimension B is zero. That is, the first coating line L <b> 1 and the second coating line L <b> 2 coincide with the first side 61 and the second side 62 of the electronic component 6. As described above, in the present embodiment, the first resin line 7a and the second resin are used as the dimension data indicating the specific dimensions of the basic pattern, which are required when the application locus data is calculated by the locus calculator 32. The lengths m and n of the line 7b are input as essential items.

Next, with reference to the flow of FIG. 10 and FIG. 11, a corner reinforcement portion resin coating operation process for the solid electronic component 6 by the resin coating apparatus 1 will be described. First, a coating mode is selected (ST1). That is, as shown in FIG. 4, whether the application work is for the electronic component mounting body 8 on which the electronic component 6 is mounted in advance or the application work is for the substrate 5 before the electronic component 6 is mounted. select. Depending on this selection, the types of specific dimensions to be input in the subsequent dimension data input are different.

  Next, a basic pattern is selected (ST2). That is, one of the patterns A, B, and C shown in FIG. 3 is selected according to the characteristics of the target electronic component 6 and input from the input unit 35. Thereafter, dimension data indicating specific dimensions in the basic pattern is input (ST3). That is, each item shown in FIG. 9 is input according to the selected basic pattern. Then, by combining the inputted dimension data, the selected basic pattern storage unit 31a, the component information storage unit 31c, and the component information and the position information respectively stored in the position information storage unit 31b, one electronic component mounting body 8 is formed. The target application trajectory data is created by the trajectory calculation unit 32.

  Next, trajectory confirmation processing for confirming the suitability of the application trajectory data calculated in this way is executed (ST5). That is, if only a coating locus is created for only one corner portion 6c, when this coating locus is applied to the entire electronic component mounting body 8, misregistration due to an input error or interference with other components is not expected. There may be a problem. For this reason, in the present embodiment, a method is adopted in which the operator visually determines the presence or absence of a defect by superimposing the calculated application locus data on the arrangement of the electronic components 6 on the actual substrate 5.

  The locus confirmation process will be described with reference to FIG. First, the camera 9 is moved above the application target position (ST11). Next, the application target position is imaged by the camera 9 (ST12). Thereby, the image containing the corner part 6c of the electronic component 6 used as application | coating object is acquired. Next, a resin line is displayed on the image of the application target position (ST13). That is, the corner portion 6c of the application target position is displayed on the display screen of the display unit 36, and the diameter D of the application nozzle 14a is calculated based on the calculated application trajectory data in a state where the coordinate reference position is matched with the image. The shape of the resin wire in consideration of the coating width corresponding to is displayed. Then, the operator visually observes the displayed resin wire and corrects it if necessary (ST14).

  That is, it is visually determined whether or not the calculated application trajectory data has a position / shape suitable for the corner portion 6c existing at the application target position. If a positional deviation or a shape defect is observed, the data is corrected and the locus confirmation process is executed again as necessary. Instead of displaying the resin line in consideration of the application width, only the application line (see the first application line L1 and the second application line L2 shown in FIG. 9) may be displayed simply.

  In this way, when the trajectory confirmation process is completed and it is determined that the application trajectory data is appropriate, this discharge is performed while discharging the reinforcing resin 7 from the discharge nozzle 14a in order to form each of the corner reinforcing portions 70. Application operation by drawing application for moving the nozzle 14a is started (ST6). The length of the one side is less than ½ side length including the corner portion 6 c in parallel with the first side 61 (one side) of the four sides constituting the rectangle of the electronic component 6. First resin wire 7a is formed (first coating step) (ST7). Next, the second resin wire 7b including the corner portion 6c is formed in parallel with the second side 62 (other side) orthogonal to the first side 61 (second coating step) (ST8). Then, (ST7) and (ST8) are repeatedly executed for all the corner portions 6c of all the target electronic components 6.

Here, when the application operation for the electronic component mounting body 8 on which the electronic component 6 is mounted in advance is selected as the application mode in (ST1), the first application step and the second application are performed. In the process, the coating lines L1 and L2 of the first resin line 7a and the second resin line 7b are outside the first side 61 and the second side 62 by the offset dimension B (predetermined width) shown in FIG. Set them apart in the direction. Further, the height position of the discharge port of the coating nozzle 14a from the upper surface 5a of the substrate 5 in the first coating process and the second coating process is set to the height position of the lower surface 6d of the electronic component 6 and the thickness of the electronic component 6. It is set between the height position corresponding to 1/2 (see FIG. 4B).

  Even if any basic pattern is selected here, if another small component 60 is already mounted at a position overlapping with any resin wire of the corner reinforcing portion 70 of the electronic component 6, In the drawing application, the discharge of the reinforcing resin 7 from the application nozzle 14a is interrupted at the mounting position of the small component 60 to form a discontinuous portion F shown in FIG. That is, in this case, in the first application step and / or the second application step, the reinforcing resin 7 is not applied on the small component 60 at a position where the small component 60 (another electronic component) exists. Discharge of the coating nozzle 14a is interrupted.

  And in (ST2), when the pattern B shown in FIG. 3 is selected as a basic pattern, in the 1st application process and the 2nd application process, the 1st resin line 7a and the 2nd resin line The first resin extending portion 7c and the second resin extending portion 7d are formed from 7b by extending a predetermined length in the outward direction with respect to the corner portion 6c. At this time, one of the first resin extension 7c and the second resin extension 7d is applied in advance, and this resin extension is formed when the subsequent resin extension is formed. The extended portion coating line is formed so as to be superimposed on the previously formed resin extending portion.

  For this reason, when the coating nozzle 14a is moved to form the subsequent resin extension portion, the discharge nozzle 14a discharges in order to prevent interference between the previously applied resin extension portion and the coating nozzle 14a. The height of the exit must be adjusted. That is, in this case, the height position of the discharge port of the coating nozzle 14a in the subsequent coating step in the first coating step and the second coating step is set to the height of the discharge port of the coating nozzle 14a in the preceding coating step. Make it higher than the position.

  In the processing flow shown in FIG. 10, the calculation process of the application trajectory data is performed by the arithmetic processing function of the resin coating apparatus 1, and the coating operation by the drawing application is performed by the same resin coating apparatus 1 according to the calculated application trajectory data. Although the example which performs is shown, you may make it function the resin coating apparatus 1 as a data preparation apparatus for resin coating. In this case, in the flow shown in FIG. 10, the application trajectory data after completion of the trajectory confirmation processing in (ST5) is output (ST9). That is, the data is transmitted to another resin coating apparatus via online output via a LAN system or a removable storage medium.

  In this case, the resin coating apparatus 1 includes a position information storage unit 31b, a component information storage unit 31c, a basic pattern storage unit 31a, and an input unit that inputs dimension data indicating specific dimensions in the basic pattern. It functions as a data application device for resin application having a configuration including 35 and a locus calculation unit 32. Of course, it is also possible to use a function of a personal computer or the like as a single resin coating data creation device having the above configuration. By using such a data method for resin application, as described above, for drawing application for the corner part, which is required when adopting a resin reinforcement method limited to the corner part of the electronic component. Can be created efficiently.

Next, in order to form the corner reinforcing portion 70 in the electronic component 6 as described above, the coating nozzle 14a is set in advance to the coating line (see the first coating line L1 and the second coating line L2 shown in FIG. 9). ), The details of the resin coating method in which the reinforcing resin 7 is discharged from the discharge port of the coating nozzle 14a and applied linearly will be described with reference to FIGS. Here, for the sake of simplicity, an example in which the reinforcing resin 7 is applied in a straight line is illustrated, but in an application shape example in which the resin wire is bent in the middle as in the case where the corner reinforcing portion 70 is formed. Similarly, the following process can be applied.

  As described above, when the purpose is to form the corner reinforcing portion 70, a resin having a high viscosity and a high thixo ratio is used as the reinforcing resin 7. However, such a resin having a high viscosity and a high thixo ratio has a tendency that the resin end portions at both ends of the resin wire are likely to have a protruding shape when discharged from the coating nozzle 14a to form the resin wire. In the resin wire formed to reinforce the corner portion, if such an upper protruding resin end exists, the shape of the resin reinforcing portion becomes unstable and the reinforcing effect is impaired, and the upper protruding resin When the end portion protrudes from the upper surface of the electronic component to be reinforced, it causes various problems such as interference with the housing and other components when it is mounted in the housing in a later process. For this reason, in the resin coating method for forming the reinforcing resin 7 shown in the present embodiment, this problem is solved by the following method.

  The broken line indicated by reference numeral 7 * in FIG. 12 indicates a coating shape line indicating the outer shape of the resin wire to be formed by drawing coating by the coating nozzle 14a. In FIG. 12, the left side is the coating start end point ES and the right side is The end point EE is the coating end side. In the resin application method shown in the present embodiment, the application nozzle 14a is not moved from the beginning to the discharge start side end point ES to start the discharge of the reinforcing resin 7, but at the start of the drawing application, FIG. As shown in a), the application nozzle 14a is positioned at the discharge start point Ps set at a position separated by a predetermined distance l1 on the application line from the application start side end point EE among the end points on both sides of the application shape line 7 *. . Next, as shown in FIG. 12B, the coating nozzle 14a is lowered to a predetermined height defined by the desired height of the resin wire (arrow c), and the reinforcing resin 7 is discharged from the discharge port of the coating nozzle 14a. Is started (discharge start process).

  Then, after this discharge start step, as shown in FIG. 12C, the application nozzle 14a is moved to the application start end point ES while continuing to discharge the reinforcing resin 7 (arrow d) (first nozzle). Moving process). At this time, an upper protrusion-shaped resin end 7e is formed at the discharge start point PS as the reinforcement resin 7 starts to be discharged. The resin end 7e is considered to be formed by the following resin behavior. That is, when the discharge of the reinforcing resin 7 from the application nozzle 14a is started at the discharge start point PS, the reinforcing resin 7 discharged from the discharge port swells immediately below the discharge port while maintaining a lump state without flowing around, It will be in the state which adhered to the certain height along the outer surface of the coating nozzle 14a. When the application nozzle 14a moves in this state, the reinforcing resin 7 adhering to the surface on the opposite side to the moving direction is left and remains as an upper protruding resin end 7e.

  Then, after the first nozzle moving step, the application nozzle 14a is reversed at the discharge start side end point ES, and as shown in FIG. 12 (d), the discharge of the reinforcing resin 7 is continued and the application nozzle 14a is continued. Is moved toward the application end side end point EE opposite to the application start side end point ES along the application shape line 7 * (second nozzle moving step). In the second nozzle moving step, the application nozzle 14a moves past the discharge start point PS, so that the resin end 7e remaining in the upper protrusion shape at the discharge start point PS is leveled by the application nozzle 14a. Disappear.

  Further, at the end of the second nozzle moving step, as shown in FIG. 13A, a descent start point set at a position separated by a predetermined distance 12 on the coating shape line 7 * from the coating end point EE. In PD, the application nozzle 14a is lowered, and in this state, the application nozzle 14a is moved to the discharge end side end point EE. Then, as shown in FIG. 13B, at the timing when the application nozzle 14a reaches the application end point EE, the discharge of the reinforcing resin 7 from the discharge port is stopped (discharge stop process).

  Thereafter, as shown in FIG. 13C, the application nozzle 14a is raised (arrow g). At this time, the discharge port of the application nozzle 14a is temporarily lowered to a position lower than the height of the resin wire to be formed. Since it is lowered, the reinforcing resin 7 that rises together with the upper attitude attached to the discharge port as the application nozzle 14a rises is torn off at a height position substantially the same as the height of the already formed resin wire, The upper end portion of the resin end portion 7f formed at the discharge end side end point EE does not greatly exceed the height of the already formed resin wire. As a result, as shown in FIG. 13D, a resin line extending from the discharge start side end point ES to the discharge end side end point EE is formed by applying the reinforcing resin 7 linearly.

  In the resin line formed in this way, the upper protruding resin end portion 7e formed at the discharge start point PS with the start of discharge of the reinforcing resin 7 from the application nozzle 14a is used as the second nozzle moving step. In this case, the upper end resin end portion 7e existing at the discharge start side end point ES is usually lost. In the second nozzle moving step, the application nozzle 14a is lowered at a descent start point set at a position PD separated from the application end point EE by a predetermined distance 12 on the application line. Thus, the upper end-shaped resin end portion 7f is prevented from being formed when the ejection of the reinforcing resin 7 from the application nozzle 14a is stopped.

  Such upper protruding resin end portions 7e and 7f in the corner reinforcing portion 70 formed to reinforce the corner portion 6c impair the reinforcing effect, and the resin end portions 7e and 7f are electronic components 6 to be reinforced. If it protrudes from the upper surface, it may cause various problems such as interference with the housing and other parts when it is mounted in the housing in a later process. On the other hand, by applying the resin coating method shown in the present embodiment, even if the high-viscosity and high-thixotropy reinforcing resin 7 is used as a corner reinforcing portion of the electronic component 6, the top impact It is possible to effectively prevent the resin end portion having the shape from being formed.

  The electronic component mounting body and the resin coating method of the present invention have an effect that a resin reinforcing portion for reinforcing the holding force of the solder joint portion can be appropriately formed to ensure mounting reliability, and This is useful in an electronic component mounting body formed by mounting an electronic component and a resin application in which a reinforcing resin for reinforcing the electronic component is applied to an outer edge portion of the electronic component.

The perspective view of the resin coating apparatus of one embodiment of this invention Structure explanatory drawing of the electronic component mounting body used as the application object of the resin coating device of one embodiment of the present invention Explanatory drawing which shows the basic pattern of the corner reinforcement part in the electronic component mounting body of one embodiment of this invention Explanatory drawing which shows the shape of the corner reinforcement part in the electronic component mounting body of one embodiment of this invention Explanatory drawing which shows the shape of the corner reinforcement part in the electronic component mounting body of one embodiment of this invention Explanatory drawing which shows the shape of the corner reinforcement part in the electronic component mounting body of one embodiment of this invention Explanatory drawing which shows the shape of the corner reinforcement part in the electronic component mounting body of one embodiment of this invention The block diagram which shows the structure of the control system of the resin coating apparatus of one embodiment of this invention Explanatory drawing of the dimension data which shows the specific dimension of the corner reinforcement part in the resin coating method of one embodiment of this invention The flowchart explaining the application | coating operation process of resin for corner reinforcement of one embodiment of this invention Flow chart of trajectory confirmation processing in corner reinforcement resin application work processing of one embodiment of the present invention Process explanatory drawing which shows the coating method of the tree resin for corner reinforcement of one embodiment of this invention Process explanatory drawing which shows the coating method of the tree resin for corner reinforcement of one embodiment of this invention

DESCRIPTION OF SYMBOLS 1 Resin coating device 2 Conveying part 3 Resin coating part 5 Board | substrate 6 Electronic component 6a Bump 6c Corner part 6e Outer edge part 60 Small component 61 1st edge 62 2nd edge 7 Reinforcing resin 7a 1st resin line 7b 2nd Resin wire 7c First resin extending portion 7d Second resin extending portion 7e Resin end portion 7f Resin end portion 7 * Application shape line 8 Electronic component mounting body 10 Y-axis table (moving means)
12 X-axis table (moving means)
13 Resin tank (resin discharge means)
14 Dispenser (resin discharge means)
14a Application nozzle L1 First application line L2 Second application line ES Discharge start side end point EE Discharge end side end point

Claims (4)

An electronic component mounting body in which a plurality of electronic components are mounted on a substrate by soldering,
One electronic component having a rectangular planar shape among the plurality of electronic components mounted on the substrate, another electronic component mounted close to a corner portion of the one electronic component, and an upper surface of the substrate The reinforcing resin is applied linearly along the outer edge portion of the one electronic component, and each of the four corner portions of the rectangle is formed, and the one electronic component is bonded to the substrate to form the electronic component. A corner reinforcing portion that reinforces a holding force for holding the component on the substrate;
Each of the corner reinforcing portions includes a first portion formed in parallel with one side of the four sides constituting the rectangle and including the corner portion and having a length less than ½ side length of the one side. And a second resin line formed including the corner portion in parallel with the other side orthogonal to the one side,
The first resin wire and / or the second resin wire are provided with a discontinuous portion on the electronic component so as not to apply the reinforcing resin at a position where the other electronic component exists. A featured electronic component mounting body.   2. The electronic component mounting body according to claim 1, wherein the second resin wire is formed with a length of less than ½ side length of the other side. A plurality of electronic components are mounted on a substrate by solder bonding, and one electronic component having a rectangular planar shape among the plurality of electronic components mounted on the substrate is adjacent to a corner portion of the one electronic component. Formed on each of the four corners of the one electronic component on the upper surface of the substrate, and the one electronic component is bonded to the substrate to attach the electronic component to the substrate. An electronic component mounting body including a corner reinforcing portion that reinforces the holding force to be held, by applying a reinforcing resin linearly along the outer edge portion of the electronic component on the upper surface of the substrate. A resin coating method to be formed,
The drawing application step of moving the discharge nozzle while discharging the reinforcing resin from the application nozzle to form each of the corner reinforcement portions is parallel to one of the four sides constituting the rectangle. A first coating step that includes the corner portion and forms a first resin wire having a length of less than ½ side length of the one side; and in parallel with the other side orthogonal to the one side, A second application step of forming a second resin wire including the corner portion,
Further, in the first application step and / or the second application step, the discharge is interrupted in order not to apply the reinforcing resin on the electronic component at a position where the other electronic component exists. Application method.   In the first application step and the second application step, the application center lines of the first resin wire and the second resin wire are spaced outward from each other by a predetermined width from the one side and the other side, respectively. The resin coating method according to claim 3, wherein the resin coating method is set.

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