JP2010191466A - Color filter substrate for organic electroluminescent element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a color filter substrate for an organic electroluminescent element, which displays a satisfactory image without defect such as a dark spot. <P>SOLUTION: The color filter substrate for the organic electroluminescent element has a transparent substrate, a colored layer formed on the transparent substrate, barrier layer separation parts formed in a dot-like pattern form on the colored layer and barrier layers formed on the colored layer and the barrier layer separation parts. The barrier layer separation part is formed in a transparent electrode layer non-forming region which is not provided with a transparent electrode layer. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a color filter substrate for an organic electroluminescent element used for an organic electroluminescent element, for example.

  Organic electroluminescent (hereinafter abbreviated as EL) elements have high visibility due to self-coloring, are all solid-state display devices unlike liquid crystal display devices, and are not significantly affected by temperature changes. In addition, it has advantages such as a large viewing angle, and in recent years, it has been put into practical use as a pixel of a display device.

  As a display device using an organic EL element, (1) a light emitting layer of three primary colors is formed in a predetermined pattern for each light emission color, and (2) a light emitting layer of white light emission is used, through a color filter of three primary colors. (3) Using a light emitting layer that emits blue light, installing a color conversion layer using a fluorescent dye, converting blue light into green fluorescence or red fluorescence, and displaying three primary colors ing.

  However, in the organic EL display device of the above (1), it is necessary to develop light-emitting materials for each color in order to emit light of different colors and make it multicolored, and the materials themselves are organic compounds. There is a problem that resistance to multi-color patterning by lithography is poor. In addition, multi-color patterning in a dry process other than the photolithography method is complicated and has a problem in mass production.

  Therefore, it is conceivable to utilize the organic EL display devices (2) and (3) other than the above (1). However, in the organic EL display devices of (2) and (3), there is a problem that the organic EL element deteriorates due to gas components desorbed from the material system used for the color filter and the color conversion layer. For this reason, an organic EL display device provided with a barrier layer in order to prevent this gas component has been proposed (see, for example, Patent Documents 1 to 5).

  This barrier layer is generally formed by vapor deposition, but it is technically difficult to obtain a barrier layer free from foreign matters such as particles and pinholes. Further, when there are particles and pinholes in the barrier layer, there is a problem that desorbed gas components are concentrated on the barrier layer, and the organic EL element deteriorates from that portion and does not emit light. On the other hand, a barrier layer can be formed by a coating method, but there is a problem that a dark spot due to pinholes does not occur, but pixel shrinkage from the end of the transparent electrode layer called shrink occurs.

JP 2002-1000046 A JP 2002-117976 A JP 2002-134268 A JP 2002-175880 A JP 2002-184578 A

  The present invention has been made in view of the above problems, and a main object of the present invention is to provide a color filter substrate for an organic EL element capable of displaying a good image without defects such as dark spots.

  To achieve the above object, the present invention provides a transparent substrate, a colored layer formed on the transparent substrate, a barrier layer separating portion formed in a dot pattern on the colored layer, and the colored layer. And a barrier layer formed on the barrier layer separation part, wherein the barrier layer separation part is formed in the transparent electrode layer non-formation region where the transparent electrode layer is not provided. Provided is a color filter substrate for an organic EL element.

  According to the present invention, since the barrier layer separation part is formed using, for example, a photosensitive resin, the region where the barrier layer is formed via the dot-shaped barrier layer separation part is not a barrier separation part. The barrier property is lower than that of the region where the layer is formed. In addition, the barrier layer separation portion is formed in the transparent electrode layer non-formation region, and when the organic EL device is formed using the organic EL device color filter substrate of the present invention, the transparent electrode layer non-formation region is a non-display region. It becomes. For this reason, the desorbed gas from the colored layer or the like is selectively released to the barrier layer separation unit. That is, since the desorbed gas from the colored layer or the like is selectively released in the non-display area, even if a defect such as a pinhole exists in the barrier layer, the effect of the desorbed gas on the pixel area is not affected. Can be suppressed. Thereby, it is possible to suppress the deterioration of the light emitting layer of the organic EL element, and it is possible to suppress the occurrence of dark spots and the like.

  In the present invention, it is preferable that the barrier layer separation portion is formed in the transparent electrode layer non-formation region and in the cathode separator formation region where the cathode separator is provided. Since the cathode separator formation region is relatively distant from the pixel region, the barrier layer separation portion is formed in the cathode separator formation region, so that the influence of the desorbed gas from the coloring layer etc. on the pixel region is effectively prevented. This is because it can be reduced.

  At this time, the barrier layer separation portion has a width in a direction perpendicular to the transparent electrode layer non-formation region equal to or less than a width of the transparent electrode non-formation region, and a width in a direction parallel to the transparent electrode layer non-formation region It is preferable that the width is smaller than the width of the cathode separator forming region. This is because if the width of the barrier layer separation portion is too large, the desorbed gas from the colored layer or the like may be released also into the pixel region.

  Moreover, in this invention, it is preferable that the said barrier layer isolation | separation part consists of negative photosensitive resin. This is because the use of a negative photosensitive resin makes it possible to easily form a barrier layer separation portion having a reverse tapered shape in cross section. The reverse taper shape is advantageous for releasing desorbed gas from the colored layer or the like.

  Furthermore, in this invention, it is preferable that the thickness of the said barrier layer isolation | separation part exists in the range of 1 micrometer-5 micrometers. If the thickness of the barrier layer separation portion is too thin, it will be difficult to selectively release the desorbed gas from the colored layer or the like from the barrier layer separation portion, and if the thickness of the barrier layer separation portion is too thick, This is because the transparent electrode layer may be disconnected due to a step (unevenness) caused by the barrier layer separation portion.

  In the present invention, a planarization layer may be formed between the colored layer, the barrier layer separating portion, and the barrier layer. By forming the planarization layer, when an organic EL element is formed using the color filter substrate for an organic EL element of the present invention, it is possible to prevent occurrence of uneven thickness in the organic EL layer of the organic EL element. Because it can.

  Furthermore, in this invention, the transparent electrode layer may be formed other than the said transparent electrode layer non-formation area | region on the said barrier layer.

  In the present invention, a color conversion layer may be formed between the colored layer, the barrier layer separating portion, and the barrier layer.

  The present invention also provides an organic EL element using the above-described color filter substrate for an organic EL element. According to the present invention, since the above-described color filter substrate for an organic EL element is used, it is possible to suppress the occurrence of dark spots and the like and to obtain an organic EL element capable of displaying a good image.

  Furthermore, the present invention provides a barrier that forms a barrier layer separation portion in a pattern in a cathode separator forming region where a cathode separator is provided on a transparent substrate on which a colored layer is formed or a transparent electrode layer non-forming region where a transparent electrode layer is not provided. There is provided a method for producing a color filter substrate for an organic EL element, comprising: a layer separation portion forming step; and a barrier layer forming step of forming a barrier layer on the colored layer and the barrier layer separation portion.

  According to the present invention, by forming the barrier layer separation portion in the transparent electrode layer non-formation region or the cathode separator formation region that becomes the non-display region, the desorbed gas from the colored layer or the like is selectively released in the non-display region. Can be made. For this reason, it is possible to prevent the desorbed gas from being emitted from the colored layer or the like to the pixel region, and it is possible to suppress the occurrence of dark spots or the like.

  In the present invention, in the barrier layer separation portion forming step, the barrier layer separation portion may be formed in a dot pattern. At this time, in the barrier layer separation portion forming step, the barrier layer separation portion has a width in a direction perpendicular to the transparent electrode layer non-formation region that is equal to or less than a width of the transparent electrode non-formation region. It is preferable that the width in the direction parallel to the region is narrower than the width of the cathode separator forming region. This is because if the width of the barrier layer separation portion is too large, the desorbed gas from the colored layer or the like may be released also into the pixel region.

  Furthermore, in the present invention, in the barrier layer separation portion forming step, the barrier layer separation portion may be formed in a line pattern in the cathode separator formation region. At this time, in the barrier layer separation portion forming step, the barrier layer separation portion is preferably formed such that the line width is narrower than the width of the cathode separator formation region. This is because if the line width of the barrier layer separation portion is too large, the desorbed gas from the colored layer or the like may be released also into the pixel region.

  In the present invention, a barrier layer separation portion removing step for removing the barrier layer separation portion may be performed after the barrier layer forming step. This is because by removing the barrier layer separation part, it is possible to release the desorbed gas from the colored layer or the like to the non-display region more effectively than when the barrier layer separation part is formed. Moreover, since the level difference (unevenness) due to the pattern-like barrier layer separation part is eliminated, the risk of disconnection of the transparent electrode layer due to this level difference can be avoided.

  In this case, it is preferable that a photolithography method is used in the barrier layer separation portion forming step. This is because the barrier layer separation portion can be easily patterned by using the photosensitive resin composition as a material for forming the barrier layer separation portion.

  At this time, in the barrier layer separation portion forming step, it is preferable to form the barrier layer separation portion using a positive photosensitive resin composition. This is because the positive photosensitive resin composition is relatively easy to remove.

  Furthermore, this invention provides the manufacturing method of the organic EL element characterized by using the manufacturing method of the color filter substrate for organic EL elements mentioned above. According to this invention, since the manufacturing method of the color filter substrate for organic EL elements mentioned above is used, generation | occurrence | production of a dark spot etc. can be suppressed and the organic EL element which can display a favorable image can be manufactured. .

  In the present invention, since the barrier layer separation part is formed in the transparent electrode layer non-formation region which is a non-display region, desorbed gas from the colored layer or the like can be selectively released to the non-display region, Even if defects such as pinholes are present in the barrier layer, the effect of suppressing the occurrence of dark spots and the like can be achieved. In addition, since the barrier layer separation part can be removed after the barrier layer is formed, the desorption gas from the colored layer or the like can be more selectively released to the non-display area.

It is a schematic plan view which shows an example of the color filter substrate for organic EL elements of this invention. It is a schematic sectional drawing of the AA arrow cross section shown in FIG. It is a schematic sectional drawing which shows an example of the color filter substrate for organic EL elements of this invention. It is process drawing which shows an example of the manufacturing method of the color filter substrate for organic EL elements of this invention. It is a schematic plan view which shows the other example of the color filter substrate for organic EL elements of this invention. It is process drawing which shows an example of the barrier layer isolation | separation part formation process in the manufacturing method of the color filter substrate for organic EL elements of this invention. It is process drawing which shows the other example of the manufacturing method of the color filter substrate for organic EL elements of this invention.

  Hereinafter, a color filter substrate for an organic EL element of the present invention, an organic EL element using the same, and a production method thereof will be described.

A. Color filter substrate for organic EL elements The color filter substrate for organic EL elements of the present invention includes a transparent substrate, a colored layer formed on the transparent substrate, and a barrier formed in a dot pattern on the colored layer. A color filter substrate for an organic EL element having a layer separation portion and a barrier layer formed on the colored layer and the barrier layer separation portion, wherein the barrier layer separation portion is a transparent layer on which a transparent electrode layer is not provided. It is formed in the electrode layer non-formation region.

First, the color filter substrate for organic EL elements of the present invention will be described with reference to the drawings. FIG. 1 is a schematic plan view showing an example of a color filter substrate for an organic EL element of the present invention. FIG. 2 is a schematic cross-sectional view taken along line AA shown in FIG. In FIG. 1, the black matrix, the colored layer, the planarization layer, and the barrier layer are omitted.
As shown in FIG. 2, the color filter substrate 10 for organic EL elements of the present invention has a colored layer 2 (2R, 2G, 2B) and a black matrix 3 formed on a transparent substrate 1, and the colored layer 2 and black A planarization layer 4 is formed on the matrix 3, and a barrier layer separation portion 5 is formed in a dot-like pattern in the transparent electrode layer non-formation region 12 on the planarization layer 4. A barrier layer 6 is formed on the separation portion 5.

  In the color filter substrate 10 for an organic EL element of the present invention shown in FIG. 1, when the organic EL element is produced using this color filter substrate for an organic EL element, a region where the transparent electrode layer is provided is a transparent electrode layer forming region 11. The area where the transparent electrode layer is not provided is defined as a transparent electrode layer non-formation area 12. A region where the cathode separator is provided is a cathode separator forming region 13. The barrier layer separating portions 5 and 5 ′ in the present invention are formed in the transparent electrode layer non-formation region 12.

The barrier layer separating portion used in the present invention is formed using, for example, a photosensitive resin as described later, and has a low barrier property against desorbed gas from the colored layer or the like. For this reason, in the region where the barrier layer 6 is formed via the dot-shaped barrier layer separating portion 5 and the region where the barrier layer 6 is formed directly on the colored layer 2 and the planarizing layer 4, the barrier layer separating portion 5 In the region where the barrier layer 6 is formed via the barrier layer, the barrier property against the desorbed gas is lower. Accordingly, the desorbed gas from the colored layer 2 is selectively released to the barrier layer separation unit 5. Since the barrier layer separation portion 5 is formed in the transparent electrode layer non-formation region 12 which is a non-display region, the desorbed gas from the colored layer 2 is selectively released to the non-display region, and the barrier Even when a defect such as a pinhole exists in the layer 6, the influence of the desorbed gas on the pixel region can be suppressed. For this reason, when the color filter substrate for organic EL elements of the present invention is used for an organic EL element, it is possible to suppress the deterioration of the light emitting layer of the organic EL element and suppress the occurrence of dark spots and the like. Can do.
Hereinafter, each structure of the color filter substrate for organic EL elements of this invention is demonstrated.

1. Barrier layer separation part The barrier layer separation part used for this invention is formed in the transparent electrode layer non-formation area | region on a colored layer. Here, the transparent electrode layer non-formation region refers to a region where a transparent electrode layer is not provided when an organic EL device is produced using the color filter substrate for an organic EL device of the present invention. In the present invention, the position of the barrier layer separation portion is not particularly limited as long as it is formed in this transparent electrode layer non-formation region. For example, as shown in FIG. 1, in the transparent electrode layer non-formation region 12, the cathode separator is formed even if the barrier layer separation portion is formed at the position of the barrier layer separation portion 5 on the cathode separator formation region 13. It may be the position of the barrier layer separation portion 5 ′ that is not on the region 13.

  In the present invention, the barrier layer separation part is preferably formed in the transparent electrode layer non-formation region and the cathode separator formation region. That is, for example, in FIG. 1, the formation position of the barrier layer separation portion is preferably the position of the barrier layer separation portion 5. Here, the cathode separator formation region refers to a region where a cathode separator is provided when an organic EL element is produced using the color filter substrate for an organic EL element of the present invention. The cathode separator is provided in a region relatively distant from the pixel region. For example, in FIG. 1, the barrier layer separating unit 5 is located farther from the pixel region than the barrier layer separating unit 5 ′. For this reason, since the barrier layer separation part is formed in the transparent electrode layer non-formation region and the cathode separator formation region, it is possible to effectively reduce the influence of the desorbed gas from the colored layer on the pixel region.

  Moreover, the barrier layer separation part used for this invention is formed in a dot-like pattern shape, and will not be specifically limited if it is formed in the dot shape discontinuously. Further, the shape of the barrier layer separation portion is, for example, a rectangle in FIG. 1, but may be a rectangle or a circle.

  Further, the size of the barrier layer separation portion is not particularly limited as long as it is a size that can be formed in the transparent electrode layer non-formation region. Since it is preferably formed in the formation region and the cathode separator formation region, it is preferable that the size be formed in the transparent electrode layer non-formation region and the cathode separator formation region. Specifically, for example, as shown in FIG. 1, the width 15 in the direction perpendicular to the transparent electrode layer non-formation region 12 of the barrier layer separation portion 5 is equal to or less than the width 17 of the transparent electrode non-formation region 12. The width 16 in the direction parallel to the transparent electrode layer non-formation region 12 of the separation part 5 is preferably narrower than the width 18 of the cathode separator formation region 13. More specifically, the width in the direction perpendicular to the transparent electrode layer non-formation region of the barrier layer separation portion and the width in the parallel direction are preferably 30 μm or less, more preferably 20 μm or less. This is because if the width of the barrier layer separation portion is too large, desorbed gas from the colored layer or the like may be released to the pixel region. On the other hand, the width in the direction perpendicular to the transparent electrode layer non-formation region of the barrier layer separation portion and the width in the parallel direction are preferably 10 μm or more. This is because if the width is too small, the strength may decrease and patterning becomes very difficult.

At this time, the cross-sectional shape of the barrier layer separating portion is not particularly limited, and may or may not be a tapered shape. Moreover, when the cross-sectional shape of the barrier layer separating portion is a taper shape, it may be a forward taper shape or a reverse taper shape, and among them, a reverse taper shape is preferable. If it is a reverse taper shape, it is difficult to form a barrier layer or the like on the side surface of the barrier layer separation part, so compared with a non-tapered shape or a forward tapered shape,
This is because the desorbed gas from the colored layer or the like is easily released.

  Regarding the thickness of the barrier layer separation part, the desorbed gas from the colored layer or the like can be selectively released from the barrier layer separation part, and the transparent electrode layer is disconnected due to a step (unevenness) by the barrier layer separation part. The thickness is not particularly limited as long as the thickness does not exist. Specifically, it is preferably in the range of 1 μm to 5 μm, more preferably in the range of 1 μm to 3 μm.

  In the present invention, it is only necessary that the desorbed gas from the colored layer or the like can be selectively released to the non-display area, and therefore the number of barrier layer separation portions is not particularly limited. For example, the barrier layer separation portion is formed for each region where the transparent electrode layer non-forming region and the cathode separator forming region intersect.

  The constituent material of the barrier layer separating portion used in the present invention is not particularly limited as long as it can be formed into a dot-like pattern, but among these, a photosensitive resin is preferable. This is because the formation of a pattern using a photosensitive resin is an already established technique and can be easily applied to the present invention including the photosensitive resin to be used.

  The constituent material of the barrier layer separation part is preferably a negative photosensitive resin among the photosensitive resins. This is because the use of a negative photosensitive resin makes it easy to form the cross-sectional shape of the barrier layer separating portion into an inversely tapered shape. As described above, the inversely tapered shape is advantageous for releasing desorbed gas from the colored layer or the like.

  As the negative photosensitive resin used for the barrier layer separating portion, those generally used as negative photosensitive resins can be used. For example, the photocurable resin which has reactive vinyl groups, such as an acrylate type and a methacrylate type, is mentioned. Also, polymethyl methacrylate, polyacrylate, polycarbonate, polyvinyl alcohol, polyvinyl pyrrolidone, hydroxyethyl cellulose, carboxymethyl cellulose, acrylic resin, norbornene resin, polyvinyl chloride resin, melamine resin, phenol resin, alkyd resin, epoxy resin, polyurethane resin, Polyester resin, maleic acid resin, polyamide resin and the like can also be used. Among these, an acrylic resin is preferable. This is because the acrylic resin has high solubility in a general-purpose solvent and the preparation of the photosensitive resin composition is easy.

2. Barrier layer The barrier layer used in the present invention is formed on the colored layer and the barrier layer separation part. Examples of the barrier layer used in the present invention include a barrier layer of a general organic EL element. Examples of the constituent material of the barrier layer include SiO ₂ , SiO _x , Al ₂ O ₃ , GeO ₂ , and TiO _2. , Cr ₂ O ₃ , ZrO ₃ , Ta ₂ O ₅ , Nb ₂ O _{3 and} other inorganic oxides; Si ₃ N ₄ , AlN and other inorganic nitrides; SiO _x N _{y and} other inorganic oxynitrides; SiC and the like Inorganic carbides; DLC (diamond-like carbon); Among these, as the barrier layer, silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum nitride, aluminum oxynitride, Al-Si composite oxide, Al-Si nitride, Al-Si oxynitride An insulating transparent inorganic film such as an object is preferable. In particular, silicon oxynitride such as SiO _x N _y is suitable. This is because by using silicon oxynitride, a barrier layer having high permeability and barrier properties can be formed.

  When the barrier layer is a silicon oxynitride film, the silicon oxynitride film is 80 ≦ X + Y ≦ 160, 10 ≦ X ≦ 80, 10 ≦ Y when the atomic ratio Si: O: N is 100: X: Y. It is preferable that ≦ 120. This is because with such an atomic ratio, the transmittance in the visible light region is good, and a dense silicon oxynitride film with high barrier properties can be obtained.

  The thickness of the barrier layer is not particularly limited as long as it exhibits a barrier property. Specifically, the thickness is preferably in the range of 20 nm to 600 nm, more preferably in the range of 100 nm to 300 nm. It is. This is because if the thickness of the barrier layer is too thin, it is difficult to obtain desired barrier properties, water resistance and moisture resistance. On the other hand, if the thickness of the barrier layer is too thick, it is difficult to obtain the barrier layer separation effect by the barrier layer separation part, and the transparency of the barrier layer may be impaired.

3. Colored layer The colored layer used in the present invention is formed on a transparent substrate and is usually composed of a red colored pattern 2R, a green colored pattern 2G, and a blue colored pattern 2B as shown in FIG. .

  Examples of the constituent material of the red coloring pattern include perylene pigments, lake pigments, azo pigments, quinacridone pigments, anthraquinone pigments, anthracene pigments, isoindoline pigments, and the like. These may be used alone or as a mixture of two or more.

  Examples of the constituent material of the green coloring pattern include halogen polysubstituted phthalocyanine pigments, halogen polysubstituted copper phthalocyanine pigments, triphenylmethane basic dyes, isoindoline pigments, and isoindolinone pigments. These may be used alone or as a mixture of two or more.

  Examples of the constituent material of the blue coloring pattern include copper phthalocyanine pigments, indanthrene pigments, indophenol pigments, cyanine pigments, dioxazine pigments and the like. These may be used alone or as a mixture of two or more.

  The colored layer is formed using a binder resin together with the above-described pigment. As the binder resin, a transparent resin having a transmittance of 50% or more in the visible light region is preferably used, and examples thereof include polymethyl methacrylate, polyacrylate, polycarbonate, polyvinyl alcohol, polyvinyl pyrrolidone, hydroxyethyl cellulose, carboxymethyl cellulose, and the like. .

  Furthermore, a photosensitive resin can be used as a constituent material of the colored layer. When the photosensitive resin is used, a photolithography method can be applied, and the colored layer can be easily formed in a pattern. Examples of the photosensitive resin used in the colored layer include photosensitive resins having reactive vinyl groups such as acrylic acid-based, methacrylic acid-based, polyvinyl cinnamate-based, and cyclized rubber-based.

  The colored layer can be formed using an ink containing a transparent resin. When an ink containing a transparent resin is used, a printing method can be applied. Examples of the transparent resin used in the ink containing the transparent resin include a polyvinyl chloride resin, a melamine resin, a phenol resin, an alkyd resin, an epoxy resin, a polyurethane resin, a polyester resin or a maleic acid resin, a monomer, oligomer or polymer of a polyamide resin. Alternatively, polymethyl methacrylate, polyacrylate, polycarbonate, polyvinyl alcohol, polyvinyl pyrrolidone, hydroxyethyl cellulose, carboxymethyl cellulose and the like can be mentioned.

  As a method for forming the colored layer, when the colored layer is mainly composed of the above-described pigment, a method of forming a vacuum film by a vacuum deposition method or the like through a desired pattern mask is applied. On the other hand, when the colored layer is composed of the above-described pigment and binder resin, the pigment, binder resin and photosensitive resin are mixed and dispersed or solubilized to prepare a colored layer forming coating solution. Apply the coating solution for forming by a general coating method such as spin coating, roll coating, casting method, etc. to form a coating film, and patterning by photolithography method, or using the above-mentioned coating solution for forming a colored layer A method of forming a pattern by a printing method or the like is applied.

  Moreover, when using photosensitive resin for a colored layer, it is preferable that the pigment mentioned above is contained about 5-50 mass% in each coloring pattern.

  In the present invention, a black matrix may be formed between the colored patterns. Examples of the black matrix used in the present invention include an oxynitride composite chromium thin film.

  As a method of forming the black matrix, a deposited film is formed by sputtering or the like, a photosensitive resin is applied thereon, mask exposure, development, and etching of the composite chromium oxynitride thin film are performed to form a pattern. A method is mentioned.

4). Transparent substrate The transparent substrate used for this invention is not specifically limited, What is generally used as a transparent substrate of an organic EL element can be used. Examples thereof include glass substrates such as alkali-free glass and soda lime glass, and plastic substrates such as polyimide resin and methacrylic acid resin.

  Although it does not specifically limit as thickness of the said transparent substrate, Usually, it exists in the range of 0.5 mm-1.2 mm, Especially preferably, it is about 0.7 mm.

5). Flattening layer In the present invention, a flattening layer 4 may be formed on the colored layer 2 as shown in FIG. This flattening layer is provided in order to eliminate the level difference and achieve leveling when there is a level difference (unevenness) due to a colored layer or a color conversion layer formed in a pattern, for example. By providing the planarizing layer, when the organic EL element is formed using the color filter substrate for an organic EL element of the present invention, it is possible to prevent occurrence of uneven thickness in the light emitting layer of the organic EL element. .

  As a constituent material of the planarization layer used in the present invention, a transparent resin having a transmittance in the visible light region of 50% or more is preferably used. Specific examples include photo-curing resins and thermosetting resins having an acrylate-based or methacrylate-based reactive vinyl group. Examples of the transparent resin include polymethyl methacrylate, polyacrylate, polycarbonate, polyvinyl alcohol, polyvinyl pyrrolidone, hydroxyethyl cellulose, carboxymethyl cellulose, polyvinyl chloride resin, melamine resin, phenol resin, alkyd resin, epoxy resin, polyurethane resin, Polyester resin, maleic acid resin, polyamide resin and the like can also be used.

  As the method for forming the planarizing layer, when the transparent resin is a liquid, a coating film is formed by applying a general coating method such as spin coating, roll coating, cast coating, etc. A method of curing the coating as it is after ultraviolet irradiation and curing the coating film as it is can be mentioned as long as it is a thermosetting resin. Moreover, when the said transparent resin is shape | molded in the film form, the method of sticking on a colored layer directly or via an adhesive is applied.

  The thickness of the planarizing layer is not particularly limited, but is usually about 2 μm to 7 μm.

6). Transparent Electrode Layer In the present invention, for example, as shown in FIG. 3, the transparent electrode layer 7 may be formed in the transparent electrode layer forming region 11 other than the transparent electrode layer non-forming region 12 on the barrier layer 6. As a constituent material of the transparent electrode layer, a material generally used as an anode of an organic EL element can be used. Specifically, ITO (Indiumu Tin Oxide; indium oxide doped with several tens of percent of tin oxide), metal (for example, Cr, Ni, Mo, Al, Ti) and the like can be mentioned.

  As a method for forming the transparent electrode layer, a method for forming a transparent electrode of a general organic EL element can be employed. Specifically, a method of patterning using a photolithography method after forming a thin film by a sputtering method or an ion plating method can be mentioned.

  Although it does not specifically limit as thickness of the said transparent electrode layer, Usually, it is about 0.1-0.5 micrometer, Preferably it is about 0.15-0.3 micrometer.

7). Color Conversion Layer In the present invention, for example, as shown in FIG. 3, color conversion layers 8R, 8G, and 8B are formed between the colored layers 2R, 2G, and 2B and the barrier layer separating portion 5 and the barrier layer 6. Also good. In addition, when the planarization layer 4 is formed as shown in FIG. 3, the color conversion layers 8R, 8G, and 8B are formed between the colored layers 2R, 2G, and 2B and the planarization layer 4.

  The color conversion layer used for this invention is formed according to each coloring pattern of the said colored layer. As the color conversion layer, a general color conversion layer can be used, and usually a fluorescent dye dispersed in a transparent resin is used. In addition, when the organic EL element is formed using the color filter substrate for the organic EL element of the present invention, when a blue light emitting layer is used as the light emitting layer of the organic EL element, blue incident light is used as the color conversion layer. Those having the function of changing to red or green are used.

  Examples of fluorescent dyes that absorb light emitted from the blue light emitting layer and emit fluorescence in the red region such as orange or red include rhodamine B, rhodamine 6G, rhodamine 3B, rhodamine 101, rhodamine 110, sulforhodamine, basic. Rhodamine dyes such as violet 11 and basic red 2; cyanine dyes such as 4-dicyanomethylene-2-methyl-6- (p-dimethylaminostillin) -4H-pyran; 1-ethyl-2- [4- Pyridine dyes such as (p-dimethylaminophenyl) -1,3-butadienyl] -pyridium-percollate (hereinafter referred to as pyridine 1); or oxazine dyes. Various dyes (direct dyes, acid dyes, basic dyes, disperse dyes, etc.) can also be used if they are fluorescent. Further, a pigment obtained by kneading the fluorescent dye in advance in a transparent resin can also be used.

  Further, examples of fluorescent dyes that absorb light emitted from such a blue light emitting layer and emit green region fluorescence include 3- (2′-benzothiazolyl) -7-diethylaminocoumarin (coumarin 6), 3- (2 '-Benzimidazolyl) -7-N, N-diethylaminocoumarin (coumarin 7), 3- (2'-N-methylbenzimidazolyl) -7-N, N-diethylaminocoumarin (coumarin 30), 2, 3, 5, 6 Coumarin dyes such as -1H, 4H-tetrahydro-8-trifluoromethylquinolidine (9,9a, 1-gh) coumarin (coumarin 153); or basic yellow 51 which is a coumarin dye dye, and solvent yellow 11 And naphthalimide dyes such as Solvent Yellow 116. Various dyes (direct dyes, acid dyes, basic dyes, disperse dyes, etc.) can also be used if they are fluorescent. Further, a pigment obtained by kneading the fluorescent dye in advance in a transparent resin can also be used.

  These fluorescent dyes may be used alone or as a mixture, as required. In particular, since the fluorescence conversion efficiency to red is low, the conversion efficiency from light emission to fluorescence can also be increased by using the fluorescent dyes in combination.

  On the other hand, the transparent resin used for the color conversion layer preferably has a transmittance in the visible light region of 50% or more. Examples of such transparent resins include polymethyl methacrylate, polyacrylate, polycarbonate, polyvinyl alcohol, polyvinyl pyrrolidone, hydroxyethyl cellulose, carboxymethyl cellulose, and the like.

  Moreover, when patterning a color conversion layer using the photolithographic method, a transparent photosensitive resin can also be used as a constituent material of a color conversion layer. Examples of the transparent photosensitive resin used for the color conversion layer include photosensitive resins having reactive vinyl groups such as acrylic acid-based, methacrylic acid-based, polyvinyl cinnamate-based, and cyclized rubber-based.

  Furthermore, when the color conversion layer is formed in a pattern by a printing method, the color conversion layer can be formed using an ink containing a transparent resin. The transparent resin used in the ink containing the transparent resin includes, for example, a melamine resin, phenol resin, alkyd resin, epoxy resin, polyurethane resin, polyester resin, maleic acid resin or polyamide resin monomer, oligomer or polymer, or polymethyl methacrylate. , Polyacrylate, polycarbonate, polyvinyl alcohol, polyvinyl pyrrolidone, hydroxyethyl cellulose, carboxymethyl cellulose and the like.

  As a method of forming the color conversion layer, when the color conversion layer is mainly composed of a fluorescent dye, a method of forming a film by vacuum deposition or sputtering through a desired pattern mask is applied. On the other hand, when the color conversion layer is composed of a fluorescent dye and a transparent resin, the fluorescent dye, the transparent resin and the photosensitive resin are mixed and dispersed or solubilized to prepare a color conversion layer forming coating solution. A color conversion layer forming coating solution is applied by a general coating method such as spin coating or roll coating, and patterned using a photolithography method, or the above color conversion layer forming coating solution is used. A method of forming a pattern by a printing method such as screen printing is applied.

8). Others The color filter substrate for organic EL elements of the present invention can be used not only for organic EL elements but also as color filter substrates for various display devices. For example, colors for various electronic devices using substrates that generate a large amount of desorbed gas (including solid elution components) such as CCM (color changing media) substrates, color filter substrates for liquid crystal display devices, and film (plastic) substrates. Examples include a filter substrate.

  In addition, since it describes in the column of the "C. manufacturing method of the color filter substrate for organic EL elements" mentioned later as a manufacturing method of the color filter substrate for organic EL elements, description here is abbreviate | omitted.

B. Organic EL Element Next, the organic EL element of the present invention will be described. The organic EL element of the present invention is characterized by using the above-described color filter substrate for an organic EL element.

  According to the present invention, since the above-described color filter substrate for an organic EL element is used, it is possible to suppress the occurrence of dark spots and the like and to obtain an organic EL element capable of displaying a good image.

  The organic EL device of the present invention is usually a color filter substrate for an organic EL device described above, a cathode separator formed in a cathode separator formation region on a transparent electrode layer of the organic EL device color filter substrate, and the transparent electrode. An organic EL layer having at least a light emitting layer and a counter electrode layer formed on the organic EL layer is formed between the cathode separators on the layer. In addition, an insulating layer may be formed in the transparent electrode layer non-forming region and the cathode separator forming region on the transparent electrode layer.

  What is generally used as a structural member of an organic EL element can be applied as the structural member of the organic EL element of the present invention. Hereinafter, the organic EL layer and the counter electrode layer of the organic EL element of the present invention will be described.

1. Organic EL Layer The organic EL layer used in the present invention is composed of one or more organic layers including at least a light emitting layer. That is, the organic EL layer is a layer including at least a light emitting layer, and the layer configuration is a layer having one or more organic layers. Usually, when an organic EL layer is formed by a wet method by coating, it is often difficult to stack a large number of layers in relation to a solvent, so that it is often formed of one or two organic layers. However, it is possible to further increase the number of layers by devising an organic material so that the solubility in a solvent is different or by combining a vacuum deposition method.

Examples of the organic layer formed in the organic EL layer other than the light emitting layer include charge injection layers such as a hole injection layer and an electron injection layer. Furthermore, examples of the other organic layers include a charge transport layer such as a hole transport layer that transports holes to the light-emitting layer and an electron transport layer that transports electrons to the light-emitting layer. In many cases, it is formed integrally with the charge injection layer by imparting a charge transporting function. In addition, as an organic layer formed in the organic EL layer, it prevents holes or electrons from penetrating like a carrier block layer and further prevents diffusion of excitons and confines excitons in the light emitting layer. And a layer for increasing the recombination efficiency.
Hereinafter, the light emitting layer which is an essential configuration of the organic EL layer will be described.

(1) Light emitting layer The light emitting layer used in the present invention has a function of emitting light by providing a recombination field of electrons and holes. As the material for forming the light emitting layer, a dye-based light-emitting material, a metal complex-based light-emitting material, or a polymer-based light-emitting material can be generally used.

  Examples of dye-based light emitting materials include cyclopentadiene derivatives, tetraphenylbutadiene derivatives, triphenylamine derivatives, oxadiazole derivatives, pyrazoloquinoline derivatives, distyrylbenzene derivatives, distyrylarylene derivatives, silole derivatives, thiophene ring compounds, pyridine rings Examples thereof include compounds, perinone derivatives, perylene derivatives, oligothiophene derivatives, trifumanylamine derivatives, coumarin derivatives, oxadiazole dimers, pyrazoline dimers, and the like.

Metal complex light emitting materials include aluminum quinolinol complex, benzoquinolinol beryllium complex, benzoxazole zinc complex, benzothiazole zinc complex, azomethyl zinc complex, porphyrin zinc complex, europium complex, iridium metal complex, platinum metal complex, etc. The metal has Al, Zn, Be, Ir, Pt, etc., or a rare earth metal such as Tb, Eu, Dy, etc., and the ligand has an oxadiazole, thiadiazole, phenylpyridine, phenylbenzimidazole, quinoline structure, etc. A metal complex etc. can be mentioned. Specifically, tris (8-quinolinol) aluminum complex (Alq ₃ ) can be used.

  Furthermore, as the polymer light emitting material, polyparaphenylene vinylene derivatives, polythiophene derivatives, polyparaphenylene derivatives, polysilane derivatives, polyacetylene derivatives, polyvinylcarbazole, polyfluorenone derivatives, polyfluorene derivatives, polyquinoxaline derivatives, polydialkylfluorene derivatives, And copolymers thereof. Moreover, what polymerized the said pigment-type luminescent material and metal complex type | system | group luminescent material is also mentioned.

  The thickness of the light emitting layer is not particularly limited as long as it can provide a function of emitting light by providing a recombination field between electrons and holes, and can be, for example, about 100 nm to 200 nm. .

  Further, a dopant that emits fluorescence or phosphorescence may be added to the light emitting layer for the purpose of improving the light emission efficiency and changing the light emission wavelength. Examples of such dopants include perylene derivatives, coumarin derivatives, rubrene derivatives, quinacridone derivatives, squalium derivatives, porphyrin derivatives, styryl dyes, tetracene derivatives, pyrazoline derivatives, decacyclene, phenoxazone, quinoxaline derivatives, carbazole derivatives, fluorene derivatives, and the like. Can be mentioned.

  The method for forming the light emitting layer is not particularly limited as long as it is a method capable of high-definition patterning. For example, vapor deposition method, printing method, inkjet method, spin coating method, casting method, dipping method, bar coating method, blade coating method, roll coating method, gravure coating method, flexographic printing method, spray coating method, and self-assembly method (Alternate adsorption method, self-assembled monolayer method) and the like. Among these, it is preferable to use a vapor deposition method, a spin coating method, and an ink jet method. Of the vapor deposition methods, vacuum vapor deposition by resistance heating is preferable. Furthermore, when the light emitting layer is patterned, it may be separately applied or vapor deposited by a masking method for pixels having different light emission colors.

2. Counter electrode layer The counter electrode layer used for this invention is an electrode which opposes the transparent electrode layer of the color filter substrate for organic EL elements mentioned above. The constituent material of the counter electrode layer is not particularly limited, and those generally used as the cathode of the organic EL element can be used. Specifically, Al, Ag, Ca, Li, CaF, or the like can be used. Further, the counter electrode layer may be formed by laminating Ca and Ag in this order, for example.

  The method for forming the counter electrode layer is not particularly limited, and a general method for forming an electrode of an organic EL element can be employed. Specifically, the counter electrode layer can be formed by a method such as a vacuum evaporation method using resistance heating.

  The thickness of the counter electrode layer is not particularly limited, but is usually 100 to 200 nm, preferably about 150 nm. When the counter electrode layer is a laminate of two or more electrodes, the above thickness is the thickness of each electrode.

C. Next, the manufacturing method of the color filter substrate for organic EL elements of this invention is demonstrated. The method for producing a color filter substrate for an organic EL device according to the present invention includes a pattern on a cathode separator forming region where a cathode separator is provided on a transparent substrate on which a colored layer is formed or a transparent electrode layer non-forming region where a transparent electrode layer is not provided. And a barrier layer separating step for forming a barrier layer separating portion, and a barrier layer forming step for forming a barrier layer on the colored layer and the barrier layer separating portion.

  The manufacturing method of the color filter substrate for organic EL elements of this invention is demonstrated referring drawings. FIG. 4 is a process diagram showing an example of a method for producing a color filter substrate for an organic EL element of the present invention. As shown in FIG. 4, in the method for producing a color filter substrate for an organic EL element of the present invention, first, a black matrix 3 and colored layers 2R, 2G, 2B are formed on a transparent substrate 1, and a planarizing layer is formed thereon. 4 is formed (FIG. 4A). And the photosensitive resin composition 25 is apply | coated on the transparent substrate 1 in which the colored layers 2R, 2G, 2B, etc. were formed, and the ultraviolet-ray 32 is irradiated through the photomask 31 (FIG.4 (b)), and it develops. Thus, the barrier layer separation portion 5 is formed (FIG. 4C) (barrier layer separation portion forming step). At this time, the barrier layer separation portion 5 is formed in a dot pattern so as to be formed in the transparent electrode layer non-formation region 12. Next, the barrier layer 6 is formed on the planarization layer 4 and the barrier layer separation part 5 (FIG. 4D, barrier layer forming step). 4 is a view as seen from the cross section taken along the line AA in FIG.

According to the present invention, the region where the barrier layer is formed via the barrier layer separating portion is compared with the region from the colored layer, as compared with the region where the barrier layer is directly formed on the substrate where the colored layer is formed. Low barrier property against desorbed gas. For this reason, the desorbed gas from the colored layer or the like is selectively released from the barrier layer separation section. The barrier layer separation portion is formed in the transparent electrode layer non-formation region or the cathode separator formation region. Since the transparent electrode layer non-formation region or the cathode separator formation region is a non-display region, it is removed from the non-display region. The separated gas is selectively released. Thereby, it is possible to prevent the desorption gas from being released to the pixel region, and it is possible to suppress the occurrence of dark spots and the like. Therefore, when an organic EL element is formed using the color filter substrate for an organic EL element manufactured according to the present invention, it is possible to obtain a good image display.
Hereinafter, each process of the manufacturing method of the color filter substrate for organic EL elements of this invention is demonstrated.

1. Barrier layer separation portion forming step In the present invention, the barrier layer separation portion forming step is a cathode separator formation region in which a cathode separator on a transparent substrate on which a colored layer is formed or a transparent electrode layer non-formation region in which no transparent electrode layer is provided. The step of forming the barrier layer separating portion in a pattern.

  In this step, as long as the barrier layer separation portion can be formed in a pattern in the cathode separator formation region or the transparent electrode layer non-formation region, the formation position and pattern shape are not particularly limited. For example, the barrier layer separation portion can be formed in a dot or line pattern.

  When forming the barrier layer separating portion in a dot-like pattern, the formation position, shape, size, etc. of the barrier layer separating portion are described in the column “A. Color filter substrate for organic EL element” described above. Since it is the same as what was described, description here is abbreviate | omitted.

  On the other hand, when the barrier layer separation part is formed in a line pattern, the barrier layer separation part 5 is preferably formed in the cathode separator formation region 13 as shown in FIG. This is because the cathode separator formation region is relatively distant from the pixel region, so that the influence of the desorbed gas from the coloring layer or the like on the pixel region can be effectively reduced.

  In this case, the size of the barrier layer separation portion is preferably a size that can be formed in the cathode separator formation region. Specifically, for example, as shown in FIG. 5, the line width 19 of the barrier layer separating portion 5 is preferably narrower than the width 18 of the cathode separator forming region 13. This is because if the line width of the barrier layer separation portion is too large, the desorbed gas from the colored layer or the like may be released also into the pixel region.

  Further, the cross-sectional shape of the dot-shaped and line-shaped barrier layer separating portions is not particularly limited, and may be a tapered shape. In addition, when the cross-sectional shape of the barrier layer separation portion is a taper shape, it may be a forward taper shape or a reverse taper shape, and is appropriately selected depending on the material for forming the barrier layer separation portion.

  The method for forming the barrier layer separating portion is not particularly limited as long as the barrier layer separating portion can be formed in a pattern, and examples thereof include a photolithography method, an ink jet method, and a screen printing method. Among these, the photolithography method is preferably used. This is because the barrier layer separation portion can be easily patterned by using the photosensitive resin composition as a material for forming the barrier layer separation portion.

  In the case of using a photolithography method in this step, in the barrier layer separation portion forming step, usually, a coating step in which a photosensitive resin composition is applied to form a coating film, and an exposure step in which the coating film is exposed in a pattern shape And a developing step for removing an uncured portion of the coating film.

  The photosensitive resin composition used in the coating step is not particularly limited, and may be a positive type or a negative type. As a negative photosensitive resin contained in a negative photosensitive resin composition, what was described in the column of "A. Color filter substrate for organic EL elements 1. Barrier layer separation part" mentioned above can be used. On the other hand, as the positive photosensitive resin contained in the positive photosensitive resin composition, those generally used as positive photosensitive resins can be used.

In the present invention, a barrier layer separation portion removing step for removing the barrier layer separation portion may be performed as described later. When this barrier layer separation part removing step is performed, it is preferable to use a positive photosensitive resin composition in the coating step. This is because the positive photosensitive resin composition is easier to remove than the negative photosensitive resin composition.
On the other hand, when not performing a barrier layer isolation | separation part removal process, it is preferable to use a negative photosensitive resin composition at an application | coating process. This is because by using a negative photosensitive resin composition, the cross-sectional shape of the barrier layer separating portion can be easily formed into a reverse taper shape. The reverse taper shape is advantageous for releasing desorbed gas from the colored layer or the like.

  When the photosensitive resin composition is applied, the photosensitive resin is used by being dispersed in a solvent. Examples of the solvent that can be used include ketones such as acetone and methyl ethyl ketone; cellosolve acetates such as propylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, ethylene glycol monomethyl ether acetate, and ethylene glycol monoethyl ether acetate; propylene glycol Cellosolves such as monoethyl ether, propylene glycol monomethyl ether, ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; alcohols such as methanol, ethanol, 1-butanol, 2-butanol and cyclohexanol; ethyl acetate, butyl acetate and the like An ester solvent; cyclohexane, decalin; These solvents may be used alone or as a mixed solvent of two or more.

  The method for applying the photosensitive resin composition is not particularly limited as long as it is a method for applying the photosensitive resin composition to the entire surface. For example, the spin coating method, the casting method, the dip coating method, the bar coating method. , Blade coating method, roll coating method, gravure coating method, spray coating method and the like.

  As an exposure method or the like in the exposure step, a generally used exposure method can be used. In the example shown in FIGS. 4B and 4C, since the photosensitive resin composition 25 is a negative type, a photomask 31 that exposes only the portion where the barrier layer separating portion 5 is formed is used. In contrast, as shown in FIGS. 6A and 6B, when the positive photosensitive resin composition 25 is used, the portion where the barrier layer separation portion 5 is formed is shielded from light. Such a photomask 31 is used.

  Furthermore, when the cross-sectional shape of the barrier layer separating portion is a tapered shape, the exposure amount in the exposure process may be adjusted.

  In the development step, development is performed using a developer so that only the coating film made of the photosensitive resin composition corresponding to the barrier layer separation portion remains. As a developer that can be used for development, a commonly used organic alkaline developer can be used. In addition, a coating film made of an inorganic alkali or a photosensitive resin composition can be developed. An aqueous solution can be used. It is preferable to wash with water after development.

2. Barrier layer formation process The barrier layer formation process in this invention is a process of forming a barrier layer on the said colored layer and the said barrier layer isolation | separation part.

  The method for forming the barrier layer is not particularly limited as long as the barrier layer can be formed in a vacuum state. For example, chemical vapor deposition (CVD) method; sputtering method; ion plating method; electron beam (EB) Vacuum deposition methods such as vapor deposition, resistance heating, laser ablation, and the like. Among these, considering the productivity of the color filter substrate for organic EL elements, it is preferable to use the sputtering method. By using the sputtering method, it is possible to provide a color filter substrate for an organic EL element that is highly productive and excellent in quality stability.

  The temperature at which the barrier layer is formed is not particularly limited as long as it is equal to or lower than the post-baking temperature in the barrier layer separation portion forming step, and may be a temperature within a range where the barrier layer can be formed in a vacuum state. . Therefore, the transparent substrate on which the colored layer and the barrier layer separation part are formed may be heated, or may not be heated unless the temperature rises with the formation of the barrier layer.

When silicon nitride oxide is used as the material for forming the barrier layer, the inert gas / N ₂ (flow rate ratio) is preferably about 40: 1 to 5: 1. This is because a silicon nitride oxide film having a high density and a high barrier property can be obtained.

3. Barrier Layer Separation Part Removal Step In the present invention, for example, as shown in FIG. 7, after the barrier layer separation part formation step (FIGS. 7A and 7B) and the barrier layer formation step (FIG. 7C), A barrier layer separation portion removing step (FIG. 7D) for removing the layer separation portion 5 may be performed. By removing the barrier layer separation part, the desorbed gas from the colored layer or the like can be selectively released from the region where the barrier layer separation part was formed, compared with the case where the barrier layer separation part is formed. This is because the desorbed gas can be effectively released. Moreover, since the level difference (unevenness) due to the barrier layer separation portion is eliminated, it is possible to avoid disconnection of the transparent electrode layer due to this level difference.

In the present invention, when the barrier layer separation part is formed in a line pattern in the barrier layer separation part formation step, it is preferable to perform the barrier layer separation part removal step.
Here, for example, consider a case where a line-shaped barrier layer separation portion 5 is formed as shown in FIG. FIG.7 (c) is a schematic sectional drawing of the BB arrow cross section shown in FIG. In this case, a transparent electrode layer is formed on the barrier layer 6, but when the barrier layer separating portion 5 is formed in the cathode separator forming region 13, a striped transparent electrode layer ( The transparent electrode layer forming region 11 is divided). For this reason, there exists a malfunction that it becomes easy to produce a short circuit between electrodes. Therefore, in such a case, it is preferable to remove the barrier layer separation portion in order to prevent a short circuit between the electrodes.

  Moreover, when performing a barrier layer isolation | separation part removal process in this invention, it is preferable to form a barrier layer isolation | separation part using a positive photosensitive resin composition at a barrier layer isolation | separation part formation process. This is because the barrier layer separation part can be easily removed as described above.

  At this time, the barrier layer separation portion formed using the positive photosensitive resin composition can be removed by exposure and development. About the exposure method and image development, it is the same as that of what was described in the column of the said barrier layer isolation | separation part formation process.

4). Others In the present invention, a transparent electrode for forming a transparent electrode layer in the transparent electrode layer forming region on the barrier layer after the barrier layer forming step and when performing the barrier layer separating portion removing step, after the barrier layer separating portion removing step. A layer forming step may be performed.
The method for forming the transparent electrode layer is the same as that described in the column “A. Color filter substrate for organic EL element” described above, and thus the description thereof is omitted here.

D. Next, a method for manufacturing the organic EL element of the present invention will be described. The method for producing an organic EL element of the present invention is characterized by using the above-described method for producing a color filter substrate for an organic EL element.

  According to this invention, since the manufacturing method of the color filter substrate for organic EL elements mentioned above is used, generation | occurrence | production of a dark spot etc. can be suppressed and the organic EL element which can display a favorable image can be manufactured. .

In the present invention, usually, a color filter substrate forming step for organic EL elements using the above-described method for producing a color filter substrate for organic EL elements, and a cathode separator forming region on the transparent electrode layer of the color filter substrate for organic EL elements Forming a cathode separator on the transparent electrode layer, forming an organic EL layer having at least a light emitting layer between the cathode separators on the transparent electrode layer, and forming a counter electrode layer on the organic EL layer An organic EL element can be manufactured by performing a counter electrode layer formation process.
Moreover, you may perform the insulating layer formation process which forms an insulating layer in the transparent electrode layer non-formation area | region on a transparent electrode layer, and a cathode separator formation area before a cathode separator formation process.

  As a method for forming each constituent member of the organic EL element in the present invention, a general method for forming each constituent member of the organic EL element can be applied. In addition, about the formation method of a light emitting layer and a counter electrode layer, it is the same as that of what was described in the column of the "B. organic EL element" mentioned above.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has substantially the same configuration as the technical idea described in the claims of the present invention, and any device that exhibits the same function and effect is the present invention. It is included in the technical scope of the invention.

Hereinafter, the present invention will be specifically described with reference to examples.
[Example 1]
(Formation of black matrix)
As a transparent substrate, soda glass (Sn surface polished product manufactured by Central Glass Co., Ltd.) having a thickness of 370 mm × 470 mm and a thickness of 0.7 mm was prepared. After cleaning this transparent substrate according to a regular method, a thin film (thickness 0.2 μm) of oxynitride composite chromium is formed by sputtering on the entire surface of one side of the transparent substrate, and a photosensitive resist is applied on the thin film of composite oxynitride chrome nitride, Mask exposure, development, and etching of the composite chromium oxynitride thin film were performed to form a black matrix having rectangular openings of 84 μm × 284 μm in a matrix at a pitch of 100 μm.

(Formation of colored layer)
Three types of photosensitive paints for forming colored patterns of red, green and blue were prepared. Condensed azo dyes (chromophthal red BRN manufactured by Ciba Specialty Chemicals) as red colorants, phthalocyanine green pigments (Lionol Green 2Y-301 manufactured by Toyo Ink Co., Ltd.), and blue as green colorants As the colorant, anthraquinone pigment (Chromophthal Blue A3R manufactured by Ciba Specialty Chemicals) was used. Moreover, polyvinyl alcohol (10% aqueous solution) was used as the binder resin. 1 part by weight of each colorant is added to 10 parts by weight of the polyvinyl alcohol aqueous solution and mixed and dispersed sufficiently. To 100 parts by weight of the resulting solution, 1 part by weight of ammonium dichromate is added as a crosslinking agent. Three types of photosensitive paints for forming colored patterns were obtained.
Next, colored patterns of each color were formed using the above-described three types of photosensitive paints for forming colored patterns. That is, a green colored pattern forming photosensitive coating material was applied to the entire surface of the transparent substrate on which the black matrix was formed by a spin coating method, and prebaked (80 ° C., 30 minutes). Then, it exposed using the predetermined | prescribed photomask. Then, development is performed with a developer (0.05% KOH aqueous solution), post-baking (100 ° C., 30 minutes) is performed, and stripe-like (90 μm wide) green colored pattern is formed at a predetermined position with respect to the black matrix pattern. (Thickness 1.5 μm) was formed. Similarly, a red colored pattern (thickness: 1.5 μm) having a stripe shape (width: 90 μm) was formed at a predetermined position with respect to the black matrix pattern by using a photosensitive paint for forming a red colored pattern. Further, a blue colored pattern (thickness: 1.5 μm) having a stripe shape (width: 90 μm) was formed at a predetermined position with respect to the black matrix pattern by using a photosensitive paint for forming a blue colored pattern.

(Formation of color conversion layer)
Next, a blue conversion layer (dummy layer) forming coating solution (Fuji Hunt Electronics Technology Co., Ltd., Color Mosaic CB-7001) is applied onto the colored layer by spin coating, and prebaked (80 ° C., 30 minutes). Went. And it patterned by the photolithographic method and performed post-baking (100 degreeC, 30 minutes). Thereby, a striped (width 90 μm) blue conversion layer (dummy layer, thickness 10 μm) was formed on the blue colored pattern.
Next, an alkali-soluble negative resist in which a green fluorescent dye (Coumarin 6 manufactured by Aldrich Co., Ltd.) is dispersed is used as a green conversion layer forming coating solution, which is applied onto the colored layer by a spin coating method and prebaked (80 (C, 30 minutes). Next, patterning was performed by photolithography, and post-baking (100 ° C., 30 minutes) was performed. As a result, a green color conversion layer (thickness: 10 μm) having a stripe shape (width: 90 μm) was formed on the green coloring pattern.
Further, an alkali-soluble negative resist in which a red fluorescent dye (Rhodamine 6G manufactured by Aldrich Co., Ltd.) is dispersed is used as a red conversion layer forming coating solution, which is applied onto the colored layer by spin coating, and prebaked (80 (C, 30 minutes). Next, patterning was performed by photolithography, and post-baking (100 ° C., 30 minutes) was performed. Thus, a striped (width 90 μm) red conversion layer (thickness 10 μm) was formed on the red colored pattern.

(Formation of planarization layer)
Next, a flattening layer forming coating solution obtained by diluting acrylic resin (NN803 manufactured by JSR) with toluene is prepared, and this flattening layer forming coating solution is formed into a colored layer, a color conversion layer, and the like by spin coating. After coating on the transparent substrate, baking (230 ° C., 1 hour) was performed. Thereby, a flattening layer (thickness of about 1 to 3 μm, actually 1.5 μm) was formed so as to cover the color conversion layer. The obtained planarization layer was a transparent and uniform film.
Then, lapping polishing was performed on the planarizing layer while spraying pure water using a polishing tape of about # 800. Further, the planarizing layer was subjected to mirror polishing (polishing) using a rotary polishing machine (manufactured by Speed Fam) while spraying an alumina fine particle abrasive. In this way, the surface planarization treatment was performed on the planarization layer.

(Formation of barrier layer separation part)
Next, a positive photosensitive resist (S1805 manufactured by Shipley Co., Ltd.) is applied on the planarizing layer, mask exposure and development are performed, and baking is performed at 130 ° C. for 15 minutes to form a transparent electrode layer non-formation region and a cathode separator. A barrier layer separation portion was formed in a dot shape in the region. The width of the barrier layer separation part in the direction parallel to the transparent electrode layer non-formation region was 20 μm, 30 μm or 40 μm, and the width of the barrier layer separation part in the direction perpendicular to the transparent electrode layer non-formation region was 20 μm.

(Formation of barrier layer)
Next, a barrier layer having a thickness of 150 nm was formed by sputtering using silicon nitride oxide under the following conditions.
<Silicon oxynitride film formation conditions>
Si ₃ N ₄ target: 3N (density 1.8 g / cm ³ )
Inert gas / N ₂ (flow rate ratio): 360 sccm / 40 sccm
・ RF power: 3.5kW
-Substrate temperature: 200 ° C

(Formation of transparent electrode layer)
Next, an indium tin oxide (ITO) film having a thickness of 150 nm is formed on the barrier layer by ion plating, a photosensitive resist is applied on the ITO film, mask exposure, development, and etching of the ITO film are performed. The transparent electrode layer was formed in a pattern (width 100 μm, space 20 μm).

(Formation of auxiliary electrode)
Next, a chromium thin film (thickness 0.2 μm) is formed by sputtering on the entire surface of the barrier layer so as to cover the transparent electrode layer, a photosensitive resist is applied on the chromium thin film, mask exposure, development, The auxiliary electrode was formed by etching the chromium thin film. The auxiliary electrode was a striped pattern formed on the transparent electrode layer so as to run on the color conversion layer from the transparent substrate.

(Formation of insulating layer and partition wall)
A coating solution for forming an insulating layer is prepared by diluting norbornene-based resin (ARTON manufactured by JSR) having an average molecular weight of about 100,000 with toluene, and the transparent electrode layer is covered with the coating solution for forming the insulating layer by spin coating. Thus, after apply | coating on a barrier layer, it baked (100 degreeC, 30 minutes), and formed the insulating film (thickness 1 micrometer). Next, a photosensitive resist was applied on the insulating film, mask exposure, development, and etching of the insulating film were performed to form an insulating layer. This insulating layer was a stripe-like pattern (width 20 μm) intersecting the transparent electrode layer at a right angle, and was located on the black matrix.
Next, a partition wall-forming coating material (photoresist ZPN1100 manufactured by Nippon Zeon Co., Ltd.) was applied over the entire surface to cover the insulating layer by spin coating, and prebaked (70 ° C., 30 minutes). Then, it exposed using the predetermined | prescribed photomask, developed with the developing solution (ZTMA-100 by Nippon Zeon Co., Ltd.), and post-baked (100 degreeC, 30 minutes). Thereby, the partition part was formed on the insulating layer. The partition wall had a height of 10 μm, a lower portion (insulating layer side) width of 15 μm, and an upper portion width of 26 μm.

(Formation of organic EL layer)
Next, using the partition wall as a mask, a hole injection layer, a blue light emitting layer, and an electron injection layer were formed by vacuum deposition.
That is, first, 4,4 ′, 4 ″ -tris [N- (3-methylphenyl) -N-phenylamino] triphenylamine is 200 nm through a photomask having an opening corresponding to the image display region. By depositing 4,4′-bis [N- (1-naphthyl) -N-phenylamino] biphenyl to a thickness of 20 nm to form a film, the partition wall becomes a mask pattern. A hole injection layer was formed only between the partition walls on the transparent electrode layer. Similarly, 4,4′-bis (2,2-diphenylvinyl) biphenyl was deposited to a thickness of 50 nm to form a light emitting layer. Thereafter, tris (8-quinolinol) aluminum was deposited to a thickness of 20 nm to form an electron injection layer. The organic EL layer thus formed is present between the partition walls as a stripe pattern having a width of 280 μm, and a dummy organic EL layer having a similar layer structure is formed on the upper surface of the partition wall. .

(Formation of counter electrode layer)
Next, magnesium and silver are simultaneously deposited by vacuum deposition (magnesium deposition rate) on the region where the partition wall is formed through a photomask having a predetermined opening wider than the image display region. = 1.3 to 1.4 nm / second, silver deposition rate = 0.1 nm / second). Thereby, the counter electrode layer (thickness: 200 nm) made of magnesium / silver compound was formed on the organic EL layer using the partition wall as a mask. This counter electrode layer was present on the organic EL layer as a stripe pattern having a width of 280 μm, and a dummy transparent electrode layer was also formed on the upper surface of the partition wall.
The organic EL element was obtained by the above method.

[Example 2]
An organic EL device was produced in the same manner as in Example 1 except that the barrier layer separation part was formed as follows.

(Formation of barrier layer separation part)
A positive photosensitive resist (S1805 manufactured by Shipley Co., Ltd.) is applied on the flattening layer, and after mask exposure and development, baking is performed at 120 ° C. for 1 hour, and a barrier layer separation portion is formed in a line in the cathode separator formation region. Formed. The width in the direction perpendicular to the cathode separator formation region of the barrier layer separation part was 20 μm, 30 μm or 40 μm.

[Example 3]
An organic EL device was produced in the same manner as in Example 1 except that the barrier layer separation part was formed as follows.

(Formation of barrier layer separation part)
A negative photosensitive resist (NN803 manufactured by JSR) is applied on the flattening layer, and after mask exposure and development, baking is performed at 120 ° C. for 1 hour to form barrier layer separation portions in the form of dots in the cathode separator formation region. did. The width of the barrier layer separation part in the direction parallel to the transparent electrode layer non-formation region was 20 μm, 30 μm or 40 μm, and the width of the barrier layer separation part in the direction perpendicular to the transparent electrode layer non-formation region was 20 μm.

[Example 4]
An organic EL device was produced in the same manner as in Example 1 except that the barrier layer separation part and the barrier layer were formed as follows.

(Formation of barrier layer separation part)
A positive photosensitive resist (S1805 manufactured by Shipley Co., Ltd.) is applied on the flattening layer, and after mask exposure and development, baking is performed at 130 ° C. for 1 hour, and the barrier layer separation portion is formed in a line in the cathode separator formation region. Formed. The width in the direction perpendicular to the transparent electrode layer non-formation region of the barrier layer separation portion was 20 μm.

(Formation of barrier layer)
Next, a barrier layer having a thickness of 150 nm was formed by sputtering using silicon nitride oxide under the following conditions.
<Silicon oxynitride film formation conditions>
Si ₃ N ₄ target: 3N (density 1.8 g / cm ³ )
Inert gas / N ₂ (flow rate ratio): 360 sccm / 40 sccm
・ RF power: 3.5kW
-Substrate temperature: 110 ° C

(Removal of barrier layer separation part)
Thereafter, the barrier layer separation part was removed using an amine-based peeling liquid (AZ remover 200 manufactured by Clariant Japan).

[Comparative Example 1]
An organic EL device was produced in the same manner as in Example 1 except that the barrier layer separation part was not formed.

[Evaluation]
The organic EL elements of Examples 1 to 4 and Comparative Example 1 were sealed to obtain an organic EL display device. By applying a voltage of DC 8.5V to the transparent electrode layer and the counter electrode layer of this organic EL display device at a constant current density of 10 mA / cm ² and driving them continuously, the transparent electrode layer and the counter electrode layer cross each other. The light emitting layer of the desired part to be made to emit light. The light-emitting area of the organic EL display device was 6 mm □, a storage test was performed at a temperature of 85 ° C. and a relative humidity of 60%, and the light-emitting defect after the elapse of 500 hours was evaluated by observing with an optical microscope (50 times magnification).
As a result, dark spots were generated in the organic EL display device of Comparative Example 1. This is considered that the barrier property of the barrier layer in the image display region is not sufficient, and the desorbed gas flows out to the image display region, and a dark spot is generated. On the other hand, in the organic EL display devices of Examples 1 to 4, generation of dark spots was not recognized, and the display characteristics with excellent durability were shown.

DESCRIPTION OF SYMBOLS 1 ... Transparent substrate 2, 2R, 2G, 2B ... Colored layer 3 ... Black matrix 4 ... Planarization layer 5, 5 '... Barrier layer separation part 6 ... Barrier layer 7 ... Transparent electrode layer 10 ... Color filter substrate for organic EL elements DESCRIPTION OF SYMBOLS 11 ... Transparent electrode layer formation area 12 ... Transparent electrode layer non-formation area 13 ... Cathode separator formation area

Claims (19)

A transparent substrate;
A colored layer formed on the transparent substrate;
A barrier layer separating portion formed in a dot-like pattern on the colored layer;
A barrier layer formed on the colored layer and the barrier layer separating portion;
A color filter substrate for an organic electroluminescent device having a transparent electrode layer formed in a stripe shape on the barrier layer,
The barrier layer separation part is formed in a transparent electrode layer non-formation region where the transparent electrode layer is not provided, and is a color filter substrate for an organic electroluminescent element.   A black matrix having openings in a matrix is formed on the transparent substrate, and the barrier layer separation portion is formed in a region where the transparent electrode layer is not formed and the black matrix intersects. The color filter substrate for an organic electroluminescent device according to claim 1.   3. The organic electroluminescence according to claim 1, wherein the barrier layer separation portion has a width in a direction perpendicular to the transparent electrode layer non-formation region equal to or less than a width of the transparent electrode non-formation region. Color filter substrate for cent element.   The color filter substrate for an organic electroluminescent element according to any one of claims 1 to 3, wherein a cross-sectional shape of the barrier layer separating portion is an inversely tapered shape.   The thickness of the said barrier layer isolation | separation part exists in the range of 1 micrometer-5 micrometers, The color filter substrate for organic electroluminescent elements of any one of Claim 1 to 4 characterized by the above-mentioned.   The organic electro according to any one of claims 1 to 5, wherein a planarization layer is formed between the colored layer, the barrier layer separating portion, and the barrier layer. Color filter substrate for luminescent element.   The organic electro according to any one of claims 1 to 6, wherein a color conversion layer is formed between the colored layer, the barrier layer separating portion, and the barrier layer. Color filter substrate for luminescent element.   An organic electroluminescent device using the color filter substrate for an organic electroluminescent device according to any one of claims 1 to 7. On the transparent electrode layer of the color filter substrate for the organic electroluminescent element, a cathode separator is formed in a stripe shape intersecting the transparent electrode layer at a right angle,
The barrier layer separating portion has a width in a direction perpendicular to a transparent electrode layer non-formation region where the transparent electrode layer is not provided, which is equal to or less than a width of the transparent electrode non-formation region, and is parallel to the transparent electrode layer non-formation region 9. The organic electroluminescent device according to claim 8, wherein the width is narrower than the width of the cathode separator forming region where the cathode separator is provided. The black matrix having openings in a matrix and a transparent substrate on which a transparent electrode layer is not provided on a transparent substrate on which a colored layer is formed, or the black matrix that intersects the transparent electrode layer non-formation region at right angles On top, a barrier layer separation part forming step of forming a barrier layer separation part in a pattern,
A barrier layer forming step of forming a barrier layer on the colored layer and the barrier layer separating portion;
And a transparent electrode layer forming step of forming a transparent electrode layer in a stripe shape on the barrier layer. A method for producing a color filter substrate for an organic electroluminescent element.   The method for producing a color filter substrate for an organic electroluminescent element according to claim 10, wherein the barrier layer separating portion is formed in a dot pattern in the barrier layer separating portion forming step.   11. The barrier layer separating portion forming step according to claim 10, wherein in the barrier layer separating portion forming step, the barrier layer separating portion is formed in a line pattern on the black matrix that intersects the transparent electrode layer non-forming region at a right angle. A method for producing a color filter substrate for an organic electroluminescent device.   The color filter substrate for an organic electroluminescent element according to any one of claims 10 to 12, wherein the barrier layer separation part removing step for removing the barrier layer separation part is not provided. Manufacturing method.   The barrier layer separation part removing step of removing the barrier layer separation part is performed after the barrier layer formation step and before the transparent electrode layer formation step. The manufacturing method of the color filter substrate for organic electroluminescent elements of Claim.   The method for manufacturing a color filter substrate for an organic electroluminescent element according to claim 14, wherein a photolithography method is used in the barrier layer separation portion forming step.   The method for producing a color filter substrate for an organic electroluminescent element according to claim 15, wherein the barrier layer separation part is formed using a positive photosensitive resin composition in the barrier layer separation part forming step. . Barrier layer separation part that forms a barrier layer separation part in a pattern on a cathode separator formation area where a cathode separator is provided or a transparent electrode layer non-formation area where a transparent electrode layer is not provided on a transparent substrate on which a colored layer is formed Organic electrolysis comprising: a forming step; a barrier layer forming step of forming a barrier layer on the colored layer and the barrier layer separating portion; and a transparent electrode layer forming step of forming a transparent electrode layer in a stripe shape on the barrier layer. A color filter substrate forming step for the luminescent element;
A cathode separator forming step of forming a cathode separator on the transparent electrode layer of the color filter substrate for the organic electroluminescent element in a stripe shape intersecting with the transparent electrode layer at a right angle;
An organic electroluminescent layer forming step of forming an organic electroluminescent layer having at least a light emitting layer between the cathode separators on the transparent electrode layer;
And a counter electrode layer forming step of forming a counter electrode layer on the organic electroluminescent layer. A method for manufacturing an organic electroluminescent element, comprising:   In the barrier layer separation portion forming step, the barrier layer separation portion is formed in a dot pattern, and the barrier layer separation portion has a width in a direction perpendicular to the transparent electrode layer non-formation region of the transparent electrode non-formation region. 18. The organic electroluminescent device according to claim 17, wherein the organic electroluminescent device is formed to have a width equal to or smaller than a width and a width in a direction parallel to the transparent electrode layer non-formation region is narrower than a width of the cathode separator formation region. Manufacturing method.   In the barrier layer separation portion forming step, the barrier layer separation portion is formed in a line pattern in the cathode separator formation region, and the barrier layer separation portion has a line width narrower than that of the cathode separator formation region. The method of manufacturing an organic electroluminescent element according to claim 17, wherein the organic electroluminescent element is formed.

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