JP2010173847A - Wafer ring conveying device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wafer ring conveying device capable of conveying wafer rings in the state of positioning the wafer rings without stopping from a ring supply part to a conveyance destination position. <P>SOLUTION: In this wafer ring conveying device, a pair of guide rails 11 and 12 for guiding a wafer ring 1 holding an adhesive sheet 2, to which a wafer 3 is attached, are arranged between a ring supply part and a conveyance destination position to convey the wafer ring 1 from the ring supply part to the conveyance destination position. The guide rails 11 and 12 include notch part guide elements 15 and 16 respectively rolling relative to notch parts 5 and 7 arranged at an opposite position at 180° relative to the shaft center of an outer radial surface of the wafer ring 1 to permit continuous conveyance of the wafer rings 1 from the ring supply part to the conveyance destination position. Notch part guide elements 15 and 16 of the guide rails 11 and 12 opposite to each other move in parallel with a direction relatively approaching and separating from each other. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a wafer ring transfer device.

  Usually, in a semiconductor manufacturing process, a wafer is attached to an adhesive sheet called a wafer sheet of a wafer ring, cut into individual pellets, and then the wafer ring is supplied to a bonding stretcher, Thus, the wafer sheet is stretched.

  For this reason, a wafer ring transfer device for supplying the wafer ring to the stretching device has been proposed (Patent Document 1). This wafer ring transfer device is provided with a pair of straightening rails on a wafer ring transfer path. In this case, the straightening rail is controlled to be kept open until the wafer ring is loaded between the straightening rails and closed after being loaded.

  That is, the wafer ring is held (clamp holding, hook holding etc.) by the holding portion of the transfer arm, and the wafer ring is carried between the correction rails. If the wafer ring is carried between the correction rails, the wafer ring is positioned by being sandwiched between the correction rails. Thereafter, the holding of the pair of correction rails is released, and the wafer ring is held again by the holding portion of the transfer arm. In this state, the wafer ring is extended by the transfer arm and transferred to the apparatus.

Japanese Patent Laid-Open No. 5-67670

  In the thing of patent document 1, after correcting the shift | offset | difference of a rotation direction, clamping of the correction rail is once cancelled | released. For this reason, the reliability of correction decreases. Moreover, since the conveyance is temporarily stopped in the state of being fitted on the correction rail, the entire conveyance time becomes long and the productivity is lowered.

  SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a wafer ring transfer apparatus that can transfer a wafer ring while being positioned without stopping from a ring supply unit to a transfer target position.

  In the wafer ring transfer device of the present invention, a pair of guide rails for guiding the wafer ring holding the adhesive sheet to which the wafer is attached are disposed between the ring supply unit and the transfer target position. A wafer ring transfer device for transferring from a ring supply unit to a transfer target position, wherein the guide rail is relative to a notch portion disposed at a position 180 ° opposite to the axis of the outer diameter surface of the wafer ring. Each has a notch guide body that directly or indirectly contacts and allows continuous transfer of the wafer ring from the ring supply unit to the transfer target position, and the notch guide bodies of the opposing guide rails are relatively It moves in parallel in the approaching / separating direction.

  According to the wafer ring conveyance device of the present invention, when the guide is inserted between the guide rails, the notch guide body directly or indirectly contacts the notch on the outer diameter surface of the wafer ring to ring the wafer ring. Since continuous transfer from the supply unit to the transfer target position is allowed, transfer can be performed without stopping the wafer ring. In addition, since the notch guides of the guide rails facing each other move in parallel in the direction of approaching / separating relatively, the pair of wafer rings are moved by the relative approaching / separating operation of the guide rail notch guides. It is possible to insert the wafer ring stably between the guide rails, and to securely hold the inserted wafer ring.

  Before the wafer ring is transported between the guide rails, the distance between the guide rail notch guides is larger than the distance between the wafer ring notches, and the wafer ring is transported between the guide rails. It is preferable to provide a control means for controlling so that the notch guides approach each other and the wafer ring is clamped by the notch guides.

  By providing such control means, the distance between the notch guides is larger than the distance between the notches of the wafer ring before the wafer ring is transferred between the guide rails. It is possible to stably fit between the guide rails. In addition, after the insertion, the notch guides approach each other and the wafer ring is clamped by the notch guides, so that stable positioning can be performed.

  The notch guide body can be composed of a plurality of rotating rollers arranged at a predetermined pitch along the wafer ring conveyance direction. As described above, by using the rotating roller, even if a pressing force is applied to the notch portion of the wafer ring, the rotating roller can roll to guide conveyance (running) of the wafer ring. Moreover, it can comprise an existing bearing as a roller.

  It is preferable to include a transport unit that hooks the wafer ring with a hook mechanism and pulls the wafer ring from the ring supply unit to the transport target position. By hooking with the hook mechanism in this manner, the wafer ring can be transferred from the ring supply unit to the transfer target position.

  The hook mechanism is preferably provided with a hook portion that is engaged with the inner diameter surface of the wafer ring.

  The ring supply unit is, for example, a ring storage cassette that stores a plurality of wafer rings. The conveyance target position is, for example, a stretching device of a bonding device.

  In the present invention, since the wafer ring can be transferred without being stopped, productivity (workability) can be improved. Further, the wafer ring can be stably inserted between the pair of guide rails, and the inserted wafer ring can be securely held, so that the wafer ring can be positioned stably and accurately. it can.

  By providing the control means, stable positioning can be performed, so that unnecessary load is not applied to the wafer ring, and smoother transfer is possible.

  By using a rotating roller for the notch guide, it is possible to transport (run) the wafer ring with a pressing force applied to the notch of the wafer ring, and more stable and accurate positioning and transport. It can be performed. Further, an existing (commercially available) bearing can be used as the rotating roller, and the cost can be reduced.

  By hooking with the hook mechanism, the wafer ring can be transferred from the ring supply unit to the transfer target position, and the transfer guide of the wafer ring by the guide rail is not hindered.

  By locking the hook portion to the inner diameter surface of the wafer ring, the wafer ring can be stably transferred from the ring supply portion to the transfer target position.

  If the ring supply unit is a ring storage cassette and the transfer target position is a bonding apparatus, continuous transfer from the ring storage cassette to the bonding apparatus can be performed without stopping.

It is a simplified top view of a wafer ring conveyance device showing an embodiment of the present invention. It is a simplified sectional view of a guide rail of the wafer ring conveyance device. The wafer ring is shown, (a) is a perspective view of the state holding the adhesive sheet, (b) is a perspective view of the state separated from the adhesive sheet, and (c) is the state shown in (a). It is sectional drawing. The wafer ring state by the said wafer ring conveyance apparatus is shown, (a) is a simplified view of a wafer ring in a state of starting insertion between guide rails, and (b) is a simplified view of a state in which the wafer ring is guided by the guide rails. (C) is a simplified view immediately before the wafer ring is discharged from between the guide rails.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  1 and 2 show a wafer ring transfer apparatus according to the present invention. This wafer ring transfer device is a wafer as shown in FIG. 3 from a ring supply cassette (for example, a cassette for storing a plurality of wafer rings) to a transfer target position, for example, a stretching device for a bonding apparatus. The ring 1 is conveyed.

  In the semiconductor manufacturing process, the wafer 3 is bonded to an adhesive sheet 2 called a wafer sheet of the wafer ring 1 and cut into individual pellets. Thereafter, the wafer ring 1 is supplied to a stretching device of a bonding apparatus. The wafer sheet 2 is stretched by the stretching device.

  For this reason, it is necessary to convey the wafer ring 1 with an adhesive sheet stored in the cassette for ring storage to the stretching device, and the wafer ring transport device according to the present invention is used for this transport as described above.

  Incidentally, as shown in FIG. 3, the wafer ring 1 is formed of a flat ring body, the adhesive sheet 2 is adhered to the back surface thereof, and the wafer 3 is adhered to the upper surface of the adhesive sheet 2. Further, the outer diameter surface of the wafer ring 1 is provided with notches 5, 6, 7, and 8 at a 90 ° pitch along the circumferential direction. That is, the first notch portion 5 and the third notch portion 7 are disposed at positions opposite to each other by 180 ° with respect to the axis of the wafer ring 1, and the notch surface 5a and the notch surface 7a are linear and parallel to each other. Be placed. Further, the second cutout portion 6 and the fourth cutout portion 8 are disposed at positions opposite to each other by 180 ° with respect to the axis of the wafer ring 1, and the cutout surface 6a and the cutout surface 8a are linear and parallel to each other. Be placed.

  As shown in FIGS. 1 and 2, the wafer ring transfer apparatus includes a pair of guide rails 11 and 12. Each guide rail 11, 12 includes a flat plate-like rectangular board 13, 14 and a notch guide body 15, 16 attached to each of the boards 13, 14. And it arrange | positions in parallel so that the board | substrates 13 and 14 may face each other.

  The notch guides 15 and 16 are each composed of a plurality of (in this case, five) rotating rollers 17 arranged at a predetermined pitch along the longitudinal direction of the substrates 13 and 14 (the conveyance direction of the wafer ring 1). . As the rotating roller 17, a bearing (bearing) having an outer ring that is rotatable around a vertical axis can be used. In this case, the first notch guide 15 is arranged on the side opposite to the second notch guide on the substrate 13, and the second notch guide 16 is arranged on the side opposite to the first notch guide on the substrate 14. The For this reason, opposite running surfaces (conveying surfaces) 13a and 14a are formed on the substrates 13 and 14, respectively.

  The guide rails 11 and 12 are continuously provided with drive mechanisms 21 and 22 that approach and separate the guide rails 11 and 12 from each other. For example, cylinder mechanisms 23 and 24 can be used as the drive mechanisms 21 and 22. That is, the cylinder mechanism 23 includes a cylinder main body 23a and a piston rod 23b. When the piston rod 23b expands and contracts, the guide rail 11 approaches and separates from the guide rail 12 as indicated by arrows A and B. The cylinder mechanism 24 includes a cylinder main body 24a and a piston rod 24b. When the piston rod 24b expands and contracts, the guide rail 12 approaches and separates from the guide rail 11 as indicated by arrows C and D.

  The guide rail 11 is provided with a guide mechanism (not shown) for translating the guide rail 11 when moving in the directions of arrows A and B. The guide rail 12 is provided with a guide mechanism (not shown) for translating the guide rail 11 in parallel when moving in the directions of arrows C and D. Each guide mechanism can be constituted by, for example, a rail extending in a direction orthogonal to the conveyance direction of the wafer ring 1 and a concave groove into which the rail is fitted. That is, a concave groove that opens downward is provided on the lower surface of the guide rails 11 and 12, and a rail that fits into the concave groove may be disposed below the guide rails 11 and 12.

  A stopper 25 that restricts the movement of the guide rail 11 in the arrow A direction is provided on the guide rail 11 side. An elastic member (not shown) is interposed between the guide rail 12 and the drive mechanism 22. That is, the elastic member (not shown) is interposed between the piston rod 24 b of the cylinder mechanism 24 constituting the drive mechanism 22 and the substrate 14.

  Further, the wafer ring 1 travels on a transfer path (transfer line) 26 from the ring supply unit to the transfer destination position by being hooked by a hook mechanism 30 (see FIGS. 3C and 4) of the transfer unit 31. The transport unit 31 includes the hook mechanism 30 having a hook portion 32 and a drive mechanism (not shown) that reciprocates the hook mechanism 30 in the directions of arrows E and F along the transport path 26.

  As shown in FIG. 3C, the hook portion 32 is engaged with a part of the inner diameter surface 1 a of the wafer ring 1. In this case, as indicated by arrows G and H, the hook portion 32 can be moved up and down and is detachably locked to the inner diameter surface 1 a of the wafer ring 1. The drive mechanism can be constituted by a reciprocating mechanism such as a cylinder mechanism, a ball screw mechanism, a linear motor, or a linear actuator. In the state where the hook portion 32 is locked to the inner diameter surface 1 a of the wafer ring 1, the hook portion 32 is prevented from contacting the adhesive sheet 2.

  Therefore, as shown in FIG. 4, the hook portion 32 of the hooking mechanism 30 is disposed on the center line L of the conveyance path 26 and is partially locked to the inner diameter surface 1a of the wafer ring 1 by the hook portion 32. By pulling the hook portion 32 from the upstream side to the downstream side, the wafer ring 1 can be transferred from the ring supply portion to the transfer target position. In this case, the wafer ring 1 slides on the running surfaces 13 a and 14 a of the substrates 13 and 14 of the guide rails 11 and 12.

  Further, as shown in FIG. 1, the transport path 26 is provided with a sensor 35 such as an optical sensor that detects the position of the hook portion 32. That is, by detecting the position of the sensor 35, it is possible to detect that the wafer ring 1 has entered (inserted) into the transfer path 26.

  When the sensor 35 detects that the wafer ring 1 has entered (inserted) into the transport path 26, the detection signal is input to the control means 36, and the drive mechanisms 21 and 22 are based on this signal. Be controlled. The control means 36 can be constituted by a microcomputer or the like.

  Next, a method for transporting the wafer ring 1 using the wafer ring transport apparatus shown in FIG. 1 will be described. First, the wafer ring 1 stored in the ring storage cassette is pushed out toward the transport path 26 by an extrusion device (pusher). At this time, the hook portion 32 of the hooking mechanism 30 is locked to a part of the inner diameter surface 1a of the wafer ring 1, and from the upstream side (ring storage cassette side) to the downstream side (stretching device side), that is, in the direction of arrow E. Be pulled. As a result, as shown in FIG. 4A, the guide rails 11 and 12 are inserted (inserted). The first notch 5 of the wafer ring 1 corresponds to the notch guide 15 of the guide rail 11, and the third notch 7 of the wafer ring 1 corresponds to the notch guide 16 of the guide rail 12.

  When the wafer ring 1 enters (inserts) between the guide rails 11 and 12 as described above, the dimension W between the guide rails 11 and 12, that is, between the notch guide bodies 15 and 16, is the notch portion 5 of the wafer ring 1. , 7 is set larger than the dimension H. Therefore, the wafer ring 1 can stably enter between the guide rails 11 and 12.

  As shown in FIG. 4A, when the wafer ring 1 enters (inserts) between the guide rails 11 and 12, the position of the hook portion 32 is detected by the sensor 35, whereby the drive mechanisms 21 and 22 are The piston rods 23b and 24b of the cylinder mechanisms 23 and 24 are extended by being controlled. At this time, the piston rod 23 b of the cylinder mechanism 23 extends until the substrate 13 of the guide rail 11 contacts the stopper 25. The piston rod 24b of the cylinder mechanism 24 has the notch guides 15 and 16 in contact (pressure contact) with the notch surfaces 5a and 7a of the notches 5 and 7, respectively. It extends until 1 is clamped.

  Thus, the wafer ring 1 is positioned (positioning in the direction orthogonal to the center line L of the transport path 26 and positioning in the tilt direction with respect to the center line L of the transport path 26). Further, when the wafer ring 1 is held between the notch guides 15 and 16, the rotating rollers 17 of the notch guide 16 are elastically provided on the wafer ring 1 by the elastic member provided on the drive mechanism 22 side. The notched surface 7a of the notched portion 7 is pressed.

  Even in this state, the wafer ring 1 is continuously pulled in the transfer path 26 by the transfer mechanism, and the rotation rollers 17 of the notch guide members 15 and 16 are notched on the notch surfaces 5a of the notch portions 5 and 7 of the wafer ring 1. , 7a to allow the wafer ring 1 to travel in the direction of arrow E. Therefore, as shown in FIG. 4B, the wafer ring 1 is continuously conveyed to the downstream side (the stretching device side). At this time, the lower surface of the wafer ring 1 slides on the running surfaces 13 a and 14 a of the substrates 13 and 14 of the guide rails 11 and 12. Then, as shown in FIG. 4C, the wafer ring 1 is unloaded from between the guide rails 11 and 12, and is conveyed to the extending device.

  If the wafer ring 1 is carried out between the guide rails 11 and 12, the distance between the guide rails 11 and 12 is increased, and the hook portion 32 is located upstream of the transport path 26 as indicated by an arrow F. 1 to return to the initial state shown in FIG. As a result, the next wafer ring 1 can be transferred.

  In the wafer ring conveyance device of the present invention, the notch guides 15 and 16 roll relative to the notches 5 and 7 on the outer diameter surface of the wafer ring 1 when fitted between the guide rails 11 and 12. Since continuous transfer from the ring supply unit of the wafer ring 1 to the transfer target position is allowed, the wafer ring 1 can be transferred without being stopped. For this reason, productivity (workability) can be improved.

  Before the wafer ring 1 is transported between the guide rails 11 and 12, the interval dimension W between the notch guides 15 and 16 is larger than the dimension H between the notch portions of the wafer ring. 1 can be stably fitted between the guide rails 11 and 12. In addition, after the insertion, the notch guides 15 and 16 approach each other and the wafer ring 1 is sandwiched between the notch guides 15 and 16, so that stable positioning can be performed. For this reason, an unnecessary load is not applied to the wafer ring 1, and smoother transfer is possible.

  The notch guides 15 and 16 can be constituted by a plurality of rotating rollers 17 arranged at a predetermined pitch along the conveyance direction of the wafer ring 1. In this way, by using the rotating roller 17, even if a pressing force is applied to the notches 5 and 7 of the wafer ring 1, the rotating roller 17 rolls to guide conveyance (running) of the wafer ring 1. Therefore, positioning and conveyance can be performed more stably and accurately. In addition, an existing (commercially available) bearing can be used as the rotating roller 17, and the cost can be reduced.

  By hooking the wafer ring 1 with the hook mechanism 30, the wafer ring 1 can be transported from the ring supply unit to the transport target position, and the transport guide of the wafer ring by the guide rails 11 and 12 is not hindered.

  As described above, the embodiment of the present invention has been described. However, the present invention is not limited to the above-described embodiment, and various modifications can be made. The installation pitch, size, number, and the like can be variously changed according to the size of the wafer ring 1 to be transferred, the length of the transfer path 26, and the like. Further, the number of the rotating rollers 17 may be different between the first notch guide body 15 side and the second notch guide body 16 side. That is, at least one of the pair of notched portions 5 and 7 held during conveyance is such that one of the two rotating rollers 17 rolls and the other rolls one rotating roller 17. I can do it.

  In the embodiment, the notch guides 15 and 16 are constituted by a plurality of rotating rollers 17 arranged on a straight line, and each rotating roller 17 directly has the notches 5 and 7 of the wafer ring 1. The cutout surfaces 5a and 7a are in contact with each other, but a belt member may be wound around the plurality of rotating rollers 17 of the cutout guides 15 and 16. In such a case, the belt member comes into contact with the notched surfaces 5a and 7a of the notched portions 5 and 7 of the wafer ring 1, the belt travels endlessly, and the wafer ring 1 travels between the guide rails 11 and 12. Will do. In addition, the notch surface of the notch portion of the wafer ring 1 can be pressed by the rotating roller 17 inside the belt member, and the wafer ring 1 can be stably conveyed while being positioned.

  Further, not the rotating roller 17 but a contact body that is in contact with a point or a straight line without contacting the cut-out surfaces 5a and 7a of the cut-out parts 5 and 7 in a straight line, is arranged on a straight line, so that the cut-out part guide 15 16 may be configured. In this case, the contact body is preferably made of a material excellent in slidability.

  The drive mechanisms 21 and 22 are cylinder mechanisms in the above-described embodiment, but other reciprocating mechanisms such as a ball screw mechanism, a linear motor, and a linear actuator may be used. Further, when the guide rails 11 and 12 are moved toward and away from each other, both the guide rails 11 and 12 are moved at the same time, but only one of them may be moved. In this case, the first guide rail 11 side may be moved to fix the second guide rail 12 side, or the second guide rail 12 side may be moved to fix the first guide rail 11 side. Good. Furthermore, instead of the entire guide rails 11 and 12 moving, the notch guide bodies 15 and 16 may be moved closer to and away from each other.

  Whether or not the wafer ring 1 has entered between the guide rails 11 and 12 is determined by detecting the position of the hook portion 32 with the sensor 35. The determination may be made based on the movement amount.

  Moreover, in the said embodiment, although it conveyed in the state in which the adhesive sheet 2 side becomes the downward direction, you may make it convey in the state in which the adhesive sheet 2 side becomes upper direction conversely. In this case, the hook portion 32 of the hooking mechanism 30 is locked to the inner diameter surface 1a of the wafer ring 1 from below. Furthermore, in the said embodiment, although the notch parts 5 and 7 were made to respond | correspond to the notch part guide bodies 15 and 16, you may make it make the notch parts 6 and 8 respond | correspond to the notch part guide bodies 15 and 16. FIG.

  Furthermore, you may make it provide the introduction path (introduction port) to which a width dimension becomes narrow toward the downstream end from the upstream to the upstream end of the guide rails 11 and 12. FIG.

DESCRIPTION OF SYMBOLS 1 Wafer ring 1a Inner diameter surface 2 Adhesive sheet 3 Wafer 5, 6, 7, 8 Notch part 11, 12 Guide rail 15, 16 Notch part guide body 17 Rotating roller 24b Piston rod 30 Hook mechanism 31 Conveying means 32 Hook part 36 Control means

Claims (8)

A pair of guide rails for guiding the wafer ring holding the adhesive sheet to which the wafer is attached are disposed between the ring supply unit and the transfer target position, and the wafer ring is moved from the ring supply unit to the transfer target position. A wafer ring transfer device for transferring up to
The guide rail is in direct or indirect contact with a notch portion disposed at a position 180 ° opposite to the axial center of the outer diameter surface of the wafer ring, so that the wafer ring is moved from the ring supply portion to the transfer destination position. And a notch guide body that allows continuous transfer of the guide rails, and the notch guide bodies of the guide rails facing each other are moved in parallel to each other in a relatively approaching / separating direction.   Before the wafer ring is transported between the guide rails, the distance between the guide rail notch guides is larger than the distance between the wafer ring notches, and the wafer ring is transported between the guide rails. 2. A wafer ring transfer apparatus according to claim 1, further comprising a control means for controlling the notch portion guide members so as to approach each other and clamp the wafer ring by the notch portion guide members.   3. The wafer ring conveyance device according to claim 1, wherein the notch guide body includes a plurality of rotating rollers disposed at a predetermined pitch along a wafer ring conveyance direction.   4. The wafer ring transfer device according to claim 3, wherein the roller is a bearing.   5. The wafer ring transfer apparatus according to claim 1, further comprising a transfer unit that hooks the wafer ring with a hook mechanism and pulls the wafer ring from the ring supply unit to a transfer target position.   6. The wafer ring transfer device according to claim 5, wherein the hooking mechanism includes a hook portion that engages with an inner diameter surface of the wafer ring.   The wafer ring transfer apparatus according to claim 1, wherein the ring supply unit is a ring storage cassette in which a plurality of wafer rings are stored.   7. The wafer ring transfer device according to claim 1, wherein the transfer target position is a stretching device of a bonding apparatus.

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