CN116798923B - Centering and orienting device for wafer carrier ring - Google Patents
Centering and orienting device for wafer carrier ring Download PDFInfo
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- CN116798923B CN116798923B CN202310682590.XA CN202310682590A CN116798923B CN 116798923 B CN116798923 B CN 116798923B CN 202310682590 A CN202310682590 A CN 202310682590A CN 116798923 B CN116798923 B CN 116798923B
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- 230000001960 triggered effect Effects 0.000 claims description 22
- 230000003287 optical effect Effects 0.000 claims description 11
- 238000009966 trimming Methods 0.000 claims description 6
- 238000005096 rolling process Methods 0.000 claims description 3
- 230000006835 compression Effects 0.000 claims description 2
- 238000007906 compression Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 description 40
- 229920005989 resin Polymers 0.000 description 40
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 21
- 229910052710 silicon Inorganic materials 0.000 description 21
- 239000010703 silicon Substances 0.000 description 21
- 238000000034 method Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 10
- 238000004806 packaging method and process Methods 0.000 description 8
- 230000007246 mechanism Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 230000001276 controlling effect Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
Abstract
The invention provides a wafer carrier ring centering and orienting device, which comprises: the base plate is provided with a first motion unit and two second motion units which are symmetrically arranged; the first motion unit is provided with two end parts which are respectively movably connected with the two second motion units; the driving control unit is used for driving and controlling the first units to move so that the first units drive the two second units to be close to or far away from each other, and opposite end parts of the two second moving units are used for clamping the wafer carrier ring; the motion paths of the first unit and the second unit are perpendicular to each other; the drive control unit is connected with the first motion unit through an elastic component. The centering and orienting device can realize centering and orienting of the wafer carrier ring, and has the advantages of simple structure, low cost and high reliability.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing equipment, in particular to a wafer carrier ring centering and orienting device.
Background
Generally, semiconductor chips are processed on a silicon wafer, and processes such as photoetching, etching, ion implantation, deposition and the like are generally required to be carried out on the silicon wafer, and the processes are carried out on microcosmic surfaces, namely, the silicon wafer is required to have enough strength and rigidity, so that the silicon wafer is required to have enough thickness when being processed in the previous process, but if the silicon wafer is very thick, after being packaged into chips, the heat dissipation performance of the chips is poor due to the fact that the chips are too thick, therefore, after the previous process is finished, the silicon wafer is thinned and then is packaged in the back way, the thinned silicon wafer is very soft, a manipulator is not used for directly conveying the silicon wafer, in order to solve the conveying problem, a wafer carrier ring is used for fixing the thin wafer, generally, the wafer carrier ring is larger than the wafer carrier ring, two blue films are pasted on the upper surface of the wafer carrier ring to clamp the wafer, and the wafer is distributed in the center of the wafer carrier ring, so that the wafer carrier ring can realize wafer conveying, and further wafer slicing, packaging and the like are realized.
In the conventional packaging process, the wafer carrier ring is not required to be centered and oriented by a wafer carrier ring conveying device, and the wafer carrier ring is only required to be conveyed to a slicing machine, and the slicing machine is required to be used for centering and orienting.
However, as moore's law of semiconductor processing approaches physical limits, it has been difficult to increase the number of diodes by decreasing the line width of microscopic circuits, and in order to increase the number of diodes to improve the performance of chips, semiconductor processing has proposed a new process: advanced packaging, which is divided into: flip chip bonding, fan-in and fan-out, 2.5D packaging, 3D packaging and the like are processes for remarkably increasing the number of diodes by packaging a plurality of bare chips together, interconnecting the bare chips through a through silicon via process and interconnecting the bare chips with a circuit board through bumps, and realizing no increase of circuit line width.
When the advanced packaging is used for 2.5D and 3D packaging, the wafer needs to be thinned to the thickness capable of being packaged, the wafer carrier ring is needed to be used for fixing the silicon wafer, the advanced packaging of the silicon wafer needs to be subjected to bump technology on the surface of the silicon wafer, photoetching, etching, deposition and other technologies are needed to be carried out on the silicon wafer, and generally, when the technologies are carried out, a conveying module is required to realize the conveying function of the silicon wafer, and also the centering and orientation functions of the silicon wafer are required to be realized, and generally, the conveying module for conveying the silicon wafer is provided with a silicon wafer alignment unit to realize the centering and orientation functions of the silicon wafer.
In the advanced packaging process, the wafer conveying module faces the problem of conveying the silicon wafer and the wafer carrier ring, and compatible mechanical fingers are designed to convey the silicon wafer and the wafer carrier, so that the conveying function of the silicon wafer and the wafer carrier is realized, but no special centering and orientation module for the wafer carrier ring is available in the market at present.
Therefore, how to solve the centering orientation of the wafer carrier ring is a concern for those skilled in the art.
Disclosure of Invention
The invention aims to provide a centering and orienting device for a wafer carrier ring, which can solve the centering and orienting problem of the wafer carrier ring.
In order to achieve the above object, the present invention provides a wafer carrier ring centering and orienting device, comprising:
the base plate is provided with a first motion unit and two second motion units which are symmetrically arranged;
The first motion unit is provided with two end parts which are respectively movably connected with the two second motion units;
The driving control unit is used for driving and controlling the first units to move so that the first units drive the two second units to be close to or far away from each other, and opposite end parts of the two second moving units are used for clamping the wafer carrier ring; the motion paths of the first unit and the second unit are perpendicular to each other;
the drive control unit is connected with the first motion unit through an elastic component.
In an alternative, the first motion unit includes: a first guide rail mounted on the base plate;
a first slider slidably mounted on the first rail;
And the transverse guide block is fixed above the first sliding block and is provided with the two end parts.
In an alternative, the second unit includes: the second guide rail is arranged on the bottom plate, and the first guide rail and the second guide rail are mutually perpendicular;
a second slider slidably mounted on the second rail;
The clamping piece is connected to the second sliding block and the end part of the transverse guide block; the transverse guide block drives the second sliding block to move along the second guide rail, so that the clamping piece moves along the second guide rail.
In an alternative, the clamping member includes: a slider having a first end facing the center of the wafer carrier ring and a second end facing away from the center of the wafer carrier ring;
The first end is connected with the second sliding block and the end part of the transverse guide block, and the second end is provided with a clamping block;
The clamping block comprises a guide block and rollers positioned at two sides of the guide block, the guide block corresponds to the trimming edge of the wafer carrier ring, and the rollers can be in rolling tangency with the circular arc edges at two sides of the trimming edge.
In an alternative, the end of the lateral guide block has a bearing, the sliding block has a 45 ° guide groove, and the bearing rolls in the 45 ° guide groove, so that the movement speeds of the lateral guide block and the clamping member are the same.
In an alternative scheme, a clamping sensor is installed on the bottom plate, a trigger sheet is installed on the transverse guide block, the trigger sheet is provided with a notch, when the wafer carrier ring is clamped in place, the optical axis of the clamping sensor passes through the notch, and the clamping sensor is triggered.
In an alternative scheme, the driving control unit comprises a cylinder, and a first sensor and a second sensor are arranged on the cylinder; the first sensor is triggered when the telescopic rod of the air cylinder is in a retracted position, the clamping sensor is triggered when the telescopic rod is in a clamping position, and the second sensor is triggered when the telescopic rod extends beyond the clamping position.
In an alternative, the driving control unit further includes: the device comprises an electric board card, a first electromagnetic valve and a second electromagnetic valve; the air pipe of the first electromagnetic valve is connected with the air inlet throttle valve of the air cylinder, the air pipe of the second electromagnetic valve is connected with the air outlet throttle valve of the air cylinder, and the electric board card is used for controlling the opening and closing of the first electromagnetic valve and the second electromagnetic valve.
In an alternative scheme, a plurality of stand columns are arranged on the bottom plate, the stand columns are distributed on the same circumference, the stand columns are used for bearing the wafer carrier ring, and the center of the circumference is coincident with the center of the wafer carrier ring.
In an alternative, the resilient member comprises a compression spring.
The invention has the beneficial effects that:
The invention has simple structure, low cost and high reliability.
Furthermore, the change of the movement direction is realized by adopting a 45-degree guide groove and a bearing, the guide groove is of an up-down mirror image structure, and the mechanism has good consistency in operation and high centering and orientation precision.
Further, kinetic energy is transmitted between the air cylinder and the clamping piece through the elastic component, and when the clamping piece clamps the wafer carrier ring, collision impact can be absorbed by the elastic component due to the existence of the elastic component, so that the safety of the wafer carrier ring is protected.
Further, three groups of sensors are installed, shrinkage position, clamping position and over-clamping position are detected respectively, states of the positions can be automatically identified, particularly the over-clamping position sensors are displayed, when a wafer falls or is bounced, the over-clamping sensors are triggered, abnormal alarm is triggered, and material safety is protected.
Drawings
The foregoing and other objects, features and advantages of the invention will be apparent from the following more particular descriptions of exemplary embodiments of the invention as illustrated in the accompanying drawings wherein like reference numbers generally represent like parts throughout the exemplary embodiments of the invention.
Fig. 1 is an isometric view of a wafer carrier ring centering and orienting device in accordance with an embodiment of the present invention, the wafer carrier ring being in a clamped state.
Fig. 2 is a top view of a wafer carrier ring centering and orienting device with the cylinder in a retracted state and the wafer carrier ring in an undamped state in accordance with an embodiment of the present invention.
Fig. 3 is a top view of a wafer carrier ring centering and orienting device with an air cylinder in an extended position and a wafer carrier ring clamped position in an embodiment of the present invention.
Fig. 4 is a top view of a wafer carrier ring centering orientation apparatus with the cylinder in a maximally extended state and in an over-clamped touch state, in accordance with an embodiment of the present invention.
Fig. 5 is a schematic diagram of motion states of two second motion units in the embodiment of the present invention, and three views from left to right are: a retracted state, a clamped state, an over-clamped state.
FIG. 6 is a schematic diagram of a clamp sensor according to an embodiment of the present invention, three views from left to right being in sequence: the position relation between the optical axis of the sensor and the notch in the retracted state, the clamping state and the over-clamping state.
Fig. 7 is a schematic diagram of the triggering principle of the clamp sensor according to the embodiment of the present invention.
Reference numerals illustrate:
1-a bottom plate; 2-wafer carrier ring; 3 a-resin columns; 3 b-resin columns; 3 c-resin columns; 3 d-resin columns; 4-an electrical board card; 5-a first solenoid valve; 6-cylinder; 7 a-an intake throttle valve; 7 b-an air outlet throttle valve; 8 a-a first sensor; 8 b-clamp sensor; 8 c-a second sensor; 9-a spring; 10-a second guide rail; 10 a-a slider; 10 b-a slider; 10 c-a slider; 10 d-a slider; 11-a first guide rail; 11 a-a slider; 12-a transverse guide block; 12 a-bearing; 12 b-bearings; 13-triggering a sheet; 14-upper sliding blocks; 14 a-45 ° guide slot of the upper slider; 15-a lower slider; 15 a-45 ° guide slot of the lower slider; 16-a lower clamping block; 16 a-lower guide block; 16 b-lower resin rollers; 16 c-lower resin rollers; 17-upper clamping blocks; 17 a-upper guide block; 17 b-upper resin rollers; 17 c-upper resin rollers; 18-clamping the optical axis of the sensor; 19-notch.
Detailed Description
The invention is described in further detail below with reference to the drawings and the specific examples. The advantages and features of the present invention will become more apparent from the following description and drawings, however, it should be understood that the inventive concept may be embodied in many different forms and is not limited to the specific embodiments set forth herein. The drawings are in a very simplified form and are to non-precise scale, merely for convenience and clarity in aiding in the description of embodiments of the invention.
It will be understood that when an element or layer is referred to as being "on," "adjacent," "connected to," or "coupled to" another element or layer, it can be directly on, adjacent, connected, or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers present. It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present invention.
Spatially relative terms, such as "under," "below," "beneath," "under," "above," "over," and the like, may be used herein for ease of description to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "under" or "beneath" other elements would then be oriented "on" the other elements or features. Thus, the exemplary terms "below" and "under" may include both an upper and a lower orientation. The device may be otherwise oriented (rotated 90 degrees or other orientations) and the spatially relative descriptors used herein interpreted accordingly.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term "and/or" includes any and all combinations of the associated listed items.
Example 1
Referring to fig. 1 to 7, the present embodiment provides a wafer carrier ring centering and orienting device, including:
The device comprises a bottom plate 1, wherein a first motion unit and two second motion units which are symmetrically arranged are arranged on the bottom plate 1;
The first motion unit is provided with two end parts which are respectively movably connected with the two second motion units;
The driving control unit is used for driving and controlling the first units to move so that the first units drive the two second units to be close to or far away from each other, and opposite end parts of the two second movement units are used for clamping the wafer carrier ring 2; the motion paths of the first unit and the second unit are perpendicular to each other;
the drive control unit is connected with the first motion unit through an elastic component.
Specifically, in this embodiment, the first motion unit includes: a first rail 11 mounted on the base plate 1; a first slider (slider 11 a) slidably mounted on the first rail 11; a lateral guide block 12 fixed above the slider 11a, the lateral guide block 12 having two ends, each having a bearing, respectively a bearing 12a and a bearing 12b.
In this embodiment, the second unit includes: a second guide rail 10 mounted on the base plate 1, the first guide rail 11 and the second guide rail 10 being perpendicular to each other; a second slider slidably mounted on the second guide rail 10; a clamping member connected to the second slider and the end of the lateral guide block 12; the transverse guide block 12 drives the second slider to move along the second guide rail 10, so that the clamping piece moves along the second guide rail 10. The clamping piece includes: a slider having a first end facing the center of the wafer carrier ring and a second end facing away from the center of the wafer carrier ring; wherein the first end is connected with the second slide block and the end part of the transverse guide block 12, and the second end is provided with a clamping block; the clamping block comprises a guide block and rollers positioned on two sides of the guide block, the guide block corresponds to the trimming edge of the wafer carrier ring 2, and the rollers can be in rolling tangency with the arc edges on two sides of the trimming edge. The material of the roller may be a resin. The sliding block is provided with a 45-degree guide groove, and the bearing rolls in the 45-degree guide groove, so that the movement speeds of the transverse guide block and the clamping piece are the same.
Referring to fig. 2, the second units are two symmetrically arranged, and the second sliders of the upper second unit are a slider 10a and a slider 10b, wherein the slider 10a and the slider 10b are mounted on the second guide rail 10, and the slider 10a and the slider 10b can slide freely up and down on the second guide rail 10. The second sliding blocks of the lower second unit are a sliding block 10c and a sliding block 10d, the sliding block 10c and the sliding block 10d are arranged on the second guide rail 10, and the sliding block 10c and the sliding block 10d can slide freely up and down on the second guide rail 10. The sliding block of the second upper unit is an upper sliding block 14, the second end of the upper sliding block 14 is provided with an upper clamping block 17, and the upper clamping block 17 comprises an upper guide block 17a, and upper resin rollers 17b and 17c positioned on two sides of the upper guide block 17a, wherein the upper resin rollers 17b and 17c can freely rotate. The lower sliding block of the second unit is a lower sliding block 15, the second end of the lower sliding block 15 is provided with a lower clamping block 16, and the lower clamping block 16 comprises a lower guide block 16a, and lower resin rollers 16b and 16c positioned at two sides of the lower guide block 16a, wherein the lower resin rollers 17b and 17c can freely rotate.
In this embodiment, the base plate 1 is provided with 4 columns, the columns are made of resin (resin columns 3a, 3b, 3c, and 3d respectively), 4 columns are distributed on the same circumference, the 4 columns are used for bearing the wafer carrier ring 2, and the center of the circumference coincides with the center of the wafer carrier ring. The height of the upper clamping block 17 and the lower clamping block 16 is consistent with the height of the wafer carrier ring 2, and the heights of other parts are lower than the wafer carrier ring 2, so that the material safety of the wafer carrier ring 2 in the clamping process is ensured.
In this embodiment, the base plate 1 is provided with a clamp sensor 8b, and the clamp sensor 8b is a correlation sensor. The transverse guide block 12 is provided with a trigger sheet 13, the trigger sheet 13 is provided with a notch 19, when the wafer carrier ring clamp 2 is clamped in place, the optical axis of the clamp sensor 8b passes through the notch 19, and the clamp sensor 8b is triggered (when the trigger sheet 13 shields the optical axis of the clamp sensor 8b, the clamp sensor 8b cannot be triggered).
In this embodiment, the drive control unit comprises a cylinder 6, and the cylinder 6 and the lateral guide block 12 are not rigidly connected, but are connected by an elastic member. In the embodiment, the elastic component is the spring 9, and the power is transmitted between the air cylinder 6 and the transverse guide block 12 through the flexible spring 9, so that the power impact of the clamping mechanism when contacting the wafer carrier ring 2 can be effectively absorbed, and the safety of materials is protected. After the air cylinder 6 is pushed out, the spring 9 is compressed, and the elastic force of the spring 9 pushes the transverse guide block 12 to slide transversely along the first guide rail 11. The bearing 12a on the transverse guide block 12 is clamped on the 45-degree guide groove 14a of the upper sliding block; the bearing 12b of the lateral guide block 12 is caught on the 45 deg. guide groove 15a of the lower slide block. The motion direction of the device is changed by adopting the structural design of the bearing and the 45-degree guide groove, and when the bearing slides in the guide groove, the bearing can freely rotate, so that the phenomenon of blocking or pause can not occur in the structure, the service life of the device can be obviously weakened by blocking and pause, the reliability is influenced, and the design obviously improves the reliability of the device.
In this embodiment, the clamping mechanism (including the first moving unit and the second moving unit) is in a mirror image relationship up and down along the center line of the first rail 11.
The cylinder 6 is provided with a first sensor 8a and a second sensor 8c; the first sensor 8a is triggered when the telescopic rod of the cylinder 6 is in the retracted position, the clamping sensor 8b is triggered when the telescopic rod is in the clamped position, and the second sensor 8c is triggered when the telescopic rod extends beyond the clamped position.
In this embodiment, the drive control unit further includes: an electric board 4, a first solenoid valve 5, and a second solenoid valve (not shown in the figure); the air pipe of the first electromagnetic valve is connected with the air inlet throttle valve 7a of the air cylinder, the air pipe of the second electromagnetic valve is connected with the air outlet throttle valve 7b of the air cylinder, and the electric board card 4 is used for controlling the opening and closing of the first electromagnetic valve and the second electromagnetic valve. The electric board card 4 controls the switch of the first electromagnetic valve and the second electromagnetic valve to realize the direction switching of the gas, and the air inlet throttle valve 7a and the air outlet throttle valve 7b can adjust the flow of the gas to realize the extension and retraction speed control of the air cylinder 6, so that the damage of impact to materials is reduced.
The working principle of the device is as follows:
Referring to fig. 2 and 5, the cylinder 6 is extended to compress the spring 9, the spring 9 pushes the lateral guide block 12 to move to the right (shown by an arrow), the bearing 12a of the lateral guide block 12 slides in the 45 ° guide groove 14a of the upper slide block 14, so that the upper slide block 14 moves downward, and the movement speed of the lateral guide block 12 is consistent with the movement speed of the upper slide block 14 because the guide groove 14a is at a 45 ° angle, as shown by an arrow above fig. 5; similarly, the bearings 12b of the lateral guide block 12 slide in the 45 ° guide grooves 15b of the lower slide block 15, causing the lower slide block 15 to move upward, also at a speed consistent with the speed of the lateral guide block 12. The lateral movement of the air cylinder 6 will eventually drive the upper slider 14 and the lower slider 15 to move in opposite directions, the speeds are the same, the upper slider 14 and the lower slider 15 respectively drive the upper clamping block 17 and the lower clamping block 16 to move up and down, as shown in fig. 5, during the movement process from left to right, the clamping mechanism will first go to the clamping position, if no wafer carrier ring exists, the clamping mechanism will continue to clamp to the over-clamping position, and the air cylinder 6 reaches the maximum stroke.
As shown in fig. 6, during the extension of the cylinder 6, the states of the clamp sensor 8b are respectively from left to right: when the left cylinder is retracted, the trigger sheet 13 shields the optical axis 18 of the clamping sensor 8b, the clamping sensor 8b is not triggered, and the first sensor 8a is triggered at the moment; when the middle cylinder stretches out to the clamping position, the notch 19 of the trigger sheet 13 moves to the position of the optical axis 18 of the clamping sensor 8b, the optical axis 18 is not blocked, and the clamping sensor 8b triggers; at the maximum stroke position of the cylinder on the right, the notch 19 of the trigger tab 13 has passed the optical axis 18 of the grip sensor 8b, the trigger tab 13 again obstructs the optical axis 18, the grip sensor 8b is not triggered, and the second sensor 8c is triggered.
As shown in fig. 2, 3 and 4, the device has 3 positions in total, namely, a retracted position of the air cylinder 6, a clamping position of the wafer carrier ring 2 and a maximum extending position of the air cylinder 6, wherein the retracted position of the air cylinder 6 triggers the first sensor 8a, the clamping position of the wafer carrier ring 2 triggers the clamping sensor 8b, and the maximum extending position of the air cylinder 6 triggers the third sensor 8c, so that each station is triggered by the sensor to judge whether the corresponding action is automatically completed. Normally, when the device is used correctly, only the retracted position of the air cylinder 6 and the clamping position of the wafer carrier ring 2 are used, and only when the wafer carrier ring 2 is not placed on the device correctly or falls off, the clamping mechanism cannot clamp the wafer carrier ring 2, so that the air cylinder 6 moves to the maximum stroke position (also called the clamping position), at the moment, the second sensor 8c can trigger and report to the whole machine software, and the device is in an abnormal state.
As shown in fig. 2, 3 and 4, during the extension of the cylinder 6, the lower clamping block 16 and the upper clamping block 17 respectively drive the lower guide block 16a, the lower resin roller 16b, the lower resin roller 16c, the upper guide block 17a, the upper resin roller 17b and the upper resin roller 17c to move at the same speed and opposite directions, and the lower guide block 16a, the lower resin roller 16b, the lower resin roller 16c, the upper guide block 17a, the upper resin roller 17b and the upper resin roller 17c simultaneously contact the wafer carrier ring 2. The wafer carrier ring 2 is generally limited by SEMI standard in overall dimension, and has four square cut edges on top, bottom, left and right, and adjacent concentric circular arc edges, which is of critical importance. The lower guide block 16a and the upper guide block 17a can be contacted with the upper flat edge and the lower flat edge of the wafer carrier ring 2 at the same time, when the angle of the wafer carrier ring 2 has certain deviation, the lower guide block 16a and the upper guide block 17a can correct the angle deviation, so that the orientation function of the wafer carrier ring 2 is realized, and the lower guide block 16a and the upper guide block 17a are simultaneously driven to clamp and retract by only one cylinder 6, so that the speeds of the lower guide block 16a and the upper guide block 17a are the same and opposite, the clamping consistency is high, and the orientation repeatability precision is high.
As shown in fig. 2,3 and 4, the lower resin roller 16b, the lower resin roller 16c, the upper resin roller 17b and the upper resin roller 17c are respectively in contact with the four circular arc sides of the wafer carrier ring 2 at the same time, and at this time, the centers of the lower resin roller 16b, the lower resin roller 16c, the upper resin roller 17b and the upper resin roller 17c are overlapped with the center of the wafer carrier ring 2, thereby realizing the centering function of the wafer carrier ring 2, and since only one cylinder 6 is used for simultaneously driving the lower resin roller 16b, the lower resin roller 16c, the upper resin roller 17b and the upper resin roller 17c to clamp and retract, the speeds of the lower resin roller 16b, the lower resin roller 16c, the upper resin roller 17b and the upper resin roller 17c are the same and opposite, so that the clamping consistency is high and the centering repeatability is high. In addition, as the resin roller can freely rotate, the wafer carrier ring 2 can be centered in a rotating mode in the centering process, sliding friction is reduced, particle formation is reduced, and environmental cleanliness is guaranteed.
The device has simple structure, low cost and high reliability. Furthermore, the change of the movement direction is realized by adopting a 45-degree guide groove and a bearing, the guide groove is of an up-down mirror image structure, and the mechanism has good consistency in operation and high centering and orientation precision. Further, kinetic energy is transmitted between the air cylinder and the clamping piece through the elastic component, and when the clamping piece clamps the wafer carrier ring, collision impact can be absorbed by the elastic component due to the existence of the elastic component, so that the safety of the wafer carrier ring is protected. Further, three groups of sensors are installed, shrinkage position, clamping position and over-clamping position are detected respectively, states of the positions can be automatically identified, particularly the over-clamping position sensors are displayed, when a wafer falls or is bounced, the over-clamping sensors are triggered, abnormal alarm is triggered, and material safety is protected.
The above description is only illustrative of the preferred embodiments of the present invention and is not intended to limit the scope of the present invention, and any alterations and modifications made by those skilled in the art based on the above disclosure shall fall within the scope of the appended claims.
Claims (10)
1. The utility model provides a wafer carrier ring centering orientation device, wherein have four square side cut about the upper and lower of wafer carrier ring, adjacent link to each other through concentric circular arc limit between the side cut, its characterized in that, wafer carrier ring centering orientation device includes:
the base plate is provided with a first motion unit and two second motion units which are symmetrically arranged;
The first motion unit is provided with two end parts which are respectively movably connected with the two second motion units;
the driving control unit is used for driving and controlling the first movement unit to move so that the first movement unit drives the two second movement units to be close to or far away from each other, and opposite end parts of the two second movement units are used for clamping the wafer carrier ring; the motion paths of the first motion unit and the second motion unit are mutually perpendicular;
The drive control unit is connected with the first motion unit through an elastic component;
The second movement unit comprises a clamping block, the clamping block comprises a guide block and rollers respectively positioned at two sides of the guide block, the guide block corresponds to the trimming edge of the wafer carrier ring, and the rollers can be in rolling tangency with the circular arc edges at two sides of the trimming edge;
under the control of the driving control unit, the two second movement units respectively drive the guide blocks and the rollers on two sides to move, and the speeds are the same and the directions are opposite; the guide blocks are respectively contacted with the upper flat edge and the lower flat edge of the wafer carrier ring at the same time, the four rollers are respectively contacted with the four circular arc edges of the wafer carrier ring at the same time, and the center formed by the four rollers is overlapped with the center of the wafer carrier ring, so that the centering orientation of the wafer carrier ring is realized.
2. The wafer carrier ring centering and orienting device of claim 1, wherein said first motion unit comprises:
a first guide rail mounted on the base plate;
a first slider slidably mounted on the first rail;
And the transverse guide block is fixed above the first sliding block and is provided with the two end parts.
3. The wafer carrier ring centering and orienting device of claim 2, wherein said second motion unit comprises:
The second guide rail is arranged on the bottom plate, and the first guide rail and the second guide rail are mutually perpendicular;
a second slider slidably mounted on the second rail;
The clamping piece is connected to the second sliding block and the end part of the transverse guide block; the transverse guide block drives the second sliding block to move along the second guide rail, so that the clamping piece moves along the second guide rail.
4. The wafer carrier ring centering and orienting device of claim 3, wherein said clamping member comprises:
a slider having a first end facing the center of the wafer carrier ring and a second end facing away from the center of the wafer carrier ring;
the first end is connected with the second sliding block and the end part of the transverse guide block, and the second end is provided with the clamping block.
5. The wafer carrier ring centering and orienting device of claim 4, wherein said end of said lateral guide block has a bearing, said slide block has a 45 ° guide slot, and said bearing rolls within said 45 ° guide slot, thereby equalizing the speeds of movement of said lateral guide block and said clamping member.
6. The wafer carrier ring centering and orienting device of claim 2, wherein a clamp sensor is mounted on the base plate, and wherein a trigger tab is mounted on the lateral guide block, the trigger tab having a notch through which an optical axis of the clamp sensor passes when the wafer carrier ring is clamped in place, the clamp sensor being triggered.
7. The wafer carrier ring centering and orienting device of claim 6, wherein said drive control unit comprises a cylinder having a first sensor and a second sensor disposed thereon; the first sensor is triggered when the telescopic rod of the air cylinder is in a retracted position, the clamping sensor is triggered when the telescopic rod is in a clamping position, and the second sensor is triggered when the telescopic rod extends beyond the clamping position.
8. The wafer carrier ring centering and orientation apparatus of claim 7, wherein said drive control unit further comprises: the device comprises an electric board card, a first electromagnetic valve and a second electromagnetic valve; the air pipe of the first electromagnetic valve is connected with the air inlet throttle valve of the air cylinder, the air pipe of the second electromagnetic valve is connected with the air outlet throttle valve of the air cylinder, and the electric board card is used for controlling the opening and closing of the first electromagnetic valve and the second electromagnetic valve.
9. The wafer carrier ring centering and orienting device of claim 1, wherein a plurality of posts are disposed on the base plate, the plurality of posts are distributed on a same circumference, the plurality of posts are configured to carry the wafer carrier ring, and a center of the circumference coincides with a center of the wafer carrier ring.
10. The wafer carrier ring centering orientation apparatus of claim 1, wherein said resilient member comprises a compression spring.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310682590.XA CN116798923B (en) | 2023-06-09 | 2023-06-09 | Centering and orienting device for wafer carrier ring |
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| CN202310682590.XA CN116798923B (en) | 2023-06-09 | 2023-06-09 | Centering and orienting device for wafer carrier ring |
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| CN116798923B true CN116798923B (en) | 2024-04-16 |
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| CN116798923A (en) | 2023-09-22 |
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