JP2010166620A5 - - Google Patents

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Publication number
JP2010166620A5
JP2010166620A5 JP2010092871A JP2010092871A JP2010166620A5 JP 2010166620 A5 JP2010166620 A5 JP 2010166620A5 JP 2010092871 A JP2010092871 A JP 2010092871A JP 2010092871 A JP2010092871 A JP 2010092871A JP 2010166620 A5 JP2010166620 A5 JP 2010166620A5
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JP
Japan
Prior art keywords
layer
covering
electronic device
cavity
substrate
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Application number
JP2010092871A
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English (en)
Japanese (ja)
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JP2010166620A (ja
JP5408447B2 (ja
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Priority to JP2010092871A priority Critical patent/JP5408447B2/ja
Priority claimed from JP2010092871A external-priority patent/JP5408447B2/ja
Publication of JP2010166620A publication Critical patent/JP2010166620A/ja
Publication of JP2010166620A5 publication Critical patent/JP2010166620A5/ja
Application granted granted Critical
Publication of JP5408447B2 publication Critical patent/JP5408447B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2010092871A 2010-04-14 2010-04-14 電子装置 Expired - Fee Related JP5408447B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010092871A JP5408447B2 (ja) 2010-04-14 2010-04-14 電子装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010092871A JP5408447B2 (ja) 2010-04-14 2010-04-14 電子装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2008027304A Division JP5233302B2 (ja) 2007-03-15 2008-02-07 電子装置、共振子、及び電子装置の製造方法

Publications (3)

Publication Number Publication Date
JP2010166620A JP2010166620A (ja) 2010-07-29
JP2010166620A5 true JP2010166620A5 (enrdf_load_stackoverflow) 2012-04-05
JP5408447B2 JP5408447B2 (ja) 2014-02-05

Family

ID=42582357

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010092871A Expired - Fee Related JP5408447B2 (ja) 2010-04-14 2010-04-14 電子装置

Country Status (1)

Country Link
JP (1) JP5408447B2 (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5344175B2 (ja) 2009-12-22 2013-11-20 セイコーエプソン株式会社 Mems発振器及びその製造方法
JP5682361B2 (ja) * 2011-02-17 2015-03-11 セイコーエプソン株式会社 振動デバイス、振動デバイスの製造方法、モーションセンサー、および電子機器
JP2014076527A (ja) 2012-10-12 2014-05-01 Seiko Epson Corp Memsセンサー、および電子機器、ロボット、移動体
JP2014184513A (ja) 2013-03-22 2014-10-02 Toshiba Corp 電気部品およびその製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6602791B2 (en) * 2001-04-27 2003-08-05 Dalsa Semiconductor Inc. Manufacture of integrated fluidic devices
JP4544880B2 (ja) * 2003-09-25 2010-09-15 京セラ株式会社 微小電気機械式装置の封止方法
JP2006202918A (ja) * 2005-01-19 2006-08-03 Sony Corp 機能素子パッケージ体及びその製造方法
JP4501715B2 (ja) * 2005-02-16 2010-07-14 セイコーエプソン株式会社 Mems素子およびmems素子の製造方法
JP4724488B2 (ja) * 2005-02-25 2011-07-13 日立オートモティブシステムズ株式会社 集積化マイクロエレクトロメカニカルシステム
JP2007125626A (ja) * 2005-11-01 2007-05-24 Toshiba Corp Mems素子
JP2007210083A (ja) * 2006-02-13 2007-08-23 Hitachi Ltd Mems素子及びその製造方法
JP2007216308A (ja) * 2006-02-14 2007-08-30 Seiko Epson Corp 電子装置及びその製造方法
JP2008016919A (ja) * 2006-07-03 2008-01-24 Matsushita Electric Ind Co Ltd 音響感応装置

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