JP2010157377A - Lamp device and lighting system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lamp device 14 improving heat-radiation. <P>SOLUTION: An LED substrate attaching part 39 and a protrusion 40 protruding from the center of the LED substrate attaching part 39 are integrally formed on a base 36 of a base metal part 31. An LED substrate 32 is closely attached to the LED substrate attaching part 39 of the base 36. Heat generated from an LED element 47 is heat-conducted to the LED substrate attaching part 39 of the base 36, is heat-conducted from the LED substrate attaching part 39 to the protrusion 40, and then heat-conducted from the protrusion 40 to equipment body 12 to radiate it. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a lamp device using an LED as a light source, and an illumination device using the lamp device.

  Conventionally, there is a lamp device using a base part of a GX53 type standardized by IEC (International Electrotechnical Commission). This lamp device has a flat shape, and is provided with a GX53-shaped base part on the upper surface side thereof, and a fluorescent lamp support member in which a flat fluorescent lamp is disposed as a light source separately from the base part on the lower surface side. Is disposed, and a lighting circuit for lighting the fluorescent lamp is accommodated inside the base part, and is configured to be thin with a small size in the height direction formed by the upper surface side and the lower surface side.

  A pair of lamp pins having a large-diameter portion at the tip is projected from the upper surface of the base portion with the height direction of the lamp device as the axial direction. Then, the lamp pin of the lamp device is inserted into the socket device from below, the lamp device is rotated and the lamp pin is hooked on the socket device, whereby the lamp device is held on the socket device, and the socket pin is in contact with the lamp pin. Then, power is supplied to the lamp pins.

In order to protect the lighting circuit from the influence of heat generated by the lighting of the fluorescent lamp, there are those in which a part of the base part that accommodates this lighting circuit is a metal heat sink or the whole base part is made of metal ( For example, see Patent Document 1.)
Japanese Patent Laying-Open No. 2007-287684 (pages 4-5 and 7, FIGS. 3 and 12)

  Since the light source generates heat when the lamp device is turned on, heat dissipation is necessary. In particular, when an LED is used as a light source, if sufficient heat dissipation is not performed, the temperature of the LED itself becomes high, causing the LED to be thermally deteriorated and causing a short life, and in some cases, the light emission efficiency is reduced. Sufficient heat dissipation is required.

  In the conventional lamp device, a part of the base part is made of a metal heat sink or the whole part of the base part is made of metal for the purpose of protecting the lighting circuit from the influence of heat generated by lighting of the fluorescent lamp. However, there is a problem that heat is not actively conducted from the fluorescent lamp support member side, which is separate from the base part, to the base part side, and sufficient heat dissipation cannot be obtained when an LED is used as a light source. There is.

  This invention is made | formed in view of such a point, and it aims at providing the lamp device which can improve heat dissipation, and the lighting fixture using this lamp device.

  The lamp device according to claim 1 includes a base part having a base on which a flat plate-like LED board mounting part and a base part integrally projecting from the center of one surface side of the LED board mounting part are formed; LED substrate attached to the other surface side of the LED substrate attachment part.

  For the base part, for example, a base structure such as GX53 type is used.

  The base is a base portion integrally formed of a metal excellent in heat conduction such as aluminum. As long as the protruding portion is configured integrally with the LED board mounting portion, the inner structure may be hollow or solid.

  The LED substrate may have one surface on which the LED is provided as a light source, and the other surface may have a plane that can be connected to the base LED substrate mounting portion. For example, the LED substrate has a wiring pattern formed on a metal substrate through an insulating layer, the LED element is mounted on the wiring pattern, and is tightly connected to the base LED substrate mounting portion of the base portion by screws or the like. It is attached as follows.

  The lamp device may be provided with a lighting circuit for lighting the LED, but this is not an essential configuration for the present invention. The lighting circuit may be housed in the lamp device body or may be disposed on the LED substrate.

  A lamp device according to a second aspect is the lamp device according to the first aspect, wherein a wall portion is integrally formed around the LED board mounting portion of the base.

  For example, the wall portion may have a fin shape on the surface and have a large surface area to improve heat dissipation.

  The lighting device according to claim 3 is an appliance main body including a socket device having an insertion hole; and is detachably attached to the socket device, the protruding portion is inserted into the insertion hole of the socket device, and the end surface of the protruding portion is an appliance. The lamp device according to claim 1, which is in contact with the main body so as to be capable of conducting heat.

  The instrument main body may be provided integrally with the socket device, and includes one in which the socket device itself constitutes the instrument main body. The place where the fixture main body comes into contact with the base portion of the lamp device so as to be able to conduct heat is not limited to the end surface of the protruding portion of the base portion, but may include the outer peripheral surface of the base portion.

  According to the lamp device of the first aspect, the LED substrate mounting portion and the protruding portion protruding from the center of one surface side of the LED substrate mounting portion are integrally formed on the base of the base portion, and the other surface of the LED substrate mounting portion of the base is formed. Since the LED board is attached in close contact with the side, the heat generated by the LED can be efficiently conducted from the LED board mounting part to the projecting part to the base LED board mounting part of the base part, and heat is collected at the projecting part. Heat can be efficiently radiated from the projecting portion, and heat dissipation can be improved.

  According to the lamp device of the second aspect, in addition to the effect of the lamp device of the first aspect, from the LED board mounting portion of the base to the wall portion formed integrally with the peripheral portion of the LED board mounting portion is also efficient. Heat conduction is possible, and heat can be radiated from the wall to the outside, improving heat dissipation.

  According to the illuminating device of claim 3, by attaching the lamp to the socket device, the protruding portion of the lamp device is inserted into the insertion hole of the socket device, and the end surface of the protruding portion can conduct heat to the instrument body. Therefore, heat can be efficiently conducted from the lamp device to the fixture body, and heat dissipation can be improved.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1 to 3 show a first embodiment, FIG. 1 is an assembled sectional view of a lighting device fixture body, a lamp device and a socket device, FIG. 2 is an exploded perspective view of the lamp device, and FIG. It is a perspective view of a lamp device and a socket device.

  The illumination device 11 is, for example, a downlight, and includes a fixture main body 12, a socket device 13 attached to the fixture main body 12, and a lamp device 14 that can be attached to and detached from the socket device 13. Hereinafter, the directional relationship such as the vertical direction will be described with the base side as the upper side and the light source side as the lower side, based on the state in which the lamp device 14 is mounted horizontally.

  The instrument body 12 is made of metal and has a reflector integrally formed, and includes a circular flat plate portion 17 and a reflective plate portion 18 that is bent downward from the periphery of the flat plate portion 17 in a curved shape. Yes. The diameter of the reflecting plate portion 18 is increased toward the lower side.

  The socket device 13 has a cylindrical socket device main body 21 made of an insulating synthetic resin, and an insertion hole 22 is formed through the center of the socket device main body 21 in the vertical direction.

  A pair of socket portions 24 are formed on the lower surface of the socket device body 21 at symmetrical positions with respect to the center of the socket device body 21. These socket portions 24 are formed with connection holes 25, and a receiving member (not shown) for supplying power to the inside of the connection holes 25 is disposed. The connection hole 25 is an arc-shaped long hole that is concentric with the center of the socket device main body 21, and a diameter-expanded portion 26 is formed at one end of the long hole.

  Further, the lamp device 14 includes a base part 31 disposed on the upper surface side that is one surface side, an LED substrate 32 disposed on the lower surface side that is the other surface side of the base part 31, a globe 33 that covers the LED substrate 32, And a lighting circuit 34 disposed in the base 31 and is formed in a thin shape with a small dimension in the height direction.

  The base part 31 is formed in the shape of GX53, and includes a base 36, a cover 37 attached to the base 36, and a pair of lamp pins 38 protruding from the cover 37.

  The base 36 is made of a metal having excellent thermal conductivity, such as aluminum, and is a flat disk-shaped (annular) LED board mounting part 39 and protrudes from the center of the upper surface of the LED board mounting part 39. A cylindrical projecting portion 40 and an annular wall portion 41 projecting from the periphery of the upper surface of the LED board mounting portion 39 are integrally formed.

  An end surface portion 42 that is a contact surface portion that abuts the flat plate portion 17 of the instrument body 12 by closing the front end surface of the protrusion 40 and attaching the lamp device 14 to the socket device 13 on the front end surface of the protrusion 40. Is formed. The outer surface of the end face portion 42 is subjected to a surface treatment such as polishing for improving the smoothness in order to improve the thermal conductivity to the instrument body 12, or a flexible material such as a gel material or a heat radiation sheet. A heat conductive member that is flexible or elastic and has excellent heat conductivity may be disposed.

  An annular storage portion 43 for storing the lighting circuit 34 is formed between the protrusion 40 and the wall portion 41 on the upper surface of the LED board mounting portion 39.

  The cover 37 is made of an insulating synthetic resin and is formed in a ring shape. The cover 37 is attached in a state of closing the upper surface of the storage portion 43 of the base 36.

  The pair of lamp pins 38 protrudes from the upper surface of the cover 37 at a symmetric position with respect to the center of the lamp device 14. A large diameter portion 44 is formed at the tip of the lamp pin 38. The large diameter portion 44 of each lamp pin 38 is inserted from the enlarged diameter portion 26 of each connection hole 25 of the socket device 13, and the lamp pin 38 is moved to the connection hole 25 by the rotation of the lamp device 14, whereby the lamp pin 38 is The lamp device 14 is held by the socket device 13 while being electrically connected to a receiver disposed inside the connection hole 25 and the large diameter portion 44 is hooked on the edge of the connection hole 25.

  Further, the LED substrate 32 is made of a metal such as aluminum and has a flat plate shape, and a wiring pattern is formed on the lower surface of the disk-shaped substrate 46 via an insulating layer, and LEDs as a plurality of LEDs are formed on the wiring pattern. An element 47 is connected and arranged. The substrate 46 is attached in close contact with the LED substrate mounting portion 39 of the base 36 by, for example, tightening with a screw or the like so as to come into contact with the lower surface of the LED substrate mounting portion 39 of the base 36 so as to allow heat conduction.

  The globe 33 is made of transparent or light diffusing glass or synthetic resin having translucency.

  Further, the lighting circuit 34 has a circuit board 49 and a plurality of lighting circuit components mounted on the circuit board 49, and the input part of the circuit board 49 and the lamp pin 38 are electrically connected by a lead wire or the like, The output part of the circuit board 49 and the LED board 32 are electrically connected by a lead wire or the like. The circuit board 49 is housed and attached in the housing part 43 of the base part 31 with an insulating material (not shown) interposed therebetween.

  In order to attach the lamp device 14 to the socket device 13, the lamp device 14 is raised so that each lamp pin 38 of the lamp device 14 is inserted in accordance with the enlarged diameter portion 26 of each connection hole 25 of the socket device 13. Thereafter, by rotating the lamp device 14 in the mounting direction and moving each lamp pin 38 to each connection hole 25, each lamp pin 38 is electrically contacted with the socket device 13 and each lamp pin 38 is moved. The large-diameter portion 44 is caught on the edge of the connection hole 25, and the lamp device 14 can be attached to the socket device 13.

  In a state where the lamp device 14 is mounted on the socket device 13, the protruding portion 40 of the lamp device 14 is inserted into the insertion hole 22 of the socket device 13, and the end surface portion 42 of the protruding portion 40 is connected to the flat plate portion 17 of the instrument body 12. Contact to allow heat conduction. At this time, a plurality of slits that divide a part of the flat plate portion 17 of the instrument main body 12 are provided in the flat plate portion 17, and the small pieces of the divided flat plate portion 17 are made elastic so that the protruding portion 40 has elasticity. The end surface portion 42 may be configured to be in close contact with each other, or a metal spring member that is in close contact with the end surface portion 42 of the protruding portion 40 may be separately provided so as to be in contact with heat.

  Further, when the LED element 47 of the lamp device 14 is turned on, the heat generated by the LED element 47 is efficiently conducted from the substrate 46 to the LED board mounting portion 39 of the base 36 of the base 31, and the LED of the base 36 is The heat conducted to the board mounting portion 39 is efficiently conducted to the projecting portion 40 formed integrally. The heat conducted to the projecting portion 40 is efficiently conducted from the end face portion 42 of the projecting portion 40 to the instrument body 12, and the heat conducted to the instrument body 12 is radiated into the atmosphere.

  Therefore, the heat generated by the LED element 47 thermally conducted to the LED board mounting portion 39 of the base 36 can be efficiently conducted to the projecting portion 40 formed integrally, and the heat is collected in the projecting portion 40 and the projecting portion. It is possible to efficiently release heat from 40 to the instrument body 12, and heat dissipation can be improved.

  On the other hand, the heat conducted to the LED board mounting portion 39 of the base 36 is also efficiently conducted to the integrally formed wall 41, and the heat conducted to the wall 41 is transferred from the wall 41. Heat is released to the atmosphere. Therefore, the heat dissipation of the heat generated by the LED element 47 can be improved.

  Therefore, the lamp device 14 of the present embodiment can obtain sufficient heat dissipation, can suppress the temperature rise of the LED element 47, the LED element 47 is thermally deteriorated and has a short life, and in some cases the luminous efficiency is high. It can be prevented from lowering.

  Next, FIG. 4 shows a second embodiment. FIG. 4 is a cross-sectional view of the lighting device.

  In the lamp device 14 according to the second embodiment, the protruding portion 40 of the base 36 of the base portion 31 has a cylindrical shape, and the inside of the protruding portion 40 is solid. When configured in this manner, the contact area with the LED board mounting portion 39 is increased and the heat conduction efficiency is increased, so that the heat of the LED element 47 is easily conducted from the board 46 to the end face portion 42 of the protrusion 40. Therefore, the thermal conductivity of the base 36 from the LED board mounting portion 39 can be improved, and as a result, the heat dissipation of the heat generated by the LED element 47 can be further improved.

  Next, FIG. 5 shows a third embodiment. FIG. 5 is a perspective view of the lighting device.

  An exhaust hole 51 is provided in the flat plate portion 17 of the instrument main body 12, and a fan 52 for exhausting the air in the instrument main body 12 from the exhaust hole 51 to the outside is disposed.

  The socket device 13 is provided with a plurality of air holes 53 that communicate the outer peripheral surface of the socket device main body 21 with the inner peripheral surface of the insertion hole 22.

  Then, due to the operation of the fan 52, the air below the instrument body 12 is sucked into the instrument body 12 from the lower surface of the instrument body 12, and is inserted into the insertion hole 22 and the insertion hole 22 through the plurality of ventilation holes 53 of the socket device 13. A flow of air that flows upward through a gap with the protruding portion 40 of the inserted lamp device 14 and is exhausted from the exhaust hole 51 to above the instrument body 12 is generated.

  With this air flow, the heat conducted to the protrusion 40 can be efficiently dissipated into the air, and as a result, the heat dissipation of the heat generated by the LED element 47 can be improved.

  The end face portion 42 and the flat plate portion 17 are in contact with each other, and the flat plate portion 17 is not shown. However, when the heat radiation of the lamp device 14 is sufficiently performed by the air cooling action of the fan 52, the flat plate portion 17 is provided. May not be provided.

  Next, FIG. 6 shows a fourth embodiment. FIG. 6 is a perspective view of the lighting device.

  In the third embodiment shown in FIG. 5, a fin 54 is provided on the protrusion 40 of the lamp device 14, and the fin 54 increases the contact area with the air flowing through the operation of the fan 52 to dissipate heat. Can be improved.

It is sectional drawing which assembled the instrument main body of the illuminating device which shows the 1st Embodiment of this invention, a lamp device, and a socket apparatus. It is a perspective view of the decomposition | disassembly state of a lamp device same as the above. It is a perspective view of a lamp device and a socket device same as the above. It is sectional drawing of the illuminating device which shows 2nd Embodiment same as the above. It is a perspective view of the illuminating device which shows 3rd Embodiment same as the above. It is a perspective view of the illuminating device which shows 4th Embodiment same as the above.

Explanation of symbols

11 Lighting equipment
12 Instrument body
13 Socket device
14 Lamp device
22 Insertion hole
31 Base part
32 LED board
36 base
39 LED board mounting part
40 Protrusion
41 Wall
47 LED elements as LEDs

Claims (3)

A base part having a base formed integrally with a flat plate-like LED board mounting part and a protruding part protruding from the center of one surface side of the LED board mounting part;
An LED board on which LEDs are mounted and attached to the other side of the base LED board mounting portion;
A lamp device comprising: The lamp device according to claim 1, wherein a wall portion is formed integrally with a peripheral portion of the base LED board mounting portion. An instrument body provided with a socket device having an insertion hole;
The lamp device according to claim 1 or 2, wherein the lamp device is detachably attached to the socket device, the projecting portion is inserted through the insertion hole of the socket device, and the end surface of the projecting portion is in contact with the fixture main body so as to be able to conduct heat.
An illumination device comprising:

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