JP2010153532A - Reflow soldering apparatus - Google Patents

Reflow soldering apparatus Download PDF

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JP2010153532A
JP2010153532A JP2008329103A JP2008329103A JP2010153532A JP 2010153532 A JP2010153532 A JP 2010153532A JP 2008329103 A JP2008329103 A JP 2008329103A JP 2008329103 A JP2008329103 A JP 2008329103A JP 2010153532 A JP2010153532 A JP 2010153532A
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hot air
circulation system
substrate
blower
reflow soldering
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JP5075806B2 (en
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Hachiji Yokota
八治 横田
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Yokota Technica Co Ltd
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Yokota Technica Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

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  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a reflow soldering apparatus reducing the number of motors for driving a fan. <P>SOLUTION: A reflow soldering apparatus blows heated air from upper and lower parts of a substrate 7 by a heated air circulation apparatus 8 to solder electronic components on a substrate. The heated air circulation apparatus has: an upper circulation system having a fan 9A that sends heated air to an upper surface of the substrate, a heated air blowing means 12A that blows the heated air to the upper surface of the substrate, an inhalation duct 14 that is connected to an inhalation opening of the fan 9A and opens within a furnace 1 provided above a conveyer 5 and an exhaust duct 13A that connects the inhalation opening of the fan 9A with the heated air blowing means 12A; and a lower circulation system having a fan 9B that sends heated air to a lower surface of the substrate, a heated air blowing means 12B that blows the heated air to the lower surface of the substrate, and an exhaust duct 13B that connects an inhalation opening of the fan 9B with the heated air blowing means 12B. The fans 9A and 9B of the upper and lower circulation systems are driven by a common motor 10, and arranged in the furnace 1 provided below the conveyer 5. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、リフロー半田付け装置に関し、特に送風機駆動用のモータの数を低減したリフロー半田付け装置に関する。   The present invention relates to a reflow soldering apparatus, and more particularly to a reflow soldering apparatus in which the number of motors for driving a blower is reduced.

リフロー半田付け装置は、熱風循環装置を備える炉内を電子部品が搭載された基板をコンベヤで搬送しながら、熱風を基板の上下から基板に吹き付けて電子部品を基板に半田付けする。このように、リフロー半田付け装置は熱風を基板の上下から基板に吹き付けるために、熱風循環装置において熱風を送風するための送風機は、基板の上面に熱風を送風するための上側循環系の送風機と、基板の下面に熱風を送風するための下側循環系の送風機とが設けられている。そして従来は、上側循環系の送風機はコンベヤよりも上側の炉内に配置され、下側循環系の送風機はコンベヤよりも下側の炉内に配置されており、これらの送風機を駆動するためのモータが炉の上側及び下側にそれぞれ設置されていた（特許文献１及び特許文献２参照）。
特開２００２−１３４９０５号公報 特開昭６３−１８０３６８号公報 The reflow soldering apparatus solders an electronic component to the substrate by blowing hot air onto the substrate from above and below the substrate while conveying the substrate on which the electronic component is mounted in a furnace equipped with a hot air circulation device. In this way, the reflow soldering device blows hot air from above and below the substrate to the substrate, and the blower for blowing hot air in the hot air circulation device is an upper circulation system blower for blowing hot air on the upper surface of the substrate. A lower circulation fan for blowing hot air on the lower surface of the substrate is provided. Conventionally, the upper circulation system fan is arranged in the furnace above the conveyor, and the lower circulation system fan is arranged in the furnace below the conveyor, for driving these fans. Motors were installed on the upper and lower sides of the furnace, respectively (see Patent Document 1 and Patent Document 2).
JP 2002-134905 A JP-A-63-180368

また、上側循環系の送風機と下側循環系の送風機をそれぞれ個別に設けずに、１つの送風機で基板の上下から熱風を基板に吹き付けるように構成したリフロー半田付け装置も提案されている（特許文献３参照）。
特開平２−２０５２５６号公報 There has also been proposed a reflow soldering apparatus in which hot air is blown from the top and bottom of a board with one blower without separately providing an upper circulation fan and a lower circulation fan (patent) Reference 3).
JP-A-2-205256

本発明は、上側循環系の送風機と下側循環系の送風機を備えたリフロー半田付け装置において、前記２系統の送風機を共通のモータで駆動するようにすることにより、送風機駆動用のモータの数を低減したリフロー半田付け装置を提供することを目的とする。   The present invention relates to a reflow soldering apparatus including an upper circulation system blower and a lower circulation system blower, by driving the two systems of blowers with a common motor, so that the number of blower driving motors is increased. An object of the present invention is to provide a reflow soldering apparatus in which the above is reduced.

上記課題を解決するために本発明は次の解決手段を採る。すなわち、
本発明は、熱風循環装置を備える炉内を電子部品が搭載された基板をコンベヤで搬送しながら、熱風を基板の上下から基板に吹き付けて電子部品を基板に半田付けするリフロー半田付け装置において、
前記熱風循環装置が、基板の上面に熱風を送風するための送風機、熱風を基板の上面に吹き出すための熱風吹出手段、送風機の吸入口に接続されコンベヤよりも上側の炉内まで延びて開口する吸入用ダクト、及び送風機の吐出口と熱風吹出手段とを接続する吐出用ダクトを備えた上側循環系と、基板の下面に熱風を送風するための送風機、熱風を基板の下面に吹き出すための熱風吹出手段、及び送風機の吐出口と熱風吹出手段とを接続する吐出用ダクトを備えた下側循環系とを有しており、
前記上側循環系と下側循環系の２系統の送風機は共通のモータで駆動され、コンベヤよりも下側の炉内に配置されていることを特徴とする。 In order to solve the above problems, the present invention employs the following means. That is,
The present invention provides a reflow soldering apparatus for soldering an electronic component to a substrate by blowing hot air onto the substrate from above and below the substrate while conveying the substrate on which the electronic component is mounted in a furnace provided with a hot air circulation device.
The hot air circulation device is connected to a blower for blowing hot air to the upper surface of the substrate, hot air blowing means for blowing hot air to the upper surface of the substrate, and extends to the furnace above the conveyor and connected to the suction port of the blower. An intake duct, an upper circulation system having a discharge duct for connecting a discharge port of a blower and hot air blowing means, a blower for blowing hot air to the lower surface of the substrate, and hot air for blowing hot air to the lower surface of the substrate And a lower circulation system having a discharge duct, and a discharge duct connecting the discharge port of the blower and the hot air blowing means,
The two systems of the upper circulation system and the lower circulation system are driven by a common motor, and are arranged in a furnace below the conveyor.

上記において、前記上側循環系と下側循環系の送風機は、下側循環系の送風機が上位置、上側循環系の送風機が下位置に同心状に並んで配置して、炉の下側に設置された共通のモータに接続されていることが好ましい。この場合、前記下側循環系の外側に前記上側循環系が形成されていることが好ましい。   In the above, the upper circulation system and the lower circulation system blower are arranged on the lower side of the furnace with the lower circulation system blower concentrically arranged at the upper position and the upper circulation system blower concentrically arranged at the lower position. It is preferable to be connected to a common motor. In this case, it is preferable that the upper circulation system is formed outside the lower circulation system.

上記では、上側循環系と下側循環系の送風機をコンベヤよりも下側の炉内に配置したが、本発明はこれに限ることはなく、上側循環系と下側循環系の送風機をコンベヤよりも上側の炉内に配置するようにしてもよい。すなわち、熱風循環装置を備える炉内を電子部品が搭載された基板をコンベヤで搬送しながら、熱風を基板の上下から基板に吹き付けて電子部品を基板に半田付けするリフロー半田付け装置において、
前記熱風循環装置が、基板の上面に熱風を送風するための送風機、熱風を基板の上面に吹き出すための熱風吹出手段、及び送風機の吐出口と熱風吹出手段とを接続する吐出用ダクトを備えた上側循環系と、基板の下面に熱風を送風するための送風機、熱風を基板の下面に吹き出すための熱風吹出手段、送風機の吸入口に接続されコンベヤよりも下側の炉内まで延びて開口する吸入用ダクト、及び送風機の吐出口と熱風吹出手段とを接続する吐出用ダクトを備えた下側循環系とを有しており、
前記上側循環系と下側循環系の２系統の送風機は共通のモータで駆動され、コンベヤよりも上側の炉内に配置されていることを特徴とする。 In the above, the upper circulation system and the lower circulation system blower are arranged in the furnace below the conveyor, but the present invention is not limited to this, and the upper circulation system and the lower circulation system blower are arranged from the conveyor. May also be placed in the upper furnace. That is, in a reflow soldering apparatus for soldering an electronic component to a substrate by blowing hot air onto the substrate from above and below the substrate while conveying the substrate on which the electronic component is mounted in a furnace provided with a hot air circulation device,
The hot air circulation device includes a blower for blowing hot air on the upper surface of the substrate, hot air blowing means for blowing hot air on the upper surface of the substrate, and a discharge duct connecting the discharge port of the blower and the hot air blowing means. An upper circulation system, a blower for blowing hot air to the lower surface of the substrate, hot air blowing means for blowing hot air to the lower surface of the substrate, connected to the suction port of the blower and extending into the furnace below the conveyor and opening A suction duct, and a lower circulation system having a discharge duct connecting the discharge port of the blower and the hot air blowing means;
The two systems of the upper circulation system and the lower circulation system are driven by a common motor, and are arranged in a furnace on the upper side of the conveyor.

上記において、前記上側循環系と下側循環系の送風機は、上側循環系の送風機が下位置、下側循環系の送風機が上位置に同心状に並んで配置して、炉の上側に設置された共通のモータに接続されていることが好ましい。この場合、前記上側循環系の外側に前記下側循環系が形成されていることが好ましい。   In the above, the blower of the upper circulation system and the lower circulation system is disposed on the upper side of the furnace, with the upper circulation system blower concentrically arranged at the lower position and the lower circulation system blower concentrically arranged at the upper position. It is preferable to be connected to a common motor. In this case, it is preferable that the lower circulation system is formed outside the upper circulation system.

上側循環系の送風機と下側循環系の送風機を共通のモータで駆動するように構成したため、モータの数を低減できる。モータの数が減ることで省エネ効果がある。窒素リフロー炉の場合はモータ軸部の窒素漏れ防止のシール部が減るので窒素の漏れを低減できる。モータを支持するためのモータベースや重量フレームを削減できるので装置の軽量化を図れる。従来の装置は下側のメンテナンス性がよくなかったが、モータを炉の上側のみに配置すれば下側のメンテナンスを軽減できる。   Since the upper circulation fan and the lower circulation fan are driven by a common motor, the number of motors can be reduced. Energy saving effect is achieved by reducing the number of motors. In the case of a nitrogen reflow furnace, the leakage of nitrogen can be reduced because the number of sealing portions for preventing nitrogen leakage in the motor shaft is reduced. Since the motor base and weight frame for supporting the motor can be reduced, the weight of the apparatus can be reduced. Although the conventional apparatus is not good in maintenance on the lower side, if the motor is arranged only on the upper side of the furnace, the maintenance on the lower side can be reduced.

以下、本発明の一実施形態を図面を参照しながら説明する。   Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

リフロー半田付け装置は、図１に示されているように、炉１内に、３個の予熱室２、１個のリフロー室３、１個の冷却室４をコンベヤ５の搬送ラインに沿って順に有している。６は、各室２，３，４を仕切る仕切壁である。炉１内には、半田の酸化を防止するために不活性ガス、本実施形態では窒素ガスが供給されており、電子部品を搭載したプリント基板７がコンベヤ５によって炉１内を搬送される。電子部品を搭載したプリント基板７は、半田付け箇所にペースト状のクリーム半田が塗られている。   As shown in FIG. 1, the reflow soldering apparatus includes three preheating chambers 2, one reflow chamber 3, and one cooling chamber 4 in a furnace 1 along a conveyor 5 conveying line. Have in order. Reference numeral 6 denotes a partition wall that partitions the chambers 2, 3, and 4. In the furnace 1, an inert gas, in this embodiment, nitrogen gas, is supplied to prevent solder oxidation, and the printed circuit board 7 on which electronic components are mounted is conveyed through the furnace 1 by the conveyor 5. The printed circuit board 7 on which electronic components are mounted has paste-like cream solder applied to the soldering locations.

予熱室２及びリフロー室３の各室には熱風循環装置８が設けられている。以下、リフロー室３の熱風循環装置８について説明するが、予熱室２の熱風循環装置８も同じように構成されている。   A hot air circulation device 8 is provided in each of the preheating chamber 2 and the reflow chamber 3. Hereinafter, although the hot air circulation device 8 in the reflow chamber 3 will be described, the hot air circulation device 8 in the preheating chamber 2 is configured in the same manner.

熱風循環装置８は上側循環系と下側循環系とを有している。図２に示されているように、上側循環系は上側循環系の送風機９Ａ、ヒータ１１Ａ、熱風吹出ケーシング部材１２Ａ、吐出用ダクト１３Ａ及び吸入用ダクト１４を有しており、下側循環系は下側循環系の送風機９Ｂ、ヒータ１１Ｂ、熱風吹出ケーシング部材１２Ｂ及び吐出用ダクト１３Ｂを有しており、上側循環系の送風機９Ａと下側循環系の送風機９Ｂは１個の共通のモータ１０で駆動されるように構成されている。   The hot air circulation device 8 has an upper circulation system and a lower circulation system. As shown in FIG. 2, the upper circulation system has an upper circulation system fan 9A, a heater 11A, a hot air blowing casing member 12A, a discharge duct 13A, and a suction duct 14. It has a lower circulation fan 9B, a heater 11B, a hot air blowing casing member 12B, and a discharge duct 13B. The upper circulation fan 9A and the lower circulation fan 9B are one common motor 10. It is configured to be driven.

上側循環系の送風機９Ａは、コンベヤ５上の電子部品を搭載したプリント基板７の上面に熱風を送風するためのものである。下側循環系の送風機９Ｂは、コンベヤ５上の電子部品を搭載したプリント基板７の下面に熱風を送風するためのものである。上側循環系と下側循環系の送風機９Ａ，９Ｂは垂直な回転軸を備え、下側循環系の送風機９Ｂが上位置、上側循環系の送風機９Ａが下位置に同心状に２段に重なってリフロー室３内の下部に配置し、炉１の下側に設置された１個の共通のモータ１０の回転軸に接続され、１個の共通のモータ１０によって駆動されるように構成されている。   The upper circulating fan 9 </ b> A is for blowing hot air to the upper surface of the printed circuit board 7 on which the electronic components on the conveyor 5 are mounted. The lower circulation system blower 9 </ b> B is for blowing hot air to the lower surface of the printed circuit board 7 on which the electronic components on the conveyor 5 are mounted. The upper circulation system and the lower circulation system fans 9A and 9B have vertical rotation shafts, and the lower circulation system fan 9B is concentrically overlapped in two stages at the upper position and the upper circulation system fan 9A is concentrically disposed at the lower position. It arrange | positions in the lower part in the reflow chamber 3, is connected to the rotating shaft of one common motor 10 installed in the lower side of the furnace 1, and is comprised so that it may drive with the one common motor 10. .

下側循環系の送風機９Ｂは、上面に開口する吸入口がコンベヤ５よりも下側のリフロー室３内に臨み、外周に開口する吐出口が吐出用ダクト１３Ｂを介して下側循環系の熱風吹出ケーシング部材１２Ｂに接続している。吐出用ダクト１３Ｂは送風機９Ｂの左右に一対設けられている。下側循環系の熱風吹出ケーシング部材１２Ｂは、熱風を電子部品を搭載したプリント基板７の下面に吹き出すための熱風吹出口をコンベヤ５上の基板７に臨む側に複数有しており、コンベヤ５よりも下側のリフロー室３内に、コンベヤ５上の基板７に対向するように配置されて設けられている。   The lower circulation system blower 9B has a suction port that opens to the upper surface facing the reflow chamber 3 below the conveyor 5, and a discharge port that opens to the outer periphery via the discharge duct 13B. It is connected to the blowout casing member 12B. A pair of discharge ducts 13B are provided on the left and right of the blower 9B. The lower circulating hot air blowing casing member 12B has a plurality of hot air outlets for blowing hot air to the lower surface of the printed circuit board 7 on which electronic components are mounted on the side facing the substrate 7 on the conveyor 5. In the lower reflow chamber 3, it is arranged so as to face the substrate 7 on the conveyor 5.

上側循環系の送風機９Ａは、下面に開口する吸入口に吸入用ダクト１４が接続し、吸入用ダクト１４はコンベヤ５よりも上側のリフロー室３内まで延びて、リフロー室３の上部において開口している。吸入用ダクト１４は送風機９Ａの左右に延びてリフロー室３の上部の左右に一対の開口先端部を備えている。上側循環系の送風機９Ａの外周に開口する吐出口は吐出用ダクト１３Ａを介して上側循環系の熱風吹出ケーシング部材１２Ａに接続している。吐出用ダクト１３Ａは送風機９Ａの左右に一対設けられている。上側循環系の熱風吹出ケーシング部材１２Ａは、熱風を電子部品を搭載したプリント基板７の上面に吹き出すための熱風吹出口をコンベヤ５上の基板７に臨む側に複数有しており、コンベヤ５よりも上側のリフロー室３内に、コンベヤ５上の基板７に対向するように配置されて設けられている。   The upper circulating fan 9A has a suction duct 14 connected to a suction port that opens on the lower surface, and the suction duct 14 extends into the reflow chamber 3 above the conveyor 5 and opens at the top of the reflow chamber 3. ing. The suction duct 14 extends to the left and right of the blower 9 </ b> A and includes a pair of opening tips on the left and right of the upper part of the reflow chamber 3. The discharge port that opens to the outer periphery of the upper circulation fan 9A is connected to the hot air blowing casing member 12A of the upper circulation system via the discharge duct 13A. A pair of discharge ducts 13A is provided on the left and right of the blower 9A. The hot air blowing casing member 12A of the upper circulation system has a plurality of hot air outlets on the side facing the substrate 7 on the conveyor 5 for blowing hot air to the upper surface of the printed circuit board 7 on which electronic components are mounted. Are disposed in the upper reflow chamber 3 so as to face the substrate 7 on the conveyor 5.

上側循環系のヒータ１１Ａは、上側循環系の熱風吹出ケーシング部材１２Ａの上方の空間部に配置されている。下側循環系のヒータ１１Ｂは、下側循環系の熱風吹出ケーシング部材１２Ｂの下方の空間部に配置されている。   The upper circulation system heater 11A is arranged in a space above the upper circulation system hot air blowing casing member 12A. The lower circulation system heater 11B is arranged in a space below the lower circulation system hot air blowing casing member 12B.

冷却室４には冷却風循環装置１５が設けられている。冷却風循環装置１５は、上記熱風循環装置８とはヒータ１１Ａ，１１Ｂを備えていない点でのみ相違し、他の構成は同じである。   The cooling chamber 4 is provided with a cooling air circulation device 15. The cooling air circulation device 15 is different from the hot air circulation device 8 only in that the heaters 11A and 11B are not provided, and the other configurations are the same.

以下、上記リフロー半田付け装置の動作を説明する。   Hereinafter, the operation of the reflow soldering apparatus will be described.

電子部品を搭載したプリント基板７は、炉１の入口側でコンベヤ５に載せられ、コンベヤ５によって炉１内を搬送される。予熱室２とリフロー室３と冷却室４では、各室２，３，４内の上側循環系の送風機９Ａと下側循環系の送風機９Ｂがモータ１０によって回転駆動される。   The printed circuit board 7 on which electronic components are mounted is placed on the conveyor 5 on the entrance side of the furnace 1, and is conveyed through the furnace 1 by the conveyor 5. In the preheating chamber 2, the reflow chamber 3, and the cooling chamber 4, the upper circulation fan 9 </ b> A and the lower circulation fan 9 </ b> B in each of the chambers 2, 3, 4 are rotationally driven by the motor 10.

以下、リフロー室３内における熱風の流れを説明する。   Hereinafter, the flow of hot air in the reflow chamber 3 will be described.

先ず、熱風がコンベヤ５上の電子部品を搭載したプリント基板７の上面に吹き付けられる場合を説明する。 First, a case where hot air is blown onto the upper surface of the printed circuit board 7 on which electronic components on the conveyor 5 are mounted will be described.

上側循環系の送風機９Ａによりヒータ１１Ａを通って加熱された熱風は、吸入用ダクト１４の先端に開口している吸入口から吸入用ダクト１４に入る。熱風は、吸入用ダクト１４内を流れて、上側循環系の送風機９Ａの吸入口から吸入され、吐出口から吐出用ダクト１３Ａに吐出される。熱風は、吐出用ダクト１３Ａ内を流れて、上側循環系の熱風吹出ケーシング部材１２Ａ内に流入し、複数の熱風吹出口からコンベヤ５上の電子部品を搭載したプリント基板７の上面に吹き付けられる。   The hot air heated through the heater 11 </ b> A by the upper circulation fan 9 </ b> A enters the suction duct 14 through the suction port opened at the tip of the suction duct 14. The hot air flows through the suction duct 14, is sucked from the suction port of the upper circulating fan 9 </ b> A, and is discharged from the discharge port to the discharge duct 13 </ b> A. The hot air flows through the discharge duct 13A, flows into the hot air blowing casing member 12A of the upper circulation system, and is blown onto the upper surface of the printed circuit board 7 on which the electronic components on the conveyor 5 are mounted from a plurality of hot air outlets.

電子部品を搭載したプリント基板７の上面に吹き付けられた熱風は、電子部品を搭載したプリント基板７を加熱した後、リフロー室３内の空間部を上方へ流れ、ヒータ１１Ａを通過して加熱され、吸入用ダクト１４に流入する。   The hot air blown on the upper surface of the printed circuit board 7 on which the electronic component is mounted heats the printed circuit board 7 on which the electronic component is mounted, then flows upward through the space in the reflow chamber 3 and is heated through the heater 11A. And flows into the suction duct 14.

以下、熱風は、上記のようにしてリフロー室３内を循環し、電子部品を搭載したプリント基板７を上側から加熱する。   Hereinafter, the hot air circulates in the reflow chamber 3 as described above, and heats the printed circuit board 7 on which electronic components are mounted from above.

次に、熱風がコンベヤ５上の電子部品を搭載したプリント基板７の下面に吹き付けられる場合を説明する。 Next, the case where hot air is sprayed on the lower surface of the printed circuit board 7 carrying the electronic components on the conveyor 5 will be described.

下側循環系の送風機９Ｂによりヒータ１１Ｂを通って加熱された熱風は、下側循環系の送風機９Ｂの吸入口から吸入され、吐出口から吐出用ダクト１３Ｂに吐出される。熱風は、吐出用ダクト１３Ｂ内を流れて、下側循環系の熱風吹出ケーシング部材１２Ｂ内に流入し、複数の熱風吹出口からコンベヤ５上の電子部品を搭載したプリント基板７の下面に吹き付けられる。   The hot air heated through the heater 11B by the lower circulation fan 9B is sucked from the suction port of the lower circulation fan 9B and discharged from the discharge port to the discharge duct 13B. The hot air flows through the discharge duct 13B, flows into the hot air blowing casing member 12B of the lower circulation system, and is blown from the plurality of hot air outlets to the lower surface of the printed circuit board 7 on which the electronic components on the conveyor 5 are mounted. .

電子部品を搭載したプリント基板７の下面に吹き付けられた熱風は、電子部品を搭載したプリント基板７を加熱した後、リフロー室３内の空間部を下方へ流れ、ヒータ１１Ｂを通過して加熱され、下側循環系の送風機９Ｂに吸入される。   The hot air blown to the lower surface of the printed circuit board 7 on which the electronic component is mounted heats the printed circuit board 7 on which the electronic component is mounted, then flows downward through the space in the reflow chamber 3 and is heated through the heater 11B. Then, the air is sucked into the blower 9B of the lower circulation system.

以下、熱風は、上記のようにしてリフロー室３内を循環し、電子部品を搭載したプリント基板７を下側から加熱する。   Hereinafter, the hot air circulates in the reflow chamber 3 as described above, and heats the printed circuit board 7 on which electronic components are mounted from below.

以上のようにして、電子部品を搭載したプリント基板７は、コンベヤ５によって炉１内を搬送されながら、プリント基板上のクリーム半田が、予熱室２内を循環する熱風（加熱された雰囲気ガス）によって所定の温度に加熱され、更に、リフロー室３内を循環する熱風（加熱された雰囲気ガス）によって加熱溶融され、冷却室４で冷却室４内を循環する冷却風（雰囲気ガス）によって溶融半田が冷却固化され、電子部品が基板上に半田付けされる。   As described above, the printed circuit board 7 on which electronic components are mounted is hot air (heated atmospheric gas) in which the cream solder on the printed circuit board circulates in the preheating chamber 2 while being conveyed through the furnace 1 by the conveyor 5. In addition, the solder is heated and melted by hot air (heated atmospheric gas) circulating in the reflow chamber 3 and melted solder by cooling air (atmospheric gas) circulating in the cooling chamber 4 in the cooling chamber 4. Is cooled and solidified, and the electronic component is soldered onto the substrate.

なお、上記では、上側循環系と下側循環系の送風機９Ａ，９Ｂをコンベヤ５よりも下側の炉１内に配置し、モータ１０を炉１の下側に配置した例を示したが、本発明はこれに限ることは無く、上側循環系と下側循環系の送風機をコンベヤ５よりも上側の炉１内に配置し、モータを炉１の上側に配置するように構成してもよい。   In the above, an example in which the upper circulation system and the lower circulation system fans 9A and 9B are arranged in the furnace 1 below the conveyor 5 and the motor 10 is arranged below the furnace 1 is shown. The present invention is not limited to this, and the fan of the upper circulation system and the lower circulation system may be arranged in the furnace 1 above the conveyor 5 and the motor may be arranged above the furnace 1. .

また、本実施形態では炉１内の雰囲気ガスとして窒素ガスを使用したものを示したが、雰囲気ガスは窒素ガスに限らない。例えば、空気を使用する場合もある。   Moreover, although what used nitrogen gas as an atmospheric gas in the furnace 1 was shown in this embodiment, atmospheric gas is not restricted to nitrogen gas. For example, air may be used.

本発明の一実施形態であるリフロー半田付け装置を示す正面図である。It is a front view which shows the reflow soldering apparatus which is one Embodiment of this invention. リフロー室を示す縦断面図である。It is a longitudinal cross-sectional view which shows a reflow chamber.

符号の説明Explanation of symbols

１・・炉、２・・予熱室、３・・リフロー室、４・・冷却室、５・・コンベヤ、６・・仕切壁、７・・電子部品を搭載したプリント基板、８・・熱風循環装置、９Ａ・・上側循環系の送風機、９Ｂ・・下側循環系の送風機、１０・・モータ、１１Ａ・・上側循環系のヒータ、１１Ｂ・・下側循環系のヒータ、１２Ａ・・上側循環系の熱風吹出ケーシング部材、１２Ｂ・・下側循環系の熱風吹出ケーシング部材、１３Ａ・・上側循環系の吐出用ダクト、１３Ｂ・・下側循環系の吐出用ダクト、１４・・上側循環系の吸入用ダクト、１５・・冷却風循環装置。   1 .... Furnace 2 .... Preheating room 3 .... Reflow room 4 .... Cooling room 5 .... Conveyor 6, ... Partition wall, 7 .... Printed circuit board with electronic parts, 8 .... Hot air circulation Equipment, 9A ... Upper circulation system fan, 9B ... Lower circulation system fan, 10 ... Motor, 11A ... Upper circulation system heater, 11B ... Lower circulation system heater, 12A ... Upper circulation Hot air outlet casing member, 12B..Lower circulation system hot air outlet casing member, 13A..Upper circulation system discharge duct, 13B..Lower circulation system discharge duct, 14 .... Upper circulation system Intake duct, 15 .... Cooling air circulation device.

Claims (6)

熱風循環装置を備える炉内を電子部品が搭載された基板をコンベヤで搬送しながら、熱風を基板の上下から基板に吹き付けて電子部品を基板に半田付けするリフロー半田付け装置において、
前記熱風循環装置が、基板の上面に熱風を送風するための送風機、熱風を基板の上面に吹き出すための熱風吹出手段、送風機の吸入口に接続されコンベヤよりも上側の炉内まで延びて開口する吸入用ダクト、及び送風機の吐出口と熱風吹出手段とを接続する吐出用ダクトを備えた上側循環系と、基板の下面に熱風を送風するための送風機、熱風を基板の下面に吹き出すための熱風吹出手段、及び送風機の吐出口と熱風吹出手段とを接続する吐出用ダクトを備えた下側循環系とを有しており、
前記上側循環系と下側循環系の２系統の送風機は共通のモータで駆動され、コンベヤよりも下側の炉内に配置されていることを特徴とするリフロー半田付け装置。 In a reflow soldering apparatus that solders an electronic component to a substrate by blowing hot air onto the substrate from above and below the substrate while conveying the substrate on which the electronic component is mounted in a furnace equipped with a hot air circulation device,
The hot air circulation device is connected to a blower for blowing hot air to the upper surface of the substrate, hot air blowing means for blowing hot air to the upper surface of the substrate, and extends to the furnace above the conveyor and connected to the suction port of the blower. An intake duct, an upper circulation system having a discharge duct for connecting a discharge port of a blower and hot air blowing means, a blower for blowing hot air to the lower surface of the substrate, and hot air for blowing hot air to the lower surface of the substrate And a lower circulation system having a discharge duct, and a discharge duct connecting the discharge port of the blower and the hot air blowing means,
The reflow soldering apparatus is characterized in that the two circulation fans of the upper circulation system and the lower circulation system are driven by a common motor and are arranged in a furnace below the conveyor. 前記上側循環系と下側循環系の送風機は、下側循環系の送風機が上位置、上側循環系の送風機が下位置に同心状に並んで配置して、炉の下側に設置された共通のモータに接続されていることを特徴とする請求項１記載のリフロー半田付け装置。   The upper circulation system and the lower circulation system are arranged in a concentric manner with the lower circulation system fan located at the upper position and the upper circulation system fan located at the lower position. The reflow soldering apparatus according to claim 1, wherein the reflow soldering apparatus is connected to a motor. 前記下側循環系の外側に前記上側循環系が形成されていることを特徴とする請求項２記載のリフロー半田付け装置。   3. The reflow soldering apparatus according to claim 2, wherein the upper circulation system is formed outside the lower circulation system. 熱風循環装置を備える炉内を電子部品が搭載された基板をコンベヤで搬送しながら、熱風を基板の上下から基板に吹き付けて電子部品を基板に半田付けするリフロー半田付け装置において、
前記熱風循環装置が、基板の上面に熱風を送風するための送風機、熱風を基板の上面に吹き出すための熱風吹出手段、及び送風機の吐出口と熱風吹出手段とを接続する吐出用ダクトを備えた上側循環系と、基板の下面に熱風を送風するための送風機、熱風を基板の下面に吹き出すための熱風吹出手段、送風機の吸入口に接続されコンベヤよりも下側の炉内まで延びて開口する吸入用ダクト、及び送風機の吐出口と熱風吹出手段とを接続する吐出用ダクトを備えた下側循環系とを有しており、
前記上側循環系と下側循環系の２系統の送風機は共通のモータで駆動され、コンベヤよりも上側の炉内に配置されていることを特徴とするリフロー半田付け装置。 In a reflow soldering apparatus that solders an electronic component to a substrate by blowing hot air onto the substrate from above and below the substrate while conveying the substrate on which the electronic component is mounted in a furnace equipped with a hot air circulation device,
The hot air circulation device includes a blower for blowing hot air on the upper surface of the substrate, hot air blowing means for blowing hot air on the upper surface of the substrate, and a discharge duct connecting the discharge port of the blower and the hot air blowing means. An upper circulation system, a blower for blowing hot air to the lower surface of the substrate, hot air blowing means for blowing hot air to the lower surface of the substrate, connected to the suction port of the blower and extending into the furnace below the conveyor and opening A suction duct, and a lower circulation system having a discharge duct connecting the discharge port of the blower and the hot air blowing means;
The reflow soldering apparatus is characterized in that the two circulation fans of the upper circulation system and the lower circulation system are driven by a common motor and are disposed in a furnace above the conveyor. 前記上側循環系と下側循環系の送風機は、上側循環系の送風機が下位置、下側循環系の送風機が上位置に同心状に並んで配置して、炉の上側に設置された共通のモータに接続されていることを特徴とする請求項４記載のリフロー半田付け装置。   The upper circulation system and the lower circulation system are arranged on the upper side of the furnace with the upper circulation system fan arranged concentrically at the lower position and the lower circulation system fan arranged at the upper position. The reflow soldering apparatus according to claim 4, wherein the reflow soldering apparatus is connected to a motor. 前記上側循環系の外側に前記下側循環系が形成されていることを特徴とする請求項５記載のリフロー半田付け装置。   6. The reflow soldering apparatus according to claim 5, wherein the lower circulation system is formed outside the upper circulation system.
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