JP2010135249A - Socket for semiconductor package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a socket for a semiconductor package without increasing a load applied to an electrode part from a pin so much, by surely contacting a pin with an electrode pad of a printed board, even when flatness of the printed board is low. <P>SOLUTION: This socket has a socket body loaded with an LGA package having a large number of electrodes arranged in a grating shape and installed on the printed board, and has a large number of expandable pins 13 (a first pin 13A, and a second pin 13B) having one end contacting with the electrodes and having the other end connecting with an electrode of the printed board. Among the large number of pins 13, the first pin 13A corresponding to a part recessed to the opposite side of the socket body in the printed board, is formed longer than the other second pin 13B. A spring constant reducing part 18 is arranged inside the first pin 13A for reducing a spring constant. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a semiconductor package socket into which an LSI package (semiconductor package) such as a BGA package or an LGA package is loaded.

  LSI packages such as BGA (Ball grid array) packages and LGA (Land grid array) packages, which are known as one of semiconductor packages, are inspected by energizing them while they are loaded in an inspection socket of an inspection device. . Also, this type of LSI package can be mounted on a printed wiring board so as to be detachable by using a socket.

  As a conventional LSI package socket, for example, there is one configured as shown in FIGS. The LSI package socket 1 shown in FIG. 4 includes a socket body 4 having a loading unit 3 into which an LSI package 2 (LGA package in the figure) is loaded, and an LSI package 2 for holding the LSI package 2 in the loading unit 3. A cover 5 and a large number of pins 6 provided on the socket body 4 are provided.

The socket body 4 is formed in a quadrangular shape in a plan view, and is attached to a printed circuit board (PWB) 8 by mounting bolts 7 (see FIG. 5) penetrating the four corners, for example. The cover 5 is swingably supported on one side of the socket body 4 and is configured to sandwich the LSI package 2 in cooperation with the socket body 4.
In FIG. 4, the pin 6 is erected on the socket body 4 so that its upper end portion contacts a large number of electrode pads 2a of the LSI package 2 and its lower end portion contacts an electrode pad (not shown) of the printed wiring board. ing.

  Examples of the pins 6 used in the conventional LSI package socket 1 include those described in Patent Document 1. The pin disclosed in Patent Document 1 is a barrel formed in a cylindrical shape, a pair of plungers movably held at both ends of the barrel, and a compression that biases these plungers in a direction protruding from the barrel. It consists of a coil spring.

  In order to inspect the LSI package 2 using the LSI package socket 1 configured as shown in FIGS. 4 and 5, the pins 6 are connected to the electrode pads of the printed circuit board 8 and the electrode pads 2 a of the LSI package 2. It is necessary to make sure that they are in contact with each other. When testing a high-speed, multi-pin LSI package in recent years, this type of LSI package consumes a relatively large amount of power. Is important.

JP 2006-200955 A

  The manufacturing accuracy of the LSI package socket 1 tends to decrease as the number of pins 6 increases at a narrow pitch. Further, the printed circuit board 8 and the LSI package 2 may be warped. For this reason, the conventional LSI package socket 1 has a problem that the possibility of contact failure of the pins 6 increases.

  FIGS. 5A and 5B show an example in which a contact failure between the pin 6 of the conventional LSI package socket 1 and the electrode pad of the printed circuit board 8 occurs. The recent printed circuit board 8 may be distorted due to a part having a low wiring density and a part having a high wiring density, and may be locally warped in a large printed circuit board.

For example, as shown in FIG. 5 (A), the socket mounting portion 8a of the printed circuit board 8 is warped so as to protrude upward, or as shown in FIG. 5 (B), the socket mounting is reversed. The part 8a may warp so as to be recessed with respect to the socket 1.
As shown in FIG. 5A, when the printed circuit board 8 warps in a convex shape with respect to the socket 1, the printed circuit board 8 is secured by fastening the four corners of the socket body 4 to the printed circuit board 8 with the mounting bolts 7. Warpage (contact failure) can be alleviated.

  However, as shown in FIG. 5B, when the printed circuit board 8 warps so as to be dented to the opposite side of the socket body 4, the pin 6 located at the center of the socket 1 and the electrode pad of the printed circuit board 8 There may be a gap S between the two. When the gap S is formed here, the pin 6 cannot contact the electrode pad, and the pin 6 causes a contact failure. Even if the pin 6 comes into contact with the electrode pad, the contact state is canceled by applying an impact or vibration to the printed circuit board 8 during use, and the power supply / GND / clock required for stable operation of the LSI package 2 etc. Supply may become unstable.

  If the pin 6 causes a contact failure, the LSI package 2 cannot be correctly inspected, the startup period of the inspection apparatus is increased, and the inspection apparatus and the LSI package 2 are mounted via the socket 1. The actual operation of the electric / electronic circuit device (not shown) is unstable. The reason why the start-up period of the inspection device is increased is that when the inspection result is not stable, the inspection is performed again to confirm the reproducibility of the result, and this re-inspection is repeated due to the poor contact of the pins 6. This is because it may be performed.

In order to prevent the contact between the electrode pad of the printed circuit board 8 and the pin 6 from becoming unstable, it is conceivable that the length of the pin 6 is formed longer only at the portion where the contact becomes unstable. However, if the pins 6 are simply formed long, the load applied from the pins 6 to the electrode pads of the printed circuit board 8 and the electrode pads 2a of the LSI package 2 when the socket 1 is attached to the printed circuit board 8 where no recess is formed. May increase, and these electrode portions may be damaged. If the increase in the load is significant, the plunger of the pin 6 may penetrate the electrode pad. In such a case, the circuit is short-circuited.
For this reason, the conventional LSI package socket 1 is required to prevent a contact failure between the pin 6 and the electrode portion while suppressing an increase in load applied to the electrode portion.

  The present invention has been made to solve such a problem, and even when the flatness of the printed circuit board is low, the pin reliably contacts the electrode pad of the printed circuit board and is added from the pin to the electrode portion. An object of the present invention is to provide a socket for a semiconductor package in which the load is not so large.

  To achieve this object, a socket for a semiconductor package according to the present invention has a loading portion into which a semiconductor package having a large number of electrodes arranged in a lattice shape is loaded, and a socket body attached to a printed circuit board, For a semiconductor package having a plurality of pins that are erected on the socket body so that one end contacts the electrode and the other end contacts the electrode of the printed circuit board, and the length of the pin changes due to deformation of a spring member provided therein. In the socket, a pin corresponding to a portion of the printed board that is recessed to the opposite side of the socket body in the printed circuit board is formed longer than the other pins, and the spring constant is reduced inside the pin. A part is provided.

  According to the present invention, in the above-described invention, the long pin is formed in a cylindrical body fixed to the socket body, and the first and first are held at both ends of the cylindrical body so as to be movable in the longitudinal direction of the cylindrical body. Two pin main bodies, and the spring member provided between the first pin main body and the second pin main body and biasing the first and second pin main bodies in a direction protruding from the cylindrical body. The spring constant reducing portion is configured by another spring member interposed between at least one of the first pin body and the second pin body and the spring member. is there.

  The present invention is the above invention, wherein the long pin is provided with a cylindrical body fixed to the socket body and a base portion fitted and inserted into the cylindrical body, and the cylindrical body is provided at both ends of the cylindrical body. First and second pin bodies held movably in the longitudinal direction, and the first and second pin bodies are provided between the first pin body and the second pin body so that the first and second pin bodies are cylindrical. A spring member made of a compression coil spring urging in a direction protruding from the base, and at the base of at least one of the first pin main body and the second pin main body in the longitudinal direction An insertion portion that overlaps an end portion of a spring member is formed, the spring member is formed in a number of turns that extends to the insertion portion, and the spring constant reduction portion is the insertion portion and a spring that extends to the insertion portion It is comprised from the said edge part of a member.

According to the present invention, the pin can be reliably brought into contact with the electrode in the portion recessed to the opposite side of the socket body in the printed circuit board. Since the spring constant of the long pin is reduced by the spring constant reducing portion, the load applied to the electrode from the pin is reduced.
Therefore, the stability of the measurement in the inspection of the semiconductor package is improved, and the repeatability when the inspection is repeated a plurality of times can be improved. Further, in the electric / electronic circuit device in which the semiconductor package is mounted on the printed board using the semiconductor package socket according to the present invention, the operation stability of the semiconductor package is improved.

(First embodiment)
Hereinafter, an embodiment of a semiconductor package socket according to the present invention will be described in detail with reference to FIGS. In this embodiment, a case where the present invention is applied to an LGA package socket into which an LGA package is loaded will be described. The socket according to this embodiment can be used to connect an LGA package to an inspection device or to mount an LGA package on a printed circuit board of an electric / electronic circuit device.

In FIG. 1, an LGA package socket 11 according to this embodiment includes a socket body 12, a number of pins 13 provided on the socket body 12, and a LGA package 14 in cooperation with the socket body 12. And a cover 15.
The socket body 12 is formed in a quadrangular shape in plan view, and is attached to the printed circuit board with mounting bolts (not shown) in a state where the socket body 12 is overlaid on the printed circuit board (not shown). Yes. The socket body 12 is formed with a loading portion 16 into which the LGA package 14 is detachably loaded. The loading portion 16 is formed so as to exhibit a recessed portion that opens upward in FIG. 1. The socket body 12 is formed into a predetermined shape using, for example, an elastomer as a base material.

The pin 13 is erected on the bottom portion 17 of the socket body 12 so as to penetrate the socket 13 in the vertical direction. Further, the pins 13 are respectively disposed at positions facing a large number of electrode pads 14 a provided in a lattice shape on the lower surface of the LGA package 14.
Of these pins 13, pins corresponding to portions that are recessed to the opposite side of the socket body 12 on the printed circuit board (hereinafter referred to as “first pins 13 </ b> A”) are other pins (hereinafter referred to as “first pins 13 </ b> A”). This pin is formed to have a longer overall length than the “second pin 13B”. In this embodiment, a first pin 13A is disposed at the center of the socket body 12, and a second pin 13B is disposed at a portion surrounding the first pin 13A. At both ends of the first pin 13A, a spring constant reducing unit 18 described later is provided.

  The position where the first pin 13A is provided is not limited to the central portion of the socket body 12 as long as the contact is physically unstable when the socket 11 is attached to the printed circuit board. Further, the length of the first pin 13A can be appropriately changed as long as the physical contact can be prevented from becoming unstable.

  As shown in FIGS. 2A and 2B, the first and second pins 13A and 13B are moved in the longitudinal direction of the barrel 21 at both ends of the barrel 21 formed in a cylindrical shape. A lower plunger 22 and an upper plunger 23 that are freely held, and a compression coil spring 24 as a spring member housed in the barrel 21 are provided. In this embodiment, the lower plunger 22 constitutes a first pin body according to the present invention, and the upper plunger 23 constitutes a second pin body according to the present invention. In the first and second pins 13A and 13B, the tip (lower end) of the lower plunger 22 is in contact with an electrode pad (not shown) of the printed circuit board, and the tip (upper end) of the upper plunger 23 is the LGA package 14. The socket body 12 is attached so as to be in contact with the electrode pad 14a.

  The barrel 21 is formed in a predetermined shape from a conductive material, and is fixed to the bottom 17 of the socket body 12. The barrel 21 of the first pin 13A and the barrel 21 of the second pin 13B are the same. In order to prevent the plungers 22 and 23 from falling off, both ends of the barrel 21 are, for example, caulked after the plungers 22 and 23 are inserted. The length of the barrel 21 according to this embodiment is substantially the same as the distance between the electrode pad 14a of the LGA package 14 and the electrode pad of the printed circuit board in a state where the LGA package 14 is inserted into the lowermost part of the socket 11. Has been.

The lower plunger 22 and the upper plunger 23 are composed of a base portion 25 housed in the barrel 21 and a tip portion 26 protruding from the barrel 21.
The lower plunger 22 of the first pin 13A and the base portion 25 of the upper plunger 23 are, as shown in FIG. 2A, a conducting portion 27 formed integrally with the distal end portion 26 and a spring bonded to the conducting portion 27. Part 28.

  The conducting portion 27 and the tip portion are formed of a conductive metal, and the spring portion 28 is formed of an elastic material having a predetermined elastic coefficient. As this elastic material, for example, an elastomer that is a base material of the socket body 12 can be used. The spring portion 28 constitutes the spring constant reducing portion 18 referred to in the present invention, and another spring member referred to in the invention of claim 2.

Further, the conducting portion 27 and the spring portion 28 are each substantially cylindrical, and are formed in a shape that fits movably in the inner peripheral portion of the barrel 21. The outer peripheral portion of the base portion 25 composed of the conductive portion 27 and the spring portion 28 is formed in a tapered shape whose outer diameter gradually decreases toward the center in the longitudinal direction of the barrel 21.
An end face 28a located on the opposite side of the conducting part 27 in the spring part 28 is formed flat. The end face of the compression coil spring 24 is in contact with the end face 28a.

  On the other hand, unlike the base 25 of the first pin 13A, the lower plunger 22 of the second pin 13B and the base 25 of the upper plunger 23 are formed integrally with the tip 26, as shown in FIG. It is formed so as to constitute a single cylindrical body. Similar to the plunger of the first pin 13A, the base portion 25 and the distal end portion 26 are made of a conductive metal.

The outer peripheral portion of the base portion 25 of the second pin 13B is formed in a tapered shape in which the outer diameter gradually decreases toward the center of the barrel 21 in the longitudinal direction. The length of the base portion 25 is formed to be substantially equal to the length of the base portion 25 of the first pin 13A.
The tip 26 of the lower plunger 22 provided on the first pin 13A is longer than the tip 26 of the lower plunger 22 provided on the second pin 13B, as shown in FIG. It is formed longer by L1. Moreover, the front-end | tip part 26 of the upper plunger 23 provided in the 1st pin 13A and the front-end | tip part 26 of the upper plunger 23 provided in the 2nd pin 13B are mutually formed in the same length. .

  The compression coil spring 24 is formed to have a predetermined spring constant. The same compression coil spring 24 of the first pin 13A and the compression coil spring 24 of the second pin 13B are used. The compression coil spring 24 according to this embodiment has a spring constant that can accommodate substantially the entire tip portions 26 of the upper and lower plungers 22 and 23 in the barrel 21. The stroke amounts of the upper and lower plungers 22 and 23 are indicated by reference numerals L2 and L3 in FIG.

  When the socket 11 according to this embodiment is attached to a printed circuit board having a high flatness, the lower plunger 22 is pushed into the barrel 21 so that the lower plunger 22 of the first pin 13A has the second pin 13B. It becomes longer than the lower plunger 22. That is, in this case, the displacement amount of the compression coil spring 24 of the first pin 13A is larger than the displacement amount of the compression coil spring 24 of the second pin 13B.

  The spring load F is obtained as the product of “spring constant K1” and “spring displacement X”. For this reason, an increase in the displacement amount X of the spring leads to an increase in the spring load F (F = K1 * X). In the first pin 13A according to this embodiment, a part of the base portion 25 of the upper plunger 23 and the lower plunger 22 is formed of an elastic material (spring portion 28), and “the spring is multiplexed”. The total spring constant (elastic coefficient) K seen from the entirety of the first pin 13A can be reduced (K <K1). The reduction of the spring constant due to the multiplexing of springs is based on the physical phenomenon that the overall spring constant is reduced by connecting the springs in series.

That is, if the spring constant of the compression coil spring 24 is K1 and the elastic coefficient of the spring portion 28 is K2, the overall elastic coefficient K of the first pin 13A is expressed by the following equations (1) and (2). As shown, it is smaller than K1.
Overall elastic modulus 1 / K = (1 / K1) + (1 / K2) (1)
K = {K2 / (K1 + K2)} * K1 ≦ K1 (2)

Therefore, in the first pin 13A according to this embodiment, the increased amount of the displacement amount X can be offset by the reduction (K1 → K) of the elastic coefficient (spring constant) described above, and the lower plunger 22 is relatively moved. Therefore, it is possible to suppress the influence of being formed long.
Therefore, the LGA package socket 11 according to this embodiment is provided with the relatively long first pin 13A in the portion corresponding to the portion recessed to the opposite side to the socket 11 in the printed circuit board. The first pin 13A can be reliably brought into contact with the electrode pad.

  Although the first pin 13A is formed to be relatively long as described above, the first pin 13A is formed so that the overall elastic coefficient (spring constant) is smaller than that of the second pin 13B. Therefore, an excessively large load is not applied to the electrode pad of the printed circuit board or the electrode pad 14a of the LGA package 14. That is, when the depth of the portion recessed to the opposite side of the socket 11 on the printed board (interval between the electrode pad and the socket body 12) is not so deep, or on a flat printed board having no recessed portion, the LGA Even when the package socket 11 is attached, the load applied to the electrode pad from the first pin 13A can be reduced.

  As a result, by using the socket 11 according to this embodiment for the inspection apparatus, the stability of the measurement in the inspection of the LGA package 14 is increased, and the repeatability when the inspection is repeated a plurality of times is also improved. Can do. In the electric / electronic circuit device in which the LGA package 14 is mounted on the printed circuit board using the LGA package socket 11 according to this embodiment, the stability of the operation of the LGA package 14 is improved.

  In this embodiment, the compression coil spring 24 and the spring portion 28 are connected in series, whereby the springs are multiplexed, and the spring constant of the entire pin is reduced. Since the spring portion 28 is accommodated in the barrel 21 so as to constitute a part of the base portion 25 of the lower plunger 22 and the upper plunger 23, the length of the barrel 21 and the compression coil spring 24 can be changed, or the spring The spring constant of the entire pin can be reduced without using the compression coil spring 24 formed so that the constant becomes relatively small.

  The length of the barrel 21 is substantially the same as the distance between the LGA package 14 and the printed circuit board in a state in which the LGA package 14 as a test object is pushed to the innermost part in the socket 11. That is, the length of the barrel 21 is formed to a minimum necessary length that can hold the plungers 22 and 23 and the compression coil spring 24. For this reason, if the length of the barrel 21 is increased in order to reduce the spring constant by using a compression coil spring having a large number of turns, the barrel 21 comes into contact with the electrode pad of the printed circuit board, and the electrode pad is in contact with the barrel 21. It will be damaged by.

  In this embodiment, the length of the barrel 21 of all the pins 13 (the first pin 13A and the second pin 13B) provided in one socket 11 is formed to a certain minimum dimension. As described above, the electrode pad is not damaged by the barrel 21. Further, in this embodiment, since the barrel 21 and the compression coil spring 24 can be used as they are, it is possible to minimize an increase in cost in carrying out the present invention.

(Second embodiment)
In the above-described embodiment, an example in which the spring constant reducing portion is configured by the spring portion provided on the plunger is shown. However, the spring constant reducing portion according to the present invention uses a compression coil spring provided in the barrel. Can be configured. This embodiment will be described in detail with reference to FIGS. In FIG. 3, the same or equivalent members as those described with reference to FIGS. 1 and 2 are denoted by the same reference numerals, and detailed description thereof is omitted as appropriate.

  Although not shown, the barrel 21 of the first pin 13A shown in FIGS. 3A to 3C is the same as the barrel 21 of the second pin 13B. Moreover, the front-end | tip part 26 of the lower plunger 22 shown in these figures is formed longer than the lower plunger 22 of the 2nd pin 13B. That is, the first pin 13A shown in FIGS. 3 (A) to 3 (C) and the first pin 13A according to the first embodiment shown in FIG. The other configuration is the same except that the shape and the number of turns of the compression coil spring 24 are different.

The lower plunger 22 of the first pin 13A shown in FIG. 3A and the base 25 of the upper plunger 23 are formed in a conical shape. The base portion 25 is connected to the distal end portion 26 so that the distal end is directed to the center in the longitudinal direction of the barrel 21.
The conical base 25 can be inserted into the compression coil spring 24, and the insertion portion 25 a overlaps the end 24 a of the compression coil spring 24 in the longitudinal direction of the barrel 21.
The compression coil spring 24 shown in FIG. 3A is formed so as to have a number of turns that extends to the insertion portion 25 a and presses the outer peripheral surface of the base portion 25. That is, in this embodiment, the number of turns of the compression coil spring 24 of the first pin 13A is larger than the number of turns of the compression coil spring 24 of the second pin 13B.

The lower plunger 22 of the first pin 13A and the base portion 25 of the upper plunger 23 shown in FIG. 3B are a large diameter portion 31 connected to the distal end portion 26, and the large diameter portion 31 is opposite to the distal end portion 26. It is comprised from the small diameter part 32 which protrudes to the side. By inserting the small diameter portion 32 of the base portion 25 into the compression coil spring 24, the small diameter portion 32 overlaps the end portion 24 a of the compression coil spring 24 in the longitudinal direction of the barrel 21. That is, in this embodiment, the small diameter portion 32 constitutes the insertion portion referred to in claim 3.
The compression coil spring 24 shown in FIG. 3B is formed to extend to the outer peripheral side of the small diameter portion 32 and to have a number of turns that presses the end surface of the large diameter portion 31.

The lower plunger 22 of the first pin 13 </ b> A and the base portion 25 of the upper plunger 23 shown in FIG. 3C are formed in a bottomed cylindrical shape that opens toward the inside of the barrel 21. An insertion portion 33 is formed in the base portion 25. The insertion portion 33 includes a space in which the end portion 24a of the compression coil spring 24 can be inserted.
The compression coil spring 24 shown in FIG. 3C is formed so as to have a number of turns that extends to the insertion portion 33 and presses the inner bottom surface of the bottomed cylindrical base portion 25.

  That is, as shown in FIGS. 3A to 3C, the compression coil spring 24 of the first pin 13A according to this embodiment increases the number of turns of the compression coil spring 24, thereby increasing the second pin 13B. Compared with the compression coil spring 24, the end 24a is formed longer. For this reason, the spring constant of the compression coil spring 24 is reduced by the end portion 24a as compared with the compression coil spring 24 of the second pin 13B.

  In the embodiment shown in FIGS. 3A to 3C, the lower pin 22 constitutes the first pin 13A main body referred to in the present invention, and the upper plunger 23 constitutes the second pin 13B main body referred to in the present invention. Has been. Further, the insertion portion 25a, 33, the small diameter portion 32, and the end portion 24a of the compression coil spring 24 extending to the insertion portion 25a, 33, the small diameter portion 32, the spring constant reducing portion 18 referred to in the present invention. Is configured.

Therefore, according to this embodiment, the compression coil spring 24 having a relatively large number of turns can be accommodated in the barrel 21 without increasing the length of the barrel 21, and the spring constant of the entire pin can be reduced. .
Also in this embodiment, since the length of the barrel 21 is not long, the electrode pad can be prevented from being damaged. Further, since the existing barrel 21 can be used, the first pin 13A can be manufactured so that the manufacturing cost is not so high.

In the above-described first and second embodiments, the example in which the spring constant reducing unit 18 is provided at both ends of the first pin 13A has been shown. However, the spring constant reducing unit according to the present invention is the first You may provide only in the one end part of the pin 13A.
In the first and second embodiments described above, an example in which the present invention is applied to the LGA package socket 11 for loading the LGA package 14 has been shown. However, the present invention loads other semiconductor packages. It can be applied to a socket for performing such as a BGA package socket.

It is sectional drawing in the use condition of the socket for semiconductor packages which concerns on this invention. FIG. 3A is a cross-sectional view showing a pin, FIG. 1A shows a first pin, and FIG. 1B shows a second pin. FIG. 5A is a cross-sectional view showing another embodiment of the first pin, FIG. 5A shows an example in which the base portion is formed in a conical shape, FIG. 5B shows an example in which a small diameter portion is formed in the base portion, and FIG. FIG. (C) shows an example in which the base is formed in a bottomed cylindrical shape. It is sectional drawing of the conventional socket for semiconductor packages. The side view which shows the state which attached the socket for conventional semiconductor packages to the printed circuit board, The figure (A) shows the state which the printed circuit board is curving so that it may become convex toward a socket, The figure (B) A state in which the printed circuit board is warped to be recessed with respect to the socket is shown.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 8 ... Printed circuit board, 11 ... Socket, 12 ... Socket main body, 13A ... 1st pin, 13B ... 2nd pin, 14 ... LGA package, 16 ... Loading part, 18 ... Spring constant reduction part, 21 ... Barrel, 22 ... Lower plunger, 23 ... Upper plunger, 24 ... Compression coil spring, 24a ... End, 25 ... Base, 25a, 33 ... Insertion part, 26 ... Tip part, 27 ... Conducting part, 28 ... Spring part, 32 ... Small diameter part .

Claims (3)

A socket body that has a loading portion into which a semiconductor package having a large number of electrodes arranged in a grid is loaded, and is attached to a printed circuit board;
For a semiconductor package having a plurality of pins that are erected on the socket body so that one end contacts the electrode and the other end contacts the electrode of the printed circuit board, and the length of the pin changes due to deformation of a spring member provided therein. In the socket
Of the large number of pins, a pin corresponding to a portion of the printed circuit board that is recessed to the opposite side of the socket body is formed longer than the other pins, and a spring constant reducing unit that reduces the spring constant is provided therein. A socket for a semiconductor package, characterized in that The socket for a semiconductor package according to claim 1, wherein the long pin is a cylindrical body fixed to the socket body;
First and second pin bodies held movably in the longitudinal direction of the cylinder at both ends of the cylinder;
The spring member is provided between the first pin body and the second pin body and biases the first and second pin bodies in a direction protruding from the cylindrical body,
The spring constant reducing portion is configured by another spring member interposed between at least one of the first pin body and the second pin body and the spring member. Socket for semiconductor package. The socket for a semiconductor package according to claim 1, wherein the long pin is a cylindrical body fixed to the socket body;
First and second pin bodies having bases fitted into the cylinder, and held movably in the longitudinal direction of the cylinder at both ends of the cylinder;
A spring member comprising a compression coil spring provided between the first pin body and the second pin body and biasing the first and second pin bodies in a direction protruding from the cylindrical body;
At the base of at least one of the first pin main body and the second pin main body, an insertion portion that overlaps with the end of the spring member in the longitudinal direction is formed,
The spring member is formed in a number of turns extending to the insertion portion,
The said spring constant reduction part is comprised from the said insertion part and the said edge part of the spring member extended to this insertion part, The socket for semiconductor packages characterized by the above-mentioned.

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