JP2010129850A - Laminated wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laminated wiring board, wherein conductive parts of respective wiring boards are electrically connected with each other between a plurality of laminated wiring boards without providing through-holes. <P>SOLUTION: The laminated wiring board 10 includes a first wiring board 20 and a second wiring board 30. The first wiring board 20 and the second wiring board 30 are laminated so that one side 21a and one side 31a are oriented in the same direction, one end portion of the second wiring board 30 is folded down between the first wiring board 20 and the second wiring board 30, and the connection parts 32a, 32a of the second conductive part 32 of the second wiring board 30 which are disposed at the one end potion are connected to the connection parts 22a, 22a of the first conductive part 22 of the first wiring board 20. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a laminated wiring board formed by laminating two or more wiring boards having a conductive portion, and more particularly to a laminated wiring board that is thin and excellent in flexibility even if it is multilayered.

  Conventionally, in a multilayer wiring board formed by laminating a plurality of wiring boards, a through hole penetrating the board is provided, and the wiring boards are connected to each other through the through hole.

Further, a non-contact type data receiving / transmitting body (non-contact type IC card or the like) called RFID (Radio Frequency Identification) is called an inlet in which an antenna is formed on a base material and an IC chip is mounted. It is produced by sticking to other base materials.
In such a non-contact type data transmission / reception body, for example, a plurality of antenna patterns are generally wound in a loop shape or a spiral shape for communication in an inlet made of a base material such as paper or film. It is known that an IC chip is mounted by crossing a jumper wiring between the contact points at both ends of the antenna pattern via an insulating layer provided across the antenna pattern (see, for example, Patent Document 1). . Here, the insulating layer is provided in order to prevent a short circuit between the antenna pattern and the jumper wiring.

  Also, in the non-contact type data receiving / transmitting body, in order to prevent a short circuit between the antenna pattern and the jumper wiring, an insulating layer is not provided across the antenna pattern, but through a through hole provided in the base material. It is known that a jumper wiring connected to a through hole is provided on the surface of the substrate opposite to the surface on which the antenna pattern is formed (see, for example, Patent Document 2).

Further, the communication circuit holder includes a base material having three regions connected to each other, an antenna pattern arranged in the first region, and a jumper wiring arranged in the third region. Disclosed is one in which both ends of an antenna pattern and both ends of a jumper wiring are electrically connected when the three regions are overlapped by bending (for example, Patent Documents) 3).
JP 2002-074310 A JP 2003-006589 A JP 2005-241011 A

  However, the conventional laminated wiring board has a problem that it is difficult to ensure conduction between the wiring boards because a plurality of wiring boards are laminated through the through holes. Moreover, in order to manufacture a multilayer wiring board, since it is necessary to form a through hole, there existed a problem that there were many manufacturing processes and manufacturing cost was high.

In addition, the non-contact type data receiver / transmitter disclosed in Patent Document 1 has many manufacturing processes because an insulating layer is provided across the antenna pattern and a jumper wiring is provided on the insulating layer. There was a problem that the manufacturing cost was high.
Moreover, since the antenna pattern and the jumper wiring are connected to each other through the through hole in the non-contact type data receiver / transmitter disclosed in Patent Document 2, it is difficult to ensure the continuity between the antenna pattern and the jumper wiring. was there. Further, in order to manufacture this non-contact type data transmitting / receiving body, it is necessary to form a through hole, so that there are many manufacturing processes and a high manufacturing cost.

  Furthermore, the circuit holder for communication disclosed in Patent Document 3 was overlapped in order to ensure electrical continuity between the antenna pattern in the first region and the jumper wiring in the third region after the base material was bent. The base material needs to be pressure-bonded, and the continuity may not be sufficiently secured depending on the force applied during pressure-bonding.

  The present invention has been made in view of the above circumstances, and can electrically connect the conductive portions of each wiring board between a plurality of laminated wiring boards without through a through hole. An object of the present invention is to provide a laminated wiring board that can be used.

  The laminated wiring board of the present invention is a laminated wiring board comprising two or more wiring boards having a conductive part, wherein the surfaces on which the main parts of the conductive part are provided all have the same orientation. Two or more wiring boards are laminated, and one of the two or more wiring boards is bent between two wiring boards that are in contact with each other, and is arranged at the one end. The connecting portion of the conductive portion of the one wiring board is disposed on the same plane as the main portion of the conductive portion of the other wiring substrate, and is connected to the connecting portion of the conductive portion of the other wiring substrate. And

  It is preferable that the two or more wiring boards are connected.

  It is preferable that the conductive part of the one wiring board forms a jumper wiring part of the conductive part of the other wiring board.

  According to the multilayer wiring board of the present invention, the multilayer wiring board is provided with two or more wiring boards having conductive portions, and the surfaces on which the main portions of the conductive portions are provided all have the same orientation. The two or more wiring boards are laminated, and one of the two or more wiring boards is bent between two wiring boards in contact with each other, and one end of the wiring board is bent at the one end. Since the connection part of the conductive part of the one wiring board arranged is arranged on the same plane as the main part of the conductive part of the other wiring board and is connected to the connection part of the conductive part of the other wiring board Since the connection portions of the conductive portions of the respective wiring boards abut on the same surface between the plurality of laminated wiring boards without using through holes as in the conventional laminated wiring board, these conductive layers The parts can be electrically connected. Therefore, the conductive portions of the respective wiring boards can be reliably conducted between the plurality of laminated wiring boards. Moreover, since it is not necessary to form a through hole, the manufacturing process can be simplified and the manufacturing cost can be reduced. Furthermore, since the multilayer wiring board of the present invention is not provided with a through hole, it is thin and excellent in flexibility even if it is multilayered.

The best mode of the multilayer wiring board of the present invention will be described.
This embodiment is specifically described for better understanding of the gist of the invention, and does not limit the present invention unless otherwise specified.

(1) First Embodiment FIG. 1 is a schematic view showing a first embodiment of the multilayer wiring board of the present invention, (a) is an exploded perspective view, and (b) is a constituent member of (a). It is sectional drawing which follows the AA line of (a), when it integrates.
The laminated wiring board 10 of this embodiment is schematically configured from a first wiring board 20 having a first conductive part 22 and a second wiring board 30 having a second conductive part 32.

The first wiring board 20 is provided on the first base material 21, the one surface 21 a of the first base material 21, and is electrically connected to the first conductive part 22 having a spiral shape and the first conductive part 22. And an IC chip 23 formed.
The first conductive portion 22 alone does not form a closed circuit, and both end portions thereof are open ends, and the open ends are arranged at a predetermined interval. This open end forms connection portions 22 a and 22 a of the first conductive portion 22. Moreover, the main part (parts other than the connection parts 22a and 22a) of the first conductive part 22 and the connection parts 22a and 22a are arranged on the same surface (one surface 21a of the first base material 21). .

The second wiring board 30 is schematically configured from a second base 31 and a second conductive portion 32 that is provided on one surface 31a of the second base 31 and has a U-shape in plan view.
The second conductive portion 32 alone does not form a closed circuit, and both end portions thereof are open ends, and the open ends are disposed at a predetermined interval. This open end forms connection portions 32 a and 32 a of the second conductive portion 32.
Further, the second base material 31 is provided with a first region 31A in which the main part of the second conductive part 32 is arranged, and connection parts 32a and 32a of the second conductive part 32, and one end of the second wiring board 30. And the second region 31B.

  The first wiring board 20 and the second wiring board 30 are used as components, and the surface on which the main portion of the first conductive portion 22 is provided, that is, one surface 21a of the first base member 21 and the second conductive portion. The second wiring board 30 is laminated on the first wiring board 20 so that the surface on which the main part of the part 32 is provided, that is, the one surface 31a of the second base material 31 has the same orientation, A laminated wiring board 10 is configured.

Furthermore, one end portion (second region 31B) of the second wiring substrate 30 is bent with the fold line 33 as a boundary, and the connection portions 32a and 32a of the second conductive portion 32 disposed at the one end portion are respectively connected to the first wiring. The contact portions 22a and 22a of the first conductive portion 22 of the substrate 20 are in contact with and connected to each other. That is, the connection portions 22a and 22a of the first conductive portion 22 and the connection portions 32a and 32a of the second conductive portion 32 are in contact with each other on the same surface (on one surface 21a of the first base material 21).
Thereby, one closed circuit composed of the first conductive portion 22 of the first wiring board 20 and the second conductive portion 32 of the second wiring board 30 is formed. Specifically, in this laminated wiring board 10, one closed circuit composed of the first conductive portion 22 and the second conductive portion 32 forms a spiral antenna on one surface 21 a of the first base material 21. . The multilayer wiring board 10 constitutes a non-contact type data receiving / transmitting body including an antenna including the first conductive portion 22 and the second conductive portion 32 and an IC chip 23 electrically connected to the antenna. .

More specifically, the connection portions 32a and 32a of the second conductive portion 32 are arranged at intervals from each other in accordance with the distance (interval) between the connection portions 22a and 22a of the first conductive portion 22, Only the second area 31 </ b> B of the two wiring boards 30 faces the one surface 21 a of the first base 21 of the first wiring board 20, and only the connection parts 32 a and 32 a of the second conductive part 32 are the first. The second conductive portion 32 is connected to the connection portions 22 a and 22 a of the conductive portion 22 to form a jumper wiring portion of the first conductive portion 22. Therefore, one closed circuit composed of the first conductive portion 22 and the second conductive portion 32 forms a spiral antenna.
In addition, one end portion (second region 31B) of the second wiring board 30 bent with the fold line 33 as a boundary is in contact with the first conductive portion 22 of the first wiring board 20 at portions other than the connection portions 32a and 32a. Since the 2nd base material 31 is insulating, the 1st electroconductive part 22 does not short-circuit in this part.

Moreover, the connection parts 22a and 22a of the 1st electroconductive part 22 and the connection parts 32a and 32a of the 2nd electroconductive part 32 are connected via the adhesive agent.
The adhesive is not particularly limited as long as it is an adhesive generally used for bonding a wiring board or the like, but is not limited to anisotropic conductive adhesive film (ACF), non-conductive film (Non-conductive film, NCF). ), Anisotropic conductive paste (ACP), non-conductive particle paste (NCP), and the like.

  In addition, the means for stacking and fixing the second wiring board 30 to the first wiring board 20 (hereinafter, abbreviated as “fixing means”) is not particularly limited, but the first wiring board 20 and the second wiring board are not limited. Mechanical means for sandwiching the substrate 30 together, an adhesive for bonding the first wiring substrate 20 and the second wiring substrate 30, a resin layer provided on the surface of the first wiring substrate 20 and / or the second wiring substrate 30 Etc.

  When an adhesive is used as the fixing means, one surface 21a of the first base material 21 of the first wiring substrate 20 and / or one surface 31a of the second base material 31 of the second wiring substrate 30 is opposite to the one surface 31a. An adhesive is provided on the surface (hereinafter referred to as “the other surface”) 31b.

Although it does not specifically limit as such an adhesive agent, The non-peeling pressure sensitive adhesive which cannot be peeled easily or cannot be peeled after sticking is used suitably.
As such a non-peelable pressure-sensitive adhesive, those conventionally used as conventional pressure-sensitive adhesives are used, and among them, an adhesive having a peeling force of 220 gf / 25 mm or more can be mentioned. Examples of such a non-peelable pressure-sensitive adhesive include natural rubber latex obtained by graft copolymerization of styrene and methyl methacrylate with natural rubber. This natural rubber latex is a suitable adhesive for the laminated wiring board 10 in terms of blocking resistance, heat resistance, wear resistance, and the like.

When a resin layer is used as the fixing means, the resin layer is applied to one surface 21a of the first base material 21 of the first wiring substrate 20 and / or the other surface 31b of the second base material 31 of the second wiring substrate 30. Is provided. Then, the resin layer is melted by heating, and the first wiring board 20 and the second wiring board 30 are fused.
As the resin for forming such a resin layer, a thermoplastic resin is used. Among these, a thermoplastic resin having a relatively low melting point is preferable.

  As the first base material 21 and the second base material 31, at least on the surface layer portion, a woven fabric, a non-woven fabric, a mat, paper or the like made of inorganic fibers such as glass fiber and alumina fiber, or a combination thereof, polyester fiber, Woven fabrics, nonwoven fabrics, mats, papers, etc. made of organic fibers such as polyamide fibers, or combinations thereof, covering members formed by impregnating them with resin varnish, polyamide resin base materials, polyester resin bases Material, polyolefin resin substrate, polyimide resin substrate, ethylene-vinyl alcohol copolymer substrate, polyvinyl alcohol resin substrate, polyvinyl chloride resin substrate, polyvinylidene chloride resin substrate, polystyrene resin Base material, polycarbonate resin base material, acrylonitrile butadiene styrene copolymer resin base material Plastic base materials such as polyethersulfone resin base materials, (glass) epoxy resin base materials, or mat processing, corona discharge processing, plasma processing, ultraviolet irradiation processing, electron beam irradiation processing, flame plasma processing, ozone processing. Or it selects from well-known things, such as what gave surface treatments, such as various easily bonding processes, and is used.

The first conductive portion 22 is formed on one surface 21a of the first base material 21 by screen printing in a predetermined pattern using a polymer-type conductive ink, or by ink-jet printing using a solvent volatile conductive ink. A predetermined pattern is formed and then fired, or a conductive foil is etched into a predetermined pattern, or a predetermined pattern is formed by metal plating.
The second conductive portion 32 is formed on one surface 31 a of the second base material 31 in the same manner as the first conductive portion 22.

  Examples of polymer-type conductive inks are those in which conductive fine particles such as silver powder, gold powder, platinum powder, aluminum powder, palladium powder, rhodium powder, carbon powder (carbon black, carbon nanotube, etc.) are blended in the resin composition Is used.

If a thermosetting resin is used as the resin composition, the polymer-type conductive ink may form a coating film that forms the first conductive portion 22 and the second conductive portion 32 at 200 ° C. or less, for example, about 100 to 150 ° C. It becomes a thermosetting type. The path through which the coating film forming the first conductive portion 22 and the second conductive portion 32 flows is formed by contact between the conductive fine particles forming the coating film, and the resistance value of the coating film is 10 ⁻⁵ Ω · cm. It is an order.
Further, as the polymer type conductive ink in the present invention, known ones such as a photocuring type, a penetrating drying type, and a solvent volatilization type are used in addition to the thermosetting type.

  The photocurable polymer type conductive ink contains a photocurable resin in the resin composition and has a short curing time, so that the production efficiency can be improved. Examples of the photo-curing polymer type conductive ink include, for example, a thermoplastic resin alone, or a blend resin composition of a thermoplastic resin and a crosslinkable resin (particularly, a crosslinkable resin composed of polyester and isocyanate) and 60 fine conductive particles. More than 10% by mass and 10% by mass or more of a polyester resin, that is, a solvent volatile type or a crosslinked / thermoplastic combined type (however, the thermoplastic type is 50% by mass or more), thermoplastic A resin resin or a blend resin composition of a thermoplastic resin and a crosslinkable resin (especially a crosslinkable resin composed of polyester and isocyanate) is blended with 10% by mass or more of a polyester resin, that is, a crosslinkable type or a crosslinked / crosslinked resin. A thermoplastic combination type is preferably used.

  Examples of the solvent volatile conductive ink include those in which 50 to 80% by mass of metal nanoparticles having an average particle diameter of 1 to 10 nm are blended in a volatile solvent, or those in which 10 to 50% by mass of a pyrolytic metal salt is blended. Is used.

Examples of the conductive foil that forms the first conductive portion 22 and the second conductive portion 32 include copper foil, silver foil, gold foil, platinum foil, and aluminum foil.
Furthermore, examples of the metal plating that forms the first conductive portion 22 and the second conductive portion 32 include copper plating, silver plating, gold plating, and platinum plating.

  The IC chip 23 is not particularly limited and may be a non-contact type IC as long as information can be written and read out in a non-contact state via an antenna including the first conductive portion 22 and the second conductive portion 32. Any tag can be used as long as it is applicable to RFID media such as a tag, a non-contact type IC label, or a non-contact type IC card.

  According to the laminated wiring board 10, the first wiring board 20 having the first conductive part 22 and the second wiring board 30 having the second conductive part 32 are provided, and one surface of the first base material 21 is provided. The second wiring board 30 is stacked on the first wiring board 20 so that one surface 31a of the second base material 31 and the one surface 31a of the second base material 31 are in the same direction, and one end of the second wiring board 30 is bent, Since the connection portions 32a and 32a of the second conductive portion 32 arranged at one end thereof are connected to the connection portions 22a and 22a of the first conductive portion 22 of the first wiring substrate 20, respectively, the conventional multilayer wiring substrate Thus, the connection portions 22a and 22a of the first conductive portion 22 and the connection portion 32a of the second conductive portion 32 between the first wiring substrate 20 and the second wiring substrate 30 that are stacked without through a through hole. , 32a abut on the same surface, so that the first conductive portion 2 and the second conductive portion 32 can be electrically connected. Therefore, the first conductive portion 22 and the second conductive portion 32 can be reliably conducted between the first wiring substrate 20 and the second wiring substrate 30. Moreover, since it is not necessary to form a through hole, the manufacturing process can be simplified and the manufacturing cost can be reduced. Furthermore, since the multilayer wiring board 10 is not provided with a through hole, it is thin and excellent in flexibility even if it is multilayered.

  In this embodiment, the laminated wiring board 10 in which the first wiring board 20 and the second wiring board 30 are laminated is illustrated, but the laminated wiring board of the present invention is not limited to this. In the laminated wiring board of the present invention, three or more wiring boards may be laminated in the same manner as in this embodiment.

  Further, in this embodiment, the second conductive portion 32 forms a jumper wiring portion of the first conductive portion 22, and one closed circuit including the first conductive portion 22 and the second conductive portion 32 forms a spiral antenna. Although the multilayer wiring board 10 is illustrated, the multilayer wiring board of the present invention is not limited to this. In the laminated wiring board of the present invention, two or more wiring boards may be laminated, and the conductive portions of the respective wiring boards may be connected to form a simple circuit.

  Moreover, in this embodiment, although the laminated wiring board 10 provided with the 1st wiring board 20 which has the IC chip 23 electrically connected with the 1st electroconductive part 22 was illustrated, the laminated wiring board of this invention is this It is not limited. In the multilayer wiring board of the present invention, the wiring board may be composed of only a base material and a conductive part, or may be provided with electronic components other than IC chips, various display elements, and various light receiving elements It may be.

  Moreover, in this embodiment, although the laminated wiring board 10 provided with the 2nd wiring board 30 which has only the 2nd electroconductive part 32 was illustrated, the laminated wiring board of this invention is not limited to this. In the multilayer wiring board of the present invention, the wiring board may include electronic components such as an IC chip, various display elements, and various light receiving elements.

  Furthermore, in this embodiment, the multilayer wiring board 10 provided with the first conductive part 22 and the second conductive part 22 that do not form a closed circuit by itself is illustrated, but the multilayer wiring board of the present invention is not limited to this. . In the multilayer wiring board of the present invention, if the conductive part of each wiring board is provided with a connecting part used for connection with another wiring board, the conductive part of each wiring board is closed as a single unit. A circuit may be formed.

(2) Second Embodiment FIG. 2 is a schematic sectional view showing a second embodiment of the multilayer wiring board of the present invention.
The laminated wiring board 40 of this embodiment includes a first wiring board 50 having a first conductive part 52, a second wiring board 60 having a second conductive part 62, and a third wiring board 70 having a third conductive part 72. And a fourth wiring board 80 having a fourth conductive portion 82.

The first wiring board 50 is schematically configured from a first base 51 and a first conductive portion 52 provided on one surface 51 a of the first base 51.
The second wiring board 60 is schematically configured from a second base 61 and a second conductive portion 62 provided on one surface 61 a of the second base 61.
The third wiring board 70 is generally configured by a third base 71 and a third conductive portion 72 provided on one surface 71 a of the third base 71.
The fourth wiring board 80 is generally configured by a fourth base material 81 and a fourth conductive portion 82 provided on one surface 81 a of the fourth base material 81.

  The first wiring board 50, the second wiring board 60, the first wiring board 70, and the fourth wiring board 80 are constituent members, and the surface on which the main part of the first conductive portion 52 is provided (the first base material 51). One surface 51a), the surface provided with the main part of the second conductive portion 62 (one surface 61a of the second base material 61), and the surface provided with the main part of the third conductive portion 72 (first surface). The first wiring so that one surface 71a) of the three base materials 71 and the surface (one surface 81a of the fourth base material 81) provided with the main part of the fourth conductive portion 82 are in the same direction. The substrate 50, the second wiring substrate 60, the first wiring substrate 70, and the fourth wiring substrate 80 are laminated in this order to constitute a laminated wiring substrate 80.

Furthermore, one end portion of the second wiring board 60 (second region 61B of the second base material 61) is bent from the first region 61A of the second base material 61 with the fold line 63 as a boundary, and is disposed at one end portion thereof. The first connection portion 62 a of the second conductive portion 62 is in contact with and connected to the connection portion 52 a of the first conductive portion 52 of the first wiring board 50.
More specifically, only the second region 61 </ b> B of the second wiring board 60 faces the one surface 51 a of the first base 51 of the first wiring board 50 and the first connection of the second conductive portions 62. Only the part 62 a is connected to the connection part 52 a of the first conductive part 52.

Further, one end portion of the third wiring board 70 (the second region 71B of the third base material 71) is bent from the first region 71A of the third base material 71 with the fold line 73 as a boundary, and is disposed at one end portion thereof. The first connection portion 72a of the third conductive portion 72 is connected to the second connection portion 62b that forms the other end portion (the end portion opposite to the one end portion) of the second conductive portion 62 of the second wiring board 60. Abutted and connected.
More specifically, only the second region 71 </ b> B of the third wiring board 70 faces the one surface 61 a of the second base 61 of the second wiring board 60 and the first connection of the third conductive portions 72. Only the portion 72 a is connected to the second connection portion 62 b of the second conductive portion 62.

Further, one end portion of the fourth wiring board 80 (the second region 81B of the fourth base material 81) is bent from the first region 81A of the fourth base material 81 with the folding line 83 as a boundary, and is disposed at one end portion thereof. The connection portion 82a of the fourth conductive portion 82 is in contact with the second connection portion 72b that forms the other end portion (the end portion opposite to the one end portion) of the third conductive portion 72 of the third wiring board 70. ,It is connected.
More specifically, only the second area 81 </ b> B of the fourth wiring board 80 faces one surface 71 a of the third base 71 of the third wiring board 70, and only the connection part 82 a of the fourth conductive part 82. Is connected to the second connection portion 72 b of the third conductive portion 72.

  As a result, the first conductive portion 52 of the first wiring substrate 50, the second conductive portion 62 of the second wiring substrate 60, the third conductive portion 72 of the third wiring substrate 70, and the fourth of the fourth wiring substrate 80. One circuit including the conductive portion 82 is formed.

In order to connect the respective conductive portions between the first wiring board 50, the second wiring board 60, the first wiring board 70, and the fourth wiring board 80, the above-described first embodiment and Similar means are used.
In addition, as means for laminating and fixing the first wiring board 50, the second wiring board 60, the first wiring board 70, and the fourth wiring board 80, the same means as in the first embodiment described above are used.

As the 1st base material 51, the 2nd base material 61, the 3rd base material 71, and the 4th base material 81, the thing similar to the above-mentioned 1st embodiment is used.
As materials for forming the first conductive portion 52, the second conductive portion 62, the third conductive portion 72, and the fourth conductive portion 82, the same materials as those in the first embodiment described above are used.

  According to the multilayer wiring board 40, a multilayer wiring board having a multilayer and higher density than the above-described multilayer wiring board 10 can be configured without through holes as in the conventional multilayer wiring board.

(3) Third Embodiment FIG. 3 is a schematic plan view showing a third embodiment of the multilayer wiring board of the present invention and showing a state where a base material constituting the multilayer wiring board is developed. 4A and 4B are schematic views showing a third embodiment of the multilayer wiring board of the present invention, in which FIG. 4A is a perspective view showing a state in which a base material constituting the multilayer wiring board is bent, and FIG. 4B is a multilayer wiring board. It is sectional drawing which follows the BB line of (a), when each area | region of the base material which comprises a board | substrate is integrated | superposed and integrated.

  The multilayer wiring board 100 of this embodiment includes a base material 101 having a first region 101A, a second region 101B, and a third region 101C connected via the fold line 105 and the fold line 106, and the first region 101A of the base material 101. A first conductive portion 102 having a spiral shape provided on one surface 101a, an IC chip 103 electrically connected to the first conductive portion 102, and one surface 101a of the second region 101B of the substrate 101 And a second conductive portion 104 that is provided over one surface 101a of the third region 101C of the base material 101 and has a U-shape in plan view.

The multilayer wiring board 100 has a configuration in which the first wiring board 20 and the second wiring board 30 constituting the above-described multilayer wiring board 10 are connected and integrated.
That is, the portion formed of the first region 101 </ b> A of the base material 101, the first conductive portion 102, and the IC chip 103 corresponds to the first wiring substrate 20 described above. In addition, a portion formed of the second region 101 </ b> B, the third region 101 </ b> C, and the second conductive portion 104 of the base material 101 corresponds to the second wiring substrate 30 described above.

  The first conductive portion 102 alone does not form a closed circuit, and both end portions thereof are open ends, and the open ends are arranged at a predetermined interval. The open end forms connection portions 102 a and 102 a of the first conductive portion 102. Moreover, the main part (parts other than the connection parts 102a and 102a) of the first conductive part 102 and the connection parts 102a and 102a are arranged on the same surface (one surface 101a of the first region 101A of the base material 101). Has been.

The second conductive portion 104 alone does not form a closed circuit, and both end portions thereof are open ends, and the open ends are arranged at a predetermined interval. The open end forms connection portions 104 a and 104 a of the second conductive portion 104.
Further, the connecting portions 104 a and 104 a of the second conductive portion 104 are disposed on one surface 101 a of the second region 101 </ b> B of the base material 101.

In such a laminated wiring board 100, the base material 101 is folded through the folding line 105 to overlap the first region 101A and the second region 101B, and further the base material 101 is folded through the folding line 106 to form the second region 101B. And the third region 101C are overlapped, the surface on which the main portion of the first conductive portion 102 is provided, that is, one surface 101a of the first region 101A of the substrate 101 and the main portion of the second conductive portion 104. The first region 101A, the second region 101B, and the third region 101C are laminated so that the surface on which is provided, that is, the one surface 101a of the third region 101C of the base material 101 has the same orientation, A laminated wiring board 100 is configured.
In other words, the base material 101 is Z-folded via the fold line 105 and the fold line 106 so that the first area 101A and the second area 101B overlap and the second area 101B and the third area 101C overlap. Thus, the laminated wiring board 100 is configured.

Furthermore, the base material 101 is bent with the fold line 105 and the fold line 106 as a boundary, and the connection portions 104a and 104a of the second conductive portion 104 disposed in the second region 101B are respectively disposed in the first region 101A. The contact portions 102a and 102a of the conductive portion 102 are in contact with and connected to each other. That is, the connection portions 102a and 102a of the first conductive portion 102 and the connection portions 104a and 104a of the second conductive portion 104 are in contact with each other on the same surface (on one surface 101a of the base material 101).
Thereby, one closed circuit composed of the first conductive portion 102 and the second conductive portion 104 is formed. Specifically, in this laminated wiring board 100, one closed circuit composed of the first conductive portion 102 and the second conductive portion 104 forms a spiral antenna. The laminated wiring board 100 constitutes a non-contact type data receiving / transmitting body including an antenna including the first conductive portion 102 and the second conductive portion 104 and an IC chip 103 electrically connected to the antenna. .

More specifically, the connection portions 104a and 104a of the second conductive portion 104 are arranged at intervals from each other in accordance with the distance (interval) between the connection portions 102a and 102a of the first conductive portion 102. Only the two regions 101B face the first region 101A, and only the connection portions 104a and 104a of the second conductive portion 104 are connected to the connection portions 102a and 102a of the first conductive portion 102, and the second conductive portion 104 Constitutes a jumper wiring portion of the first conductive portion 102. Therefore, one closed circuit composed of the first conductive portion 102 and the second conductive portion 104 forms a spiral antenna.
In addition, the second region 101B of the base material 101 that is bent with the fold line 105 and the fold line 106 as a boundary is in contact with the first conductive portion 102 of the first region 101A at portions other than the connection portions 104a and 104a of the second conductive portion 104. However, since the base material 101 is insulative, the first conductive portion 102 is not short-circuited at this portion.

In order to connect the connection portions 102a and 102a of the first conductive portion 102 and the connection portions 104a and 104a of the second conductive portion 104 between the first region 101A and the second region 101B of the base material 101, Means similar to those of the first embodiment are used.
Further, as the means for laminating and fixing the first area 101A, the second area 101B, and the third area 101C of the base material 101, the same means as in the first embodiment described above is used.

As the base material 101, the same material as in the first embodiment described above is used.
As materials for forming the first conductive portion 102 and the second conductive portion 104, the same materials as those in the first embodiment described above are used.
As the IC chip 103, the same one as in the first embodiment described above is used.

  According to this laminated wiring board 100, the base material 101 is folded through the folding line 105 to overlap the first region 101A and the second region 101B, and further, the base material 101 is folded through the folding line 106 to form the second region 101B. And the third region 101C are overlapped, so that the first region 101A, the first region 101A, the first region 101A of the base material 101 and the one surface 101a of the third region 101C have the same orientation. The two regions 101B and the third region 101C are stacked, and the connection portions 104a and 104a of the second conductive portion 104 disposed in the second region 101B are respectively connected to the first conductive portion 102 disposed in the first region 101A. 102a, 102a and 102a, the first region 101A and the first layer 101A are stacked without passing through holes as in the conventional multilayer wiring board. Between the regions 101B, the connection portions 102a and 102a of the first conductive portion 102 and the connection portions 104a and 104a of the second conductive portion 104 abut on the same plane, so the first conductive portion 102 and the second conductive portion 104 are in contact with each other. Can be electrically connected. Accordingly, the first conductive portion 102 and the second conductive portion 104 can be reliably conducted between the first region 101A, the second region 101B, and the third region 101C. Further, since the multilayer wiring board 100 is not provided with a through hole, it is thin and excellent in flexibility even if it is made multi-layered.

Moreover, since it is not necessary to form a through hole, the manufacturing process can be simplified and the manufacturing cost can be reduced.
Furthermore, since the first conductive portion 102 and the second conductive portion 104 are provided on one surface 101a of the base material 101, both can be formed at the same time, thereby simplifying the manufacturing process and reducing the manufacturing cost. Can do.

  In this embodiment, the multilayer wiring substrate 100 is illustrated in which the base material 101 including the first region 101A, the second region 101B, and the third region 101C is bent with the fold line 105 and the fold line 106 as a boundary and stacked. However, the multilayer wiring board of the present invention is not limited to this. In the laminated wiring board of the present invention, a board composed of four or more regions may be folded and laminated in the same manner as described above.

However, as in this embodiment, when a laminated wiring board is formed by bending a base material composed of three or more regions, a main portion of each conductive portion is provided in every other region, and a conductive portion is provided in the region between them. The connection part is provided.
That is, for example, when a base material composed of the region a, the region b, the region c, the region d, the region e, the region f, and the region g is used, the main portion of the conductive portion a is formed in the region a and the conductive portion b is formed in the region b. The connection part, the main part of the conductive part b in the area c, the connection part of the conductive part c in the area d, the main part of the conductive part c in the area e, the connection part of the conductive part d in the area f, and the conductive part d in the area g. The main part is provided.

  In this embodiment, the second conductive portion 104 forms a jumper wiring portion of the first conductive portion 102, and one closed circuit including the first conductive portion 102 and the second conductive portion 104 forms a spiral antenna. Although the multilayer wiring board 100 is illustrated, the multilayer wiring board of the present invention is not limited to this. In the laminated wiring board according to the present invention, even if a board composed of three or more regions is bent and laminated, the conductive parts of the respective wiring boards are connected to form a simple circuit. Good.

  Further, in this embodiment, the multilayer wiring board 100 including the first conductive portion 102 and the second conductive portion 104 that do not form a closed circuit by itself is illustrated, but the multilayer wiring substrate of the present invention is not limited to this. . In the multilayer wiring board of the present invention, if the conductive part of each wiring board is provided with a connecting part used for connection with another wiring board, the conductive part of each wiring board is closed as a single unit. A circuit may be formed.

BRIEF DESCRIPTION OF THE DRAWINGS It is the schematic which shows 1st embodiment of the multilayer wiring board of this invention, (a) is an exploded perspective view, (b) is the A- of (a), when the structural member of (a) is integrated. It is sectional drawing which follows A line. It is a schematic sectional drawing which shows 2nd embodiment of the multilayer wiring board of this invention. It is a schematic plan view which shows 3rd embodiment of the multilayer wiring board of this invention, and shows the state which expand | deployed the base material which comprises a multilayer wiring board. It is the schematic which shows 3rd embodiment of the laminated wiring board of this invention, (a) is a perspective view which shows the state which bent the base material which comprises a laminated wiring board, (b) comprises a laminated wiring board. When each area | region of a base material is overlap | superposed and integrated, it is sectional drawing which follows the BB line of (a).

Explanation of symbols

10, 40, 100 ... laminated wiring board, 20, 50 ... first wiring board, 21, 51 ... first base material, 22, 52, 102 ... first conductive part, 22a, 32a , 52a ... connection part, 23, 103 ... IC chip, 30, 60 ... second wiring board, 31, 61 ... second base material, 32, 62, 104 ... second conductive Part, 62a, 72a ... 1st connection part, 62b, 72b ... 2nd connection part, 70 ... 3rd wiring board, 71 ... 3rd base material, 72 ... 3rd Conductive part, 80 ... fourth wiring board, 81 ... fourth substrate, 82 ... fourth conductive part, 101 ... base material.

Claims (3)

A laminated wiring board comprising two or more wiring boards having conductive portions,
The two or more wiring boards are laminated so that the surfaces provided with the main parts of the conductive parts all have the same orientation,
Of the two or more wiring substrates, one end portion of one wiring substrate is bent between two wiring substrates in contact with each other, and a connection portion of the conductive portion of the one wiring substrate disposed at the one end portion Is disposed on the same plane as the main part of the conductive part of the other wiring board, and is connected to the connection part of the conductive part of the other wiring board.   The multilayer wiring board according to claim 1, wherein the two or more wiring boards are connected. The multilayer wiring board according to claim 1, wherein the conductive part of the one wiring board forms a jumper wiring part of the conductive part of the other wiring board.

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