JP2010129704A - Adjusting method of inter-roll gap of substrate processing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adjusting method of inter-roll gap of a substrate processing apparatus which can be installed with suitable pressing amount between a first roll and a second roll by accurately detecting positions where the first roll and second roll come into contact with a substrate. <P>SOLUTION: A substrate jig 50, a first roll jig 40-1 and a second roll jig 40-2 are prepared, and an outer periphery of the substrate jig 50 is inserted into a circumferential groove 12a of a head 12 to be supported. The second roll jig is positioned through position adjustment so that the gap between a reverse surface of the substrate jig 50 and the second roll jig 40-2 has a predetermined value, the first roll jig 40-1 is opposed to the second roll jig 40-2, and the first roll jig is positioned through position adjustment so that the gap between the second roll jig and the first roll jig has a predetermined value. Then the first roll is held by a first roll rotating mechanism 17 holding the first roll jig 40-1 and the second roll is held by a second roll rotating mechanism 18 holding the second roll jig 40-2. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention provides a substrate processing apparatus for cleaning a front surface and a back surface of a roll sponge slidably contacted with each other while rotating a disk-shaped substrate such as a semiconductor substrate like a scrub cleaning device. The present invention relates to a roll gap adjusting method for a substrate processing apparatus that adjusts a gap between roll sponges that are in sliding contact with front and back surfaces.

As a cleaning apparatus for cleaning a disk-shaped substrate such as a semiconductor substrate, there is a substrate cleaning apparatus as shown in FIG. The substrate cleaning apparatus 10 includes a substrate rotating mechanism including a plurality of (four in the drawing) spindles 11 that support and rotate the outer peripheral edge of a disk-shaped substrate Wf to be cleaned such as a semiconductor substrate, and a first roll type. A first roll rotating mechanism 17 that supports the cleaning member 13 on the first rotation axis and is slidably contacted with the surface of the substrate Wf to be cleaned while rotating in the direction of the arrow F ₁ , and the second roll type cleaning member 15 is the first rotation axis. in the second rotation axis parallel to, and supported by opposed so as to sandwich the substrate to be cleaned Wf, a second roll rotating mechanism 18 for sliding contact with the back surface of the cleaned substrate Wf while rotating in the arrow F ₂ direction It is the structure provided with.

The first roll type cleaning member 13 and the second roll type cleaning member 15 are roll sponges having a surface layer made of PVA, and the first roll type cleaning member 13 is placed on the surface of the substrate to be cleaned Wf rotating in the direction of arrow E. The surface layer 13a is pressed against the back surface and the surface layer 15a of the second roll type cleaning member 15 is pressed, and cleaning is performed by spraying a cleaning liquid from the cleaning liquid nozzle 19 onto the front and back surfaces. The pressing load of the first roll type cleaning member 13 and the second roll type cleaning member 15 is set by an air cylinder provided in each of the first roll rotation mechanism 17 and the second roll rotation mechanism 18. The distance from the contact position at which the first roll type cleaning member 13 and the second roll type cleaning member 15 are in contact with the substrate to be cleaned Wf to the stroke end of the air cylinder is used as the pressing amount. In FIG. 1, 12 is a top provided on the top of the spindle 11, and 12a is a circumferential groove provided on the outer periphery of the top. Reference numeral 20 denotes a cleaning arm, and reference numeral 21 denotes a swing shaft that swings the cleaning arm 20.
Japanese Patent Laid-Open No. 2002-50602

  In the above cleaning apparatus, the conventional method for adjusting the pressing amount of the first roll type cleaning member 13 and the second roll type cleaning member 15 is to support a dummy substrate Wf to be cleaned by a substrate rotating mechanism having a plurality of spindles 11. The first roll-type cleaning member 13 and the second roll-type cleaning member 15 are brought into contact with the substrate to be cleaned Wf, the contact positions are visually confirmed, and the first roll-type cleaning member 13 and the second roll type are checked from the contact positions. The pressing amount of the cleaning member 15 is set to a predetermined value (for example, the pressing amount of the first roll type cleaning member 13: 1 to 2 mm, the pressing amount of the second roll type cleaning member 15: 0.1 to 0.3 mm) Yes.

  In the conventional method for adjusting the pressing amount of the first roll-type cleaning member 13 and the second roll-type cleaning member 15, the second roll-type cleaning member 15 is placed on the back surface (lower surface) of the substrate to be cleaned Wf due to variations in adjustment work. There was a problem of not contacting. In particular, since the second roll-type cleaning member 15 is located below the substrate to be cleaned Wf, it is accurately visually confirmed that the second roll-type cleaning member 15 and the back surface (lower surface) of the substrate to be cleaned Wf are in contact. Since it cannot be confirmed, even if the second roll-type cleaning member 15 and the back surface of the substrate to be cleaned Wf appear to be in contact with each other, the air cylinder is interposed between the second roll-type cleaning member 15 and the back surface of the substrate to be cleaned Wf. There is a gap more than the distance to the stroke end, and even if the second roll type cleaning member 15 is pushed up to the stroke end, the second roll type cleaning member 15 may not contact the back surface of the substrate to be cleaned Wf.

  The present invention has been made in view of the above points, and can accurately detect the positions where the first roll and the second roll contact the substrate and appropriately set the pressing amounts of the first roll and the second roll. It is an object of the present invention to provide a roll gap adjusting method for an apparatus.

  In order to solve the above problems, the present invention provides a substrate rotating mechanism for supporting and rotating a disk-shaped substrate, and a first sliding contact with the surface of the substrate while supporting and rotating the first roll on the first rotation axis. A roll rotation mechanism, and a second roll rotation mechanism that slides on the back surface of the substrate while rotating and supporting the second roll on a second rotation axis parallel to the first rotation axis and facing the substrate. A substrate processing apparatus roll gap adjusting method for adjusting a gap between a first roll and a second roll in a substrate processing apparatus comprising: a substrate rotating mechanism supporting a plate-like substrate jig corresponding to a substrate; The second roll rotation mechanism supports the second roll jig corresponding to the second roll, and the second roll rotation mechanism has a predetermined value so that the gap between the back surface of the substrate jig and the second roll jig becomes a predetermined value. Adjust the position and position the second row The first roll jig corresponding to the first roll supported by the first roll rotating mechanism is opposed to the jig so that the gap between the second roll jig and the first roll jig becomes a predetermined value. The position of the first roll rotation mechanism is adjusted and positioned, and then the first roll rotation mechanism and the second roll rotation mechanism are replaced with the first roll jig and the second roll jig, and the first roll and the second roll rotation mechanism are replaced. Two rolls are supported.

  According to the present invention, in the roll gap adjustment method of the substrate processing apparatus, the substrate jig is provided with a gap measurement window at a position corresponding to the second roll jig, and a dial gauge is used through the gap measurement window. Then, the gap between the back surface of the substrate jig and the second roll jig is measured, and the position of the second roll rotating mechanism is adjusted and positioned so that the gap becomes a predetermined value.

  In the roll gap adjusting method for a substrate processing apparatus according to the present invention, the gap adjustment between the second roll jig and the first roll jig may be performed after the second roll rotating mechanism is positioned and then the second roll jig. And positioning the position of the first roll rotating mechanism in a state where the second roll jig, the skimming gauge, and the first roll jig are in contact with each other. It is characterized by.

  According to the present invention, in the method for adjusting a roll gap of the substrate processing apparatus, the first and second roll jigs embed a rigid cylindrical material in a resin material, and the outer diameter of the outer periphery of the resin material is a second roll. It is formed in the shape of a roll having the same outer diameter as the outer diameter of the second roll, or formed in a cylindrical shape having a large diameter portion having the same outer diameter as the outer diameter of the second roll at least partially.

  Further, the present invention is characterized in that, in the roll gap adjusting method of the substrate processing apparatus, the resin material is PEEK, the rigid cylindrical material is SUS, and the outer diameter variation is 0.05 mm or less. To do.

  According to the present invention, the substrate rotating mechanism supports the plate-shaped substrate jig corresponding to the substrate, and the second roll rotating mechanism supports the second roll jig corresponding to the second roll, and the back surface of the substrate jig. The first roll is adjusted by positioning the second roll rotating mechanism so that the gap between the first roll rotating jig and the second roll jig becomes a predetermined value, and is supported by the first roll rotating mechanism. The first roll jig corresponding to the above is opposed, and the position of the first roll rotation mechanism is adjusted and positioned so that the gap between the second roll jig and the first roll jig becomes a predetermined value. After that, instead of the first roll jig and the second roll jig, the first roll and the second roll are supported by the first roll rotation mechanism and the second roll rotation mechanism. The position that contacts the front and back of the board can be managed accurately, It can be properly set a pressing amount of the roll and a second roll.

  According to the present invention, the position of the second roll rotating mechanism is adjusted by measuring the gap between the back surface of the substrate jig and the second roll jig using a dial gauge through the gap measurement window provided in the substrate jig. Therefore, the pressing amount of the second roll can be set after the second roll comes into contact with the back surface of the substrate accurately.

  Further, according to the present invention, after positioning the second roll rotating mechanism, a skimming gauge having a predetermined thickness is interposed between the second roll jig and the first roll jig, Since the position of the first roll rotating mechanism is positioned in a state where the skimming gauge and the first roll jig are in contact with each other, if the thickness of the skimming gauge is made equal to the thickness of the substrate, the pressing amount of the first roll is set to the first roll. Can be set after accurately contacting the back surface of the substrate.

  Further, according to the present invention, the first and second roll jigs embed a cylindrical member having high rigidity in a resin material, and the outer periphery of the resin material has an outer diameter that is the same as the outer diameter of the second roll. Or a cylindrical shape having a large diameter portion having the same outer diameter as the outer diameter of the second roll at least partially, and the variation in the outer diameter is, for example, 0.05 mm or less. The pressing amount of the second roll can be set with high accuracy.

  Embodiments of the present invention will be described below with reference to the drawings. In the present embodiment example, a substrate cleaning apparatus for cleaning a disk-shaped substrate such as a semiconductor substrate will be described. However, a roll gap adjusting method according to the present invention includes a first roll and a second roll, The present invention can be applied to a substrate processing apparatus that processes a substrate by bringing the second roll into contact with the rotating disk-shaped front and back surfaces. In this substrate cleaning apparatus, the substrate rotation mechanism for supporting and rotating the substrate to be cleaned has substantially the same configuration as the substrate rotation mechanism including the plurality of spindles 11 in FIG.

  FIG. 2 is a side view showing a schematic configuration excluding the substrate rotation mechanism of the substrate cleaning apparatus according to the present invention. As shown in the figure, the present substrate cleaning apparatus 10 supports the first roll type cleaning member 13 on the first rotation axis X1 and rotates the first roll so as to be in sliding contact with the surface of the substrate Wf to be cleaned. The mechanism 17 and the second roll-type cleaning member 15 are opposed to each other on the second rotation axis X2 parallel to the first rotation axis X1 so as to sandwich the substrate Wf to be cleaned, and are rotated while being supported and rotated. It is the structure provided with the 2nd roll rotation mechanism 18 made to slidably contact with a back surface. A disk-like substrate Wf to be cleaned such as a semiconductor substrate is rotated by a substrate rotating mechanism (see FIG. 1) including a plurality of spindles 11 that rotate while supporting the outer peripheral edge of the substrate Wf not shown. Reference numeral 33 denotes a stopper bolt (dial-type stopper) that restricts the lowering of the first roll rotating mechanism 17, and reference numeral 34 denotes a stopper bolt (dial-type stopper) that restricts the rising of the second roll rotating mechanism 18.

  The first roll rotation mechanism 17 is attached to the base 30 and can be moved up and down by a predetermined amount by the air cylinder 31. The second roll rotating mechanism 18 is attached to the base 30 and can be moved up and down by a predetermined amount by an air cylinder 32. The first roll type cleaning member 13 and the second roll type cleaning member 15 are roll sponges having a surface layer made of PVA. The first roll-type cleaning member 13 is pressed against the surface of the substrate to be cleaned Wf, the second roll-type cleaning member 15 is pressed against the back surface of the substrate to be cleaned Wf, and a cleaning liquid is sprayed from a cleaning liquid nozzle (not shown) on the front and back surfaces, The front and back surfaces of the substrate to be cleaned Wf are cleaned at the same time.

  The adjustment of the pressing load on the surface of the substrate to be cleaned Wf of the first roll type cleaning member 13 is performed by the air cylinder 31 after the first roll type cleaning member 13 comes into contact with the surface of the substrate to be cleaned Wf. The mold cleaning member 13 is pressed by the pressing amount of the surface of the substrate to be cleaned Wf, and the adjustment of the pressing load on the back surface of the substrate to be cleaned Wf of the second roll type cleaning member 15 is adjusted by the second roll type cleaning member 15 After contacting the back surface of Wf, the air cylinder 32 performs the second roll-type cleaning member 15 with the pressing amount of the back surface of the substrate Wf to be cleaned. Accordingly, in order to accurately set the pressing loads on the front and back surfaces of the substrate to be cleaned Wf and perform appropriate substrate cleaning, the first roll type cleaning member 13 and the second roll type cleaning member 15 are provided on the surface of the substrate to be cleaned Wf. And the position which contacts a back surface needs to be detected with sufficient accuracy, and the first roll type cleaning member 13 and the second roll type cleaning member 15 need to be positioned at the positions. Conventionally, this detection is performed by visual inspection. However, visual inspection is accurate in a narrow space in the substrate cleaning apparatus 10 in which the first roll type cleaning member 13, the second roll type cleaning member 15, and the substrate to be cleaned Wf are arranged. Cannot be detected. In particular, since the second roll-type cleaning member 15 is located below the substrate to be cleaned Wf, it is extremely difficult to visually detect the position where the second roll-type cleaning member 15 contacts the back surface of the substrate to be cleaned Wf. is there.

  Therefore, here, a roll jig (dummy roll-type cleaning member) configured as shown in FIG. 3 and a substrate jig (dummy cleaned substrate Wf) configured as shown in FIG. 4 are prepared. In a procedure described in detail later, the position where the second roll jig contacts the back surface of the substrate jig is detected, the second roll rotating mechanism 18 is positioned at this position, and the first roll jig is the substrate. A position in contact with the surface of the jig is detected, and the first roll rotation mechanism 17 is positioned at this position. Then, the first roll jig is changed to the first roll type cleaning member 13, the second roll jig is changed to the second roll type cleaning member 15, and the first roll type cleaning member 13 and the second roll type cleaning member 15, respectively. Is brought into contact with the front and back surfaces of the substrate to be cleaned Wf, and the front and back surfaces of the substrate to be cleaned Wf that is rotated by being supported by the substrate rotating mechanism are simultaneously cleaned while adjusting the pressing amount after the contact.

  3A and 3B are diagrams showing the configuration of the roll jig used for the first roll jig 40-1 and the second roll jig 40-2. FIG. 3A is a side view and FIG. 3B is a side sectional view. It is. As shown in FIG. 3, the roll jig 40 embeds a rigid cylindrical material (here, SUS cylindrical material) 42 as a mandrel in a resin material (here, PEEK resin material) 43, and the outer diameter is first and A plurality of (three in the figure) large diameter portions 41 having the same outer diameter as the second roll-type cleaning members 13 and 15 and a plurality (four in the figure) small diameter portions 44 having an outer diameter smaller than the large diameter portion 41. The resin material is cut out so as to be formed into a cylindrical shape. By embedding a SUS cylindrical material as a core rod in the PEEK material in this way, it is possible to suppress deformation at the time of machining the PEEK material, and it is possible to reduce variation in the outer diameter. Here, both the large diameter portion and the small diameter portion could have an outer diameter size variation of 0.05 mm or less.

  4A and 4B are diagrams showing the configuration of the substrate jig. FIG. 4A is a plan view and FIG. 4B is a front view. The substrate jig 50 has a disk shape, and the outer diameter and thickness thereof are substantially the same as the outer diameter and thickness of the substrate to be cleaned Wf. As will be described later, a distance between the surface (upper surface) of the substrate jig 50 and the outer peripheral top portion of the second roll jig 40-2 is measured for the substrate jig 50, and the back surface of the substrate jig 50 is measured. A gap measurement window 52 for detecting a gap between the first roll jig 40-2 and the outer peripheral surface of the second roll jig 40-2 is provided in the central portion, and gap measurement windows 51 are also provided on both sides thereof.

  Using the second roll jig 40-2, the substrate jig 50, and the dial gauge, the gap between the front surface (upper surface) of the substrate jig 50 and the outer peripheral top portion of the second roll jig 40-2 (the back surface of the substrate jig 50). And a method of measuring the gap between the outer peripheral surfaces of the second roll jig 40-2 will be described with reference to FIG. First, the second roll jig 40-2 is mounted on the roll mounting portion on which the second roll type cleaning member 15 of the second roll rotating mechanism 18 of the substrate cleaning apparatus 10 is mounted, and a plurality of spindles 11 ( As shown in FIG. 5, the outer peripheral portion of the substrate jig 50 is inserted into the circumferential groove 12a of the upper frame 12 of FIG. 1), and the substrate is supported by the plurality of frames 12 (here, four frames). To do. The width dimension of the circumferential groove 12a of the top 12 is substantially the same as the thickness dimension of the substrate jig 50, and the substrate jig 50 is inserted into the circumferential groove 12a of the top 12 without any gap.

  In this state, the air cylinder 32 (see FIG. 2) is operated to raise the second roll jig 40-2 mounted on the roll mounting portion of the second roll rotating mechanism 18, and the second roll jig 40- The top of the outer peripheral surface of the second large-diameter portion 41 is raised until it reaches the vicinity of the back surface position of the substrate jig 50. In this state, the distance between the top of the outer peripheral surface of the large-diameter portion 41 of the second roll jig 40-2 and the upper surface of the substrate jig 50 is measured using the dial gauge 45. Here, since the thickness of the substrate jig 50 is known, measuring the distance between the top of the outer peripheral surface of the large diameter portion 41 and the upper surface of the substrate jig 50 is the second roll jig 40-2. The gap between the large-diameter portion 41 and the back surface of the substrate jig 50 is measured. The second roll jig 40-2 is raised by the air cylinder 32 so that the gap becomes zero, and the outer peripheral surface of the large-diameter portion 41 of the second roll jig 40-2 becomes the substrate jig. It is possible to detect the position in contact with the back surface of 50.

  Further, the second roll jig 40-2 is raised and raised until the top of the outer peripheral surface of the small diameter portion 44 of the second roll jig 40-2 reaches the vicinity of the position where it contacts the back surface of the substrate jig 50. In this state, the distance between the top of the outer peripheral surface of the large-diameter portion 41 of the second roll jig 40-2 and the upper surface of the substrate jig 50 is measured using the dial gauge 45. Since the difference between the outer diameter of the large diameter portion 41 and the outer diameter of the small diameter portion 44 of the second roll jig 40-2 is known, the distance between the top of the outer peripheral surface of the small diameter portion 44 and the upper surface of the substrate jig 50. To measure the gap between the large-diameter portion 41 of the second roll jig 40-2 and the back surface of the substrate jig 50. Accordingly, the second roll jig 40-2 is lowered by the air cylinder 32 so that the gap becomes zero, and the outer peripheral surface of the large-diameter portion 41 of the second roll jig 40-2 becomes the substrate by becoming zero. The position in contact with the back surface of the jig 50 can be detected.

  As described above, the gap between the large-diameter portion 41 of the second roll jig 40-2 and the back surface of the substrate jig 50 is measured by the dial gauge 45 through the gap measurement window 52 and the gap measurement windows 51 and 51 on both sides thereof. By detecting the point (position) at which the gap becomes zero, the outer diameter variation of the second roll jig 40-2 can be extremely small as 0.05 mm or less as described above. When the second roll cleaning member 15 is mounted on the roll mounting portion of the two-roll rotating mechanism 18 instead of the second roll jig 40-2, the point that the gap becomes zero is that the second roll cleaning member 15 The entire top of the outer peripheral surface of the substrate is in contact with the back surface of the substrate to be cleaned Wf. The second roll rotation mechanism 18 is positioned at this position.

  The first roll rotating mechanism 17 is mounted on the first roll rotating mechanism 17 with reference to the position of the second roll jig 40-2 where the large-diameter portion 41 of the second roll jig 40-2 contacts the back surface of the substrate jig 50. The 1-roll jig 40-1 is positioned. As shown in FIG. 6, the first roll jig 40-1 is positioned on the second roll jig 40-2 positioned as described above with a predetermined thickness (substantially the same thickness as the thickness of the substrate to be cleaned Wf). 47, the first roll jig 40-1 mounted on the roll mounting portion of the first roll rotating mechanism 17 is lowered by the air cylinder 31, and the first roll jig 40-1 and the second roll are lowered. The first roll rotation mechanism 17 is positioned at the point (contact position) where the skimming gauge 47 is sandwiched between the jig 40-2.

  As described above, the point (position) where the large-diameter portion 41 of the second roll jig 40-2 contacts the back surface of the substrate jig 50 is detected by the dial gauge 45, and the second roll rotating mechanism 18 is detected at that point. The first roll rotating mechanism is positioned at a point (position) where the large diameter portion 41 of the first roll jig 40 is in contact with the skimming gauge 47 placed on the positioned second roll jig 40-2. 17 is positioned. Thus, when the first roll type cleaning member 13 and the second roll type cleaning member 15 are mounted on the roll mounting portions of the first roll rotation mechanism 17 and the second roll rotation mechanism 18, respectively, When the two-roll rotating mechanism 18 reaches the positioned position, the entire outer peripheral surface tops of the first roll-type cleaning member 13 and the second roll-type cleaning member 15 are in contact with the front and back surfaces of the substrate to be cleaned Wf, respectively. Alternatively, since the position reaches a position very close to the contact point, by adjusting the pressing amount of the first roll type cleaning member 13 and the second roll type cleaning member 15 from this position, the first roll type can be obtained with an appropriate load. The cleaning member 13 and the second roll-type cleaning member 15 can be pressed and cleaned against the front and back surfaces of the substrate to be cleaned Wf.

  In the embodiment, the point (contact position) where the gap between the large-diameter portion 41 of the second roll jig 40-2 and the back surface of the substrate jig 50 is zero is detected, and the second roll is detected at this position. The first roll is positioned at a point (contact position) where the large-diameter portion 41 of the first roll jig 40 is in contact with the skimming gauge 47 placed on the second roll jig 40-2. Although the rotation mechanism 17 is positioned, a position having a predetermined gap between the large-diameter portion 41 of the second roll jig 40-2 and the back surface of the substrate jig 50 that is extremely close to the second roll jig 40-2. The first roll rotating mechanism 17 may be positioned at a position having a predetermined gap in which the large diameter portion 41 of the first roll jig 40 is very close to the skimming gauge 47 placed thereon. In this case, the second roll-type cleaning member 15 and the first roll-type cleaning member 13 come into contact with the back surface and the front surface of the substrate to be cleaned Wf at a position that is raised and lowered by a predetermined amount from the positioned position. .

  FIG. 7 is an external view showing a state when the first roll-type cleaning member 13 is attached to the first roll rotation mechanism 17. As shown in the figure, the first roll rotating mechanism 17 is provided with a drive shaft portion 23 and a driven shaft portion 22, and the driven shaft portion 22 is attached to the end of the first roll type cleaning member 13 as shown in FIG. 9. A mounting socket 22b is provided. The mounting socket 22b is urged in a direction opposite to the direction indicated by the arrow G by a coil spring 22a. An engagement portion (not shown) provided at one end of the first roll type cleaning member 13 is engaged with the engagement portion 22c of the mounting socket 22b, and the first roll type cleaning member 13 is indicated by an arrow G, as shown in FIG. The coil spring 22a is pressed against the elastic force to move the other end of the first roll-type cleaning member 13 as indicated by an arrow H, and its engaging portion (not shown) is engaged with the driving shaft portion 23. The first roll-type cleaning member 13 can be mounted between the drive shaft portion 23 and the driven shaft portion 22 by being engaged with 23a.

  The drive shaft unit 23 is provided with a drive unit including a motor for rotating the first roll type cleaning member 13 (not shown), and the first roll type cleaning member 13 is driven to rotate by the drive unit. Thus, the end portion of the first roll type cleaning member 13 is rotatably supported by a bearing (ball bearing) 22d provided in the mounting socket 22b, and rotates between the drive shaft portion 23 and the driven shaft portion 22.

  FIG. 8 is an external view showing a state in which the second roll type cleaning member 15 is mounted on the second roll rotating mechanism 18. As shown in the drawing, the second roll rotating mechanism 18 is provided with a drive shaft portion 26 and a driven shaft portion 25. Although not shown in the driven shaft portion 25, a second configuration having the same configuration as shown in FIG. A mounting socket for mounting the roll type cleaning member 15 is provided, and the second roll type cleaning member 15 can be mounted between the drive shaft portion 26 and the driven shaft portion 25. The drive shaft portion 26 is provided with a drive portion having a motor or the like, and the second roll type cleaning member 15 is driven to rotate between the drive shaft portion 26 and the driven shaft portion 25 by the drive portion. Rotate.

  As shown in FIG. 10, the second roll-type cleaning member 15 has a sponge roller 15a inserted into a new roll sponge 15a, and a nut 15c is screwed into the end of the sponge shaft 15b. 15 is an assembled structure. The first roll type cleaning member 13 has the same configuration as the second roll type cleaning member 15. As described above, after the positioning of the second roll jig 40-2 of the second roll rotation mechanism 18 and the positioning of the first roll jig 40-1 of the first roll rotation mechanism 17 are finished, the substrate jig 50 Remove. Thereafter, the second roll-type cleaning member 15 is mounted between the driven shaft portion 25 and the drive shaft portion 26 of the second roll rotation mechanism 18 (see FIG. 8), and the first roll-type cleaning member 13 is attached to the first roll. The rotating shaft 17 is mounted between the driven shaft 22 and the drive shaft 23 (see FIG. 7). Subsequently, the substrate to be cleaned Wf is sandwiched between the four pieces 12. Then, the substrate to be cleaned Wf is rotated by rotating the driving piece among the four pieces 12.

  By raising the second roll rotating mechanism 18 by the air cylinder 32 until the second roll type cleaning member 15 reaches the position positioned by the second roll jig 40-2, the second roll type cleaning member 15 is covered. It contacts the back surface (lower surface) of the cleaning substrate Wf. Further, the first roll-type cleaning member 13 is lowered by the air cylinder 31 until the first roll-type rotation mechanism 17 is lowered until the first roll-type cleaning member 13 reaches the position positioned by the first roll jig 40-1. Contacts the surface (upper surface) of the substrate to be cleaned Wf. Further, since the substrate to be cleaned Wf, the second roll type cleaning member 15 and the first roll type cleaning member 13 rotate, and the cleaning liquid is supplied from the cleaning liquid nozzle 19 to the front and back surfaces of the substrate to be cleaned Wf, The front and back surfaces of the cleaning substrate Wf can be reliably cleaned. Further, by adjusting the lowering amount of the first roll type cleaning member 13 by the air cylinder 31 and the rising amount of the second roll type cleaning member 15 by the air cylinder 32, the first roll type cleaning member 13 and the second roll type cleaning member are adjusted. The pressing force of the member 15 to be cleaned Wf can be adjusted.

  The present invention has been described above by taking the first to fourth embodiments as examples. However, the present invention is not limited to the above-described embodiments, and the technical scope described in the claims, the specification, and the drawings. Various modifications are possible within the scope of the idea. For example, the first and second roll jigs 40-1 and 40-2 have a plurality of large-diameter portions 41 as shown in FIG. Either one or both of 40-2 may have the same diameter as the whole without the large-diameter portion 41 and the same cylindrical shape as the outer diameter of the first roll type cleaning member 13 and the second roll type cleaning member 15. .

It is a figure which shows schematic structure of a board | substrate cleaning apparatus. It is a side view which shows schematic structure except the board | substrate rotation mechanism of the board | substrate cleaning apparatus which concerns on this invention. It is a figure which shows the structural example of the roll jig | tool used for the roll clearance gap adjustment method of the substrate processing apparatus of this invention, (a) is a side view, (b) is a sectional side view. It is a figure which shows the structural example of the board | substrate jig | tool used for the roll clearance gap adjustment method of the substrate processing apparatus of this invention. It is a figure for demonstrating the roll clearance gap adjustment method of the substrate processing apparatus of this invention. It is a figure for demonstrating the roll clearance gap adjustment method of the substrate processing apparatus of this invention. It is an external view which shows a state when mounting | wearing with a 1st roll type washing | cleaning member to a 1st roll rotation mechanism. It is an external view which shows the state which mounted | wore the 2nd roll type | mold cleaning member with the 2nd roll rotation mechanism. It is sectional drawing which shows the structure of a mounting socket. It is a disassembled perspective view which shows the structure of a roll type washing | cleaning member.

Explanation of symbols

10 Substrate cleaning device 11 Spindle
12 frames
13 First Roll Type Cleaning Member 15 Second Roll Type Cleaning Member 17 First Roll Rotating Mechanism 18 Second Roll Rotating Mechanism 19 Cleaning Liquid Nozzle 20 Cleaning Arm 21 Oscillating Shaft 22 Driven Shaft Part 23 Drive Shaft Part 25 Driven Shaft Part 26 Drive Shaft 30 Base 31 Air cylinder 32 Air cylinder 33 Stopper bolt (Dial type stopper)
34 Stopper bolt (Dial type stopper)
40 Roll jig 41 Large diameter portion 44 Small diameter portion 45 Dial gauge 47 Clearance gauge 50 Substrate jig 51 Gap measurement window 52 Gap measurement window

Claims (4)

A substrate rotating mechanism for supporting and rotating a disk-shaped substrate;
A first roll rotation mechanism for slidingly contacting the surface of the substrate while rotating while supporting and rotating the first roll on the first rotation axis;
A second roll rotation mechanism for slidingly contacting the back surface of the substrate while rotating and supporting the second roll on a second rotation axis parallel to the first rotation axis and facing the substrate. A roll gap adjusting method for a substrate processing apparatus for adjusting a gap between the first roll and the second roll in a substrate processing apparatus comprising:
The substrate rotation mechanism supports a plate-shaped substrate jig corresponding to the substrate, the second roll rotation mechanism supports a second roll jig corresponding to the second roll, and the substrate jig back surface Adjusting and positioning the position of the second roll rotating mechanism so that the gap between the second roll jigs is a predetermined value;
The first roll jig corresponding to the first roll supported by the first roll rotation mechanism is opposed to the second roll jig, and a gap between the second roll jig and the first roll jig Adjusting the position of the first roll rotation mechanism so that becomes a predetermined value,
Thereafter, the first roll rotation mechanism and the second roll rotation mechanism are supported by the first roll jig and the second roll jig in place of the first roll jig and the second roll jig. A roll gap adjustment method for a substrate processing apparatus. In the roll clearance adjustment method of the substrate processing apparatus according to claim 1,
The substrate jig is provided with a gap measurement window at a position corresponding to the second roll jig, and a gap between the back surface of the substrate jig and the second roll jig is provided using a dial gauge through the gap measurement window. And adjusting the position of the second roll rotation mechanism so that the gap becomes the predetermined value, and adjusting the roll gap of the substrate processing apparatus. In the roll clearance adjustment method of the substrate processing apparatus according to claim 1,
The gap adjustment between the second roll jig and the first roll jig is performed by positioning the second roll rotation mechanism and then setting a predetermined value between the second roll jig and the first roll jig. A roll gap of a substrate processing apparatus, wherein a position of the first roll rotating mechanism is positioned in a state where the second roll jig, the skimmer gauge, and the first roll jig are in contact with each other through a thickness gauge having a thickness. Adjustment method. In the roll gap adjustment method of the substrate processing apparatus according to any one of claims 1 to 3,
The first and second roll jigs are formed by embedding a rigid cylindrical material in a resin material and forming the outer periphery of the resin material in a roll shape having an outer diameter equal to the outer diameter of the second roll. Alternatively, a roll gap adjusting method for a substrate processing apparatus, wherein the roll gap is formed in a cylindrical shape having a large diameter portion having the same outer diameter as that of the second roll at least partially.

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