JP2010108779A - Shield material and manufacturing method therefor, flexible flat cable, manufacturing method therefor, and electronic apparatus thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress occurrence of short circuits in a metal layer of a shielding material. <P>SOLUTION: An insulating adhesive member 13 for covering a portion, excluding both end parts of conductors 12a-12f is laminated on an insulating material 14. The insulating adhesive member 13 is formed by two insulating adhesive layers which pinch the conductors 12a-12f from the upper side and the lower side directions mutually melting by lamination. An insulating material 11 is laminated on the insulating adhesive member 13, and the insulating member 11 is adhered to the insulating adhesive member 13. Furthermore, the insulating adhesive member 13 is adhered to the insulating material 14 on the lower side. The insulating material 14 is adhered to a shielding part 16, in which the side face of the shield layer is covered by an insulating adhesive layer on the lower side. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a shield material that suppresses noise caused by an electromagnetic field, a manufacturing method thereof, a flexible flat cable using the shield material, a manufacturing method thereof, and an electronic device equipped with the flexible flat cable.

  In recent years, in signal processing performed by many electrical products and electronic devices such as home appliances such as flat-screen television devices, office equipment such as large-sized copying machines, and medical equipment, the speed of signals has been rapidly increasing. Accordingly, many cables such as flexible flat cables (hereinafter referred to as “FFC”) used in these electrical products and electronic devices are required to have improved electrical characteristics such as impedance control. It is becoming. As household appliances such as large-sized television devices intensify cost competition, inexpensive and long-length FFCs are useful.

  The impedance of the impedance control FFC is controlled by the physical size of the conductor serving as the signal line and the shield material positioned on the exterior of the FFC main body. The shield material has a structure that is affixed to one side of the FFC main body and a structure that covers the outer periphery of the FFC main body.

The shielding material used for the impedance control FFC is required to suppress noise and improve transmission characteristics. As the transmission speed of signal lines increases, the influence of the shielding material on the improvement of signal transmission characteristics increases.
JP 2002-184245 A

  In order to realize high-speed signal transmission, the shield FFC having such a shield material is required to improve not only the characteristic impedance and the eye pattern, but particularly the transmission characteristics of the conductor that becomes the signal line. For example, in the low frequency band of 5 GHz or less, the conductor loss is most related to this transmission characteristic, and in particular, the thickness of the metal layer of the shield material greatly affects the conductor loss. Conventionally, a metal layer made of metal such as Al or Ag having a thickness of less than 1 μm has been applied to a shield material used for the shield FFC by a method such as vapor deposition in consideration of workability and flexibility. However, the shield FFC using a thin metal layer of less than 1 μm has poor transmission characteristics.

  In order to improve the transmission characteristics for realizing high-speed signal transmission, a shielding material having a metal layer having a thickness of at least several μm is necessary in consideration of the skin effect and the like.

  FIG. 13 is a diagram showing the transmission characteristics (Sdd21) of a conductor in a shield FFC using a conventional shield material with a metal layer thickness of 0.1 μm and a conventional shield material with a metal layer thickness of 8 μm. It is. In FIG. 13, a curve a shows the transmission characteristics of the conductor in the shield FFC using a shield material with a metal layer thickness of 8 μm, and a curve b shows the shield material with a metal layer thickness of 0.1 μm. The transmission characteristic of the conductor in the used shield FFC is shown. In the frequency band shown in FIG. 13, it can be seen that the transmission characteristics of the conductor of the shield FFC using the shield material with the metal layer thickness of 8 μm is better than the shield material with the metal layer thickness of 0.1 μm. .

  The shield FFC using a shield material having a metal layer with a thickness of several μm or more has excellent electrical characteristics including such transmission characteristics, characteristic impedance, and eye pattern, and realizes high-speed signal transmission. Is possible.

  FIG. 14 is a cross-sectional view of a shield FFC 100 using a shield material having a metal layer with a thickness of several μm or more. In the shield FFC 100, the shield layer 107 is formed by laminating an insulating material 104, a metal layer 105, and a conductive adhesive layer 106 in this order. The shield FFC 100 is formed by sequentially laminating an insulating material 103 and an insulating adhesive layer 101 covering the conductors 102a to 102f on the shield layer 107.

  As shown in FIG. 14, when the thickness of the metal layer 105 is several μm or more, there is a possibility that a short circuit occurs at the end of the shield FFC 100 where the metal layer 105 is exposed, that is, the side surface of the metal layer 105. is there.

  For the purpose of insulating the metal layer of the shield material, a method such as attaching an insulating film to the side surface of the shield material can be considered. However, this method causes problems such as deterioration in flexibility and high cost.

  This invention is proposed in view of such a conventional situation, and it aims at suppressing generation | occurrence | production of the short circuit in the metal layer of the shield material used for shield FFC.

  In order to achieve the above-described object, a method for manufacturing a shield material according to the present invention includes a shield layer in which an insulating material, a metal layer, and a conductive adhesive layer are laminated in this order, and an insulating adhesive layer. A method of manufacturing a shield material in which the insulating adhesive layer is laminated on the conductive adhesive layer by thermocompression bonding, wherein the insulating property is obtained by thermocompression bonding of the shield layer and the insulating adhesive layer. When the insulating adhesive constituting the adhesive layer melts, the end of the insulating adhesive layer hangs down and covers at least the side surface of the conductive adhesive layer and the side surface of the metal layer. It is a manufacturing method.

  In order to achieve the above-described object, the shield material according to the present invention includes a shield layer in which an insulating material, a metal layer, and a conductive adhesive layer are laminated in this order, and the conductive adhesive layer. A shield material having a laminated insulating adhesive layer, wherein an end of the insulating adhesive layer is suspended, and at least a side surface of the conductive adhesive layer is formed by the suspended insulating adhesive layer. And a shielding material in which a side surface of the metal layer is coated.

  In order to achieve the above-described object, a flexible flat cable manufacturing method according to the present invention includes a shield layer in which a first insulating material, a metal layer, and a conductive adhesive layer are laminated in this order, A first step of manufacturing a shield material in which the first insulating adhesive layer is laminated on the conductive adhesive layer; and the shield material, A second insulating material provided with a plurality of conductors is thermocompression bonded to a laminate in which the second insulating material is laminated on the second insulating adhesive layer, and the second insulating material is formed on the first insulating adhesive layer. A second step of manufacturing a flexible flat cable in which a conductive adhesive layer is laminated. In the first step, the first step is performed by thermocompression bonding of the shield layer and the first insulating adhesive layer. The first insulating adhesive constituting the first insulating adhesive layer melts The end of the insulating adhesive layer hangs down to cover at least the side surface of the conductive adhesive layer and the side surface of the metal layer, and in the second step, the shield material and the laminate are When the second insulating adhesive constituting the second insulating adhesive layer is melted by thermocompression bonding, an end of the first insulating adhesive layer hangs down and at least the first insulating adhesive The method of manufacturing a flexible flat cable further covers the side surface of the conductive adhesive layer covered with a conductive adhesive layer and the side surface of the metal layer covered with the first insulating adhesive layer.

  In order to achieve the above-described object, a flexible flat cable according to the present invention includes a shield layer in which a first insulating material, a metal layer, and a conductive adhesive layer are laminated in this order, and the conductive adhesive. A first insulating adhesive layer having a first insulating adhesive layer laminated on the agent layer, wherein at least a side surface of the conductive adhesive layer and a side surface of the metal layer are suspended. A flexible flat cable in which a laminated body in which a second insulating material provided with a plurality of conductors is laminated on a second insulating adhesive layer is laminated on the shield material covered with a layer. The at least one side surface of the conductive adhesive layer covered by the first insulating adhesive layer and the first insulating adhesive layer are covered by the suspended second insulating adhesive layer. Further coated on the side surface of the metal layer A flexible flat cable comprising been.

  In order to achieve the above-described object, an electronic device according to the present invention is an electronic device equipped with the flexible flat cable of the present invention.

  According to the present invention, since the metal layer of the shield material is covered with the insulating adhesive layer, occurrence of a short circuit is suppressed at the end of the shield material.

  Hereinafter, specific embodiments to which the present invention is applied will be described in detail with reference to the drawings.

  The shielded flexible flat cable (hereinafter referred to as “shield FFC”) in the present embodiment is formed by attaching a shield material that suppresses noise due to external electromagnetic waves and controls impedance.

  FIG. 1 is an external view of a shield FFC 1 in the present embodiment. FIG. 2A is a top view of the shield FFC1, and FIG. 2B is a bottom view of the shield FFC1.

  As shown in FIG. 2A, in the shield FFC1, conductors 12a to 12f as signal lines are arranged in parallel at a pitch of 0.5 mm on the insulating material. The conductors 12a to 12f each have a width of 0.3 mm and a thickness of 0.035 mm.

  As shown in FIG. 1, the conductors 12 a to 12 f are covered with an insulating adhesive member 13 except for both ends. The conductors 12a to 12f are bonded to the insulating adhesive member 13 on the lower surfaces of both ends. The number of conductors 12 is not limited to this.

  On the insulating material 14, an insulating adhesive member 13 that covers portions other than both ends of the conductors 12a to 12f is laminated, and the insulating material 14 and the insulating adhesive member 13 are bonded to each other. The insulating adhesive member 13 is formed by melting two insulating adhesive layers sandwiching the conductors 12a to 12f from the upper surface and the lower surface thereof and laminating them by a laminate described later. An insulating material 11 is laminated on the insulating adhesive member 13, and the insulating adhesive member 13 and the insulating material 11 are bonded to each other.

  The insulating material 14 is bonded to a shield portion 16 having a shield layer covered with an insulating adhesive on the lower surface thereof.

  Further, the insulating material 14 is bonded to the reinforcing plates 15a and 15b via insulating adhesive layers (not shown) at both ends of the lower surface thereof. The reinforcing plates 15a and 15b are bonded by, for example, hot pressing.

  FIG. 3 is a cross-sectional view of the shield FFC1 shown in FIG. Here, the AA line cuts the shield FFC1 so as to cut in the longitudinal direction of the conductor 12c. 4 is a cross-sectional view taken along line BB of the shield FFC1 shown in FIG. Here, the BB line cuts the shield FFC1 in the short direction.

  As shown in FIG. 3, the insulating material 14, the insulating adhesive layer 13b, the conductor 12c, the insulating adhesive layer 13a, and the insulating material 11 are laminated in this order. Note that in the actual configuration of the shield FFC1, the insulating adhesive member 13 formed by melting the insulating adhesive layer 13a and the insulating adhesive layer 13b in each other except for both ends of the conductor 12c. Covered with

  In the shield part 16, the shield layer 20 is formed by laminating an insulating material 17, a metal layer 18, and a conductive adhesive layer 19 in this order. An insulating adhesive layer 21 is laminated on the conductive adhesive layer 19. The metal layer 18 functions as a ground for the conductors 12a to 12f as signal lines while suppressing noise due to an external electromagnetic field. As shown in the top view of FIG. 2 (A), the bottom view of FIG. 2 (B), and the cross-sectional views of FIGS. 3 and 4, the shield FFC 1 is an insulating adhesive in which the side surface of the shield layer 20 hangs down. Covered by layer 21. Here, at least the side surface of the conductive adhesive layer 19 and the side surface of the metal layer 18 in the shield layer 20 are completely covered with the insulating adhesive layer 21 and are not exposed. For this reason, in the shield FFC1, occurrence of a short circuit (short circuit) at the end portion (edge portion) is suppressed.

  Examples of the conductors 12a to 12f include soft copper that has been surface-treated by tin plating.

  Further, as the insulating materials 11, 14, and 17, for example, an insulating film such as polyethylene terephthalate (PET) can be used.

  Examples of the insulating adhesive constituting the insulating adhesive member 13 and the insulating adhesive constituting the insulating adhesive layer 21 include flame retardant polyester resin, vinyl chloride resin, flame retardant polyethylene resin, and the like. And flame retardant and insulating thermoplastic resins. The insulating adhesive is preferably a non-halogen material. The insulating adhesive member 13 and the insulating adhesive layer 21 are preferably made of the same insulating adhesive.

  Moreover, as a material which comprises the reinforcement boards 15a and 15b, insulating films, such as a polyethylene terephthalate, can be mentioned, for example.

  The metal layer 18 may be made of a highly permeable metal foil such as iron or nickel, a highly conductive metal foil such as copper, an aluminum foil, or zinc.

  In the present embodiment, the shield FFC 1 is manufactured by a two-stage laminate described below.

  First, as shown in FIG. 5 (A), the insulating layer 17, the metal layer 18, and the conductive adhesive layer 19 are laminated in this order, and the shield layer 20 and the insulating adhesive layer 22 are thermocompression bonded. In this embodiment, a laminating process is performed as a thermocompression bonding process. That is, the laminator 31 is laminated in a state where the shield layer 20 and the insulating adhesive layer 22 are overlapped (first laminating process). Here, the thickness of the insulating adhesive layer 22 before lamination can be several tens of μm or more.

  The laminator 31 includes center portions 32a and 32b made of, for example, glass, and surface portions 33a and 33b made of, for example, silicon rubber covering the center portions 32a and 32b, respectively. Here, the heating temperature at the time of laminating the laminator 31 can be set to 100 to 120 ° C., for example. The line speed of the laminator 31 can be 1.5 m / min.

  By the first laminating process, the insulating adhesive constituting the insulating adhesive layer 22 is melted and the insulating adhesive layer 22 hangs down. As shown in FIG. 5 (B), the shield material 41 is manufactured in which the side surface of the shield layer 20 is covered with the hanging insulating adhesive layer 22. The manufactured shield material 41 is naturally cooled by leaving it at room temperature.

  6 is an external view of the shield material 41, FIG. 7A is a cross-sectional view taken along the line CC of the shield material 41 shown in FIG. 6, and FIG. 7B is a shield material shown in FIG. 41 is a sectional view taken along line DD of FIG. 41. FIG.

  As shown in FIGS. 7A and 7B, the shield material 41 has the side surface of the shield layer 20 covered with the end portion of the insulating adhesive layer 22 that hangs down. Here, at least the side surface of the conductive adhesive layer 19 and the side surface of the metal layer 18 in the shield layer 20 are completely covered with the insulating adhesive layer 22 and are not exposed. For this reason, occurrence of a short circuit at the end of the shield FFC1 is suppressed.

  In order to prevent at least the side surface of the conductive adhesive layer 19 and the side surface of the metal layer 18 in the shield layer 20 from being completely covered with the insulating adhesive layer 22 and exposed, the shield layer 20 and the insulating adhesive layer 22 are not exposed. The melt viscosity of the insulating adhesive constituting the insulating adhesive layer 22 at the time of lamination is preferably 0.01 MPa · s to 100 MPa · s.

  When the melt viscosity of the insulating adhesive constituting the insulating adhesive layer 22 is less than 0.01 MPa · s, the insulating adhesive of the insulating adhesive layer 22 may drip on the side surface of the shield layer 20. In addition, there is a possibility that a missing portion is generated in the insulating adhesive layer 22 covering the side surface of the shield layer 20 and the metal layer 18 is exposed.

  On the other hand, when the melt viscosity of the insulating adhesive constituting the insulating adhesive layer 22 is greater than 100 MPa · s, even if the insulating adhesive constituting the insulating adhesive layer 22 melts during lamination, this If the insulating adhesive is too hard, at least the side surface of the conductive adhesive layer 19 and the side surface of the metal layer 18 in the shield layer 20 may not be completely covered.

  The thickness of the metal layer 18 can be 2 μm or more. By setting the thickness of the metal layer 18 to 2 μm or more, the shield FFC1 has excellent electrical characteristics such as transmission characteristics, characteristic impedance, and eye pattern in the conductors 12a to 12f, and high-speed signal transmission can be realized.

  If the thickness of the metal layer 18 is 2 μm or more, the thicknesses of the insulating material 17, the metal layer 18, the conductive adhesive layer 19, and the insulating adhesive layer 22 can be arbitrarily set. . In the present embodiment, in consideration of the melt viscosity of the insulating adhesive constituting the insulating adhesive layer 22, at least the side surface of the metal layer 18 and the side surface of the conductive adhesive layer 19 are completely covered. Each value can be set.

  Next, as shown in FIG. 8A, the shield material 41 and a base FFC 42 having conductors 12a to 12f (referred to as conductor 12 in FIG. 8) are thermocompression bonded. In the base FFC 42, the insulating adhesive layer 23, the insulating material 14, the insulating adhesive member 13 covering the portions excluding both ends of the conductors 12a to 12f, and the insulating material 11 are laminated in this order. Reinforcing plates 15a and 15b are bonded to the lower surface via an insulating adhesive layer (not shown).

  Specifically, the base FFC 42 and the shield material 41 are laminated by the laminator 31 so that the lower surface of the insulating adhesive layer 23 of the base FFC 42 and the upper surface of the shield material 41 are overlapped (second laminating process). Here, the thickness of the insulating adhesive layer 23 before lamination can be several tens of μm or more.

  By the second laminating process, the insulating adhesive layer 23 hangs down by melting the insulating adhesive constituting the insulating adhesive layer 23 by the lamination, and the shield layer 20 covers the insulating adhesive layer 22. The side surface of the shield material 41 thus formed is further covered. Here, the adhesive constituting the insulating adhesive layer 23 and the insulating adhesive constituting the insulating adhesive layer 22 are melted to form an insulating adhesive layer 21 that is thicker than the insulating adhesive layer 22. Constitute.

  Specifically, at least the side surface of the metal layer 18 and the side surface of the conductive adhesive layer 19 are completely covered with the insulating adhesive layer 21 thicker than the insulating adhesive layer 22 and are not exposed. Such further covering with the insulating adhesive layer 21 makes it difficult for the insulating adhesive layer 21 to be damaged, and reduces the possibility that the side surface of the conductive adhesive layer 19 and the side surface of the metal layer 18 will be exposed later.

  By such first and second laminating processes, a shield FFC1 having a shield portion 16 as shown in FIG. 8B is manufactured. Then, the manufactured shield FFC1 is left at room temperature to naturally cool.

  The melt viscosity of the insulating adhesive constituting the insulating adhesive layer 22 at the time of laminating the base FFC 42 and the shield material 41 is 0.01 MPa · for the same reason as described in the explanation of the first laminating process. It is preferably s to 100 MPa · s.

  Further, as described above, the thickness of the insulating adhesive layer 23 can be arbitrarily set. That is, in consideration of the melt viscosity of the insulating adhesive constituting the insulating adhesive layers 22 and 23, the value is such that at least the side surface of the metal layer 18 and the side surface of the conductive adhesive layer 19 are completely covered. Can be set.

  In the present embodiment, a shield FFC in which the shield material manufactured by the method for manufacturing a shield material in the present embodiment is provided on the outer periphery of the base FFC having the conductors 12a to 12f can be manufactured.

  FIG. 9 is an external view of the shield FFC 2 in which the shield material 41 is provided on the outer periphery of the base FFC 43. FIG. 10A is a top view of the shield FFC2, and FIG. 10B is a bottom view of the shield FFC2. In the shield FFC2, the same components as those of the shield FFC1 are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 9, the shield FFC2 has a shield material 41 wound around an outer peripheral portion except for both ends of a base FFC43 having conductors 12a to 12f. As shown in FIG. , The shield materials 41 are bonded to each other.

  FIG. 11 is a cross-sectional view taken along line DD of the shield FFC2 shown in FIG. As shown in FIG. 11, the shield FFC 2 includes an insulating material 14, an insulating adhesive member 13 covering the conductors 12 a to 12 f, and a base FFC 43 in which the insulating material 11 is laminated in this order, and the base FFC 43. It is comprised from the shielding material 41 which coat | covers an outer periphery.

  As described above, the shield material 41 is laminated on the upper surface of the conductive adhesive layer 19 and the shield layer 20 in which the insulating material 17, the metal layer 18, and the conductive adhesive layer 19 are laminated in this order. And an insulating adhesive layer 22. The part where the shield materials 41 are attached is bonded via the insulating adhesive layer 22.

  The shield FFC 2 is manufactured by winding a shield material 41 around the outer periphery of the base FFC 43 and laminating it with a laminator 31. Here, the conditions for laminating the base FFC 43 and the shield material 41 are the same as the conditions for laminating the shield FFC 1 described above. That is, the heating temperature when laminator 31 is laminated can be set to 100 to 120 ° C. The line speed during laminator 31 lamination can be 1.5 m / min.

  The shield FFC in the present embodiment as described above can be mounted on an electronic device such as a television apparatus provided with a flat panel display, for example. Such a thin television device requires a high-performance image transmission device in order to achieve high image quality. The shield FFC according to the present embodiment realizes high-speed signal transmission while suppressing a short circuit by covering an end portion of a shield material having a metal layer having a thickness of 2 μm or more with an insulating adhesive layer. Therefore, it can be mounted on such an electronic device.

  Hereinafter, specific examples of the present invention will be described. In this example, the shield FFC shown in FIG. 1 was manufactured by the manufacturing method in the present embodiment described above.

  First, the shield material shown in FIG. 6 was manufactured. That is, the laminate was laminated by a laminator in a state where the shield layer and the insulating adhesive layer in which the insulating material, the metal layer, and the conductive adhesive layer were laminated in this order were overlapped.

  Here, the thickness of the insulating adhesive layer before lamination was 40 μm. As the metal layer, a copper foil having a thickness of 8 μm was used. As an insulating adhesive constituting the insulating adhesive layer, a halogen-free TC film (SCID (Sony Chemical & Information Device)) made of a flame-retardant polyester resin was used. Moreover, the line speed of the laminator was 1.5 m / min, and the heating temperature of the laminator was 120 ° C.

  FIG. 12 is a diagram showing the relationship between the temperature [° C.] and the viscosity [MPa · s] of the flame-retardant polyester resin as the insulating adhesive. By setting the heating temperature of the laminator to 120 ° C., the melt viscosity of the flame-retardant polyester resin as the insulating adhesive during lamination was about 0.1 MPa · s.

  By this laminating process, the insulating adhesive constituting the insulating adhesive layer is melted and the insulating adhesive layer hangs down, and the entire side surface of the shield layer is covered with the dropped insulating adhesive layer. Was manufactured. The manufactured shielding material was naturally cooled by leaving it at room temperature.

  Next, the shield FFC shown in FIG. 1 was manufactured. That is, the base FFC and the shield material were laminated by a laminator so that the lower surface of the insulating adhesive layer of the base FFC and the upper surface of the shield material were overlapped. Also here, the line speed of the laminator was 1.5 m / min, and the heating temperature of the laminator was 120 ° C. For this reason, the melt viscosity of the flame retardant polyester resin as the insulating adhesive during lamination was about 0.1 MPa · s.

  As the insulating adhesive constituting the insulating adhesive layer of the base FFC, a halogen-free TC film (manufactured by SCID) made of the above flame-retardant polyester resin was used. The thickness of the insulating adhesive layer included in the base FFC before lamination was 40 μm.

  By this laminating process, the insulating adhesive layer of the base FFC hangs down by melting the insulating adhesive constituting the insulating adhesive layer, and the shield layer is covered with the insulating adhesive layer. The entire side of the material was further coated. Here, the adhesive that constitutes the insulating adhesive layer and the insulating adhesive that constitutes the insulating adhesive layer are melted together, so that the insulating property is thicker than the insulating adhesive layer of the shield material before lamination. An adhesive layer was constructed.

  The total length of the manufactured shield FFC was 200 mm. The conductor pitch of the shield FFC was 0.5 mm, and the number of pins was 21 pin.

  In the manufactured shield FFC, the side surface of the shield material was completely covered with the insulating adhesive layer. Thereby, the manufactured shield FFC has good electrical characteristics such as transmission characteristics, characteristic impedance, and eye pattern in the conductor, and can be a shield FFC capable of realizing high-speed signal transmission.

  It should be noted that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention.

It is an external view of the shield FFC in this Embodiment. 2A is a top view of the shield FFC shown in FIG. 1, and FIG. 2B is a bottom view of the shield FFC shown in FIG. It is the sectional view on the AA line of the shield FFC shown in FIG. It is the BB sectional view taken on the line of shield FFC shown in FIG. FIG. 5A is a diagram for explaining the first laminating process, and FIG. 5B is a side view of the shield material manufactured by the first laminating process. It is an external view of the shielding material manufactured by the 1st lamination process. 7A is a cross-sectional view of the shield material shown in FIG. 6 taken along the line CC, and FIG. 7B is a cross-sectional view of the shield material shown in FIG. FIG. 8A is a diagram for explaining the second laminating process, and FIG. 8B is a side view of the shield FFC manufactured by the second laminating process. It is an external view of shield FFC which provided the shield material in this embodiment in the perimeter of base FFC. FIG. 10A is a top view of the shield FFC shown in FIG. 9, and FIG. 10B is a bottom view of the shield FFC shown in FIG. It is the DD sectional view taken on the line of shield FFC shown in FIG. It is a figure which shows the relationship between the temperature [degreeC] and the viscosity [MPa * s] of the flame-retardant polyester resin as an insulating adhesive agent. It is a figure which shows the permeation | transmission characteristic in the conventional shield material whose thickness of a metal layer is 0.1 micrometer, and the conventional shield material whose thickness of a metal layer is 8 micrometers. It is sectional drawing of the conventional general shield material.

Explanation of symbols

  1, 2, Shield FFC, 11, 14, 17 Insulating material, 12a to 12f Conductor, 13 Insulating adhesive member, 15a, 15b Reinforcement plate, 16 Shield part, 18 Metal layer, 19 Conductive adhesive layer, 20 Shield layer, 21, 22, 23 Insulating adhesive layer, 31 Laminator 41 Shielding material

Claims (15)

The insulating layer, the metal layer, and the conductive adhesive layer are laminated in this order, and the insulating adhesive layer is thermocompression bonded, and the insulating adhesive layer is laminated on the conductive adhesive layer. A method of manufacturing a shield material,
When the insulating adhesive constituting the insulating adhesive layer is melted by thermocompression bonding between the shield layer and the insulating adhesive layer, the end of the insulating adhesive layer hangs down to at least the conductive layer. Manufacturing method of the shielding material which coat | covers the side surface of an adhesive agent layer, and the side surface of the said metal layer.   The method for producing a shielding material according to claim 1, wherein the insulating adhesive has a melt viscosity of 0.01 MPa · s to 100 MPa · s.   The method for manufacturing a shielding material according to claim 2, wherein the insulating adhesive is a thermoplastic resin.   The method for manufacturing a shielding material according to claim 3, wherein the insulating adhesive is a flame retardant polyester resin, a vinyl chloride resin, or a flame retardant polyethylene resin.   The method for manufacturing a shield material according to claim 1, wherein the metal constituting the metal layer is copper.   The method for manufacturing a shield material according to claim 1, wherein the thickness of the metal layer is 2 μm or more. A shield material having a shield layer in which an insulating material, a metal layer, and a conductive adhesive layer are laminated in this order, and an insulating adhesive layer laminated on the conductive adhesive layer,
A shield material in which an end portion of the insulating adhesive layer is suspended, and at least a side surface of the conductive adhesive layer and a side surface of the metal layer are covered with the suspended insulating adhesive layer. The first insulating material, the metal layer, and the conductive adhesive layer are laminated in this order, and the first insulating adhesive layer is thermocompression bonded, and the first insulating material, the metal layer, and the conductive adhesive layer are placed on the conductive adhesive layer. A first step of manufacturing a shielding material in which one insulating adhesive layer is laminated;
The shield material and a laminated body in which a second insulating material provided with a plurality of conductors is laminated on a second insulating adhesive layer are thermocompression-bonded, and on the first insulating adhesive layer A second step of manufacturing a flexible flat cable on which the second insulating adhesive layer is laminated,
In the first step, by melting the first insulating adhesive constituting the first insulating adhesive layer by thermocompression bonding of the shield layer and the first insulating adhesive layer, The end of the insulating adhesive layer hangs down and covers at least the side surface of the conductive adhesive layer and the side surface of the metal layer,
In the second step, the second insulating adhesive constituting the second insulating adhesive layer is melted by thermocompression bonding of the shield material and the laminate, whereby the first insulating property is obtained. An end portion of the adhesive layer hangs down and at least the side surface of the conductive adhesive layer covered with the first insulating adhesive layer and the metal layer covered with the first insulating adhesive layer. A method for producing a flexible flat cable for further covering a side surface.   The method for producing a flexible flat cable according to claim 8, wherein melt viscosity of the first insulating adhesive and the second insulating adhesive is 0.01 MPa · s to 100 MPa · s.   The method for manufacturing a flexible flat cable according to claim 9, wherein the first insulating adhesive and the second insulating adhesive are thermoplastic resins.   The method for producing a flexible flat cable according to claim 10, wherein the first insulating adhesive and the second insulating adhesive are a flame retardant polyester resin, a vinyl chloride resin, or a flame retardant polyethylene resin.   The method for producing a flexible flat cable according to claim 8, wherein the metal constituting the metal layer is copper.   The method of manufacturing a flexible flat cable according to claim 8, wherein the metal layer has a thickness of 2 μm or more. A shield material having a shield layer in which a first insulating material, a metal layer, and a conductive adhesive layer are laminated in this order, and a first insulating adhesive layer laminated on the conductive adhesive layer And a plurality of conductors are disposed on the shield material in which at least a side surface of the conductive adhesive layer and a side surface of the metal layer are covered with the suspended first insulating adhesive layer. A flexible flat cable in which a laminate in which two insulating materials are laminated on a second insulating adhesive layer is laminated,
At least the side surface of the conductive adhesive layer covered by the first insulating adhesive layer and the first insulating adhesive layer covered by the suspended second insulating adhesive layer. A flexible flat cable in which the side surface of the metal layer is further coated.   The electronic device carrying the flexible flat cable of Claim 14.

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