JP2010093189A - Substrate processing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing device capable of reducing the consumption of a processing liquid. <P>SOLUTION: The substrate processing device includes a spin chuck 3 having a support ring 8 for holding a substrate W horizontally, and a cleaning liquid nozzle and a rinse liquid nozzle for supplying the processing liquid to the substrate W held by the spin chuck 3. The support ring 8 includes an annular expansion surface 36 provided enclosing the entire circumference of the substrate W and expanding an outer circumferential edge of the substrate W outward so that the processing liquid may flow outward from a top surface of the substrate W held by the support ring 8. The expansion surface 36 is a lyophobic surface having higher lyophobicity to the processing liquid than the substrate W. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus for processing a substrate. Examples of substrates to be processed include semiconductor wafers, liquid crystal display substrates, plasma display substrates, FED (Field Emission Display) substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, and photomasks. Substrate, ceramic substrate and the like.

In a manufacturing process of a semiconductor device or a liquid crystal display device, a substrate processing apparatus for processing a substrate such as a semiconductor wafer or a glass substrate for a liquid crystal display device is used. A single wafer processing apparatus that processes substrates one by one includes, for example, a spin chuck that horizontally holds and rotates the substrate, and a processing liquid nozzle that supplies a processing liquid to the substrate held by the spin chuck. ing.
When processing a substrate with this substrate processing apparatus, for example, while rotating the spin chuck, the discharge of the processing liquid from the processing liquid nozzle is continued, and the surface of the substrate is formed while forming a flow of the processing liquid on the spin chuck. A method (continuous discharge process) is performed to advance this process. As another method, while the spin chuck is stopped or rotated at a low speed, the processing liquid is supplied from the processing liquid nozzle to the substrate surface and accumulated on the surface, and the liquid film is held on the substrate surface. The paddle process (liquid piling process) which advances the process is known.
JP 2001-237214 A

  However, when continuous discharge processing is performed, the amount of processing liquid consumed increases. In particular, when continuous discharge processing is performed on a substrate having a hydrophobic surface, the substrate surface is difficult to wet, so it is necessary to rotate the substrate at a high speed while continuously supplying the processing liquid at a large flow rate, and the consumption of the processing liquid is reduced. More. In addition, a large pipe for supplying the processing liquid at a large flow rate and a large actuator for rotating the substrate at a high speed may be required, resulting in an increase in size of the apparatus. In recent years, since the size of the substrate tends to increase, these problems have become more apparent.

  On the other hand, when the paddle process is performed, the consumption of the processing liquid can be reduced as compared with the continuous discharge process. Further, since it is not necessary to continuously supply the processing liquid at a large flow rate or to rotate the substrate at a high speed, it is possible to suppress or prevent an increase in size of the apparatus. However, when performing a paddle process, the process liquid spills from the outer peripheral edge of the substrate surface in the process of forming a liquid film on the substrate, so that the amount of process liquid is larger than the amount necessary to cover the entire substrate surface. Consumption will increase. In particular, a substrate having a hydrophobic surface is more likely to spill the treatment liquid than a substrate having a hydrophilic state, and thus the consumption of the treatment liquid is further increased.

  The present invention has been made under such a background, and an object thereof is to provide a substrate processing apparatus capable of reducing the consumption of processing liquid.

  In order to achieve the object, the invention according to claim 1 is the substrate holding means (3) having a holding portion (8, 108, 208, 308, 408, 508, 608) for holding the substrate (W) horizontally. ) And a processing liquid supply means (4, 5) for supplying a processing liquid to the substrate held by the substrate holding means, and the holding portion surrounds the entire periphery of the substrate and surrounds the outer peripheral edge of the substrate. An annular expansion surface (36, 136, 236, 336) provided so as to expand toward the surface, and the expansion surface is a lyophobic surface having a higher lyophobic property than the substrate. It is a substrate processing apparatus (1).

In addition, the alphanumeric characters in parentheses represent corresponding components in the embodiments described later. The same applies hereinafter.
According to this invention, the holding portion for horizontally holding the substrate has an annular expansion surface provided so as to surround the entire circumference of the substrate and extend the outer peripheral edge of the substrate outward. Yes. Further, the extended surface is a lyophobic surface having higher lyophobic property than the substrate. Therefore, although the processing liquid supplied to the upper surface of the substrate held by the holding unit from the processing liquid supply means and reaches the peripheral edge of the upper surface of the substrate can move outward toward the expansion surface, the movement is lyophobic. It is suppressed by the extended surface. Thereby, it can suppress that a process liquid spills from the outer periphery of a board | substrate, and can reduce the consumption of a process liquid. Further, if the expansion surface gives the processing liquid on the substrate a force larger than the force for suppressing the movement of the processing liquid, the processing liquid can be moved outward from the peripheral edge of the upper surface of the substrate toward the expansion surface. The treatment liquid can be drained from the substrate, and the treatment with the treatment liquid and the drying treatment can be performed smoothly. Thereby, the process with respect to a board | substrate can be performed smoothly, reducing the consumption of a process liquid.

  According to a second aspect of the present invention, the substrate holding means includes a rotating means (9) for rotating the holding portion around a vertical axis (L1), and the holding portion has a space (S1) below the substrate. In this way, the lower surface peripheral edge portion of the substrate is formed so as to be supported over the entire circumference, and has communication portions (38, 438) for communicating the space with the space around the holding portion. A substrate processing apparatus according to claim 1.

  According to the present invention, by rotating the holding unit around the vertical axis while holding the substrate in the holding unit, the gas in the space generated below the substrate is discharged from the communication unit by centrifugal force, and the The space can be made negative. Therefore, the substrate can be sucked and held by this negative pressure. Thus, the substrate can be integrally rotated together with the holding portion in a state where the substrate is sucked and held.

Further, since the holding portion supports the lower surface peripheral portion of the substrate, the substrate can be adsorbed and held in a state where the portions other than the lower surface peripheral portion of the substrate are not in contact. Accordingly, the contact area between the substrate and the holding portion can be reduced, so that it is possible to suppress or prevent foreign substances such as particles from moving from the holding portion to the substrate and contaminating the substrate.
According to a third aspect of the present invention, the holding portion includes an annular tapered surface (35, 55) inclined downward toward the inside, and the tapered surface supports the lower surface peripheral portion of the substrate by line contact. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is formed.

According to the present invention, since the tapered surface is formed so as to support the lower peripheral edge portion of the substrate by line contact, the contact area between the substrate and the holding portion can be reduced. Thereby, it can suppress or prevent that a foreign material moves to a board | substrate from a holding | maintenance part and the said board | substrate is contaminated.
According to a fourth aspect of the present invention, the holding portion has a plurality of support portions (57) arranged in an annular shape, and each of the plurality of support portions supports the lower surface peripheral edge portion of the substrate by point contact. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is formed.

According to this invention, by making each support part point-contact with the lower surface peripheral part of a board | substrate, these support parts can be cooperated and a board | substrate can be supported. Further, since the contact between each support portion and the substrate is a point contact, the contact area between the substrate and the holding portion can be reduced, thereby suppressing or preventing the contamination of the substrate.
According to a fifth aspect of the present invention, the processing liquid supply means is controlled to supply the processing liquid to the upper surface of the substrate, whereby a liquid film is formed on the upper surface of the substrate to form a liquid film of the processing liquid covering the upper surface. 5. The apparatus according to claim 1, further comprising a control unit (50) that executes a liquid film forming step to be performed and a draining step for controlling the substrate holding unit to drain the processing liquid from the substrate. It is a substrate processing apparatus of description.

  According to this invention, by causing the control means to execute the liquid film forming step, the processing liquid supplied from the processing liquid supply means performs liquid deposition on the upper surface of the substrate and covers the upper surface of the substrate. A film can be formed. Thereby, the paddle process (liquid piling process) which advances a process in the state which hold | maintained the liquid film on the upper surface of the board | substrate can be performed. In addition, since the draining process is executed by the control means, the processing liquid can be drained from the substrate held in the holding unit, so the liquid film of the processing liquid is drained from the substrate and the substrate is dried. Can be made.

  As described above, since the movement of the processing liquid from the peripheral edge of the upper surface of the substrate to the expansion surface can be suppressed, the amount of the processing liquid that falls from the outer peripheral edge of the substrate is reduced in the process of forming the liquid film of the processing liquid. be able to. Thereby, the consumption of a process liquid can be reduced. Further, in the draining process, for example, by rotating the substrate around the vertical axis and applying a centrifugal force to the processing liquid on the substrate, if the expansion surface gives a force larger than the force for suppressing the movement of the processing liquid, The processing liquid can be easily discharged from the substrate by moving the processing liquid from the peripheral edge of the upper surface to the expansion surface. Thereby, the process with respect to a board | substrate can be performed smoothly, reducing the consumption of a process liquid.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is an illustrative view for explaining the configuration of a substrate processing apparatus 1 according to an embodiment of the present invention.
The substrate processing apparatus 1 includes a spin chuck 3 (substrate holding means) that horizontally holds and rotates a single substrate W in a processing chamber 2 partitioned by partition walls, and a substrate W held by the spin chuck 3. A cleaning liquid nozzle 4 (processing liquid supply means) for supplying a cleaning liquid as a processing liquid to the upper surface, and a rinsing liquid nozzle 5 for supplying a rinsing liquid as a processing liquid to the upper surface of the substrate W held by the spin chuck 3. (Treatment liquid supply means). The substrate processing apparatus 1 is a single wafer processing apparatus that processes substrates W one by one. In this embodiment, the substrate W is a circular substrate such as a semiconductor wafer.

  The spin chuck 3 includes a rotary shaft 6 extending in the vertical direction, a disc-shaped spin base 7 attached horizontally to the upper end of the rotary shaft 6, and a support ring 8 (holding portion) disposed on the spin base 7. And a motor 9 (rotating means) coupled to the rotating shaft 6. The spin chuck 3 can hold the substrate W horizontally in a state where the lower peripheral edge portion of the substrate W is supported by the support ring 8. Further, the spin chuck 3 can rotate the held substrate W around the vertical rotation axis L <b> 1 passing through the center of the substrate W by the driving force of the motor 9. The rotating shaft 6 is inserted through a cylindrical cover 10, and a motor 9 is accommodated in the cover 10. In this embodiment, the spin base 7 is a disk-shaped member having a diameter larger than that of the substrate W.

  The rotating shaft 6 is a hollow shaft. A lower processing liquid supply pipe 11 is inserted into the rotary shaft 6 in a non-contact state. A lower surface nozzle 12 that discharges the processing liquid toward the center of the lower surface of the substrate W is provided at the upper end of the lower processing liquid supply pipe 11. The lower surface nozzle 12 is arranged so that the discharge port 12 a is close to the center of the lower surface of the substrate W supported by the support ring 8.

  A lower cleaning liquid supply pipe 13 and a lower rinse liquid supply pipe 14 are connected to the lower processing liquid supply pipe 11. A cleaning liquid from a cleaning liquid supply source (not shown) is supplied to the lower processing liquid supply pipe 11 via a lower cleaning liquid supply pipe 13. Further, a rinsing liquid from a rinsing liquid supply source (not shown) is supplied to the lower processing liquid supply pipe 11 via a lower rinsing liquid supply pipe 14. A cleaning liquid and a rinsing liquid as the processing liquid are selectively supplied to the lower processing liquid supply pipe 11. Thus, the processing liquid can be supplied from the lower processing liquid supply pipe 11 to the lower surface nozzle 12 and discharged from the discharge port 12a of the lower surface nozzle 12 toward the center of the lower surface of the substrate W.

The lower cleaning liquid supply pipe 13 is provided with a lower cleaning liquid valve 15 for switching between supply and stop of supply of the cleaning liquid to the lower surface nozzle 12. Further, the lower rinse liquid supply pipe 14 is provided with a lower rinse liquid valve 16 for switching between supply and stoppage of the rinse liquid to the lower surface nozzle 12.
As the cleaning liquid supplied to the lower processing liquid supply pipe 11, for example, a chemical liquid or a rinsing liquid can be used. Examples of the chemical liquid include a liquid containing at least one of sulfuric acid, acetic acid, nitric acid, hydrochloric acid, hydrofluoric acid, aqueous ammonia, and aqueous hydrogen peroxide. Examples of the rinsing liquid include pure water (deionized water), carbonated water, electrolytic ionic water, hydrogen water, ozone water, and hydrochloric acid water having a diluted concentration (for example, about 10 to 100 ppm).

  Further, a lower gas supply path 17 surrounding the lower process liquid supply pipe 11 is formed between the rotating shaft 6 and the lower process liquid supply pipe 11. The upper end of the lower gas supply path 17 is an annular lower gas discharge port 18 located at the center of the upper surface of the spin base 7 (see FIG. 3). A gas from a gas supply source (not shown) is supplied to the lower gas supply path 17 via a lower gas supply pipe 19. The gas supplied to the lower gas supply path 17 is discharged upward from the lower gas discharge port 18. In the lower gas supply pipe 19, a lower gas valve 20 for switching between supply and stop of supply of gas to the lower gas supply path 17 and a flow rate of gas supplied to the lower gas supply path 17 are adjusted. The gas flow rate adjustment valve 21 is interposed. For example, nitrogen gas, which is an example of an inert gas, is used as the gas supplied to the lower gas supply path 17.

The cleaning liquid nozzle 4 is, for example, a straight nozzle that discharges the cleaning liquid in a continuous flow state. The cleaning liquid nozzle 4 is attached to the tip of a nozzle arm 22 that extends horizontally. The cleaning liquid nozzle 4 is disposed above the spin chuck 3 with its discharge port directed downward.
A first cleaning liquid supply pipe 23 and a second cleaning liquid supply pipe 24 are connected to the cleaning liquid nozzle 4. A first cleaning liquid from a cleaning liquid supply source (not shown) is supplied to the cleaning liquid nozzle 4 via a first cleaning liquid supply pipe 23. The cleaning liquid nozzle 4 is supplied with a second cleaning liquid from a cleaning liquid supply source (not shown) via a second cleaning liquid supply pipe 24. The cleaning liquid nozzle 4 is selectively supplied with a first cleaning liquid and a second cleaning liquid as processing liquids. The first and second cleaning liquids are different types of cleaning liquids.

  The first cleaning liquid supply pipe 23 is provided with a first cleaning liquid valve 25 for switching between supply and stop of supply of the first cleaning liquid to the cleaning liquid nozzle 4. The second cleaning liquid supply pipe 24 is provided with a second cleaning liquid valve 26 for switching between supply and stop of supply of the second cleaning liquid to the cleaning liquid nozzle 4. As the first and second cleaning liquids, for example, a chemical liquid or a rinse liquid can be used, respectively. In this embodiment, the same type of cleaning liquid as that supplied to the lower surface nozzle 12 is used as the second cleaning liquid.

  The nozzle arm 22 is coupled to a support shaft 27 extending along the vertical direction. The support shaft 27 can swing around its central axis. The support shaft 27 is coupled to a nozzle swing drive mechanism 28 formed of, for example, a motor. When the driving force of the nozzle swing driving mechanism 28 is input to the support shaft 27, the cleaning liquid nozzle 4 and the nozzle arm 22 are horizontally moved integrally around the central axis of the support shaft 27. Accordingly, the cleaning liquid nozzle 4 can be disposed above the substrate W held on the spin chuck 3, and the cleaning liquid nozzle 4 can be retracted from above the spin chuck 3.

The rinse liquid nozzle 5 is, for example, a straight nozzle that discharges the rinse liquid in a continuous flow state. The rinsing liquid nozzle 5 is attached to the tip of a nozzle arm 29 that extends horizontally. The rinsing liquid nozzle 5 is disposed above the spin chuck 3 with its discharge port directed downward.
A rinse liquid supply pipe 30 is connected to the rinse liquid nozzle 5. A rinse liquid from a rinse liquid supply source (not shown) is supplied to the rinse liquid nozzle 5 via a rinse liquid supply pipe 30. The rinse liquid supply pipe 30 is provided with a rinse liquid valve 31 for switching between supply and stop of supply of the rinse liquid to the rinse liquid nozzle 5. The rinse liquid nozzle 5 is supplied with the same type of rinse liquid as that supplied to the lower surface nozzle 12 via the lower rinse liquid supply pipe 14. That is, in this embodiment, the same type of rinse liquid is discharged from the rinse liquid nozzle 5 and the lower surface nozzle 12.

  The nozzle arm 29 is coupled with a support shaft 32 extending along the vertical direction. The support shaft 32 can swing around its central axis. The support shaft 32 is coupled to a nozzle swing drive mechanism 33 formed of, for example, a motor. When the driving force of the nozzle swing drive mechanism 33 is input to the support shaft 32, the rinse liquid nozzle 5 and the nozzle arm 29 are horizontally moved integrally around the central axis of the support shaft 32. Thereby, the rinse liquid nozzle 5 can be disposed above the substrate W held on the spin chuck 3, or the rinse liquid nozzle 5 can be retracted from above the spin chuck 3.

FIG. 2 is a schematic longitudinal sectional view of the spin chuck 3. FIG. 3 is a schematic plan view of the spin chuck 3. Below, with reference to FIG. 2 and FIG. 3, the support ring 8 and the structure relevant to it are demonstrated.
The support ring 8 is, for example, a flat plate-like member having an annular shape. The thickness of the support ring 8 is, for example, about several mm to several cm. The inner diameter of the support ring 8 is made smaller than the outer diameter of the substrate W, and the outer diameter of the support ring 8 is made larger than the outer diameter of the substrate W. In this embodiment, the outer diameter of the support ring 8 is approximately the same as the outer diameter of the spin base 7. The support ring 8 is horizontally disposed along the peripheral edge of the upper surface of the spin base 7 so as to be coaxial with the spin base 7.

The support ring 8 can support the lower surface peripheral portion of the substrate W over the entire circumference above the spin base 7. A narrow space S <b> 1 (space) along the horizontal direction is generated between the upper surface of the spin base 7 and the lower surface of the substrate W in a state where the lower peripheral edge of the substrate W is supported by the support ring 8. .
Further, the cross-sectional shape (cross-sectional shape along the vertical plane) of the support ring 8 has a wedge shape that tapers toward the inner peripheral side. The lower surface of the support ring 8 is an annular horizontal surface, and the upper surface of the support ring 8 is inclined downward from the inner peripheral edge of the horizontal surface 34 toward the inside of the support ring 8. An annular tapered surface 35 is provided.

  The taper surface 35 has an inner diameter smaller than the outer diameter of the substrate W, and the outer diameter is larger than the outer diameter of the substrate W. The tapered surface 35 can support the substrate W in a state in which the taper surface 35 is in line contact with the outer periphery of the lower surface of the substrate W over the entire circumference. The horizontal surface 34 and the tapered surface 35 are formed such that the height of the horizontal surface 34 is the same as or lower than the upper surface of the substrate W in a state where the substrate W is supported by the tapered surface 35.

  Further, as shown in FIG. 3, the upper surface of the support ring 8 is located on the outer side of the substrate W (the portion including the outer peripheral portion of the tapered surface 35 and the horizontal surface 34. Hereinafter, it is referred to as “expansion surface 36”. ) Surrounds the entire periphery of the substrate W so as to expand the outer peripheral edge of the substrate W outward. The support ring 8 is formed so that the processing liquid supplied to the upper surface of the substrate W can flow outward from the upper surface of the substrate W toward the extended surface 36. Since the inner peripheral portion of the extended surface 36 corresponds to the outer peripheral portion of the tapered surface 35, it is inclined downward toward the inside of the support ring 8.

  The extended surface 36 is a lyophobic surface that has higher lyophobic properties than the substrate W. Specifically, for example, the support ring 8 is formed of a material having higher lyophobic property than the substrate W with respect to the processing liquid. That is, when the substrate W is a silicon wafer (the contact angle between the silicon wafer and water is 70 degrees), for example, PTFE (polytetrafluoroethylene) whose contact angle with water is 114 degrees, The support ring 8 is formed of PFA (perfluoroalkoxyethylene) having a contact angle of 109 degrees. As a result, all the outer surfaces of the support ring 8 including the extended surface 36 are made lyophobic surfaces that have higher lyophobic properties than the substrate W.

  Further, the support ring 8 is connected to the spin base 7 so as to be integrally rotatable. Specifically, a plurality of connecting members 37 are interposed between the spin base 7 and the support ring 8, and the support ring 8 is connected to the spin base 7 so as to be integrally rotatable by these connecting members 37. . The support ring 8 is rotated together with the spin base 7 and the rotation shaft 6 around the vertical rotation axis L <b> 1 by the driving force of the motor 9. The rotation axis L1 is a vertical axis passing through the center of the substrate W supported by the support ring 8.

  As shown in FIG. 3, the plurality of connecting members 37 are arranged at intervals in the circumferential direction of the support ring 8. Further, as shown in FIG. 2, the plurality of connecting members 37 connect the support ring 8 to the spin base 7 while being separated from the upper surface of the spin base 7. A gap G1 in the vertical direction between the spin base 7 and the support ring 8 is narrowed (for example, set to 0.5 mm). By narrowing the vertical gap G1 between the spin base 7 and the support ring 8, the height of the narrow space S1 is reduced, and the volume of the narrow space S1 is further reduced.

  Further, a gap 38 is formed between the lower surface of the support ring 8 and the upper surface of the spin base 7 as a communication portion that extends in the horizontal direction. The gap 38 communicates with the space inside the support ring 8. Accordingly, the gap 38 between the lower surface of the support ring 8 and the upper surface of the spin base 7 communicates with a narrow space S1 formed between the upper surface of the spin base 7 and the lower surface of the substrate W. The narrow space S <b> 1 communicates with the space around the support ring 8 through the gap 38.

  When the spin base 7 and the support ring 8 are rotated at a low rotation speed (for example, about 10 to 30 rpm) in a state where the lower surface peripheral portion of the substrate W is supported by the support ring 8, the substrate supported by the support ring 8 W rotates around a vertical axis of rotation L1 passing through its center. At this time, the substrate W supported by the support ring 8 rotates integrally with the support ring 8 without sliding with respect to the support ring 8 due to a frictional force generated between the substrate W and the support ring 8.

On the other hand, when the spin base 7 and the support ring 8 are rotated at a predetermined rotation speed (for example, several hundred rpm or more) in a state where the lower peripheral edge of the substrate W is supported by the support ring 8, The narrow space S1 formed between the lower surface of the substrate W becomes a negative pressure, and the substrate W supported by the support ring 8 is sucked and held by the spin chuck 3.
That is, when the substrate W and the spin base 7 are rotated at the predetermined rotational speed, an outward force (centrifugal force away from the rotation axis L1) acts on the gas existing in the narrow space S1. Further, the narrow space S1 is communicated with the space around the support ring 8 by a gap 38 as a communication portion. Furthermore, since the lower surface periphery of the substrate W is supported by the support ring 8 over the entire periphery, the space between the lower surface periphery of the substrate W and the support ring 8 is almost sealed. Therefore, when the substrate W and the spin base 7 are rotated at the predetermined rotational speed, the gas existing in the narrow space S1 is discharged from the gap 38 by the centrifugal force, and the narrow space S1 becomes negative pressure. Therefore, the substrate W supported by the support ring 8 is sucked and held by the spin chuck 3, and rotates around the rotation axis L1 together with the support ring 8 in this state. Thereby, the substrate W supported by the support ring 8 can be integrally rotated around the rotation axis L1. The substrate W supported by the support ring 8 is attracted and held by the spin chuck 3 in a state where the portion other than the peripheral edge of the lower surface of the substrate W is not in contact with the spin chuck 3.

Next, a configuration for placing the substrate W on the support ring 8 will be described. Continuing to refer to FIGS.
The substrate W is placed on the support ring 8 by a plurality of push-up pins 39 attached to the spin base 7. Each push-up pin 39 has a shaft portion 40 extending in the vertical direction and an upper end portion 41 connected to the upper end of the shaft portion 40. A spherical minute projection 42 is formed on the upper surface of the upper end portion 41. The plurality of push-up pins 39 can support the substrate W in cooperation by bringing the minute protrusions 42 into point contact with the lower surface of the substrate W.

Each of the plurality of push-up pins 39 is inserted through a plurality of through holes 43 that pass through the spin base 7 in the thickness direction (the vertical direction in FIG. 2). Each push-up pin 39 is attached to the spin base 7 so as to be movable up and down. Each push-up pin 39 is attached to the spin base 7 so as to be integrally rotatable.
As shown in FIG. 3, the plurality of through holes 43 are arranged at intervals on a predetermined circumference concentric with the support ring 8. Similarly, the plurality of push-up pins 39 are also arranged at intervals on a predetermined circumference concentric with the support ring 8. As shown in FIG. 2, an annular seal 44 is held in each through hole 43. The shaft portion 40 of each push-up pin 39 is inserted through the corresponding seal 44. As a result, the space between the shaft portion 40 of each push-up pin 39 and the spin base 7 is sealed. Each push-up pin 39 can move up and down with respect to the corresponding seal 44.

  Further, the lower end of the shaft portion 40 of each push-up pin 39 is connected to an annular support member 45 surrounding the rotating shaft 6. The plurality of push-up pins 39 are connected to the support member 45 in a state where the heights of the upper ends are aligned. A pusher 46 is disposed below the support member 45, and the support member 45 is raised by the pusher 46. The pusher 46 can raise the support member 45 by moving the rod 48 upward relative to the main body 47. As the pusher 46 raises the support member 45, the plurality of push-up pins 39 are integrally raised vertically upward. The pusher 46 can raise each push-up pin 39 to an upper position where the upper end portion 41 of each push-up pin 39 is above the support ring 8 (the position of the upper push-up pin 39 in FIG. 2).

  A coil spring 49 is fitted on the shaft portion 40 of each push-up pin 39. Each coil spring 49 is compressed in the vertical direction between the spin base 7 and the support member 45. The upper ends of the coil springs 49 are engaged with the lower surface of the spin base 7, and the lower ends of the coil springs 49 are engaged with the upper surface of the support member 45. Each push-up pin 39 is caused to stand by at a lower position where the upper surface of the upper end portion 41 (the surface around the minute protrusion 42) is at the same height as the upper surface of the spin base 7 by the elastic restoring force of the plurality of coil springs 49. ing.

  When each push-up pin 39 is raised to the upper position by the pusher 46, each coil spring 49 is further compressed and elastically deformed. Then, after the push-up pins 39 reach the upper position, when the rods 48 of the pushers 46 are lowered, the push-up pins 39 are lowered by the elastic restoring force of the plurality of coil springs 49. Thereby, each push-up pin 39 can be lowered from the upper position to the lower position.

  When the substrate W is carried into the processing chamber 2 and placed on the support ring 8, first, the support member 45 is raised by the pusher 46, and each push-up pin 39 is raised to the upper position. . Then, the substrate W is carried into the processing chamber 2 by a transfer robot (not shown), and the substrate W is placed on the plurality of push-up pins 39. Thereafter, the rod 48 of the pusher 46 is lowered, and each push-up pin 39 is lowered to the lower position by the elastic restoring force of the coil spring 49. The substrate W placed on the plurality of push-up pins 39 is placed on the tapered surface 35 of the support ring 8 as each push-up pin 39 descends. As a result, the substrate W is placed on the support ring 8.

  On the other hand, when the substrate W is dispensed from the support ring 8, the support member 45 is raised by the pusher 46, and each push-up pin 39 is raised to the upper position. The substrate W supported by the support ring 8 moves onto the plurality of push-up pins 39 in the process in which each push-up pin 39 rises. Then, the substrate W supported by the plurality of push-up pins 39 is received by the transfer robot at the upper position and is carried out of the processing chamber 2. Thereby, the substrate W is paid out from the support ring 8, and the substrate W is carried out from the processing chamber 2.

  As described above, in this embodiment, the substrate W can be placed on the support ring 8 via the plurality of push-up pins 39 instead of placing the substrate W directly on the support ring 8 from the transfer robot. Therefore, for example, even when the transfer robot is of a type that supports the lower surface of the substrate W, the substrate W can be placed on the support ring 8 without causing the transfer robot to collide with the spin base 7 or the like. Thereby, the substrate W can be reliably placed on the support ring 8. Similarly, by using a plurality of push-up pins 39, the substrate W can be reliably delivered from the support ring 8 without causing the transfer robot to collide with the spin base 7 or the like.

FIG. 4 is a block diagram for explaining the electrical configuration of the substrate processing apparatus 1.
The substrate processing apparatus 1 includes a control unit 50 (control means). The control unit 50 controls operations of the motor 9, the nozzle swing drive mechanisms 28 and 33, the pusher 46, and the like. In addition, opening and closing of the valve provided in the substrate processing apparatus 1 and adjustment of the opening degree of the flow rate adjusting valve are controlled by the control unit 50.

FIG. 5 is a process diagram for explaining a first processing example of the substrate W by the substrate processing apparatus 1. 6 to 8 are schematic side views of the spin chuck 3 during the processing of the substrate W, respectively.
Below, with reference to FIG. 1 and FIG. 5, the 1st example of a process of the board | substrate W by the substrate processing apparatus 1 is demonstrated. In each processing step of the first processing example, FIG. 2 and FIGS. 6 to 8 are appropriately referred to.

The unprocessed substrate W is carried into the processing chamber 2 by a transfer robot (not shown) (Step S11), and is placed on the support ring 8 via a plurality of push-up pins 39 (see FIG. 2). By supporting the substrate W by the support ring 8, a narrow space S <b> 1 along the horizontal direction is formed between the upper surface of the spin base 7 and the lower surface of the substrate W.
Next, paddle processing (liquid accumulation processing) is performed with the first cleaning liquid that proceeds with the liquid film of the first cleaning liquid held on the upper surface of the substrate W (step S12). Specifically, first, the nozzle swing drive mechanism 28 is controlled by the control unit 50, and the cleaning liquid nozzle 4 is disposed above the central portion of the substrate W. Then, the lower gas valve 20 is opened by the control unit 50, and nitrogen gas is discharged from the lower gas discharge port 18. The nitrogen gas discharged from the lower gas discharge port 18 expands in the narrow space S1 outward (in a direction away from the rotation axis L1), and is between the lower surface of the support ring 8 and the upper surface of the spin base 7. It is discharged from the narrow space S1 through the gap 38.

  Next, the motor 9 is controlled by the control unit 50, and the spin base 7 is brought into a stopped state or a low-speed rotation state (for example, a state where the spin base 7 is rotated at a rotation speed of about 10 to 30 rpm). When the spin base 7 is rotated at a low speed, the support ring 8 rotates together with the spin base 7, and the substrate W supported by the support ring 8 rotates around the rotation axis L1. The substrate W supported by the support ring 8 rotates integrally with the support ring 8 without sliding with respect to the support ring 8 due to a frictional force generated between the substrate W and the support ring 8.

  Next, the first cleaning liquid valve 25 is opened by the control unit 50, and the first cleaning liquid is discharged from the cleaning liquid nozzle 4 toward the center of the upper surface of the substrate W. The discharged first cleaning liquid is deposited on the center of the upper surface of the substrate W and spreads toward the peripheral edge. At this time, since the substrate W is in a stopped state or a low-speed rotation state, there is almost no first cleaning liquid scattered around the substrate W due to the centrifugal force due to the rotation of the substrate W, and the supplied first cleaning liquid is on the substrate W. It accumulates in. Thereby, liquid deposition by the first cleaning liquid is performed on the upper surface of the substrate W, and a liquid film of the first cleaning liquid covering the entire upper surface of the substrate W is formed as shown in FIG. 6 (liquid film forming step).

After the liquid film of the first cleaning liquid is formed on the substrate W, the discharge of the first cleaning liquid from the cleaning liquid nozzle 4 is stopped, and the state where the liquid film of the first cleaning liquid is held on the upper surface of the substrate W for a predetermined time. Maintained over. In this manner, the paddle process using the first cleaning liquid that advances the process while holding the liquid film of the first cleaning liquid on the substrate W is performed on the upper surface of the substrate W.
As described above, the support ring 8 is formed so that the processing liquid supplied to the upper surface of the substrate W can flow outward from the upper surface of the substrate W toward the extended surface 36. Therefore, in the process of forming the liquid film with the first cleaning liquid on the substrate W, the first cleaning liquid may move outward from the peripheral edge of the upper surface of the substrate W toward the extended surface 36 of the support ring 8. However, since the extended surface 36 of the support ring 8 has a higher lyophobic surface than the substrate W, the movement of the first cleaning liquid from the upper surface of the substrate W to the extended surface 36 is suppressed. ing.

  Further, even if the first cleaning liquid moves from the upper surface of the substrate W to the extended surface 36, the inner peripheral portion of the extended surface 36 (corresponding to the outer peripheral portion of the tapered surface 35) is inclined downward toward the inside. A force directed toward the inside of the support ring 8 acts on the first cleaning liquid that has moved onto the expansion surface 36. Therefore, as shown in FIG. 6, the first cleaning liquid that has moved onto the expansion surface 36 accumulates along the peripheral end surface of the substrate W, and forms a liquid reservoir along the peripheral end surface. That is, an annular recess for forming a liquid pool is formed by the inner peripheral portion of the expansion surface 36.

  Since the 1st washing | cleaning liquid which reached the upper surface peripheral part of the board | substrate W is pushed inward by this liquid pool, the movement to the support ring 8 is suppressed further. Accordingly, when the liquid is deposited on the upper surface of the substrate W, the amount of the first cleaning liquid that moves on the support ring 8 can be reduced. Therefore, the entire area of the upper surface of the substrate W can be covered by discharging the cleaning liquid nozzle 4 from the cleaning liquid nozzle 4 in an amount substantially equal to the amount necessary to cover the upper surface of the substrate W. Thereby, the consumption of a 1st washing | cleaning liquid can be reduced.

  After the paddle process is performed on the upper surface of the substrate W, a rinsing process is performed on the upper surface of the substrate W (step S13). Specifically, first, the control unit 50 controls the two nozzle swing drive mechanisms 28 and 33 to retract the cleaning liquid nozzle 4 from the substrate W, and then the rinsing liquid nozzle 5 moves to the center of the substrate W. (See FIG. 7). Then, the motor 9 is controlled by the controller 50, and the spin base 7 is rotated at a predetermined rotational speed (for example, several hundred rpm or more). As a result, the substrate W supported by the support ring 8 is adsorbed and held by the spin chuck 3 in a non-contact state with the spin base 7 and integrated with the support ring 8 around the rotation axis L1 at the predetermined rotational speed. Rotate. At this time, the opening degree of the gas flow rate adjusting valve 21 is controlled by the control unit 50, and the discharge flow rate of nitrogen gas from the lower gas discharge port 18 is adjusted to an amount that maintains the adsorption state of the substrate W by the spin chuck 3. ing.

  Next, the rinsing liquid valve 31 is opened by the controller 50, and the rinsing liquid is discharged from the rinsing liquid nozzle 5 toward the center of the upper surface of the substrate W. As shown in FIG. 7, the discharged rinsing liquid is applied to the center of the upper surface of the substrate W, receives a centrifugal force due to the rotation of the substrate W, and instantaneously from the center of the upper surface of the substrate W toward the peripheral portion. It spreads. As a result, the rinsing liquid is supplied to the entire upper surface of the substrate W, and the first cleaning liquid is washed away from the substrate W by the rinsing liquid. In this way, the rinsing process is performed on the upper surface of the substrate W. After the rinsing process for the upper surface of the substrate W is performed for a predetermined time, the rinsing liquid valve 31 is closed by the control unit 50 and the supply of the rinsing liquid to the upper surface of the substrate W is stopped.

  In the rinsing process with respect to the upper surface of the substrate W, the processing liquid (here, the rinsing liquid and the first cleaning liquid) that has reached the peripheral edge of the upper surface of the substrate W is, as in the paddle processing, The outward movement toward the expansion surface 36 is suppressed by the pool of the processing liquid surrounding the peripheral end surface of the substrate W. However, in the rinsing process on the upper surface of the substrate W, the rotational speed of the substrate W is increased compared to the paddle process, and the centrifugal force acting on the processing liquid is increased. Therefore, the processing liquid supplied to the upper surface of the substrate W moves outward toward the expansion surface 36 without staying at the peripheral edge of the upper surface of the substrate W. Thereby, the processing liquid can be easily drained from the substrate W. That is, although the movement of the processing liquid from the substrate W to the expansion surface 36 can be suppressed, the processing liquid can be drained from the substrate W by increasing the rotation speed of the substrate W, so that the rinsing process for the upper surface of the substrate W is performed. Can be performed smoothly.

  In the present embodiment, the height of the horizontal plane 34 is the same as the upper surface of the substrate W supported by the support ring 8 or lower than the upper surface of the substrate W. The liquid pool of the processing liquid accumulated in the portion is easily moved to the outer peripheral portion (corresponding to the horizontal surface 34) of the expansion surface 36. As a result, the liquid reservoir of the processing liquid can be moved outwardly and easily drained from the extended surface 36. Therefore, the processing liquid that has moved from the substrate W to the expansion surface 36 can be drained to the outside of the support ring 8 without flowing back to the substrate W side. Thereby, the rinse process with respect to the upper surface of the board | substrate W can be performed smoothly.

The drainage of the processing liquid collected on the inner peripheral portion of the extended surface 36 is determined by, for example, the inclination angle of the inner peripheral portion, the height of the horizontal plane 34, the magnitude of the centrifugal force applied to the processing liquid on the substrate W, It can be adjusted by changing.
Further, in the first processing example, in the rinsing process for the upper surface of the substrate W, the gas existing in the narrow space S1 or the lower gas is formed from the gap 38 formed between the lower surface of the support ring 8 and the upper surface of the spin base 7. Nitrogen gas discharged from the side gas discharge port 18 is blown outward. Further, the vertical gap G1 between the spin base 7 and the support ring 8 is narrowed (see FIG. 2), and the vertical size of the gap 38 is small. Therefore, foreign matters such as mist and particles of the processing liquid are prevented or prevented from entering the narrow space S <b> 1 through the gap 38. Thereby, it can suppress or prevent that a process liquid and a foreign material adhere to the lower surface of the board | substrate W, and the said lower surface is contaminated.

  After the rinse process is performed on the upper surface of the substrate W, a drying process (spin drying) for drying the substrate W is performed (step S14). Specifically, first, the motor 9 is controlled by the controller 50, and the spin base 7 is rotated at a high rotation speed (for example, several thousand rpm). At this time, nitrogen gas is discharged from the lower gas discharge port 18 at a discharge flow rate at which the adsorption state of the substrate W by the spin chuck 3 is maintained.

  When the spin base 7 is rotated at a high rotational speed, the substrate W supported by the support ring 8 is integrally held around the rotation axis L1 at a high rotational speed together with the support ring 8 while being sucked and held by the spin chuck 3. Rotate. As shown in FIG. 8, the rinse liquid adhering to the substrate W receives centrifugal force due to the rotation of the substrate W, is swung around the substrate W, and is drained from the substrate W (drainage process). Thereby, the substrate W is dried.

After the high-speed rotation of the substrate W is continued for a predetermined time, the rotation of the motor 9 is stopped and the rotation of the substrate W by the spin chuck 3 is stopped. Thereafter, the processed substrate W is received from the support ring 8 by the plurality of push-up pins 39 (see FIG. 2), and the substrate W is unloaded from the processing chamber 2 by the transfer robot (step S15).
FIG. 9 is a process diagram for explaining a second processing example of the substrate W by the substrate processing apparatus 1. FIG. 10 is a schematic side view of the spin chuck 3 during execution of the second processing example.

  The difference between the second processing example and the first processing example described above is that after performing paddle processing and rinsing processing on the upper surface of the substrate W, cleaning processing and rinsing processing are performed on the upper and lower surfaces of the substrate W. There is. Below, with reference to FIG. 1 and FIG. 9, the 2nd example of a process of the board | substrate W by the substrate processing apparatus 1 is demonstrated. In each processing step of the second processing example, FIGS. 2, 6 to 8, and 10 are referred to as appropriate.

The unprocessed substrate W is carried into the processing chamber 2 by a transfer robot (not shown) (step S21) and placed on the support ring 8 via a plurality of push-up pins 39 (see FIG. 2). By supporting the substrate W by the support ring 8, a narrow space S1 is formed between the upper surface of the spin base 7 and the lower surface of the substrate W along the horizontal direction (see FIG. 6).
Next, paddle processing (liquid accumulation processing) is performed with the first cleaning liquid that proceeds with the liquid film of the first cleaning liquid being held on the upper surface of the substrate W (step S22). Specifically, first, the nozzle swing drive mechanism 28 is controlled by the control unit 50, and the cleaning liquid nozzle 4 is disposed above the central portion of the substrate W (see FIG. 6). Then, the lower gas valve 20 is opened by the control unit 50, and nitrogen gas is discharged from the lower gas discharge port 18. The nitrogen gas discharged from the lower gas discharge port 18 expands in the narrow space S1 outward (in a direction away from the rotation axis L1), and is between the lower surface of the support ring 8 and the upper surface of the spin base 7. It is discharged from the narrow space S1 through the gap 38.

  Next, the motor 9 is controlled by the control unit 50, and the spin base 7 is brought into a stopped state or a low-speed rotation state (for example, a state where the spin base 7 is rotated at a rotation speed of about 10 to 30 rpm). When the spin base 7 is rotated at a low speed, the support ring 8 rotates together with the spin base 7, and the substrate W supported by the support ring 8 rotates around the vertical rotation axis L1 passing through the center thereof. The substrate W supported by the support ring 8 rotates integrally with the support ring 8 without sliding with respect to the support ring 8 due to a frictional force generated between the substrate W and the support ring 8.

  Next, the first cleaning liquid valve 25 is opened by the control unit 50, and the first cleaning liquid is discharged from the cleaning liquid nozzle 4 toward the center of the upper surface of the substrate W. The discharged first cleaning liquid is deposited on the center of the upper surface of the substrate W and spreads toward the peripheral edge. At this time, since the substrate W is in a stopped state or a low-speed rotation state, there is almost no first cleaning liquid scattered around the substrate W due to the centrifugal force due to the rotation of the substrate W, and the supplied first cleaning liquid is the substrate W Accumulate on top. Thereby, liquid deposition by the first cleaning liquid is performed on the upper surface of the substrate W, and a liquid film of the first cleaning liquid covering the entire upper surface of the substrate W is formed as shown in FIG. 6 (liquid film forming step).

After the liquid film of the first cleaning liquid is formed on the substrate W, the discharge of the first cleaning liquid from the cleaning liquid nozzle 4 is stopped, and the state where the liquid film of the first cleaning liquid is held on the upper surface of the substrate W for a predetermined time. Maintained over. In this manner, the paddle process using the first cleaning liquid that advances the process while holding the liquid film of the first cleaning liquid on the substrate W is performed on the upper surface of the substrate W.
After the paddle process is performed on the upper surface of the substrate W, the rinse process is performed on the upper surface of the substrate W (step S23). Specifically, first, the control unit 50 controls the two nozzle swing drive mechanisms 28 and 33 to retract the cleaning liquid nozzle 4 from the substrate W, and then the rinsing liquid nozzle 5 moves to the center of the substrate W. (See FIG. 7). Then, the motor 9 is controlled by the controller 50, and the spin base 7 is rotated at a predetermined rotational speed (for example, several hundred rpm or more). As a result, the substrate W supported by the support ring 8 is adsorbed and held by the spin chuck 3 in a non-contact state with the spin base 7 and integrated with the support ring 8 around the rotation axis L1 at the predetermined rotational speed. Rotate.

  Next, the rinsing liquid valve 31 is opened by the controller 50, and the rinsing liquid is discharged from the rinsing liquid nozzle 5 toward the center of the upper surface of the substrate W. As shown in FIG. 7, the discharged rinsing liquid is applied to the center of the upper surface of the substrate W, receives a centrifugal force due to the rotation of the substrate W, and instantaneously from the center of the upper surface of the substrate W toward the peripheral portion. It spreads. As a result, the rinsing liquid is supplied to the entire upper surface of the substrate W, and the first cleaning liquid is washed away from the substrate W by the rinsing liquid. In this way, the rinsing process is performed on the upper surface of the substrate W. After the rinsing process for the upper surface of the substrate W is performed for a predetermined time, the rinsing liquid valve 31 is closed by the control unit 50 and the supply of the rinsing liquid to the upper surface of the substrate W is stopped.

  After the rinsing process is performed on the upper surface of the substrate W, the cleaning process is simultaneously performed on the upper surface and the lower surface of the substrate W (step S24). Specifically, first, the control unit 50 controls the two nozzle swing drive mechanisms 28 and 33 so that the rinse liquid nozzle 5 is retracted from the substrate W, and then the cleaning liquid nozzle 4 is positioned at the center of the substrate W. Is disposed above. Then, the motor 9 is controlled by the controller 50, and the spin base 7 is rotated at a predetermined rotational speed (for example, several hundred rpm or more). At this time, nitrogen gas is continuously discharged from the lower gas discharge port 18, and the discharge flow rate is controlled to an amount that maintains the adsorption state of the substrate W by the spin chuck 3.

  Next, the second cleaning liquid valve 26 and the lower cleaning liquid valve 15 are opened by the control unit 50, and the same type of cleaning liquid (second cleaning liquid) is discharged from the cleaning liquid nozzle 4 and the lower surface nozzle 12. As shown in FIG. 10, the second cleaning liquid discharged from the cleaning liquid nozzle 4 is deposited on the center of the upper surface of the substrate W, receives a centrifugal force due to the rotation of the substrate W, and receives a peripheral portion from the center of the upper surface of the substrate W. It spreads instantly toward. Thereby, the second cleaning liquid is supplied to the entire upper surface of the substrate W. In this way, the cleaning process with the second cleaning liquid is performed on the upper surface of the substrate W.

  On the other hand, as shown in FIG. 10, the second cleaning liquid discharged from the lower surface nozzle 12 is deposited on the center of the lower surface of the substrate W, receives centrifugal force due to the rotation of the substrate W, and follows the lower surface of the substrate W. It spreads from the center toward the periphery. As a result, the second cleaning liquid is supplied to the entire lower surface of the substrate W. More specifically, on the lower surface of the substrate W, a liquid film of the second cleaning liquid having a flow from the central part toward the peripheral part is formed. The discharge flow rate of the second cleaning liquid from the lower surface nozzle 12 is set such that the film thickness of the liquid film of the second cleaning liquid is, for example, several μm to several hundred μm, and the adsorption state of the substrate W by the spin chuck 3 is maintained. Yes.

  The lower surface of the substrate W is treated with a liquid film of the second cleaning liquid covering the entire area. In this way, the cleaning process with the second cleaning liquid is performed on the lower surface of the substrate W, and the cleaning process with the second cleaning liquid is simultaneously performed on the upper surface and the lower surface of the substrate W. After the cleaning process using the second cleaning liquid for the upper and lower surfaces of the substrate W has been performed for a predetermined time, the control unit 50 closes the second cleaning liquid valve 26 and the lower cleaning liquid valve 15 to move the upper and lower surfaces of the substrate W to the upper and lower surfaces. The supply of the second cleaning liquid is stopped.

  Next, a rinsing process is simultaneously performed on the upper and lower surfaces of the substrate W (step S25). Specifically, first, the control unit 50 controls the two nozzle swing drive mechanisms 28 and 33 to retract the cleaning liquid nozzle 4 from the substrate W, and then the rinsing liquid nozzle 5 moves to the center of the substrate W. Is disposed above. Then, the motor 9 is controlled by the controller 50, and the spin base 7 is rotated at a predetermined rotational speed (for example, several hundred rpm or more). At this time, nitrogen gas is continuously discharged from the lower gas discharge port 18, and the discharge flow rate is controlled to an amount that maintains the adsorption state of the substrate W by the spin chuck 3.

  Next, the rinsing liquid valve 31 and the lower rinsing liquid valve 16 are opened by the control unit 50, and the same type of rinsing liquid is discharged from the rinsing liquid nozzle 5 and the lower surface nozzle 12. The rinsing liquid discharged from the rinsing liquid nozzle 5 reaches the center of the upper surface of the substrate W, receives a centrifugal force due to the rotation of the substrate W, and instantaneously spreads from the center of the upper surface of the substrate W toward the peripheral edge. Go. As a result, the rinse liquid is supplied to the entire upper surface of the substrate W, and the second cleaning liquid is washed away from the substrate W by the rinse liquid. In this way, the rinsing process is performed on the upper surface of the substrate W.

  On the other hand, the rinsing liquid discharged from the lower surface nozzle 12 is deposited on the lower surface central portion of the substrate W, receives a centrifugal force due to the rotation of the substrate W, and moves from the central portion toward the peripheral portion along the lower surface of the substrate W. It spreads. Thereby, on the lower surface of the substrate W, a liquid film of the rinsing liquid having a flow from the central portion toward the peripheral portion is formed. The flow rate of the rinse liquid discharged from the lower surface nozzle 12 is controlled so that the film thickness of the liquid film of the rinse liquid is, for example, several μm to several hundred μm, and the adsorption state of the substrate W by the spin chuck 3 is maintained.

  The second cleaning liquid adhering to the lower surface of the substrate W is washed away by the rinse liquid supplied to the lower surface of the substrate W. In this way, the rinsing process is performed on the lower surface of the substrate W, and the rinsing process is simultaneously performed on the upper surface and the lower surface of the substrate W. After the rinsing process for the upper surface and the lower surface of the substrate W is performed for a predetermined time, the rinsing liquid valve 31 and the lower rinsing liquid valve 16 are closed by the control unit 50, and the rinsing liquid on the upper surface and the lower surface of the substrate W is closed. Supply is stopped.

  After the rinsing process is simultaneously performed on the upper surface and the lower surface of the substrate W, a drying process (spin drying) for drying the substrate W is performed (step S26). Specifically, first, the motor 9 is controlled by the controller 50, and the spin base 7 is rotated at a high rotation speed (for example, several thousand rpm). At this time, nitrogen gas is discharged from the lower gas discharge port 18 at a discharge flow rate at which the adsorption state of the substrate W by the spin chuck 3 is maintained.

  When the spin base 7 is rotated at a high rotational speed, the substrate W supported by the support ring 8 is integrally held around the rotation axis L1 at a high rotational speed together with the support ring 8 while being sucked and held by the spin chuck 3. Rotate. As shown in FIG. 8, the rinse liquid adhering to the substrate W receives centrifugal force due to the rotation of the substrate W, is swung around the substrate W, and is drained from the substrate W (drainage process). Thereby, the substrate W is dried.

After the high-speed rotation of the substrate W is continued for a predetermined time, the rotation of the motor 9 is stopped and the rotation of the substrate W by the spin chuck 3 is stopped. Thereafter, the processed substrate W is received from the support ring 8 by the plurality of push-up pins 39 (see FIG. 2), and the substrate W is unloaded from the processing chamber 2 by the transfer robot (step S27).
As described above, in the present embodiment, the support ring 8 that supports the substrate W surrounds the entire circumference of the substrate W, and is extended so that the outer peripheral edge of the substrate W extends outward. The extended surface 36 is a liquid-phobic surface having a higher liquid-phobic property than the substrate W. Therefore, although the processing liquid supplied to the upper surface of the substrate W and has reached the peripheral edge of the upper surface of the substrate W can move outward toward the expansion surface 36, the movement is caused by the expansion surface 36 that is a lyophobic surface. It is suppressed. Therefore, in the process of forming a liquid film of the processing liquid on the substrate W in the paddle processing on the upper surface of the substrate W, the amount of the processing liquid that spills from the outer peripheral edge of the substrate W can be reduced. Thereby, the consumption of a process liquid can be reduced.

  Further, if the substrate W is rotated around the rotation axis L1 that is a vertical axis, and the centrifugal force larger than the force that the expansion surface 36 suppresses the movement of the processing liquid is applied to the processing liquid on the substrate W, the substrate W The processing liquid can be moved outward from the peripheral edge of the upper surface toward the expansion surface 36. Therefore, it is possible to smoothly perform the rinsing process and the drying process on the upper surface of the substrate W. Accordingly, a series of substrate processing from processing with the processing liquid to drying can be smoothly performed while reducing consumption of the processing liquid.

  Furthermore, in this embodiment, since the substrate W supported by the support ring 8 can be sucked and held by increasing the rotation speed of the spin base 7 and the support ring 8, for example, the peripheral end surface of the substrate W is formed by a plurality of clamping members. There is no need to separately provide a holding mechanism such as a mechanical chuck mechanism for holding and holding the substrate W, or a vacuum mechanism for sucking and holding the substrate W by sucking air in the narrow space S1. Therefore, the structure of the substrate processing apparatus 1 can be simplified, and the manufacturing cost of the substrate processing apparatus 1 can be reduced. Further, the substrate processing apparatus 1 can be downsized. Furthermore, since it is not necessary to provide a mechanical chuck mechanism, for example, in the above-described drying process, the processing liquid that moves outward on the substrate W hits the holding member and rebounds, or air current is generated by the rotation of the holding member around the rotation axis L1. It is possible to suppress or prevent the processing liquid discharged from the substrate W from adhering to the substrate W due to disturbance. Thereby, contamination of the substrate W can be suppressed or prevented.

  Furthermore, in this embodiment, since the tapered surface 35 of the support ring 8 supports the lower peripheral edge of the substrate W by line contact, the contact area between the substrate W and the tapered surface 35 is reduced. . Thereby, it can suppress or prevent that foreign materials, such as a particle, move to the board | substrate W from the taper surface 35, and the said board | substrate W is contaminated. Further, when the substrate W is attracted and held by the spin chuck 3, portions other than the lower peripheral edge portion of the substrate W can be brought into non-contact with the spin chuck 3, so that foreign matter moves from the spin chuck 3 to the substrate W. Thus, contamination of the substrate W can be suppressed or prevented.

Hereinafter, another embodiment of the present invention will be described with reference to FIGS. 11 to 16, the same components as those shown in FIGS. 1 to 10 described above are denoted by the same reference numerals as those in FIGS. 1 to 10, and the description thereof is omitted.
In the above-described embodiment, the case where the support ring 8 is an annular flat plate member and the cross-sectional shape thereof is a wedge shape that tapers toward the inner peripheral side has been described. The shape is not limited to this. Specifically, for example, the support ring 8 may have a shape shown in FIGS.

  The support ring 108 (holding portion) shown in FIG. 11 has an annular plate shape, and its cross-sectional shape (cross-sectional shape along the vertical plane) is rectangular. The upper surface and the lower surface of the support ring 108 are each an annular horizontal surface. Further, the inner diameter of the support ring 108 is smaller than the outer diameter of the substrate W, and the outer diameter of the support ring 108 is larger than the outer diameter of the substrate W. In this embodiment, the outer diameter of the support ring 108 is approximately the same as the outer diameter of the spin base 7. The support ring 108 is horizontally disposed along the peripheral edge of the upper surface of the spin base 7 so as to be coaxial with the spin base 7. The peripheral edge of the lower surface of the substrate W is supported by the inner periphery of the upper surface of the support ring 108. In a state where the substrate W is supported by the support ring 108, the entire upper surface of the support ring 108 positioned outward from the substrate W extends so that the outer peripheral edge of the substrate W extends outward. It is an expansion surface 136 that surrounds the circumference.

  Further, the support ring 208 (holding portion) shown in FIG. 12 is formed in an annular flat plate shape, and the corner portion on the inner peripheral upper side is cut downward over the entire periphery. This cut portion forms an annular step 51 that is concentric with the support ring 208 and forms an annular shape. The annular step portion 51 has an annular horizontal surface 52 extending outward from the upper end of the inner peripheral surface of the support ring 208, and a cylindrical vertical surface 53 extending upward from the outer peripheral edge of the horizontal surface 52. . The horizontal surface 52 has an inner diameter smaller than the outer diameter of the substrate W, and the outer diameter is slightly larger than the outer diameter of the substrate W. The vertical surface 53 has the same height as the thickness of the substrate W.

The peripheral edge of the lower surface of the substrate W is supported by a horizontal plane 52. In a state where the lower surface peripheral portion of the substrate W is supported by the horizontal surface 52, the vertical surface 53 is opposed at a position close to the peripheral end surface of the substrate W. By causing the vertical surface 53 to be close to the peripheral end surface of the substrate W, it is possible to suppress or prevent the displacement of the substrate W in the horizontal direction.
Further, the upper surface of the support ring 208 has an annular horizontal surface, and is formed so as to be continuous with the upper surface peripheral portion of the substrate W in a state where the lower surface peripheral portion of the substrate W is supported by the horizontal surface 52. The upper surface of the support ring 208 is an extended surface 236 that surrounds the entire periphery of the substrate W so as to expand the outer peripheral edge of the substrate W outward.

  Further, the support ring 308 (holding portion) shown in FIG. 13 is formed in an annular flat plate shape, and the corner portion on the inner periphery upper side is cut downward over the entire periphery. This cut portion forms an annular step 54 that is concentric with the support ring 308 and forms an annular shape. The annular step portion 54 includes an annular tapered surface 55 that extends outward from the upper end of the inner peripheral surface of the support ring 308, and a cylindrical vertical surface 56 that extends upward from the outer peripheral edge of the tapered surface 55. ing. The tapered surface 55 is inclined downward toward the inside of the support ring 308. The tapered surface 55 has an inner diameter smaller than the outer diameter of the substrate W, and the outer diameter is slightly larger than the outer diameter of the substrate W.

The tapered surface 55 can support the lower peripheral edge of the substrate W by line contact. In a state where the lower surface peripheral portion of the substrate W is supported by the tapered surface 55, the vertical surface 56 opposes at a position close to the peripheral end surface of the substrate W. By bringing the vertical surface 56 close to the peripheral end surface of the substrate W, it is possible to suppress or prevent the displacement of the substrate W in the horizontal direction.
Further, the upper surface of the support ring 308 is formed in an annular horizontal plane, and is formed so as to be continuous with the upper surface peripheral portion of the substrate W while the lower surface peripheral portion of the substrate W is supported by the tapered surface 55. The upper surface of the support ring 308 is an extended surface 336 that surrounds the entire periphery of the substrate W so as to expand the outer peripheral edge of the substrate W outward.

  Further, the support ring 408 (holding portion) shown in FIG. 14 has the same shape as the support ring 8 shown in FIG. 2, and a plurality of (three or more) support portions projecting upward from the tapered surface 35. 57. In FIG. 14, only one support part 57 is shown. The plurality of support portions 57 are annularly arranged on the tapered surface 35 with an interval in the circumferential direction of the support ring 408.

  Each support portion 57 has a spherical outer surface, and can support the lower surface of the substrate W by point contact (so-called proximity balls). Each support portion 57 is disposed on the lower surface of the substrate W so as to support a position on the center side of 1 to 2 mm from the outer peripheral edge, for example. The support ring 408 can support the substrate W by causing each support portion 57 to make point contact with the peripheral edge of the lower surface of the substrate W so that the support portions 57 cooperate with each other.

  Further, the protruding amount of each support portion 57 from the tapered surface 35 is reduced. The support ring 408 can support the substrate W in a state where the peripheral edge of the lower surface of the substrate W is brought close to the tapered surface 35. A gap 438 is formed between the lower surface of the substrate W and the tapered surface 35 except for the portion supported by the support portion 57 in a state where the substrate W is supported by the plurality of support portions 57. The narrow space S1 formed between the upper surface of the spin base 7 and the lower surface of the substrate W is communicated with the space around the support ring 408 through the gap 438. That is, in this embodiment, the gap 438 functions as a communication portion that allows the narrow space S1 to communicate with the space around the support ring 408. Therefore, in this embodiment, as shown in FIG. 14, the lower surface of the support ring 408 is in close contact with the upper surface of the spin base 7 without providing a gap between the upper surface of the spin base 7 and the lower surface of the support ring 408. Even in this case, the gas existing in the narrow space S1 can be discharged from the gap 438 between the peripheral edge of the lower surface of the substrate W and the tapered surface 35, so that the narrow space S1 can be set to a negative pressure. Thereby, the substrate W supported by the support ring 408 can be sucked and held. Although not shown, in this embodiment, a configuration may be adopted in which a gap G1 as shown in FIG. 2 is provided between the upper surface of the spin base 7 and the lower surface of the support ring 408.

Although not shown, a plurality of support portions 57 may be provided on the support rings 108, 208, and 308 shown in FIGS. 11 to 13, and the substrate W may be supported by these support portions 57.
A support ring 508 (holding portion) shown in FIG. 15 includes a flat plate portion 58 having the same shape as the support ring 8 shown in FIG. 2 and a cylindrical portion 59 extending downward from the outer peripheral portion of the flat plate portion 58. have. The tubular portion 59 extends vertically downward from the outer peripheral portion of the flat plate portion 58. The cylindrical portion 59 is located outside the spin base 7 and surrounds the gap 38. A predetermined gap is formed between the inner peripheral surface of the cylindrical portion 59 and the outer peripheral surface of the spin base 7. The cylindrical portion 59 can suppress or prevent foreign matters such as mist and particles of the processing liquid from entering the narrow space S <b> 1 through the gap 38. Thereby, it can suppress or prevent that a process liquid and a foreign material adhere to the lower surface of the board | substrate W, and the said lower surface is contaminated.

  A support ring 608 (holding portion) shown in FIG. 16 includes a flat plate portion 58 having the same shape as the support ring 8 shown in FIG. 2 and a cylindrical portion 60 extending downward from the outer peripheral portion of the flat plate portion 58. have. The tubular portion 60 extends downward from the outer peripheral portion of the flat plate portion 58 while spreading outward. The cylindrical portion 60 is located outside the spin base 7 and surrounds the gap 38. A predetermined gap is formed between the inner peripheral surface of the cylindrical portion 60 and the outer peripheral surface of the spin base 7.

  The cylindrical portion 60 can suppress or prevent foreign matters such as mist and particles of the processing liquid from entering the narrow space S <b> 1 through the gap 38. Further, since the cylindrical portion 60 extends downward while spreading outward from the outer peripheral portion of the flat plate portion 58, the processing liquid discharged outward from the gap 38 is lowered downward by the inner peripheral surface of the cylindrical portion 60. Can lead. As a result, it is possible to suppress or prevent the processing liquid discharged from the gap 38 from striking the tubular portion 60 and rebounding and entering the gap 38 again. As a result, it is possible to suppress or prevent a decrease in dischargeability of the processing liquid from the gap 38.

Although not shown, the cylindrical portion 59 or the cylindrical portion 60 may be provided on the support rings 108, 208, and 308 shown in FIGS.
Although the embodiments of the present invention have been described above, the present invention is not limited to the contents of the above-described embodiments, and various modifications can be made within the scope of the claims. For example, in the above-described embodiment, the case where the support ring 8, 108, 208, 308, 408, 508, 608 and the spin base 7 are separate from each other has been described, but the support ring 8, 108, 208, 308, 408 is described. , 508, 608 and the spin base 7 may be integrally formed. Specifically, for example, as shown in FIG. 17, the support ring 8, the spin base 7, and the plurality of connecting members 37 may be integrally formed.

  Further, in the above-described embodiment, the case where the support rings 8, 108, 208, 308, 408, 508, and 608 that function as the holding portion are each annular is described, but the holding portion may not be annular. For example, a flat member may be used as the holding portion. In this case, the substrate can be sucked and held on the flat plate member by forming a small diameter suction hole in the flat plate member and sucking the lower surface of the substrate from the suction hole.

  In the above-described embodiment, the case where nitrogen gas is discharged upward from the annular lower gas discharge port 18 located in the center of the upper surface of the spin base 7 has been described. It is also possible to form a plurality of discharge ports on the peripheral edge of the upper surface 7 and to discharge nitrogen gas upward from these discharge ports. In this case, nitrogen gas can be reliably blown out from the gap 38 between the spin base 7 and the support ring 8, so that the processing liquid and foreign matter can be more reliably suppressed or prevented from entering the gap 38.

  In the above-described embodiment, the case has been described in which the extended surface 36 is formed as a lyophobic surface by forming the support ring 8 from a material having a higher lyophobic property than the substrate W. For example, the extended surface 36 may be a lyophobic surface by coating the outer surface of the support ring 8 with a material having higher lyophobic properties than the substrate W.

In the above-described embodiment, the semiconductor wafer is taken up as the substrate W to be processed. However, the substrate is not limited to the semiconductor wafer, but is used for a liquid crystal display device substrate, a plasma display substrate, an FED substrate, an optical disk substrate, and a magnetic disk substrate. Other types of substrates such as a substrate, a magneto-optical disk substrate, and a photomask substrate may be processed.
In addition, various design changes can be made within the scope of matters described in the claims.

It is an illustration figure for demonstrating the structure of the substrate processing apparatus which concerns on one Embodiment of this invention. It is a schematic longitudinal cross-sectional view of a spin chuck. It is an illustration top view of a spin chuck. It is a block diagram for demonstrating the electrical structure of a substrate processing apparatus. It is process drawing for demonstrating the 1st process example of the board | substrate by a substrate processing apparatus. FIG. 2 is a schematic side view of a spin chuck during substrate processing. FIG. 2 is a schematic side view of a spin chuck during substrate processing. FIG. 2 is a schematic side view of a spin chuck during substrate processing. It is process drawing for demonstrating the 2nd example of a process of the board | substrate by a substrate processing apparatus. It is an illustration side view of a spin chuck during execution of the 2nd processing example. It is an illustration longitudinal section of a support ring concerning other embodiments of the present invention, and the composition relevant to it. FIG. 6 is a schematic longitudinal sectional view of a support ring and a related configuration according to still another embodiment of the present invention. FIG. 6 is a schematic longitudinal sectional view of a support ring and a related configuration according to still another embodiment of the present invention. FIG. 6 is a schematic longitudinal sectional view of a support ring and a related configuration according to still another embodiment of the present invention. FIG. 6 is a schematic longitudinal sectional view of a support ring and a related configuration according to still another embodiment of the present invention. FIG. 6 is a schematic longitudinal sectional view of a support ring and a related configuration according to still another embodiment of the present invention. FIG. 6 is a schematic longitudinal sectional view of a support ring and a related configuration according to still another embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 3 Spin chuck 4 Cleaning liquid nozzle 5 Rinse liquid nozzle 8 Support ring 9 Motor 35 Tapered surface 36 Expansion surface 38 Gap 50 Control part 55 Tapered surface 57 Support part 108 Support ring 136 Expansion surface 208 Support ring 236 Expansion surface 308 Support Ring 336 Expansion surface 408 Support ring 438 Clearance 508 Support ring 608 Support ring L1 Rotation axis S1 Narrow space W Substrate

Claims (5)

A substrate holding means having a holding portion for holding the substrate horizontally;
Processing liquid supply means for supplying a processing liquid to the substrate held by the substrate holding means,
The holding portion has an annular expansion surface provided so as to surround the entire periphery of the substrate and expand the outer peripheral edge of the substrate outward.
The substrate processing apparatus, wherein the extended surface is a lyophobic surface having a higher lyophobic property than the substrate. The substrate holding means includes a rotating means for rotating the holding portion around a vertical axis,
The holding portion is formed so as to be able to support the lower surface peripheral edge portion of the substrate over the entire circumference so that a space is generated below the substrate, and for communicating the space with the space around the holding portion. The substrate processing apparatus according to claim 1, further comprising a communication unit. The holding portion includes an annular tapered surface that is inclined downward toward the inside,
The substrate processing apparatus according to claim 1, wherein the tapered surface is formed so as to support a peripheral portion of a lower surface of the substrate by line contact. The holding part has a plurality of support parts arranged in an annular shape,
The substrate processing apparatus according to claim 1, wherein each of the plurality of support portions is formed so as to support a peripheral portion of a lower surface of the substrate by point contact.   A liquid film forming step of controlling the processing liquid supply means to supply a processing liquid to the upper surface of the substrate, thereby forming a liquid film of the processing liquid covering the upper surface by performing liquid accumulation on the upper surface of the substrate; 5. The substrate processing apparatus according to claim 1, further comprising: a control unit that controls the substrate holding unit to perform a draining step of draining the processing liquid from the substrate.

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