JP2010093057A - Resin-sealed electronic component, and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin-sealed electronic component that securely prevents a resin from leaking in an engagement portion between a case-side wall member and a case base or a through-hole into which a terminal for external connection is inserted, and to provide a method of manufacturing the resin-sealed electronic component. <P>SOLUTION: The resin-sealed electronic component includes a resin injection groove portion 9 formed along the engagement portion 7 between the case-side wall member 2 and case base 3, a projection portion 14 arranged having a gap with the terminal 6 for external connection, and a resin reception portion 14a extended to below the terminal 6 for external connection along the through-hole 10, and fine gaps are blocked by making a gap closing resin 8 injected into the resin injection groove portion 9 infiltrate a gap of the engagement portion 7 through capillarity and also making a gap closing resin 8 passed through the gap between the resin reception portion 14a and terminal 6 for external connection infiltrate the gap between the through-hole 10 and terminal 6 through capillarity, thereby preventing the resin from leaking. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a resin-encapsulated electrical component and a method for manufacturing the same.

As shown in FIG. 5, in a conventional case-containing capacitor in which a capacitor element 22 is housed in a case 21 and filled with a resin 23, each terminal 24 for external connection is passed through each through hole 26 in each side wall member 25 of the case. There is a case in which each side wall member 25 of the case is fitted to a case base 27 and filled with resin 23 and sealed with resin (for example, see Patent Document 1).
Japanese Patent Publication No. 3-67332

  However, as in the conventional example described above, when the fitting portions of the case base 27 and the side wall member 25 are fitted and filled with the resin 23, the resin 23 may leak from a minute gap existing in the fitting portion. Therefore, it was necessary to separately prevent resin leakage, such as applying an adhesive along the fitting portion.

  Further, when each terminal 24 for external connection is led out through each through hole 26 of each side wall member 25 of the case, each penetration of each side wall member 25 of the case through which each terminal 24 for external connection is inserted. There is a possibility that resin leakage may occur from the hole 26, and in order to prevent resin leakage, attempts have been made to make the size of the through hole 26 slightly smaller than the size of the terminal 24, but in this case, depending on the material of the resin case 21 However, there is a problem in that the resin case 21 may crack when each terminal 24 is inserted.

  The present invention has been made to solve the above-described conventional drawbacks, and an object of the present invention is to provide a resin-encapsulated electrical component that can reliably prevent the leakage of the filled resin and a method for manufacturing the same.

  Accordingly, the present invention is a resin-encapsulated electrical component in which an electrical element 4 is housed in a case 1 and filled with a filling resin 5 and a terminal 6 for external connection is derived, and the case side wall member 2 is fitted to the case base 3 The resin injection groove portion 9 is provided along the fitting portion 7, and the gap closing resin 8 injected into the resin injection groove portion 9 is allowed to enter the gap of the fitting portion 7. It is characterized by that.

  The case 1 is a resin-encapsulated electrical component in which an electrical element 4 is housed and filled with a filling resin 5 and a terminal 6 for external connection is led out. The external connection terminal 6 is a through-hole in the case side wall member 2. 10, and a projecting portion 14 arranged so as to have a clearance S between the external connection terminal 6 inside the case 1 and the through hole 10 of the case side wall member 2 inside the case 1. A resin receiving portion 14a extending below the external connection terminal 6 is provided, and the gap closing resin 8 is passed through the gap 10 between the resin receiving portion 14a and the external connection terminal 6. And the terminal 6 are made to enter.

  Furthermore, a method of manufacturing a resin-encapsulated electrical component in which an electrical element 4 is housed in a case 1 and filled with a filling resin 5 and a terminal 6 for external connection is derived, and the case side wall member 2 is fitted to the case base 3 After the fitting portion 7 is provided, the resin injection groove portion 9 is provided along the fitting portion 7, the case side wall member 2 and the case base 3 are fitted, and before the filling resin 5 is filled in the case 1. In addition, the gap closing resin 8 is injected into the resin injection groove 9, and the gap closing resin 8 is allowed to enter the gap of the fitting portion 7, and after curing, the case 1 is filled with the filling resin 5. It is a feature.

  Furthermore, a method for manufacturing a resin-encapsulated electrical component in which an electric element 4 is housed in a case 1 and filled with a filling resin 5 and a terminal 6 for external connection is led out, the external connection terminal 6 is a case side wall member. A projecting portion 14 which is led out through the two through holes 10 and is disposed inside the case 1 so as to have a gap S between the external connection terminals 6 and the case side wall member 2 inside the case 1. The resin receiving portion 14a extending below the external connection terminal 6 is provided along the through hole 10 of the case, and after the external connection terminal 6 is inserted into the through hole 10 of the case side wall member 2, the through hole 10, a gap closing resin 8 is injected so as to straddle the case sidewall member 2 and the external connection terminal 6, and the gap closing resin 8 is used as the resin receiving portion 14 a and the external connection terminal. Through hole 10 and terminal 6 through a gap with 6 Clearance by infiltration, after curing, is characterized by filling the filling resin 5 to the casing 1.

  According to the resin-encapsulated electrical component of the present invention, the case side wall member 2 has the fitting portion 7 to be fitted to the case base 3, and the resin injection into which the gap closing resin 8 enters along the fitting portion 7. Since the groove portion 9 is provided, before the filling resin 5 is filled into the case 1, the gap closing resin 8 in the resin injection groove portion 9 is injected into the resin injection groove portion 9 in advance to fill the gap closing resin 8 in the resin injection groove portion 9. However, resin leakage can be reliably prevented by entering into a minute gap existing in the fitting portion 7 by a capillary phenomenon and closing the gap.

  Further, the external connection terminal 6 is led out through the through hole 10 of the case side wall member 2, and the protrusion is arranged so as to have a clearance S between the case 1 and the external connection terminal 6. Since the resin receiving part 14a extended below the terminal 6 for external connection along the through-hole 10 of the case side wall member 2 inside the case 14 and the case 1 inside is provided, the upper surface of the terminal 6 for external connection The gap closing resin 8 is poured into the terminal 6 by injecting the gap closing resin 8 so as to straddle the case sidewall member 2 and the terminal 6 in the vicinity of the contact portion between the contact hole and the inner peripheral surface of the through hole 10. The gap closing resin 8 can be guided to the resin receiving portion 14a extending from the lower side of the terminal 6 for external connection. Further, through the gap between the resin receiving portion 14a and the external connection terminal 6, the gap closing resin 8 penetrates into a minute gap existing between the terminal 6 and the inner peripheral surface of the through hole 10 by capillary action. However, resin leakage can be reliably prevented by closing the gap.

  Next, specific embodiments of the resin-encapsulated electrical component of the present invention will be described in detail with reference to the drawings. As shown in FIGS. 1 to 3, the resin-sealed electrical component according to the embodiment of the present invention houses an electrical element 4 such as a capacitor element in a resin case 1, and is connected to the electrical element 4. This is a resin-encapsulated electrical component having a structure in which the terminals 6 and 6 are led out of the case 1 and filled with a filling resin 5 such as epoxy resin.

  The case 1 includes a case base 3 and a detachable case side wall member 2 for closing a side surface portion of the case base 3. The case base 3 is a hollow box-shaped member provided with an opening on the upper side, and has a substantially rectangular bottom wall 12 and three side walls 13 extending upward from three sides of the end of the bottom wall 12. 13 and 13, and the other side surface portion has a shape cut out in a substantially square shape from the upper end downward. And the fitting groove 7a is formed in the right-and-left both ends and lower end part which divide a cutting part so that a cutting part may be followed.

  Moreover, as shown in FIG.1 and FIG.2, the guide piece 11 is extended toward the direction of an excision part at intervals of about 1 to several millimeters with the fitting groove 7a along the fitting groove 7a. ing.

  The case side wall member 2 is a substantially rectangular plate-like member, and two through holes 10 and 10 for inserting the terminals 6 and 6 are formed therein. Then, the left and right ends 7b and 7b and the lower end 7c of the case side wall member 2 are fitted so as to be fitted in the fitting grooves 7a provided in the case base 3, as shown in FIGS. Projections are formed. That is, the fitting protrusions of both end portions 7 b and 7 b provided on the case side wall member 2 are positioned above the fitting groove 7 a of the case base 3, so that the case side wall member 2 moves downward with respect to the case base 3. , The fitting protrusions of both end portions 7b and 7b and the lower end portion 7c are fitted into the fitting groove 7a, and the case side wall member 2 can be fitted into the case base 3. When the case side wall member 2 and the case base 3 are fitted, the resin injection groove portion 9 extends along the fitting portion 7 by the guide piece 11 provided around the cut portion and the inner side surface 16 of the case side wall member 2. Is formed.

  Further, as shown in FIGS. 1 and 2, the inner surface 16 of the case side wall member 2 sandwiches the through-hole 10 at a location about 1 to several mm in the left-right direction from both left and right ends of the through-hole 10. A pair of first protrusions (protrusions) 14 and 14 extending in the vertical direction are formed. Further, a first resin receiving portion (resin receiving portion) 14 a is formed along the lower end portion of the through-hole 10 so as to connect both lower end portions of the pair of first projecting portions 14 and 14 substantially horizontally. When the terminal 6 is inserted through the through hole 10, gaps S and S are formed between the left and right side portions of the terminal 6 and the first protrusions 14 and 14, and the lower surface of the terminal 6 and the resin receiving portion 14a. Lightly touches the top surface. Instead of abutting in this way, a minute gap may be formed between the lower surface of the terminal 6 and the upper surface of the first resin receiving portion 14a.

  Moreover, as shown in FIG.1 and FIG.3, a pair of 2nd protrusion part extended substantially in parallel with the 1st protrusion parts 14 and 14 toward the downward direction from the lower end part of the 1st protrusion parts 14 and 14 15 and 15 are formed. And the 2nd resin receiving part 15a is formed so that the both lower ends of a pair of 2nd protrusion parts 15 and 15 may be connected substantially horizontally.

  The resin-encapsulated electrical component is manufactured using the resin case 1 as described above. Next, the procedure will be described. As shown in FIG. 4, first, the plate-like terminals 6, 6 are first inserted into the through holes 10, 10 provided in the case side wall member 2 and attached. When the terminals 6 and 6 are inserted into the through holes 10 and 10, between the pair of first projecting portions 14 and 14 provided on the inner surface 16 of the case side wall member 2 and the left and right side portions of the terminals 6 and 6. In addition, the gaps S and S are formed, and the upper surfaces of the first resin receiving portions 14a and 14a and the lower surfaces of the terminals 6 and 6 are in light contact with each other or have a minute gap.

  Next, the electric element 4 is connected between the terminals 6 and 6 attached to the case side wall member 2 as described above. When the connection of the electric element 4 is completed, the case side wall member 2 is attached to the case base 3 to assemble the resin case 1 and the electric element 4 is positioned in the case 1 as described above. At this time, as described above, the resin injection groove portion 9 is formed along the fitting portion 7 between the case side wall member 2 and the case base 3 by the inner side surface 16 of the case side wall member 2 and the guide piece 11. In this state, the vicinity of the contact portion between the upper surfaces of the terminals 6 and 6 inside the case 1 and the inner peripheral surface of the through holes 10 and 10, the vicinity of the center of the inner side surface 16 of the case side wall member 2, and the upper end of the resin injection groove portion 9. The gap closing resin 8 is injected from the vicinity.

  Then, in the gap closing resin 8 injected in the vicinity of the contact portion between the upper surfaces of the terminals 6 and 6 and the inner peripheral surfaces of the through holes 10 and 10, the upper surfaces of the terminals 6 and 6 and the inner surface 16 of the case side wall member 2 Flows in the left-right direction so as to straddle, flows downward through each gap S, flows into a minute gap formed between the upper surfaces of the first resin receiving portions 14a, 14a and the lower surfaces of the terminals 6, 6, The minute gap that exists between the terminals 6 and 6 and the inner peripheral surfaces of the through holes 10 and 10 enters by capillarity, and the gap is closed.

  In addition, the gap closing resin 8 injected in the vicinity of the center of the inner side surface 16 of the case side wall member 2 flows downward while passing through the inner side surface 16 of the case side wall member 2 and is positioned below the resin injection groove portion 9. And flows in the left-right direction along the resin injection groove 9.

  Further, the gap closing resin 8 injected in the vicinity of the upper end of the resin injection groove 9 flows downward through the resin injection groove 9 and flows from the vicinity of the center of the inner side surface 16 of the case side wall member 2. Merge with resin 8. At this time, the gap closing resin 8 flows over the entire region of the resin injection groove 9, so that the gap closing resin 8 is fitted between the case base 3 and the case side wall member 2 that causes resin leakage due to capillary action. It enters into a minute gap existing at the joint 7 and this gap is closed.

  Then, after the injected gap closing resin 8 is cured, the filling resin 5 is filled in the case 1 to complete the manufacture of the resin-encapsulated electrical component.

  According to the resin-encapsulated electrical component and the manufacturing method thereof of the above embodiment, the resin injection groove portion 9 is formed along the fitting portion 7 between the case base 3 and the case side wall member 2, and the gap is closed in the resin injection groove portion 9 When the resin 8 is injected, the gap closing resin 8 enters the minute gap that exists in the fitting portion 7 and causes resin leakage, and thus the gap is completely closed. As a result, resin leakage from the fitting portion 7 between the case base 3 and the case side wall member 2 can be prevented.

  In addition, when the terminals 6 and 6 are inserted through the through holes 10 and 10 of the case side wall member 2, gaps S are formed between the left and right side ends of the terminals 6 and 6 and the first protrusions 14, respectively. By injecting gap closing resin 8 from the vicinity of the contact portion between the upper surfaces of the terminals 6 and 6 inside the case and the inner peripheral surfaces of the through holes 10 and 10, the upper surfaces of the terminals 6 and 6 and the inner surface of the case side wall member 2 16, flows in the left-right direction across the gap S, flows downward through the gaps S, flows into a minute gap between the lower surfaces of the terminals 6, 6 and the upper surfaces of the first resin receiving portions 14a, 14a, 6 and 6 and the inner peripheral surface of the through-holes 10 and 10 of the case side wall member 2 enter a minute gap that causes resin leakage by capillarity, and the gap is closed. As a result, resin leakage from the through holes 10 and 10 can be prevented.

  Although specific embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made within the scope of the present invention. For example, various materials other than the epoxy resin can be adopted as the material of the filling resin 5. Various materials can be used as the gap closing resin 8, but a material having a lower viscosity and higher fluidity than the filling resin 5 such as an epoxy resin is preferably used. The electric element 4 can also be applied as a resistor other than a capacitor, a diode, or the like. Furthermore, in the above, the case side wall member 2 is provided with the second projecting portions 15 and 15 and the second resin receiving portion 15a for preventing the gap closing resin 8 from sagging, but the first projecting portion 14, 14 and the first resin receiving portion 14a alone may be used. Also in the configuration, an example in which one case side wall member 2 and two terminals 6 and 6 are used is shown, but any number of these can be implemented. In the above example, after the case side wall member 2 and the case base 3 are fitted, the gap is closed in the vicinity of the contact portion between the upper surfaces of the terminals 6 and 6 inside the case and the inner peripheral surfaces of the through holes 10 and 10. The resin 8 is poured, but after the terminals 6 and 6 are inserted into the through holes 10 and 10 of the case side wall member 2, before the case side wall member 2 and the case base 3 are fitted, the gap is closed. Resin 8 may be poured.

It is a perspective view which shows one Embodiment of the resin-sealed electrical component of this invention. It is a cross-sectional view of the embodiment. It is a longitudinal cross-sectional view of the said embodiment. It is process drawing which shows the manufacturing process of the said embodiment. It is a perspective view of a prior art example.

Explanation of symbols

1 .. Resin case, 2 .. Case side wall member, 3 .. Case base, 4 .. Electrical element, 5 .. Filling resin, 6 .. Terminal, 7 .. Fitting part, 8. , 9 .. Resin injection groove, 10.. Through hole, 14... First protrusion, 14 a.

Claims (4)

  A resin-encapsulated electrical component in which an electrical element (4) is housed in a case (1) and filled with a filling resin (5) and a terminal (6) for external connection is derived, and the case side wall member (2) is the case There is a fitting portion (7) fitted to the base body (3), a resin injection groove portion (9) is provided along the fitting portion (7), and a gap injected into the resin injection groove portion (9) A resin-sealed electrical component, wherein the closing resin (8) is infiltrated into the gap of the fitting portion (7).   A resin-encapsulated electrical component in which an electrical element (4) is housed in a case (1) and filled with a filling resin (5) and a terminal (6) for external connection is derived, the terminal (6) for external connection Is led out through the through hole (10) of the case side wall member (2), and is arranged so as to have a gap (S) between the case (1) and the external connection terminal (6). And a resin receiving portion (14a) extending below the external connection terminal (6) along the through hole (10) of the case side wall member (2) inside the case (1). And the gap closing resin (8) was allowed to enter the gap between the through hole (10) and the terminal (6) through the gap between the resin receiving portion (14a) and the external connection terminal (6). A resin-encapsulated electrical component.   A method of manufacturing a resin-encapsulated electrical component in which an electrical element (4) is housed in a case (1) and filled with a filling resin (5) and a terminal (6) for external connection is led out, comprising a case side wall member (2 ) Has a fitting portion (7) to be fitted to the case base (3), a resin injection groove (9) is provided along the fitting portion (7), and the case side wall member (2) and the case base are provided. After fitting (3), before filling the filling resin (5) into the case (1), the gap closing resin (8) is injected into the resin injection groove (9) and the gap closing is performed. A method for producing a resin-encapsulated electrical component, wherein the resin (8) is infiltrated into a gap between the fitting portions (7), and after curing, the case (1) is filled with the filling resin (5).   A method of manufacturing a resin-encapsulated electrical component in which an electrical element (4) is housed in a case (1) and filled with a filling resin (5) and a terminal (6) for external connection is derived, the terminal for external connection (6) is led out through the through hole (10) of the case side wall member (2) and has a gap (S) between the case (1) and the external connection terminal (6). And a resin receiving portion extending below the external connection terminal (6) along the through hole (10) of the case side wall member (2) on the inner side of the case (1) (14a) and after inserting the external connection terminal (6) into the through hole (10) of the case side wall member (2), the case side wall member (2) and the periphery of the through hole (10) The gap closing resin (8) is injected so as to straddle the external connection terminal (6), and the gap closing resin 8) is infiltrated into the gap between the through hole (10) and the terminal (6) through the gap between the resin receiving portion (14a) and the external connection terminal (6) and cured, and then the case (1 ) Is filled with filled resin (5).