JP2009290011A - Electronic component mounting board, and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting board allowing an underfill to be uniformly filled in the entire undersurface of an electronic component; and a manufacturing method of the electronic component mounting board. <P>SOLUTION: This electronic component mounting board 1 is provided with a circuit board 10 and the electronic component 20 mounted on the circuit board 10, and allows the underfill 30 to be injected into a space formed between a mounting surface 11 of the circuit board 10 with the electronic component 20 mounted thereon and the electronic component 20. An injection hole 13 for injecting the underfill 30 therethrough is formed in a part of the circuit board 10 facing the electronic component 20 by penetrating in the thickness direction of the circuit board 10; and restriction parts 14 restricting the flow of the injected underfill 30 on the mounting surface 11 are formed in the vicinities of the periphery of the injection hole 13 of the mounting surface 11. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic component mounting board and a method for manufacturing the same.

  Conventionally, when an electronic component having a plurality of connection terminals such as BGA and CSP is mounted on a mounting surface of a circuit board, first, the electronic component is arranged at a predetermined position on the mounting surface of the circuit board, and a plurality of the electronic components are arranged. Connect the connection terminal and the circuit board by soldering or the like. Thereafter, a gap formed between the electronic component and the circuit board is filled with an underfill as a member to be injected to improve the fixing property between the electronic component and the circuit board.

As a method for filling the underfill in the gap formed between the electronic component and the circuit board, a method of injecting the underfill from the mounting surface side of the electronic component on the circuit board is known (for example, Patent Document 1). reference).
However, when underfill is injected by the above method, there are the following problems.

First, since the underfill is injected into the gap formed on the lower surface side of the electronic component from the side surface side of the electronic component on the mounting surface of the circuit board, the underfill is injected outside the side surface of the electronic component. A space for placing the injection member is required. In this space, since other electronic components that interfere with the arrangement of the injection member cannot be arranged, the degree of freedom in arranging the electronic components on the mounting surface of the circuit board is low.
Secondly, in order to fill the entire gap with the underfill from the side surface side of the electronic component, it is necessary to use an underfill with a low viscosity.
Third, underfill is filled from the side surface side of the electronic component to the entire gap, so it takes time to fill the underfill.

Fourth, when underfill is injected, the underfill injected from the injection member toward the lower surface of the electronic component flows out to the mounting surface of the circuit board in order to prevent the underfill from flowing out of the electronic component. A prevention member had to be provided.
Fifth, when a shield case that covers electronic components is arranged on the mounting surface of the circuit board, in order to fill the underfill inside the shield case, the side wall portion and the upper surface portion of the shield case are composed of separate members. It was necessary to use a shielded case having a two-piece structure. As described above, when the shield case has a two-piece structure, the underfill cannot be filled into the shield case without any gap, and the inside of the shield case cannot be completely sealed.

Therefore, in order to solve the above-described problem, an injection hole for injecting underfill is provided in the circuit board, and the underfill is injected through the injection hole from the side opposite to the mounting surface of the electronic component on the circuit board. A method has been proposed (see, for example, Patent Document 2).
According to the method proposed in Patent Document 2, since the underfill is injected from the side opposite to the mounting surface of the circuit board, the above first to fifth problems can be solved.

However, in the method proposed in Patent Document 2, the underfill injected from the injection hole spreads concentrically around the injection hole. Therefore, when the electronic component has a square or rectangle in plan view, there is a problem that the underfill cannot be uniformly filled in the gap formed between the lower surface of the electronic component and the mounting surface of the circuit board. there were.
Japanese Patent Laid-Open No. 2001-210661 JP 2003-110363 A

  Therefore, the present invention provides an electronic component mounting board that can appropriately inject a member to be injected into a gap formed between the lower surface of the electronic component and the mounting surface of the circuit board, and a method for manufacturing the electronic component mounting board. For the purpose.

The present invention comprises a circuit board and an electronic component mounted on the circuit board, and is injected into a gap formed between the mounting surface of the circuit board on which the electronic component is mounted and the electronic component. An electronic component mounting board capable of injecting a member, wherein an injection hole for injecting the injected member is formed in a portion of the circuit board facing the electronic component so as to penetrate in a thickness direction of the circuit board. ,
The present invention relates to an electronic component mounting substrate in which a restricting portion for restricting the flow of the injected member on the mounting surface is provided near the periphery of the injection hole on the mounting surface.

  In addition, when the electronic component is mounted on the mounting surface, the shape of the electronic component viewed in the thickness direction of the circuit board is a substantially rectangular shape, and the injection hole is mounted on the circuit board. Further, it is preferable that the electronic component is located at a portion facing the central portion.

  Moreover, it is preferable that the said control part is located on the straight line from which the distance between the said injection hole and the position facing the outer edge of the said electronic component becomes the shortest in the said mounting surface.

  Moreover, it is preferable that the said to-be-injected member is inject | poured into the said clearance gap substantially uniformly.

  Also, an outflow prevention portion that prevents the injected member from flowing out from the injection hole to the surface opposite to the mounting surface in the vicinity of the periphery of the injection hole on the surface opposite to the mounting surface of the circuit board. Is preferably provided.

  Moreover, it is preferable that the said control part is a convex part formed with the solder.

  Moreover, it is preferable that the said control part is a recessed part formed in the said circuit board.

  Moreover, it is preferable that a cover member that covers the electronic component is provided on the mounting surface of the circuit board.

  The present invention provides a method for manufacturing an electronic component mounting board, wherein an electronic component is mounted on a circuit board, and a member to be injected is injected into a gap formed between the electronic component mounting surface of the circuit board and the electronic component. An injection hole for injecting the injected member is formed in a portion of the circuit board facing the electronic component, and the injected member is injected in the vicinity of the peripheral edge of the injection hole on the mounting surface of the circuit board. The present invention relates to a method for manufacturing an electronic component mounting board in which a restricting portion for restricting movement of the mounting surface is provided, and the injected member is injected through the injection hole from the surface of the circuit board opposite to the mounting surface.

  ADVANTAGE OF THE INVENTION According to this invention, the electronic component mounting board which can inject | pour a to-be-injected member into the clearance gap formed between the lower surface of an electronic component and the mounting surface of a circuit board appropriately, and the manufacturing method of the said electronic component mounting board can be provided. .

Hereinafter, preferred embodiments for carrying out the present invention will be described with reference to the drawings. First, a first embodiment of an electronic component mounting board of the present invention will be described with reference to FIG.
1A is a plan view of the electronic component mounting board 1 according to the first embodiment of the present invention, and FIG. 1B is a cross-sectional view taken along the line II of the electronic component mounting board 1 shown in FIG. 1A.

The electronic component mounting board 1 includes a circuit board 10 having wiring (not shown) formed on the mounting surface 11 and an electronic component 20 mounted on the mounting surface 11 of the circuit board 10.
The electronic component mounting board 1 constitutes a predetermined electronic circuit by electrically connecting a plurality of electronic components 20 arranged on the mounting surface 11 of the circuit board 10 by wiring.

The electronic component 20 used in the present embodiment is a surface mount type electronic component such as BGA or CSP.
The electronic component 20 includes an electronic component body 21 having a substantially square shape in plan view, and a plurality of connection terminals 22 provided on the lower surface 23 of the electronic component body 21.
The plan view means that the electronic component 20 is viewed in the thickness direction of the circuit board 10 in a state where the electronic component 20 is mounted on the mounting surface 11 of the circuit board 10.
A semiconductor chip (not shown) is accommodated in the electronic component main body 21, and this semiconductor chip is electrically connected to each of the plurality of connection terminals 22 via connection lines (not shown).
Each of the plurality of connection terminals 22 has a substantially spherical shape, and is arranged vertically and horizontally in substantially the entire region excluding the central portion of the lower surface 23 of the electronic component main body 21.

The mounting surface 11 of the circuit board 10 is provided with a plurality of conductive portions 12 corresponding to the arrangement of the plurality of connection terminals 22 of the electronic component 20.
The circuit board 10 and the electronic component 20 are connected by soldering a plurality of connection terminals 22 to the plurality of conductive portions 12. Thereby, the electronic component 20 and the circuit board 10 are electrically connected.

An injection hole 13 penetrating in the thickness direction of the circuit board 10 is formed in a portion of the circuit board 10 on which the electronic component 20 is mounted facing the lower surface 23 of the electronic component 20. An underfill 30 made of a thermosetting resin to be described later is injected from the injection hole 13 as a member to be injected.
The injection hole 13 is formed in a portion facing the central portion of the lower surface 23 of the electronic component 20 mounted on the circuit board 10. That is, the injection hole 13 is provided in a portion of the circuit board 10 that faces the portion of the lower surface 23 of the electronic component 20 where the plurality of connection terminals 22 are not disposed.

Four restricting portions 14 are provided in the vicinity of the periphery of the injection hole 13 on the mounting surface 11 of the circuit board 10. Each of these four restricting portions 14 is composed of a convex portion formed of solder. The four restricting portions 14 restrict the flow of the underfill 30 on the mounting surface 11 when an underfill 30 described later is injected.
The four restricting portions 14 are respectively provided on the straight lines 70 on the mounting surface 11 where the distance between the injection hole 13 and the position facing the outer edge of the electronic component 20 is the shortest.
That is, the four restricting portions 14 are respectively arranged on straight lines connecting the injection holes 13 and the midpoints of the four sides constituting the outer edge of the electronic component 20.

  Each of the four restricting portions 14 has a substantially square shape in a plan view, and a pair of opposing vertices of each of the four restricting portions 14 has an injection hole 13 and a midpoint of each of the four sides constituting the outer edge of the electronic component 20. Located on a straight line.

An annular outflow prevention rib 16 is provided near the periphery of the injection hole 13 on the surface 15 opposite to the mounting surface 11 of the circuit board 10. The outflow prevention rib 16 prevents the underfill 30 from flowing out from the injection hole 13 toward the surface 15 opposite to the mounting surface 11 when an underfill 30 described later is injected into the injection hole 13.
The diameter (inner diameter) of the outflow prevention rib 16 is configured to be slightly larger than the diameter of the injection hole 13.

  A gap 60 (see FIG. 2B) formed between the mounting surface 11 of the circuit board 10 and the lower surface 23 of the electronic component 20, the injection hole 13, and an outflow prevention rib on the surface 15 side of the circuit board 10 opposite to the mounting surface 11. Underfill 30 is filled inside 16.

Next, an embodiment of a method for manufacturing an electronic component mounting board according to the present invention will be described with reference to FIGS. This embodiment is a method for manufacturing the electronic component mounting board 1 of the first embodiment described above.
2A is a plan view showing a state before the electronic component mounting board 1 is filled with the underfill 30, and FIG. 2B is a cross-sectional view taken along the line II-II in FIG. 2A. 3A and 4A are plan views showing how the underfill 30 spreads in the process of injecting the underfill 30 into the electronic component mounting substrate 1, respectively, and FIGS. 3B and 4B are respectively the views of FIG. 3A. It is a III-III line sectional view and a IV-IV line sectional view of Drawing 4A. 5A is a plan view showing the electronic component mounting substrate 1 in a state where the underfill 30 has been filled, and FIG. 5B is a cross-sectional view taken along the line VV in FIG. 5A.

  In the manufacturing method of the electronic component mounting substrate 1 according to the present embodiment, the underfill injector 40 is used to introduce the underfill through the injection hole 13 formed in the circuit board 10 from the surface 15 side opposite to the mounting surface 11 of the circuit board 10. Fill 30 is injected to fill the gap 60 formed between the mounting surface 11 of the circuit board 10 and the lower surface 23 of the electronic component 20 substantially uniformly.

  The underfill injector 40 includes a cylindrical cylinder 41 provided with an injection port 43 on the distal end side, and a piston 42 slidably provided inside the cylinder 41.

  First, as shown in FIG. 2B, the tip of the underfill injector 40 in which the underflow 30 is filled in the outflow prevention rib 16 provided on the surface 15 of the circuit board 10 opposite to the mounting surface 11. Abut the sides. Here, the injection port 43 of the cylinder 41 is disposed so as to face the injection hole 13 of the circuit board 10.

Next, as shown in FIGS. 3B and 4B, the piston 42 is advanced to push out the underfill 30 inside the cylinder 41 from the injection port 43, and through the injection hole 13, the mounting surface 11 of the circuit board 10 and the lower surface of the electronic component 20. The gap 60 formed between the two is filled.
Then, since the underfill 30 pushed out from the injection hole 13 is restricted in the mounting surface 11 from the injection hole 13 toward the side where the restricting portion 14 is provided, It does not spread concentrically (see FIGS. 3A and 4A).

Specifically, the underfill 30 that flows from the injection hole 13 toward the restricting portion 14 is prevented from moving outward from the restricting portion 14 by the restricting portion 14, and a part of the underfill 30. Is moved along the side surface of the restricting portion 14 toward a portion where the restricting portion 14 is not provided.
On the other hand, the flow of the underfill 30 flowing from the injection hole 13 toward the portion where the restricting portion 14 is not provided is not restricted.

  As a result, the amount of the underfill 30 flowing from the injection hole 13 toward the side where the restricting portion 14 is provided is reduced, and the amount of the underfill 30 flowing from the injection hole 13 toward the side where the restricting portion 14 is not provided. Will be more.

  Here, as shown in FIG. 2B, FIG. 3B, etc., four regulating portions 14 are provided in the vicinity of the injection hole 13 in the mounting surface 11 of the circuit board 10. Further, the electronic component 20 is substantially square in plan view, and these four restricting portions 14 are arranged on the straight lines on the mounting surface 11 where the distance between the injection hole 13 and the outer edge of the electronic component 20 is the shortest. Has been. And the control part 14 is not provided in the part with the long distance from the injection hole 13 to the outer edge of the electronic component 20, ie, the part which goes to four vertexes in the outer edge of the electronic component 20 from the injection hole 13.

  As a result, as shown in FIGS. 5A and 5B, the underfill 30 injected from the injection hole 13 is filled substantially uniformly over the entire lower surface 23 of the substantially square electronic component 20.

  According to the electronic component mounting substrate 1 and the method for manufacturing the electronic component mounting substrate 1 described above, the following effects are exhibited.

  An injection hole 13 for injecting the underfill 30 is provided in a portion of the circuit board 10 that faces the lower surface 23 of the electronic component 20, and the flow of the underfill 30 is restricted near the periphery of the injection hole 13 in the mounting surface 11 of the circuit board 10. A regulation unit 14 is provided. Thereby, when the underfill 30 is injected through the injection hole 13 from the surface 15 side opposite to the mounting surface 11 of the circuit board 10, the side of the mounting surface 11 where the restricting portion 14 of the injected underfill 30 is provided. Therefore, the injected underfill 30 does not spread concentrically around the injection hole 13. Therefore, by arranging the restricting portion 14 according to the shape of the electronic component 20, the direction and amount of the underfill 30 can be adjusted, so that the space between the lower surface 23 of the electronic component 20 and the mounting surface 11 of the circuit board 10 can be adjusted. The underfill 30 can be uniformly filled in the formed gap 60.

  In addition, since the underfill 30 is injected through the injection hole 13 from the surface 15 side opposite to the mounting surface 11 of the circuit board 10, the degree of freedom of arrangement of the electronic components 20 on the mounting surface 11 of the circuit board 10 is high.

In addition, the electronic component 20 has a substantially square shape in plan view, and the injection hole 13 is provided in a portion facing the central portion of the lower surface 23 of the electronic component 20 mounted on the circuit board 10. As a result, the distance from the injection hole 13 to the outer edge of the electronic component 20 is reduced as compared with the conventional method of filling the underfill from the side surface side of the electronic component. Therefore, even if the underfill 30 having a high viscosity is used, the underfill 30 can be filled in the gap 60 formed between the lower surface 23 of the electronic component 20 and the mounting surface 11 of the circuit board 10 in a short time.
Moreover, since the underfill 30 with high viscosity can be used, the filled underfill 30 can be cured in a short time.

  In addition, since the underfill 30 is injected from the injection hole 13, it is easy to control the force for injecting the underfill 30, and it is possible to prevent the excess underfill 30 from being applied outside the lower surface 23 of the electronic component 20.

  In addition, the restricting portion 14 is provided on a straight line where the distance from the injection hole 13 to the position facing the outer edge of the electronic component 20 is the shortest. Thereby, since the flow of the underfill 30 toward the portion where the distance from the injection hole 13 to the outer edge of the electronic component 20 is short can be restricted, the underfill 30 can be filled almost uniformly on the lower surface 23 of the electronic component 20.

In addition, the shape of the restricting portion 14 is substantially square in plan view, and the pair of vertices facing the restricting portion 14 are positioned in a straight line where the distance between the injection hole 13 and the outer edge of the electronic component 20 is the shortest. I let you. Thereby, a part of the underfill 30 that has flowed from the injection hole 13 toward the restriction portion 14 is provided on the restriction portion 14 along the side edge of the restriction portion 14 from the apex located on the injection hole 13 side in the restriction portion 14. It flows in the part that is not. Therefore, the amount of the underfill 30 flowing from the injection hole 13 toward the restricting portion 14 can be made smaller than the amount of the underfill flowing from the injection hole 13 to the portion where the restricting portion 14 is not provided.
Therefore, by providing the restriction portion 14 at a portion where the distance from the injection hole 13 to the outer edge of the electronic component 20 is short, and not providing the restriction portion 14 at a portion where the distance from the injection hole 13 to the outer edge of the electronic component 20 is long. The underfill 30 can be filled substantially uniformly over the entire lower surface 23 of the electronic component 20.

Further, an outflow prevention rib 16 is provided on the surface 15 opposite to the mounting surface 11 of the circuit board 10. Thereby, it is possible to prevent the underfill 30 from flowing out from the peripheral edge of the injection hole 13 toward the outside on the surface 15 opposite to the mounting surface 11 of the circuit board 10.
Further, the diameter of the outflow prevention rib 16 is slightly larger than the diameter of the injection hole 13. As a result, the underfill 30 hardened on the inner side of the outflow prevention rib 16 on the surface 15 side opposite to the mounting surface 11 of the circuit board 10 does not move to the mounting surface 11 side through the injection hole 13. It is possible to prevent the underfill 30 filled on the side from being peeled off from the circuit board 10.

Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 6 is a plan view of the electronic component mounting board 1 according to the second embodiment of the present invention.
In the description of each embodiment below, the same constituent elements are denoted by the same reference numerals, and the description thereof is omitted or simplified.

In the second embodiment, the shape of the electronic component 20 and the shape of the restricting portion are mainly different from the first embodiment.
Specifically, the electronic component 20 has a substantially rectangular shape in plan view. Then, the restricting portion 14 </ b> A defines the injection hole 13, which is the shortest distance between the injection hole 13 and the outer edge of the electronic component 20, and the midpoint of each of the pair of long sides of the electronic component 20 on the mounting surface 11. It is provided on each connecting straight line. Moreover, the regulation part 14B is provided also on the straight line which connects the injection hole 13 and the midpoint of a pair of short side of an electronic component, respectively.

The restricting portion 14A has a long rhombus shape in the direction in which the long side of the electronic component 20 extends.
The restricting portion 14B is substantially square, and a pair of opposing vertices of the restricting portion 14B are located on a straight line connecting the injection hole 13 and the midpoint of the pair of short sides of the electronic component 20.
According to the electronic component mounting substrate 1 of the second embodiment, in addition to the same effects as described above, the following effects can be obtained.
The circuit board 10 has a substantially rectangular shape in plan view, and the restricting portion 14 provided on the long side has a rhombus shape that is long in the long side direction of the electronic component 20. Thereby, the amount of the underfill 30 flowing from the injection hole 13 toward the long side of the electronic component 20 can be made smaller than the amount of the underfill 30 flowing from the injection hole 13 toward the short side of the electronic component 20. Therefore, the underfill 30 can be filled substantially uniformly over the entire lower surface of the substantially rectangular electronic component 20 in plan view.

Next, a third embodiment of the present invention will be described with reference to FIG. FIG. 7 is a plan view of the electronic component mounting board 1 according to the third embodiment of the present invention.
The third embodiment is mainly different from the first embodiment in that the shape of the electronic component 20 and a plurality of injection holes are provided in the circuit board 10.
Specifically, the electronic component 20 is substantially rectangular in plan view. Further, in the mounting surface 11 of the circuit board 10, two injection holes 13 </ b> A are formed at a portion facing the central portion of the electronic component 20 at a predetermined interval in the longitudinal direction of the electronic component 20.

  In the vicinity of each of the two injection holes 13A on the straight line connecting the two injection holes 13A, a substantially rectangular regulating portion 14C that is long in the direction in which the short side of the electronic component 20 extends is provided. Further, a substantially square regulating portion 14D is provided on each of the short side and the pair of long sides of the electronic component 20 from the two injection holes 13A.

  According to the electronic component mounting substrate 1 of the third embodiment, a substantially rectangular regulating portion that is long in the direction in which the short side of the electronic component 20 extends in the vicinity of each of the two injection holes 13A on a straight line connecting the two injection holes 13A. 14C was provided. Accordingly, since the amount of the underfill 30 flowing from the two injection holes 13A toward the restricting portion 14C is restricted, the underfill 30 is almost uniformly filled in the entire lower surface of the substantially rectangular electronic component 20 in plan view. it can.

Next, a fourth embodiment of the present invention will be described with reference to FIG. FIG. 8 is a cross-sectional view of the electronic component mounting board 1 according to the fourth embodiment of the present invention.
The fourth embodiment is different from the first embodiment in that a shield case 50 as a cover member that covers the electronic component 20 is provided mainly on the mounting surface 11 side of the circuit board 10.

Specifically, the shield case 50 is a one-piece type in which a side wall portion 51 and an upper surface portion 52 are integrally formed.
In addition, the entire internal space of the shield case 50 including the gap 60 formed between the mounting surface 11 of the circuit board 10 and the lower surface 23 of the electronic component 20 is filled with the underfill 30.
According to the electronic component mounting substrate 1 of the fourth embodiment, in addition to the same effects as described above, the following effects can be obtained.

  Since the injection hole 13 is provided in the circuit board 10 and the underfill 30 is injected through the injection hole 13 from the surface 15 side opposite to the mounting surface 11 of the circuit board 10, the shield case 50 is provided on the mounting surface 11 side of the circuit board 10. After placing and covering the electronic component 20, the underfill 30 can be injected into the internal space of the shield case 50. Therefore, the inside of the shield case 50 can be filled and sealed with the underfill 30 without a gap. In addition, since the one-piece type shield case 50 can be used, it is possible to suppress the electrical influence on the electronic components and the like housed in the shield case 50.

As mentioned above, although each embodiment of this invention was described, this invention is not restrict | limited to embodiment mentioned above, It can change suitably.
For example, in 1st Embodiment to 4th Embodiment, although the control part 14 was comprised from the convex part formed with the solder, it is not restricted to this. For example, the restricting portion 14 may be composed of a recess formed in the circuit board.

  In this way, when the restricting portion is constituted by a recess, the underfill flowing from the injection hole toward the restricting portion flows into the recess, so this underfill flows until the underfill flowing toward the restricting portion fills the groove. Does not flow outside the groove. Therefore, the movement of the underfill flowing from the injection hole toward the restricting portion can be restricted.

  In the third embodiment, the two restricting portions 14C provided between the two injection holes 13A have a substantially rectangular shape that is long in the direction in which the short side of the electronic component 20 extends, but is not limited thereto. For example, as shown in FIG. 9, the shape of the two restricting portions may be formed in a band shape that is curved so as to protrude toward the portion of the mounting surface 11 that faces the center of the electronic component 20.

  Moreover, in each said embodiment, although it was set as the to-be-injected member which inject | pours the underfill which consists of thermosetting resins from the injection hole 13 as an example, in this invention, as an underfill, it is not limited to thermosetting other resin. Other materials may be used, and a member other than the underfill may be used as the injected member.

1 is a plan view of an electronic component mounting board according to a first embodiment of the present invention. It is the II sectional view taken on the line of FIG. 1A. It is a top view which shows the state before filling an electronic component mounting board | substrate with underfill. It is the II-II sectional view taken on the line of FIG. 2A. The top view which shows a mode that the underfill spreads in the process of inject | pouring underfill into an electronic component mounting board | substrate. It is the III-III sectional view taken on the line of FIG. 3A. It is a top view which shows a mode that the underfill spreads in the process of inject | pouring underfill into an electronic component mounting board | substrate. It is the IV-IV sectional view taken on the line of FIG. 4A. It is a top view which shows the electronic component mounting board | substrate of the state after filling of underfill. It is the VV sectional view taken on the line of FIG. 5A. It is a top view of the electronic component mounting board | substrate which concerns on 2nd Embodiment of this invention. It is a top view of the electronic component mounting board | substrate which concerns on 3rd Embodiment of this invention. It is sectional drawing of the electronic component mounting board | substrate which concerns on 4th Embodiment of this invention. It is a top view of the modification of the electronic component mounting board | substrate of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting board 10 Circuit board 11 Mounting surface 14 Control part 16 Outflow prevention rib (outflow prevention part)
20 Electronic component 23 Lower surface 30 Underfill (injected member)
50 Shield case (cover member)

Claims (9)

A circuit board;
An electronic component mounted on the circuit board,
An electronic component mounting board capable of injecting a member to be injected into a gap formed between a mounting surface of the circuit board on which the electronic component is mounted and the electronic component,
In the portion of the circuit board facing the electronic component, an injection hole for injecting the injection target member is formed penetrating in the thickness direction of the circuit board,
An electronic component mounting board provided with a restricting portion for restricting the flow of the injected member on the mounting surface in the vicinity of the periphery of the injection hole on the mounting surface. When the electronic component is mounted on the mounting surface, the shape of the electronic component viewed in the thickness direction of the circuit board is a substantially rectangular shape,
The electronic component mounting board according to claim 1, wherein the injection hole is located at a portion facing a central portion of the electronic component mounted on the circuit board.   The electronic component mounting board according to claim 2, wherein the restricting portion is located on a straight line on the mounting surface where a distance between the injection hole and a position facing the outer edge of the electronic component is the shortest.   The electronic component mounting substrate according to claim 1, wherein the injected member is injected substantially uniformly into the gap.   An outflow prevention portion is provided in the vicinity of the periphery of the injection hole on the surface opposite to the mounting surface of the circuit board to prevent the injected member from flowing out from the injection hole to the surface opposite to the mounting surface. The electronic component mounting board according to claim 1, wherein the electronic component mounting board is provided.   The electronic component mounting board according to claim 1, wherein the restricting portion is a convex portion formed of solder.   The electronic component mounting substrate according to claim 1, wherein the restricting portion is a recess formed in the circuit board.   The electronic component mounting board according to claim 1, wherein a cover member that covers the electronic component is provided on the mounting surface of the circuit board. An electronic component mounting board is mounted on a circuit board, and an injection member is injected into a gap formed between the electronic component mounting surface of the circuit board and the electronic component,
Forming an injection hole for injecting the injected member into a portion of the circuit board facing the electronic component;
In the vicinity of the peripheral edge of the injection hole on the mounting surface of the circuit board, a restricting portion for restricting movement of the injected member on the mounting surface is provided,
A method for manufacturing an electronic component mounting board, wherein the member to be injected is injected through the injection hole from a surface side opposite to the mounting surface of the circuit board.

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