JP2010089514A - 接合膜付き基材、接合方法および接合体 - Google Patents
接合膜付き基材、接合方法および接合体 Download PDFInfo
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012105474A1 (ja) * | 2011-01-31 | 2012-08-09 | ボンドテック株式会社 | 接合面作製方法、接合基板、基板接合方法、接合面作製装置、及び基板接合体 |
| KR101360597B1 (ko) * | 2012-07-05 | 2014-02-11 | 주식회사 포스코 | 이종소재의 접착방법 |
| JP2024532686A (ja) * | 2021-09-02 | 2024-09-10 | 東京エレクトロン株式会社 | 接合層及びその製造プロセス |
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2009
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012105474A1 (ja) * | 2011-01-31 | 2012-08-09 | ボンドテック株式会社 | 接合面作製方法、接合基板、基板接合方法、接合面作製装置、及び基板接合体 |
| US10166749B2 (en) | 2011-01-31 | 2019-01-01 | Lan Technical Service Co., Ltd. | Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly |
| KR101360597B1 (ko) * | 2012-07-05 | 2014-02-11 | 주식회사 포스코 | 이종소재의 접착방법 |
| JP2024532686A (ja) * | 2021-09-02 | 2024-09-10 | 東京エレクトロン株式会社 | 接合層及びその製造プロセス |
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