JP2010089514A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2010089514A5 JP2010089514A5 JP2009293506A JP2009293506A JP2010089514A5 JP 2010089514 A5 JP2010089514 A5 JP 2010089514A5 JP 2009293506 A JP2009293506 A JP 2009293506A JP 2009293506 A JP2009293506 A JP 2009293506A JP 2010089514 A5 JP2010089514 A5 JP 2010089514A5
- Authority
- JP
- Japan
- Prior art keywords
- bonding film
- base material
- bonding
- adherend
- leaving group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 claims 13
- 239000000463 material Substances 0.000 claims 10
- 125000004429 atom Chemical group 0.000 claims 5
- 125000004432 carbon atom Chemical group C* 0.000 claims 5
- 229910052751 metal Inorganic materials 0.000 claims 5
- 239000002184 metal Substances 0.000 claims 5
- 229910052799 carbon Inorganic materials 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 230000001678 irradiating effect Effects 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 239000000306 component Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 125000005843 halogen group Chemical group 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- 125000004437 phosphorous atom Chemical group 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 229910052717 sulfur Inorganic materials 0.000 claims 1
- 125000004434 sulfur atom Chemical group 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 239000011701 zinc Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009293506A JP2010089514A (ja) | 2009-12-24 | 2009-12-24 | 接合膜付き基材、接合方法および接合体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009293506A JP2010089514A (ja) | 2009-12-24 | 2009-12-24 | 接合膜付き基材、接合方法および接合体 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007237327A Division JP4462313B2 (ja) | 2007-09-12 | 2007-09-12 | 接合膜付き基材、接合方法および接合体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010089514A JP2010089514A (ja) | 2010-04-22 |
| JP2010089514A5 true JP2010089514A5 (https=) | 2010-10-28 |
Family
ID=42252676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009293506A Withdrawn JP2010089514A (ja) | 2009-12-24 | 2009-12-24 | 接合膜付き基材、接合方法および接合体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2010089514A (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10166749B2 (en) | 2011-01-31 | 2019-01-01 | Lan Technical Service Co., Ltd. | Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly |
| KR101360597B1 (ko) * | 2012-07-05 | 2014-02-11 | 주식회사 포스코 | 이종소재의 접착방법 |
| US12362304B2 (en) * | 2021-09-02 | 2025-07-15 | Tokyo Electron Limited | Bonding layer and process of making |
-
2009
- 2009-12-24 JP JP2009293506A patent/JP2010089514A/ja not_active Withdrawn
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB201112376D0 (en) | Boding of metal components | |
| WO2014022619A8 (en) | Dual solder layer for fluidic self assembly and electrical component substrate and method employing same | |
| GB2507188A (en) | Method for forming bonded structures and bonded structures formed thereby | |
| WO2007128586A3 (de) | Energiestrahl-löten oder -schweissen von bauteilen | |
| MY150139A (en) | Laminated body, method of manufacturing substrate, substrate and semiconductor device | |
| WO2011110346A3 (de) | Verfahren zum herstellen eines kühlbaren formwerkzeugs sowie durch das verfahren hergestelltes formwerkzeug | |
| JP2009173950A5 (https=) | ||
| WO2013045364A3 (de) | Schichtverbund aus einer trägerfolie und einer schichtanordnung umfassend eine sinterbare schicht aus mindestens einem metallpulver und eine lotschicht | |
| SG161151A1 (en) | Soi substrate and method for manufacturing the same | |
| TW200730479A (en) | Selective placement of carbon manotubes through functionalization | |
| JP2015518270A5 (https=) | ||
| JP2014175425A5 (https=) | ||
| JP2013120771A5 (https=) | ||
| JP2011077504A5 (ja) | Ｓｏｉ基板の作製方法 | |
| WO2010015878A3 (en) | Process for joining and separating substrates | |
| GB2463214A (en) | Method for preventing void formation in a solder joint | |
| JP2010089514A5 (https=) | ||
| JP2009073943A5 (https=) | ||
| EP2154710A3 (en) | Substrate joining method and 3-D semiconductor device | |
| WO2006079628A3 (de) | Verfahren zum aufbringen von dicarbonsäure-olefin-copolymere enthaltenden, integrierten vorbehandlungsschichten auf metallische oberflächen | |
| WO2008013806A3 (en) | Process for joining materials using a metallic heat source within a controlled atmosphere | |
| SG155778A1 (en) | Method for diffusion bonding metallic components with nanoparticle foil | |
| WO2016042414A3 (de) | Verfahren zur herstellung eines umgeformten schaltungsträgers, sowie umgeformter schaltungsträger | |
| SG160302A1 (en) | Method for manufacturing semiconductor substrate | |
| WO2011011251A3 (en) | Method for forming an oxide layer on a brazed article |