JP2010089119A

JP2010089119A - Solder alloy

Info

Publication number: JP2010089119A
Application number: JP2008261045A
Authority: JP
Inventors: Sada Sawamura; 貞澤村; Tadashi Ariga; 正有賀; Yoichi Fujii; 要一藤井; Gakuo Igarashi; 岳夫五十嵐
Original assignee: Nihon Almit Co Ltd
Current assignee: Nihon Almit Co Ltd
Priority date: 2008-10-07
Filing date: 2008-10-07
Publication date: 2010-04-22
Anticipated expiration: 2028-10-07
Also published as: JP5336142B2; JP5336142B6

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inexpensive solder alloy which has low Ag content and whose soldering property is enhanced. <P>SOLUTION: The solder alloy has a composition composed of, by weight, 0.1-0.4% Ag, 0.5-3.0% Cu, 0.5-1.0% In and the balance Sn with inevitable impurities. The soldering property can be considerably enhanced by simultaneously adding Cu and In of the predetermined concentration to Sn which is the main component of the lead-free solder alloy while minimizing the addition of expensive Ag. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、Ａｇ含有率が低く安価でありながら、はんだ付性を向上させたはんだ合金に関する。 The present invention relates to a solder alloy that has a low Ag content and is inexpensive and has improved solderability.

従来、Ｐｂをほとんど含まない、いわゆる鉛フリーはんだ合金として、特許文献１により提案されたＳｎ−Ａｇ−Ｃｕはんだ合金が広く用いられている。
また、非特許文献１により、近年ではＡｇの価格高騰を受け、Ａｇ含有率を低減させたＳｎ−Ａｇ−Ｃｕはんだ合金も提案されていることが報告されている。
特許３０２７４４１号公報ＪＥＩＴＡＥＴＲ−７０２３第２世代フローはんだ標準化プロジェクト活動成果報告 Conventionally, as a so-called lead-free solder alloy containing almost no Pb, the Sn—Ag—Cu solder alloy proposed in Patent Document 1 has been widely used.
In addition, Non-Patent Document 1 reports that Sn-Ag-Cu solder alloys with a reduced Ag content have been proposed in recent years due to the rising price of Ag.
Japanese Patent No. 3027441 JEITA ETR-7702 2nd generation flow solder standardization project activity report

近年のＡｇ価格高騰を受け、Ａｇ含有率が低いＳｎ−Ａｇ−Ｃｕはんだ合金が提案されているが、安価であるものの、はんだ付性が悪い課題があった。
そこで、本発明は、Ａｇ含有率が低く安価でありながら、はんだ付性を向上させた鉛フリーはんだ合金を提供することを目的とする。 In response to the recent increase in Ag prices, Sn-Ag-Cu solder alloys with a low Ag content have been proposed. However, although they are inexpensive, there is a problem of poor solderability.
Accordingly, an object of the present invention is to provide a lead-free solder alloy having improved solderability while being low in Ag content and inexpensive.

上記目的を達成するために、本発明のはんだ合金は、Ａｇが０．１〜０．４重量％、Ｃｕが０．５〜３．０重量％、Ｉｎが０．５〜１．０重量％、および残部がＳｎおよび不可避不純物よりなることを特徴とする。 In order to achieve the above object, the solder alloy of the present invention has an Ag of 0.1 to 0.4% by weight, Cu of 0.5 to 3.0% by weight, and In of 0.5 to 1.0% by weight. And the balance consists of Sn and inevitable impurities.

本発明によれば、鉛フリーはんだ合金の主成分であるＳｎにＡｇが０．１〜０．４重量％、Ｃｕが０．５〜３．０重量％、Ｉｎが０．５〜１．０重量％同時に添加することで、安価なはんだ合金でありながら、はんだ付性を向上させることが可能となる。Ａｇ単独、Ｃｕ単独、およびＩｎ単独での添加では、はんだ付性の向上効果は低いが、高価なＡｇの添加を最小限にとどめた上で、ＣｕおよびＩｎを同時に所定の濃度添加することで、はんだ付性を大きく向上させることが出来る。 According to the present invention, Sn, which is a main component of a lead-free solder alloy, has an Ag content of 0.1 to 0.4% by weight, a Cu content of 0.5 to 3.0% by weight, and an In content of 0.5 to 1.0. By simultaneously adding the weight%, it is possible to improve solderability while being an inexpensive solder alloy. Addition of Ag alone, Cu alone, and In alone has a low effect of improving solderability, but by adding a predetermined concentration of Cu and In at the same time while minimizing the addition of expensive Ag. The solderability can be greatly improved.

同時に添加するＡｇの添加量が０．１重量％以下、Ｃｕの添加量が０．５重量％以下、Ｉｎの添加量が０．５重量％以下であると、はんだ付性向上の効果

が少ない。また、同時に添加するＡｇの添加量が０．４重量％超であると、はんだ付性向上は期待できるものの、高価なＡｇを多量に含有することになるため、好ましくない。さらに、同時に添加するＣｕの添加量が３．０重量％超であると、はんだ合金の液相線温度が上昇し、はんだ合金の流動性が低下するため、はんだ付性の低下を招く恐れがあるので、不適である。また、Ｉｎの添加量が１．０％超であると、はんだ付後にはんだ合金表面が白く濁り、外観検査を行う上で、はんだ付不良の発見ができなくなる恐れがある。その上、Ｉｎは希少金属であり、Ａｇ同様に近年価格が高騰しているため、多量に含有させることは好ましくない。 When the addition amount of Ag added simultaneously is 0.1% by weight or less, the addition amount of Cu is 0.5% by weight or less, and the addition amount of In is 0.5% by weight or less, the effect of improving solderability

Less is. Further, if the amount of Ag added at the same time is more than 0.4% by weight, an improvement in solderability can be expected, but a large amount of expensive Ag is contained, which is not preferable. Furthermore, if the amount of Cu added at the same time is more than 3.0% by weight, the liquidus temperature of the solder alloy increases and the fluidity of the solder alloy decreases, which may lead to a decrease in solderability. Because there is, it is unsuitable. On the other hand, if the amount of In is more than 1.0%, the surface of the solder alloy becomes cloudy after soldering, and it may not be possible to find a soldering defect in visual inspection. In addition, since In is a rare metal and its price has been rising recently in the same manner as Ag, it is not preferable to contain a large amount.

このため、本発明は、Ａｇが０．１〜０．４重量％、Ｃｕが０．５〜３．０重量％、Ｉｎが０．５〜１．０重量％、および残部がＳｎおよび不可避不純物よりなることを特徴とするはんだ合金であり、このはんだ合金は、高価なＡｇを多量に含有せず、安価でありながら、はんだ付性に優れる。 For this reason, the present invention is characterized in that Ag is 0.1 to 0.4 wt%, Cu is 0.5 to 3.0 wt%, In is 0.5 to 1.0 wt%, and the balance is Sn and inevitable impurities This solder alloy does not contain a large amount of expensive Ag, and is inexpensive but excellent in solderability.

以下、本発明を、その実施例に基づいて説明する。
ＳｎにＡｇ、Ｃｕ、およびＩｎの３種類の元素を同時に添加した、はんだ合金を用いて、はんだ付性試験を実施した。はんだ付性は、ウエッティングバランス法により、はんだ合金のぬれ時間（ゼロクロスタイム）を測定することで評価を行った。Ａｇが０．１重量％、０．３重量％、０．４重量％、１．０重量％、Ｃｕが、０．５重量％、０．７重量％、２．０重量％、３．０重量％、Ｉｎが０．５重量％、１．０重量％含有し、残部がＳｎおよび不可避不純物よりからなるはんだ合金を作製した。ウエッティングバランス法は、ＪＩＳＺ３１９７：１９９９に準拠し、溶融させたはんだ合金に、フラックスを塗布した試験用銅板（厚さ０．３ｍｍ×幅１０ｍｍ×長さ３０ｍｍ）を２０秒浸漬させ、このときのゼロクロスタイムを測定した。試験温度（溶融はんだ合金の温度）は、融点のおよそ＋５０℃とし、２７０℃、３２０℃、および３５０℃にて実施した。試験結果を表１に示す。 Hereinafter, the present invention will be described based on examples.
A solderability test was performed using a solder alloy in which three kinds of elements of Ag, Cu, and In were simultaneously added to Sn. The solderability was evaluated by measuring the wetting time (zero crossing time) of the solder alloy by a wetting balance method. Ag is 0.1 wt%, 0.3 wt%, 0.4 wt%, 1.0 wt%, Cu is 0.5 wt%, 0.7 wt%, 2.0 wt%, 3.0 A solder alloy containing 0.5% by weight, 1.0% by weight of In, and 1.0% by weight of In, with the balance being Sn and inevitable impurities was produced. The wetting balance method is based on JIS Z 3197: 1999. A test copper plate (thickness 0.3 mm × width 10 mm × length 30 mm) coated with a flux is immersed in a molten solder alloy for 20 seconds. The zero cross time was measured. The test temperature (temperature of the molten solder alloy) was about + 50 ° C. of the melting point, and was carried out at 270 ° C., 320 ° C., and 350 ° C. The test results are shown in Table 1.

ＳｎにＡｇ単独、Ｃｕ単独、およびＩｎ単独添加した、はんだ合金、あるいはＡｇ、Ｃｕ添加、Ｃｕ、Ｉｎ添加、およびＡｇ、Ｉｎ添加した、はんだ合金のぬれ時間（ゼロクロスタイム）は、試験温度２７０℃のとき、２．３〜２．８秒、試験温度３２０のとき、１．９秒、試験温度３５０℃のとき、１．８〜２．１秒であった。その一方で、ＳｎにＡｇが０．１〜０．４重量％、Ｃｕが０．５〜３．０重量％、Ｉｎが０．５〜１．０重量％を同時に添加した、はんだ合金のぬれ時間（ゼロクロスタイム）は、試験温度２７０℃のとき、１．６〜２．２秒、試験温度３２０℃のとき、１．５秒、試験温度３５０℃のとき、１．０〜１．２秒であり、いずれの試験温度域においても、ぬれ時間の短縮が確認された。
また、ＳｎにＡｇが０．１〜０．４重量％、Ｃｕが０．５〜３．０重量％、Ｉｎが０．５〜１．０重量％を同時に添加した、はんだ合金のぬれ時間（ゼロクロスタイム）は、Ａｇを１．０重量％、Ｃｕを０．５重量％添加した、はんだ合金と比較しても同等であり、本はんだ合金は、高価なＡｇを多量に含有しなくても、Ａｇを多量に添加したはんだ合金と同等のはんだ付性が得られることが明らかとなった。
以上の結果、Ａｇが０．１〜０．４重量％、Ｃｕが０．５〜３．０重量％、Ｉｎが０．５〜１．０重量％、および残部がＳｎおよび不可避不純物よりなることを特徴とするはんだ合金は、Ａｇ含有率が低く安価でありながら、ぬれ時間が短く、はんだ付性に優れることが明らかとなった。 The wetting time (zero crossing time) of the solder alloy in which Ag alone, Cu alone, and In alone are added to Sn, or the solder alloy in which Ag, Cu, Cu, In, and Ag, In are added is the test temperature of 270 ° C. In this case, it was 2.3 to 2.8 seconds, 1.9 seconds at the test temperature 320, and 1.8 to 2.1 seconds at the test temperature 350 ° C. On the other hand, wetting of the solder alloy, in which Ag is added to 0.1 to 0.4 wt%, Cu is added to 0.5 to 3.0 wt%, and In is added to 0.5 to 1.0 wt% simultaneously. The time (zero crossing time) is 1.6 to 2.2 seconds when the test temperature is 270 ° C, 1.5 seconds when the test temperature is 320 ° C, and 1.0 to 1.2 seconds when the test temperature is 350 ° C. It was confirmed that the wetting time was shortened in any test temperature range.
Also, the wetting time of the solder alloy in which Ag is added to 0.1 to 0.4 wt%, Cu is added to 0.5 to 3.0 wt%, and In is added to 0.5 to 1.0 wt% simultaneously with Sn ( The zero cross time) is equivalent to that of a solder alloy to which 1.0% by weight of Ag and 0.5% by weight of Cu are added, and this solder alloy does not contain a large amount of expensive Ag. It was revealed that solderability equivalent to that of a solder alloy with a large amount of Ag added can be obtained.
As a result, Ag is 0.1 to 0.4% by weight, Cu is 0.5 to 3.0% by weight, In is 0.5 to 1.0% by weight, and the balance is Sn and inevitable impurities. It has been clarified that the solder alloy characterized by the above has a low Ag content and is inexpensive and has a short wetting time and excellent solderability.

本発明は、Ａｇ含有率が低く安価でありながら、はんだ付性を向上させたはんだ合金であり、やに入りはんだ、ソルダペースト、棒はんだ、および線状はんだとして使用される。
The present invention is a solder alloy with low Ag content and low cost and improved solderability, and is used as a core solder, solder paste, bar solder, and linear solder.

Claims

Ag is 0.1 to 0.4% by weight, Cu is 0.5 to 3.0% by weight, In is 0.5 to 1.0% by weight, and the balance is made of Sn and inevitable impurities. Solder alloy.