JP2010085880A - Optical deflector and method for manufacturing optical deflector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical deflector for simplifying a mechanism, preventing a barycentric point of the optical deflector from being shifted, and inhibiting an appearance of the other mode and a rotational shift during a drive. <P>SOLUTION: The optical deflector includes: a mirror 2 comprising a movable plate 11 and a reflection film 21; a support frame 12 for supporting the movable plate 11; an elastic support 13 for turnably coupling the movable plate 11 to the support frame 12; and a magnet 22 fitted into a penetration hole provided in the movable plate 11. The centers of the magnet 22 and the mirror 2 are disposed so as to be in the same plane in the thickness direction of the mirror 2. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an optical deflector and a method for manufacturing the optical deflector.

  In an optical deflector intended to be applied to a display, a printer, or the like that draws an image using laser light, it is required to further increase the speed of optical scanning in order to increase the resolution of the image. However, there is a limit to improving the performance of polygon mirrors and galvanometer mirrors that are currently used, and mirror devices manufactured by processing silicon substrates with MEMS (Micro Electro Mechanical System) are expected as optical deflectors to replace them. ing. Since such a MEMS mirror can be driven at a higher resonance frequency than a polygon mirror or a galvanometer mirror, it is possible to form an image with higher resolution.

  For example, Patent Document 1 discloses an optical deflector that drives a movable plate relative to a support substrate and deflects incident light incident on a reflective surface, and at least a surface on which the reflective surface of the movable plate is not formed. An optical deflector in which two or more recesses are formed and a magnetic body is formed in the recesses is described.

In Patent Document 2, a superelastic alloy with a high fatigue limit is adopted for a torsion spring, a small magnet with a mirror finish is attached to the center of the spring, a coil is placed outside the coil, and an alternating current is passed to the alternating magnetic field. And an optical scanning device that causes a mirror-finished small magnet to resonate and vibrate.
JP 2004-37987 A JP-A-9-138366

  The optical deflector described in Patent Document 1 has an effect of enabling high-speed driving by reducing the moment of inertia due to silicon. However, generally, the processing limit value of the permanent magnet is about 0.4 mm, and since the thickness of silicon is smaller than this, the deviation of the center of gravity remains. For this reason, it is considered that the rotation center of the movable plate is shifted and the driving is influenced by the translation mode, the attraction between the magnet and the coil, and the like.

  In addition, since the optical scanning device described in Patent Document 2 has a torsion spring made of a material different from that of the magnet, the bonding strength between the torsion spring and the mirror may be reduced. In particular, when the torsion spring is directly bonded to the magnet or mirror member as in the optical scanning device described in Patent Document 2, it is conceivable that the bonded area is very narrow and may come off during driving.

  It is an object of the present invention to provide an optical deflector and a method for manufacturing the optical deflector that can prevent the deviation of the center of gravity of the optical deflector and suppress the appearance of other modes during driving and the rotational deviation with a simple mechanism. And

  An optical deflector according to the present invention includes a movable part provided with a light reflecting part having light reflectivity, a support part for supporting the movable part, and the movable part rotatably connected to the support part. A coupling portion and a magnet fitted in a through-hole provided in the movable portion, and arranged such that the center of the magnet and the movable portion is substantially on the same plane in the thickness direction of the movable portion. It is what has been.

  According to the present invention, in the thickness direction of the movable part, the center of the magnet and the movable part is on substantially the same plane, so that the deviation of the center of gravity of the optical deflector can be prevented. As a result, the appearance of other modes when the optical deflector is driven, rotation deviation, and the like can be suppressed. By inserting the magnet into the through-hole provided in the movable part, the center of gravity of the magnet overlaps the position of the center of gravity of the movable part compared to the case of adhering the magnet to the surface of the movable part. I can do it. Thereby, the stress concerning a connection part can be reduced.

Further, the movable portion may be provided with a pair of the magnets with the light reflecting portion interposed therebetween.
Moreover, the said light reflection part may be formed in the surface of the said magnet provided in the said movable part.

The movable part includes a first movable part having the light reflecting part formed on a surface thereof, and a pair of second movable parts provided with the first movable part interposed therebetween, The magnet may be provided in each of the second movable parts.
Thereby, the area of a light reflection part can be taken widely.

An optical deflector manufacturing method according to the present invention is the above-described optical deflector manufacturing method, wherein a first step of forming a mask having a predetermined pattern on a surface of a substrate, and the substrate using the mask. And a second step of forming the movable portion, the support portion, the connecting portion, and the through hole, and a third step of fitting the magnet into the through hole.
According to the present invention, since the center of gravity of the magnet overlaps the position of the center of gravity of the movable part compared to the case where the magnet is adhered to the surface of the movable part by fitting the magnet into the through hole provided in the movable part, the inertia The moment can be reduced. Thereby, the stress concerning a connection part can be reduced.

In the second step, it is desirable to etch the substrate using wet etching.
When the etching method of the substrate is wet etching, the adhesive can be applied to a relatively wide range by using the crystal plane of the substrate as compared with the case of using dry etching. The movable part can be bonded more firmly.

In the second step, it is desirable to over-etch the substrate using wet etching.
Thereby, the crystal plane of the substrate is over-etched, and the area where the magnet and the movable part are in contact with each other is widened, so that the magnet can be prevented from falling down and stabilized.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
Embodiment 1 FIG.
FIG. 1 is a top view showing a configuration of an optical deflector 1 according to the first embodiment. 2 is a cross-sectional view taken along line AA in FIG. 3 is a cross-sectional view taken along line BB in FIG.

  The optical deflector 1 includes a movable plate (movable portion) 11, a support frame (support portion) 12, and a pair of elastic connection portions (connection portions) 13 that support the movable plate 11 so as to be torsionally rotatable with respect to the support frame 12. And have. The movable plate 11, the support frame 12, and the elastic connecting portion 13 are integrally formed, for example, by etching a silicon substrate. A reflective film 21 is formed on the surface of the movable plate 11. The movable plate 11 and the reflective film (light reflecting portion) 21 constitute the mirror 2.

  The movable plate 11 is provided with a pair of magnets 22 with the reflective film 21 interposed therebetween. The magnet 22 is fitted in a through hole provided in the movable plate 11. The magnet 22 is arranged so that the center of the magnet 22 and the mirror 2 are on substantially the same plane in the thickness direction of the movable plate 11. As shown in the figure, the magnet 22 is fixed to the movable plate 11 by an adhesive 60 applied to the front and back surfaces of the movable plate 11.

  The magnet 22 is magnetized in a direction orthogonal to the axis X that is the rotation center axis of the movable plate 11 when the movable plate 11 is viewed in plan. That is, the magnet 22 has a pair of magnetic poles that are opposed to each other via the axis X and have different polarities. The support frame 12 is joined to the holder 50, and a coil 51 for driving the movable plate 11 is disposed on the holder 50.

  The coil 51 is supplied with a periodically changing current (AC). As a result, the coil 51 alternately generates a magnetic field directed upward (movable plate 11 side) and a magnetic field directed downward. As a result, the movable plate 11 rotates around the X axis while twisting and deforming the elastic connecting portion 13 so that one of the pair of magnetic poles of the magnet 22 approaches the coil 51 and the other magnetic pole is separated. Be made.

  The movable plate 11, the support frame 12, and the elastic connecting portion 13 of the optical deflector 1 are integrally formed by etching the silicon substrate 10 as shown in FIG. FIG. 5 is a diagram showing a pattern formed by dry etching the silicon substrate 10. FIG. 5 corresponds to a cross section taken along line CC in FIG. As shown in FIG. 5, the silicon substrate 10 is formed with a movable plate 11, a support frame 12, an elastic coupling portion 13, and a through hole 14 for fitting a magnet 22. The magnet 22 is fixed to the movable plate 11 by applying the adhesive 60 after fitting the magnet 22 in the through hole 14.

As a method for etching the silicon substrate 10, either dry etching or wet etching may be used. Hereinafter, a method for manufacturing the optical deflector 1 when wet etching is used will be described.
As in the case of using dry etching, the movable plate 11, the support frame 12, and the elastic connecting portion 13 of the optical deflector 1 are integrally formed by etching a silicon substrate 10 as shown in FIG.

  First, as shown in FIG. 6, masks 31 and 32 made of silicon oxide are formed on both surfaces of the silicon substrate 10, and resists 41 and 42 are formed on the masks 31 and 32. The resist may be positive or negative.

  Next, the resist 42 is exposed and developed to form a predetermined opening pattern P <b> 2 in the resist 42. The opening pattern P2 is a pattern that opens an area other than the movable plate 11, the support frame 12, and the elastic connecting portion 13, for example. Furthermore, the opening pattern P2 of the resist 42 is transferred to the mask 32 by etching the mask 32 using the resist 42 as a mask. For example, buffered hydrofluoric acid (BHF) is used for etching the mask 32.

  Next, the resists 41 and 42 on both surfaces of the silicon substrate 10 are removed. For removing the resists 41 and 42, sulfuric acid washing or ashing is used. Next, a resist 43 is formed on the back side of the silicon substrate 10 and a resist 44 is formed on the front side.

  Next, the resist 44 on the surface side of the silicon substrate 10 is exposed and developed to form a predetermined opening pattern P <b> 1 in the resist 44. The opening pattern P1 is, for example, the same pattern as the opening pattern P2. Further, the mask 31 is etched using the resist 44 as a mask. Thereby, the opening pattern P1 of the resist 44 is transferred to the mask 31. In the etching of the mask 31, buffered hydrofluoric acid (BHF) is used as in the etching of the mask 31.

Next, the resists 43 and 44 on both surfaces of the silicon substrate 10 are removed. For removing the resists 43 and 44, sulfuric acid cleaning or ashing is used.
Next, the silicon substrate 10 is etched using the masks 31 and 32. For the etching of the silicon substrate 10, for example, wet etching using KOH is used. As a result, the pattern shown in FIG. 7 is formed on the silicon substrate 10. FIG. 7 corresponds to a cross section taken along line CC in FIG. As shown in FIG. 7, the silicon substrate 10 is formed with a movable plate 11, a support frame 12, an elastic connecting portion 13, and a through hole 14 for fitting a magnet 22.

Hereinafter, a case where the silicon substrate 10 made of a Si wafer having a (100) principal surface is used will be described as an example.
When wet etching using KOH is performed on the silicon substrate 10, the etching starts to progress from both surfaces of the silicon substrate 10. When wet etching is used, for example, the portions of the silicon substrate 10 exposed in the opening patterns P1 and P2 are etched in a tapered shape. A hole formed by etching from the front surface of the silicon substrate 10 and a bottom of the hole formed by etching from the back surface of the silicon substrate 10 come into contact with each other, thereby forming one hole penetrating the silicon substrate 10. . At this time, in wet etching such as KOH, since the Si crystal orientation (111) plane functions as an etching stopper, a side surface shape formed by a plane having an angle θ = 54.73 ° with the surface is automatically formed. The As shown in FIG. 7, normally, when the silicon substrate 10 is processed by wet etching, the side surface 15 ((111) surface) of the silicon substrate 10 is in a state of protruding toward the center of the through hole. .

  Next, the masks 31 and 32 are removed, and a reflective film 21 is formed on the movable plate 11 by forming a metal film on the surface of the silicon substrate 10 and patterning it. Examples of the method for forming the metal film include vacuum deposition, sputtering, electroplating, electroless plating, and metal foil bonding. Note that the mask 31 and the mask 32 may be left without being removed.

Next, the magnet 22 is fitted into the through hole 14 provided in the movable plate 11, and the magnet 22 is fixed by the adhesive 60.
FIG. 8 is a view showing a cross section in a state where the magnet 22 is fixed to the silicon substrate 10 which has been subjected to wet etching. FIG. 8 shows the same cross section as FIG. As shown in FIG. 8, when the wet etching is used, the adhesive 60 is spread over a relatively wide range by using the (111) surface of silicon as compared with the case of using the dry etching shown in FIG. Can be applied. Thus, by securing a wide bonding area, the magnet 22 and the movable plate 11 can be bonded more firmly.

  In addition, as shown in FIG. 9, after etching the silicon substrate 10 to the (111) plane, the side surface 16 may be formed by further over-etching. Thereby, since the area which the magnet 22 and the movable plate 11 contact becomes large compared with the example shown in FIG. 8, the fall of the magnet 22 can be prevented and stabilized.

  In the above embodiment, the masks 31 and 32 are formed on both the front and back surfaces of the silicon substrate 10 and wet etching is performed from both surfaces of the silicon substrate 10. However, the mask is formed only on one surface (for example, the back surface) of the silicon substrate 10. And wet etching from one side may be performed. FIG. 10 is a cross-sectional view showing a state in which the magnet 22 is fixed to the silicon substrate 10 formed by etching the (111) plane with a mask formed on only one side. Further, FIG. 11 is a view showing a cross section in a state where the magnet 22 is fixed to the silicon substrate 10 on which the side surface 16 is formed by forming a mask only on one side and etching to the (111) plane and then performing over-etching. .

  In the example shown in FIGS. 10 and 11, the surface of the silicon substrate 10 (the surface on which the reflective film 21 is formed) is not etched, so that the area of the reflective film 21 can be made larger than when both surfaces of the silicon substrate 10 are etched. it can. For this reason, the optical deflector 1 with higher reflection efficiency can be obtained.

  After the magnet 22 is fixed to the movable plate 11, the structure including the movable plate 11, the support frame 12, and the elastic connecting portion 13 manufactured using the silicon substrate 10 is attached to the holder 50, whereby the optical deflector 1. Is manufactured.

As described above, according to the first embodiment, since the center of the magnet 22 in the thickness direction and the center of the mirror 2 in the thickness direction are on the same plane, the center of gravity deviation of the optical deflector 1 can be prevented. . Thereby, the appearance of other modes when the optical deflector 1 is driven, rotation deviation, and the like can be suppressed.
By inserting the magnet 22 into the through-hole 14 provided in the movable plate 11, the center of gravity of the magnet 22 overlaps the position of the center of gravity of the mirror 2 as compared with the case where the magnet 22 is bonded to the surface of the movable plate 11. The moment can be reduced. Thereby, the stress concerning the elastic connection part 13 can be reduced.

  Further, when the etching method of the silicon substrate 10 is wet etching, the bonding area between the silicon substrate 10 and the magnet 22 can be increased as compared with the case of dry etching. Can be bonded more firmly. Further, by etching to the (111) plane and then over-etching, the area where the magnet 22 and the movable plate 11 are in contact with each other becomes wider as compared with the example shown in FIG. 8, so that the magnet 22 is prevented from falling and stabilized. be able to.

Embodiment 2. FIG.
In the optical deflector according to the second embodiment of the present invention, as in the first embodiment, the movable plate, the support frame, and the elastic connecting portion are integrally formed by etching the silicon substrate. FIG. 12 is a top view showing the configuration of the optical deflector 7 according to the second embodiment. 13 is a cross-sectional view taken along line AA in FIG. FIG. 13 shows only a portion of the silicon substrate in which the movable plate 71, the support frame 72, and the elastic connecting portion 73 are integrally formed. The support frame 72 is joined to the holder as in the first embodiment, and a coil for driving the movable plate 71 is disposed on the holder.

  As shown in the figure, in the second embodiment, the magnet 22 is provided at the center of the movable plate 71, and the reflective film 21 is provided on the magnet 22. The magnet 22 is fitted into a through-hole provided in the movable plate 71 as in the first embodiment. The magnet 22 is arranged so that the center of the magnet 22 in the thickness direction and the center of the movable plate 71 in the thickness direction are on substantially the same plane. As shown in the figure, the magnet 22 is fixed to the movable plate 71 by an adhesive 60 applied to the front and back surfaces of the movable plate 71. The magnet 22 is magnetized in a direction orthogonal to the axis X that is the rotation center axis of the movable plate 71 when the movable plate 71 is viewed in plan.

  Similar to the first embodiment, the movable plate 71, the support frame 72, and the elastic connecting portion 73 of the optical deflector 7 are integrally formed by etching the silicon substrate. At this time, a through hole for fitting the magnet 22 is also formed at the same time. As a silicon substrate etching method, either dry etching or wet etching may be used. In the case of wet etching, the bonding area between the movable plate 71 and the magnet 22 can be increased compared to the case of dry etching. Further, after etching to the (111) plane, the area where the magnet 22 and the movable plate 71 are in contact may be widened by over-etching to prevent the magnet 22 from falling and stabilize.

  As described above, according to the second embodiment, the center of the magnet 22 in the thickness direction and the center of the movable plate 71 in the thickness direction are on the same plane, thereby preventing the deviation of the center of gravity of the optical deflector 7. Can do. Thereby, the appearance of other modes when the optical deflector 7 is driven, rotation deviation, and the like can be suppressed.

  In Embodiment 2, the reflective film 21 is formed directly on the surface of the magnet 22, but a thin substrate may be sandwiched between the magnet 22 and the reflective film 21. Thereby, the reflective film 21 can be formed on a flatter surface.

Embodiment 3 FIG.
In the optical deflector according to the third embodiment of the present invention, as in the first embodiment, the movable plate, the support frame, and the elastic connecting portion are integrally formed by etching the silicon substrate. FIG. 14 is a top view showing the configuration of the optical deflector 8 according to the third embodiment. 15 is a cross-sectional view taken along line AA in FIG. FIG. 15 shows only a portion of the silicon substrate in which the movable plates 81a and 81b, the support frame 82, and the elastic coupling portions 83a and 83b are integrally formed. The support frame 82 is joined to the holder as in the first embodiment, and coils for driving the movable plates 81a and 81b are arranged on the holder.

  As shown in the figure, the optical deflector 8 has a movable plate 81a having a reflection film 21 formed on the surface thereof, and two movable plates 81b connected to the movable plate 81a via an elastic connecting portion 83a. This structure has two vibration systems. The magnet 22 is fitted in a through hole provided in each movable plate 81b. The magnet 22 is arranged so that the center in the thickness direction of the magnet 22 and the center in the thickness direction of the movable plate 81b are on substantially the same plane. As shown in the figure, the magnet 22 is fixed to the movable plate 81b by an adhesive 60 applied to the front and back surfaces of the movable plate 81b. The magnet 22 is magnetized in a direction orthogonal to the axis X that is the rotation center axis of the movable plate movable plates 81a and 81b when the movable plates 81a and 81b are viewed in plan.

  The movable plates 81a and 81b, the support frame 82, and the elastic connecting portions 83a and 83b of the optical deflector 8 are integrally formed by etching the silicon substrate, as in the first embodiment. At this time, a through hole for fitting the magnet 22 is also formed at the same time. As a silicon substrate etching method, either dry etching or wet etching may be used. In the case of wet etching, the bonding area between the movable plate 81b and the magnet 22 can be increased compared to the case of dry etching. Furthermore, after etching to the (111) plane, over-etching may be performed to increase the area where the magnet 22 and the movable plate 81b are in contact with each other, thereby preventing the magnet 22 from falling and stabilizing.

  As described above, according to the third embodiment, the center of the magnet 22 in the thickness direction and the centers of the thickness directions of 81a and 81b are on the same plane, thereby preventing the deviation of the center of gravity of the optical deflector 8. Can do. Thereby, the appearance of other modes when the optical deflector 8 is driven, rotation deviation, and the like can be suppressed.

  In the third embodiment, since the reflective film 21 is formed on the movable plate 81a and the magnet 22 is fitted in the through hole provided in the movable plate 81b, the area of the reflective film 21 can be increased.

(Display device)
As an application example of the optical deflector according to the present invention, a projection type display device will be described. FIG. 16 is a diagram illustrating a schematic configuration of a projection type display device. The display device shown in FIG. 16 uses the optical deflector according to the present invention as a horizontal scanning mirror.

  The display device shown in FIG. 16 includes a laser light source 101, a dichroic mirror 102, a photodiode 103, and a vertical mirror 104 in addition to the optical deflector 1.

  The laser light source 101 includes a red laser light source 101R that emits red laser light, a blue laser light source 101B that emits blue laser light, and a green laser light source 101G that emits green laser light. However, laser light sources of two colors or less or four colors or more may be used.

  The dichroic mirror 102 includes a dichroic mirror 102R that reflects red laser light from the red laser light source 101R, a dichroic mirror 102B that reflects blue laser light and transmits red laser light, and reflects green laser light and blue laser light and red. A dichroic mirror 102G that transmits laser light. By these three types of dichroic mirrors 102, the combined light of red laser light, blue laser light, and green laser light is incident on the vibrating mirror 1.

  The photodiode 103 detects the amounts of red laser light, green laser light, and blue laser light that are transmitted without being reflected by the dichroic mirrors 102R, 102G, and 102B.

  The optical deflector 1 scans the laser beam sent from the dichroic mirror 102 in the horizontal direction (the vertical direction of the axis X). As described above, the optical deflector 1 is a resonant mirror formed by MEMS.

  The vertical mirror 104 scans the laser beam reflected by the optical deflector 1 in the vertical direction. The vertical mirror 104 is configured by a galvanometer mirror, for example. A galvanometer mirror is a deflector in which a mirror is provided with an axis so that the rotation angle of the mirror can be changed according to electric vibration. An image is displayed by horizontal scanning of the laser light by the optical deflector 1 and vertical scanning of the laser light by the vertical mirror 104.

  This display layer device further includes a laser driving means 110 for driving the laser light source 101 and a horizontal mirror driving means for driving the optical deflector 1 as a drive control system for the laser light source 101, the vibrating mirror 1 and the vertical mirror 104. 111, a vertical mirror driving unit 112 that drives the vertical mirror 104, a control unit 113 that controls the entire operation, and a storage unit 114.

  The control means 113 is based on image information sent from various video sources 115 such as a personal computer or a mobile phone, and displays these images by means of a laser drive means 110, a horizontal mirror drive means 111, a vertical mirror drive means. The operation of 112 is controlled.

  The storage unit 114 includes, for example, a ROM that stores various programs, a RAM that stores variables, and the like, and a nonvolatile memory.

  By applying the optical deflector 1 according to the present invention to a display device, a display device with good display performance can be realized.

The present invention is not limited to the description of the above embodiment.
For example, the movable plate of the optical deflector 1 may be a polygon other than a circle. In addition, although the optical deflector 1 of the type that is driven with one-dimensional one degree of freedom is illustrated here, the optical deflector 1 of the type that is driven two-dimensionally may be used, and it is driven with one-dimensional two degrees of freedom. It may be a type of optical deflector 1. When the two-dimensionally driven type optical deflector 1 is used, the vertical mirror 104 is not necessary.
The optical deflector 1 can be applied to a laser printer or the like other than the display device.
In addition, various modifications can be made without departing from the scope of the present invention.

FIG. 1 is a top view showing the configuration of the optical deflector according to the first embodiment. 2 is a cross-sectional view taken along line AA in FIG. 3 is a cross-sectional view taken along line BB in FIG. FIG. 4 is a cross-sectional view for explaining the method of manufacturing the optical deflector according to the first embodiment. FIG. 5 is a cross-sectional view for explaining the method of manufacturing the optical deflector according to the first embodiment. FIG. 6 is a cross-sectional view for explaining the method of manufacturing the optical deflector according to the first embodiment. FIG. 7 is a cross-sectional view for explaining the method of manufacturing the optical deflector according to the first embodiment. FIG. 8 is a view showing a cross section in a state in which a magnet is fixed to a silicon substrate subjected to wet etching. It is a figure which shows the cross section of the state which fixed the magnet to the silicon substrate over-etched using wet etching. FIG. 10 is a view showing a cross section in a state where a magnet is fixed to a silicon substrate wet-etched with a mask formed only on one side. FIG. 11 is a view showing a cross section in a state in which a magnet is fixed to a silicon substrate that has been over-etched by wet etching after forming a mask only on one side. FIG. 12 is a top view showing the configuration of the optical deflector according to the second embodiment. 13 is a cross-sectional view taken along line AA in FIG. FIG. 14 is a top view showing the configuration of the optical deflector according to the third embodiment. 15 is a cross-sectional view taken along line AA in FIG. It is a schematic block diagram of the display apparatus using the optical deflector which concerns on this invention.

Explanation of symbols

1, 7, 8 Optical deflector, 10 Silicon substrate, 11, 71, 81a, 81b Movable plate, 12, 72, 82 Support frame, 13, 73, 83a, 83b Elastic support portion, 14 Through hole, 15, 16 Side surface 2 mirror, 21 reflective film, 22 magnet, 31, 32 mask, 41, 42 resist, 50 holder, 51 coil, 60 adhesive, 101 laser light source, 101R red laser light source, 101G green laser light source, 101B blue laser light source, 102, 102R, 102G, 102B Dichroic mirror, 103, 103R, 103G, 103B Photodiode, 104 Vertical mirror, 110 Laser drive means, 111 Horizontal mirror drive means, 112 Vertical mirror drive means, 113 Control means, 114 Storage means, 115 Video source

Claims (7)

A movable part provided with a light reflecting part having light reflectivity;
A support part for supporting the movable part;
A connecting part for connecting the movable part to the support part in a rotatable manner;
A magnet fitted in a through hole provided in the movable part,
An optical deflector, wherein the magnet and the center of the movable part are arranged on substantially the same plane in the thickness direction of the movable part.   The optical deflector according to claim 1, wherein the movable portion is provided with a pair of the magnets with the light reflecting portion interposed therebetween.   The optical deflector according to claim 1, wherein the light reflecting portion is formed on a surface of the magnet provided in the movable portion. The movable part is
A first movable part having the light reflecting part formed on the surface;
A pair of second movable parts provided across the first movable part,
The optical deflector according to claim 1, wherein the magnet is provided in each of the second movable parts. A method of manufacturing an optical deflector according to any one of claims 1 to 4,
A first step of forming a mask having a predetermined pattern on the surface of the substrate;
Etching the substrate using the mask to form the movable part, the support part, the connection part, and the through hole;
And a third step of fitting the magnet into the through-hole.   6. The method of manufacturing an optical deflector according to claim 5, wherein in the second step, the substrate is etched using wet etching.   6. The method of manufacturing an optical deflector according to claim 5, wherein in the second step, the substrate is over-etched using wet etching.

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